TEXAS INSTRUMENTS TLV5535 Technical data

T
TLV5535
8-BIT, 35 MSPS, LOW -POWER ANALOG-TO-DIGITAL CONVERTER
SLAS221 – JUNE 1999
D
8-Bit Resolution, 35 MSPS Sampling Analog-to-Digital Converter (ADC)
D
Low Power Consumption: 90 mW Typ Using External References
D
Wide Analog Input Bandwidth: 600 MHz Typ
D
3.3-V Single-Supply Operation
D
3.3-V TTL/CMOS-Compatible Digital I/O
D
Internal Bottom and Top Reference Voltages
D
Adjustable Reference Input Range
D
Power-Down (Standby) Mode
D
Separate Power Down for Internal Voltage References
D
Three-State Outputs
D
28-Pin Thin Shrink SOP (TSSOP) Packages
D
Applications – Digital Communications (IF Sampling) – High-Speed DSP Front-End
(TMS320C6000) – Medical Imaging – Video Processing (Scan Rate/Format
Conversion) – DVD Read Channel Digitization
description
DRV
DRV
DV
DV
PW PACKAGE
(TOP VIEW)
DD
D0 D1 D2 D3 D4 D5 D6 D7
SS SS
CLK
OE
DD
1 2 3 4 5 6 7 8 9 10 11 12 13 14
AV
28
AV
27
AIN
26
CML
25
PWDN_REF
24
AV
23
REFBO
22
REFBI
21
REFTI
20
REFTO
19
AV
18
BG
17
AV
16 15
STBY
SS DD
SS
SS
DD
The TLV5535 is an 8-bit, 35 MSPS, high-speed A/D converter. It converts the analog input signal into 8-bit binary-coded digital words up to a sampling rate of 35 MHz. All digital inputs and outputs are 3.3 V TTL/CMOS-compatible.
The device consumes very little power due to the 3.3-V supply and an innovative single-pipeline architecture implemented in a CMOS process. The user obtains maximum flexibility by setting both bottom and top voltage references from user-supplied voltages. If no external references are available, on-chip references are available for internal and external use. The full-scale range is 1 V
up to 1.6 Vpp, depending on the analog
pp
supply voltage. If external references are available, the internal references can be disabled independently from the rest of the chip, resulting in an even greater power saving.
While usable in a wide variety of applications, the device is specifically suited for the digitizing of high-speed graphics and for interfacing to LCD panels or LCD/DMD projection modules . Other applications include DVD read channel digitization, medical imaging, and communications. This device is suitable for IF sampling of communication systems using sub-Nyquist sampling methods because of its high analog input bandwidth.
AVAILABLE OPTIONS
A
–40°C to 85°C TLV5535IPW
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PACKAGED DEVICES
TSSOP-28
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
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Copyright 1999, Texas Instruments Incorporated
1
TLV5535 8-BIT, 35 MSPS, LOW -POWER ANALOG-TO-DIGITAL CONVERTER
SLAS221 – JUNE 1999
functional block diagram
SHA
+
SHA SHA SHA SHA SHA
DACADC
2222 2
Correction Logic
Output Buffers
D0(LSB)–D7(MSB)
2
ADC
The single-pipeline architecture uses 6 ADC/DAC stages and one final flash ADC. Each stage produces a resolution of 2 bits. The correction logic generates its result using the 2-bit result from the first stage, 1 bit from each of the 5 succeeding stages, and 1 bit from the final stage in order to arrive at an 8-bit result. The correction logic ensures no missing codes over the full operating temperature range.
circuit diagrams of inputs and outputs
ALL DIGITAL INPUT CIRCUITS AIN INPUT CIRCUIT
DV
DD
AV
DD
2
REFERENCE INPUT CIRCUIT D0–D7 OUTPUT CIRCUIT
AV
DD
Internal Reference Generator
AV
REFBI
or
REFTI
DD
REFTO or REFBO
D
OE
0.5 pF
DRV
DRV
DD
D_Out
SS
2
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
I/O
DESCRIPTION
TLV5535
8-BIT, 35 MSPS, LOW -POWER ANALOG-TO-DIGITAL CONVERTER
SLAS221 – JUNE 1999
Terminal Functions
TERMINAL
NAME NO.
AIN 26 I Analog input AV
DD
AV
SS
BG 17 O Band gap reference voltage. A 1-µF capacitor (with an optional 0.1-µF capacitor in parallel) should be
CLK 12 I Clock input. The input is sampled on each rising edge of CLK. CML 25 O Common mode level. This voltage is equal to (A VDD – AVSS) ÷ 2. An external 0.1-µF capacitor should be
D0 – D7 2 – 9 O Data outputs. D7 is the MSB. DRV
DD
DRV
SS
DV
DD
OE 13 I Output enable. When high, the D0 – D7 outputs go in high-impedance mode. DV
SS
PWDN_REF 24 I Power down for internal reference voltages. A high on this terminal disables the internal reference circuit. REFBI 21 I Reference voltage bottom input. The voltage at this terminal defines the bottom reference voltage for the
REFBO 22 O Reference voltage bottom output. An internally generated reference is available at this terminal. It can be
REFTI 20 I Reference voltage top input. The voltage at this terminal defines the top reference voltage for the ADC.
REFTO 19 O Reference voltage top output. An internally generated reference is available at this terminal. It can be
STBY 15 I Standby input. A high level on this input enables power-down mode.
16, 27 I Analog supply voltage
18, 23, 28 I Analog ground
connected between this terminal and A VSS for external filtering.
connected between this terminal and A VSS.
1 I Supply voltage for digital output drivers 10 I Ground for digital output drivers 14 I Digital supply voltage
11 I Digital ground
ADC. It can be connected to REFBO or to an externally generated reference level. Sufficient filtering should be applied to this input. The use of a 0.1-µF capacitor connected between REFBI and AVSS is recommended. Additionaly, a 0.1-µF capacitor can be connected between REFTI and REFBI.
connected to REFBI or left unconnected. A 1-µF capacitor between REFBO and A VSS provides sufficient decoupling required for this output.
It can be connected to REFTO or to an externally generated reference level. Sufficient filtering should be applied to this input. The use of a 0.1-µF capacitor between REFTI and AVSS is recommended. Additionaly, a 0.1-µF capacitor can be connected between REFTI and REFBI.
connected to REFTI or left unconnected. A 1-µF capacitor between REFTO and A VSS provides sufficient decoupling required for this output.
absolute maximum ratings over operating free-air temperature (unless otherwise noted)
Supply voltage range:AVDD to AVSS, DVDD to DVSS –0.5 V to 4.5 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
AVDD to DVDD, AVSS to DVSS –0.5 V to 0.5 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Digital input voltage range to DVSS –0.5 V to DVDD + 0.5 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Analog input voltage range to AVSS –0.5 V to AVDD + 0.5 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Digital output voltage range applied from external source to DGND –0.5 V to DV Reference voltage input range to AGND: V
(REFTI)
, V
(REFTO)
, V
(REFBI)
, V
(REFBO)
–0.5 V to AVDD + 0.5 V
DD
+ 0.5 V. . . . . . . . . . . . . .
Operating free-air temperature range, TA: TLV5535I –40°C to 85°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, T
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
–55°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
stg
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3
TLV5535
C
L
V
I
MHz
FS
PDPower dissipation
8-BIT, 35 MSPS, LOW -POWER ANALOG-TO-DIGITAL CONVERTER
SLAS221 – JUNE 1999
recommended operating conditions over operating free-temperature range
power supply
Supply voltage
analog and reference inputs
Reference input voltage (top), V Reference input voltage (bottom), V Reference voltage differential, V Analog input voltage, V
(AIN)
(REFTI)
(REFTI)
digital inputs
High-level input voltage, V Low-level input voltage, V Clock period, t Pulse duration, clock high, t
Pulse duration, clock low, t
c
IH
IL
w(CLKH)
w(CLKL)
(REFBI)
– V
AVDD – AV DVDD – DV DRVDD – DRV
(REFBI)
SS
SS
SS
MIN NOM MAX UNIT
(NOM) – 0.2 2 + (AVDD – 3) (NOM) + 0.2 V
0.8 1 1.2 V
V
(REFBI)
MIN NOM MAX UNIT
2.0 DV
DGND 0.2xDV
28.6 ns 13 ns
13 ns
MIN NOM MAX UNIT
3 3.3 3.6 V
1 + (AVDD – 3) V
V
(REFTI)
DD
DD
V
V V
electrical characteristics over recommended operating conditions, f
= 35 MSPS, external
CLK
voltage references (unless otherwise noted)
power supply
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
AV
I
DD
P
D(STBY)
DD
Operating supply current
p
Standby power STBY = H, CLK held high or low 11 15
DV DRV
DD
DD
AVDD = DVDD = 3.3 V, DRVDD = 3 V,
= 15 F,
PWDN_REF = L 106 139 PWDN_REF = H 90 113
= 1
p
, –1-dB
-
digital logic inputs
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
I
High-level input current on CLK
IH
Low-level input current on digital inputs
I
IL
(OE
, STDBY, PWDN_REF, CLK)
CIInput capacitance 5 pF
IIH leakage current on other digital inputs (OE, STDBY , PWDN_REF) is not measured since these inputs have an internal pull-down resistor of 4 K to DGND.
AVDD = DVDD = DRVDD = CLK = 3.6 V 10 µA AVDD = DVDD = DRVDD = 3.6 V,
Digital inputs at 0 V
27 34
1.5 2.6 4 6
10 µA
mA
mW
4
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AV
DD
DV
DD
DRV
DD
V
Integral nonlinearity (INL), best-fit
Internal references (see Note 1)
DD DD DD
TLV5535
8-BIT, 35 MSPS, LOW -POWER ANALOG-TO-DIGITAL CONVERTER
SLAS221 – JUNE 1999
electrical characteristics over recommended operating conditions, f
= 35 MSPS, external
CLK
voltage references (unless otherwise noted) (continued)
logic outputs
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
V
High-level output voltage
OH
V
Low-level output voltage
OL
C
Output capacitance 5 pF
O
High-impedance state output current to
I
OZH
high level High-impedance state output current to
I
OZL
low level
dc accuracy
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Differential nonlinearity (DNL) Internal references (see Note 2), TA = –40°C to 85°C –1 ±0.6 1.3 LSB Zero error Full-scale error
NOTES: 1. Integral nonlinearity refers to the deviation of each individual code from a line drawn from zero to full scale. The point used as zero
occurs 1/2 LSB before the first code transition. The full-scale point is defined as a level 1/2 LSB beyond the last code transition. The
deviation is measured from the center of each particular code to the true straight line between these two endpoints.
2. An ideal ADC exhibits code transitions that are exactly 1 LSB apart. DNL is the deviation from this ideal value. Therefore this measure indicates how uniform the transfer function step sizes are. The ideal step size is defined here as the step size for the device under test [i.e., (last transition level – first transition level) ÷ (2n – 2)]. Using this definition for DNL separates the effects of gain and offset error. A minimum DNL better than –1 LSB ensures no missing codes.
3. Zero error is defined as the difference in analog input voltage – between the ideal voltage and the actual voltage – that switches the ADC output from code 0 to code 1. The ideal voltage level is determined by adding the voltage corresponding to 1/2 LSB to the bottom reference level. The voltage corresponding to 1 LSB is found from the difference of top and bottom references divided by the number of ADC output levels (256).
Full-scale error is defined as the difference in analog input voltage – between the ideal voltage and the actual voltage – that switches the ADC output from code 254 to code 255. The ideal voltage level is determined by subtracting the voltage corresponding to 1.5 LSB from the top reference level. The voltage corresponding to 1 LSB is found from the difference of top and bottom references divided by the number of ADC output levels (256).
AVDD = DVDD = DRVDD = 3 V at IOH = 50 µA, Digital output forced high
AVDD = DVDD = DRVDD = 3.6 V at IOL = 50 µA, Digital output forced low
=
AVDD = DVDD = 3.3 V, DRVDD = 3 V, Internal references (see Note 3)
=
= 3.6
TA = 25°C –1.5 ±0.7 1.5 LSB TA = –40°C to 85°C –2.4 ±0.7 2.4 LSB
2.8 V
0.1 V
10 µA
10 µA
5 %FS 5 %FS
analog input
C
Input capacitance 4 pF
I
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
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5
TLV5535
Differential phase, DP
0.6
CLK in
Differential gain, DG
20 IRE am litude vs full scale of 140 IRE
0.2%
8-BIT, 35 MSPS, LOW -POWER ANALOG-TO-DIGITAL CONVERTER
SLAS221 – JUNE 1999
electrical characteristics over recommended operating conditions, f
= 35 MSPS, external
CLK
voltage references (unless otherwise noted) (continued)
reference input (AVDD = DVDD = DRVDD = 3.6 V)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
R
Reference input resistance 400
ref
I
Reference input current 2.5 mA
ref
reference outputs
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
V
(REFTO)
V
(REFBO)
dynamic performance
Effective number of bits (ENOB)
Signal-to-noise ratio + distortion (SNRD)
Total harmonic distortion (THD)
Spurious free dynamic range (SFDR)
Analog input full-power bandwidth, BW See Note 4 600 MHz
Based on analog input voltage of – 1-dB FS referenced to a 1.3 Vpp full-scale input range and using the external voltage references at f
= 35 MSPS with AVDD = DVDD = 3.3 V and DRVDD = 3 V at 25°C.
CLK
NOTE 4: The analog input bandwidth is defined as the maximum frequency of a –1-dB FS input sine that can be applied to the device for which
Reference top offset voltage Reference bottom offset voltage
Absolute min/max values valid and tested for AVDD = 3.3 V
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
fin = 1 MHz 6.6 7.4 fin = 4.2 MHz 6.6 7.4 fin = 15 MHz 7 fin = 1 MHz 41.5 46 fin = 4.2 MHz 41.5 46 fin = 15 MHz 43 fin = 1 MHz –46 –55 fin = 4.2 MHz –45.5 –54 fin = 15 MHz –50 fin = 1 MHz 48 58 fin = 4.2 MHz 48 58 fin = 15 MHz 52
p
an extra 3-dB attenuation is observed in the reconstructed output signal.
f
= 35 MHz, fin = 4.2 MHz,
CLK
20 IRE amplitude vs full-scale of 140 IRE
2.07 2 + [(AVDD – 3) ÷ 2] 2.21 V
1.09 1 + [(AVDD – 3) ÷ 2] 1.21 V
Bits
dB
dB
dB
6
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f
See Note 5
TLV5535
8-BIT, 35 MSPS, LOW -POWER ANALOG-TO-DIGITAL CONVERTER
SLAS221 – JUNE 1999
electrical characteristics over recommended operating conditions, f voltage references (unless otherwise noted) (continued)
timing requirements
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
CLK
t
d(o)
t
h(o)
t
d(pipe)
t
d(a)
t
j(a)
t
dis
t
en
NOTES: 5. Output timing t
Maximum conversion rate 35 MHz Minimum conversion rate 10 kHz Output delay time (see Figure 1) CL = 10 pF, See Notes 5 and 6 9 ns Output hold time CL = 2 pF, See Note 5 2 ns
Pipeline delay time (latency) See Note 6 4.5 4.5 4.5 Aperture delay time 3 ns
Aperture jitter Disable time, OE rising to Hi-Z Enable time, OE falling to valid data 5 8 ns
is measured from the 1.5 V level of the CLK input falling edge to the 10%/90% level of the digital output. The digital
output load is not higher than 10 pF. Output hold time t
digital output is load is not less than 2 pF. Aperture delay t The OE signal is asynchronous. OE timing t
not higher than 10 pF. OE timing ten is measured from the V
levels. The digital output load is not higher than 10 pF.
6. The number of clock cycles between conversion initiation on an input sample and the corresponding output data being made available from the ADC pipeline. Once the data pipeline is full, new valid output data is provided on every clock cycle. In order to know when data is stable on the output pins, the output delay time t to be added to the pipeline latency. Note that since the max t clocked in on a rising edge of CLK at this speed. The falling edge should be used.
d(o)
is measured from the 1.5 V level of the CLK input falling edge to the 10%/90% level of the digital output. The
h(o)
is measured from the 1.5 V level of the CLK input to the actual sampling instant.
d(A)
is measured from the V
dis
level of OE to the high-impedance state of the output data. The digital output load is
IH(MIN)
level of OE to the instant when the output data reaches V
IL(MAX)
(i.e., the delay time through the digital output buffers) needs
d(o)
is more than 1/2 clock period at 35 MHz, data cannot be reliably
d(o)
= 35 MSPS, external
CLK
1.5 ps, rms 5 8 ns
OH(min)
or V
OL(max)
CLK
cycles
output
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TLV5535 8-BIT, 35 MSPS, LOW -POWER ANALOG-TO-DIGITAL CONVERTER
SLAS221 – JUNE 1999
PARAMETER MEASUREMENT INFORMATION
N+3
N
N+1
90% 10%
V
IH(min)
N+5
V
t
en
IL(max)
CLK
N+2
t
d(pipe)
t
j(a)
t
t
h(o)
d(a)
1.5 V
1/f
V
V
CLK
t
w(CLKH)
D0–D7 N–4 N–3 N–2 N–1 N N+1
OE
IH
(min)
t
w(CLKL)
IL
(max)
N+4
1.5 V
t
d(o)
t
dis
Figure 1. Timing Diagram
TYPICAL CHARACTERISTICS
performance plots at 25°C
V
OH(min)
V
OL(max)
0.2
0.1
0.0
DNL – LSB
–0.1
–0.2
0 50 100 150 200 250
ADC Code
Figure 2. DNL vs Input Code at 35 MSPS (with external reference, PW Package)
8
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
8-BIT, 35 MSPS, LOW -POWER ANALOG-TO-DIGITAL CONVERTER
TYPICAL CHARACTERISTICS
performance plots at 25°C (continued)
0.4
0.3
0.2
0.1 –0.0 –0.1
INL – LSB
–0.2 –0.3 –0.4
0 50 100 150 200 250
Figure 3. INL vs Input Code at 35 MSPS (with external reference, PW package)
TLV5535
SLAS221 – JUNE 1999
ADC Code
50 45
40
35
30
25
SNRD – dB
20
15
10
5 0
0 1020304050
Analog Input Frequency – MHz
Figure 4. SNRD vs fin at 35 MSPS (external reference)
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TLV5535 8-BIT, 35 MSPS, LOW -POWER ANALOG-TO-DIGITAL CONVERTER
SLAS221 – JUNE 1999
TYPICAL CHARACTERISTICS
performance plots at 25°C (continued)
8
7
6
5
4
ENOB
3
2
1
0
0 1020304050
Analog Input Frequency – MHz
Figure 5. ENOB vs FIN, 35 MSPS (external reference)
0 –10 –20 –30 –40 –50 –60 –70
Power – dBFS
–80 –90
–100
0 5 10 15
f – Frequency – MHz
Figure 6. Spectral Plot fin = 1.0 MHz at 35 MSPS
10
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
8-BIT, 35 MSPS, LOW -POWER ANALOG-TO-DIGITAL CONVERTER
TYPICAL CHARACTERISTICS
performance plots at 25°C (continued)
0 –10 –20 –30 –40 –50 –60
Power – dB
–70 –80 –90
–100
0 5 10 15
Figure 7. Spectral Plot fin = 4.2 MHz at 35 MSPS
TLV5535
SLAS221 – JUNE 1999
f – Frequency – MHz
0
–10 –20 –30 –40 –50 –60
Power – dB
–70 –80 –90
–100
0 5 10 15
f – Frequency – MHz
Figure 8. Spectral Plot fin = 15.527 MHz at 35 MSPS
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11
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