Texas Instruments TIC12400 User Manual

User's Guide

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TIC12400 Evaluation Module

This user's guide describes the characteristics, operation, and use of the TIC12400 Evaluation Module (EVM).

Contents

1 Introduction ................................................................................................................... 2

2 Hardware...................................................................................................................... 4

3 SWITCH BOARD Hardware Description ................................................................................. 8

4 GUI Software Installation.................................................................................................. 11

5 TIC12400 GUI Application ................................................................................................ 14

6 Board Files .................................................................................................................. 39

List of Figures

1 TIC12400 EVM Block Level Diagram..................................................................................... 2

2 TIC12400 EVM, SWITCH BOARD, and USB to USB-Mini Cable..................................................... 4

3 EVM, SWITCH BOARD, USB Cable, PC, and Power Supply Setup................................................. 4

4 EVM Hardware Top Description ........................................................................................... 5

5 EVM Hardware Bottom Description ...................................................................................... 6

6 Setup_TIC12400-0.4.0_EVM.exe........................................................................................ 11

7 Installation Steps 1–6...................................................................................................... 12

8 Figure 3. Installation Steps 7–13......................................................................................... 13

9 Double Click on “App Center EVM GUI” Shortcut to Open........................................................... 14

10 GUI Home Page............................................................................................................ 14

11 Device Configuration Page ............................................................................................... 17

12 Channel Configuration Page.............................................................................................. 21

13 Page Connections.......................................................................................................... 39

14 Main Device................................................................................................................. 40

15 USB interface ............................................................................................................... 41

16 <Caption> ................................................................................................................... 41

17 Input filters – IN10-IN23 use 10 Ω instead of 220 Ω................................................................... 41

18 SWITCH Board Schematic................................................................................................ 42

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TIC12400 Evaluation Module

External Micro

Connector

MSP430

(U1)

3.3-V

Regulator

(U4)

Connector

Channel

0í23

Battery or Power

Supply

5-V

Regulator

(U9)

Input Filter

Channel IN0 to IN

Test Point Test Point

DNP

TXB0106

(U10)

TIC12400

(U11)

. . .

SPI

INT

RST

USB

Connector

x24

ONBOARD EVM MONITORS:

x VDD Current Monitor (INA226A, U12) x VS Current Monitor (INA226A, U13) x Ambient Air Temp Monitor (TMP102AQ, U5) x Case Temp Monitor (TMP102AQ, U2)

I2C

SPI

INT

RST

SPI

INT

RST

Introduction

1 Introduction

The TIC12400 is a multiple switch detection interface that is designed to detect the opening and closing of up to 24 switch contacts. 10 out of the 24 inputs are configurable to detect switch states that are either battery connected switches (BCS) or ground connected switches (GCS), which means it can either sink or source current from the channel. The remaining 14 channels are design to support ground connected switches only (source current). The wetting current can be preprogrammed to six available values, which accommodates for different application scenarios. Communication to and from the device is done using a 24-bit SPI protocol.

The TIC124000 and TIC12400-Q1 provide the same functionality and the TIC12400 Evaluation Module is used for both devices.

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Figure 1. TIC12400 EVM Block Level Diagram

The TIC12400 EVM is an evaluation module for the Texas Instruments TIC12400 and it provides basic functionality evaluation for the device. When used together with the switch board, the EVM allows testing of its functionality via SPI communication established to the PC using the USB adaptor.

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Caution Hot surface.

Contact may cause burns.

Do not touch.

The DUT of the board can get hot when all channels are enabled at

the highest wetting current settings in continuous mode

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1.1 Warnings

Introduction

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+12.0 V

Power

Supply

EVMSWITCH BOARD

USB

Hardware

2 Hardware

2.1 Kit

Two boards, EVM (TIC12400EVM) and SWITCH BOARD (TIC12400_SWB), are provided with an USB to USB-MINI cable within the KIT; see Figure 2.

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Figure 2. TIC12400 EVM, SWITCH BOARD, and USB to USB-Mini Cable

2.2 Connection to the PC and Powering up the EVM

A mini-USB cable is used to connect the EVM board to the PC. The VDD of the EVM is powered by the USB’s VBUS. The positive terminal of the Power Supply is connected to the “VBAT” terminal of both the EVM and SWITCH BOARD. The negative terminal of the power supply is connected to the “GND” terminal of the EVM. Turn ON the power supply and set it to a nominal supply of +12 V, see Figure 3.

Figure 3. EVM, SWITCH BOARD, USB Cable, PC, and Power Supply Setup

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Optional Circuitry or Functions

Required Circuitry

10 11

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2.3 EVM Hardware Description

The TIC12400 EVM is designed to allow the user to easily evaluate switch detection using the GUI. The break down of all the features and design of the EVM follow.

Hardware

1. Connect the TIC12400EVM to a supply using VBAT (J9) as the positive terminal of the supply and GND (J10) to the negative terminal of the supply using standard banana cables. The supply can range from 4.5V to 35V, but is nominally at 12V.

2. Connect the TIC12400EVM to your computer via the mini-USB cable provided. The actual connector is located on the bottom side of the board. This will allow your computer to interface with the EVM and communicate to the device.

3. Connect the Switch Board or your own switches via a mating connector to J2, which connects the switches to the INx pins of the device.

4. U11 is the TIC12400 devices.

5. The EVM has several LED use to help the user indicate the status of the EVM

6. The device has three post regulator decoupling caps: V at each output capacitor for each of these three regulators.

7. The EVM facilitates the use of an external microcontroller by interfacing with SPI, INT, and RESET pins of the device.

8. There is an optional Translator/Level shifter (TXB0106) on the EVM to ensure the ability to interface with the device's SPI, INT, and RESET functions at various voltages set by VDD pin. The MSP430 is a

3.3-V device and does not support 5-V logic level without the TXB0106.

9. The EVM has the ability to do relative temperature measurements of the air using the TI TMP0104AQ

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Figure 4. EVM Hardware Top Description

, V

CAP_D

CAP_PRE

, and V

TIC12400 Evaluation Module

. There are test points

CAP_A

1,6,7,11,12

CONNECTOR

Hardware

10. There are place holders for a filter components on each channel of the EVM. There is a 100mil header

11. The filter capacitors at the pins of the device are not loaded by default and are there to allow the

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device.

along the edge of the connector to measure signal at connector, and SMT test points to measure the signal at the IC.

design of filters if needed.

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Figure 5. EVM Hardware Bottom Description

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1. The EVM has a blocking diode and large bulk capacitor. The blocking diode (D3) protects the EVM in

2. The EVM has the ability to do relative temperature measurements of the device's case temperature

3. The MSP430's support devices, such as JTAG interface, crystal, programming button, and so forth.

4. The MSP430 bridges the communication from the computer’s USB cable to the device's SPI, INT, and

5. The TPS73533 receives power from the VBUS of the USB, which is 5 V. It then regulates that to the

6. There are two INA226A Current Monitors for measuring current in VDD (U12) and for measuring th

7. There are four status LED on the EVM that take up power when in use. The header (J4) facilitates

8. The TPS7A6650Q is a high voltage regulator that is able to take high voltage and regulate it down to

Hardware

case the terminals of the battery are switched accidentally. The bulk capacitor (C24) adds a delay between a battery disconnect and the device shutting down.

a. 2.1 There EVM has several jumpers for configuring the EVM in a variety of ways. J1: This jumper

connects the input of the 5V regulator to VS if inserted. (Default: Not Loaded)

b. 2.6 J6: This jumper connects a GPIO from the EVM micro (MSP430) to the output enable (OE) of

the TXB0106 level shifter by placing the jumper between pins 1 and 2. Placing the jumper between pins 2 and 3 forces the translator to be on. If there is no jump on J7 then the pull down resistor turns it off (OE=LOW) and places the level shifter in high impedance mode, preventing bus contention between two possible masters on the SPI bus.

c. 2.7 J7: This jumper connects VDD pin of the device to either the onboard +3.3V supply generated

from the USB bus or connects to the onboard +5V regulator that is supplied from the battery. Connecting pin 1 and 2 with a jumper connects VDD to +3.3V and connecting 2 and 3 with a jumper connects VDD to +5V (this assumes J1 is also loaded). (Default: jumper across pin 1 and

d. 2.11 J11: This jumper connects VS pin of the device to the bulk capacitor after the protection

diode.

e. 2.12 J12: This jumper gives the option of having the pull up resistor come from either VDD or VS.

Connecting pin 1 and 2 with a jumper, references the INT pin to VS. Connecting pin 2 and 3 with a jumper references the INT pin to VDD.

using TI’s TMP0104AQ device.

RESET lines. The MSP430 also interfaces with several supports circuits for measuring temperature for air and case, measuring current to VDD, and measuring current to VS. The MSP430 also has the ability to control OE pin of TXB0106 to facilitate control of the device by an external microcontroller.

+3.3V output on the TIC12400 EVM.

current going into VS (U13). The MSP430 interfaces with these devices using I2C and relays the information through the UBS cable to the GUI on the computer.

removing the LED’s in the circuit to do system level power measurements accurately.

5V for use with higher voltage micro controllers. When J1 is removed the regulator’s input voltage is removed and therefore it is disabled.

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23-1 23-2 23-3 23-4 23-5

SW23_A

SW23_B

IN23

5 4

SWITCH BOARD Hardware Description

3 SWITCH BOARD Hardware Description

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1. The SWITCH BOARD (SWB) is designed such that ground offsets can be tested by removing J6, which disconnects the Chassis Ground (CGND) from the EVM ground (GND). A supply can be placed between GND and CGND to create the offset. If not testing this feature, then J6 is by default in place and therefore CGND and GND are shorted together.

2. VBAT provides the power to the battery connected switches. Switch 0 to 9 are battery connected switches.

3. J114 connects all the switches from the SWB to the inputs of the EVM.

4. J1, J2, and J3 are jumpers that connect SW0 to SW23 to IN0 to IN23 of the EVM. These jumpers allow the user to disconnect the SW’s on the Switch Board to the EVM and provide a 0.1" head to connect their own switch of their choosing to the EVM.

5. SW23A and SW23B are provided to test the device's ability to detect multi-resistor coded ground referenced switch transitions. SW23A relate directly to the mapped thresholds for 3A, 3B, and 3C. SW23B relate directly to thresholds 8 and 9 of the device. Switch 23-1-5 are designed to coincide with one state for each instance of one switch being in the “CLOSED” position. Channel 23 of the device has the ability to set up to 5 thresholds, which means there are 6 states. Each switch represents one state and all switches in the “OPEN” position represents the 6th state.

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X-2

OPEN

X-1

X-2

OPEN

X-1

X-2

OPEN

X-1

X-1 X-2

SWX

INX

OPEN

X-2

OPEN

X-1

X-2

OPEN

X-1

X-2

OPEN

X-1

X-1 X-2

SWX

INX

OPEN

X-1 X-2 X-3

SWX

IN_X

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6. SW18 – SW22 are used to test up to 4 state resistor coded ground referenced switches. Each of the

7. SW12 – SW17 are used when up to two thresholds (three states) is needed for the switch application.

SWITCH BOARD Hardware Description

channels have three ground connected switches labeled X-1, X-2, and X-3, which coincides with a mapped threshold for 3A, 3B, and 3C. Each individual switch represents one of the three states and the fourth state is when all switches are “OPEN”.

Each of the channels have two ground connected switches labeled X-1 and X-2, which coincides with a mapped threshold for 2A and 2B, and a switch position called “OPEN” to represent the third state.

8. SW10 and SW11 are used when up to two thresholds (three states) is needed for the switch application. Each channel from 0 to 11, has one unique threshold mapping for each channel and one common threshold (THRES_COM) that is shared for all the channels (0-11). These switches are setup to illustrate this feature.

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X-1

OPEN

X-2

OPENOPEN

SWX

X-1

X-2

OPEN

VBAT

IN_X

X-1

X-2

X-1

X-2

SWITCH BOARD Hardware Description

9. SW0 to SW9 are designed to test the device ability to detect digital switches that are either referenced to a battery connected switch or ground connected switch. There are two state, “OPEN” and either chassis Ground Connected Switch (GCS) or Battery Connected Switch (BCS).

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4 GUI Software Installation

The GUI software is required to establish the communication between the EVM boards and the PC and it also provides the GUI interface to read/write registers information on device. The following section described the software installation procedure.

Step 1. Download the GUI software The software can be downloaded on TI server at link goes here. Please inquiry with a TI representative

if you don’t have access to the files. Step 2. Software installation Go to location that the executable was downloaded to and either double-click the Setup_TIC12400-

0.4.0_EVM.exe file to begin software installation or right click and select “Run as administrator”. The software will install two applications, “App Center” software and the TIC12400 GUI App software. If the “App Center” software isn’t already installed on the PC then additional steps will be needed. Those steps are outlines in the following figures.

GUI Software Installation

Follow the on-screen instructions to complete the setup. The process may take up to 10 minutes depending on your computer speed.

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Figure 6. Setup_TIC12400-0.4.0_EVM.exe

TIC12400 Evaluation Module

This screen should show up shortly after step

5. This screen should appear on top, unless the user clicks on another item. Sometimes the screen may appear to be behind the other setup screen. The TIC12400 EVM GUI will not install until the App Center software is first installed.

GUI Software Installation

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TIC12400 Evaluation Module

Figure 7. Installation Steps 1–6

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GUI Software Installation

The EVM GUI can either be opened before or after the EVM is setup and power is applied.

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Figure 8. Figure 3. Installation Steps 7–13

TIC12400 Evaluation Module

3 4 5 6

TIC12400 GUI Application

5 TIC12400 GUI Application

5.1 Starting the GUI

After the EVM and SWITCH BOARD are connected and then the cables are connected the Power Supply and PC via USB cable, the GUI can be run by double clicking the shortcut icon on the desktop, see

Figure 9.

Figure 9. Double Click on “App Center EVM GUI” Shortcut to Open

5.2 TIC12400 Info Page

The “Info” page (Home) of the TIC12400 GUI has a short summary of the features of the TIC12400. See the following map of features of the “Info” page in Figure 10.

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TIC12400 Evaluation Module

Figure 10. GUI Home Page

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TIC12400 GUI Application

The Menu bar has several sub menus that are within “File”, “Tools” and “Help” drop down menus. “File” drop down menu provides access to “Saving Registers”, “Save Registers As”, and “Load

Registers”. This means switch profiles can be saved and loaded as needed.

“Tools” drop down menu provides access to the Logging feature of the GUI. This records both SPI Reads and Writes.

“Help” drop down menu provides access to information pertaining to GUI version and MSP430 firmware revision.

The Menu bar can be clicked to show the minimized and maximized menu, default is minimized. The buttons on the bar are from top to bottom as follows:

• Intro (Home): Brings the user back to the Intro screen

• Channel Configuration: Page to configure the channels of the device in a graphical format

• Configuration Wizard: Guided setup of MSDI based on system level requirements

• Device Settings: Access device settings without manually

adjusting the register settings

• Real Time Status Tracker: Live visual monitoring of channel inputs

• Matrix Configuration: Graphical configuration of the Matrix mode settings

• Polling mode current calculator: Page to calculate the current consumption of the devicewhile in polling mode with multiple settings, and Register Map. These are also available buttons on the right of the “Intro” page.

• Registers: Register access page

Quick Start. Opens up a sub menu with two options.

1. A configuration wizard that walks through the system level use case to setup the device

2. Load default configuration for the device

The settings button will open a sub menu for Channel Configurations, Device Settings and Matrix

configuration. These are the same pages accessed by the men bar on the left side of the GUI.

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TIC12400 GUI Application

The tools button will open a sub menu to access the Polling Mode current Calculator and Real-

Time Status Tracker pages.

6. Clicking on the register map button will direct the user to the Register map page via a sub menu. Reference materials button that pulls up links to the EVM User’s Guide, Datasheet and a

reference video. Benefits banner. Clicking on the links in this section will show greater details on the device

benefits and how they differ from today’s implementations. The button toggles ON/OFF the Log page, which is also seen in the Tools->Log pane.

If the EVM is connected to the PC with the USB cable then the GUI will show that it is connected by showing a green dot. If there is no communication with either the on board micro controller (MSP430) or the device then the following image will be seen, indicated no communication.

10.

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5.3 Device Settings Page

The Device Configuration page controls many of the features for TIC12400 that control device general operation.

TIC12400 GUI Application

Figure 11. Device Configuration Page

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)

TIC12400 GUI Application

The device has a variety of setting and features that are accessed and controlled by doing read and writes to the device. It is important to note that when selecting and changing setting within the GUI it must be written to the device prior to initiating the activation of the device by clicking on the “Trigger” button. Once the Trigger is turned ON all registers become read only (with the exception of the CRC_T, RESET, and TRIGGER bits). Trigger initiates the wetting currents and

starts external switch monitoring.

The device has several features that help ensure robust communications to and from the device to the micro controller on the SPI bus. Interrupts can be generated in the INT pin of the device to communicate to the user that either “SPI_FAIL”, “PARITY_FAIL”, or “CRC_CALC_COMPLETE” fault has occurred.

The device has the ability to alert the user when Switch State Change (SSC) has occurred. The Channel Configuration sets the conditions that initiate a SSC. If this feature is not selected then the SSC is recorded but the INT pin is not asserted. This is also true for the VS0 and VS1 voltage state change. There are four different thresholds (VS0_THRES2A/B and VS1_THRES2A/B) that can be set for VS measurements to establish state changes. If the VS0/VS1 Threshold Crossing features are not selected then the INT pin is not asserted after a state change, but it will be

stored in the device and the user must read the device to determine that the a state change occurred.

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If the "Wetting Current Diag" is selected then an INT assertion occurs if any of the "Wetting Current Diag – IN0/1/2/3" fail. If the "ADC Diag" is selected then an INT is asserted if the ADC Diag fails

The device has the ability to assert the INT pin when System Faults occur such as “Over Voltage”, “Under Voltage”, “Temperature Warning”, and “Temperature Shutdown”.

This button sends a software reset to the device via SPI. This will reset all registers to their default setting! The user must write back all the registers before selecting “Trigger” and to start wetting current and start external switch monitoring.

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TIC12400 GUI Application

The TIC12400 GUI monitors the INT pin approximately at every second. There is an INTERUPT led on the EVM lights up when the INT pin is asserted. This coincides with the INT icon. Once the INT is asserted then selecting the READ button reads the INT_STAT register which clears the INT assert

If the Auto-Read interrupt register features is selected then the GUI will automatically read the INT_STAT register every 5 seconds, which will clear the INT and record the INT_STATE register information into GUI, but it does clear the INT_STAT register within the device.

The Wetting Current Auto-Scaling feature allows the user to enable or disable the auto scaling feature in continuous mode.

The Temperature warning and wetting current reduction feature provides the ability to enable or disable the wetting current reduction feature when a Temperature warning event occurs.

The TIC12400 has the ability to do an ADC diagnostics and also has the ability to test wetting currents on IN0, IN1, IN2, and IN3 and diagnose if there are faults.

10.

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TIC12400 GUI Application

The TIC12400's advanced settings have several features that allow the user to optimize their switch state change monitoring system. VS measurement can be enabled or disabled here. Once enabled the advanced settings menu becomes accessible to the right of the checkbox.

Accessing the VS Measurement settings will allow the user to select the channel, resistor divider ratio and select the thresholds. The thresholds can be shown in volts or ADC thresholds or volts.

The Operation mode and timing settings can also be configured between polling and continuous mode.

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Clicking the Settings cog opens the timing settings menu to configure the polling mode.

11.

The CCP or clean current polling settings can also be configured by clicking the configure CCP option. This will allow the user to enable CCP by channel and select the current to be either 10 mA or 15 mA by group.

Additional the detection filter can be adjusted and the Interrupt assertion scheme can be selected.

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* *

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CRC calculations can be initiated and results displayed within this window. Note, an INT can be setup to indicate when the CRC calculation is completed by the device, which at that time it can be read.

12. Displayed results will look as follows:

5.4 Channel Configuration Page

The Channel Configuration page controls the Channel settings for how to indicate state change when monitoring the Channels.

TIC12400 GUI Application

The TIC12400 has a variety of setting and features that are accessed and controlled by doing read and writes to the device. It is important to note that when selecting and changing setting within the GUI it must be written to the device prior to initiating the activation of the device by clicking on the “Trigger” button. Once the Trigger is turned ON all registers become read only (with the exception of the CRC_T, RESET, and TRIGGER bits). Trigger initiates the wetting

currents and starts external switch monitoring.

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Figure 12. Channel Configuration Page

TIC12400 Evaluation Module

SOURCE

Wetting Current Direction

SINK

Wetting Current Direction

TIC12400 GUI Application

The TIC12400 has 24 channels that can be configured a variety of ways to detect all types of switches. Within the “Simple View” the GUI breaks down each channel into manageable easy to visualize channel settings. In order to change the setting the Channel must be Enabled, which is done by clicking on the Enable/Disable button. The channel will no longer be greyed out and channel information will be able to be changed.

Each Column describes the feature that can be changed and a simple single click will toggle between settings or allow to select from a drop down menu.

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More advanced setting for each Channel can be accessed clicking on the settings icon.

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TIC12400 GUI Application

The GUI monitors the INT pin approximately at every second. There is an INTERUPT led on the EVM lights up when the INT pin is asserted. This coincides with the INT icon. Once the INT is asserted then selecting the READ button reads the INT_STAT register which clears the INT assert

All the Channels can be Enabled or Disabled all at once by clicking on these buttons.

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TIC12400 GUI Application

The TIC12400 Channel Configurations can be controlled by one of three ways.

1) "Simple View" is the default mode of accessing the Channel Configurations if

2) "Detailed View" allows the user to see all the Channel Configurations at once and also to design to show all the dependent variables.

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3) Register Map view allows the user to do individual bit control for configuration registers.

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5.5 Channel Configuration Wizard

TIC12400 GUI Application

The TIC12400 GUI will walk through the system configuration with a series of question prompts

on the system configuration. Once a prompt is completed the GUI will move on the to the next step. You can edit any prompt at any time regardless of your current step in the wizard.

After completing the question prompts. The start button will move to the next area to be

configured. The red outline will show the current part of the system being addressed by the prompt. As more

questions are answered this area will show how the external system is being interpreted by the GUI.

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TIC12400 GUI Application

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The system configuration from the previous page is shown at the top of the section. Clicking the Modify button will bring up a prompt to change these settings.

Here is it possible to change of the settings again as necessary for either adding a new switch to the configuration or adjusting the overall system details. After the desired system configuration is set, press the Update button to change the setting and click the X to return to the wizard.

Each IWett setting will give a recommended threshold. If the Recommended threshold in N/A that setting is not recommended.

2. This displays the current global thresholds for the ADC.

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TIC12400 GUI Application

The wetting current setting can be selected either by using the drop down menu in this section or clicking the setting in section 1.

Based on the number of switch states the GUI will recommend the appropriate channel that can handle the switch type.

The Recommended thresholds section will show which thresholds are available to use. It is important to keep track of the global thresholds that are currently being used by other channels as the TIC12400 is configured.

After the desired settings are correct, clicking the copy settings will configure the TIC12400 device. Clicking Do Nothing will exit the wizard. The wizard can be used multiple times to update TIC12400 per each switch in the system.

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TIC12400 GUI Application

The current setting and threshold calculations will be different for different switch states. For 4 switch states 3 thresholds must be used. If any of the threshold boxes for a given wetting current setting are populated with NA, that current setting cannot be used. If all of the current settings cannot be used the resistance ranges for the switch are not supported. For more information on the supported resistance values for multiple switch states see the datasheet.

In this example the only supported wetting current is 2 mA as all of the thresholds have values.

In this example the only supported wetting current is 2 mA as all of the thresholds have non NA values.

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The recommended channels that are available all support the 4 switch configuration and the channels that do not support 4 switch states are not recommended.

Additionally the available threshold settings are Thres3A/B/C. These thresholds can be mapped to any unmapped thresholds but must follow the rules that ThresC > ThresB > ThresA.

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5.6 Real Time Status Tracker

TIC12400 GUI Application

The channel list includes all the available channels for the device. Enabled channels display green and disabled channels display gray. Clicking green channels will turn on the GUI tracker for that channel. Clicking the same button again will disable the GUI tracker. Note this does not enable/disable the channel in the device, it changes if the GUI displays any real time changes.

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TIC12400 GUI Application

This will show each channel that the GUI tracker is enabled for. Each channel will show the threshold on the left side of the graph. For multiple switch state channels all the thresholds are shown. As the switch state changes the graph will update accordingly as shown below if the Trigger has been enabled in section 3.

Clicking the trigger button will enable the device to monitor the inputs and update the real time status tracker.

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5.7 Matrix Configuration

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TIC12400 GUI Application

The Matrix configuration settings area changes the setup for Matrix mode according to the system requirements Clicking the Matrix configuration will allow you to select between the supported configurations.

The input source and sink currents are also selectable via a drop down menu. The sink current must always be larger than the source current and the GUI will make unusable source and sink combinations un-selectable.

The detection edge control option lets you select between no detection, rising, falling, and rising or falling edge detection schemes.

The Matrix polling active time controls how long the inputs are polled as described in the datasheet.

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TIC12400 Evaluation Module

TIC12400 GUI Application

The Switch Status area shows the current status of the matrix of switches. The status can be checked by clicking the Check switch status button. Mousing over a box will show which switch that is.

This is a visual depiction of the matrix mode operation. Selecting the different matrix settings (4x4, 5x5, 6x6) will change the image to show which channels are being used.

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After setting the desired matrix configuration click the Write to Device button to set the register

settings in the TIC12400 device. Use the Trigger button to monitor the TIC12400 enable monitoring of the inputs.

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5.8 Polling Mode Current Calculator

TIC12400 GUI Application

Matrix mode calculations can be enabled by clicking the checkbox. This will open up a menu to select the matrix configuration options.

The Polling_Act_Time and Polling time can be selected as well.

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TIC12400 Evaluation Module

TIC12400 GUI Application

Each channel can be selected in this menu as well as the wetting current, input mode, and the external switch state.

Clicking calculate will prompt the results page which will deliver the measurement cycle time, active duty cycle and the effective current for different temperatures.

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TIC12400 Evaluation Module

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TIC12400 GUI Application

The matrix channel configuration will not be interactive unless matrix mode is checked from section 1.

After matrix mode is checked the boxes become interactive. Clicking different switches will close or open them and the current calculator will update accordingly.

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TIC12400 Evaluation Module

TIC12400 GUI Application

5.9 Register Map

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The Register name is shown as it matches the datasheet. The address of the register and the value of the register is shown in hexadecimal. The bit representation of the Value is also shown. Registers that are read only will be shown as transparent red. Read and write registers are shown as black.

One way to edit a register is to click the value field of that register. Registers of the device will not change until the Write Register button is clicked. If Auto Read is enable, any register changes

that have not been sent to the device will be overwritten to the current value of the TIC12400. The bit field representation will also update as the value field of the register is adjusted.

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TIC12400 GUI Application

For the selected register in the register field, a question mark help button will appear. Clicking this will show the full description for that register field.

Clicking the red x will exit the help menu for that register and take the user back to the register fields.

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TIC12400 Evaluation Module

TIC12400 GUI Application

The field view area shows a bit by bit name and description for each setting available in that register.

Clicking the ? Button will bring up that field’s bit number(s) in the register, whether it is read or write and the description. Clicking the red x will exit the help description prompt.

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Auto read can be enabled on a polling timer that is adjustable in the GUI.

The Immediate and deferred menu will adjust when the register are written after they are changed in the GUI. Immediate will send the new register settings to the device immediately after they are changed. The deferred setting will wait for the user to click the Write Register button before sending the new register settings to the device.

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IN0 IN1

IN8

IN9

IN10

IN11

CS_MSDI

SCLK

MOSI

MISO

INT

RST

IN2

IN4

IN5

IN21 IN22

IN23

IN6

IN7

IN12

IN13

IN14

IN15 IN16

IN17

IN18 IN19

IN20

IN3

SCL

SDA

MSP-LED

EN_EXT_MICRO

Multiple Switch Detection Interface HVL129A_MSDI_MC.SchDoc

CS_MSDI

SCLK

MOSI

MISO

INT

RST

EXT_MICRO_CONTROL

SDA

SCL

MSP-LED

EN_EXT_MICRO

Micro Controller Board HVL129A_Microcontroller

IN1_SB IN23_SB

IN21_SB IN22_SB IN20_SB

IN18_SB IN19_SB IN17_SB

IN15_SB IN16_SB IN14_SB

IN13_SB IN12_SB IN11_SB

IN0_SB

IN2_SB

IN6_SB

IN7_SB

IN8_SB

IN9_SB

IN10_SB

IN5_SB

Hardware HVL129A_Hardware

A10

A11

A12

A13

A14

A15

A16

B10

B11

B12

B13

B14

B15

B16

C10

C11

C12

C13

C14

C15

C16

5650478-5

TP4

PEC24SAAN

Power Supplies HVL129A_PowerSupply

IN0_SB IN1_SB

IN23_SB

IN22_SB

IN21_SB

IN20_SB

IN19_SB

IN18_SB

IN17_SB

IN16_SB

IN15_SB

IN14_SB

IN13_SB

IN12_SB

IN11_SB

IN10_SB

IN9_SB

IN8_SB

IN7_SB

IN6_SB

IN5_SB

IN4_SB

IN3_SB

IN2_SB

IN3_SB

IN4_SB

GND

123456789

DNP

+5V

GND

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6 Board Files

This section contains the main board and SWITCH board schematics and BOMs.

6.1 Main Board Schematic

Figure 13 through Figure 17 illustrate the main board schematics.

Board Files

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Figure 13. Page Connections

TIC12400 Evaluation Module

GND

0.1µF

C32

VDD

TP3

GND

SCLK SI SO

0.1µF

C31

DPI/CE injection/measurement po int choosethis one

DPI/CE injection/measurement po int

IN8_SB

IN7_SB

IN6_SB

IN5_SB

IN4_SB

IN3_SB

IN2_SB

IN1_SB

IN0_SB

IN5

IN4

IN3

IN0

IN1

IN2

IN21

IN22

IN23

IN6

IN7

IN10

IN11

IN12

IN8

IN13

IN14

IN15

IN16

IN17

IN18

IN19

IN20

IN9_SB

IN9

1µF

C33

SB_IN_ IN_

0 HVL129A_INx.SchDoc

SB_IN_ IN_

1 HVL129A_INx.SchDoc

SB_IN_ IN_

2 HVL129A_INx.SchDoc

SB_IN_ IN_

3 HVL129A_INx.SchDoc

SB_IN_ IN_

4 HVL129A_INx.SchDoc

SB_IN_ IN_

5 HVL129A_INx.SchDoc

SB_IN_ IN_

6 HVL129A_INx.SchDoc

SB_IN_ IN_

7 HVL129A_INx.SchDoc

SB_IN_ IN_

8 HVL129A_INx.SchDoc

SB_IN_ IN_

9 HVL129A_INx.SchDoc

SB_IN_ IN_

10 HVL129A_INx.SchDoc

SB_IN_ IN_

11 HVL129A_INx.SchDoc

SB_IN_ IN_

12 HVL129A_INx.SchDoc

SB_IN_ IN_

13 HVL129A_INx.SchDoc

SB_IN_ IN_

14 HVL129A_INx.SchDoc

SB_IN_ IN_

15 HVL129A_INx.SchDoc

SB_IN_ IN_

23 HVL129A_INx.SchDoc

SB_IN_ IN_

22 HVL129A_INx.SchDoc

SB_IN_ IN_

21 HVL129A_INx.SchDoc

SB_IN_ IN_

20 HVL129A_INx.SchDoc

SB_IN_ IN_

19 HVL129A_INx.SchDoc

SB_IN_ IN_

18 HVL129A_INx.SchDoc

SB_IN_ IN_

17 HVL129A_INx.SchDoc

SB_IN_ IN_

16 HVL129A_INx.SchDoc

IN13

IN14

IN15

IN16

IN17

IN18

IN19

IN208DGND

IN21

IN22

IN23

RESET

SCLK

VDD

INT

CAP_PRE

CAP_D

CAP_A

IN0

IN1

IN2

IN3

IN4

AGND

IN5

IN6

IN7

IN8

IN9

IN10

IN11

IN12

U11

TIC12400DCPQ1

RESET

GND

SCL

GND

SDA

GND

0.01µF

C59

DNP

GND

0.01µF

C57

DNP

GND

0.01µF

C55

DNP

GND

0.01µF

C53

DNP

GND

0.01µF

C51

DNP

GND

0.01µF

C49

DNP

GND

0.01µF

C47

DNP

GND

0.01µF

C45

DNP

GND

0.01µF

C60

DNP

0.01µF

C58

DNP

GND

0.01µF

C56

DNP

GND

0.01µF

C54

DNP

GND

0.01µF

C52

DNP

GND

0.01µF

C50

DNP

GND

0.01µF

C48

DNP

GND

0.01µF

C46

DNP

GND

0.01µF

C44

DNP

GND

0.01µF

C43

DNP

GND

0.01µF

C42

DNP

GND

0.01µF

C41

DNP

GND

0.01µF

C40

DNP

GND

0.01µF

C39

DNP

GND

0.01µF

C38

DNP

GND

0.01µF

C37

DNP

GND

0.1µF

C30

0.1µF

C29

0.1µF

C36

DNP

0.1µF

C11

DNP

0 R15

4.7µF

C20

GND

/CS

ALERT

SDA

SCL

VS+

GND

VBUS

VIN-

VIN+

U12

INA226AIDGSR

DNP

ALERT

SDA

SCL

VS+

GND

VBUS

VIN-

VIN+

U13

INA226AIDGSR

DNP

+3.3V

GND

+3.3V

GND

I2C Cur ren t Shun t i s u sed to mea su re curren t for V s and Vdd

4.99k

DNP

4.99k

R11

DNP

4.99k

R16

DNP

4.99k

R17

DNP

4.99k

R18

DNP

4.99k R19

DNP

GND

IN0 IN1 IN2 IN3 IN4 IN5 IN6 IN7 IN8 IN9 IN10 IN11 IN12 IN13 IN14 IN15 IN16 IN17 IN18

IN20 IN21 IN22 IN23

IN19

IndicatorLEDs

+3.3V +5V

Green

GND

MSP-LED

Green

GND

Green

5,6,84,7

1,2,

CSD17313Q2

GND

Red

Green

Vssint

INT_LED

750

R25

5.10k

R28

750

R27

750

1.62k

R26

/INT

INT_LED

4.32k

R20

VDD

MOSI

CS_MSDI

MISO

SCLK

RST

VDD

10k

R24

Green

EN_EXT_MICRO

750

R13

INT

BAS 52-02V H6327

VDD

2.00k

0 R31

0 R10

123456789

PRE

123

J12

SH-J12

SH-MSP_LED

SH-3.3V

SH-EXT_MC

SH-5V

SH-INT

DNP

Board Files

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TIC12400 Evaluation Module

Figure 14. Main Device

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GND

IN_SB_IN_

0.015µF

C1_0

220

R1_0

IN_0

GND

2.2µF

C23

VDD

0.1µF

C22

GND

47µF

C24

12V Battery Input

TAB

VIN1VOUT

TPS7A6550QKVURQ1

GND

VBAT_MSDI

GND_MSDI

+3.3V

+5V

0.1µF

C28

SPC15363

J10

SPC15354

600 ohm

+VBUS

R14

DNP

Vbat_c TP2

SS34

123

J11

SH-J7

SH-J11

SH-J1

DNP

GND

+3.3V

GND

IO1

IO2

GND3IO3

IO4

VCC

TPD4E004DRYR

33k

10µF

1.5k

1.07Meg

R22

220pF

C10

7.5V

Z2 1SMB5922BT3G

22µF

C13

0.01µF

C15

2.2µF

C12

Alternate Functions for GPIO pins:

-------------------------------------------------------------GPIO0 - I2C:SDA GPIO1 - I2C:SCL GPIO2 - SPI:SCLK, EasyScale:DOUT, uWire:SCLK GPIO3 - PWM2, INT0 GPIO4 - SPI:MOSI, UART:TXD, uWIRE:MOSI GPIO5 - SPI:MISO, UART:RXD,uWIRE:MISO GPIO6 - PWM1, OW1, SPI:CS GPIO7 - PWM0, OW2, INT2 GPIO8 - ADC3 GPIO9 - ADC2, EasyScale:AIN GPIO10 - VEREFGPIO11 - VEREF+ GPIO12 - FEC, CLOCK, INT3 GPIO13 - PWM3

VUSB

PUR

VBUS

0.1µF

C25

GND

+3.3V

49.9k

R23

GND

+3.3V

EXT_MICRO_CONTROL

VCCA

GND

VCCB

U10

TXB0106PWR

0.1µF

C26

GND

VDD

2 3 4

41 32

1µF

C14

90 ohm

FB1

OUT

GND

U4A

TPS73533DRBR

Place on bottom of board on opposing side of thermal pad so that thermal resistance is minimiz ed

Place on top of board in secluded section of PCB then hav e internal pours kept out and machine out slots to ther mally isolate from board

49.9k

U4B

TPS73533DRBR

CS_MSDI SCLK MOSI MISO

0 R33 0 R34 0 R39 0 R40

INT

0 R41

RST

0 R42

GPIO6 GPIO2 GPIO4 GPIO5 GPIO3 GPIO7

+VBUS

5,6,8

4,7

1,2,

Q2 CSD17313Q2

TP1

EN_EXT_MICRO

GPIO12

P6.4/CB4/A4

P6.5/CB5/A5

P6.6/CB6/A6

P6.7/CB7/A7

P7.0/CB8/A12

P7.1/CB9/A13

P7.2/CB10/A14

P7.3/CB11/A15

P5.0/A8/VREF+/VEREF+

P5.1/A9/VREF-/VEREF-

AVCC1

P5.4/XIN

P5.5/XOUT

AVSS1

P8.0

P8.1

P8.2

DVCC1

DVSS1

VCORE

P1.0/TA0CLK/ACLK

P1.1/TA0.0

P1.2/TA0.1

P1.3/TA0.2

P1.4/TA0.3

P1.5/TA0.4

P1.6/TA1CLK/CBOUT

P1.7/TA1.0

P2.0/TA1.1

P2.1/TA1.2

P2.2/TA2CLK/SMCLK

P2.3/TA2.0

P2.4/TA2.1

P2.5/TA2.2

P2.6/RTCCLK/DMAE0

P2.7/UCB0STE/UCA0CLK

P3.0/UCB0SIMO/UCB0SDA

P3.1/UCB0SOMI/UCB0SCL

P3.2/UCB0CLK/UCA0STE

P3.3/UCA0TXD/UCA0SIMO

P3.4/UCA0RXD/UCA0SOMI

P3.5/TB0.5

P3.6/TB0.6

P3.7/TB0OUTH/SVMOUT

P4.0/PM_UCB1STE/PM_UCA1CLK

P4.1/PM_UCB1SIMO/PM_UCB1SDA

P4.2/PM_UCB1SOMI/PM_UCB1SCL

P4.3/PM_UCB1CLK/PM_UCA1STE

DVSS2

DVCC2

P4.4/PM_UCA1TXD/PM_UCA1SIMO

P4.5/PM_UCA1RXD/PM_UCA1SOMI

P4.6/PM_NONE

P4.7/PM_NONE

P5.6/TB0.0

P5.7/TB0.1

P7.4/TB0.2

P7.5/TB0.3

P7.6/TB0.4

P7.7/TB0CLK/MCLK

VSSU

PU.0/DP

PUR

PU.1/DM

VBUS

VUSB

V18

AVSS2

P5.2/XT2IN

P5.3/XT2OUT

TEST/SBWTCK

PJ.0/TDO

PJ.1/TDI/TCLK

PJ.2/TMS

PJ.3/TCK

RST/NMI/SBWTDIO

P6.0/CB0/A0

P6.1/CB1/A1

P6.2/CB2/A2

P6.3/CB3/A3

MSP430F5529IPNR

MINI-USB

GPIO9 GPIO8

GPIO11 GPIO10

P8.0

GPIO12

GPIO7

SDA

SDABRD SCLBRD

SCL

I2CPU

GPIO0SDABRD GPIO1SCLBRD

GPIO4

GPIO2

GPIO6

GPIO3

GPIO5

MSP-LED

GPIO13

GND

0.1µF

GND

0.1µF

PUR

VBUS VUSB

V18

GND

1 2

24MHz

+3.3V

2200pF

GND

33k

R12

GND

1 2 3 4 5 6 7 8

9 10 11 12 13 14

DNP

JTAG

30pF

C34

GND

0.47µF

220pF

C16

GND

+3.3V

GND

JTAG8

SCL

GND

ALERT

ADD0

V+

SDA

TMP102AQDRLRQ1

DNP0.1µF

C18

DNP

GND

4.99k R32

DNP

+3.3V

SDABRD

SCLBRD

GND

+3.3V

SCL

GND

ALERT

ADD0

V+

SDA

TMP102AQDRLRQ1

DNP

GND

0.1µF

DNP

GND

4.99k R35

DNP

4.99k R37

DNP

+3.3V

4.99k R36

DNP

SDABRD

SCLBRD

0.1µF

123

JP1

SH-J6

SH-J2

DNP

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Board Files

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Figure 17. Input filters – IN10-IN23 use 10 Ω instead of 220 Ω

Figure 15. USB interface

Figure 16. <Caption>

TIC12400 Evaluation Module

1234567

SW23_B

123456789

101112

SW18

IN0

IN1

IN2

IN3

IN4

IN10

IN11

IN12

IN13

IN14

IN16

IN17

IN15

IN18

IN19

IN20

IN22

IN23

IN21

123456789

101112

SW19

123456789

101112

SW20

123456789

101112

SW21

123456789

101112

SW22

123456789

101112

SW23_A

VBAT

CGNDGND

CGND

GND

IN5

IN6

IN7

IN8

IN9

A10

A11

A12

A13

A14

A15

A16

B10

B11

B12

B13

B14

B15

B16

C10

C11

C12

C13

C14

C15

C16

IN1_SB

IN22_SB

IN0_SB

IN19_SB

IN16_SB

IN12_SB

IN9_SB

IN6_SB

IN2_SB

IN23_SB

IN21_SB

IN20_SB

IN18_SB

IN17_SB

IN15_SB

IN14_SB

IN13_SB

IN11_SB

IN8_SB

IN10_SB

IN7_SB

IN5_SB

IN3_SB

IN4_SB

IN0_SB

IN1_SB

IN2_SB

IN3_SB

IN4_SB

IN5_SB

IN6_SB

IN7_SB

IN8_SB

IN9_SB

IN10_SB

IN11_SB

IN12_SB

IN13_SB

IN14_SB

IN15_SB

IN16_SB

IN17_SB

IN18_SB

IN19_SB

IN20_SB

IN21_SB

IN22_SB

IN23_SB

100

R37

100

R40

100

R43

100

R46

100

R49

100

R52

100R36

100R34

100R32

100R30

470R21

470R23

470R25

470R27

294

R38

294

R41

294

R44

294

R47

294

R50

402

R54

887

R55

1.65k

R56

220

R53

23-523-1 23-423-2 23-322-1 2 2-2 22-321-1 21-2 21-320-1 20-2 20-319-1 19-2 19-318-1 18-2 18-3

750

R51

750

R48

750

R45

750

R42

750

R39

VBAT

OPEN

SW11-1

SW11-2

OPEN

SW1-1

SW1-2

OPEN

SW2-1

SW2-2

OPEN

SW3-1

SW3-2

OPEN

SW4-1

SW4-2

OPEN

SW5-1

SW5-2

OPEN

SW6-1

SW6-2

OPEN

SW7-1

SW7-2

OPEN

SW8-1

SW8-2

OPEN

SW9-1

SW9-2

OPEN

SW10-1

SW10-2

OPEN

SW12-1

SW12-2

OPEN

SW13-1

SW13-2

OPEN

SW14-1

SW14-2

OPEN

SW15-1

SW15-2

OPEN

SW16-1

SW16-2

OPEN

SW17-1

SW17-2

VBAT

CGND CGND CGND CGND CGND CG ND CGND

R19

R17

R15

R13

R11

R10

R12

R14

R18

R20

VBAT

CGND

S1S1S2

SW0

CGND CGND

VBAT

OPEN

SW0-1

SW0-2

S1S1S2

SW1

S1S1S2

SW2

S1S1S2

SW3

S1S1S2

SW4

CGNDCGND

VBAT

S1S1S2

SW5

CGND CGND

S1S1S2

SW6

S1S1S2

SW7

S1S1S2

SW8

S1S1S2

SW9

CGNDCGND

R16

S1S1S2

SW10

CGND CGND

S1S1S2

SW11

S1S1S2

SW12

S1S1S2

SW13

S1S1S2

SW14

S1S1S2

SW15

S1S1S2

SW16

S1S1S2

SW17

CGND

CGND CGND

CGND

CGND CGND

CGND

CGND CGND

CGND

CGND CGND

CGND

CGND CGND

CGND

CGND CGND

CGND

CGND CGND

CGND

100R22

100R24

100R26

100R28

470R29

470R35

470R33

470R31

1 2

3 4

5 6

7 8

9 10

11 12

13 14

1 2

3 4

5 6

7 8

9 10

11 12

13 14

15 16

1 2

3 4

5 6

7 8

9 10

11 12

SH-0

SH-1

SH-2

SH-3

SH-4

SH-5

SH-6

SH-7

SH-8

SH-9

SH-18

SH-19

SH-20

SH-21

SH-22

SH-23

SH-11

SH-12

SH-13

SH-14

SH-15

SH-16

SH-17

SH-10

SH-J6

Board Files

6.2 Switch Board Schematic

Figure 18 shows the SWITCH board schematic.

TIC12400 Evaluation Module

Figure 18. SWITCH Board Schematic

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Board Files

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TIC12400 Evaluation Module

6.3 Main Board Bill of Materials

Table 1 lists the main board bill of materials (BOM).

Table 1. Main Board Bill of Materials

Designator QTY Value Description Package Reference Part Number

!PCB1 1 Printed Circuit Board HVL129 !PCB2 1 Daughter card load board. Set in separate ESD bag. Kiting item. N/A HVL149 C1_0, C1_1, C1_2,

C1_3, C1_4, C1_5, C1_6, C1_7, C1_8, C1_9, C1_10, C1_11, C1_12, C1_13, C1_14, C1_15, C1_16, C1_17, C1_18, C1_19, C1_20, C1_21, C1_22, C1_23

24 0.015uF CAP, CERM, 0.015 µF, 100 V, +/- 10%, X7R, 0603 0603 C0603C153K1RACTU

C2, C34 2 30pF CAP, CERM, 30pF, 100V, +/-5%, C0G/NP0, 0603 0603 GRM1885C2A300JA01D C3 1 2200pF CAP, CERM, 2200pF, 50V, +/-10%, X7R, 0603 0603 C0603X222K5RACTU C4, C5, C6 3 0.1uF CAP, CERM, 0.1uF, 16V, +/-5%, X7R, 0603 0603 0603YC104JAT2A C7 1 0.47uF CAP, CERM, 0.47uF, 10V, +/-10%, X7R, 0603 0603 C0603C474K8RACTU C9 1 10uF CAP, CERM, 10uF, 16V, +/-20%, X5R, 0805 0805 0805YD106MAT2A C10, C16 2 220pF CAP, CERM, 220pF, 50V, +/-1%, C0G/NP0, 0603 0603 06035A221FAT2A C12 1 2.2uF CAP, CERM, 2.2uF, 16V, +/-10%, X5R, 0805 0805 0805YD225KAT2A C13 1 22uF CAP ALUM 22UF 10V 20% SMD E55 EEE-1AA220WR C14 1 1uF CAP, CERM, 1 µF, 25 V, +/- 10%, X7R, 0805 0805 C0805C105K3RACTU C15 1 0.01uF CAP, CERM, 0.01uF, 50V, +/-10%, X7R, 0603 0603 C1608X7R1H103K C20 1 4.7uF CAP, CERM, 4.7 µF, 50 V, +/- 20%, X7R, 1206_190 1206_190 C3216X7R1H475M160AC C22, C31, C32 3 0.1uF CAP,CERM, 0.1 µF, 25 V, +/- 5%, X7R, 0603 0603 C0603C104J3RAC C23 1 2.2uF CAP, CERM, 2.2 µF, 10 V, +/- 10%, X7R, 0805 0805 GRM21BR71A225KA01L C24 1 47uF CAP, AL, 47 µF, 63 V, +/- 20%, ohm, SMD SMT Radial G EEETG1J470P C25, C26 2 0.1uF CAP, CERM, 0.1 µF, 25 V, +/- 5%, X7R, 0603 0603 C0603C104J3RACTU C28 1 0.1uF CAP, CERM, 0.1 µF, 50 V, +/- 10%, X7R, 0805 0805 C0805C104K5RACTU C29, C30 2 0.1uF CAP, CERM, 0.1 µF, 50 V, +/- 10%, X7R, 0603 0603 06035C104KAT2A C33 1 1uF CAP, CERM, 1 µF, 50 V, +/- 10%, X7R, 0603 0603 UMK107AB7105KA-T D1, D2, D4, D5, D7 5 Green LED, Green, SMD 1.6x0.8x0.8mm LTST-C190KGKT D3 1 40V Diode, Schottky, 40 V, 3 A, SMC SMC SS34 D6 1 Red LED, Red, SMD LED_0603 LTST-C191KRKT D8 1 45V Diode, Schottky, 45 V, 0.75 A, SOD-523 SOD-523 BAS 52-02V H6327 FB1 1 90 ohm Ferrite Bead, 90 ohm @ 100 MHz, 1.5 A, 1206 1206 MI1206K900R-10 H2, H5, H8, H11 4 Standoff, Hex, 1"L #4-40 Nylon Standoff 1902E H3, H6, H9, H12 4 Machine Screw, Round, #4-40 x 1/4, Nylon, Philips panhead Screw NY PMS 440 0025 PH

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Table 1. Main Board Bill of Materials (continued)

Designator QTY Value Description Package Reference Part Number

IN_0, IN_1, IN_2, IN_3, IN_4, IN_5, IN_6, IN_7, IN_8, IN_9, IN_10, IN_11, IN_12, IN_13, IN_14, IN_15, IN_16, IN_17, IN_18, IN_19, IN_20, IN_21, IN_22, IN_23

24 Test Lead clips and hooks, SMT Test Point, Body 3.25x1.65mm S1751-46

J1, J11, JP1 3 Header, 100mil, 2x1, Gold with Tin Tail, SMT 2x1 Header TSM-102-01-L-SV J2 1 Header, 2.54mml, 16x3, Gold, TH Header, 2.54mml, 16x3, TH 5650478-5 J4 1 Header, 2.54mm, 5x2, Gold, SMT Header, 2.54mm, 5x2, SMT TSM-105-01-L-DV-P J5 1 Connector, Receptacle, Mini-USB Type B, R/A, Top Mount SMT USB Mini Type B 1734035-2 J6, J7, J12 3 Header, 100mil, 3x1, Gold, SMT Samtec_TSM-103-01-X-SV TSM-103-01-L-SV J9 1 BANANA JACK, SOLDER LUG, RED, TH Red Insulated Banana Jack SPC15363 J10 1 BANANA JACK, SOLDER LUG, BLACK, TH Black Insulated Banana Jack SPC15354 L1 1 600 ohm Ferrite Bead, 600 ohm @ 100 MHz, 2 A, 0805 0805 MPZ2012S601A Q1, Q2 2 30V MOSFET, N-CH, 30 V, 5 A, SON 2x2mm SON 2x2mm CSD17313Q2 R1_0, R1_1, R1_2,

R1_3, R1_4, R1_5, R1_6, R1_7, R1_8, R1_9

10 220 RES, 220, 1%, 0.5 W, AEC-Q200 Grade 0, 0805 0805 ERJ-P6WF2200V

R1_10, R1_11, R1_12, R1_13, R1_14, R1_15, R1_16, R1_17, R1_18, R1_19, R1_20, R1_21, R1_22, R1_23

14 10.0 RES, 10.0, 1%, 0.5 W, AEC-Q200 Grade 0, 0805 0805 ERJ-P6WF10R0V

R2, R13, R25, R27 4 750 RES, 750, 5%, 0.1 W, 0603 0603 CRCW0603750RJNEA R3 1 2.00k RES, 2.00 k, 1%, 0.1 W, 0603 0603 CRCW06032K00FKEA R4, R6 2 33 RES, 33 ohm, 5%, 0.063W, 0402 0402 CRCW040233R0JNED R5, R23 2 49.9k RES, 49.9 k, 1%, 0.1 W, 0603 0603 CRCW060349K9FKEA R7 1 1.5k RES, 1.5k ohm, 5%, 0.063W, 0402 0402 CRCW04021K50JNED R8, R12 2 33k RES, 33k ohm, 5%, 0.063W, 0402 0402 CRCW040233K0JNED R10, R15, R31, R33,

R34, R39, R40, R41, R42

9 0 RES, 0, 5%, 0.1 W, 0603 0603 CRCW06030000Z0EA

R20 1 4.32k RES, 4.32 k, 1%, 0.1 W, 0603 0603 RC0603FR-074K32L R22 1 1.07Meg RES, 1.07Meg ohm, 1%, 0.1W, 0603 0603 CRCW06031M07FKEA R24 1 10k RES, 10 k, 5%, 0.1 W, 0603 0603 CRCW060310K0JNEA R26 1 1.62k RES, 1.62 k, 1%, 0.1 W, 0603 0603 CRCW06031K62FKEA R28 1 5.10k RES, 5.10 k, 1%, 0.1 W, 0603 0603 RC0603FR-075K1L S1 1 Switch, Tactile, SPST-NO, SMT Switch, 6.1x1.8x4.6 mm EVQ-PSD02K

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Table 1. Main Board Bill of Materials (continued)

Designator QTY Value Description Package Reference Part Number

SH-3.3V, SH-5V, SHEXT_MC, SH-J6, SHJ7, SH-J11, SH-J12, SH-MSP_LED

8 1x2 Shunt, 100mil, Gold plated, Black Shunt SNT-100-BK-G

TP1 1 Test Point, Multipurpose, Black, TH Black Multipurpose Testpoint 5011 TP2 1 Test Point, Multipurpose, Red, TH Red Multipurpose Testpoint 5010 TP3 1 Header, 100mil, 1pos, Gold, TH Testpoint TSW-101-07-G-S TP4 1 Header, 2.54mm, 24x1, Gold, TH Header, 2.54mm, 24x1, TH PEC24SAAN U1 1 25 MHz Mixed Signal Microcontroller with 128 KB Flash, 8192 B SRAM and 63 GPIOs, -40 to 85

degC, 80-pin QFP (PN), Green (RoHS & no Sb/Br)

PN0080A MSP430F5529IPNR

U3 1 TPD4E0

04DRYR

IC, 4-Chan ESD-Protection Array SON-6 TPD4E004DRYR

U4 1 Single Output High PSRR LDO, 500 mA, Fixed 3.3 V Output, 2.7 to 6.5 V Input, with Low IQ, 8-

pin SON (DRB), -40 to 125 degC, Green (RoHS & no Sb/Br)

DRB0008A TPS73533DRBR

U9 1 Single Output Automotive LDO, 300 mA, Fixed 5 V Output, 4 to 40 V Input, 3-pin PFM (KVU),

-40 to 125 degC, Green (RoHS & no Sb/Br)

KVU0003A TPS7A6550QKVURQ1

U10 1 6-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR WITH AUTO-DIRECTION SENSING

AND ±15-kV ESD PROTECTION, PW0016A

PW0016A TXB0106PWR

U11 1 Multiple Switch Detection Interface (MSDI) device, DCP0038A DCP0038A TIC12400DCPQ1 Y1 1 Crystal, 24.000MHz, 20pF, SMD Crystal, 11.4x4.3x3.8mm ECS-240-20-5PX-TR Z2 1 7.5V Diode, Zener, 7.5V, 550mW, SMB SMB 1SMB5922BT3G C8, C18 0 0.1uF CAP, CERM, 0.1 µF, 25 V, +/- 5%, X7R, 0603 0603 C0603C104J3RACTU C11, C36 0 0.1uF CAP, CERM, 0.1 µF, 50 V, +/- 10%, X7R, 0603 0603 06035C104KAT2A C37, C38, C39, C40,

C41, C42, C43, C44, C45, C46, C47, C48, C49, C50, C51, C52, C53, C54, C55, C56, C57, C58, C59, C60

0 0.01uF CAP, CERM, 0.01 µF, 50 V, +/- 5%, X7R, 0603 0603 C0603C103J5RACTU

FID1, FID2, FID3 0 Fiducial mark. There is nothing to buy or mount. N/A N/A J3 0 Header(Shrouded), 2.54mm, 5x2, Gold, TH Header, 2.54mm, 5x2, TH AWHW-10G-0202-T J8 0 Header, 100mil, 7x2, SMT Header, 100 mil, 7x2, SMT 0015912140 R9, R11, R16, R17,

R18, R19, R32, R35, R36, R37

0 4.99k RES, 4.99 k, 1%, 0.1 W, 0603 0603 CR0603-FX-4991ELF

R14 0 0 RES, 0, 5%, 0.1 W, 0603 0603 CRCW06030000Z0EA SH-INT, SH-J1, SH-J20 1x2 Shunt, 100mil, Gold plated, Black Shunt SNT-100-BK-G

U2, U5 0 Low-Power Digital Temperature Sensor With SMBus and Two-Wire Serial Interface in SOT563,

DRL0006A

DRL0006A TMP102AQDRLRQ1

U12, U13 0 High-or Low-Side Measurement, Bi-Directional CURRENT/POWER MONITOR with I2C(TM)

Interface, DGS0010A

DGS0010A INA226AIDGSR

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6.4 SWITCH Board Bill of Materials

Table 2 lists the SWITCH board BOM.

Table 2. SWITCH Board Bill of Materials

Designator QTYValue Description Package Reference Part Number

!PCB1 1 Printed Circuit Board HVL149 H1, H2, H3, H4 4 Machine Screw, Round, #4-40 x 1/4, Nylon, Philips panhead Screw NY PMS 440 0025 PH H5, H6, H7, H8 4 Standoff, Hex, 1"L #4-40 Nylon Standoff 1902E J1 1 Header, 2.54mm, 10x2, Gold, SMT 1000x180x290mil TSM-110-01-L-DV-P J2 1 Header, 2.54mm, 8x2, Gold, SMT Header, 2.54mm, 8x2, SMT TSM-108-01-L-DV J3 1 Header, 2.54mm, 6x2, Gold, SMT Header, 2.54mm, 6x2, SMT TSM-106-01-L-DV J4, J5 2 Header, 100mil, 1pos, Gold, TH Testpoint TSW-101-07-G-S J6 1 Header, 2.54 mm, 2x1, Gold, R/A, SMT Header, 2.54 mm, 2x1, R/A,

SMT

0878980204

J7 1 Receptacle, 2.54mm, 16x3, Gold, R/A, TH Receptacle,2.54mm, 16x3, R/A,TH5650868-4

J8 1 BANANA JACK, SOLDER LUG, RED, TH Red Insulated Banana Jack SPC15363 J9 1 BANANA JACK, SOLDER LUG, BLACK, TH Black Insulated Banana Jack SPC15354 R1, R2, R3, R4, R5,

R6, R7, R8, R9, R10, R11, R12, R13, R14, R15, R16, R17, R18, R19, R20

20 0 RES, 0, 5%, 0.25 W, 1206 1206 ERJ-8GEY0R00V

R21, R23, R25, R27, R29, R31, R33, R35

8 470 RES, 470, 1%, 0.25 W, 1206 RC1206FR-07470RL

R22, R24, R26, R28, R30, R32, R34, R36

8 100 RES, 100, 1%, 0.25 W, 1206 ERJ-8ENF1000V

R37, R40, R43, R46, R49, R52

6 100 RES, 100, 1%, 0.25 W, 1206 1206 ERJ-8ENF1000V

R38, R41, R44, R47, R50

5 294 RES, 294, 1%, 0.25 W, 1206 1206 RC1206FR-07294RL

R39, R42, R45, R48, R51

5 750 RES, 750, 1%, 0.25 W, 1206 1206 CRCW1206750RFKEA

R53 1 220 RES, 220, 1%, 0.25 W, 1206 1206 RC1206FR-07220RL R54 1 402 RES, 402, 1%, 0.25 W, 1206 1206 ERJ-8ENF4020V R55 1 887 RES, 887, 1%, 0.25 W, 1206 1206 ERJ-8ENF8870V R56 1 1.65k RES, 1.65 k, 1%, 0.25 W, 1206 1206 ERJ-8ENF1651V

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Table 2. SWITCH Board Bill of Materials (continued)

Designator QTYValue Description Package Reference Part Number

SH-0, SH-1, SH-2, SH-3, SH-4, SH-5, SH-6, SH-7, SH-8, SH-9, SH-10, SH-11, SH-12, SH-13, SH14, SH-15, SH-16, SH-17, SH-18, SH19, SH-20, SH-21, SH-22, SH-23, SH-J6

25 1x2 Shunt, 100mil, Gold plated, Black Shunt SNT-100-BK-G

SW0, SW1, SW2, SW3, SW4, SW5, SW6, SW7, SW8, SW9, SW10, SW11, SW12, SW13, SW14, SW15, SW16, SW17

18 Switch, Slide, SP3T, On-On-On, 3 Pos, 0.3A, 30 VDC, TH 12.6x4.3mm SS-13D16-VG 4 PA

SW18, SW19, SW20, SW21, SW22, SW23_A

6 Switch, DPST, 3 Pos, 0.1 A, 50 VDC, SMD 17.67x9.78mm 204-213ST

SW23_B 1 Switch, DPST, 2 Pos, 0.1 A, 50 VDC, SMD 12.34x9.78mm 204-212ST FID1, FID2, FID3 0 Fiducial mark. There is nothing to buy or mount. N/A N/A

STANDARD TERMS FOR EVALUATION MODULES

1. Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, and/or documentation which may be provided together or separately (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance with the terms set forth herein. User's acceptance of the EVM is expressly subject to the following terms.

1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions set forth herein but rather shall be subject to the applicable terms that accompany such Software

1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned, or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production system.

2 Limited Warranty and Related Remedies/Disclaimers:

2.1 These terms do not apply to Software. The warranty, if any, for Software is covered in the applicable Software License Agreement.

2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM to User. Notwithstanding the foregoing, TI shall not be liable for a nonconforming EVM if (a) the nonconformity was caused by neglect, misuse or mistreatment by an entity other than TI, including improper installation or testing, or for any EVMs that have been altered or modified in any way by an entity other than TI, (b) the nonconformity resulted from User's design, specifications or instructions for such EVMs or improper system design, or (c) User has not paid on time. Testing and other quality control techniques are used to the extent TI deems necessary. TI does not test all parameters of each EVM. User's claims against TI under this Section 2 are void if User fails to notify TI of any apparent defects in the EVMs within ten (10) business days after delivery, or of any hidden defects with ten (10) business days after the defect has been detected.

2.3 TI's sole liability shall be at its option to repair or replace EVMs that fail to conform to the warranty set forth above, or credit User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the warranty period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to repair or replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall be warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day warranty period.

3 Regulatory Notices:

3.1 United States

3.1.1 Notice applicable to EVMs not FCC-Approved:

FCC NOTICE: This kit is designed to allow product developers to evaluate electronic components, circuitry, or software associated with the kit to determine whether to incorporate such items in a finished product and software developers to write software applications for use with the end product. This kit is not a finished product and when assembled may not be resold or otherwise marketed unless all required FCC equipment authorizations are first obtained. Operation is subject to the condition that this product not cause harmful interference to licensed radio stations and that this product accept harmful interference. Unless the assembled kit is designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must operate under the authority of an FCC license holder or must secure an experimental authorization under part 5 of this chapter.

3.1.2 For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:

CAUTION

This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment.

FCC Interference Statement for Class A EVM devices

NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to correct the interference at his own expense.

FCC Interference Statement for Class B EVM devices

NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

• Reorient or relocate the receiving antenna.

• Increase the separation between the equipment and receiver.

• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.

• Consult the dealer or an experienced radio/TV technician for help.

3.2 Canada

3.2.1 For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210 or RSS-247

Concerning EVMs Including Radio Transmitters:

This device complies with Industry Canada license-exempt RSSs. Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may

cause undesired operation of the device.

Concernant les EVMs avec appareils radio:

Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.

Concerning EVMs Including Detachable Antennas:

Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device.

Concernant les EVMs avec antennes détachables

Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de l'émetteur

3.3 Japan

3.3.1 Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に

輸入される評価用キット、ボードについては、次のところをご覧ください。

http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page

3.3.2 Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certified by TI as conforming to Technical Regulations of Radio Law of Japan.

If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required to follow the instructions set forth by Radio Law of Japan, which includes, but is not limited to, the instructions below with respect to EVMs (which for the avoidance of doubt are stated strictly for convenience and should be verified by User):

1. Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for Enforcement of Radio Law of Japan,

2. Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to EVMs, or

3. Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan.

【無線電波を送信する製品の開発キットをお使いになる際の注意事項】開発キットの中には技術基準適合証明を受けていないものがあります。技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの措置を取っていただく必要がありますのでご注意ください。

1. 電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用いただく。

2. 実験局の免許を取得後ご使用いただく。

3. 技術基準適合証明を取得後ご使用いただく。

なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。

上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。日本テキサス・インスツルメンツ株式会社東京都新宿区西新宿６丁目２４番１号西新宿三井ビル

3.3.3 Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page

電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧ください。http:/

/www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page

3.4 European Union

3.4.1 For EVMs subject to EU Directive 2014/30/EU (Electromagnetic Compatibility Directive): This is a class A product intended for use in environments other than domestic environments that are connected to a

low-voltage power-supply network that supplies buildings used for domestic purposes. In a domestic environment this product may cause radio interference in which case the user may be required to take adequate measures.

4 EVM Use Restrictions and Warnings:

4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.

4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information related to, for example, temperatures and voltages.

4.3 Safety-Related Warnings and Restrictions:

4.3.1 User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or property damage. If there are questions concerning performance ratings and specifications, User should contact a TI field representative prior to connecting interface electronics including input power and intended loads. Any loads applied outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative. During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit components may have elevated case temperatures. These components include but are not limited to linear regulators, switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the information in the associated documentation. When working with the EVM, please be aware that the EVM may become very warm.

4.3.2 EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the dangers and application risks associated with handling electrical mechanical components, systems, and subsystems. User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees, affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or designees.

4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal, state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local requirements.

5. Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as accurate, complete, reliable, current, or error-free.

6. Disclaimers:

6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY MATERIALS PROVIDED WITH THE EVM (INCLUDING, BUT NOT LIMITED TO, REFERENCE DESIGNS AND THE DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL FAULTS." TI DISCLAIMS ALL OTHER WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT NOT LIMITED TO ANY EPIDEMIC FAILURE WARRANTY OR IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY THIRD PARTY PATENTS, COPYRIGHTS, TRADE SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS.

6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS SHALL BE CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY OTHER INDUSTRIAL OR INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD PARTY, TO USE THE EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY INVENTION, DISCOVERY OR IMPROVEMENT, REGARDLESS OF WHEN MADE, CONCEIVED OR ACQUIRED.

7. USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES, EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS. THIS OBLIGATION SHALL APPLY WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY OTHER LEGAL THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED.

8. Limitations on Damages and Liability:

8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE TERMS OR THE USE OF THE EVMS , REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED TO, COST OF REMOVAL OR REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES, RETESTING, OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS, LOSS OF SAVINGS, LOSS OF USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL BE BROUGHT AGAINST TI MORE THAN TWELVE (12) MONTHS AFTER THE EVENT THAT GAVE RISE TO THE CAUSE OF ACTION HAS OCCURRED.

8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY USE OF AN EVM PROVIDED HEREUNDER, INCLUDING FROM ANY WARRANTY, INDEMITY OR OTHER OBLIGATION ARISING OUT OF OR IN CONNECTION WITH THESE TERMS, , EXCEED THE TOTAL AMOUNT PAID TO TI BY USER FOR THE PARTICULAR EVM(S) AT ISSUE DURING THE PRIOR TWELVE (12) MONTHS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE CLAIMED. THE EXISTENCE OF MORE THAN ONE CLAIM SHALL NOT ENLARGE OR EXTEND THIS LIMIT.

9. Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s) will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s), excluding any postage or packaging costs.

10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas, without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas. Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief in any United States or foreign court.

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265

IMPORTANT NOTICE FOR TI DESIGN INFORMATION AND RESOURCES

Texas Instruments Incorporated (‘TI”) technical, application or other design advice, services or information, including, but not limited to, reference designs and materials relating to evaluation modules, (collectively, “TI Resources”) are intended to assist designers who are developing applications that incorporate TI products; by downloading, accessing or using any particular TI Resource in any way, you (individually or, if you are acting on behalf of a company, your company) agree to use it solely for this purpose and subject to the terms of this Notice.

TI’s provision of TI Resources does not expand or otherwise alter TI’s applicable published warranties or warranty disclaimers for TI products, and no additional obligations or liabilities arise from TI providing such TI Resources. TI reserves the right to make corrections, enhancements, improvements and other changes to its TI Resources.

You understand and agree that you remain responsible for using your independent analysis, evaluation and judgment in designing your applications and that you have full and exclusive responsibility to assure the safety of your applications and compliance of your applications (and of all TI products used in or for your applications) with all applicable regulations, laws and other applicable requirements. You represent that, with respect to your applications, you have all the necessary expertise to create and implement safeguards that (1) anticipate dangerous consequences of failures, (2) monitor failures and their consequences, and (3) lessen the likelihood of failures that might cause harm and take appropriate actions. You agree that prior to using or distributing any applications that include TI products, you will thoroughly test such applications and the functionality of such TI products as used in such applications. TI has not conducted any testing other than that specifically described in the published documentation for a particular TI Resource.

You are authorized to use, copy and modify any individual TI Resource only in connection with the development of applications that include the TI product(s) identified in such TI Resource. NO OTHER LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE TO ANY OTHER TI INTELLECTUAL PROPERTY RIGHT, AND NO LICENSE TO ANY TECHNOLOGY OR INTELLECTUAL PROPERTY RIGHT OF TI OR ANY THIRD PARTY IS GRANTED HEREIN, including but not limited to any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information regarding or referencing third-party products or services does not constitute a license to use such products or services, or a warranty or endorsement thereof. Use of TI Resources may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.

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TI SHALL NOT BE LIABLE FOR AND SHALL NOT DEFEND OR INDEMNIFY YOU AGAINST ANY CLAIM, INCLUDING BUT NOT LIMITED TO ANY INFRINGEMENT CLAIM THAT RELATES TO OR IS BASED ON ANY COMBINATION OF PRODUCTS EVEN IF DESCRIBED IN TI RESOURCES OR OTHERWISE. IN NO EVENT SHALL TI BE LIABLE FOR ANY ACTUAL, DIRECT, SPECIAL, COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF TI RESOURCES OR USE THEREOF, AND REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.

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Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265

Texas Instruments TIC12400 User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual