C SUFFIX . . . FN PACKAGE
M SUFFIX . . . FK PACKAGE
I
I
I
I
I
Pin assignments in operating mode
10
TIBPAL16L8’
(TOP VIEW)
I
I
3 2 1 20 19
4
5
6
7
8
910111213
I
GND
V
20
CC
O
19
I/O
18
I/O
17
I/O
16
15
I/O
14
I/O
13
I/O
12
O
11
I
CC
I
O
V
I/O
18
I/O
17
I/O
16
I/O
15
I/O
14
I
O
I/O
These programmable array logic devices feature high speed and functional equivalency when compared with
currently available devices. These IMPACT-X circuits combine the latest Advanced Low-Power Schottky
technology with proven titanium-tungsten fuses to provide reliable, high-performance substitutes for
conventional TTL logic. Their easy programmability allows for quick design of custom functions and typically
results in a more compact circuit board. In addition, chip carriers are available for futher reduction in board
space.
All of the register outputs are set to a low level during power-up. Extra circuitry has been provided to allow loading
of each register asynchronously to either a high or low state. This feature simplifies testing because the registers
can be set to an initial state prior to executing the test sequence.
The TIBPAL16’ C series is characterized from 0°C to 75°C. The TIBPAL16’ M series is characterized for
operation over the full military temperature range of –55°C to 125°C.
These devices are covered by U.S. Patent 4,410,987.
IMPACT-X is a trademark of Texas Instruments Incorporated.
PAL is a registered trademark of Advanced Micro Devices Inc.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
Copyright 1992, Texas Instruments Incorporated
1
TIBPAL16R4-7C, TIBPAL16R6-7C, TIBPAL16R8-7C
TIBPAL16R4-10M, TIBPAL16R6-10M, TIBPAL16R8-10M
HIGH-PERFORMANCE IMPACT-X PAL
SRPS006D – D3115, MAY 1988 – REVISED MARCH 1992
CIRCUITS
TIBPAL16R4’
C SUFFIX . . . J OR N PACKAGE
M SUFFIX . . . J PACKAGE
(TOP VIEW)
CLK
1
I
2
I
3
I
4
I
5
I
6
I
7
I
8
I
9
GND
C SUFFIX . . . J OR N PACKAGE
M SUFFIX . . . J PACKAGE
GND
CLK
I
I
I
I
I
I
I
I
10
TIBPAL16R6’
(TOP VIEW)
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
20
19
18
17
16
15
14
13
12
11
V
I/O
I/O
Q
Q
Q
Q
I/O
I/O
OE
V
I/O
Q
Q
Q
Q
Q
Q
I/O
OE
CC
CC
TIBPAL16R4’
C SUFFIX . . . FN PACKAGE
M SUFFIX . . . FK PACKAGE
(TOP VIEW)
CC
I
CLK
I/O
V
18
17
16
15
14
3 2 1 20 19
I
4
I
5
I
6
I
7
I
8
910111213
I
I
I/O
I/O
OE
GND
TIBPAL16R6’
C SUFFIX . . . FN PACKAGE
M SUFFIX . . . FK PACKAGE
(TOP VIEW)
I
GND
CLK
OE
CC
V
I/O
I/O
18
17
16
15
14
Q
3 2 1 20 19
I
4
I
5
I
6
I
7
I
8
910111213
I
I
I/O
Q
Q
Q
Q
Q
Q
Q
Q
Q
TIBPAL16R8’
C SUFFIX . . . J OR N PACKAGE
M SUFFIX . . . J PACKAGE
(TOP VIEW)
CLK
1
I
2
I
3
I
4
I
5
I
6
I
7
I
8
I
9
GND
Pin assignments in operating mode
2
10
V
20
CC
Q
19
Q
18
Q
17
Q
16
15
Q
14
Q
13
Q
12
Q
11
OE
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TIBPAL16R8’
C SUFFIX . . . FN PACKAGE
M SUFFIX . . . FK PACKAGE
(TOP VIEW)
I
GND
CLK
OE
CC
V
Q
Q
18
17
16
15
14
Q
3 2 1 20 19
I
4
I
5
I
6
I
7
I
8
910111213
I
I
Q
Q
Q
Q
Q
functional block diagrams (positive logic)
TIBPAL16L8-7C, TIBPAL16R4-7C
TIBPAL16L8-10M, TIBPAL16R4-10M
HIGH-PERFORMANCE IMPACT-X PAL
SRPS006D – D3115, MAY 1988 – REVISED MARCH 1992
TIBPAL16L8 ’
CIRCUITS
OE
CLK
1016
I
16 x
&
32 X 64
166
TIBPAL16R4’
7
7
7
7
7
7
7
7
6
EN
≥1
O
O
I/O
I/O
I/O
I/O
I/O
I/O
EN 2
C1
denotes fused inputs
816
I
16 x
4
164
&
32 X 64
1D
I = 0
2
Q
Q
Q
Q
I/O
I/O
I/O
I/O
8
8
8
8
7
7
7
7
4
≥1
≥1
EN
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
3
TIBPAL16R6-7C, TIBPAL16R8-7C
TIBPAL16R6-10M, TIBPAL16R8-10M
HIGH-PERFORMANCE IMPACT-X PAL
SRPS006D – D3115, MAY 1988 – REVISED MARCH 1992
functional block diagrams (positive logic)
CIRCUITS
TIBPAL16R6 ’
OE
CLK
816
I
16 x
6
162
&
32 X 64
EN 2
C1
1D
I = 0
2
Q
Q
Q
Q
Q
Q
I/O
I/O
8
8
8
8
8
8
7
7
2
≥1
≥1
EN
6
OE
CLK
denotes fused inputs
816
I
16 x
168
TIBPAL16R8’
&
32 X 64
EN 2
C1
1D
I = 0
2
Q
Q
Q
Q
Q
Q
Q
Q
8
8
8
8
8
8
8
8
8
≥1
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
logic diagram (positive logic)
1
I
First
Fuse
Numbers
2
I
3
I
4
I
5
I
6
I
7
I
8
I
9
I
048121620242831
0
32
64
96
128
160
192
224
256
288
320
352
384
416
448
480
512
544
576
608
640
672
704
736
768
800
832
864
896
928
960
992
1024
1056
1088
1120
1152
1184
1216
1248
1280
1312
1344
1376
1408
1440
1472
1504
1536
1568
1600
1632
1664
1696
1728
1760
1792
1824
1856
1888
1920
1952
1984
2016
HIGH-PERFORMANCE IMPACT-X PAL
SRPS006D – D3115, MAY 1988 – REVISED MARCH 1992
Increment
TIBPAL16L8-7C
TIBPAL16L8-10M
CIRCUITS
19
O
18
I/O
17
I/O
16
I/O
15
I/O
14
I/O
13
I/O
12
O
11
I
Fuse number = First fuse number + Increment
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
5
TIBPAL16R4-7C
TIBPAL16R4-10M
HIGH-PERFORMANCE IMPACT-X PAL
SRPS006D – D3115, MAY 1988 – REVISED MARCH 1992
logic diagram (positive logic)
1
CLK
First
Fuse
Numbers
2
I
3
I
4
I
5
I
6
I
7
I
8
I
9
I
048121620242831
0
32
64
96
128
160
192
224
256
288
320
352
384
416
448
480
512
544
576
608
640
672
704
736
768
800
832
864
896
928
960
992
1024
1056
1088
1120
1152
1184
1216
1248
1280
1312
1344
1376
1408
1440
1472
1504
1536
1568
1600
1632
1664
1696
1728
1760
1792
1824
1856
1888
1920
1952
1984
2016
Fuse number = First fuse number + Increment
Increment
CIRCUITS
I = 0
1D
I = 0
1D
I = 0
1D
I = 0
1D
C1
C1
C1
C1
19
18
17
16
15
14
13
12
11
I/O
I/O
Q
Q
Q
Q
I/O
I/O
OE
6
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
logic diagram (positive logic)
1
CLK
First
Fuse
Numbers
2
I
3
I
4
I
5
I
6
I
7
I
8
I
9
I
Fuse number = First fuse number + Increment
048121620242831
0
32
64
96
128
160
192
224
256
288
320
352
384
416
448
480
512
544
576
608
640
672
704
736
768
800
832
864
896
928
960
992
1024
1056
1088
1120
1152
1184
1216
1248
1280
1312
1344
1376
1408
1440
1472
1504
1536
1568
1600
1632
1664
1696
1728
1760
1792
1824
1856
1888
1920
1952
1984
2016
HIGH-PERFORMANCE IMPACT-X PAL
SRPS006D – D3115, MAY 1988 – REVISED MARCH 1992
Increment
TIBPAL16R6-7C
TIBPAL16R6-10M
CIRCUITS
19
I/O
I = 0
1D
C1
I = 0
1D
C1
I = 0
1D
C1
I = 0
1D
C1
I = 0
1D
C1
I = 0
1D
C1
18
17
16
15
14
13
12
11
Q
Q
Q
Q
Q
Q
I/O
OE
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
7
TIBPAL16R8-7C
TIBPAL16R8-10M
HIGH-PERFORMANCE IMPACT-X PAL
NOTE 1: These ratings apply except for programming pins during a programming cycle.
recommended operating conditions
MINNOMMAXUNIT
V
CC
V
IH
V
IL
I
OH
I
OL
f
clock
w
t
su
t
h
T
A
NOTE 2: These are absolute voltage levels with respect to the ground pin of the device and include all overshoots due to system and/or tester
Supply voltage4.7555.25V
High-level input voltage (see Note 2)25.5V
Low-level input voltage (see Note 2)0.8V
High-level output current–3.2mA
Low-level output current24mA
Clock frequency0100MHz
Pulse duration, clock (see Note 2)t
Setup time, input or feedback before clock↑7ns
Hold time, input or feedback after clock↑0ns
Operating free-air temperature02575°C
noise. Testing these parameters should not be attempted without suitable equipment.
High5
Low5
CIRCUITS
ns
electrical characteristics over recommended operating free-air temperature range
PARAMETERTEST CONDITIONSMIN TYP†MAXUNIT
V
IK
V
OH
V
OL
‡
I
OZH
‡
I
OZL
I
I
‡
I
IH
‡
I
IL
§
I
OS
I
CC
C
i
C
o
C
clk
†
All typical values are at VCC = 5 V, TA = 25°C.
‡
I/O leakage is the worst case of I
§
Not more than one output should be shorted at a time, and the duration of the short circuit should not exceed one second. VO is set at 0.5 V to
avoid test problems caused by test equipment ground degradation.
TIBPAL16L8-7C, TIBPAL16R4-7C, TIBPAL16R6-7C, TIBPAL16R8-7C
HIGH-PERFORMANCE IMPACT-X PAL
SRPS006D – D3115, MAY 1988 – REVISED MARCH 1992
switching characteristicsover recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted)
PARAMETER
‡
f
max
pd
t
pd
§
t
pd
t
en
t
dis
t
en
t
dis
¶
t
sk(o)
†
All typical values are at VCC = 5 V, TA = 25°C.
‡
See section for f
§
This parameter applies to TIBPAL16R4’ and TIBPAL16R6’ only (see Figure 4 for illustration) and is calculated from the measured f
feedback in the counter configuration.
¶
This parameter is the measurement of the difference between the fastest and slowest tpd (CLK-to-Q) observed when multiple registered outputs
are switching in the same direction.
Clock frequency062.5MHz
Pulse duration, clock (see Note 2)t
Setup time, input or feedback before clock↑10ns
Hold time, input or feedback after clock↑0ns
Operating free-air temperature–5525125°C
noise. Testing these parameters should not be attempted without suitable equipment.
High8
Low8
CIRCUITS
ns
electrical characteristics over recommended operating free-air temperature range
PARAMETERTEST CONDITIONSMIN TYP†MAXUNIT
V
IK
V
OH
V
OL
‡
I
OZH
0, Q outputs–0.1
‡
I
OZL
I
I
I
IH
‡
I
IL
I
OS
I
CC
C
i
C
o
C
clk/oe
†
All typical values are at VCC = 5 V, TA = 25°C.
‡
I/O leakage is the worst case of I
§
Not more than one output should be shorted at a time, and the duration of the short circuit should not exceed one second. VO is set at 0.5 V to
avoid test problems caused by test equipment ground degradation.
TIBPAL16L8-10M, TIBPAL16R4-10M, TIBPAL16R6-10M, TIBPAL16R8-10M
HIGH-PERFORMANCE IMPACT-X PAL
SRPS006C – D31 15, MAY 1988 – REVISED OCTOBER 1990
switching characteristicsover recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted)
PARAMETER
‡
f
max
t
pd
t
pd
§
t
pd
t
en
t
dis
t
en
t
†
‡
§
dis
All typical values are at VCC = 5 V, TA = 25°C.
See section for f
section.
This parameter applies to TIBPAL16R4’ and TIBPAL16R6’ only (see Figure 4 for illustration) and is calculated from the measured f
feedback in the counter configuration.
max
FROM
(INPUT)
without feedback62.5
with internal feedback
(counter configuration)
with external feedback52.5
Texas Instruments programmable logic devices can be programmed using widely available software and
inexpensive device programmers.
Complete programming specifications, algorithms, and the latest information on hardware, software, and
firmware are available upon request. Information on programmers capable of programming T exas Instruments
programmable logic is also available, upon request, from the nearest TI field sales office, local authorized TI
distributor, or by calling Texas Instruments at (214) 997-5666.
preload procedure for registered outputs (see Figure 1 and Note 3)
The output registers can be preloaded to any desired state during device testing. This permits any state to be
tested without having to step through the entire state-machine sequence. Each register is preloaded individually
by following the steps given below.
Step 1.With V
at 5 volts and Pin 1 at VIL, raise Pin 11 to V
CC
Step 2.Apply either VIL or VIH to the output corresponding to the register to be preloaded.
Step 3.Pulse Pin 1, clocking in preload data.
Step 4.Remove output voltage, then lower Pin 11 to VIL. Preload can be verified by observing the
Following power up, all registers are reset to zero. This feature provides extra flexibility to the system designer
and is especially valuable in simplifying state-machine initialization. To ensure a valid power-up reset, it is
important that the rise of VCC be monotonic. Following power-up reset, a low-to-high clock transition must not
occur until all applicable input and feedback setup times are met.
V
CC
Active Low
Registered Output
CLK
5 V
V
V
V
V
OH
OL
IH
IL
†
This is the power-up reset time and applies to registered outputs only. The values shown are from characterization data.
In this mode, data is presented at the input to the flip-flop and clocked through to the Q output with no feedback.
Under this condition, the clock period is limited by the sum of the data setup time and the data hold time (t
However, the minimum f
f
Thus,
without feedback
max
is determined by the minimum clock period (tw high + tw low).
max
+
(twhigh
1
)
twlow)
CLK
or
1
(tsu)
th)
.
CIRCUITS
su
+ th).
f
with internal feedback, see Figure 4
max
LOGIC
ARRAY
tsu + t
tw high + tw low
Figure 3. f
h
or
Without Feedback
max
C1
1D
This configuration is most popular in counters and on-chip state-machine designs. The flip-flop inputs are
defined by the device inputs and flip-flop outputs. Under this condition, the period is limited by the internal delay
from the flip-flop outputs through the internal feedback and logic array to the inputs of the next flip-flop.
Thus,
f
with internal feedback
max
+
(tsu)
1
tpdCLK*to*FB)
.
Where tpd CLK-to-FB is the deduced value of the delay from CLK to the input of the logic array.
This configuration is a typical state-machine design with feedback signals sent off-chip. This external feedback
could go back to the device inputs or to a second device in a multi-chip state machine. The slowest path defining
the period is the sum of the clock-to-output time and the input setup time for the external signals
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Lead/Ball Finish MSL Peak Temp
(3)
(2)
Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional
product content details.
None: Not yet available Lead (Pb-Free).
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
4-Mar-2005
Addendum-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,
enhancements, improvements, and other changes to its products and services at any time and to discontinue
any product or service without notice. Customers should obtain the latest relevant information before placing
orders and should verify that such information is current and complete. All products are sold subject to TI’s terms
and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI
deems necessary to support this warranty . Except where mandated by government requirements, testing of all
parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for
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TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,
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