TEXAS INSTRUMENTS TIBPAL16L8-7C, TIBPAL16R4-7C, TIBPAL16R6-7C, TIBPAL16R8-7C, TIBPAL16L8-10M Technical data

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TIBPAL16L8-10M, TIBPAL16R4-10M, TIBPAL16R6-10M, TIBPAL16R8-10M
TIBPAL16L8-7C, TIBPAL16R4-7C, TIBPAL16R6-7C, TIBPAL16R8-7C
HIGH-PERFORMANCE IMPACT-X PAL
SRPS006D – D3115, MAY 1988 – REVISED MARCH 1992
CIRCUITS
High-Performance Operation:
f
(no feedback)
max
TIBPAL16R’-7C Series . . . 100 MHz Min TIBPAL16R’-10M Series . . . 62.5 MHz Min
f
(internal feedback)
max
TIBPAL16R’-7C Series . . . 100 MHz Min TIBPAL16R’-10M Series . . . 62.5 MHz Min
f
(external feedback)
max
TIBPAL16R’-7C Series . . . 74 MHz Min TIBPAL16R’-10M Series . . . 52.5 MHz Min
Propagation Delay
TIBPAL16L’-7C Series . . . 7 ns Max TIBPAL16L’-10M Series . . . 10 ns Max
Functionally Equivalent, but Faster than,
Existing 20-Pin PLDs
Preload Capability on Output Registers
Simplifies Testing
Power-Up Clear on Registered Devices (All
Register Outputs are Set Low, but Voltage Levels at the Output Pins Go High)
Package Options Include Both Plastic and
Ceramic Chip Carriers in Addition to Plastic and Ceramic DIPs
Security Fuse Prevents Duplication
Dependable Texas Instruments Quality and
Reliability
DEVICE
PAL16L8 10 2 0 6 PAL16R4 8 0 4 (3-state buffers) 4 PAL16R6 8 0 6 (3-state buffers) 2 PAL16R8 8 0 8 (3-state buffers) 0
I
INPUTS
description
3-STATE
O OUTPUTS
REGISTERED
Q OUTPUTS
I/O
PORT
S
TIBPAL16L8’
C SUFFIX . . . J OR N PACKAGE
M SUFFIX . . . J PACKAGE
(TOP VIEW)
I
I
I
I
4
I
I
I
I
I
GND
C SUFFIX . . . FN PACKAGE M SUFFIX . . . FK PACKAGE
I I I I I
Pin assignments in operating mode
10
TIBPAL16L8’
(TOP VIEW)
I
I
3 2 1 20 19
910111213
I
GND
V
20
CC
O
19
I/O
18
I/O
17
I/O
16 15
I/O
14
I/O
13
I/O
12
O
11
I
CC
I
O
V
I/O
18
I/O
17
I/O
16
I/O
15
I/O
14
I
O
I/O
These programmable array logic devices feature high speed and functional equivalency when compared with currently available devices. These IMPACT-X circuits combine the latest Advanced Low-Power Schottky technology with proven titanium-tungsten fuses to provide reliable, high-performance substitutes for conventional TTL logic. Their easy programmability allows for quick design of custom functions and typically results in a more compact circuit board. In addition, chip carriers are available for futher reduction in board space.
All of the register outputs are set to a low level during power-up. Extra circuitry has been provided to allow loading of each register asynchronously to either a high or low state. This feature simplifies testing because the registers can be set to an initial state prior to executing the test sequence.
The TIBPAL16’ C series is characterized from 0°C to 75°C. The TIBPAL16’ M series is characterized for operation over the full military temperature range of –55°C to 125°C.
These devices are covered by U.S. Patent 4,410,987. IMPACT-X is a trademark of Texas Instruments Incorporated. PAL is a registered trademark of Advanced Micro Devices Inc.
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
Copyright 1992, Texas Instruments Incorporated
TIBPAL16R4-7C, TIBPAL16R6-7C, TIBPAL16R8-7C TIBPAL16R4-10M, TIBPAL16R6-10M, TIBPAL16R8-10M HIGH-PERFORMANCE IMPACT-X PAL
SRPS006D – D3115, MAY 1988 – REVISED MARCH 1992
CIRCUITS
TIBPAL16R4’
C SUFFIX . . . J OR N PACKAGE
M SUFFIX . . . J PACKAGE
(TOP VIEW)
CLK
I
I
I
4
I
I
I
I
I
GND
C SUFFIX . . . J OR N PACKAGE
M SUFFIX . . . J PACKAGE
GND
CLK
I I I I I I I I
10
TIBPAL16R6’
(TOP VIEW)
20 19 18 17 16 15 14 13 12 11
20 19 18 17 16 15 14 13 12 11
V I/O I/O Q Q Q Q I/O I/O OE
V I/O Q Q Q Q Q Q I/O OE
CC
CC
TIBPAL16R4’
C SUFFIX . . . FN PACKAGE
M SUFFIX . . . FK PACKAGE
(TOP VIEW)
CC
I
CLK
I/O
V
18 17 16 15 14
3 2 1 20 19
I
I
I
I
I
910111213
I
I
I/O
I/O
OE
GND
TIBPAL16R6’
C SUFFIX . . . FN PACKAGE
M SUFFIX . . . FK PACKAGE
(TOP VIEW)
I
GND
CLK
OE
CC
V
I/O
I/O
18 17 16 15 14
Q
3 2 1 20 19
I
I
I
I
I
910111213
I
I
I/O Q Q Q Q
Q Q Q Q Q
TIBPAL16R8’
C SUFFIX . . . J OR N PACKAGE
M SUFFIX . . . J PACKAGE
(TOP VIEW)
CLK
I
I
I
4
I
I
I
I
I
GND
Pin assignments in operating mode
10
V
20
CC
Q
19
Q
18
Q
17
Q
16 15
Q
14
Q
13
Q
12
Q
11
OE
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TIBPAL16R8’
C SUFFIX . . . FN PACKAGE
M SUFFIX . . . FK PACKAGE
(TOP VIEW)
I
GND
CLK
OE
CC
V
Q
Q
18 17 16 15 14
Q
3 2 1 20 19
I
I
I
I
I
910111213
I
I
Q Q Q Q Q
functional block diagrams (positive logic)
TIBPAL16L8-7C, TIBPAL16R4-7C
TIBPAL16L8-10M, TIBPAL16R4-10M
HIGH-PERFORMANCE IMPACT-X PAL
SRPS006D – D3115, MAY 1988 – REVISED MARCH 1992
TIBPAL16L8
CIRCUITS
OE
CLK
10 16
I
16 x
&
32 X 64
166
TIBPAL16R4
EN
1
O
O
I/O
I/O
I/O
I/O
I/O
I/O
EN 2
C1
denotes fused inputs
816
I
16 x
164
&
32 X 64
1D
I = 0
Q
Q
Q
Q
I/O
I/O
I/O
I/O
1
1
EN
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TIBPAL16R6-7C, TIBPAL16R8-7C TIBPAL16R6-10M, TIBPAL16R8-10M HIGH-PERFORMANCE IMPACT-X PAL
SRPS006D – D3115, MAY 1988 – REVISED MARCH 1992
functional block diagrams (positive logic)
CIRCUITS
TIBPAL16R6
OE
CLK
816
I
16 x
162
&
32 X 64
EN 2
C1
1D
I = 0
Q
Q
Q
Q
Q
Q
I/O
I/O
1
1
EN
OE
CLK
denotes fused inputs
816
I
16 x
168
TIBPAL16R8
&
32 X 64
EN 2
C1
1D
I = 0
Q
Q
Q
Q
Q
Q
Q
Q
1
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logic diagram (positive logic)
I
First Fuse Numbers
I
I
I
I
I
I
I
I
0 4 8 12 16 20 24 28 31
0 32 64 96
128 160 192 224
256 288 320 352 384 416 448 480
512 544 576 608 640 672 704 736
768 800 832 864 896 928 960 992
1024 1056 1088 1120 1152 1184 1216 1248
1280 1312 1344 1376 1408 1440 1472 1504
1536 1568 1600 1632 1664 1696 1728 1760
1792 1824 1856 1888 1920 1952 1984 2016
HIGH-PERFORMANCE IMPACT-XPAL
SRPS006D – D3115, MAY 1988 – REVISED MARCH 1992
Increment
TIBPAL16L8-7C
TIBPAL16L8-10M
CIRCUITS
19
O
18
I/O
17
I/O
16
I/O
15
I/O
14
I/O
13
I/O
12
O
11
I
Fuse number = First fuse number + Increment
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TIBPAL16R4-7C TIBPAL16R4-10M HIGH-PERFORMANCE IMPACT-XPAL
SRPS006D – D3115, MAY 1988 – REVISED MARCH 1992
logic diagram (positive logic)
CLK
First Fuse Numbers
I
I
I
I
I
I
I
I
0 4812 16 20 24 28 31
0 32 64 96
128 160 192 224
256 288 320 352 384 416 448 480
512 544 576 608 640 672 704 736
768 800 832 864 896 928 960 992
1024 1056 1088 1120 1152 1184 1216 1248
1280 1312 1344 1376 1408 1440 1472 1504
1536 1568 1600 1632 1664 1696 1728 1760
1792 1824 1856 1888 1920 1952 1984 2016
Fuse number = First fuse number + Increment
Increment
CIRCUITS
I = 0
1D
I = 0
1D
I = 0
1D
I = 0
1D
C1
C1
C1
C1
19
18
17
16
15
14
13
12
11
I/O
I/O
Q
Q
Q
Q
I/O
I/O
OE
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logic diagram (positive logic)
CLK
First Fuse Numbers
I
I
I
I
I
I
I
I
Fuse number = First fuse number + Increment
0 4 8 12 16 20 24 28 31
0 32 64 96
128 160 192 224
256 288 320 352 384 416 448 480
512 544 576 608 640 672 704 736
768 800 832 864 896 928 960 992
1024 1056 1088 1120 1152 1184 1216 1248
1280 1312 1344 1376 1408 1440 1472 1504
1536 1568 1600 1632 1664 1696 1728 1760
1792 1824 1856 1888 1920 1952 1984 2016
HIGH-PERFORMANCE IMPACT-XPAL
SRPS006D – D3115, MAY 1988 – REVISED MARCH 1992
Increment
TIBPAL16R6-7C
TIBPAL16R6-10M
CIRCUITS
19
I/O
I = 0
1D
C1
I = 0
1D
C1
I = 0
1D
C1
I = 0
1D
C1
I = 0
1D
C1
I = 0
1D
C1
18
17
16
15
14
13
12
11
Q
Q
Q
Q
Q
Q
I/O
OE
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TIBPAL16R8-7C TIBPAL16R8-10M HIGH-PERFORMANCE IMPACT-XPAL
SRPS006D – D31 15, MAY 1988 – REVISED MARCH 1992
logic diagram (positive logic)
CLK
First Fuse Numbers
I
I
I
I
I
I
I
I
0 4 8 12 16 20 24 28 31
0 32 64 96
128 160 192 224
256 288 320 352 384 416 448 480
512 544 576 608 640 672 704 736
768 800 832 864 896 928 960 992
1024 1056 1088 1120 1152 1184 1216 1248
1280 1312 1344 1376 1408 1440 1472 1504
1536 1568 1600 1632 1664 1696 1728 1760
1792 1824 1856 1888 1920 1952 1984 2016
Fuse number = First fuse number + Increment
Increment
CIRCUITS
I = 0
1D
I = 0
1D
I = 0
1D
I = 0
1D
I = 0
1D
I = 0
1D
I = 0
1D
I = 0
1D
C1
C1
C1
C1
C1
C1
C1
C1
19
18
17
16
15
14
13
12
11
Q
Q
Q
Q
Q
Q
Q
Q
OE
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TIBPAL16L8-7C, TIBPAL16R4-7C, TIBPAL16R6-7C, TIBPAL16R8-7C
HIGH-PERFORMANCE IMPACT-X PAL
SRPS006D – D3115, MAY 1988 – REVISED MARCH 1992
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage, VCC (see Note 1) 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage (see Note 1) 5.5 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Voltage applied to disabled output (see Note 1) 5.5 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating free-air temperature range 0°C to 75°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range –65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
NOTE 1: These ratings apply except for programming pins during a programming cycle.
recommended operating conditions
MIN NOM MAX UNIT
V
CC
V
IH
V
IL
I
OH
I
OL
f
clock
w
t
su
t
T
A
NOTE 2: These are absolute voltage levels with respect to the ground pin of the device and include all overshoots due to system and/or tester
Supply voltage 4.75 5 5.25 V High-level input voltage (see Note 2) 2 5.5 V Low-level input voltage (see Note 2) 0.8 V High-level output current –3.2 mA Low-level output current 24 mA Clock frequency 0 100 MHz
Pulse duration, clock (see Note 2)t Setup time, input or feedback before clock 7 ns
Hold time, input or feedback after clock 0 ns Operating free-air temperature 0 25 75 °C
noise. Testing these parameters should not be attempted without suitable equipment.
High 5 Low 5
CIRCUITS
ns
electrical characteristics over recommended operating free-air temperature range
PARAMETER TEST CONDITIONS MIN TYP†MAX UNIT
V
IK
V
OH
V
OL
I
OZH
I
OZL
I
I
I
IH
I
IL
I
OS
I
CC
C
i
C
C
clk
All typical values are at VCC = 5 V, TA = 25°C.
I/O leakage is the worst case of I
Not more than one output should be shorted at a time, and the duration of the short circuit should not exceed one second. VO is set at 0.5 V to avoid test problems caused by test equipment ground degradation.
VCC = 4.75 V, II = –18 mA –0.8 –1.5 V VCC = 4.75 V, IOH = –3.2 mA 2.4 3.2 V VCC = 4.75 V, IOL = 24 mA 0.3 0.5 V VCC = 5.25 V, VO = 2.7 V 100 µA VCC = 5.25 V, VO = 0.4 V –100 µA VCC = 5.25 V, VI = 5.5 V 100 µA VCC = 5.25 V, VI = 2.7 V 25 µA VCC = 5.25 V, VI = 0.4 V –80 –250 µA VCC = 5.25 V, VO = 0.5 V –30 –70 –130 mA VCC = 5.25 V, VI = 0, Outputs open 160 180 mA f = 1 MHz, VI = 2 V 5 pF f = 1 MHz, VO = 2 V 6 pF f = 1 MHz, V
and IIL or I
OZL
OZH
= 2 V 6 pF
CLK
and IIH respectively.
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
TIBPAL16L8-7C, TIBPAL16R4-7C, TIBPAL16R6-7C, TIBPAL16R8-7C HIGH-PERFORMANCE IMPACT-X PAL
SRPS006D – D3115, MAY 1988 – REVISED MARCH 1992
switching characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
f
max
pd
t
pd
t
pd
t
en
t
dis
t
en
t
dis
t
sk(o)
All typical values are at VCC = 5 V, TA = 25°C.
See section for f
This parameter applies to TIBPAL16R4’ and TIBPAL16R6’ only (see Figure 4 for illustration) and is calculated from the measured f feedback in the counter configuration.
This parameter is the measurement of the difference between the fastest and slowest tpd (CLK-to-Q) observed when multiple registered outputs are switching in the same direction.
max
FROM
(INPUT)
without feedback 100
with internal feedback
(counter configuration) with external feedback 74
I, I/O
CLK Q R2 = 390 Ω, 2 4 6.5 ns CLK Feedback input See Figure 6 3 ns
OE Q 4 7.5 ns OE Q 4 7.5 ns I, I/O O, I/O 6 9 ns I, I/O O, I/O 6 9 ns
Skew between registered outputs 0.5 ns
specifications.
O, I/Ot
CIRCUITS
TO
(OUTPUT)
1 or 2 outputs switching 3 5.5 7
8 outputs switching R1 = 200 Ω, 3 6 7.5
TEST CONDITION MIN TYP†MAX UNIT
100 MHz
max
ns
with internal
10
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
TIBPAL16L8-10M, TIBPAL16R4-10M, TIBPAL16R6-10M, TIBPAL16R8-10M
HIGH-PERFORMANCE IMPACT-X PAL
SRPS006D – D3115, MAY 1988 – REVISED MARCH 1992
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage, VCC (see Note 1) 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage (see Note 1) 5.5 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Voltage applied to disabled output (see Note 1) 5.5 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating free-air temperature range –55°C to 125°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range –65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
NOTE 1: These ratings apply except for programming pins during a programming cycle.
recommended operating conditions
MIN NOM MAX UNIT
V
CC
V
IH
V
IL
I
OH
I
OL
f
clock w
t
su
t
T
A
NOTE 2: These are absolute voltage levels with respect to the ground pin of the device and include all overshoots due to system and/or tester
Supply voltage 4.5 5 5.5 V High-level input voltage 2 5.5 V Low-level input voltage 0.8 V High-level output current –2 mA Low-level output current 12 mA
Clock frequency 0 62.5 MHz Pulse duration, clock (see Note 2)t Setup time, input or feedback before clock 10 ns
Hold time, input or feedback after clock 0 ns Operating free-air temperature –55 25 125 °C
noise. Testing these parameters should not be attempted without suitable equipment.
High 8 Low 8
CIRCUITS
ns
electrical characteristics over recommended operating free-air temperature range
PARAMETER TEST CONDITIONS MIN TYP†MAX UNIT
V
IK
V
OH
V
OL
I
OZH
0, Q outputs –0.1
I
OZL
I
I
I
IH
I
IL
I
OS
I
CC
C
i
C
C
clk/oe
All typical values are at VCC = 5 V, TA = 25°C.
I/O leakage is the worst case of I
Not more than one output should be shorted at a time, and the duration of the short circuit should not exceed one second. VO is set at 0.5 V to avoid test problems caused by test equipment ground degradation.
I/O ports –0.25
I/O ports 100 All others 25
VCC = 4.5 V, II = –18 mA –0.8 –1.5 V VCC = 4.5 V, IOH = –2 mA 2.4 3.2 V VCC = 4.5 V, IOL = 12 mA 0.3 0.5 V
VCC = 5.5 V, VO = 2.7 V 100 µA
VCC = 5.5 V, VCC = 5.5 V, VI = 5.5 V 1 mA
VCC = 5.5 V, VCC = 5.5 V, VI = 0.4 V –0.08 –0.25 mA
VCC = 5.5 V, VO = 0.5 V –30 –70 –130 mA VCC = 5.5 V, VI = GND, Outputs open 140 200 mA f = 1 MHz, VI = 2 V 5 pF f = 1 MHz, VO = 2 V 6 pF f = 1 MHz, V
and IIL or I
OZL
OZH
VO = 0.4 V
= 2 V 6 pF
CLK/OE
and IIH respectively.
mA
µAVI = 2.7 V
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11
TIBPAL16L8-10M, TIBPAL16R4-10M, TIBPAL16R6-10M, TIBPAL16R8-10M HIGH-PERFORMANCE IMPACT-X PAL
SRPS006C – D31 15, MAY 1988 – REVISED OCTOBER 1990
switching characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
f
max
t
pd
t
pd
t
pd
t
en
t
dis
t
en
t
dis
All typical values are at VCC = 5 V, TA = 25°C. See section for f section. This parameter applies to TIBPAL16R4’ and TIBPAL16R6’ only (see Figure 4 for illustration) and is calculated from the measured f feedback in the counter configuration.
max
FROM
(INPUT)
without feedback 62.5
with internal feedback
(counter configuration) with external feedback 52.5
I, I/O O, I/O R1 = 390 Ω, 2 6 10 ns
CLK Q R2 = 750 , 1 4 9 ns CLK Feedback input See Figure 6 5 ns
OE Q 1 4 10 ns OE Q 1 4 10 ns I, I/O O, I/O 2 6 12 ns I, I/O O, I/O 1 6 10 ns
specifications. f
with external feedback is not production tested but is calculated from the equation found in the f
max
TO
(OUTPUT)
CIRCUITS
TEST CONDITION MIN TYP†MAX UNIT
62.5 MHz
with internal
max
max
12
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TIBPAL16L8-7C, TIBPAL16R4-7C, TIBPAL16R6-7C, TIBPAL16R8-7C
TIBPAL16L8-10M, TIBPAL16R4-10M, TIBPAL16R6-10M, TIBPAL16R8-10M
HIGH-PERFORMANCE IMPACT-X PAL
SRPS006D – D3115, MAY 1988 – REVISED MARCH 1992
programming information
Texas Instruments programmable logic devices can be programmed using widely available software and inexpensive device programmers.
Complete programming specifications, algorithms, and the latest information on hardware, software, and firmware are available upon request. Information on programmers capable of programming T exas Instruments programmable logic is also available, upon request, from the nearest TI field sales office, local authorized TI distributor, or by calling Texas Instruments at (214) 997-5666.
preload procedure for registered outputs (see Figure 1 and Note 3)
The output registers can be preloaded to any desired state during device testing. This permits any state to be tested without having to step through the entire state-machine sequence. Each register is preloaded individually by following the steps given below.
Step 1. With V
at 5 volts and Pin 1 at VIL, raise Pin 11 to V
CC
Step 2. Apply either VIL or VIH to the output corresponding to the register to be preloaded. Step 3. Pulse Pin 1, clocking in preload data. Step 4. Remove output voltage, then lower Pin 11 to VIL. Preload can be verified by observing the
voltage level at the output pin.
Pin 11
t
Pin 1
t
d
su
t
w
.
IHH
t
d
CIRCUITS
V
IHH
V
IL
V
IH
V
IL
Registered I/O Input Output
NOTE 3: td = tsu = th = 100 ns to 1000 ns V
Figure 1. Preload Waveforms
= 10.25 V to 10.75 v
IHH
V
IH
V
IL
V
OH
V
OL
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13
TIBPAL16L8-7C, TIBPAL16R4-7C, TIBPAL16R6-7C, TIBPAL16R8-7C TIBPAL16L8-10M, TIBPAL16R4-10M, TIBPAL16R6-10M, TIBPAL16R8-10M
4 V
CIRCUITS
t
pd
(600 ns TYP, 1000 ns MAX)
1.5 V
1.5 V
t
w
t
su
1.5 V
HIGH-PERFORMANCE IMPACT-X PAL
SRPS006D – D3115, MAY 1988 – REVISED MARCH 1992
power-up reset (see Figure 2)
Following power up, all registers are reset to zero. This feature provides extra flexibility to the system designer and is especially valuable in simplifying state-machine initialization. To ensure a valid power-up reset, it is important that the rise of VCC be monotonic. Following power-up reset, a low-to-high clock transition must not occur until all applicable input and feedback setup times are met.
V
CC
Active Low
Registered Output
CLK
5 V
V
V
V
V
OH
OL
IH
IL
This is the power-up reset time and applies to registered outputs only. The values shown are from characterization data.
This is the setup time for input or feedback.
Figure 2. Power-Up Reset Waveforms
14
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
TIBPAL16L8-7C, TIBPAL16R4-7C, TIBPAL16R6-7C, TIBPAL16R8-7C
TIBPAL16L8-10M, TIBPAL16R4-10M, TIBPAL16R6-10M, TIBPAL16R8-10M
HIGH-PERFORMANCE IMPACT-X PAL
SRPS006D – D3115, MAY 1988 – REVISED MARCH 1992
f
SPECIFICATIONS
max
without feedback, see Figure 3
f
max
In this mode, data is presented at the input to the flip-flop and clocked through to the Q output with no feedback. Under this condition, the clock period is limited by the sum of the data setup time and the data hold time (t However, the minimum f
f
Thus,
without feedback
max
is determined by the minimum clock period (tw high + tw low).
max
+
(twhigh
1
)
twlow)
CLK
or
1
(tsu)
th)
.
CIRCUITS
su
+ th).
f
with internal feedback, see Figure 4
max
LOGIC
ARRAY
tsu + t
tw high + tw low
Figure 3. f
h
or
Without Feedback
max
C1
1D
This configuration is most popular in counters and on-chip state-machine designs. The flip-flop inputs are defined by the device inputs and flip-flop outputs. Under this condition, the period is limited by the internal delay from the flip-flop outputs through the internal feedback and logic array to the inputs of the next flip-flop.
Thus,
f
with internal feedback
max
+
(tsu)
1
tpdCLK*to*FB)
.
Where tpd CLK-to-FB is the deduced value of the delay from CLK to the input of the logic array.
CLK
LOGIC
ARRAY
C1
1D
t
su
Figure 4. f
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
With Internal Feedback
max
tpd CLK-to-FB
15
TIBPAL16L8-7C, TIBPAL16R4-7C, TIBPAL16R6-7C, TIBPAL16R8-7C TIBPAL16L8-10M, TIBPAL16R4-10M, TIBPAL16R6-10M, TIBPAL16R8-10M HIGH-PERFORMANCE IMPACT-X PAL
SRPS006D – D3115, MAY 1988 – REVISED MARCH 1992
with external feedback, see Figure 5
f
max
This configuration is a typical state-machine design with feedback signals sent off-chip. This external feedback could go back to the device inputs or to a second device in a multi-chip state machine. The slowest path defining the period is the sum of the clock-to-output time and the input setup time for the external signals
+ tpd CLK-to-Q).
(t
su
f
Thus,
with external feedback
max
CIRCUITS
f
SPECIFICATIONS
max
+
(tsu)
CLK
tpdCLK*to*Q)
1
.
LOGIC
ARRAY
t
su
Figure 5. f
C1
1D
tpd CLK-to-Q t
With External Feedback
max
NEXT DEVICE
su
16
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
TIBPAL16L8-7C, TIBPAL16R4-7C, TIBPAL16R6-7C, TIBPAL16R8-7C
TIBPAL16L8-10M, TIBPAL16R4-10M, TIBPAL16R6-10M, TIBPAL16R8-10M
HIGH-PERFORMANCE IMPACT-X PAL
SRPS006D – D3115, MAY 1988 – REVISED MARCH 1992
PARAMETER MEASUREMENT INFORMATION
5 V
S1
R1
From Output Under Test
Test Point
CIRCUITS
Timing
Input
Data
Input
Input
In-Phase
Output
Out-of-Phase
Output
(see Note D)
1.5 V
t
su
1.5 V
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
1.5 V 1.5 V
t
pd
1.5 V
t
pd
1.5 V 1.5 V
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
1.5 V
(see Note A)
(3.5 V) [3 V]
(0.3 V) [0]
t
h
(3.5 V) [3 V]
(0.3 V) [0]
(3.5 V) [3 V]
(0.3 V) [0]
t
pd
V
OH
1.5 V V
OL
t
pd
V
OH
V
OL
C
L
LOAD CIRCUIT FOR
3-STATE OUTPUTS
High-Level
Output
Control
(low-level
enabling)
Waveform 1
S1 Closed
(see Note B)
Waveform 2
S1 Open
(see Note B)
R2
(3.5 V) [3 V]
Pulse
Low-Level
Pulse
VOLTAGE WAVEFORMS
t
en
1.5 V 1.5 V
t
w
1.5 V 1.5 V
PULSE DURATIONS
1.5 V 1.5 V
t
dis
(0.3 V) [0]
(3.5 V) [3 V]
(0.3 V) [0]
(3.5 V) [3 V]
(0.3 V) [0]
3.3 V
1.5 V
t
t
en
dis
1.5 V
VOL +0.5 V
V
V
VOH –0.5 V
0 V
ENABLE AND DISABLE TIMES, 3-STATE OUTPUTS
VOLTAGE WAVEFORMS
OL
OH
NOTES: A. CL includes probe and jig capacitance and is 50 pF for tpd and ten, 5 pF for t
B. W aveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2
is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses have the following characteristics: For C suffix, use the voltage levels indicated in parentheses ( ), PRR 1 MHz,
tr = tf = 2 ns, duty cycle = 50%; For M suffix, use the voltage levels indicated in brackets [ ], PRR 10 MHz, tr and tf 2 ns, duty
cycle = 50% D. When measuring propagation delay times of 3-state outputs, switch S1 is closed. E. Equivalent loads may be used for testing.
Figure 6. Load Circuit and Voltage Waveforms
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
dis
.
17
TIBPAL16L8-7C, TIBPAL16R4-7C, TIBPAL16R6-7C, TIBPAL16R8-7C TIBPAL16L8-10M, TIBPAL16R4-10M, TIBPAL16R6-10M, TIBPAL16R8-10M HIGH-PERFORMANCE IMPACT-X PAL
SRPS006D – D3115, MAY 1988 – REVISED MARCH 1992
TYPICAL CHARACTERISTICS
SUPPLY CURRENT
vs
FREE-AIR TEMPERATURE
220
CIRCUITS
PROPAGATION DELAY TIME
SUPPLY VOLTAGE
vs
200
180
160
140
– Supply Current – mA
CC
I
120
100
–75 –50 –25 0 25 50
TA – Free-Air Temperature – °C
Figure 7
PROPAGATION DELAY TIME
FREE-AIR TEMPERATURE
vs
t
(I, I/O to O, I/O)
PHL
75 100 125
TA = 25 °C
Propagation Delay Time – ns
CL = 50 pF R1 = 200
R2 = 390 1 Output Switching
4.5 4.75 5
PROPAGATION DELAY TIME
16
VCC = 5 V TA = 25 °C
14
R1 = 200 R2 = 390
1 Output Switching
12
t
(I, I/O to O, I/O)
PHL
t
(I, I/O to O, I/O)
PLH
t
(CLK to Q)
PHL
t
(CLK to Q)
PLH
VCC – Supply Voltage – V
5.25 5.5
Figure 8
vs
LOAD CAPACITANCE
18
Propagation Delay Time – ns
–75 –50 –25 0 25 50
t
(CLK to Q)
PHL
VCC = 5 V CL = 50 pF R1 = 200 R2 = 390
1 Output Switching
TA – Free-Air Temperature – °C
Figure 9
t
(I, I/O to O, I/O)
PLH
t
PLH
(CLK to Q)
75 100 125
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
10
t
PHL
Propagation Delay Time – ns
100 200 300 400
0 600
CL – Load Capacitance – pF
t
PLH
t
t
(CLK to Q)
PHL
(I, I/O to O, I/O)
(I, I/O to O, I/O)
Figure 10
(CLK to Q)
PLH
500
1000
900
VCC = 5 V
TA = 0 °C
TIBPAL16L8-7C, TIBPAL16R4-7C, TIBPAL16R6-7C, TIBPAL16R8-7C
TIBPAL16L8-10M, TIBPAL16R4-10M, TIBPAL16R6-10M, TIBPAL16R8-10M
CIRCUITS
TYPICAL CHARACTERISTICS
POWER DISSIPATION
vs
FREQUENCY
8-BIT COUNTER MODE
HIGH-PERFORMANCE IMPACT-X PAL
SRPS006D – D3115, MAY 1988 – REVISED MARCH 1992
PROPAGATION DELAY TIME
vs
NUMBER OF OUTPUTS SWITCHING
0.8 VCC = 5 V TA = 25 °C
0.7
R1 = 200 R2 = 390 CL = 50 pF
0.6 8-Bit Counter
0.5
800
– Power Dissipation – mW
700
D
P
600
1 4 10 40 100
TA = 25 °C
TA = 80 °C
F – Frequency – MHz
Figure 11
NUMBER OF OUTPUTS SWITCHING
t
PLH
0.4
0.3
0.2
– Skew Between Outputs Switching – ns
0.1
skew
t
PROPAGATION DELAY TIME
vs
t
(I, I/O to O, I/O)
PHL
(I, I/O to O, I/O)
23 4 56
Number of Outputs Switching
Figure 12
78
Propagation Delay Time – ns
012345
Outputs switching in the same direction (t
t
PHL
t
(CLK to Q)
PLH
VCC = 5 V TA = 25 °C CL = 50 pF R1 = 200 R2 = 390
Number of Outputs Switching
Figure 13
PLH compared to
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
t
PLH/tPHL to
t
PHL)
(CLK to Q)
678
19
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1992 T exas Instruments Incorporated
Printed in U.S.A.
D0892
SRPS006D
PACKAGE OPTION ADDENDUM
www.ti.com
4-Mar-2005
PACKAGING INFORMATION
Orderable Device Status
(1)
Package
Type
Package Drawing
Pins Package
Qty
Eco Plan
5962-85155172A ACTIVE LCCC FK 20 1 None Call TI Level-NC-NC-NC 5962-8515517RA ACTIVE CDIP J 20 1 None Call TI Level-NC-NC-NC 5962-8515517SA ACTIVE CFP W 20 1 None Call TI Level-NC-NC-NC
5962-85155182A ACTIVE LCCC FK 20 1 None Call TI Level-NC-NC-NC 5962-8515518RA ACTIVE CDIP J 20 1 None Call TI Level-NC-NC-NC 5962-8515518SA ACTIVE CFP W 20 1 None Call TI Level-NC-NC-NC
5962-85155192A ACTIVE LCCC FK 20 1 None Call TI Level-NC-NC-NC 5962-8515519RA ACTIVE CDIP J 20 1 None Call TI Level-NC-NC-NC 5962-8515519SA ACTIVE CFP W 20 1 None Call TI Level-NC-NC-NC
5962-85155202A LIFEBUY LCCC FK 20 1 None Call TI Level-NC-NC-NC 5962-8515520RA LIFEBUY CDIP J 20 1 None Call TI Level-NC-NC-NC 5962-8515520SA LIFEBUY CFP W 20 1 None Call TI Level-NC-NC-NC
TIBPAL16L8-10MFKB ACTIVE LCCC FK 20 1 None Call TI Level-NC-NC-NC
TIBPAL16L8-10MJB ACTIVE CDIP J 20 1 None Call TI Level-NC-NC-NC
TIBPAL16L8-10MWB ACTIVE CFP W 20 1 None Call TI Level-NC-NC-NC
TIBPAL16L8-7CFN ACTIVE PLCC FN 20 46 None Call TI Level-1-220-UNLIM
TIBPAL16L8-7CN ACTIVE PDIP N 20 20 None Call TI Level-NC-NC-NC
TIBPAL16R4-10MFKB LIFEBUY LCCC FK 20 1 None Call TI Level-NC-NC-NC
TIBPAL16R4-10MJB LIFEBUY CDIP J 20 1 None Call TI Level-NC-NC-NC
TIBPAL16R4-10MWB LIFEBUY CFP W 20 1 None Call TI Level-NC-NC-NC
TIBPAL16R4-7CFN OBSOLETE PLCC FN 20 None Call TI Call TI
TIBPAL16R4-7CN OBSOLETE PDIP N 20 None Call TI Call TI
TIBPAL16R6-10MFKB ACTIVE LCCC FK 20 1 None Call TI Level-NC-NC-NC
TIBPAL16R6-10MJB ACTIVE CDIP J 20 1 None Call TI Level-NC-NC-NC
TIBPAL16R6-10MWB ACTIVE CFP W 20 1 None Call TI Level-NC-NC-NC
TIBPAL16R6-7CFN ACTIVE PLCC FN 20 46 None Call TI Level-1-220-UNLIM
TIBPAL16R6-7CN NRND PDIP N 20 20 None Call TI Level-NC-NC-NC
TIBPAL16R8-10MFKB ACTIVE LCCC FK 20 1 None Call TI Level-NC-NC-NC
TIBPAL16R8-10MJB ACTIVE CDIP J 20 1 None Call TI Level-NC-NC-NC
TIBPAL16R8-10MWB ACTIVE CFP W 20 1 None Call TI Level-NC-NC-NC
TIBPAL16R8-7CFN OBSOLETE PLCC FN 20 None Call TI Call TI
TIBPAL16R8-7CN OBSOLETE PDIP N 20 None Call TI Call TI
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device.
(2)
Lead/Ball Finish MSL Peak Temp
(3)
(2)
Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional
product content details.
None: Not yet available Lead (Pb-Free). Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens, including bromine (Br) or antimony (Sb) above 0.1% of total product weight.
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
4-Mar-2005
Addendum-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty . Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
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Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.
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Products Applications
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DSP dsp.ti.com Broadband www.ti.com/broadband Interface interface.ti.com Digital Control www.ti.com/digitalcontrol Logic logic.ti.com Military www.ti.com/military Power Mgmt power.ti.com Optical Networking www.ti.com/opticalnetwork Microcontrollers microcontroller.ti.com Security www.ti.com/security
Telephony www.ti.com/telephony Video & Imaging www.ti.com/video Wireless www.ti.com/wireless
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