Low Power Consumption: 90 mW Typ
Using External References
D
Wide Analog Input Bandwidth: 600 MHz Typ
D
3.3-V Single-Supply Operation
D
3.3-V TTL/CMOS-Compatible Digital I/O
D
Internal Bottom and Top Reference
Voltages
D
Adjustable Reference Input Range
D
Power-Down (Standby) Mode
D
Separate Power Down for Internal Voltage
References
D
Three-State Outputs
D
28-Pin Thin Shrink SOP (TSSOP) Packages
D
Applications
– Digital Communications (IF Sampling)
– High-Speed DSP Front-End
(TMS320C6000)
– Medical Imaging
– Video Processing (Scan Rate/Format
Conversion)
– DVD Read Channel Digitization
description
DRV
DRV
DV
DV
PW PACKAGE
(TOP VIEW)
DD
D0
D1
D2
D3
D4
D5
D6
D7
SS
SS
CLK
OE
DD
1
2
3
4
5
6
7
8
9
10
11
12
13
14
AV
28
AV
27
AIN
26
CML
25
PWDN_REF
24
AV
23
REFBO
22
REFBI
21
REFTI
20
REFTO
19
AV
18
BG
17
AV
16
15
STBY
SS
DD
SS
SS
DD
The TLV5535 is an 8-bit, 35 MSPS, high-speed A/D converter. It converts the analog input signal into 8-bit
binary-coded digital words up to a sampling rate of 35 MHz. All digital inputs and outputs are 3.3 V
TTL/CMOS-compatible.
The device consumes very little power due to the 3.3-V supply and an innovative single-pipeline architecture
implemented in a CMOS process. The user obtains maximum flexibility by setting both bottom and top voltage
references from user-supplied voltages. If no external references are available, on-chip references are
available for internal and external use. The full-scale range is 1 V
up to 1.6 Vpp, depending on the analog
pp
supply voltage. If external references are available, the internal references can be disabled independently from
the rest of the chip, resulting in an even greater power saving.
While usable in a wide variety of applications, the device is specifically suited for the digitizing of high-speed
graphics and for interfacing to LCD panels or LCD/DMD projection modules . Other applications include DVD
read channel digitization, medical imaging, and communications. This device is suitable for IF sampling of
communication systems using sub-Nyquist sampling methods because of its high analog input bandwidth.
AVAILABLE OPTIONS
A
–40°C to 85°CTLV5535IPW
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PACKAGED DEVICES
TSSOP-28
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
The single-pipeline architecture uses 6 ADC/DAC stages and one final flash ADC. Each stage produces a
resolution of 2 bits. The correction logic generates its result using the 2-bit result from the first stage, 1 bit from
each of the 5 succeeding stages, and 1 bit from the final stage in order to arrive at an 8-bit result. The correction
logic ensures no missing codes over the full operating temperature range.
BG17OBand gap reference voltage. A 1-µF capacitor (with an optional 0.1-µF capacitor in parallel) should be
CLK12IClock input. The input is sampled on each rising edge of CLK.
CML25OCommon mode level. This voltage is equal to (A VDD – AVSS) ÷ 2. An external 0.1-µF capacitor should be
D0 – D72 – 9OData outputs. D7 is the MSB.
DRV
DD
DRV
SS
DV
DD
OE13IOutput enable. When high, the D0 – D7 outputs go in high-impedance mode.
DV
SS
PWDN_REF24IPower down for internal reference voltages. A high on this terminal disables the internal reference circuit.
REFBI21IReference voltage bottom input. The voltage at this terminal defines the bottom reference voltage for the
REFBO22OReference voltage bottom output. An internally generated reference is available at this terminal. It can be
REFTI20IReference voltage top input. The voltage at this terminal defines the top reference voltage for the ADC.
REFTO19OReference voltage top output. An internally generated reference is available at this terminal. It can be
STBY15IStandby input. A high level on this input enables power-down mode.
16, 27IAnalog supply voltage
18, 23, 28IAnalog ground
connected between this terminal and A VSS for external filtering.
connected between this terminal and A VSS.
1ISupply voltage for digital output drivers
10IGround for digital output drivers
14IDigital supply voltage
11IDigital ground
ADC. It can be connected to REFBO or to an externally generated reference level. Sufficient filtering
should be applied to this input. The use of a 0.1-µF capacitor connected between REFBI and AVSS is
recommended. Additionaly, a 0.1-µF capacitor can be connected between REFTI and REFBI.
connected to REFBI or left unconnected. A 1-µF capacitor between REFBO and A VSS provides sufficient
decoupling required for this output.
It can be connected to REFTO or to an externally generated reference level. Sufficient filtering should be
applied to this input. The use of a 0.1-µF capacitor between REFTI and AVSS is recommended.
Additionaly, a 0.1-µF capacitor can be connected between REFTI and REFBI.
connected to REFTI or left unconnected. A 1-µF capacitor between REFTO and A VSS provides sufficient
decoupling required for this output.
absolute maximum ratings over operating free-air temperature (unless otherwise noted)
†
Supply voltage range:AVDD to AVSS, DVDD to DVSS –0.5 V to 4.5 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
AVDD to DVDD, AVSS to DVSS –0.5 V to 0.5 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Digital input voltage range to DVSS –0.5 V to DVDD + 0.5 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Analog input voltage range to AVSS –0.5 V to AVDD + 0.5 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Digital output voltage range applied from external source to DGND –0.5 V to DV
Reference voltage input range to AGND: V
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
recommended operating conditions over operating free-temperature range
power supply
Supply voltage
analog and reference inputs
Reference input voltage (top), V
Reference input voltage (bottom), V
Reference voltage differential, V
Analog input voltage, V
(AIN)
(REFTI)
(REFTI)
digital inputs
High-level input voltage, V
Low-level input voltage, V
Clock period, t
Pulse duration, clock high, t
Pulse duration, clock low, t
c
IH
IL
w(CLKH)
w(CLKL)
(REFBI)
– V
AVDD – AV
DVDD – DV
DRVDD – DRV
(REFBI)
SS
SS
SS
MINNOMMAXUNIT
(NOM) – 0.2 2 + (AVDD – 3)(NOM) + 0.2V
0.811.2V
V
(REFBI)
MINNOMMAXUNIT
2.0DV
DGND0.2xDV
28.6ns
13ns
13ns
MINNOMMAXUNIT
33.33.6V
1 + (AVDD – 3)V
V
(REFTI)
DD
DD
V
V
V
electrical characteristics over recommended operating conditions, f
= 35 MSPS, external
CLK
voltage references (unless otherwise noted)
power supply
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
AV
I
DD
P
D(STBY)
DD
Operating supply current
p
Standby powerSTBY = H, CLK held high or low1115
DV
DRV
DD
DD
AVDD = DVDD = 3.3 V, DRVDD = 3 V,
= 15 F,
PWDN_REF = L106139
PWDN_REF = H90113
= 1
p
, –1-dB
–
-
digital logic inputs
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
I
High-level input current on CLK
IH
Low-level input current on digital inputs
I
IL
(OE
, STDBY, PWDN_REF, CLK)
CIInput capacitance5pF
†
IIH leakage current on other digital inputs (OE, STDBY , PWDN_REF) is not measured since these inputs have an internal pull-down resistor of
4 KΩ to DGND.
electrical characteristics over recommended operating conditions, f
= 35 MSPS, external
CLK
voltage references (unless otherwise noted) (continued)
logic outputs
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
V
High-level output voltage
OH
V
Low-level output voltage
OL
C
Output capacitance5pF
O
High-impedance state output current to
I
OZH
high level
High-impedance state output current to
I
OZL
low level
dc accuracy
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
Differential nonlinearity (DNL)Internal references (see Note 2),TA = –40°C to 85°C–1±0.61.3LSB
Zero error
Full-scale error
NOTES: 1. Integral nonlinearity refers to the deviation of each individual code from a line drawn from zero to full scale. The point used as zero
occurs 1/2 LSB before the first code transition. The full-scale point is defined as a level 1/2 LSB beyond the last code transition. The
deviation is measured from the center of each particular code to the true straight line between these two endpoints.
2. An ideal ADC exhibits code transitions that are exactly 1 LSB apart. DNL is the deviation from this ideal value. Therefore this measure
indicates how uniform the transfer function step sizes are. The ideal step size is defined here as the step size for the device under
test [i.e., (last transition level – first transition level) ÷ (2n – 2)]. Using this definition for DNL separates the effects of gain and offset
error. A minimum DNL better than –1 LSB ensures no missing codes.
3. Zero error is defined as the difference in analog input voltage – between the ideal voltage and the actual voltage – that switches
the ADC output from code 0 to code 1. The ideal voltage level is determined by adding the voltage corresponding to 1/2 LSB to the
bottom reference level. The voltage corresponding to 1 LSB is found from the difference of top and bottom references divided by
the number of ADC output levels (256).
Full-scale error is defined as the difference in analog input voltage – between the ideal voltage and the actual voltage – that switches
the ADC output from code 254 to code 255. The ideal voltage level is determined by subtracting the voltage corresponding to 1.5
LSB from the top reference level. The voltage corresponding to 1 LSB is found from the difference of top and bottom references
divided by the number of ADC output levels (256).
AVDD = DVDD = DRVDD = 3 V at IOH = 50 µA,
Digital output forced high
AVDD = DVDD = DRVDD = 3.6 V at IOL = 50 µA,
Digital output forced low
electrical characteristics over recommended operating conditions, f
= 35 MSPS, external
CLK
voltage references (unless otherwise noted) (continued)
reference input (AVDD = DVDD = DRVDD = 3.6 V)
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
R
Reference input resistance400Ω
ref
I
Reference input current2.5mA
ref
reference outputs
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
V
(REFTO)
V
(REFBO)
dynamic performance
Effective number of bits (ENOB)
Signal-to-noise ratio + distortion (SNRD)
Total harmonic distortion (THD)
Spurious free dynamic range (SFDR)
Analog input full-power bandwidth, BWSee Note 4600MHz
†
Based on analog input voltage of – 1-dB FS referenced to a 1.3 Vpp full-scale input range and using the external voltage references at
f
= 35 MSPS with AVDD = DVDD = 3.3 V and DRVDD = 3 V at 25°C.
CLK
NOTE 4: The analog input bandwidth is defined as the maximum frequency of a –1-dB FS input sine that can be applied to the device for which
Reference top offset voltage
Reference bottom offset voltage
Absolute min/max values valid
and tested for AVDD = 3.3 V
†
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
fin = 1 MHz6.67.4
fin = 4.2 MHz6.67.4
fin = 15 MHz7
fin = 1 MHz41.546
fin = 4.2 MHz41.546
fin = 15 MHz43
fin = 1 MHz–46–55
fin = 4.2 MHz–45.5–54
fin = 15 MHz–50
fin = 1 MHz4858
fin = 4.2 MHz4858
fin = 15 MHz52
p
an extra 3-dB attenuation is observed in the reconstructed output signal.
electrical characteristics over recommended operating conditions, f
voltage references (unless otherwise noted) (continued)
timing requirements
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
CLK
t
d(o)
t
h(o)
t
d(pipe)
t
d(a)
t
j(a)
t
dis
t
en
NOTES: 5. Output timing t
Maximum conversion rate35MHz
Minimum conversion rate10kHz
Output delay time (see Figure 1)CL = 10 pF,See Notes 5 and 69ns
Output hold timeCL = 2 pF,See Note 52ns
Pipeline delay time (latency)See Note 64.54.54.5
Aperture delay time3ns
Aperture jitter
Disable time, OE rising to Hi-Z
Enable time, OE falling to valid data58ns
is measured from the 1.5 V level of the CLK input falling edge to the 10%/90% level of the digital output. The digital
output load is not higher than 10 pF.
Output hold time t
digital output is load is not less than 2 pF.
Aperture delay t
The OE signal is asynchronous.
OE timing t
not higher than 10 pF.
OE timing ten is measured from the V
levels. The digital output load is not higher than 10 pF.
6. The number of clock cycles between conversion initiation on an input sample and the corresponding output data being made
available from the ADC pipeline. Once the data pipeline is full, new valid output data is provided on every clock cycle. In order to
know when data is stable on the output pins, the output delay time t
to be added to the pipeline latency. Note that since the max t
clocked in on a rising edge of CLK at this speed. The falling edge should be used.
d(o)
is measured from the 1.5 V level of the CLK input falling edge to the 10%/90% level of the digital output. The
h(o)
is measured from the 1.5 V level of the CLK input to the actual sampling instant.
d(A)
is measured from the V
dis
level of OE to the high-impedance state of the output data. The digital output load is
IH(MIN)
level of OE to the instant when the output data reaches V
IL(MAX)
(i.e., the delay time through the digital output buffers) needs
d(o)
is more than 1/2 clock period at 35 MHz, data cannot be reliably