This user's guide describes the characteristics, operation, and use of the TMP103EVM evaluation board. It
provides a detailed description of the hardware design. It discusses how to set up and configure the
evaluation module (EVM) software, and reviews the hardware and various aspects of the software
operation. This document also includes information regarding operating procedures and input/output
connections, an electrical schematic, printed-circuit board (PCB) layout drawings, and a parts list for the
TMP103EVM. Throughout this document, the terms evaluation board, evaluation module, and EVM are
synonymous with the TMP103EVM.
Microsoft, Windows are registered trademarks of Microsoft Corporation.
I2C is a trademark of NXP Semiconductors.
All other trademarks are the property of their respective owners.
1Overview
The TMP103 is a digital output temperature sensor capable of reading temperatures to 1°C resolution.
The TMP103 uses a two-wire I2C™ and SMBus interface that supports global commands. These global
commands allow the user to communicate with up to eight TMP103 devices on the bus without having to
send individual addresses. The TMP103 is ideal for environments with constrained space or powersensitive applications. The TMP103 is also specified to operate between –40°C and +125°C.
1.1TMP103EVM Kit Contents
Figure 1 illustrates the typical hardware included the TMP103EVM. Table 1 details the contents of the
TMP103EVM kit, Contact the Texas Instruments Product Information Center (PIC) nearest you if any
component is missing. TI highly recommends that you check the TI web site at http://www.ti.com to verify
that you have the latest versions of the related software.
www.ti.com
Figure 1. Typical Hardware Included With the TMP103EVM Kit
If you have questions about the TMP103EVM, contact the Temperature Sensing Applications Team by
posting on E2E forum here: https://e2e.ti.com/support/sensor/temperature_sensors/.
1.3Related Documentation
The following documents provide information regarding Texas Instruments integrated circuits used in the
assembly of the TMP103EVM. This user's guide is available from the TI web site under literature number
SBOU099. Any letter appended to the literature number corresponds to the document revision that is
current at the time of the writing of this document. Newer revisions may be available from the TI web site
at http://www.ti.com, or call the Texas Instruments Literature Response Center at (800) 477-8924 or the
Product Information Center at (972) 644-5580. When ordering, identify the document by both title and
literature number.
TMP103 Product Data SheetSBOS545
SM-USB-DIG Platform User’s
1.4FCC Warning
This equipment is intended for use in a laboratory test environment only. It generates, uses, and can
radiate radio frequency energy and has not been tested for compliance with the limits of computing
devices pursuant to subpart J of part 15 of FCC rules, which are designed to provide reasonable
protection against radio frequency interference. Operation of this equipment in other environments may
cause interference with radio communications, in which case the user is required to take whatever
measures may be required to correct this interference at their own expense.
Table 2. Related Documentation
DocumentLiterature Number
Guide
SBOU098
Overview
2System Setup
The TMP103EVM hardware consists of the SM-USB-DIG Platform and the TMP103EVM; these units are
easily connected through a 10-pin, board-to-board connector that should be attached to the SM-USB-DIG
and TMP103EVM PCBs. Once these two boards are connected, simply plug the USB device from the SMDIG into the computer as shown in Figure 2.
The TMP103EVM is very modest in its design, and only requires the two-wire I2C lines (SDA and SCLK)
and V
has several test points to monitor these signal lines, and ground, in case users may want to use their own
signals or verify I2C communications.
/GND to supply a constant 3.3 V and power return, as shown in Figure 3. The TMP103EVM also
DUT
www.ti.com
Figure 3. TMP103 Test Board Block Diagram
3.1Signal Definitions of H1 (10-Pin Male Connector Socket)
Table 3 shows the pinout for the 10-pin connector socket used to communicate between the TMP103EVM
and the SM-USB-DIG. It should be noted that the TMP103EVM only uses the necessary I2C
communication lines (Pins 1 and 3) and the V
TMP103 sensors.
Table 3. Pin Connector
Pin on U1SignalDescription
1I2C_SCLI2C clock signal (SCL)
2CTRL/MEAS4
3I2C_SDA1I2C data signal (SDA)
4CTRL/MEAS5
5SPI_DOUT1SPI data output (MOSI)
6V
7SPI_CLKSPI clock signal (SCLK)
(1)
When V
8GNDPower return (GND)
9SPI_CS1SPI chip select Signal (CS)
10SPI_DIN1SPI data input (MISO)
is Hi-Z, all digital I/Os are Hi-Z as well.
DUT
and GND (Pins 6 and 8) pins to issue commands to the
3.2Theory of Operation for the SM-USB-DIG Platform
Figure 4 shows the block diagram for the SM-USB-DIG Platform. This platform is a general-purpose data
acquisition system that is used on several different Texas Instruments' evaluation modules. The details of
its operation are included in a separate document, the SM-USB-DIG Platform User's Guide (SBOU098),
available for download at www.ti.com). The block diagram in Figure 4 is presented as a brief overview of
the Platform.
The core of the SM-USB-DIG Platform is the TUSB3210, an 8052 microcontroller (μC) that has a built-in
USB interface. The microcontroller receives information from the host computer that it translates into I2C,
SPI, or other digital I/O patterns. During the digital I/O transaction, the microcontroller reads the response
of any device connected to the I/O interface. The response from the device is then sent back to the PC
where it is interpreted by the host computer.
Theory of Operation
Figure 4. SM-USB-DIG Platform Block Diagram
4TMP103EVM Hardware Overview
4.1Electrostatic Discharge Warning
Many of the components on the TMP103EVM are susceptible to damage by
4.2Connecting the Hardware
handling precautions when unpacking and handling the EVM, including the use
of a grounded wrist strap at an approved ESD workstation.
To connect the TMP103 Test Board and the SM-USB-DIG Platform together, gently slide the male and
female ends of the 10-pin connectors together. Make sure that the two connectors are completely pushed
together; loose connections may cause intermittent operation.
electrostatic discharge (ESD). Customers are advised to observe proper ESD
4.3Connecting the USB Cable to the SM-USB-DIG Platform
Figure 5 depicts the USB cable connected to the SM-USB-DIG Platform. Be careful when inserting the
connectors.
www.ti.com
Figure 5. Connecting the USB Cable to the SM-USB-DIG Platform
Figure 6 shows the typical system response when the SM-USB-DIG Platform board connects to a PC
USB port for the first time. Typically, the computer will respond with a Found New Hardware, USB Device
pop-up dialog. The pop-up window then generally changes to Found New Hardware, USB HumanInterface Device. This pop-up screen indicates that the device is ready to be used. The SM-USB-DIG
Platform uses the human interface device drivers that are part of the Microsoft®Windows®operating
system.
This section describes some of the hardware features present on the TMP103 test board.
4.4.1Populating 0-Ω Resistors
The TMP103 test board contains 0-Ω resistors (R1 to R16) that connect the individual TMP103 sensors to
the I2C bus lines. When these resistors are populated, they become available for communication in
general calls. If the 0-Ω resistors are not populated for certain TMP103 devices on the board, they are not
able to communicate with the software or receive any external I2C commands. Leaving the resistors
unpopulated could be useful if one of the TMP103 units becomes damaged or fewer than eight TMP103s
are populated.
4.4.2Multiple TMP103 Sensors
The TMP103EVM board was designed to take advantage of the I2C general call described in the TMP103
product data sheet. This feature allows the software to communicate with all the TMP103s simultaneously
without requiring individual commands with separate pointer addresses to the sensors. The maximum
number of sensors on the TMP103 test board is eight; all devices have separate hardware address, so a
board of eight populated TMP103 devices requires eight different part types. For assignment of the pointer
addresses and a more detailed description, consult the TMP103 Low-Power, Digital Temperature Sensor
With Two-Wire Interface in WCSP data sheet (SBOS545).
4.4.3I2C Test Points
I2C test points are included on the TMP103 test board for user convenience. These test points can be
used to monitor the two-wire lines of the I2C interface or to run the TMP103 test board externally without
the use of the SM-USB-DIG.
TMP103EVM Hardware Overview
4.4.4Optional 10-Pin Connector Ribbon Extender
The TMP103EVM kit ships with an optional ribbon cable to extend the connection between the SM-USBDIG and the TMP103EVM PCB. This cable can be useful if high temperature tests must be run on the test
board, because the SM-USB-DIG platform is not rated for high temperatures. To connect the ribbon cable,
attach the cable to the EVM and SM-USB-DIG Platform board as shown in Figure 7.
This section discusses how to install the TMP103EVM software.
5.1Operating Systems Compatibility
The TMP103EVM software has been tested on the Microsoft Windows 7. The software should also
function on other Windows operating systems such as Windows 10.
5.2TMP103EVM Software Installation
The EVM software is tested on the Microsoft Windows 7 and 10 operating system (OS). The software also
functions on other Windows operating systems. The EVM software is available through the EVM product
folder on the TI website. To download the software to your system, simply follows the instructions below.
1. Go to the TMP103EVM web page on the TI website: http://www.ti.com/tool/TMP103EVM. Scroll down
to the Software section and download the latest evaluation software.
2. Unzip the downloaded file into a known directory. Once the files are extracted, navigate and run the
Setup_TMP103EVM_GUI.exe file located in [Unzip location]. The EVM software installer then begins
the installation process as shown in Figure 8.
3. Follow the on-screen instructions by clicking the Next button to install the software. Following this
TMP103EVM Software Setup
option, two license agreements are presented as shown in Figure 9 and Figure 10 that must be
accepted. After accepting both the Texas Instruments and National Instruments license agreements,
the user is given the choice of selecting the directory to install the program; usually, TI recommends
choosing the default setting stored in the C:\Program Files\TMP103EVM path as shown in Figure 11.