Texas Instruments TECHNOLOGY FOR INNOVATORS 4Q User Manual

Technology for Innovators

Interface Selection Guide

4Q 2006

Interface Selection Guide

➔

Table of Contents

Introduction 3

LVDS, xECL, CML . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4

Multipoint-LVDS (M-LVDS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8

Digital Isolators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10

RS-485/422 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11

RS-232 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13

UARTs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16

CAN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18

FlatLink™3G . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19

SerDes (Serial Gigabit Transceivers and LVDS) . . . . . . . . . . . . . . . . . . . . . . . . . . .20

™

DVI/PanelBus

TMDS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24

USB Hub Controllers and Peripheral Devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25

USB Port Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26

USB Power Managers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27

PCI Express®. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .29

PCI Bridges . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33

CardBus Power Switches . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .34

1394 (FireWire®) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .36

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Check inter

face.ti.com

for the latest IBIS Models

and

evaluation modules

GTLP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .39

VME . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .41

Clock Distribution Circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .42

Cross-Reference Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .43

Device Index

Technical Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .48

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .47

(EVMs).

Interface Selection Guide Texas Instruments 4Q 2006

Interface Selection Guide

Introduction

Texas Instruments (TI) provides complete interface solutions that empower you to differentiate your products and accelerate time-to-market. Our expertise in high-speed, mixed-signal circuits, system-on-a-chip integration and advanced product development processes ensures you will

eceive the silicon, support tools, software and technical documentation to create and deliver the best products on time and at competitive prices.

ncluded in this selection guide you will find design considerations, technical overviews, graphic representation of portfolios, parametric tables

nd resource information on the following families of devices:

LVDS: (p. 4) TIA/EIA-644A specification

esigned for differential transmission delivering signaling rates into the Gbps range and power in the mW range with low EMI to the telecommunication and consumer markets.

xECL: (p. 4) Emitter coupled logic (xECL),

high-speed differential interface technology designed for low jitter and skew.

CML: (p. 4) Current-mode logic (CML), high

speed differential interface technology.

M-LVDS: (p. 8) TIA/EIA-899 specification with

all the benefits of LVDS applicable to multipoint bus architecture in backplanes. Used often for clock distribution, e.g. AdvancedTCA.

Digital Isolators: (p. 10) The new ISO72x

high-speed digital isolators use state-of-the-art integrated capacitive coupling and silicondioxide isolation barrier to provide up to 150-Mbps signaling rate with only 1-ns jitter, best-of-class noise immunity and high reliability.

RS-485/422: (p. 11) Robust TIA/EIA-485 and

TIA/ EIA-422 specifications specially designed for harsh, industrial environments transmitting a differential signal up to 50 Mbps or 1.2 km.

RS-232: (p. 13) TIA/EIA-232 specification

defining single-ended interface between data terminal equipment (DTE) and data circuitterminating equipment (DCE).

UARTs: (p. 16) Universal Asynchronous

Receiver/T nent of serial communication utilizing RS232, RS485/422 or LVDS transceivers to transmit or receive between remote devices performing parallel process and serial to parallel conversion in the receive process.

CAN: (p. 18) Controller Area Network

(ISO11898) specification commonly used in automotive and industrial applications describes differential signaling at a rate up to 1 Mbps on a 40-meter bus with multipoint topology.

ransmitters are the key logic compo

to serial conversion in the transmit

FlatLink™ 3G: (p. 19) A new family of serial-

zers and deserializers designed for mobile

phone displays.

SerDes: (p. 20) Serializers and deserializers

in the gigabit range designed to bridge large numbers of data bits over a small number of data lines in telecommunication applications.

DVI/PanelBus™: (p. 22) The Digital Visual

Interface Specification, DVI, is an industry standard developed by the Digital Display Working Group (DDWG) for high-speed digital connection to digital displays. DVI uses transition-minimized DC balanced (TMDS) data signaling.

TMDS: (p. 24) Transition minimized differential

signaling is the electrical interface used by DVI and HDMI.

USB Hub Controllers and Peripheral Devices:

established to make connecting PCs, peripherals and consumer electronics flexible and easy. The hub controller manages USB port connect/ disconnect activities and a peripheral controller enables USB connectivity of a peripheral device to either a host or hub.

USB Port Protection: (p. 26) Transient voltage

suppressor protects USB 1.1 devices from ESD and electrical noise transients.

USB Power Managers: (p. 27)

like TPS204xA and TPS205xA, are designed to

meet all the USB 1.0 and 2.0 requirements for current-limiting and power switching to reliably control the power on the voltage bus.

PCI Express®: (p. 29)

flexible and cost-effective I/O interconnect.

PCI Bridges: (p. 33) A peripheral component

interconnect (PCI) bridge provides a highperformance connection path between either two PCI buses or a PCI component and one or more DSP devices.

(p. 25) The USB standard was

A robust, scalable,

TI products,

CardBus Power Switches: (p. 34) The

ardBus controller uses the card detect and voltage sense pins to determine a PC card’s voltage requirements and then directs the PCMCIA power switch to enable the proper voltages. Standard PC cards require that V be switched between ground, 3.3 V, and 5 V, while VPP is switched between ground, 3.3 V, 5 V, and 12 V. CardBay sockets have the standard requirements for VCC, but require ground,

3.3 V, and 5 V to VPP, and ground, 1.8 V, or 3.3 V to V simply not need 12 V or VPP while still having the standard requirements for V consider the voltage requirements of the application when selecting a PCMCIA power switch.

1394: (p. 36) IEEE 1394 (FireWire®) high-speed

interconnection enables simple, low-cost, high-bandwidth, real-time data connectivity between computers, peripherals and consumer electronics.

GTLP: (p. 39) Gunning transceiver logic plus

(GTLP) derived from the JEDEC JESD8-3 GTL standard is a reduced-voltage-swing technology designed for high-speed interface between cards operating at LVTTL logic levels and backplanes operating at GTLP signal levels.

VME: (p. 41)

64-bit, backplane architecture that is coordinated and controlled by VITA. VME is used extensively in military applications.

Clock Distribution Circuits: (p. 42)

TI offers both single-ended and differential clock buffers that perform from below 200 MHz up to 3.5 GHz in a variety of fan-out options. In addition to simple option for customers needing differential signals (LVPECL) and single-ended signals (LVTTL/LVCMOS) from the same device.

. Other PC card applications may

CORE

The VMEbus™ is a standardized,

, industrial and aerospace

. Therefore,

➔

Texas Instruments 4Q 2006 Interface Selection Guide

LVDS2

VDS9637

LVDS34

Singles

Transmitters Receivers Transceivers Repeaters/

Translators

Crosspoint

Switches

Up to 400 Mbps Up to 630 Mbps ≥ 1 Gbps Clock Distribution Devices

(See pg. 42 for table)

LVDS388A

LVDS386

DCLVD110

VDS108

LVDS104 L

VDS105

VDS117

LVDS116

VDS9638

LVDS179 LVDS180

VDS049 LVDS050 LVDS051 LVDS1050

CML100 LVDS100 LVDS101 LVDS16 LVP16 LVDS17 LVP17 LVDS18 LVP18 LVDS19 LVP19 LVDS20 LVP20

VDS22 LVCP22 LVCP23 LVDS122

VDS250

Duals

Quads

8 Channels

16 Channels

10 Channels

LVDS109

LVDS1

VDS389

LVDS387

LVDS047 LVDS31 LVDS3487 L

VDS391

LVDS048A/348 LVDS32/33 LVDS3486 L

VDS390

➔

LVDS, xECL, CML

Design Considerations

ignaling Rate—TI offers repeaters/transla-

tors and crosspoint switches with signaling

ates up to 4.0 Gbps.

Jitter — Reducing jitter, the deviation of a

signal timing event from its ideal position, has become a priority for ensuring reliability in high-speed data buses.

Skew — Excessive skew, the time delta

between the actual and expected arrival

LVDS Family of Products

time of a clock signal, can limit the maximum bandwidth performance and lead to data

ampling errors. Low skew specifications

s make high-speed interconnect devices

xcellent for signal buffering.

Power Consumption — Low-voltage

differential signaling (LVDS) offers a low-power alternative to ECL and PECL devices. Currentmode drivers in LVDS produce a constant current, which allows power consumption to be relatively independent of frequency. The

constant current driver delivers about 3.5 mA to a 100-W load.

Technical Information

• LVDS is based on the TIA/EIA-644A standard conceived to provide a generalpurpose electrical-layer specification for drivers and receivers connected in a point-to-point or multidrop interface.

Resources For a complete list of resources (evaluation modules, data sheets and application notes), visit interface.ti.com

Literature Number

Description

Application Notes

SLLA014A Low-Voltage Differential Signaling (LVDS) Design Notes (Rev. A) SLLA030C Reducing Electromagnetic Interference with LVDS (Rev. C) SLLA031A Using an LVDS Receiver with TIA/EIA-422 Data (Rev. A) SLLA034A SLLA038B SLLA053B Performance of LVDS with Different Cables (Rev. B) SLLA054A SLLA065 SLLA082B Active Fail-Safe in TI's LVDS Receivers (Rev. B) SLLA100 Increase Current Drive Using LVDS SLLA101 Interfacing Different Logic with LVDS Receivers

Slew Rate Control of L Interface Circuits for TIA/EIA-644 (LVDS) (Rev. B)

L A Comparison of LinBiCMOS and CMOS Process T

VDS Multidrop Connections (Rev

VDS Circuits (Rev

. A)

echnologies in L

VDS ICs

SLLA103 LVPECL and LVDS Power Comparison SLLA104 Suggestions for L

VDS Connections SLLA105 DSP to DSP Link Using LVDS SLLA107 Live Insertion with Differential Interface Products SLLA147 Suitable LVDS Architectures

Interface Selection Guide Texas Instruments 4Q 2006

Literature Number Description

Application Notes

VDS, HSTL, and CML

SCAA059 SCAA062

Part Number Description Price

Evaluation Modules (EVMs)

SN65LVDS31-32EVM Evaluation Module for LVDS31 and LVDS32 49.00 SN65LVDS31-32BEVM Evaluation Module for LVDS31 and LVDS32B 49.00 SN65LVDS31-33EVM Evaluation Module for LVDS31 and LVDS33 49.00 SN65LVDS386EVM SN65LVDS386 Evaluation Module 49.00 SN65L SN65LVDS100EVM SN65LVDS100 Evaluation Module 99.00 SN65LVDS20EVM SN65LVDS20 Evaluation Module 49.00 SN65CML20EVM SN65L

AC-Coupling Between Differential L DC-Coupling Between Differential LVPECL, LVDS, HSTL, and CML

VDS387 Evaluation Module 49.00

SN65L

VDS387EVM

SN65CML20 Evaluation Module

VCP22 Evaluation Module

VCP22-23EVM

SN65L

VPECL, L

SN65LVDS122EVM SN65LVDS122 Evaluation Module 49.00 SN65LVDS250EVM SN65LVDS250 Evaluation Module 49.00

Note: IBIS models are available at interface.ti.com

Suggested resale price in U.S. dollars.

49.00

25.00

LVDS, xECL, CML

VDS/LVPECL/CML Repeaters/Translators and Crosspoints Selection Guide

No. No. Signaling Jitter Part-to- Tx tpd Rx ESD

Device

Crosspoint Switch Family

SN65LVCP22 2X2 Crosspoint Switch: 2 2 LVPECL, LVDS 1000 105 100 0.65 0.65 85 5 16SOIC, 2.70

SN65LVCP23 2X2 Crosspoint Switch: 2 2 LVPECL, LVPECL 1300 100 100 0.65 0.65 65 5 16SOIC, 5.20

SN65LVCP40 Dual 1:2 Mux with Equalizer and 6 6 LVPECL, CML 4000 30 500 1 1 254 4 48QFN 17.40

SN65LVDS12222X2 Crosspoint Switch: 2 2 LVPECL, LVDS 1500 65 150 0.9 0.9 100 4 16SOIC, 4.75

SN65LVDS25024X4 Crosspoint Switch: 4 4 LVPECL, LVDS 2000 50 150 0.9 0.9 145 3 TSSOP 7.75

Repeaters/Translators

SN65CML100 LVDS/LVPECL/CML-to-CML 1 1 LVPECL, CML 1500 70 100 0.8 — 12 5 8SOIC, 2.55

VDS100

SN65L

SN65LVDS1012LVDS/LVPECL/CML-to-LVPECL 1 1 LVPECL, LVPECL 2000 65 100 0.9 — 90 5 8SOIC, 2.55

SN65LVDS16/17 2.5-V/3.3-V Oscillator Gain 1 1 LVPECL LVDS 2000 10 130 0.63 — 48 2 8QFN 2.55

SN65LVDS18/19 2.5-V/3.3-V Oscillator Gain 1 1 LVPECL LVDS 1000 10 130 0.63 — 36 2 8QFN 1.95

SN65LVDS20 2.5-V/3.3-V LVDS repeater with enable 1 1 LVPECL LVDS 4000 45 130

SN65LVP16/17 2.5-V/3.3-V Oscillator Gain Stage/Buffer 1 — LVPECL LVPECL 2000 10 130 0.63 — 30 2 8QFN 2.55

SN65LVP18/19

SN65LVP20 2.5-V/3.3-V LVPECL 1 1 LVPECL LVPECL 4000 10 130 0.63 — 45 3 8QFN 4.40

Supply voltage for all devices listed above is 3.3 V. 2Integrated termination available (100-Ω)-SN65LVDTxxx. New products are listed in bold red.

*Suggested resale price in U.S. dollars in quantities of 1,000.

Description Tx Rx Signal Signal (Mbps) (ps) Skew Max (ns) (ns) Max (mA) (kV) Package(s) Price*

LVDS Outputs LVDS, CML 16TSSOP

LVPECL Outputs LVDS, CML 16TSSOP

Pre-Emphasis LVDS, CML

LVDS Output LVDS, CML 16TSSOP

LVDS Output LVDS, CML

Repeater/Translator LVDS, CML 8VSSOP

VDS/LVPECL/CML 1 1 LVPECL, LVDS 2000 65 100 0.8 — 30 5 8SOIC, 2.55

L to LVDS Repeater/Translator LVDS, CML 8VSSOP

Repeater/Translator LVDS, CML 8VSSOP

Stage/Buffer (single ended/diff inputs)

(single ended

2.5-V/3.3-V (single ended

/diff inputs)

Oscillator Gain Stage/Buffer 1 — LVPECL LVPECL 1000 10 130 0.63 — 20 2 8QFN 1.95

/diff inputs)

of of Input Output Rate Max Part Typ tpd Typ I

0.63 —

LVDS, CML

HBM Pin/

45 3 8QFN 3.30

➔

PECL Selection Guide

Device

TB5D1M

TB5D2H

TB5R1

TB5R2

TB5R3

TB3R1

TB3R2

TB5T1

VDS33

SN65L

SN65LVDS3481Receiver with –4 V to 5 V

SN65LVDS341Receiver with –4 V to 5 V

SN65LVDS3521Receiver with –4 V to 5 V

Integrated Termination Available (100-Ω)-SN65LVDTxxx.

*Suggested resale price in U.S. dollars in quantities of 1,000.

Description Tx Rx Signal Signal (Mbps) (ns) (ns) (mA) (kV) (V) Pin/Package(s) Price*

Replacement for Agere BDG1A & BPNGA, 4 — TTL PECL 400 1.2 — 40 3 3.3, 5 16SOIC gull-wing, 7.20 built-in surge protection Replacement for Agere BDG1A & BDGLA, power down open circuit o/p Replacement for Agere BRF1A & BRF2A, 8KΩ Input Impedance Replacement for Agere BRS2A & BRS2B

Replacement for Agere BRF1A

3.3-V supply alternative to Agere BRF1A & BRF2A

3.3-V supply alternative to Agere BRS2A & BRS2B Dual differential transceiver

Receiver with –4 V to 5 Common-Mode Range, L

Common-Mode Range, L

Common-Mode Range

V — 4 LVDS, LVPECL, LVTTL 400 — 4 23 15 3.3 16SOIC, 16TSSOP 1.60

VDS32 Footprint

VDS48 Footprint

Tx Rx

No. No. Signaling tpd tpd

of of Input Output Rate Typ Typ Max HBM Voltage

—

4 LVPECL TTL 400 — 2.6 50 3 5 16SOIC gull-wing, 8.65

—

4 LVPECL LVTTL 400 — — 32 3 3.3 16SOIC 8.65

—

4 LVPECL LVTTL 400 — — 32 3 3.3 16SOIC 8.65

—

2 LVPECL, LVPECL, 400 1.2 2.5 35 3 5 8SOIC gull-wing, 7.20

—

2 LVDS, LVPECL, LVTTL 400 — 4 12 15 3.3 8SOIC 1.15

—

4 LVDS, LVPECL, LVTTL 560 — 6 20 15 3.3 24TSSOP 1.80

—

TTL PECL 400 1.2 — 40 3 3.3, 5 16SOIC gull-wing, 7.20

PECL TTL 400 — 2.5 32 3 5 16SOIC gull-wing, 7.20

VTTL 8SOIC

VTTL

VECL, ECL

PECL, L

LVDS, LVPECL, LVTTL 340 — 6 20 15 3.3 16SOIC, 16TSSOP 1.60

PECL, LVECL, ECL

VECL, ECL

PECL, L

VECL, ECL

PECL, L

ESD Supply

16SOIC

Texas Instruments 4Q 2006 Interface Selection Guide

LVDS, xECL, CML

➔

LVDS Selection Guide

Signaling Part-to-Part Tx tpd

No. of No. of Rate Skew Max Typ Device Description Tx Rx Input Signal Output Signal (Mbps) (ps) (ns) Single

SN65LVDS1 Driver 1 — LVTTL LVDS 630 — 1.7 SN65LVDS2 SN65LVDS179 Full-Duplex Transceiver, No Enables 1 1 LVDS, LVTTL LVTTL, LVDS 400 — 1.7 SN65LVDS180 Full-Duplex Transceiver, with Enables 1 1 LVDS, LVTTL LVTTL, LVDS 400 — 1.7

Dual

SN65LVDS9638 Driver 2 — LVTTL LVDS 400 800 1.7 SN65LVDS9637 Receiver — 2 LVDS LVTTL 400 1000 — SN65LVDS049 Transceiver, Driver and Receiver Enable 2 2 LVDS, LVTTL LVTTL, LVDS 400 100 1.3 SN65LVDS050 Transceiver, Driver and Receiver Enable 2 2 LVDS, LVTTL LVDS, LVTTL 400 — 1.7 SN65LVDS051 Transceiver, Driver Enable Only 2 2 LVDS, LVTTL LVDS, LVTTL 400 — 1.7 SN65LVDS1050 Transceiver with 2.7-V Supply 2 2 LVDS, LVTTL LVTTL, LVDS 400 — 1.7 SN65LVDS22 Multiplexed LVDS Repeater 2 2 LVDS LVDS 250 — 4

Quad

SN65LVDS047 Driver with Flow-Through Pinout 4 — LVTTL LVDS 400 1000 1.8 SN65LVDS31 Driver, AM26LS31 Footprint 4 — LVTTL LVDS 400 800 1.7 SN65LVDS3487 Driver, MC34987 Footprint 4 — LVTTL LVDS 400 800 1.7 SN65LVDS391 Driver with Flow-Through Pinout 4 — LVTTL LVDS 630 1500 1.7 SN65LVDS048A Receiver with Flow-Through Pinout — 4 LVDS LVTTL 400 1000 — SN65LVDS32 Receiver, AM26LS32 Footprint — 4 LVDS LVTTL 400 1000 — SN65LVDS3486 Receiver, MC3486 Footprint — 4 LVDS LVTTL 400 1000 — SN65LVDS390

8-Channel

SN65LVDS389 Driver 8 — LVTTL LVDS 630 1500 1.7 SN65LVDS388A

16-Channel

SN65LVDS387 Driver 16 — LVTTL LVDS 630 1500 1.7 SN65LVDS386

Integrated termination available (100-Ω) - SN65LVDTx.

Receiver — 1 LVDS LVTTL 400 — 1.7

Receiver with Flow-Through Pinout — 4 LVDS LVTTL 630 1000 —

Receiver — 8 LVDS LVTTL 630 1000

Receiver — 16 LVDS LVTTL 630 1000 —

Interface Selection Guide Texas Instruments 4Q 2006

LVDS, xECL, CML

LVDS Selection Guide

tpd Typ Max HBM Voltage Device (ns) (mA) (kV) (V) Pin/Package(s) Price Single Family

SN65LVDS1 — 8 15 3.3 8SOIC, 5SOP 0.47 SN65LVDS2 SN65LVDS179 3.7 12 12 3.3 8SOIC, 8VSSOP 1.35 SN65LVDS180 3.7 12 12 3.3 14SOIC, 14TSSOP 1.35

Dual Family

SN65LVDS9638 — 13 8 3.3 8HTSSOP, 8SOIC, 8VSSOP 1.15 SN65LVDS9637 2.1 10 8 3.3 8HTSSOP, 8SOIC, 8VSSOP 1.15 SN65LVDS049 1.9 35 10 3.3 16TSSOP 1.00 SN65LVDS050 3.7 20 12 3.3 16SOIC, 16TSSOP 2.00 SN65LVDS051 3.7 20 12 3.3 16SOIC, 16TSSOP 2.00 SN65LVDS1050 3.7 20 12 2.7 16TSSOP 2.00 SN65LVDS22 4 20 12 3.3 16SOIC, 16TSSOP 2.80

Quad Family

SN65LVDS047 — 26 8 3.3 16SOIC, 16TSSOP 1.30 SN65LVDS31 — 35 8 3.3 16SOIC, 16TSSOP, 16SOP 1.50 SN65LVDS3487 — 35 8 3.3 16SOIC 1.50 SN65LVDS391 — 26 15 3.3 16SOIC, 16TSSOP 1.50 SN65LVDS048A 2.4 15 10 3.3 16SOIC, 16TSSOP 1.30 SN65LVDS32 2.1 18 8 3.3 16SOIC, 16TSSOP, 16SOP 1.50 SN65LVDS3486 2.1 18 8 3.3 16SOIC 1.50 SN65LVDS390

8-Channel Family

SN65LVDS389 — 70 15 3.3 38TSSOP 2.90 SN65LVDS388A

16-Channel Family

SN65LVDS387 — 95 15 3.3 64TSSOP 5.55 SN65LVDS386

Integrated termination available (100-Ω)-SN65LVDTx

*Suggested resale price in U.S. dollars in quantities of 1,000.

2.6 7 15 3.3 8SOIC, 5SOP 0.47

2.5 18 15 3.3 16SOIC, 16TSSOP 1.50

2.5 40 15 3.3 38TSSOP 2.90

2.5 70 15 3.3 64TSSOP 5.55

SD Supply

➔

Texas Instruments 4Q 2006 Interface Selection Guide

100 Mbps

200 Mbps

300 Mbps

400 Mbps

500 Mbps

600 Mbps

700 Mbps

Single Dual Quad 8-Channel 16-Channel

LVDM179 LVDM180

LVDM176

LVDM050 LVDM051

LVDM1676 LVDM1677

LVDM22

MLVD2 MLVD3

LVDM320

MLVD200A MLVD202A MLVD204A MLVD205A

MLVD201 MLVD203 MLVD206 MLVD207

M-LVDS Transceivers

M-LVDS Clock Distribution (see p.42 for table)

LVDM: a version of LVDS with double the output current

M-LVDS Receivers

LVDM31

MLVD047

MLVD129

MLVD080 MLVD082 MLVD128

High

ype 1

Type 2

2.4 V

150 mV

50 mV

0 mV

–50 mV

High

Low

Transition Region

Low

2.4 V

➔

Multipoint-LVDS (M-LVDS)

M-LVDS Features

• TIA/EIA-899 standard

• Driver output current

11.3 mA vs. 3.5 mA (LVDS)

••

• Receiver thresholds

••

50 mV vs. 100 mV (LVDS)

• Driver edge rate control

••

1 ns min allows ease-of-stub design

• Contention provisions Driver short circuit limited to 43 mA

••

Drivers, receivers and disabled devices must limit their bus voltage from 0 to 2.4 V

••

Drivers are tested with 32 contending nodes

Multipoint LVDS

M-LVDS Devices from TI

• TIA/EIA-899 standard compliant guarantees true multipoint

• Type 1 receivers: 25-mV hysteresis to prevent oscillation Type 2 receivers: internal failsafe

• (no external bias network)

• –1-V to 3.4-V common mode

• 3.3-V supply operation

M-LVDS for ATCA

• Synchronous ATCA clock signals (8 kHz, 19.22 MHz and user defined <100 MHz) use M-LVDS.

Receiver types.

Interface Selection Guide Texas Instruments 4Q 2006

Multipoint-LVDS (M-LVDS)

M-LVDS Selection Guide

No. No. Half/ Signaling Part-to-

Device

SN65MLVD2 — 1 1 — M-LVDS LVTTL 200 — — — — — — ✔ Web SN65MLVD3 — 1 2 — M-LVDS LVTTL 200 — — — — — — ✔ Web

SN65MLVD200A 1 1 1 Half LVTTL, M-LVDS LVTTL, M-LVDS 100 1000 2.5 3.6 24 8 8SOIC ✔ 1.55 SN65MLVD201 1 1 1 Half LVTTL, M-LVDS LVTTL, M-LVDS 200 1000 1.5 4 24 8 8SOIC ✔ 1.85 SN65MLVD202A 1 1 1 Full LVTTL, M-LVDS LVTTL, M-LVDS 100 1000 2.5 3.6 24 8 14SOIC ✔ 1.55 SN65MLVD203 1 1 1 Full LVTTL, M-LVDS LVTTL, M-LVDS 200 1000 1.5 4 24 8 14SOIC ✔ 1.85 SN65MLVD204A 1 1 2 Half LVTTL, M-LVDS LVTTL, M-LVDS 100 1000 2.5 3.6 24 8 8SOIC ✔ 1.55 SN65MLVD205A 1 1 2 Full LVTTL, M-LVDS LVTTL, M-LVDS 100 1000 2.5 3.6 24 8 14SOIC ✔ 1.55 SN65MLVD206 1 1 2 Half LVTTL, M-LVDS LVTTL, M-LVDS 200 1000 1.5 4 24 8 8SOIC ✔ 1.85 SN65MLVD207 1 1 2 Full LVTTL, M-LVDS LVTTL, M-LVDS 200 1000 1.5 4 24 8 14SOIC ✔ 1.85

SN65MLVD047 4 0 — Half LVTTL M-LVDS 200 1000 1.5 — 60 12 16SOIC, ✔ 1.45

SN65MLVD128 8 1 — — LVTTL M-LVDS 200 800 1.5 1.5 140 8 48TSSOP ✔ 3.80 SN65MLVD129 8 2 — — LVTTL M-LVDS 200 800 1.5 1.5 140 8 48TSSOP ✔ 3.80 SN65MLVD080 8 8 1 Half LVTTL, LVDS LVTTL, M-LVDS 250 1000 2.4 6 180 8 64TSSOP ✔ 4.75

SN65MLVD082 8 8 2 Half LVTTL, LVDS LVTTL, M-LVDS 250 1000 2.4 6 180 8 64TSSOP ✔ 4.75 SN65LVDM179 1 1 — Full LVTTL, LVDM LVTTL, LVDM 500 1000 1.7 3.7 15 12 8SOIC, — 1.70

SN65LVDM05022 2 — Full LVTTL, LVDM LVTTL, LVDM 500 1000 1.7 3.7 27 12 16SOIC, — 2.20

SN65LVDM22 2 2 — — LVDM LVDM 250 — 4 4 27 12 16SOIC, — 2.50

SN65LVDM31 4 0 — — LVCMOS LVDM 150 1000 2.3 — 40 12 16SOIC — 1.55

of of Rx Full Rate Part Skew Typ Typ Max HBM Pin/ Standard

Tx Rx Type Duplex Input Signal Output Signal (Mbps) Max (ps) (ns) (ns) (mA) (kV) Package(s) Compliance Price*

tpd

ESD TIA/EIA-899

16TSSOP

8VSSOP

16TSSOP

➔

SN65LVDM1676 16 16 — Half LVTTL, LVDM LVTTL, LVDM 630 1000 2.5 3 175 15 64TSSOP — 7.75

Supply voltage for all devices listed above is 3.3 V and temperature range is –40 to 85°C. New products are listed in bold red.

Automotive version available, temperature range of –40 to 125°C Preview products are listed in bold blue.

*Suggested resale price in U.S. dollars in quantities of 1,000.

Resources For a complete list of resources (evaluation modules, data sheets and application notes), visit interface.ti.com

Literature Number Description

Application Notes

SLLA106 TIA/EIA-485 and M-LVDS, Power and Speed Comparison SLLA088A Transmission at 200 Mbps in VME Card Cage Using LVDM (Rev. A) SLLA108 Introduction to M-LVDS (TIA/EIA-899) SLLA121 Interoperability of M-LVDS and BusLVDS SLLA119 Wired-Logic Signaling with M-LVDS SLLA127 M-LVDS Signaling Rate Versus Distance SLLA067A

Part Number Description Price

Evaluation Modules (EVMs)

MLVD20xEVM M-LVDS Evaluation Module 99.00 SN65LVDM31-32BEVM SN65LVDM31-32BEVM Evaluation Module 49.00

Note: IBIS models are available at interface.ti.com

*Suggested resale price in U.S. dollars.

Comparing Bus Solutions

Texas Instruments 4Q 2006 Interface Selection Guide

Magnetic Flux Density vs. Frequency

100E-18

100E-12

100E-6

100E+0

100E+6

0.001 0.01 0.1 1 10 100

MHz

Wb/m

ISO721 Inductive IEC61000-4-9 IEC61000-4-8

ISO

721

Isol

ato

➔

Digital Isolators

esign Considerations

Reliability — Best-in-class, high voltage

and functional reliability with > 25 years.

agnetic Immunity— Immunity from

external magnetic fields to prevent data corruption is a critical consideration for industrial applications. 1E6 times higher magnetic immunity than inductive couplers.

Signaling rate — TI offers digital isolators

with the highest signaling rates of up to 150 Mbps.

Jitter — To ensure signal integrity,

jitter reduction is a priority. ISO72xx products offer the lowest jitter with 1-ns jitter at 150-Mbps PRBS NRZ data input.

Key Features

• 4000-V

••

UL 1577, IEC 60747-5-2

peak

isolation

(VDE 0884, Rev. 2)

••

IEC 61010-1 and CSA approved

••

50-kV/µs transient immunity

• Signaling rate 0 Mbps to 150 Mbps

••

Low propagation delay

••

Low pulse skew (pulse-width distortion)

• Low-power sleep mode

• High-electromagnetic immunity

• Low-input current requirement of 10 µA

• Fail-safe output

echnical Information

he ISO72xx is a family of digital isolators

sing the industry’s first application of digital

u capacitive isolation technology. Digital buffers

apacitively couple data signals through a

c silicone-dioxide (SiO2) insulation barrier which provides galvanic isolation of up to 4000 V. The device receives digital inputs and provides clean digital outputs while preventing noise currents and/or excessive voltages from entering the local ground.

Recently introduced alternative isolation techniques that use magnetic coupling may still share the deficiencies of the older optocoupler solutions such as a restricted operating temperature along with new concerns such as

he absence of a fail-safe output, an inability to

t operate with DC-only signals and concerns associated with susceptibility to external magnetic fields and operating life under highvoltage conditions. TI isolation solutions are designed to eliminate such problems.

Digital Isolators Selection Guide

Low-Power Transient

Device Description Rating (UL) Mode (Max) (Min) Voltage Price

ISO721 Single channel (TTL) ISO721M Single channel (CMOS) 2500 V ISO722 Single channel OUT EN (TTL) 2500 V ISO722M Single channel OUT EN (CMOS)

ISO150 Dual channel bi-directional 1500 V

ISO7220A Dual channel uni-directional (TTL) 2500 V ISO7220C Dual channel uni-directional (TTL) ISO7220M Dual channel uni-directional (CMOS) 2500 V ISO7221A Dual channel bi-directional (TTL) 2500 V ISO7221C Dual channel bi-directional (TTL) ISO7221M Dual channel bi-directional (CMOS) 2500 V

*Suggested resale price in U.S. dollars in quantities of 1,000.

Interface Selection Guide Texas Instruments 4Q 2006

Isolation Sleep Data Rate Immunity Supply

µs 3.3 V, 5 V 1.65

2500 V

RMS

No Yes 150 Mbps 25 kV/µs 3.3 V, 5 V 1.65 Yes 100 Mbps 25 kV/µs 3.3 V, 5 V 1.75

No 80 Mbps 1.6 kV/µs 5 V 8.10

No 1 Mbps 25 kV/µs 3.3 V, 5 V 1.10

No 150 Mbps 25 kV/µs 3.3 V, 5 V 2.50

No 1 Mbps 25 kV/µs 3.3 V, 5 V 1.10

No 150 Mbps 25 kV/µs 3.3 V, 5 V 2.50

100 Mbps

150 Mbps 25 kV/µs 3.3 V, 5 V 1.75

25 Mbps

25 kV/

25 kV/µs 3.3 V, 5 V 2.00

New products are listed in

Preview products are listed in bold blue.

bold red.

RS-485/422

➔

esign Considerations

Interoperability — In general, RS-485 is a

superset of RS-422. Compliance with the TIA/EIA standard will ensure reliable data communication in a variety of networks, including Modbus, INTERBUS, PROFIBUS, BACnet and a variety of proprietary protocols.

Robustness — RS-485 is a robust interface

standard for use in industrial environments. It features a wide common mode range of –7 V to 12 V. Parts from TI are available with ESD protection up to 30 kV.

Reliability — Integrated fail-safe circuitry

protects the bus from interpreting noise as valid data when short-circuit, open-circuit or idle line fault conditions occur.

Speed and Distance — Low noise coupling

of differential signaling with twisted-pair cabling and wide common-mode voltage

RS-485/422 Family of Products

range allows data exchange at signaling rates of up to 50 Mbps or to distances of several

20 percent of the characteristic impedance of the cable and can vary from 90 Ω to 120 Ω.

kilometers at lower rates.

Technical Information

Line Loading — RS-422 is capable of support-

ing one driver and up to 10 receivers on the bus line. Standard RS-485 is capable of supporting up to 32 unit loads or nodes on the bus line. However, there are reduced unit load devices available that can support up to 256 devices.

Termination — A multipoint bus architecture

requires termination at both ends of the bus line. The termination resistors must be within

Resources F

Literature Number Description

Application Notes

SLLA036B Interface Circuits for TIA/EIA-485 (RS-485) SLLA070C 422 and 485 Standards Overview and System Configurations SLLA112 RS-485 for E-Meter Applications SLLA177 PROFIBUS Electrical-Layer Solutions SLLA169 Use Receiver Equalization to Extend RS-485 Data Communications SLLA143 RS-485 for Digital Motor Control Applications

Note: IBIS models are available at interface.ti.com

or a complete list of resources (evaluation modules, data sheets and application notes), visit interface.ti.com

• The main difference between RS-422 and RS-485 is the multidrop and multipoint bus architecture—that is, one driver to many receivers and many drivers to many receivers, respectively.

• Typical signaling rates and distances for these standards are up to 10 Mbps or up to 1.2 km. TI offers devices capable of reaching signaling rates of up to 50 Mbps.

Texas Instruments 4Q 2006 Interface Selection Guide

RS-485/422

➔

RS-485/422 Selection Guide

S No. of Supply Rate ESD Receiver Dr/Rx (V) Enables Device1Features (Mbps) (kV) Fail-Safe Nodes Package(s) Price

DE, RE HVD12 3.3V Supply – Low-Speed Slew-Rate Control 1 15 Short, Open, Idle 256 8-PDIP, 8-SOIC 1.75

3.3

3 to 5

5 DE, RE HVD3082E Low Power Mode, Optimized for Low-Speed 0.2 15 Short, Open, Idle 256 8-PDIP, 8-SOIC, 8-MSOP 0.90

Half-Duplex

1/1

3.3

Full-Duplex

2/2

3/3 Separate DIR LBC170 FAST-20 SCSI, Skew: 3ns 30 12 Open 32 20-SOIC, 16-SSOP 4.10

3/3

4/0 Complementary LBC172 Low Power 10 2 — 32 16-PDIP, 20-SOIC 1.80

4/0

0/4 Complementary LBC173 Low Power 10 2 Open 32 16-PDIP, 16-SOIC 1.15

0/4

These devices use the temperature prefixes:

*Suggested resale price in U.S. dollars in quantities of 1,000.

Triple

Quad-Drivers

Quad-Receivers

E, RE HVD11 3.3V Supply – Low-Speed Slew-Rate Control 10 15 Short, Open, Idle 256 8-PDIP, 8-SOIC 1.80 DE, RE HVD10 3.3V Supply – High-Speed Signaling 25 15 Short, Open, Idle 64 8-PDIP, 8-SOIC 1.85 DE, RE HVD08 Wide Supply Range: 3 to 5.5V 10 15 Short, Open, Idle 256 8-PDIP, 8-SOIC 1.90

E, RE HVD3085E Low Power Mode, Optimized for Mid-Speed 1 15 Short, Open, Idle 256 8-PDIP, 8-SOIC, 8-MSOP 0.90 DE, RE HVD3088E Low Power Mode, Optimized for High-Speed 10 15 Short, Open, Idle 256 8-PDIP, 8-SOIC, 8-MSOP 1.00 DE, RE HVD485E Half Duplex Transceiver 10 15 Open 64 8-PDIP, 8-SOIC, 8-MSOP 0.70 DE, RE HVD1176 PROFIBUS Transceiver, EN 50170 40 10 Short, Open, Idle 160 8-SOIC 1.55 DE, RE HVD22 –20V to 25V Common Mode Operation 0.5 16 Short, Open, Idle 256 8-PDIP, 8-SOIC 1.65 DE, RE HVD21 –20V to 25V Common Mode, 5Mbps 5 16 Short, Open, Idle 256 8-PDIP, 8-SOIC 1.65 DE, RE HVD20 –20V to 25V Common Mode, 25Mbps 25 16 Short, Open, Idle 64 8-PDIP, 8-SOIC 1.65 DE, RE HVD23 Receiver Equalization, 160 Meters at 25 Mbps 25 16 Short, Open, Idle 64 8-PDIP, 8-SOIC 1.80 DE, RE HVD24 Receiver Equalization, 500 Meters at 3 Mbps 3 16 Short, Open, Idle 256 8-PDIP, 8-SOIC 1.80 DE, RE HVD07 Strong Driver Outputs – Low Signal Rate 1 16 Short, Open, Idle 256 8-PDIP, 8-SOIC 1.50 DE, RE HVD06 Strong Driver Outputs – Mid Signal Rate 10 16 Short, Open, Idle 256 8-PDIP, 8-SOIC 1.55 DE, RE HVD05 Strong Driver Outputs – Fast Signal Rate 40 16 Short, Open, Idle 64 8-PDIP, 8-SOIC 1.60 DE, RE LBC176 Low Power 10 2 Open 32 8-PDIP, 8-SOIC 0.90 DE, RE LBC176A Low Power, Fast Signaling, ESD Protection 30 12 Open 32 8-PDIP, 8-SOIC 1.20 DE, RE LBC184 Transient Protection, IEC Air, Contact, Surge 0.25 30 Open 128 8-PDIP, 8-SOIC 1.30 DE, RE LBC182 IEC ESD Protection, Air and Contact Tests DE, RE ALS176 Fast Signaling, Skew: 15ns 35 2 Open 32 8-SOIC 1.26 DE, RE 176B Cost Effective 10 2 None 32 8-PDIP, 8-SOIC, 8-SOP 0.44

No HVD30 3.3V Supply, no Enables, 25Mbps 25 15 Short, Open, Idle 64 8-SOIC 1.80 No HVD31 3.3V Supply, no Enables, 5Mbps 5 15 Short, Open, Idle 256 8-SOIC 1.80 No HVD32 3.3V Supply, no Enables, 1Mbps 1 15 Short, Open, Idle 256 8-SOIC 1.80

No HVD379 Balanced Receivers, Ideal for Interbus 25 DE, RE HVD33 3.3V Supply, with Enables, 25Mbps 25 15 Short, Open, Idle 64 14-SOIC 1.85 DE, RE HVD34 3.3V Supply, with Enables, 5Mbps 5 15 Short, Open, Idle 256 14-SOIC 1.85 DE, RE HVD35 3.3V Supply, with Enables, 1Mbps 1 15

No HVD50 Strong Bus Outputs, no Enables, 25Mbps 25 15 Short, Open, Idle 64 8-SOIC 1.70 No HVD51 Strong Bus Outputs, no Enables, 5Mbps 5 15 Short, Open, Idle 256 8-SOIC 1.70 No HVD52 Strong Bus Outputs, no Enables, 1Mbps 1 15 Short, Open, Idle 256 8-SOIC 1.70 No HVD179 Balanced Receivers, Ideal for Interbus 25 15 None 256 8-SOIC 1.85 No LBC179 Low Power, without Enable 10 2 Open 32 8-PDIP, 8-SOIC 0.85 No

DE, RE HVD53 Strong Bus Outputs, with Enables, 25Mbps 25 15 Short, Open, Idle 64 14-SOIC 1.60 DE, RE HVD54 Strong Bus Outputs, with Enables, 5Mbps 5 15 Short, Open, Idle 256 14-SOIC 1.60 DE, RE HVD55 Strong Bus Outputs, with Enables, 1Mbps 1 15 Short, Open, Idle 256 14-SOIC 1.60 DE, RE DE, RE ALS180 High Signaling Rate, with Enables 25 2 Open 32 14-SOIC 1.71 DE, RE ALS1177 Dual full-duplex drivers/receivers 10 2 Open 32 16-PDIP, 16-SOIC 3.24

1DE, 2DE

riple RE

DE, T

Complementary LBC172A High Signaling Rate, High ESD 30 13 — 32 16-PDIP, 16-SOIC, 20-SOIC 2.40

Pairwise LBC174 Low Power 10 2 — 32 16-PDIP, 20-SOIC 1.90 Pairwise

Complementary LBC173A High Signaling Rate, High ESD, Low Power 50 6 Short, Open, Idle 32 16-PDIP, 16-SOIC 1.50

Pairwise LBC175 Low Power 10 2 Open 32 16-PDIP, 16-SOIC 1.10 Pairwise LBC175A High Signaling Rate, High ESD, Low Power 50 6 Short, Open, Idle 32 16-PDIP, 16-SOIC 1.40 Pairwise

LBC179A

LBC180

ALS1178 Dual full-duplex drivers/receivers 10 2 Open 32 16-PDIP, 16-SOIC 3.24

LBC171 FAST-20 SCSI, Skew: 3ns 30 12 Open 32 20-SOIC, 20-SSOP 4.10

LBC174A

175 Standard 10 2 None 32 16-PDIP, 16-SOIC, 16-SOP 2.70

SN55 = military (–55

High Signaling Rate, High ESD w/o Enables

Low Power

High Signaling Rate, High ESD

, with Enables

C to 125° C); SN65 = industrial (–40° C to 85° C); SN75 = commercial (0° C to 70° C).

ignaling

0.25

30 10 Open 32 8-PDIP, 8-SOIC 1.10

15 Open 128 8-PDIP, 8-SOIC 1.05

15 None 256 8-SOIC 1.95

Short, Open, Idle 256 14-SOIC 1.85

2 Open 32 14-PDIP, 14-SOIC, 16-QFN 1.05

13 — 32 16-PDIP, 16-SOIC, 20-SOIC 2.50

Interface Selection Guide T

exas Instruments 4Q 2006

RS-232

Modem

USB

1394

802.11 1284

DV I

TMS320DM64x™

EMIF

Video

Out

Video

PCIJTA G

EMAC

SDRAM

TVP5146

TS5V330 TS3V330

Analog MUX

or 5150A

Flash

AMP

forTHS8135 only

Host CPU

Video DAC

THS8200 THS8135

Head-

TS5A23157

Analog

MUX

phone

Volume Control

Audio DAC

TLV320DAC26

PCI Bus

McASP

Speaker

ADSL

Cable

Modem

RS-232

➔

RS232: IEC6100-4-2 (Level 4) ESD-Protected Devices

I offers new RS-232 devices with system-

T level IEC61000-4-2 electrostatic discharge (ESD) protection. This protection makes the RS-232 interface immune to damage from ESD strikes that may occur while the system is up and running, such as when a connection to the RS-232 cable is made. These devices are drop-in replacements and are functionally identical to the existing industry-standard solutions, providing a seamless transition in the qualification process. These devices meet the requirements for low-power, high-speed applications such as portable/consumer, telecom and computing equipment.

TI offers these new devices in the NiPdAu Pb-Free finish, which eliminates tin whiskers that might compromise long-term system reliability. TI offers the space-saving QFN package on select devices in addition to its already extensive RS-232 portfolio.

Key Features

• No external ESD device needed with these system-level ESD ratings:

– ±15-kV human-body model (HBM) – ±8-kV IEC61000-4-2, contact

discharge

– ±15-kV IEC61000-4-2, air-gap

discharge

• Improved drop-in replacement of popular RS-232 devices

• Data rates meet or exceed today’s high-speed-application requirements

• Flexible power-saving options enable longer battery life

• Wide portfolio permits selection of the right form, fit and functionality

• Industry-leading interface product space with assured source of supply

• NiPdAu Pb-Free solution provides whisker-free, reliable package options

• Space-saving QFN package options for portable applications

pplications

• The three-driver, five-receiver MAX3243E is most popular in applications like PCs, notebooks and servers.

• The MAX3238E/37E offer complementary five-driver, threereceiver solutions. These two devices are popular in PC peripheral applications like data cables, printers, modems, industrial control, etc.

• The MAX3227E/23E/22E/21E are popular in portable handheld applications due to their reduced bit count, package size and low power consumption.

• Higher-speed versions like the SNx5C3232E/23E/22E/21E meet today’s higher throughput needs through the serial interface.

• The MAX232E and MAX213 provide a higher noise margin for more rugged environments such as industrial control.

Personal video recorder application block diagram.

Texas Instruments 4Q 2006 Interface Selection Guide

RS-232

➔

S232 Selection Guide

Data Rate ESD Supply I

Device (kbps) Drivers Receivers HBM (kV) Voltage(s) (V) (max) (mA) Pin/Package(s) Price

MAX3223E 500 2 2 IEC61000-4-2 3.3, 5 1 20SOIC, 20SSOP, 20TSSOP, 24QFN 0.84 MAX3222E 500 2 2 IEC61000-4-2 3.3, 5 1 20SOIC, 20SSOP, 20TSSOP, 24QFN 1.00 SN75C3222E 1000 2 2 IEC61000-4-2 3.3, 5 1 20SOIC, 20SSOP, 20TSSOP, 24QFN 2.50 SN65C3222E 1000 2 2 IEC61000-4-2 3.3, 5 1 20SOIC, 20SSOP, 20TSSOP, 24QFN 2.88 SN75C3223E 1000 2 2 IEC61000-4-2 3.3, 5 1 20SOIC, 20SSOP, 20TSSOP, 24QFN 2.11 SN65C3223E 1000 2 2 IEC61000-4-2 3.3, 5 1 20SOIC, 20SSOP, 20TSSOP, 24QFN 2.50 MAX3238E 400 5 3 IEC61000-4-2 3.3, 5 2 28SSOP, 28TSSOP, 32RHB 0.87 MAX3221E 250 1 1 IEC61000-4-2 3.3, 5 1 16SSOP, 16TSSOP 0.88 SN65C3221E 1000 1 1 IEC61000-4-2 3.3, 5 1 16SSOP, 16TSSOP 3.10 SN75C3221E 1000 1 1 IEC61000-4-2 3.3, 5 1 16SSOP, 16TSSOP 2.50 MAX3237E 1000 5 3 IEC61000-4-2 3.3, 5 2 28SSOP, 28TSSOP, 32RHB 0.87

ADM2209E 960 10 6 IEC61000-4-2 Dual 3.3V, 12V 5 38TSSOP TBD

MAX232E 120 2 2 IEC61000-4-2 5 10 38TSSOP, 16PDIP, 16SOIC, 16SSOP 0.39

AX202E

M MAX207E 120 5 3 IEC61000-4-2 5 20 24SOIC, 24SSOP TBD MAX208E 120 4 4 IEC61000-4-2 5 20 24PDIP, 24SOIC, 24SSOP TBD

MAX3386E 250 3 2 IEC61000-4-2 VL 1.65V to VCC, 1 20SOIC, 20TSSOP 1.92

SN65C3232E 1000 2 2 IEC61000-4-2 3.3, 5 1 16SOIC, 16SSOP, 16TSSOP 3.92 SN75C3232E 1000 2 2 IEC61000-4-2 3.3, 5 1 16SOIC, 16SSOP, 16TSSOP 3.22 MAX211E 120 4 5 IEC61000-4-2 5 20 20SOIC, 20SSOP, 28SOIC, 28SSOP TBD MAX3227E 1000 1 1 IEC61000-4-2 3.3, 5 1 16SSOP 1.20 MAX3232E 250 2 2 IEC61000-4-2 3.3, 5 1 16SOIC, 16SSOP, 16TSSOP 0.68 MAX3243E 500 3 5 IEC61000-4-2 3.3, 5 1 28SOIC, 28SSOP, 28TSSOP, 32QFN 0.63 MAX3318E 460 2 2 IEC61000-4-2 2.25, 3 1 20SSOP, 20TSSOP 1.10

MAX213 120 4 5 15KV HBM 5 1 28SOIC, 28SSOP 1.08 MAX202 120 2 2 15KV HBM 5 15 16SOIC, 16TSSOP 0.51 MAX207 120 5 3 15KV HBM 5 20 24SOIC, 24SSOP 0.63 MAX208 120 4 4 15KV HBM 5 20 24PDIP, 24SOIC, 24SSOP 0.96 MAX211 120 4 5 15KV HBM 5 20 28SOIC, 28SSOP 0.63 MAX222 120 2 2 15KV HBM 5 10 18PDIP, 18SOIC 0.74 MAX3221 250 1 1 15KV HBM 3.3, 5 1 16SSOP, 16TSSOP 0.88 MAX3223 250 2 2 15KV HBM 3.3, 5 1 20SOIC, 20SSOP, 20TSSOP 1.12 MAX3232 250 2 2 15KV HBM 3.3, 5 1 16SOIC, 16SSOP, 16TSSOP 0.96 MAX3238 250 5 3 15KV HBM 3.3, 5 2 28SSOP, 28TSSOP 1.20 MAX3243 250 3 5 15KV HBM 3.3, 5 1 28SOIC, 28SSOP, 28TSSOP 0.88 MAX3318 460 2 2 15KV HBM 2.25, 3 2 20SSOP, 20TSSOP 1.58 SN65C23243 250 6 10 15KV HBM 3.3, 5 0.02 48SSOP, 48TSSOP 4.32 SN65C3221 SN65C3223 1000 2 2 15KV HBM 3.3 or 5 1 20SOIC, 20SSOP, 20TSSOP 2.50 SN65C3232 1000 2 2 15KV HBM 3.3 or 5 1 16SOIC, 16SSOP, 16TSSOP 3.02 SN65C3238 1000 5 3 15KV HBM 3.3 or 5 2 28SOIC, 28SSOP, 28TSSOP 3.24 SN65C3243 1000 3 5 15KV HBM 3.3 or 5 1 28SOIC, 28SSOP, 28TSSOP 3.46 SN75C23243 250 6 10 15KV HBM 3.3, 5 0.02 48SSOP, 48TSSOP 3.42 SN75C3221 SN75C3223 SN75C3232 1000 2 2 15KV HBM 3.3 or 5 1 16SOIC, 16SSOP, 16TSSOP 2.79 SN75C3238 SN75C3243 1000 3 5 15KV HBM 3.3 or 5 1 28SOIC, 28SSOP, 28TSSOP 1.51 SN75LP1185 256 3 5 15KV HBM 5, ±12 1 20PDIP, 20SOIC, 20SSOP 1.78 SN75LP196 256 5 3 15KV HBM 5, ±12 1 20PDIP, 20SOIC, 20SSOP, 20TSSOP 1.78 SN75LPE185 256 3 5 15KV HBM 5, ±12 1 24PDIP, 24SOIC, 24SSOP, 24TSSOP 1.89 SN75185 120 3 5 10KV HBM ±12, 5 30 20PDIP, 20SOIC, 20SSOP, 20TSSOP 0.45 SN75196 SN75LV4737A 128 3 5 4KV HBM 3 or 5 20.7 28SSOP 2.61 MAX232 120 2 2 2KV HBM 5 10 16PDIP, 16SO, 16SOIC 0.48 SN75150 120 SN75155 120 SN75188 120 4 2KV HBM –9 25 14PDIP, 14SO, 14SOIC 0.22

*Suggested resale price in U.S. dollars in quantities of 1,000. New products are listed in bold red.

20 2 2 IEC61000-4-2 5 15 16SOIC, 16TSSOP TBD

VCC3V to 5.5V

1000

1000 1000 2 2 15KV HBM 3.5 or 5 1 20SOIC, 20SSOP, 20TSSOP 2.38

1000

120

2 1

3 10KV HBM ±12, 5 20 20PDIP, 20SOIC 0.68

15KV HBM

15KV HBM 3.3 or 5 1 16SOIC, 16SSOP, 16TSSOP 1.94

15KV HBM

2KV HBM 2KV HBM –12 14 8PDIP, 8SOIC 0.72

3.3 or 5 1 16SOIC, 16SSOP, 16TSSOP 2.38

3.3 or 5

–12

28SOIC, 28SSOP, 28TSSOP 2.81

8PDIP, 8SOIC 0.72

Preview products are listed in bold blue.

Interface Selection Guide Texas Instruments 4Q 2006

Smart Card

MMC SD

LAN Port

Stereo Audio Line In

LED

Analog

Phone Line

Antenna

Plug

Satellite

Video Input

CATV

RF FE

LCD

Display

USB Plug

Keypad

Camera

Video Processor

PCI

EMAC

Video Port

EMIF

Bluetooth

Controller

ADSL

Cable MODEM

803.11

RS-232

1394 PHY

DVI

TMDS

Video

Decoder

3-Ch DAC

Stereo Audio

CODEC

Voice

CODEX

ADC

3-Ch Amp

Tuner

SDRAM

OFDM

QAM

QPSK

DEMOD

FLASH

CPU

PCI

Interface

IrDA

Video

Encoder

SDRAM FLASH

TV CH3-4 MOD

2-to-4 Wire

Interface

2-to-4 Wire

Interface

Adapter

RS-232

RS-232 Selection Guide (Continued)

Device (kbps) Drivers Receivers HBM (kV) Voltage(s) (V) (max) (mA) Pin/Package Price

Data Rate ESD Supply I

SN75C1406 120 3 3 2KV HBM ± 12, 5 0.45 16PDIP, 16SO, 16SOIC 0.86 SN75C185 120 3 5 2KV HBM ± 12, 5 0.75 20PDIP, 20SOIC 1.08 SN75C188 120 4 — 2KV HBM –12 0.16 14PDIP, 14SO, 14SOIC, 14SSOP 0.31 TL145406 120 3 3 2KV HBM ± 12, 5 20 16PDIP, 16SOIC 0.94 GD65232 120 3 5 — ±9, 5 38 20PDIP, 20SOIC, 20SSOP, 20TSSOP 0.29 GD75232 120 3 5 — ±9, 5 30 20PDIP, 20SOIC, 20SSOP, 20TSSOP 0.27 GD75323 120 5 3 — ± 12, 5 32 20SOIC 0.41 LT1030 120 4 — — –5 1 14PDIP, 14SOIC 1.44 MAX3222 120 2 2 — 3.3, 5 1 20SOIC, 20SSOP, 20TSSOP 1.36 MC1488 120 4 — — –9 25 14PDIP 0.20 MC1489 120 — 4 — 5 26 14PDIP 0.25 MC1489A 120 — 4 — 5 26 14PDIP 0.29 SN65C1154 120 4 4 — — — 20PDIP 3.42 SN65C1406 120 3 3 — ± 12, 5 — 16SOIC 1.80 SN65C3222 120 2 2 — 3.3 or 5 1 20SOIC, 20SSOP, 20TSSOP 3.24 SN75154 120 4 4 — 5 or 12 35 16PDIP, 16SO, 16SOIC 0.72 SN751701 120 1 1 — ± 5, 9, 12 11.9 8SO 1.30 SN75186 120 1 1 — ± 12, 5 — 24SOIC 1.80 SN75189 120 — 4 — 5 26 14PDIP, 14SO, 14SOIC 0.22 SN75189A 120 — 4 — 5 26 14PDIP, 14SO, 14SOIC 0.22 SN752232 120 6 10 — 5 +/-50 48SSOP, 48TSSOP 0.90 SN75C1154 120 4 4 — ± 12, 5 — 20PDIP, 20SO, 20SOIC 0.76 SN75C189 120 — 4 — 5 0.7 14PDIP, 14SO, 14SOIC 0.31 SN75C189A 120 — 4 — 5 0.7 14PDIP, 14SO, 14SOIC, 14SSOP 0.31 SN75C198 120 4 — — –12 0.32 14PDIP, 14SOIC 2.25 SN75C3222 120 2 2 — 3.3 or 5 1 20SOIC, 20SSOP, 20TSSOP 2.81 SN75LBC187 120 3 5 — 5 30 28SSOP 3.60 SN75LBC241 120 4 5 — 5 8 28SOIC 2.16 UA9636A 120 2 — — –12 36 8PDIP, 8SOIC 0.36 UC5170C 120 — — — — — 28PLCC 3.15 UC5180C 120 — 8 — 4.75 to 5.25 35 28PLCC 3.00 UC5181C 120 — 8 — 4.75 to 5.25 35 28PLCC 3.15

*Suggested resale price in U.S. dollars in quantities of 1,000.

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PDA interface application block diagram.

Texas Instruments 4Q 2006 Interface Selection Guide

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