Texas Instruments TMP300, TMP300AIDCKTG4 Datasheet

 
  

R

PULL-UP

210kW

(1)

R

SET

T

SET

OUT

V+

HYST

SET

V

TEMP

TMP300

3mA

Proportional
toT

A

NOTE:(1)Thinfilmresistorwithapproximately10%accuracy;
however,thisaccuracyerroristrimmedoutatthefactory.

1

2

3

6

5

4

V+

V

TEMP

HYST

SET

T

SET

GND

OUT

TMP300

SC70-6,SOT23-6

1.8V, Resistor-Programmable
TEMPERATURE SWITCH and

ANALOG OUT TEMPERATURE SENSOR in SC70

1

FEATURES

2

• ACCURACY: ± 1 ° C (typical at +25 ° C)

• PROGRAMMABLE TRIP POINT

• PROGRAMMABLE HYSTERESIS: 5 ° C/10 ° C

• OPEN-DRAIN OUTPUTS

• LOW-POWER: 110 μ A (max)

• WIDE VOLTAGE RANGE: +1.8V to +18V

• OPERATION: – 40 ° C to +150 ° C

• ANALOG OUT: 10mV/ ° C

• SC70-6 AND SOT23-6 PACKAGES

APPLICATIONS

• POWER-SUPPLY SYSTEMS

• DC-DC MODULES

• THERMAL MONITORING

• ELECTRONIC PROTECTION SYSTEMS

TMP300

SBOS335A – JUNE 2005 – REVISED SEPTEMBER 2007

DESCRIPTION

The TMP300 is a low-power, resistor-programmable,
digital output temperature switch. It allows a threshold
point to be set by adding an external resistor. Two
levels of hysteresis are available. The TMP300 has a
V
point or in temperature-compensation loops.

The TMP300 detects temperature with ± 4 ° C accuracy
(max) over – 40 ° C to +125 ° C.

With a supply voltage as low as 1.8V and low current
consumption, the TMP300 is ideal for power-sensitive
systems.

Available in two micropackages that have proven
thermal characteristics, this part gives a complete and
simple solution for users who need simple and
reliable thermal management.

analog output that can be used as a testing

TEMP

1

2 All trademarks are the property of their respective owners.

PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

Copyright © 2005 – 2007, Texas Instruments Incorporated

www.ti.com

TMP300

SBOS335A – JUNE 2005 – REVISED SEPTEMBER 2007

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

ORDERING INFORMATION

(1)

PRODUCT PACKAGE-LEAD PACKAGE DESIGNATOR PACKAGE MARKING

TMP300 SC70-6 DCK BPN
TMP300 SOT23-6

(2)

DBV T300

(1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI

web site at www.ti.com .

(2) Available 4Q, 2007.

ABSOLUTE MAXIMUM RATINGS

(1)

VALUE UNIT

Supply Voltage (V+) +18 V
Signal Input Terminals, Voltage
Signal Input Terminals, Current
Output Short-Circuit (ISC)

(2)
(2)

(3)

– 0.5 to (V+) + 0.5 V

± 10 mA

Continuous
Open-Drain Output (V+) + 0.5 V
Operating Temperature – 40 to +150 ° C
Storage Temperature – 55 to +150 ° C
Junction Temperature (TJ) +150 ° C

ESD Rating

Human Body Model (HBM) 4000 V
Charged Device Model (CDM) 1000 V

(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may

degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not supported.

(2) Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.5V beyond the supply rails should

be current limited to 10mA or less.

(3) Short-circuit to ground.

2 Submit Documentation Feedback Copyright © 2005 – 2007, Texas Instruments Incorporated

Product Folder Link(s): TMP300

www.ti.com

TMP300

SBOS335A – JUNE 2005 – REVISED SEPTEMBER 2007

ELECTRICAL CHARACTERISTICS

At VS= 3.3V and TA= – 40 ° C to +125 ° C, unless otherwise noted.

TMP300

PARAMETER TEST CONDITIONS MIN

(1)

TEMPERATURE MEASUREMENT

Measurement Range VS= 2.35V to 18V – 40 +125 ° C

VS= 1.8V to 2.35V – 40 100(V

TRIP POINT

Total Accuracy TA= – 40 ° C to +125 ° C ± 2 ± 4 ° C
R

Equation TCis in ° C R

SET

SET

HYSTERESIS SET INPUT

LOW Threshold 0.4 V
HIGH Threshold VS– 0.4 V
Threshold Hysteresis HYST

HYST

= GND 5 ° C

SET

= V

SET

S

DIGITAL OUTPUT

Logic Family CMOS
Open-Drain Leakage Current OUT = V

S

Logic Levels

V

OL

VS= 1.8V to 18V, I

= 5mA 0.3 V

SINK

ANALOG OUTPUT

Accuracy ± 2 ± 3 ° C
Temperature Sensitivity 10 mV/ ° C
Output Voltage TA= +25 ° C 720 750 780 mV
V

Pin Output Resistance 210 k Ω

TEMP

POWER SUPPLY

Quiescent Current

(2)

I

Q

VS= 1.8V to 18V,

TA= – 40 ° C to +125 ° C

TEMPERATURE RANGE

Specified Range VS= 2.35V to 18V – 40 +125 ° C

VS= 1.8V to 2.35V – 40 100(V

Operating Range VS= 2.35V to 18V – 40 +150 ° C

VS= 1.8V to 2.35V – 50 100(V

Thermal Resistance, θ

JA

SC70 250 ° C/W
SOT23-6

(3)

(1) 100% of production is tested at TA= +85 ° C. Specifications over temperature range are ensured by design.
(2) See Figure 1 for typical quiescent current.
(3) Available Q4, 2007.

(1)

TYP

MAX

– 0.95) ° C

S

(1)

= 10 (50 + TC)/3 k Ω

10 ° C

10 μ A

110 μ A

– 0.95) ° C

S

– 0.95) ° C

S

180 ° C/W

UNIT

Copyright © 2005 – 2007, Texas Instruments Incorporated Submit Documentation Feedback 3

Product Folder Link(s): TMP300

www.ti.com

-40 -25 0

95

85

45

25 50 75 100 125

Temperature( C)°

I ( A)m

Q

75

55

65

V =18V

S

V =3.3V

S

V =1.8V

S

-40 -25 0

2.0

1.5

1.0

0.5

0

-0.5

-1.0

-1.5

-2.0

25 50 75 100 125

Temperature( C)°

Error( C)°

T +1%

ERROR

T

ERROR

- 1%

T +0.1%

ERROR

T

ERROR

- 0.1%

-40 -25 0

700

600

500

400

300

200

100

0

25 50 75 100 125

Temperature(°C)

R

(k

)

W

SET

-40 -25 0

4.0

-4.0
25 50 75 100 125

Temperature( C)°

Error(

C)°

2.0

-1.0

1.0

0

-2.0

-3.0

3.0

-40 -25 0

3.0

2.0

-3.0
25 50 75 100 125

Temperature( C)°

Error(

C)°

1.5

-2.0

1.0

-2.5

2.5

0.5

0

-0.5

-1.0

-1.5

-40 -25 0

0.10

0.08

-0.02

0

-0.04

-0.06

-0.08

-0.10

25 50 75 100 125

Temperature(°C)

Error

( C/V)°

0.06

0.04

0.02

T is+85 CforV°

MAX S

=1.8Vto3.3V

3.3Vto18V

TMP300

SBOS335A – JUNE 2005 – REVISED SEPTEMBER 2007

TYPICAL CHARACTERISTICS

At VS= 5V, unless otherwise noted.

QUIESCENT CURRENT OVER TEMPERATURE AND

SUPPLY R

Figure 1. Figure 2.

R

vs TEMPERATURE TYPICAL TRIP ERROR

SET

SHIFT DUE TO R

SET

TOLERANCE

SET

Figure 3. Figure 4.

TYPICAL ANALOG OUTPUT ERROR ANALOG PSR OVER TEMPERATURE

Figure 5. Figure 6.

4 Submit Documentation Feedback Copyright © 2005 – 2007, Texas Instruments Incorporated

Product Folder Link(s): TMP300

www.ti.com

-40 -25 0

0.10

0.08

-0.02

0

-0.04

-0.06

-0.08

-0.10

25 50 75 100 125

Temperature(°C)

Error

( C/V)°

0.06

0.04

0.02

3.3Vto18V

T is+85 CforV°

MAX S

=1.8Vto3.3V

At VS= 5V, unless otherwise noted.

TMP300

SBOS335A – JUNE 2005 – REVISED SEPTEMBER 2007

TYPICAL CHARACTERISTICS (continued)

TRIP PSR OVER TEMPERATURE

Figure 7.

Copyright © 2005 – 2007, Texas Instruments Incorporated Submit Documentation Feedback 5

Product Folder Link(s): TMP300

www.ti.com

R =

SET

(T 0.01+0.5)´

SET

3e

-6

R ink =W

SET

10(50+T )

SET

3

R

INT

210kW

R

SET

T

SET

OUT

V+

HYST

SET

V

TEMP

TMP300

3 Am

Proportional
toT

A

Open-DrainControl

Voltagesource

totesttrippoint.

TMP300

SBOS335A – JUNE 2005 – REVISED SEPTEMBER 2007

APPLICATIONS INFORMATION

The TMP300 is a thermal sensor designed for
over-temperature protection circuits in electronic
systems. The TMP300 uses a set resistor to program
the trip temperature of the digital output. An additional
high-impedance (210k Ω ) analog voltage output
provides the temperature reading.

CALCULATING R

The set resistor (R
for the comparator input. The TMP300 trips when the
V

pin exceeds the T

TEMP

set resistor is determined by the analog output
function and the 3 μ A internal bias current.

SET

) provides a threshold voltage

SET

voltage. The value of the

SET

To set the TMP300 to trip at a preset value, calculate
the R

resistor value according to Equation 1 or

SET

Equation 2 :

Where T

Where T

USING V

is in ° C; or

SET

is in ° C.

SET

TO TRIP THE DIGITAL OUTPUT

TEMP

The analog voltage output can also serve as a
voltage input that forces a trip of the digital output to
simulate a thermal event. This simulation facilitates
easy system design and test of thermal safety
circuits, as shown in Figure 8 .

(1)

(2)

Figure 8. Applying Voltage to Trip Digital Output

6 Submit Documentation Feedback Copyright © 2005 – 2007, Texas Instruments Incorporated

Product Folder Link(s): TMP300

www.ti.com

210kW

T

SET

OUT

V+

HYST

SET

V

TEMP

TMP300

3 Am

Proportional
toT

A

AnalogOut

OPA335

-50 -25 0

1.00

0.75

0.50

0.25

0

-0.25

-0.50

-0.75

-1.00

25 50 75 100 125

Temperature( C)°

TripSetVoltageError( C)°

210kW

T

SET

OUT

V+

HYST

SET

V

TEMP

TMP300

3 Am

Proportional
toT

A

Open-DrainControl

Voltagesource

totesttrippoint.

DAC8560

TMP300

SBOS335A – JUNE 2005 – REVISED SEPTEMBER 2007

ANALOG TEMPERATURE OUTPUT USING A DAC TO SET THE TRIP POINT

The analog out or V
(210k Ω ). Avoid loading this pin to prevent degrading digital-to-analog converter (DAC) code. This
the analog out value or trip point. Buffer the output of technique can be useful for control loops where a
this pin when using it for direct thermal measurement. large thermal mass is being brought up to the set

Figure 9 shows buffering of the analog output signal. temperature and the OUT pin is used to control the

pin is high-impedance The trip point is easily converted by changing the

TEMP

heating element. The analog output can be monitored
in a control algorithm that adjusts the set temperature
to prevent overshoot. Trip set voltage error versus
temperature is shown in Figure 10 , which shows error
in ° C of the comparator input over temperature. An
alternative method of setting the trip point by using a
DAC is shown in Figure 11 .

Figure 9. Buffering the Analog Output Signal

Figure 10. Trip Set Voltage Error vs Temperature

Figure 11. DAC Generates the Voltage-Driving T

Product Folder Link(s): TMP300

Pin

SET

Copyright © 2005 – 2007, Texas Instruments Incorporated Submit Documentation Feedback 7

www.ti.com

-50 -25 0

5

4

3

2

1

0

-1

-2

-3

-4

-5

25 50 75 100 125

Temperature( C)°

Error( C)°

Maximum

Average

Minimum

-50 -25 0

5

4

3

2

1

0

-1

-2

-3

-4

-5

25 50 75 100 125

Temperature( C)°

Error( C)°

Maximum

Average

Minimum

210kW

R

SET

C

BYPASS

T

SET

OUT

V+

HYST

SET

V

TEMP

TMP300

3 Am

Proportional
toT

A

Open-DrainControl

C

BYPASS

TMP300

SBOS335A – JUNE 2005 – REVISED SEPTEMBER 2007

HYSTERESIS

The hysteresis pin has two settings. Grounding
HYST
V

S

variation over temperature is shown in Figure 12 and

Figure 13 .

Figure 12. 5 ° C Hysteresis Error vs Temperature

results in 5 ° C of hysteresis. Connecting it to

SET

results in 10 ° C of hysteresis. Hysteresis error

Bypass capacitors should be used on the supplies as
well as on the R

and analog out (V

SET

) pins when

TEMP

in noisy environments, as shown in Figure 14 . These
capacitors reduce premature triggering of the
comparator.

Figure 13. 10 ° C Hysteresis Error vs Temperature

Figure 14. Bypass Capacitors Prevent Early Comparator Toggling Due to Circuit Board Noise

8 Submit Documentation Feedback Copyright © 2005 – 2007, Texas Instruments Incorporated

Product Folder Link(s): TMP300

PACKAGE OPTION ADDENDUM

www.ti.com

5-Oct-2007

PACKAGING INFORMATION

Orderable Device Status

(1)

Package

Type

Package
Drawing

Pins Package

Qty

Eco Plan

TMP300AIDBVR PREVIEW SOT-23 DBV 6 3000 TBD Call TI Call TI
TMP300AIDBVT PREVIEW SOT-23 DBV 6 250 TBD Call TI Call TI
TMP300AIDCKR ACTIVE SC70 DCK 6 3000 Green (RoHS &

no Sb/Br)

TMP300AIDCKRG4 ACTIVE SC70 DCK 6 3000 Green (RoHS &

no Sb/Br)

TMP300AIDCKT ACTIVE SC70 DCK 6 250 Green (RoHS &

no Sb/Br)

TMP300AIDCKTG4 ACTIVE SC70 DCK 6 250 Green (RoHS &

no Sb/Br)

(1)

The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in

a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.

(2)

Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check

http://www.ti.com/productcontent for the latest availability information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements

for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

(2)

Lead/Ball Finish MSL Peak Temp

CU NIPDAU Level-1-260C-UNLIM

CU NIPDAU Level-1-260C-UNLIM

CU NIPDAU Level-1-260C-UNLIM

CU NIPDAU Level-1-260C-UNLIM

(3)

(3)

MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder

temperature.

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In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
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Addendum-Page 1

PACKAGE MATERIALS INFORMATION

www.ti.com

TAPE AND REEL BOX INFORMATION

27-Sep-2007

Device Package Pins Site Reel

Diameter

(mm)

TMP300AIDCKR DCK 6 SITE 48 179 8 2.25 2.4 1.22 4 8 Q3
TMP300AIDCKT DCK 6 SITE 48 179 8 2.25 2.4 1.22 4 8 Q3

Reel

Width

(mm)

A0 (mm) B0 (mm) K0 (mm) P1

(mm)W(mm)

Pin1

Quadrant

Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION

www.ti.com

27-Sep-2007

Device Package Pins Site Length (mm) Width (mm) Height (mm)

TMP300AIDCKR DCK 6 SITE 48 0.0 0.0 0.0

TMP300AIDCKT DCK 6 SITE 48 0.0 0.0 0.0

Pack Materials-Page 2

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