Operates From a Single 5-V Supply or From
a Split ±5-V Supply
D
Complementary Outputs
D
Input Common-Mode Voltage Includes
Negative Rail
D
Low Offset Voltage
D
No Minimum Slew Rate Requirement
D
Output Latch Capability
D
Functional Replacement to the LT1116
description
The TL31 16 is an ultra-fast comparator designed
to interface directly to TTL logic while operating
from either a single 5-V power supply or dual
±5-V supplies. The input common-mode voltage
extends to the negative rail for ground sensing
applications. It features extremely tight offset
voltage and high gain for precision applications. It
has complementary outputs that can be latched
using the LATCH ENABLE terminal. Figure 1
shows the positive supply current of the
comparator. The TL3116 only requires 12.7 mA
(typical) to achieve a propagation delay of 10 ns.
The TL3116 is a pin-for-pin functional replacement for the LT1116 comparator, offering
high-speed operation but consuming much less
power.
AVAILABLE OPTIONS
PACKAGED DEVICES
T
A
0°C to 70°CTL3116CDTL3116CPWLETL3116Y
–40°C to 85°CTL3116IDTL3116IPWLE—
†
The PW packages are available left-ended taped and reeled only.
‡
Chip forms are tested at TA = 25°C only.
SMALL
OUTLINE
(D)
†
TSSOP
(PW)
FORM
(Y)
PRECISION COMPARATORS
SLCS132B – MARCH 1997 – REVISED APRIL 1997
V
CC+
IN+
IN–
V
CC–
symbol (each comparator)
IN+
IN–
POSITIVE SUPPLY CURRENT
FREE-AIR TEMPERATURE
15
VCC = ± 5 V
14
13
12
11
10
9
8
– Positive Supply Current – mA
7
CC
I
‡
6
5
–50–250255075100125
TA – Free-Air Temperature – °C
TL3116, TL3116Y
ULTRA-FAST LOW-POWER
D AND PW PACKAGE
(TOP VIEW)
1
2
3
4
Figure 1
Q OUT
8
Q OUT
7
GND
6
LATCH ENABLE
5
Q OUT
OUT
Q
vs
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
This chip, when properly assembled, displays characteristics similar to the TL31 16C. Thermal compression or
ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive
epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
V
(4)
V
+
–
CC–
CC+
GND
(1)
(6)
(8)
(7)
Q OUT
Q OUT
55
(1)
(2)
(3)
(4)
(1)
(1)
63
(5)
(8)
(7)
(6)
(6)
(6)
IN+
IN–
(5)
(2)
(3)
LATCH ENABLE
CHIP THICKNESS: 10 MILS TYPICAL
BONDING PADS: 4 × 4 MILS MINIMUM
TJ max = 150°C
TOLERANCES ARE ±10%.
ALL DIMENSIONS ARE IN MILS.
TERMINALS 1 AND 6 CAN BE
CONNECTED TO MULTIPLE PADS.
COMPONENT COUNT
Bipolars53
MOSFETs49
Resistors46
Capacitors14
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TL3116, TL3116Y
ULTRA-FAST LOW-POWER
PRECISION COMPARATORS
SLCS132B – MARCH 1997 – REVISED APRIL 1997
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds 260°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltage values, except differential voltages, are with respect to network ground.
2. Differential voltages are at IN+ with respect to IN–.
Full range for the TL3116C is 0°C to 70°C. Full range for the TL3116I is –40°C to 85°C.
‡
t
pd1
overdrive at TA = 25°C only. Correlation tests have shown that t
to ensure that all internal bias conditions are correct. For low overdrive conditions, VOS is added to the overdrive.
ropagation delay time
Pulse skew (|t
Setup time, LATCH ENABLE3.43.4ns
cannot be measured in automatic handling equipment with low values of overdrive. The TL3116 is 100% tested with a 1-V step and 500-mV
pd+
– t
pd–
|)
VOD = 5 mV
∆V
= 100 mV,
VOD = 20 mV
∆VI = 100 mV,
TA = 25°C
TYPICAL CHARACTERISTICS
TA = 25°C9.9129.912
TA = full range9.9149.915
TA = 25°C8.210.38.210.3
TA = full range8.212.78.213.7
VOD = 5 mV,
limits given can be ensured with this test, if additional dc tests are performed
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion, not to exceed 0.006 (0,15).
D. Four center pins are connected to die mount pad.
E. Falls within JEDEC MS-012
10
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TL3116, TL3116Y
ULTRA-FAST LOW-POWER
PRECISION COMPARATORS
SLCS132B – MARCH 1997 – REVISED APRIL 1997
MECHANICAL INFORMATION
PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE
14 PIN SHOWN
0,65
14
1
1,20 MAX
A
7
0,10 MIN
0,32
0,19
8
6,70
4,50
4,30
6,10
M
0,13
Seating Plane
0,10
0,15 NOM
Gage Plane
0,25
0°–8°
0,75
0,50
PINS **
DIM
A MAX
A MIN
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
8
3,10
2,90
14
5,10
4,90
16
5,10
20
6,60
6,404,90
24
7,90
7,70
28
9,80
9,60
4040064/D 10/95
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
11
IMPORTANT NOTICE
T exas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue
any product or service without notice, and advise customers to obtain the latest version of relevant information
to verify, before placing orders, that information being relied on is current and complete. All products are sold
subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those
pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. T esting and other quality control techniques are utilized to the extent
TI deems necessary to support this warranty . Specific testing of all parameters of each device is not necessarily
performed, except those mandated by government requirements.
CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF
DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL
APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR
WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER
CRITICAL APPLICA TIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERST OOD TO
BE FULLY AT THE CUSTOMER’S RISK.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other
intellectual property right of TI covering or relating to any combination, machine, or process in which such
semiconductor products or services might be or are used. TI’s publication of information regarding any third
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
Copyright 1998, Texas Instruments Incorporated
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