– Enhanced Direct-Memory-Access Controller•Supports 32-Bit Integer, SP (IEEE Single
(EDMA3)Precision/32-Bit) and DP (IEEE Double
– Serial ATA (SATA) Controller
– DDR2/Mobile DDR Memory Controller
– Two Multimedia Card (MMC)/Secure Digital
(SD) Card Interface
– LCD Controller
– Video Port Interface (VPIF)
– 10/100 Mb/s Ethernet MAC (EMAC):
– Programmable Real-Time Unit Subsystem
– Three Configurable UART Modules
– USB 1.1 OHCI (Host) With Integrated PHY
– USB 2.0 OTG Port With Integrated PHY
– One Multichannel Audio Serial Port
– Two Multichannel Buffered Serial Ports
• 375/456-MHz C674x VLIW DSP
• C674x Instruction Set Features
– Superset of the C67x+™ and C64x+™ ISAs
– Up to 3648/2746 C674x MIPS/MFLOPS
– Byte-Addressable (8-/16-/32-/64-Bit Data)
– 8-Bit Overflow Protection
– Bit-Field Extract, Set, Clear
– Normalization, Saturation, Bit-Counting
– Compact 16-Bit Instructions
• C674x Two Level Cache Memory Architecture
– 32K-Byte L1P Program RAM/Cache
– 32K-Byte L1D Data RAM/Cache
– 256K -Byte L2 Unified Mapped RAM/Cache
– Flexible RAM/Cache Partition (L1 and L2)
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2TMS320C6000, C6000 are trademarks of Texas Instruments.
ADVANCE INFORMATION concerns new products in the sampling
or preproduction phaseof development. Characteristic dataand other
specifications are subjectto change without notice.
Support
– 64 General-Purpose Registers (32 Bit)
Precision/64-Bit) Floating Point
•Supports up to Four SP Additions Per
Clock, Four DP Additions Every 2 Clocks
•Supports up to Two Floating Point (SP or
DP) Reciprocal Approximation (RCPxP)
and Square-Root Reciprocal
Approximation (RSQRxP) Operations Per
Cycle
– Two Multiply Functional Units
•Mixed-Precision IEEE Floating Point
Multiply Supported up to:
– 2 SP x SP -> SP Per Clock
– 2 SP x SP -> DP Every Two Clocks
– 2 SP x DP -> DP Every Three Clocks
– 2 DP x DP -> DP Every Four Clocks
•Fixed Point Multiply Supports Two 32 x
32-Bit Multiplies, Four 16 x 16-Bit
Multiplies, or Eight 8 x 8-Bit Multiplies per
Clock Cycle, and Complex Multiples
– Instruction Packing Reduces Code Size
– All Instructions Conditional
– Hardware Support for Modulo Loop
Operation
– Protected Mode Operation
– Exceptions Support for Error Detection and
Program Redirection
• Software Support
– TI DSP/BIOS™
– Chip Support Library and DSP Library
• 128K-Byte RAM Memory
• 1.8V or 3.3V LVCMOS IOs (except for USB and
DDR2 interfaces)
•16-Bit DDR2 SDRAM With 512 MB– 128-channel TDM
Address Space or
•16-Bit mDDR SDRAM With 256 MB
Address Space
• Three Configurable 16550 type UART Modules:
– With Modem Control Signals
– 16-byte FIFO
– 16x or 13x Oversampling Option
• LCD Controller
• Two Serial Peripheral Interfaces (SPI) Each
With Multiple Chip-Selects
• Two Multimedia Card (MMC)/Secure Digital (SD)
Card Interface with Secure Data I/O (SDIO)
Interfaces
• Two Master/Slave Inter-Integrated Circuit (I2C
Bus™)
• One Host-Port Interface (HPI) With 16-Bit-Wide
Muxed Address/Data Bus For High Bandwidth
• Programmable Real-Time Unit Subsystem
(PRUSS)
– Two Independent Programmable Realtime
Unit (PRU) Cores
•32-Bit Load/Store RISC architecture
•4K Byte instruction RAM per core
•512 Bytes data RAM per core
•PRU Subsystem (PRUSS) can be disabled
via software to save power
•Register 30 of each PRU is exported from
the subsystem in addition to the normal
R31 output of the PRU cores.
– Standard power management mechanism
•Clock gating
•Entire subsystem under a single PSC
clock gating domain
– Dedicated interrupt controller
– FIFO buffers for Transmit and Receive
• 10/100 Mb/s Ethernet MAC (EMAC):
– IEEE 802.3 Compliant
– MII Media Independent Interface
– RMII Reduced Media Independent Interface
– Management Data I/O (MDIO) Module
• Video Port Interface (VPIF):
– Two 8-bit SD (BT.656), Single 16-bit or Single
Raw (8-/10-/12-bit) Video Capture Channels
– Two 8-bit SD (BT.656), Single 16-bit Video
Display Channels
• Universal Parallel Port (uPP):
– High-Speed Parallel Interface to FPGAs and
Data Converters
– Data Width on Each of Two Channels is 8- to
16-bit Inclusive
– Single Data Rate or Dual Data Rate Transfers
– Supports Multiple Interfaces with START,
ENABLE and WAIT Controls
• Serial ATA (SATA) Controller:
– Supports SATA I (1.5 Gbps) and SATA II (3.0
Gbps)
– Supports all SATA Power Management
Features
– Hardware-Assisted Native Command
Queueing (NCQ) for up to 32 Entries
– Supports Port Multiplier and
Command-Based Switching
• Real-Time Clock With 32 KHz Oscillator and
Separate Power Rail
• Three 64-Bit General-Purpose Timers (Each
configurable as Two 32-Bit Timers)
• One 64-bit General-Purpose/Watchdog Timer
(Configurable as Two 32-bit General-Purpose
– Dedicated switched central resourceTimers)
• USB 1.1 OHCI (Host) With Integrated PHY• Two Enhanced Pulse Width Modulators
(USB1)(eHRPWM):
• USB 2.0 OTG Port With Integrated PHY (USB0)– Dedicated 16-Bit Time-Base Counter With
– USB 2.0 High-/Full-Speed Client
– USB 2.0 High-/Full-/Low-Speed Host
– End Point 0 (Control)
– End Points 1,2,3,4 (Control, Bulk, Interrupt or
ISOC) Rx and Tx
• One Multichannel Audio Serial Port:
– Two Clock Zones and 16 Serial Data Pins
– Supports TDM, I2S, and Similar Formats
– DIT-Capable
– FIFO buffers for Transmit and Receive
• Two Multichannel Buffered Serial Ports:
– Supports TDM, I2S, and Similar Formats
– AC97 Audio Codec Interface
Period And Frequency Control
– 6 Single Edge, 6 Dual Edge Symmetric or 3
Dual Edge Asymmetric Outputs
– Dead-Band Generation
– PWM Chopping by High-Frequency Carrier
– Trip Zone Input
The device is a Low-power applications processor based on a C674x DSP core. It provides significantly
lower power than other members of the TMS320C6000™ platform of DSPs.
The device enables OEMs and ODMs to quickly bring to market devices featuring robust operating
systems support, rich user interfaces, and high processing performance life through the maximum
flexibility of a fully integrated mixed processor solution.
The device DSP core uses a two-level cache-based architecture. The Level 1 program cache (L1P) is a
32KB direct mapped cache and the Level 1 data cache (L1D) is a 32KB 2-way set-associative cache. The
Level 2 program cache (L2P) consists of a 256KB memory space that is shared between program and
data space. L2 memory can be configured as mapped memory, cache, or combinations of the two.
Although the DSP L2 is accessible by other hosts in the system, an additional 128KB RAM shared
memory is available for use by other hosts without affecting DSP performance.
The peripheral set includes: a 10/100 Mb/s Ethernet MAC (EMAC) with a Management Data Input/Output
(MDIO) module; one USB2.0 OTG interface; one USB1.1 OHCI interface; two inter-integrated circuit (I2C)
Bus interfaces; one multichannel audio serial port (McASP) with 16 serializers and FIFO buffers; two
multichannel buffered serial ports (McBSP) with FIFO buffers; two SPI interfaces with multiple chip
selects; four 64-bit general-purpose timers each configurable (one configurable as watchdog); a
configurable 16-bit host port interface (HPI) ; up to 9 banks of 16 pins of general-purpose input/output
(GPIO) with programmable interrupt/event generation modes, multiplexed with other peripherals; three
UART interfaces (each with RTS and CTS); two enhanced high-resolution pulse width modulator
(eHRPWM) peripherals; 3 32-bit enhanced capture (eCAP) module peripherals which can be configured
as 3 capture inputs or 3 auxiliary pulse width modulator (APWM) outputs; and 2 external memory
interfaces: an asynchronous and SDRAM external memory interface (EMIFA) for slower memories or
peripherals, and a higher speed DDR2/Mobile DDR controller.
SPRS590B–JUNE 2009–REVISED AUGUST 2010
The Ethernet Media Access Controller (EMAC) provides an efficient interface between the device and a
network. The EMAC supports both 10Base-T and 100Base-TX, or 10 Mbits/second (Mbps) and 100 Mbps
in either half- or full-duplex mode. Additionally an Management Data Input/Output (MDIO) interface is
available for PHY configuration. The EMAC supports both MII and RMII interfaces.
The SATA controller provides a high-speed interface to mass data storage devices. The SATA controller
supports both SATA I (1.5 Gbps) and SATA II (3.0 Gbps).
The Universal Parallel Port (uPP) provides a high-speed interface to many types of data converters,
FPGAs or other parallel devices. The UPP supports programmable data widths between 8- to 16-bits on
each of two channels. Single-data rate and double-data rate transfers are supported as well as START,
ENABLE and WAIT signals to provide control for a variety of data converters.
A Video Port Interface (VPIF) is included providing a flexible video input/output port.
The rich peripheral set provides the ability to control external peripheral devices and communicate with
external processors. For details on each of the peripherals, see the related sections later in this document
and the associated peripheral reference guides.
The device has a complete set of development tools for the DSP. These include C compilers, a DSP
assembly optimizer to simplify programming and scheduling, and a Windows™ debugger interface for
visibility into source code execution.
NOTE: This is a placeholder for the Revision History Table for future revisions of the document.
This data manual revision history highlights the changes made to the SPRS590A device-specific data
manual to make it an SPRS590B revision.
Table 2-1. Revision History
ADDITIONS/MODIFICATIONS/DELETIONS
Global - Added MPU Content
Global - Replaced all "CLKIN" references with "OSCIN"
Global - Updated td(SCSL_SPC)S min from P to 2P
Global - Made changes in the document to reflect the following detail.
"The DSP L2 ROM is used for boot purposes and cannot be programmed with application code".
Global - Updated the pin map graphic to fix typos.
Global -
•All instances of EMU[0] updated to EMU0
•All instances of EMU[1] updated toEMU1
•All instances of UART1_RTS updated to have an overbar
•All instances of UART2_RTS updated to have an overbar
•All instances of SPI1_SCS[0] updated to have an overbar
•All instances of EMA_CS[4] updated to have an overbar
•All instances of SPI1_ENA updated to have an overbar
•All instances of SATA_TXN updated to have an overbar
•All instances of LCD_AC_ENB_CS updated to have an overbar
•All instances of DDR_CS updated to have an overbar
•All instances of UHPI_HRDY updated to have an overbar
•All instances of UHPI_HDS1 updated to have an overbar
•All instances of UHPI_HCS updated to have an overbar
Added Table 3-3 C674x L1/L2 Memory Protection Registers
Added Section 3.9 Unused Pin Configurations
Added Section 6.6.3- Dynamic Voltage and Frequency Scaling (DVFS)
AddedSection 4.3 Pullup/Pulldown Resistors
Added Section 6.14.3 - SATA Unused Signal Configuration
Added sections -Section 6.14.2 - SATA Interface, Section 6.14.2.1 - SATA Interface Schematic, Section 6.14.2.2 - Compatible SATA
The following documents are available on the Internet at www.ti.com. Tip: Enter the literature number in
the search box provided at www.ti.com.
DSP Reference Guides
SPRUG82TMS320C674x DSP Cache User's Guide. Explains the fundamentals of memory caches
and describes how the two-level cache-based internal memory architecture in the
TMS320C674x digital signal processor (DSP) can be efficiently used in DSP applications.
Shows how to maintain coherence with external memory, how to use DMA to reduce
memory latencies, and how to optimize your code to improve cache efficiency. The internal
memory architecture in the C674x DSP is organized in a two-level hierarchy consisting of a
dedicated program cache (L1P) and a dedicated data cache (L1D) on the first level.
Accesses by the CPU to the these first level caches can complete without CPU pipeline
stalls. If the data requested by the CPU is not contained in cache, it is fetched from the next
lower memory level, L2 or external memory.
SPRUFE8TMS320C674x DSP CPU and Instruction Set Reference Guide. Describes the CPU
architecture, pipeline, instruction set, and interrupts for the TMS320C674x digital signal
processors (DSPs). The C674x DSP is an enhancement of the C64x+ and C67x+ DSPs with
added functionality and an expanded instruction set.
SPRS590B–JUNE 2009–REVISED AUGUST 2010
SPRUFK5TMS320C674x DSP Megamodule Reference Guide. Describes the TMS320C674x digital
signal processor (DSP) megamodule. Included is a discussion on the internal direct memory
access (IDMA) controller, the interrupt controller, the power-down controller, memory
protection, bandwidth management, and the memory and cache.
EMIFA
Flash Card InterfaceMMC and SD cards supported.
EDMA3
Timers
UART3 (each with RTS and CTS flow control)
SPI2 (Each with one hardware chip select)
Peripherals
Not all peripherals pins
are available at the
same time (for more
detail, see the Device
Configurations section).
On-Chip Memory
I2C2 (both Master/Slave)
Multichannel Audio Serial Port [McASP]1 (each with transmit/receive, FIFO buffer, 16 serializers)
Multichannel Buffered Serial Port [McBSP]2 (each with transmit/receive, FIFO buffer, 16)
10/100 Ethernet MAC with Management Data I/O1 (MII or RMII Interface)
UHPI1 (16-bit multiplexed address/data)
USB 2.0 (USB0)High-Speed OTG Controller with on-chip OTG PHY
USB 1.1 (USB1)Full-Speed OHCI (as host) with on-chip PHY
General-Purpose Input/Output Port9 banks of 16-bit
LCD Controller1
SATA Controller1 (Support both SATA I and SATAII)
Universal Parallel Port (uPP)1
Video Port Interface (VPIF)1 (video in and video out)
PRU Subsystem (PRUSS)2 Programmable PRU Cores
Size (Bytes)448KB RAM
Organization
www.ti.com
Table 3-1. Characteristics of C6748
DDR2, 16-bit bus width, up to 150 MHz
Mobile DDR, 16-bit bus width, up to 133 MHz
Asynchronous (8/16-bit bus width) RAM, Flash,
16-bit SDRAM, NOR, NAND
64 independent channels, 16 QDMA channels,
2 channel controllers, 3 transfer controllers
4 64-Bit General Purpose (each configurable as 2 separate
32-bit timers, one configurable as Watch Dog)
4 Single Edge, 4 Dual Edge Symmetric, or
2 Dual Edge Asymmetric Outputs
DSP
32KB L1 Program (L1P)/Cache (up to 32KB)
32KB L1 Data (L1D)/Cache (up to 32KB)
256KB Unified Mapped RAM/Cache (L2)
DSP Memories can be made accessible to EDMA3 and
other peripherals.
ADDITIONAL MEMORY
128KB RAM
C674x CPU ID + CPU
Rev ID
C674x Megamodule
Revision
JTAG BSDL_IDDEVIDR0 Register0x0B7D_102F
CPU FrequencyMHz674x DSP 375 MHz (1.2V) or 456 MHz (1.3V)
(1) ADVANCE INFORMATION concerns new products in the sampling or preproduction phase of development. Characteristic data and
other specifications are subject to change without notice. PRODUCTION DATA information is current as of publication date. Products
conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include
testing of all parameters.
(1)
Product Preview (PP),
Advance Information (AI),
or Production Data (PD)
375 MHz versions - PD
456 MHz versions - AI
3.3Device Compatibility
The C674x DSP core is code-compatible with the C6000™ DSP platform and supports features of both
the C64x+ and C67x+ DSP families.
The C674x Central Processing Unit (CPU) consists of eight functional units, two register files, and two
data paths as shown in Figure 3-2. The two general-purpose register files (A and B) each contain
32 32-bit registers for a total of 64 registers. The general-purpose registers can be used for data or can be
data address pointers. The data types supported include packed 8-bit data, packed 16-bit data, 32-bit
data, 40-bit data, and 64-bit data. Values larger than 32 bits, such as 40-bit-long or 64-bit-long values are
stored in register pairs, with the 32 LSBs of data placed in an even register and the remaining 8 or
32 MSBs in the next upper register (which is always an odd-numbered register).
The eight functional units (.M1, .L1, .D1, .S1, .M2, .L2, .D2, and .S2) are each capable of executing one
instruction every clock cycle. The .M functional units perform all multiply operations. The .S and .L units
perform a general set of arithmetic, logical, and branch functions. The .D units primarily load data from
memory to the register file and store results from the register file into memory.
The C674x CPU combines the performance of the C64x+ core with the floating-point capabilities of the
C67x+ core.
Each C674x .M unit can perform one of the following each clock cycle: one 32 x 32 bit multiply, one 16 x
32 bit multiply, two 16 x 16 bit multiplies, two 16 x 32 bit multiplies, two 16 x 16 bit multiplies with
add/subtract capabilities, four 8 x 8 bit multiplies, four 8 x 8 bit multiplies with add operations, and four
16 x 16 multiplies with add/subtract capabilities (including a complex multiply). There is also support for
Galois field multiplication for 8-bit and 32-bit data. Many communications algorithms such as FFTs and
modems require complex multiplication. The complex multiply (CMPY) instruction takes for 16-bit inputs
and produces a 32-bit real and a 32-bit imaginary output. There are also complex multiplies with rounding
capability that produces one 32-bit packed output that contain 16-bit real and 16-bit imaginary values. The
32 x 32 bit multiply instructions provide the extended precision necessary for high-precision algorithms on
a variety of signed and unsigned 32-bit data types.
SPRS590B–JUNE 2009–REVISED AUGUST 2010
The .L or (Arithmetic Logic Unit) now incorporates the ability to do parallel add/subtract operations on a
pair of common inputs. Versions of this instruction exist to work on 32-bit data or on pairs of 16-bit data
performing dual 16-bit add and subtracts in parallel. There are also saturated forms of these instructions.
The C674x core enhances the .S unit in several ways. On the previous cores, dual 16-bit MIN2 and MAX2
comparisons were only available on the .L units. On the C674x core they are also available on the .S unit
which increases the performance of algorithms that do searching and sorting. Finally, to increase data
packing and unpacking throughput, the .S unit allows sustained high performance for the quad 8-bit/16-bit
and dual 16-bit instructions. Unpack instructions prepare 8-bit data for parallel 16-bit operations. Pack
instructions return parallel results to output precision including saturation support.
Other new features include:
•SPLOOP - A small instruction buffer in the CPU that aids in creation of software pipelining loops where
multiple iterations of a loop are executed in parallel. The SPLOOP buffer reduces the code size
associated with software pipelining. Furthermore, loops in the SPLOOP buffer are fully interruptible.
•Compact Instructions - The native instruction size for the C6000 devices is 32 bits. Many common
instructions such as MPY, AND, OR, ADD, and SUB can be expressed as 16 bits if the C674x
compiler can restrict the code to use certain registers in the register file. This compression is
performed by the code generation tools.
•Instruction Set Enhancement - As noted above, there are new instructions such as 32-bit
multiplications, complex multiplications, packing, sorting, bit manipulation, and 32-bit Galois field
multiplication.
•Exceptions Handling - Intended to aid the programmer in isolating bugs. The C674x CPU is able to
detect and respond to exceptions, both from internally detected sources (such as illegal op-codes) and
from system events (such as a watchdog time expiration).
•Privilege - Defines user and supervisor modes of operation, allowing the operating system to give a
basic level of protection to sensitive resources. Local memory is divided into multiple pages, each with
read, write, and execute permissions.
•Time-Stamp Counter - Primarily targeted for Real-Time Operating System (RTOS) robustness, a
free-running time-stamp counter is implemented in the CPU which is not sensitive to system stalls.
For more details on the C674x CPU and its enhancements over the C64x architecture, see the following
documents:
•TMS320C64x/C64x+ DSP CPU and Instruction Set Reference Guide (literature number SPRUFE8)
•TMS320C64x Technical Overview (literature number SPRU395)
A. On .M unit, dst2 is 32 MSB.
B. On .M unit, dst1 is 32 LSB.
C. On C64x CPU .M unit, src2 is 32 bits; on C64x+ CPU .M unit, src2 is 64 bits.
D. On .L and .S units, odd dst connects to odd register files and even dst connects to even register files.
The DSP memory map is shown in .
By default the DSP also has access to most on and off chip memory areas.
Additionally, the DSP megamodule includes the capability to limit access to its internal memories through
its SDMA port; without needing an external MPU unit.
3.4.2.1External Memories
The DSP has access to the following External memories:
•Asynchronous EMIF / SDRAM / NAND / NOR Flash (EMIFA)
•SDRAM (DDR2)
3.4.2.2DSP Internal Memories
The DSP has access to the following DSP memories:
•L2 RAM
•L1P RAM
•L1D RAM
3.4.2.3C674x CPU
The C674x core uses a two-level cache-based architecture. The Level 1 Program cache (L1P) is 32 KB
direct mapped cache and the Level 1 Data cache (L1D) is 32 KB 2-way set associated cache. The Level 2
memory/cache (L2) consists of a 256 KB memory space that is shared between program and data space.
L2 memory can be configured as mapped memory, cache, or a combination of both.
www.ti.com
Table 3-2 shows a memory map of the C674x CPU cache registers for the device.
Extensive use of pin multiplexing is used to accommodate the largest number of peripheral functions in
the smallest possible package. Pin multiplexing is controlled using a combination of hardware
configuration at device reset and software programmable register settings.
3.6.1Pin Map (Bottom View)
The following graphics show the bottom view of the ZCE and ZWT packages pin assignments in four
quadrants (A, B, C, and D). The pin assignments for both packages are identical.
Device level pin multiplexing is controlled by registers PINMUX0 - PINMUX19 in the SYSCFG module.
For the device family, pin multiplexing can be controlled on a pin-by-pin basis. Each pin that is multiplexed
with several different functions has a corresponding 4-bit field in one of the PINMUX registers.
Pin multiplexing selects which of several peripheral pin functions controls the pin's IO buffer output data
and output enable values only. The default pin multiplexing control for almost every pin is to select 'none'
of the peripheral functions in which case the pin's IO buffer is held tri-stated.
Note that the input from each pin is always routed to all of the peripherals that share the pin; the PINMUX
registers have no effect on input from a pin.
Table 3-5 to Table 3-31 identify the external signal names, the associated pin/ball numbers along with the
mechanical package designator, the pin type (I, O, IO, OZ, or PWR), whether the pin/ball has any internal
pullup/pulldown resistors, whether the pin/ball is configurable as an IO in GPIO mode, and a functional pin
description.
TMSL16IIPUBJTAG test mode select
TDIM16IIPUBJTAG test data input
TDOJ18OIPUBJTAG test data output
TCKJ15IIPUBJTAG test clock
TRSTL17IIPDBJTAG test reset
EMU0J16I/OIPUBEmulation pin
EMU1K16I/OIPUBEmulation pin
(1) I = Input, O = Output, I/O = Bidirectional, Z = High impedance, PWR = Supply voltage, GND = Ground, A = Analog signal.
Note: For multiplexed pins where functions have different types (ie., input versus output), the table reflects the pin function direction for
that particular peripheral.
(2) IPD = Internal Pulldown resistor, IPU = Internal Pullup resistor. CP[n] = configurable pull-up/pull-down (where n is the pin group) using
the PUPDENA and PUPDSEL registers in the System Module.
(3) This signal is part of a dual-voltage IO group (A, B or C). These groups can be operated at 3.3V or 1.8V nominal. The three groups can
be operated at independent voltages but all pins withina group will operate at the same voltage. Group A operates at the voltage of
power supply DVDD3318_A. Group B operates at the voltage of power supply DVDD3318_B. Group C operates at the voltage of power
supply DVDD3318_C.
PLL0_VDDAL15PWR——PLL analog VDD(1.2-V filtered supply)
PLL0_VSSAM17GND——PLL analog VSS(for filter)
PLL1_VDDAN15PWR——PLL analog VDD(1.2-V filtered supply)
PLL1_VSSAM15GND——PLL analog VSS(for filter)
(1) I = Input, O = Output, I/O = Bidirectional, Z = High impedance, PWR = Supply voltage, GND = Ground, A = Analog signal.
Note: For multiplexed pins where functions have different types (ie., input versus output), the table reflects the pin function direction for
that particular peripheral.
(2) IPD = Internal Pulldown resistor; IPU = Internal Pullup resistor; CP[n] = configurable pull-up/pull-down (where n is the pin group) using
the PUPDENA and PUPDSEL registers in the System Module.
(3) This signal is part of a dual-voltage IO group (A, B or C). These groups can be operated at 3.3V or 1.8V nominal. The three groups can
be operated at independent voltages but all pins withina group will operate at the same voltage. Group A operates at the voltage of
power supply DVDD3318_A. Group B operates at the voltage of power supply DVDD3318_B. Group C operates at the voltage of power
supply DVDD3318_C.
(1) I = Input, O = Output, I/O = Bidirectional, Z = High impedance, PWR = Supply voltage, GND = Ground, A = Analog signal.
Note: For multiplexed pins where functions have different types (ie., input versus output), the table reflects the pin function direction for
that particular peripheral.
(2) IPD = Internal Pulldown resistor; IPU = Internal Pullup resistor; CP[n] = configurable pull-up/pull-down (where n is the pin group) using
the PUPDENA and PUPDSEL registers in the System Module. The pull-up and pull-down control of these pins is not active until the
device is out of reset. During reset, all of the pins associated with these registers are weakly pulled down. If the application requires a
pull-up, an external pull-up can be used.
(3) This signal is part of a dual-voltage IO group (A, B or C). These groups can be operated at 3.3V or 1.8V nominal. The three groups can
be operated at independent voltages but all pins withina group will operate at the same voltage. Group A operates at the voltage of
power supply DVDD3318_A. Group B operates at the voltage of power supply DVDD3318_B. Group C operates at the voltage of power
supply DVDD3318_C.
H18GND——Oscillator ground
TYPE
(1)
PULL
(2)
POWER
GROUP
(3)
RTC module core power
(isolated from chip CVDD)
DESCRIPTION
3.8.4DEEPSLEEP Power Control
Table 3-8. DEEPSLEEP Power Control Terminal Functions
SIGNAL
NAMENO.
RTC_ALARM / UART2_CTS / GP0[8] / DEEPSLEEPF4ICP[0]ADEEPSLEEP power control output
(1) I = Input, O = Output, I/O = Bidirectional, Z = High impedance, PWR = Supply voltage, GND = Ground, A = Analog signal.
Note: For multiplexed pins where functions have different types (ie., input versus output), the table reflects the pin function direction for
that particular peripheral.
(2) IPD = Internal Pulldown resistor; IPU = Internal Pullup resistor; CP[n] = configurable pull-up/pull-down (where n is the pin group) using
the PUPDENA and PUPDSEL registers in the System Module. The pull-up and pull-down control of these pins is not active until the
device is out of reset. During reset, all of the pins associated with these registers are weakly pulled down. If the application requires a
pull-up, an external pull-up can be used.
(3) This signal is part of a dual-voltage IO group (A, B or C). These groups can be operated at 3.3V or 1.8V nominal. The three groups can
be operated at independent voltages but all pins withina group will operate at the same voltage. Group A operates at the voltage of
power supply DVDD3318_A. Group B operates at the voltage of power supply DVDD3318_B. Group C operates at the voltage of power
supply DVDD3318_C.
(1) I = Input, O = Output, I/O = Bidirectional, Z = High impedance, PWR = Supply voltage, GND = Ground, A = Analog signal.
Note: The pin type shown refers to the input, output or high-impedance state of the pin function when configured as the signal name
highlighted in bold. All multiplexed signals may enter a high-impedance state when the configured function is input-only or the configured
function supports high-Z operation. All GPIO signals can be used as input or output. For multiplexed pins where functions have different
types (ie., input versus output), the table reflects the pin function direction for that particular peripheral.
(2) IPD = Internal Pulldown resistor; IPU = Internal Pullup resistor; CP[n] = configurable pull-up/pull-down (where n is the pin group) using
the PUPDENA and PUPDSEL registers in the System Module. The pull-up and pull-down control of these pins is not active until the
device is out of reset. During reset, all of the pins associated with these registers are weakly pulled down. If the application requires a
pull-up, an external pull-up can be used.
(3) This signal is part of a dual-voltage IO group (A, B or C). These groups can be operated at 3.3V or 1.8V nominal. The three groups can
be operated at independent voltages but all pins withina group will operate at the same voltage. Group A operates at the voltage of
power supply DVDD3318_A. Group B operates at the voltage of power supply DVDD3318_B. Group C operates at the voltage of power
supply DVDD3318_C.
(1) I = Input, O = Output, I/O = Bidirectional, Z = High impedance, PWR = Supply voltage, GND = Ground, A = Analog signal.
Note: The pin type shown refers to the input, output or high-impedance state of the pin function when configured as the signal name
highlighted in bold. All multiplexed signals may enter a high-impedance state when the configured function is input-only or the configured
function supports high-Z operation. All GPIO signals can be used as input or output. For multiplexed pins where functions have different
types (ie., input versus output), the table reflects the pin function direction for that particular peripheral.
(2) IPD = Internal Pulldown resistor; IPU = Internal Pullup resistor; CP[n] = configurable pull-up/pull-down (where n is the pin group) using
the PUPDENA and PUPDSEL registers in the System Module.
(1) I = Input, O = Output, I/O = Bidirectional, Z = High impedance, PWR = Supply voltage, GND = Ground, A = Analog signal.
Note: The pin type shown refers to the input, output or high-impedance state of the pin function when configured as the signal name
highlighted in bold. All multiplexed signals may enter a high-impedance state when the configured function is input-only or the configured
function supports high-Z operation. All GPIO signals can be used as input or output. For multiplexed pins where functions have different
types (ie., input versus output), the table reflects the pin function direction for that particular peripheral.
(2) IPD = Internal Pulldown resistor; IPU = Internal Pullup resistor; CP[n] = configurable pull-up/pull-down (where n is the pin group) using
the PUPDENA and PUPDSEL registers in the System Module. The pull-up and pull-down control of these pins is not active until the
device is out of reset. During reset, all of the pins associated with these registers are weakly pulled down. If the application requires a
pull-up, an external pull-up can be used.
(3) This signal is part of a dual-voltage IO group (A, B or C). These groups can be operated at 3.3V or 1.8V nominal. The three groups can
be operated at independent voltages but all pins withina group will operate at the same voltage. Group A operates at the voltage of
power supply DVDD3318_A. Group B operates at the voltage of power supply DVDD3318_B. Group C operates at the voltage of power
supply DVDD3318_C.
(1) I = Input, O = Output, I/O = Bidirectional, Z = High impedance, PWR = Supply voltage, GND = Ground, A = Analog signal.
Note: The pin type shown refers to the input, output or high-impedance state of the pin function when configured as the signal name
highlighted in bold. All multiplexed signals may enter a high-impedance state when the configured function is input-only or the configured
function supports high-Z operation. All GPIO signals can be used as input or output. For multiplexed pins where functions have different
types (ie., input versus output), the table reflects the pin function direction for that particular peripheral.
(2) IPD = Internal Pulldown resistor; IPU = Internal Pullup resistor; CP[n] = configurable pull-up/pull-down (where n is the pin group) using
the PUPDENA and PUPDSEL registers in the System Module. The pull-up and pull-down control of these pins is not active until the
device is out of reset. During reset, all of the pins associated with these registers are weakly pulled down. If the application requires a
pull-up, an external pull-up can be used.
(3) This signal is part of a dual-voltage IO group (A, B or C). These groups can be operated at 3.3V or 1.8V nominal. The three groups can
be operated at independent voltages but all pins withina group will operate at the same voltage. Group A operates at the voltage of
power supply DVDD3318_A. Group B operates at the voltage of power supply DVDD3318_B. Group C operates at the voltage of power
supply DVDD3318_C.
(1) I = Input, O = Output, I/O = Bidirectional, Z = High impedance, PWR = Supply voltage, GND = Ground, A = Analog signal.
Note: The pin type shown refers to the input, output or high-impedance state of the pin function when configured as the signal name
highlighted in bold. All multiplexed signals may enter a high-impedance state when the configured function is input-only or the configured
function supports high-Z operation. All GPIO signals can be used as input or output. For multiplexed pins where functions have different
types (ie., input versus output), the table reflects the pin function direction for that particular peripheral.
(2) IPD = Internal Pulldown resistor; IPU = Internal Pullup resistor; CP[n] = configurable pull-up/pull-down (where n is the pin group) using
the PUPDENA and PUPDSEL registers in the System Module. The pull-up and pull-down control of these pins is not active until the
device is out of reset. During reset, all of the pins associated with these registers are weakly pulled down. If the application requires a
pull-up, an external pull-up can be used.
(3) This signal is part of a dual-voltage IO group (A, B or C). These groups can be operated at 3.3V or 1.8V nominal. The three groups can
be operated at independent voltages but all pins withina group will operate at the same voltage. Group A operates at the voltage of
power supply DVDD3318_A. Group B operates at the voltage of power supply DVDD3318_B. Group C operates at the voltage of power
supply DVDD3318_C.
TYPE
eCAP0
eCAP1
eCAP2
(1)
PULL
(2)
POWER
GROUP
(3)
enhanced capture 0 input or
auxiliary PWM 0 output
enhanced capture 1 input or
auxiliary PWM 1 output
enhanced capture 2 input or
auxiliary PWM 2 output
(1) I = Input, O = Output, I/O = Bidirectional, Z = High impedance, PWR = Supply voltage, GND = Ground, A = Analog signal.
Note: The pin type shown refers to the input, output or high-impedance state of the pin function when configured as the signal name
highlighted in bold. All multiplexed signals may enter a high-impedance state when the configured function is input-only or the configured
function supports high-Z operation. All GPIO signals can be used as input or output. For multiplexed pins where functions have different
types (ie., input versus output), the table reflects the pin function direction for that particular peripheral.
(2) IPD = Internal Pulldown resistor; IPU = Internal Pullup resistor; CP[n] = configurable pull-up/pull-down (where n is the pin group) using
the PUPDENA and PUPDSEL registers in the System Module. The pull-up and pull-down control of these pins is not active until the
device is out of reset. During reset, all of the pins associated with these registers are weakly pulled down. If the application requires a
pull-up, an external pull-up can be used.
(3) This signal is part of a dual-voltage IO group (A, B or C). These groups can be operated at 3.3V or 1.8V nominal. The three groups can
be operated at independent voltages but all pins withina group will operate at the same voltage. Group A operates at the voltage of
power supply DVDD3318_A. Group B operates at the voltage of power supply DVDD3318_B. Group C operates at the voltage of power
supply DVDD3318_C.
(1) Boot decoding is defined in the bootloader application report.
(2) I = Input, O = Output, I/O = Bidirectional, Z = High impedance, PWR = Supply voltage, GND = Ground, A = Analog signal.
Note: The pin type shown refers to the input, output or high-impedance state of the pin function when configured as the signal name
highlighted in bold. All multiplexed signals may enter a high-impedance state when the configured function is input-only or the configured
function supports high-Z operation. All GPIO signals can be used as input or output. For multiplexed pins where functions have different
types (ie., input versus output), the table reflects the pin function direction for that particular peripheral.
(3) IPD = Internal Pulldown resistor; IPU = Internal Pullup resistor; CP[n] = configurable pull-up/pull-down (where n is the pin group) using
the PUPDENA and PUPDSEL registers in the System Module. The pull-up and pull-down control of these pins is not active until the
device is out of reset. During reset, all of the pins associated with these registers are weakly pulled down. If the application requires a
pull-up, an external pull-up can be used.
(4) This signal is part of a dual-voltage IO group (A, B or C). These groups can be operated at 3.3V or 1.8V nominal. The three groups can
be operated at independent voltages but all pins withina group will operate at the same voltage. Group A operates at the voltage of
power supply DVDD3318_A. Group B operates at the voltage of power supply DVDD3318_B. Group C operates at the voltage of power
supply DVDD3318_C.
(1) I = Input, O = Output, I/O = Bidirectional, Z = High impedance, PWR = Supply voltage, GND = Ground, A = Analog signal.
Note: The pin type shown refers to the input, output or high-impedance state of the pin function when configured as the signal name
highlighted in bold. All multiplexed signals may enter a high-impedance state when the configured function is input-only or the configured
function supports high-Z operation. All GPIO signals can be used as input or output. For multiplexed pins where functions have different
types (ie., input versus output), the table reflects the pin function direction for that particular peripheral.
(2) IPD = Internal Pulldown resistor; IPU = Internal Pullup resistor; CP[n] = configurable pull-up/pull-down (where n is the pin group) using
the PUPDENA and PUPDSEL registers in the System Module.The pull-up and pull-down control of these pins is not active until the
device is out of reset. During reset, all of the pins associated with these registers are weakly pulled down. If the application requires a
pull-up, an external pull-up can be used.
(3) This signal is part of a dual-voltage IO group (A, B or C). These groups can be operated at 3.3V or 1.8V nominal. The three groups can
be operated at independent voltages but all pins withina group will operate at the same voltage. Group A operates at the voltage of
power supply DVDD3318_A. Group B operates at the voltage of power supply DVDD3318_B. Group C operates at the voltage of power
supply DVDD3318_C.
SPI1_SCS[6] / I2C0_SDA / TM64P3_OUT12 / GP1[4]G18I/OCP[11]AI2C0 serial data
SPI1_SCS[7] / I2C0_SCL / TM64P2_OUT12 / GP1[5]G16I/OCP[11]AI2C0 serial clock
I2C1
SPI1_SCS[4] / UART2_TXD / I2C1_SDA / GP1[2]F16I/OCP[12]AI2C1 serial data
SPI1_SCS[5] / UART2_RXD / I2C1_SCL / GP1[3]F17I/OCP[12]AI2C1 serial clock
(1) I = Input, O = Output, I/O = Bidirectional, Z = High impedance, PWR = Supply voltage, GND = Ground, A = Analog signal.
Note: The pin type shown refers to the input, output or high-impedance state of the pin function when configured as the signal name
highlighted in bold. All multiplexed signals may enter a high-impedance state when the configured function is input-only or the configured
function supports high-Z operation. All GPIO signals can be used as input or output. For multiplexed pins where functions have different
types (ie., input versus output), the table reflects the pin function direction for that particular peripheral.
(2) IPD = Internal Pulldown resistor; IPU = Internal Pullup resistor; CP[n] = configurable pull-up/pull-down (where n is the pin group) using
the PUPDENA and PUPDSEL registers in the System Module.The pull-up and pull-down control of these pins is not active until the
device is out of reset. During reset, all of the pins associated with these registers are weakly pulled down. If the application requires a
pull-up, an external pull-up can be used.
(3) This signal is part of a dual-voltage IO group (A, B or C). These groups can be operated at 3.3V or 1.8V nominal. The three groups can
be operated at independent voltages but all pins withina group will operate at the same voltage. Group A operates at the voltage of
power supply DVDD3318_A. Group B operates at the voltage of power supply DVDD3318_B. Group C operates at the voltage of power
supply DVDD3318_C.
(1) I = Input, O = Output, I/O = Bidirectional, Z = High impedance, PWR = Supply voltage, GND = Ground, A = Analog signal.
Note: The pin type shown refers to the input, output or high-impedance state of the pin function when configured as the signal name
highlighted in bold. All multiplexed signals may enter a high-impedance state when the configured function is input-only or the configured
function supports high-Z operation. All GPIO signals can be used as input or output. For multiplexed pins where functions have different
types (ie., input versus output), the table reflects the pin function direction for that particular peripheral.
(2) IPD = Internal Pulldown resistor; IPU = Internal Pullup resistor; CP[n] = configurable pull-up/pull-down (where n is the pin group) using
the PUPDENA and PUPDSEL registers in the System Module. The pull-up and pull-down control of these pins is not active until the
device is out of reset. During reset, all of the pins associated with these registers are weakly pulled down. If the application requires a
pull-up, an external pull-up can be used.
(3) This signal is part of a dual-voltage IO group (A, B or C). These groups can be operated at 3.3V or 1.8V nominal. The three groups can
be operated at independent voltages but all pins withina group will operate at the same voltage. Group A operates at the voltage of
power supply DVDD3318_A. Group B operates at the voltage of power supply DVDD3318_B. Group C operates at the voltage of power
supply DVDD3318_C.
(1) I = Input, O = Output, I/O = Bidirectional, Z = High impedance, PWR = Supply voltage, GND = Ground, A = Analog signal.
Note: The pin type shown refers to the input, output or high-impedance state of the pin function when configured as the signal name
highlighted in bold. All multiplexed signals may enter a high-impedance state when the configured function is input-only or the configured
function supports high-Z operation. All GPIO signals can be used as input or output. For multiplexed pins where functions have different
types (ie., input versus output), the table reflects the pin function direction for that particular peripheral.
(2) IPD = Internal Pulldown resistor; IPU = Internal Pullup resistor; CP[n] = configurable pull-up/pull-down (where n is the pin group) using
the PUPDENA and PUPDSEL registers in the System Module. The pull-up and pull-down control of these pins is not active until the
device is out of reset. During reset, all of the pins associated with these registers are weakly pulled down. If the application requires a
pull-up, an external pull-up can be used.
(3) This signal is part of a dual-voltage IO group (A, B or C). These groups can be operated at 3.3V or 1.8V nominal. The three groups can
be operated at independent voltages but all pins withina group will operate at the same voltage. Group A operates at the voltage of
power supply DVDD3318_A. Group B operates at the voltage of power supply DVDD3318_B. Group C operates at the voltage of power
supply DVDD3318_C.
(1) I = Input, O = Output, I/O = Bidirectional, Z = High impedance, PWR = Supply voltage, GND = Ground, A = Analog signal.
Note: The pin type shown refers to the input, output or high-impedance state of the pin function when configured as the signal name
highlighted in bold. All multiplexed signals may enter a high-impedance state when the configured function is input-only or the configured
function supports high-Z operation. All GPIO signals can be used as input or output. For multiplexed pins where functions have different
types (ie., input versus output), the table reflects the pin function direction for that particular peripheral.
(2) IPD = Internal Pulldown resistor; IPU = Internal Pullup resistor; CP[n] = configurable pull-up/pull-down (where n is the pin group) using
the PUPDENA and PUPDSEL registers in the System Module. The pull-up and pull-down control of these pins is not active until the
device is out of reset. During reset, all of the pins associated with these registers are weakly pulled down. If the application requires a
pull-up, an external pull-up can be used.
(3) This signal is part of a dual-voltage IO group (A, B or C). These groups can be operated at 3.3V or 1.8V nominal. The three groups can
be operated at independent voltages but all pins withina group will operate at the same voltage. Group A operates at the voltage of
power supply DVDD3318_A. Group B operates at the voltage of power supply DVDD3318_B. Group C operates at the voltage of power
supply DVDD3318_C.
(1) I = Input, O = Output, I/O = Bidirectional, Z = High impedance, PWR = Supply voltage, GND = Ground, A = Analog signal.
Note: The pin type shown refers to the input, output or high-impedance state of the pin function when configured as the signal name
highlighted in bold. All multiplexed signals may enter a high-impedance state when the configured function is input-only or the configured
function supports high-Z operation. All GPIO signals can be used as input or output. For multiplexed pins where functions have different
types (ie., input versus output), the table reflects the pin function direction for that particular peripheral.
(2) IPD = Internal Pulldown resistor; IPU = Internal Pullup resistor; CP[n] = configurable pull-up/pull-down (where n is the pin group) using
the PUPDENA and PUPDSEL registers in the System Module. The pull-up and pull-down control of these pins is not active until the
device is out of reset. During reset, all of the pins associated with these registers are weakly pulled down. If the application requires a
pull-up, an external pull-up can be used.
(3) This signal is part of a dual-voltage IO group (A, B or C). These groups can be operated at 3.3V or 1.8V nominal. The three groups can
be operated at independent voltages but all pins withina group will operate at the same voltage. Group A operates at the voltage of
power supply DVDD3318_A. Group B operates at the voltage of power supply DVDD3318_B. Group C operates at the voltage of power
supply DVDD3318_C.
(1) I = Input, O = Output, I/O = Bidirectional, Z = High impedance, PWR = Supply voltage, GND = Ground, A = Analog signal.
Note: The pin type shown refers to the input, output or high-impedance state of the pin function when configured as the signal name
highlighted in bold. All multiplexed signals may enter a high-impedance state when the configured function is input-only or the configured
function supports high-Z operation. All GPIO signals can be used as input or output. For multiplexed pins where functions have different
types (ie., input versus output), the table reflects the pin function direction for that particular peripheral.
(2) IPD = Internal Pulldown resistor; IPU = Internal Pullup resistor; CP[n] = configurable pull-up/pull-down (where n is the pin group) using
the PUPDENA and PUPDSEL registers in the System Module. The pull-up and pull-down control of these pins is not active until the
device is out of reset. During reset, all of the pins associated with these registers are weakly pulled down. If the application requires a
pull-up, an external pull-up can be used.
(3) This signal is part of a dual-voltage IO group (A, B or C). These groups can be operated at 3.3V or 1.8V nominal. The three groups can
be operated at independent voltages but all pins withina group will operate at the same voltage. Group A operates at the voltage of
power supply DVDD3318_A. Group B operates at the voltage of power supply DVDD3318_B. Group C operates at the voltage of power
supply DVDD3318_C.
(1) I = Input, O = Output, I/O = Bidirectional, Z = High impedance, PWR = Supply voltage, GND = Ground, A = Analog signal.
Note: The pin type shown refers to the input, output or high-impedance state of the pin function when configured as the signal name
highlighted in bold. All multiplexed signals may enter a high-impedance state when the configured function is input-only or the configured
function supports high-Z operation. All GPIO signals can be used as input or output. For multiplexed pins where functions have different
types (ie., input versus output), the table reflects the pin function direction for that particular peripheral.
(2) IPD = Internal Pulldown resistor; IPU = Internal Pullup resistor; CP[n] = configurable pull-up/pull-down (where n is the pin group) using
the PUPDENA and PUPDSEL registers in the System Module. The pull-up and pull-down control of these pins is not active until the
device is out of reset. During reset, all of the pins associated with these registers are weakly pulled down. If the application requires a
pull-up, an external pull-up can be used.
(3) This signal is part of a dual-voltage IO group (A, B or C). These groups can be operated at 3.3V or 1.8V nominal. The three groups can
be operated at independent voltages but all pins withina group will operate at the same voltage. Group A operates at the voltage of
power supply DVDD3318_A. Group B operates at the voltage of power supply DVDD3318_B. Group C operates at the voltage of power
supply DVDD3318_C.
(1) I = Input, O = Output, I/O = Bidirectional, Z = High impedance, PWR = Supply voltage, GND = Ground, A = Analog signal.
Note: The pin type shown refers to the input, output or high-impedance state of the pin function when configured as the signal name
highlighted in bold. All multiplexed signals may enter a high-impedance state when the configured function is input-only or the configured
function supports high-Z operation. All GPIO signals can be used as input or output. For multiplexed pins where functions have different
types (ie., input versus output), the table reflects the pin function direction for that particular peripheral.
(2) IPD = Internal Pulldown resistor; IPU = Internal Pullup resistor; CP[n] = configurable pull-up/pull-down (where n is the pin group) using
the PUPDENA and PUPDSEL registers in the System Module. The pull-up and pull-down control of these pins is not active until the
device is out of reset. During reset, all of the pins associated with these registers are weakly pulled down. If the application requires a
pull-up, an external pull-up can be used.
(3) This signal is part of a dual-voltage IO group (A, B or C). These groups can be operated at 3.3V or 1.8V nominal. The three groups can
be operated at independent voltages but all pins withina group will operate at the same voltage. Group A operates at the voltage of
power supply DVDD3318_A. Group B operates at the voltage of power supply DVDD3318_B. Group C operates at the voltage of power
supply DVDD3318_C.
(1) I = Input, O = Output, I/O = Bidirectional, Z = High impedance, PWR = Supply voltage, GND = Ground, A = Analog signal.
Note: The pin type shown refers to the input, output or high-impedance state of the pin function when configured as the signal name
highlighted in bold. All multiplexed signals may enter a high-impedance state when the configured function is input-only or the configured
function supports high-Z operation. All GPIO signals can be used as input or output. For multiplexed pins where functions have different
types (ie., input versus output), the table reflects the pin function direction for that particular peripheral.
(2) IPD = Internal Pulldown resistor; IPU = Internal Pullup resistor; CP[n] = configurable pull-up/pull-down (where n is the pin group) using
the PUPDENA and PUPDSEL registers in the System Module. The pull-up and pull-down control of these pins is not active until the
device is out of reset. During reset, all of the pins associated with these registers are weakly pulled down. If the application requires a
pull-up, an external pull-up can be used.
(3) This signal is part of a dual-voltage IO group (A, B or C). These groups can be operated at 3.3V or 1.8V nominal. The three groups can
be operated at independent voltages but all pins withina group will operate at the same voltage. Group A operates at the voltage of
power supply DVDD3318_A. Group B operates at the voltage of power supply DVDD3318_B. Group C operates at the voltage of power
supply DVDD3318_C.
E17ICP[9]ASATA mechanical presence switch input
D16ICP[9]ASATA cold presence detect input
F19OCP[13]ASATA cold presence power-on output
E18OCP[13]ASATA LED control output
M2,
P1,
P2,
N4
H1,
H2,
K1,
K2,
L3,
M1
TYPE
(1)
PULL
(2)
POWER
GROUP
(3)
SATA PHY PLL regulator output. Requires an
external 0.1uF filter capacitor.
(1) I = Input, O = Output, I/O = Bidirectional, Z = High impedance, PWR = Supply voltage, GND = Ground, A = Analog signal.
Note: The pin type shown refers to the input, output or high-impedance state of the pin function when configured as the signal name
highlighted in bold. All multiplexed signals may enter a high-impedance state when the configured function is input-only or the configured
function supports high-Z operation. All GPIO signals can be used as input or output. For multiplexed pins where functions have different
types (ie., input versus output), the table reflects the pin function direction for that particular peripheral.
(2) IPD = Internal Pulldown resistor; IPU = Internal Pullup resistor; CP[n] = configurable pull-up/pull-down (where n is the pin group) using
the PUPDENA and PUPDSEL registers in the System Module. The pull-up and pull-down control of these pins is not active until the
device is out of reset. During reset, all of the pins associated with these registers are weakly pulled down. If the application requires a
pull-up, an external pull-up can be used.
(3) This signal is part of a dual-voltage IO group (A, B or C). These groups can be operated at 3.3V or 1.8V nominal. The three groups can
be operated at independent voltages but all pins withina group will operate at the same voltage. Group A operates at the voltage of
power supply DVDD3318_A. Group B operates at the voltage of power supply DVDD3318_B. Group C operates at the voltage of power
supply DVDD3318_C.
(1) I = Input, O = Output, I/O = Bidirectional, Z = High impedance, PWR = Supply voltage, GND = Ground, A = Analog signal.
Note: The pin type shown refers to the input, output or high-impedance state of the pin function when configured as the signal name
highlighted in bold. All multiplexed signals may enter a high-impedance state when the configured function is input-only or the configured
function supports high-Z operation. All GPIO signals can be used as input or output. For multiplexed pins where functions have different
types (ie., input versus output), the table reflects the pin function direction for that particular peripheral.
(2) IPD = Internal Pulldown resistor; IPU = Internal Pullup resistor; CP[n] = configurable pull-up/pull-down (where n is the pin group) using
the PUPDENA and PUPDSEL registers in the System Module. The pull-up and pull-down control of these pins is not active until the
device is out of reset. During reset, all of the pins associated with these registers are weakly pulled down. If the application requires a
pull-up, an external pull-up can be used.
(3) This signal is part of a dual-voltage IO group (A, B or C). These groups can be operated at 3.3V or 1.8V nominal. The three groups can
be operated at independent voltages but all pins withina group will operate at the same voltage. Group A operates at the voltage of
power supply DVDD3318_A. Group B operates at the voltage of power supply DVDD3318_B. Group C operates at the voltage of power
supply DVDD3318_C.
(1) I = Input, O = Output, I/O = Bidirectional, Z = High impedance, PWR = Supply voltage, GND = Ground, A = Analog signal.
Note: The pin type shown refers to the input, output or high-impedance state of the pin function when configured as the signal name
highlighted in bold. All multiplexed signals may enter a high-impedance state when the configured function is input-only or the configured
function supports high-Z operation. All GPIO signals can be used as input or output. For multiplexed pins where functions have different
types (ie., input versus output), the table reflects the pin function direction for that particular peripheral.
(2) IPD = Internal Pulldown resistor; IPU = Internal Pullup resistor; CP[n] = configurable pull-up/pull-down (where n is the pin group) using
the PUPDENA and PUPDSEL registers in the System Module. The pull-up and pull-down control of these pins is not active until the
device is out of reset. During reset, all of the pins associated with these registers are weakly pulled down. If the application requires a
pull-up, an external pull-up can be used.
(3) This signal is part of a dual-voltage IO group (A, B or C). These groups can be operated at 3.3V or 1.8V nominal. The three groups can
be operated at independent voltages but all pins withina group will operate at the same voltage. Group A operates at the voltage of
power supply DVDD3318_A. Group B operates at the voltage of power supply DVDD3318_B. Group C operates at the voltage of power
supply DVDD3318_C.
(1) I = Input, O = Output, I/O = Bidirectional, Z = High impedance, PWR = Supply voltage, GND = Ground, A = Analog signal.
Note: The pin type shown refers to the input, output or high-impedance state of the pin function when configured as the signal name
highlighted in bold. All multiplexed signals may enter a high-impedance state when the configured function is input-only or the configured
function supports high-Z operation. All GPIO signals can be used as input or output. For multiplexed pins where functions have different
types (ie., input versus output), the table reflects the pin function direction for that particular peripheral.
(2) IPD = Internal Pulldown resistor; IPU = Internal Pullup resistor; CP[n] = configurable pull-up/pull-down (where n is the pin group) using
the PUPDENA and PUPDSEL registers in the System Module. The pull-up and pull-down control of these pins is not active until the
device is out of reset. During reset, all of the pins associated with these registers are weakly pulled down. If the application requires a
pull-up, an external pull-up can be used.
(3) This signal is part of a dual-voltage IO group (A, B or C). These groups can be operated at 3.3V or 1.8V nominal. The three groups can
be operated at independent voltages but all pins withina group will operate at the same voltage. Group A operates at the voltage of
power supply DVDD3318_A. Group B operates at the voltage of power supply DVDD3318_B. Group C operates at the voltage of power
supply DVDD3318_C.
(1) GP8[0] is initially configured as a reserved function after reset and will not be in a predictable state. This signal will only be stable after
the GPIO configuration for this pin has been completed. Users should carefully consider the system implications of this pin being in an
unknown state after reset.
1.3V internal ram supply voltage pins (for 456 MHz versions)
1.2V internal ram supply voltage pins (for 375 MHz versions)
DESCRIPTION
3.9Unused Pin Configurations
All signals multiplexed with multiple functions may be used as an alternate function if a given peripheral is
not used. Unused non-multiplexed signals and some other specific signals should be handled as specified
in the tables below.
If NMI is unused, it should be pulled-high externally through a 10k-ohm resistor to supply DVDD3318_B.
Table 3-32. Unused USB0 and USB1 Signal Configurations
SIGNAL NAMEConfiguration (When only USB1 is not used)
USB0_DMNo ConnectUse as USB0 function
USB0_DPNo ConnectUse as USB0 function
This device supports a variety of boot modes through an internal DSP ROM bootloader . This device does
not support dedicated hardware boot modes; therefore, all boot modes utilize the internal DSP ROM. The
input states of the BOOT pins are sampled and latched into the BOOTCFG register, which is part of the
system configuration (SYSCFG) module, when device reset is deasserted. Boot mode selection is
determined by the values of the BOOT pins.
See Using the TMS320C6748/C6746/C6742 Bootloader (SPRAAT2) for more details on the ROM Boot
Loader.
The following boot modes are supported:
•NAND Flash boot
– 8-bit NAND
•NOR Flash boot
– NOR Direct boot (8-bit or 16-bit)
– NOR Legacy boot (8-bit or 16-bit)
– NOR AIS boot (8-bit or 16-bit)
•SPI0/ SPI1 Boot
– Serial Flash (Master Mode)
– SERIAL EEPROM (Master Mode)
– External Host (Slave Mode)
•UART0/UART1/UART2 Boot
– External Host
SPRS590B–JUNE 2009–REVISED AUGUST 2010
4.2SYSCFG Module
The following system level features of the chip are controlled by the SYSCFG peripheral:
•Readable Device, Die, and Chip Revision ID
•Control of Pin Multiplexing
•Priority of bus accesses different bus masters in the system
•Capture at power on reset the chip BOOT pin values and make them available to software
•Control of the DeepSleep power management function
•Enable and selection of the programmable pin pullups and pulldowns
•Special case settings for peripherals:
– Locking of PLL controller settings
– Default burst sizes for EDMA3 transfer controllers
– Selection of the source for the eCAP module input capture (including on chip sources)
– McASP AMUTEIN selection and clearing of AMUTE status for the McASP
– Control of the reference clock source and other side-band signals for both of the integrated USB
PHYs
– Clock source selection for EMIFA
– DDR2 Controller PHY settings
– SATA PHY power management controls
•Selects the source of emulation suspend signal (from DSP) of peripherals supporting this function.
Proper board design should ensure that input pins to the device always be at a valid logic level and not
floating. This may be achieved via pullup/pulldown resistors. The device features internal pullup (IPU) and
internal pulldown (IPD) resistors on most pins to eliminate the need, unless otherwise noted, for external
pullup/pulldown resistors.
An external pullup/pulldown resistor needs to be used in the following situations:
•Boot and Configuration Pins: If the pin is both routed out and 3-stated (not driven), an external
pullup/pulldown resistor is strongly recommended, even if the IPU/IPD matches the desired value/state.
•Other Input Pins: If the IPU/IPD does not match the desired value/state, use an external
pullup/pulldown resistor to pull the signal to the opposite rail.
For the boot and configuration pins, if they are both routed out and 3-stated (not driven), it is strongly
recommendedthatanexternalpullup/pulldownresistorbeimplemented.Although,internal
pullup/pulldown resistors exist on these pins and they may match the desired configuration value,
providing external connectivity can help ensure that valid logic levels are latched on these device boot and
configuration pins. In addition, applying external pullup/pulldown resistors on the boot and configuration
pins adds convenience to the user in debugging and flexibility in switching operating modes.
Tips for choosing an external pullup/pulldown resistor:
•Consider the total amount of current that may pass through the pullup or pulldown resistor. Make sure
to include the leakage currents of all the devices connected to the net, as well as any internal pullup or
pulldown resistors.
•Decide a target value for the net. For a pulldown resistor, this should be below the lowest VILlevel of
all inputs connected to the net. For a pullup resistor, this should be above the highest VIHlevel of all
inputs on the net. A reasonable choice would be to target the VOLor VOHlevels for the logic family of
the limiting device; which, by definition, have margin to the VILand VIHlevels.
•Select a pullup/pulldown resistor with the largest possible value; but, which can still ensure that the net
will reach the target pulled value when maximum current from all devices on the net is flowing through
the resistor. The current to be considered includes leakage current plus, any other internal and
external pullup/pulldown resistors on the net.
•For bidirectional nets, there is an additional consideration which sets a lower limit on the resistance
value of the external resistor. Verify that the resistance is small enough that the weakest output buffer
can drive the net to the opposite logic level (including margin).
•Remember to include tolerances when selecting the resistor value.
•For pullup resistors, also remember to include tolerances on the IO supply rail.
•For most systems, a 1-kΩ resistor can be used to oppose the IPU/IPD while meeting the above
criteria. Users should confirm this resistor value is correct for their specific application.
•For most systems, a 20-kΩ resistor can be used to compliment the IPU/IPD on the boot and
configuration pins while meeting the above criteria. Users should confirm this resistor value is correct
for their specific application.
•For more detailed information on input current (II), and the low-/high-level input voltages (VILand VIH)
for the device, see Section 5.2 , Recommended Operating Conditions.
•For the internal pullup/pulldown resistors for all device pins, see the peripheral/system-specific terminal
functions table.
5.1Absolute Maximum Ratings Over Operating Junction Temperature Range
(Unless Otherwise Noted)
Supply voltage ranges
Input voltage (VI) ranges
Output voltage (VO) ranges
Clamp Currentrails. Limit clamp current that flows through the I/O's internal diode
Operating Junction Temperature ranges,
T
J
Storage temperature range, T
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to VSS, USB0_VSSA33, USB0_VSSA, PLL0_VSSA, OSCVSS, RTC_VSS
(3) Up to a maximum of 24 hours.
stg
(1)
Core Logic, Variable and Fixed-0.5 V to 1.4 V
(CVDD, RVDD, RTC_CVDD, PLL0_VDDA , PLL1_VDDA ,
SATA_VDD, USB_CVDD )
I/O, 1.8V-0.5 V to 2 V
(USB0_VDDA18, USB1_VDDA18, SATA_VDDR, DDR_DVDD18)
I/O, 3.3V-0.5 V to 3.8V
(DVDD3318_A, DVDD3318_B, DVDD3318_C, USB0_VDDA33,
USB1_VDDA33)
Oscillator inputs (OSCIN, RTC_XI), 1.2V-0.3 V to CVDD + 0.3V
Dual-voltage LVCMOS inputs, 3.3V or 1.8V (Steady State)-0.3V to DVDD + 0.3V
Dual-voltage LVCMOS inputs, operated at 3.3V(Transient)DVDD + 20%
Dual-voltage LVCMOS inputs, operated at 1.8V(Transient)DVDD + 30%
USB 5V Tolerant IOs:5.25V
(USB0_DM, USB0_DP, USB0_ID, USB1_DM, USB1_DP)
USB0 VBUS Pin5.50V
Dual-voltage LVCMOS outputs, 3.3V or 1.8V-0.5 V to DVDD + 0.3V
(Steady State)
Dual-voltage LVCMOS outputs, operated at 3.3V(Transient)DVDD + 20%
(Transient)up to 20% of Signal
Dual-voltage LVCMOS outputs, operated at 1.8V(Transient)DVDD + 30%
(Transient)up to 30% of Signal
Input or Output Voltages 0.3V above or below their respective power±20mA
protection cells.
Commercial (default)0°C to 90°C
Industrial (D suffix)-40°C to 90°C
Extended (A suffix)-40°C to 105°C
(default)-55°C to 150°C
(1) The RTC provides an option for isolating the RTC_CVDD from the CVDD to reduce current leakage when the RTC is powered
independently. If these power supplies are not isolated (CTRL.SPLITPOWER=0), RTC_CVDD must be equal to or greater than CVDD.
If these power supplies are isolated (CTRL.SPLITPOWER=1), RTC_CVDD may be lower than CVDD.
(2) When an external crystal is used oscillator (OSC_VSS, RTC_VSS) ground must be kept separate from other grounds and connected
directly to the crystal load capacitor ground. These pins are shorted to VSS on the device itself and should not be connected to VSS on
the circuit board. If a crystal is not used and the clock input is driven directly, then the oscillator VSS may be connected to board ground.
(3) These IO specifications apply to the dual-voltage IOs only and do not apply to DDR2/mDDR or SATA interfaces. DDR2/mDDR IOs are
(4) Whichever is smaller. P = the period of the applied signal. Maintaining transition times as fast as possible is recommended to improve
noise immunity on input signals.
(5) This operating points is not supported on revision 1.x silicon.
(6) This operating point is 300 MHz on revision 1.x silicon.
Differential input voltage, SATA_REFCLKP and
SATA_REFCLKN
Transition time, 10%-90%, All Inputs (unless otherwise
specified in the electrical data sections)
CVDD = 1.3V
operating point
CVDD = 1.2V
Commercial temperature grade
(default)
operating point
CVDD = 1.1V
operating point
CVDD = 1.0V
operating point
CVDD = 1.3V
operating point
Industrial temperature grade
(D suffix)
CVDD = 1.1V
operating point
CVDD = 1.0V
operating point
CVDD = 1.2V
operating point
Extended temperature gradeCVDD = 1.1V
(A suffix)operating point
The information in the section below is provided solely for your convenience and does not extend or
modify the warranty provided under TI’s standard terms and conditions for TI semiconductor products.
To avoid significant degradation, the device power-on hours (POH) must be limited to the following:
Table 5-1. Recommended Power-On Hours
SiliconOperating JunctionPower-On Hours [POH]
RevisionTemperature (Tj)(hours)
A300 MHz0 to 90 °C1.2V100,000
B300 MHz0 to 90 °C1.2V100,000
B375 MHz0 to 90 °C1.2V100,000
B375 MHz-40 to 105 °C1.2V75,000
B456 MHz0 to 90 °C1.3V100,000
B456 MHz-40 to 90 °C1.3V100,000
(1) 100,000 POH can be achieved at this temperature condition if the device operation is limited to 345 MHz
Note: Logic functions and parameter values are not assured out of the range specified in the recommended
operating conditions.
The above notations cannot be deemed a warranty or deemed to extend or modify the warranty under
TI’s standard terms and conditions for TI semiconductor products.
(1) These IO specifications apply to the dual-voltage IOs only and do not apply to DDR2/mDDR or SATA interfaces. DDR2/mDDR IOs are
1.8V IOs and adhere to the JESD79-2A standard. USB0 I/Os adhere to the USB2.0 standard. USB1 I/Os adhere to the USB1.1
standard. SATA I/Os adhere to the SATA-I and SATA-II standards.
(2) IIapplies to input-only pins and bi-directional pins. For input-only pins, IIindicates the input leakage current. For bi-directional pins, I
indicates the input leakage current and off-state (Hi-Z) output leakage current.
(3) Applies only to pins with an internal pullup (IPU) or pulldown (IPD) resistor.
TEST
CONDITIONS
DVDD= 3.15V,
IOH= -4 mA
DVDD= 3.15V,
IOH= -100 mA
IOH= -2 mA
DVDD= 3.15V,
IOL= 4mA
DVDD= 3.15V,
IOL= 100 mA
VI= VSS to
DVDD without
opposing
internal resistor
VI= VSS to
DVDD with
opposing70310mA
internal pullup
6Peripheral Information and Electrical Specifications
6.1Parameter Information
6.1.1Parameter Information Device-Specific Information
A.The data sheet provides timing at the device pin. For output timing analysis, the tester pin electronics and its
transmission line effects must be taken into account. A transmission line with a delay of 2 ns or longer can be used to
produce the desired transmission line effect. The transmission line is intended as a load only. It is not necessary to
add or subtract the transmission line delay (2 ns or longer) from the data sheet timings.
Input requirements in this data sheet are tested with an input slew rate of < 4 Volts per nanosecond (4 V/ns) at the
device pin and the input signals are driven between 0V and the appropriate IO supply rail for the signal.
Figure 6-1. Test Load Circuit for AC Timing Measurements
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The load capacitance value stated is only for characterization and measurement of AC timing signals. This
load capacitance value does not indicate the maximum load the device is capable of driving.
6.1.1.1Signal Transition Levels
All input and output timing parameters are referenced to V
For 3.3 V I/O, V
For 1.8 V I/O, V
= 1.65 V.
ref
= 0.9 V.
ref
Figure 6-2. Input and Output Voltage Reference Levels for AC Timing Measurements
All rise and fall transition timing parameters are referenced to VILMAX and VIHMIN for input clocks,
VOLMAX and VOHMIN for output clocks
Figure 6-3. Rise and Fall Transition Time Voltage Reference Levels
6.2Recommended Clock and Control Signal Transition Behavior
All clocks and control signals must transition between VIHand VIL(or between VILand VIH) in a monotonic
manner.
6.3Power Supplies
6.3.1Power-on Sequence
The device should be powered-on in the following order:
•1) RTC (RTC_CVDD) may be powered from an external device (such as a battery) prior to all other
supplies being applied or powered-up at the same time as CVDD. If the RTC is not used, RTC_CVDD
should be connected to CVDD. RTC_CVDD should not be left unpowered while CVDD is powered.
•2a) All variable 1.3V - 1.0V core logic supplies (CVDD)
•2b) All static 1.2V logic supplies (RVDD, VDDA_12_PLL0, VDDA_12_PLL1, USB_CVDD ,
SATA_VDD). If voltage scaling is not used on the device, groups 2a) and 2b) can be controlled from
the same power supply and powered up together.
•3) All static 1.8V IO supplies (DVDD18, DDR_DVDD18, USB0_VDDA18 , USB1_VDDA18 and
SATA_VDDR) and any of the LVCMOS IO supply groups used at 1.8V nominal (DVDD3318_A,
DVDD3318_B, or DVDD3318_C).
•4) All analog 3.3V PHY supplies (USB0_VDDA33 and USB1_VDDA33; these are not required if both
USB0 and USB1 are not used) and any of the LVCMOS IO supply groups used at 3.3V nominal
(DVDD3318_A, DVDD3318_B, or DVDD3318_C).
There is no specific required voltage ramp rate for any of the supplies as long as the LVCMOS supplies
operated at 3.3V (DVDD3318_A, DVDD3318_B, or DVDD3318_C) never exceed the STATIC 1.8V
supplies by more than 2 volts.
RESET must be maintained active until all power supplies have reached their nominal values.
6.3.2Power-off Sequence
The power supplies can be powered-off in any order as long as LVCMOS supplies operated at 3.3V
(DVDD3318_A, DVDD3318_B, or DVDD3318_C) never exceed static 1.8V supplies by more than 2 volts.
There is no specific required voltage ramp down rate for any of the supplies (except as required to meet
the above mentioned voltage condition).
A power-on reset (POR) is required to place the device in a known good state after power-up. Power-On
Reset is initiated by bringing RESET and TRST low at the same time. POR sets all of the device internal
logic to its default state. All pins are tri-stated with the exception of RESETOUT which remains active
through the reset sequence. RESETOUT is an output for use by other controllers in the system that
indicates the device is currently in reset.
A summary of the effects of Power-On Reset is given below:
•All internal logic (including emulation logic and the PLL logic) is reset to its default state
•Internal memory is not maintained through a POR
•RESETOUT goes active
•All device pins go to a high-impedance state
•The RTC peripheral is not reset during a POR. A software sequence is required to reset the RTC
A watchdog reset triggers a POR.
6.4.2Warm Reset
A warm reset provides a limited reset to the device. Warm Reset is initiated by bringing only RESET low
(TRST is maintained high through a warm reset). Warm reset sets certain portions of the device to their
default state while leaving others unaltered. All pins are tri-stated with the exception of RESETOUT which
remains active through the reset sequence. RESETOUT is an output for use by other controllers in the
system that indicates the device is currently in reset.
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A summary of the effects of Warm Reset is given below:
•All internal logic (except for the emulation logic and the PLL logic) is reset to its default state
•Internal memory is maintained through a warm reset
•RESETOUT goes active
•All device pins go to a high-impedance state
•The RTC peripheral is not reset during a warm reset. A software sequence is required to reset the
RTC
Table 6-1 assumes testing over the recommended operating conditions.
Table 6-1. Reset Timing Requirements (
NO.PARAMETERUNIT
1t
w(RSTL)
2t
su(BPV-RSTH)
3t
h(RSTH-BPV)
t
d(RSTH-RESETOUTH)
4
5t
d(RSTL-RESETOUTL)
(1) RESETOUT is multiplexed with other pin functions. See the Terminal Functions table, Table 3-5 for details.
(2) For power-on reset (POR), the reset timings in this table refer to RESET and TRST together. For warm reset, the reset timings in this
table refer to RESET only (TRST is held high).
(3) OSCIN cycles.
Pulse width, RESET/TRST low100100100ns
Setup time, boot pins valid before RESET/TRST high202020ns
Hold time, boot pins valid after RESET/TRST high202020ns
RESET high to RESETOUT high; Warm reset141620cycles
RESET high to RESETOUT high; Power-on Reset141620
Delay time, RESET/TRST low to RESETOUT low141620ns
(1),(2)
)
1.3V, 1.2V1.1V1.0V
MINMAXMINMAXMINMAX
(3)
Figure 6-4. Power-On Reset (RESET and TRST active) Timing
The device includes two choices to provide an external clock input, which is fed to the on-chip PLLs to
generate high-frequency system clocks. These options are illustrated in Figure 6-6 and Figure 6-7. For
input clock frequencies between 12 and 20 MHz, a crystal with 80 ohm max ESR is recommended. For
input clock frequencies between 20 and 30 MHz, a crystal with 60 ohm max ESR is recommended.
Typical load capacitance values are 10-20 pF, where the load capacitance is the series combination of C1
and C2.
Figure 6-6 illustrates the option that uses on-chip 1.2V oscillator with external crystal circuit. Figure 6-7
illustrates the option that uses an external 1.2V clock input.
Table 6-3. OSCIN Timing Requirements for an Externally Driven Clock
PARAMETERMINMAXUNIT
f
OSCIN
t
c(OSCIN)
t
w(OSCINH)
t
w(OSCINL)
t
t(OSCIN)
t
j(OSCIN)
(1) Whichever is smaller. P = the period of the applied signal. Maintaining transition times as fast as possible is recommended to improve
noise immunity on input signals.
OSCIN frequency range1250MHz
Cycle time, external clock driven on OSCIN20ns
Pulse width high, external clock on OSCIN0.4 t
Pulse width low, external clock on OSCIN0.4 t
Transition time, OSCIN0.25P or 10ns
Period jitter, OSCIN0.02Pns
c(OSCIN)
c(OSCIN)
(1)
ns
ns
6.6Clock PLLs
The device has two PLL controllers that provide clocks to different parts of the system. PLL0 provides
clocks (though various dividers) to most of the components of the device. PLL1 provides clocks to the
mDDR/DDR2 Controller and provides an alternate clock source for the ASYNC3 clock domain. This allows
the peripherals on the ASYNC3 clock domain to be immune to frequency scaling operation on PLL0.
The PLL controller provides the following:
•Glitch-Free Transitions (on changing clock settings)
•Domain Clocks Alignment
•Clock Gating
•PLL power down
The various clock outputs given by the controller are as follows:
•Domain Clocks: SYSCLK [1:n]
•Auxiliary Clock from reference clock source: AUXCLK
Various dividers that can be used are as follows:
•Post-PLL Divider: POSTDIV
•SYSCLK Divider: D1, ¼, Dn
Various other controls supported are as follows:
The device DSP generates the high-frequency internal clocks it requires through an on-chip PLL.
The PLL requires some external filtering components to reduce power supply noise as shown in
Figure 6-8.
Figure 6-8. PLL External Filtering Components
The input to the PLL is either from the on-chip oscillator or from an external clock on the OSCIN pin. PLL0
outputs seven clocks that have programmable divider options. PLL1 outputs three clocks that have
programmable divider options. Figure 6-9 illustrates the high-level view of the PLL Topology.
The PLLs are disabled by default after a device reset. They must be configured by software according to
the allowable operating conditions listed in Table 6-4 before enabling the device to run from the PLL by
setting PLLEN = 1.
(1) The multiplier values must be chosen such that the PLL output frequency (at PLLOUT) is between 300 and 600 MHz, but the frequency
going into the SYSCLK dividers (after the post divider) cannot exceed the maximum clock frequency defined for the device at a given
voltage operating point.
Default
Value
(1)
(1)
OSCIN
6.6.2Device Clock Generation
PLL0 is controlled by PLL Controller 0 and PLL1 is controlled by PLL Controller 1. PLLC0 and PLLC1
manage the clock ratios, alignment, and gating for the system clocks to the chip. The PLLCs are
responsible for controlling all modes of the PLL through software, in terms of pre-division of the clock
inputs (PLLC0 only), multiply factors within the PLLs, and post-division for each of the chip-level clocks
from the PLLs outputs. PLLC0 also controls reset propagation through the chip, clock alignment, and test
points.
PLLC0 provides clocks for the majority of the system but PLLC1 provides clocks to the mDDR/DDR2
Controller and the ASYNC3 clock domain to provide frequency scaling immunity to a defined set or
peripherals. The ASYNC3 clock domain can either derive its clock from PLL1_SYSCLK2 (for frequency
scaling immunity from PLL0) or from PLL0_SYSCLK2 (for synchronous timing with PLL0) depending on
the application requirements. In addition, some peripherals have specific clock options independent of the
ASYNC clock domain.
The processor supports multiple operating points by scaling voltage and frequency to minimize power
consumption for a given level of processor performance.
Frequency scaling is achieved by modifying the setting of the PLL controllers’ multipliers, post-dividers
(POSTDIV), and system clock dividers (SYSCLKn). Modification of the POSTDIV and SYSCLK values
does not require relocking the PLL and provides lower latency to switch between operating points, but at
the expense of the frequencies being limited by the integer divide values (only the divide values are
altered the PLL multiplier is left unmodified). Non integer divide frequency values can be achieved by
changing both the multiplier and the divide values, but when the PLL multiplier is changed the PLL must
relock, incurring additional latency to change between operating points. Detailed information on modifying
the PLL Controller settings can be found in the TMS320C6748 DSP System Reference Guide -
SPRUGJ7.
Voltage scaling is enabled from outside the device by controlling an external voltage regulator. The
processor may communicate with the regulator using GPIOs, I2C or some other interface. When switching
between voltage-frequency operating points, the voltage must always support the desired frequency.
When moving from a high-performance operating point to a lower performance operating point, the
frequency should be lowered first followed by the voltage. When moving from a low-performance operating
point to a higher performance operating point, the voltage should be raised first followed by the frequency.
Voltage operating points refer to the CVdd voltage at that point. Other static supplies must be maintained
at their nominal voltages at all operating points.
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Product Folder Link(s): TMS320C6748
ADVANCEINFORMATION
TMS320C6748
SPRS590B–JUNE 2009–REVISED AUGUST 2010
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The maximum voltage slew rate for CVdd supply changes is 1 mV/us.
For additional information on power management solutions from TI for this processor, follow the Power
Management link in the Product Folder on www.ti.com for this processor.
The processor supports multiple clock domains some of which have clock ratio requirements to each
other. SYSCLK1:SYSCLK2:SYSCLK4:SYSCLK6 are synchronous to each other and the SYSCLKn
dividers must always be configured such that the ratio between these domains is 1:2:4:1. The ASYNC and
ASYNC3 clock domains are asynchronous to the other clock domains and have no specific ratio
requirement.
The table below summarizes the maximum internal clock frequencies at each of the voltage operating
points.
Table 6-5. Maximum Internal Clock Frequencies at Each Voltage Operating Point
McASP AUXCLK Bypass clock source for the McASP50 MHz50 MHz50 MHz50 MHz
PLL0_AUXCLK48 MHz48 MHz48 MHz48 MHz
ASYNC1ASYNC Clock Domain (EMIFA)66.6 MHz 33.3 MHz
ASYNC250 MHz50 MHz50 MHz50 MHz
ASYNC3152 MHz150 MHz100 MHz75 MHz
SYSCLK2 clock domain peripherals and
domain peripherals
Optional clock for ASYNC1 clock
domain
Optional 50 MHz clock source for
EMAC RMII interface
DDR2/mDDR Interface clock source
the value shown)
Optional clock source for ASYNC3
clock domain peripherals
Alternate clock source input to PLL
Controller 0
Bypass clock source for the USB0 and
USB1
ASYNC2 Clock Domain (multiple
peripherals)
ASYNC3 Clock Domain (multiple
peripherals)
CLOCK DOMAIN1.3V NOM1.2V NOM
148 MHz (Async mode)148 MHz (Async mode)
100 MHz (SDRAM mode) 100 MHz (SDRAM mode)
Some interfaces have specific limitations on supported modes/speeds at each operating point. See the
corresponding peripheral sections of this document for more information.
TI provides software components (called the Power Manager) to perform DVFS and abstract the task from
the user. The Power Manager controls changing operating points (both frequency and voltage) and
handles the related tasks involved such as informing/controlling peripherals to provide graceful transitions
between operating points. The Power Manager is bundled as a component of DSP/BIOS.
The device has a large number of interrupts to service the needs of its many peripherals and subsystems.
6.7.1DSP Interrupts
The C674x DSP interrupt controller combines device events into 12 prioritized interrupts. The source for
each of the 12 CPU interrupts is user programmable and is listed in Table 6-6. Also, the interrupt
controller controls the generation of the CPU exceptions, NMI, and emulation interrupts. Table 6-7
summarizes the C674x interrupt controller registers and memory locations.
Table 6-6. C6748 DSP Interrupts
EVT#Interrupt NameSource
0EVT0C674x Int Ctl 0
1EVT1C674x Int Ctl 1
2EVT2C674x Int Ctl 2
3EVT3C674x Int Ctl 3
4T64P0_TINT12Timer64P0 - TINT12
5SYSCFG_CHIPINT2SYSCFG CHIPSIG Register
6PRU_EVTOUT0PRUSS Interrupt
7EHRPWM0HiResTimer/PWM0 Interrupt
8EDMA3_0_CC0_INT1EDMA3_0 Channel Controller 0 Shadow Region 1 Transfer