Texas Instruments TDP158RSBEVM User Manual

User's Guide

SLLU257A–February 2017–Revised February 2018

TDP158 RSB Evaluation Module

This document describes how to use and configure the TDP158RSBEVM and provides recommendations for system hardware implementation. These recommendations are only guidelines and it is the designer’s responsibility to consider all system characteristics and requirements. Refer to the TDP158 data sheet (SLLSEX2) for technical details such as device operation, terminal description, and so forth.

Contents

1 Overview...................................................................................................................... 2

1.1 What is the TDP158? .............................................................................................. 2

1.2 What is the TDP158 EVM?........................................................................................ 2

2 Hardware Description ....................................................................................................... 3

2.1 Video Connectors for TDP158 Ports............................................................................. 3

2.2 Local I

2.3 Enable and Reset................................................................................................... 4

2.4 Power................................................................................................................. 4

2.5 Jumper Configuration .............................................................................................. 5

2.6 Component Population Configuration............................................................................ 5

2.7 USB Interface via TUSB3410 .................................................................................... 6

3 Quick Start Guide............................................................................................................ 6

4 Schematic and Bill of Materials ............................................................................................ 7

4.1 Schematic............................................................................................................ 7

4.2 Bill of Materials .................................................................................................... 11

5 Board Layout................................................................................................................ 13

6 Total Phase Aardvark I

7 References.................................................................................................................. 16

C Access.................................................................................................... 3

C Host Adapter Scripts........................................................................ 16

1 TDP158RSBEVM............................................................................................................ 2

2 TDP158RSBEVM Block Diagram ......................................................................................... 3

3 TDP158RSBEVM Schematics (1 of 4) - Input Connectors ............................................................ 7

4 TDP158RSBEVM Schematics (2 of 4) - TDP158RSB Implementation .............................................. 8

5 TDP158RSBEVM Schematics (3 of 4) - Regulators ................................................................... 9

6 TDP158RSBEVM Schematics (4 of 4) - TUSB3410 Implementation .............................................. 10

7 Layer 1 (Top) ............................................................................................................... 13

8 Layer 2 (GND) .............................................................................................................. 13

9 Layer 3 (PWR).............................................................................................................. 14

10 Layer 4 (PWR).............................................................................................................. 14

11 Layer 5 (GND) .............................................................................................................. 15

12 Layer 6 (Bottom)............................................................................................................ 15

1 Aardvark I 2 TDP158 Target I

C (J18) Pin-Out ................................................................................................. 4

C Address................................................................................................ 4

3 SW1 DIP Switch Setting.................................................................................................... 5

4 Component Configuration .................................................................................................. 5

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List of Figures

List of Tables

TDP158 RSB Evaluation Module

Overview

5 Bill of Materials ............................................................................................................. 11

Trademarks

Aardvark is a trademark of Total Phase, Inc.. All other trademarks are the property of their respective owners.

1 Overview

1.1 What is the TDP158?

The TDP158 is a DisplayPort to Transition Minimized Differential Signal (TMDS) redriver supporting Digital Video Interface (DVI) 1.0 and High Definition Multimedia Interface (HDMI) 1.4b and 2.0 output signals.

The TDP158 supports the Dual Mode Standard version 1.1 type 1 and type 2 through the DDC link. The TDP158 supports a data rate of up to 6Gbps per data lane to support UltraHD (4K×2K/60Hz) 8-bits per color high-resolution video and HDTV with 16-bit color depth at 1080p (1920×1080/60Hz).

1.2 What is the TDP158 EVM?

The TDP158 EVM is a PCB created to help customers evaluate the TDP158 device for video applications. This EVM can also be used as a hardware reference design for implementation of the TDP158 in the RSB package. PCB design and layout files can be provided upon request to provide PCB design illustrations of the routing and placement rules. Figure 1 is a picture of the EVM.

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TDP158 RSB Evaluation Module

Figure 1. TDP158RSBEVM

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USB2

Connector

5-V

Dongle

5-V to 3.3-V

LDO

3.3-V to 1.1-V LDO

Aardvark

Connector

TUSB3410

SCL_CTL SDA_CTL

DP Connector Top

HDMI Connector

IN0P/N IN1P/N IN2P/N

I3P/N

DDC_SCL/SDA

TMDS_D2P/N TMDS_D1P/N

TMDS_D0P/N TMDS_CLKP/N DDC_SCL/SDA

TDP158

(40-Pin RSB)

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1.2.1 What is Included in the TDP158RSBEVM?

The major components of the EVM are as follows:

• TDP158RSB

• Standard DP source connector (receptacle)

• Standard HDMI sink connector (receptacle)

• DC power regulators

• I2C programming interface for external I2C host connection

• USB interface (utility available)

2 Hardware Description

Figure 2 illustrates the EVM block diagram.

Hardware Description

2.1 Video Connectors for TDP158 Ports

The EVM has a DP connection for the source and an HDMI connection for the sink. J2 is a standard DP connector (Molex 47272-0001). J4 is a standard HDMI connector (Molex 4715-10001). There is a third video connection on the board for an HDMI source (J1), this function is not supported on the TDP158RSB EVM.

2.2 Local I2C Access

Access to the local I2C signals on the TDP158 is provided via input connector J18. Note that the I2C signal levels should be at 3.3 V when the I2C interface is accessed through the connector.

A standalone external I2C host can be connected via J18 for debug and control purposes. An example of an external I2C Host controller is the Total Phase Aardvark™ I2C/SPI Host Adapter (Total Phase Part#: TP240141). Sample scripts for this I2C Host controller are provided by request.

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Figure 2. TDP158RSBEVM Block Diagram

TDP158 RSB Evaluation Module

Hardware Description

Bit 7 (MSB)

1 0 1 1 1 1 0 0/1

Bit 6

NOTE: The target I2C address for the TDP158 can be modified with the EVM jumper settings.

2.3 Enable and Reset

There are three device enable and reset options to use with the EVM. A. Supervisor circuitry option

This is the default configuration on the TDP158 EVM. The enable (EN) signal is held low until the power good (PG) from the 3.3-V voltage regulator reaches a stable high-voltage level then is released high.

B. RC timing option

The C35 external capacitor and internal resistor are used to control the EN ramp time after the device is powered on. The C35 is a DNI (Do Not Install option) by default. The C35 needs to be installed and R70 needs to be uninstalled to enable this option.

C. External control option

A push button (SW1) is provided for manual control of the EN and OE input of the TDP158.

Table 1. Aardvark I2C (J18) Pin-Out

J18 Pin # Description J18 Pin # Description

1 SCL_CTL 2 GND 3 SDA_CTL 4 NC 5 NC 6 NC 7 NC 8 NC 9 NC 10 GND

Table 2. TDP158 Target I2C Address

TDP158 I2C Target Address

Bit 5

Bit 4

7 Bit Address = 5Eh

Bit 3

Bit 2

Bit 1

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Bit 0 (W/R)

2.4 Power

A DC power jack (J13) to accept a 5-V wall power adapter is provided on the EVM. The DC power jack (CUI Inc. PJ-202AH) has an inner diameter of 2.1 mm and an outer diameter of 5.5 mm. The tip of the 5-V power supply must be positive. A 5-V power supply of at least 1.5 A that meets the stated requirements can be used to power the TDP158RSBEVM. Power is provided to the EVM when SW1 is set to position 1.

Do not plug in any power source higher than the configured voltage (5 V).

Alternately, it is possible to power the EVM by connecting a USB micro cable to a host and setting SW1 to position 3. Note that this usage may exceed USB compliance requirements for power consumption.

TDP158 RSB Evaluation Module

CAUTION

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2.5 Jumper Configuration

Jumpers are provided to operate the device and EVM in different configurations, see Table 3.

DIP SW No Signal Name Description Default Config

J3 HPD_SNK JP 2–3 for external HPD

JP 2–1 for board_5V

J5 PRE JP 1–2 for 3 db

JP 2–3 for 0 db When I2C_EN is low

J6 SWAP JP 1–2 for SWAP

JP 2–3 for Normal When I2C_EN is low

J7 I2C_EN JP 1–2 for I2C_EN = High; Puts Device into I2C Control Mode

JP 2–3 for I2C_EN = Low; Puts Device into Pin Strap Mode

J8 TERM JP 1–2 for 75–150 Ω

JP 2–3 for 150–300 Ω NC; no termination

J9 VSADJ JP 1–2 for 5.5 kΩ

JP 2–3 for adjustable resistance (6 kΩ) NC – N/A

J10 EQ1_SEL_A0 JP 1–2 for:

• tabI2C Addr bit A0 = 1, when I2C_EN = H

• tabFixed EQ at 14 dB @ 3G, when I2C_EN = L JP 2–3 for:

• tabI2C Addr bit A0 = 0, when I2C_EN = H

• tabFixed EQ at 7.5 dB @ 3G, when I2C_EN = L NC for Adaptive EQ

J11 EQ2_SEL_A1 JP 1–2 for:

• tabI2C Addr bit A0 = 1, when I2C_EN = H

• tabFixed EQ at 14 dB @ 3G, when I2C_EN = L JP 2–3 for:

• tabI2C Addr bit A0 = 0, when I2C_EN = H

• tabFixed EQ at 7.5 dB @ 3G, when I2C_EN = L NC for Adaptive EQ

J12 SLEW JP 1–2 for fast

JP 2–3 for slowest NC for mid range

Hardware Description

Table 3. SW1 DIP Switch Setting

JP 2–3

JP 2–3 Puts Device into Pin Strap Mode

NC Note: When TMDS_CLOCK_RATIO_STATUS bit = 1, the TDP158 automatically sets source termination at 75 Ω to 150 Ω.

JP 2–3 The default value is 6 kΩ on early EVMs (prior to revision B)

2.6 Component Population Configuration

To allow the TDP158 EVM to support both HDMI or DP input, there are many components that need to be removed, placed, or modified depending on the board configuration. Table 4 provides a summary of the component configuration for the TDP158 RSB. In addition, the unused source receptacle can be depopulated.

Function Reference Designator TDP158 Differential Pair - IN C16, C17, C18, C19, C20, C21, C22, C23 populated with 0.1 µF Differential Pair - HDMI IN R9, R10, R11, R14, R15, R16, R17, R18 not populated (0 Ω) SDA or SCL - HDMI R12, R13 not populated (2 kΩ) Differential Pair - DP IN R26, R27, R31, R32, R33, R34, R35, R37 populated with 0 Ω SDA, SCL, or HPD - DP R29, R30 populated with 2 kΩ Pullup Differential Pair HDMI IN R1, R2, R3, R4, R5, R6, R7, R8 populated with 49.9 Ω

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Table 4. Component Configuration

TDP158 RSB Evaluation Module

Hardware Description

2.6.1 DDC Snoop Option

To accommodate systems that do not properly resend DDC commands after HPD goes low, TI has implemented an DDC snoop mode on the TDP158RSB EVM. This mode allows the HPD line to be routed around the TDP158, but remain connected to the TDP158 on the sink side to allow the TDP158 to snoop its state. This snoop mode is disabled, by default, on the TDP158RSB EVMs.

• Pop R22, R23, no pop R19, R20, R12, R13 for HDMI, DDC snoop

• Pop R24, R25, no pop R38, R39, R29, R30 for DP, DDC snoop

• Pop R19, R20, R12, R13, no pop R22, R23 for HDMI, DDC on

• Pop R38, R39, R29, R30, no pop R24, R25 for DP, DDC on

2.6.2 HPD Snoop Option

Not available for the TDP158RSB EVM.

2.7 USB Interface via TUSB3410

Use the following settings for USB interface via TUSB3410:

• J19 must be set to SDA – SDA_USB

• J17 must be set to SCL – SCL_USB

• Attached USB micro cable to J16 and to the host computer

• Start the Eye Scan Tool software. Refer to the EyesScan Tool User's Guide (SLUUBK2) for details.

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3 Quick Start Guide

Use the following steps for quick-start procedures:

1. Apply 5-V power to the EVM, turn on SW1. LED D1 should light up.

2. If using external I2C adapter instead of pin straps, configure the TDP158 at this step.

3. Plug in a DP source using a standard DP cable into J2 (Standard DP connector).

4. Plug in an HDMI video sink device into J4 (Standard HDMI connector) using a standard HDMI cable.

5. Video output on HDMI sink should be observed.

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Displ ayPort++

HDMI RX

Pop R22, R23, no pop R19, R20, R12, R13 for HDMI, DDC SNOOP Pop R19, R20, R12, R1 3, no pop R22, R23 for HDMI, DDC ON

Pop R38, R39, R29, R30 no pop R24, R25 for DP, DDC ON Pop R24, R25 no pop R38, R39, R29, R30 for DP, DDC snoop -

NOTE: DDC snoop enables 5V DDC operation

HPD_SRC is a 3.3V signal

HDMI specification requires a 5.0V signal

DP_SCL_SRC

DP_SDA_SRC

DPRX_GND

C_DPRX_LN1N C_DPRX_LN1P

C_DPRX_LN3N

C_DPRX_LN3P C_DPRX_LN2N

C_DPRX_LN2P

C_DPRX_LN0N

C_DPRX_LN0P DP_CAD

HDMI_SCL_SR_IN HDMI_SDA_SRC_IN

HDMI_IN_5V

BOARD_5V

BOARD_3P3V

BOARD_3P3VBOARD_3P3V

BOARD_5V

IN_D2P PAGE2,3

IN_D2N PAGE2,3 IN_D1P PAGE2,3

IN_D1N PAGE2,3 IN_D0P PAGE2,3

IN_D0N PAGE2,3 IN_CLKP PAGE2,3

IN_CLKN PAGE2,3

SCL_SRC PAGE2,3

SDA_SRC PAGE2,3

IN_CLKN PAGE2,3

IN_CLKP PAGE2,3 IN_D0N PAGE2,3

IN_D0P PAGE2,3 IN_D1N PAGE2,3 IN_D1P PAGE2,3

IN_D2N PAGE2,3

IN_D2P PAGE2,3

CEC PAGE2,3

SPDIF PAGE3

SCL_SRC PAGE2,3 SDA_SRC PAGE2,3

HDMI_SDA_SRC PAGE3

HDMI_SCL_SRC PAGE3

HPD_SRC PAGE2,3

R35 0

R11 0 - DNI

R30 2K

R36 1M

R17 0 - DNI

R37 0

Display_Port_Connector_Sink

GND7

GND8

GND9

GND10

ML_3n

GND1

ML_3p

ML_2n

GND2

ML_2p

ML_1n

GND3

ML_1p

ML_0n

GND4

ML_0p

CAD (GND)

DP_CEC (GND)

AUX_p (SCL)

GND6

AUX_n (SDA)

HPD

DP_PWR_RTN

DP_PWR

R12 2K - DNI

Case120Case2

Case322Case4

49.9

1 uF

R38 0

R26 0

R10 0 - DNI

R20 0 - DNI

R16 0 - DNI

49.9

R23

0 - DNI

R29 2K

R39 0

R31 0

R9 0 - DNI

R15 0 - DNI

R24 0 - DNI

LP1

R28 100K

R13 2K - DNI

R21 0 Ohm - DNI

R33 0

R19 0 - DNI

R34 0

R14 0 - DNI

49.9

R25 0 - DNI

R18 0 - DNI

R27 0

LP2

49.9

R22

0 - DNI

49.9

R32 0

49.9

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Schematic and Bill of Materials

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TDP158 RSB Evaluation Module

4 Schematic and Bill of Materials

This section contains the schematics and bill of materials for the EVM.

4.1 Schematic

Figure 3 through Figure 6 illustrates the EVM schematics.

Figure 3. TDP158RSBEVM Schematics (1 of 4) - Input Connectors

SDA_CTL and SCL_CTL are configuration inputs when I2C_ EN is low. J5 and J6 will set the values of these pins a nd J17 and J19 should not be populated .

HDMI TX

TDP158

SDA_CTL/PRE

SCL_CTL/SWAP

VDD_1P1VVCC_3P3V

VDD_1P1V VCC_3P3V

BOARD_5V

VCC_3P3V

VCC_3P3V VCC_3P3V VCC_3P3V

VCC_3P3V

IN_D2PPAGE2

IN_D2NPAGE2

IN_D1PPAGE2

IN_D1NPAGE2

IN_D0PPAGE2

IN_D0NPAGE2

IN_CLKPPAGE2

IN_CLKNPAGE2

HPD_SRCPAGE2

HDMI_SCL_SRC PAGE2

HDMI_SDA_SRC PAGE2

SDA_SRCPAGE2

SCL_SRCPAGE2

OE PAGE4

SCL_CTL/SWAPPAGE5

SDA_CTL/PREPAGE5

CECPAGE2

SPDIFPAGE2

R43 0 Ohm

R55

PTV0910K POT

R58 0 Ohm

J10

EQ1_A0 LO

1 2 3

R59 0 Ohm

C17

0.1uF

123

C14

10 pF

C2 10uF

I2C_EN LO

1 2 3

R41

0.01uF

R52 0 Ohm

PRE LO

1 2 3

C18

0.1uF

R46 0 Ohm

TERM LO

1 2 3

C11 10uF

4.7 pF

R57 0 Ohm

0.01uF

R40

C10

10 pF

C19

0.1uF

R48 0 Ohm

R44 0 Ohm

R49 0 Ohm

R56

47K

C15

4.7 pF

C16

0.1uF

0.01uF

C20

0.1uF

R50 0 Ohm

HDR3X1 M.1

DEFAULT

VSADJ

POT

1 2 3

C21

0.1uF

LP5

R45 0 Ohm

TDP158RSB

IN_D2P

IN_D2N

HPD_SRC

IN_D1P

IN_D1N

IN_D0P

IN_D0N

I2C_EN

IN_CLKP

IN_CLKN

VCC1

VDD1

SCL_CTL/SWAP13SDA_CTL/PRE

GND1

TERM16EQ1/A017VSADJ

VDD2

OUT_CLKN

OUT_CLKP

EQ2/A1

OUT_D0N

OUT_D0P

OUT_D1N

OUT_D1P

HPD_SNK

OUT_D2N

OUT_D2P

VDD3

SCL_SNK

SDA_SNK

SLEW

GND2

VCC2

SCL_SRC

SDA_SRC

VDD4

PAD

LP3

LP4

C22

0.1uF

10 pF

R51

5.49K

R54 0 Ohm

J11

EQ2_A1 LO

1 2 3

C12

0.01uF

SWAP LO

1 2 3

C23

0.1uF

J12

SLEW LO

1 2 3

R53 0 Ohm

C13

0.01uF

R47 0 Ohm

R42

0.01uF

D2P

GND1

D2N

D1P

GND2

D1N

D0P

GND3

D0N

CLKP

GND4

CLKN

CEC

UTILITY

SCL

SDA

DDC/CEC GND

HPD

GND5

GND6

GND7

GND8

Schematic and Bill of Materials

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TDP158 RSB Evaluation Module

Figure 4. TDP158RSBEVM Schematics (2 of 4) - TDP158RSB Implementation

1.1V LDO REGULATOR

5.0V BOOST

3.3V BUCK REGULATOR - 4V to 17V input

RESET

REG_PG

EN1P2

SS1P2

FB_1PT2V

PWRIN_SW

FB_3PT3V

TPS3808_CTPB_MANUAL_RESET

BOARD_3P3V

BOARD_1P1V

BOARD_3P3V

VDD_1P1V

VCC_3P3V

BOARD_3P3V

USB_5V

BOARD_5V

BOARD_3P3V

BOARD_IN

VCC_3P3V

BOARD_3P3V

VCC_3P3V

REG_PG PAGE4

REG_PGPAGE4

OE PAGE3

C37

220pF

LP10

GND

R69 10K

R63 240K

J15

1 2

LP8

2.2 uH

J14

1 2

SW1 3POS - SPDT

WALL - OFF - USB 5V

123

TPS3808

RESET#

GND

MR#3CT

SENSE

VDD

C33

10 pF

C24 220uF

C32 10uF

D1 LED Green 0805

5V PWR

C38

0.1uF

R68

4.99K

R70 0 Ohm

R67 499

C25 10uF

C26 22uF

R62 0 Ohm

J13

2.1mm x 5.5mm

2 3

C35

220nF - DNI

1 uH

C28 10uF

TPS62150A

SW1

SW2

SW3

AGND

FSW

DEF

SS/TR

AVIN

PVIN1

PVIN2

VOS

PGND115PGND216PAD

TPS74201RGWT

OUT1

NC12NC23NC3

IN1

IN2

IN3

IN4

BIAS

GND12NC413NC5

NC6

OUT4

OUT3

OUT2

PAD

R64 10K - DNI

C36

18pF

R65

4.7K

C29 10uF

C31

2.2uF

R72 0 Ohm

N.O.

SW2 PB_SWITCH

RESET

124

R60 100K

C30

0.01uF

LP6

3.3V

R71

4.7K

R61 750K

C34

1nF - DNI

LP9

GND

R66

1.87K

TPS61240

GND

VOUT

VIN

PAD

C27

3.3 nF

LP7

1.1V

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Schematic and Bill of Materials

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TDP158 RSB Evaluation Module

Figure 5. TDP158RSBEVM Schematics (3 of 4) - Regulators

AARDVARK CONNECTOR

TUSB3410

RSTIn

BOARD_3P3V

+1V8

USB_5V

+1V8

BOARD_3P3V

VCC_3P3V

SCL_CTL_USBPAGE5

SDA_CTL_USBPAGE5

SDA_CTL_USB PAGE5

SCL_CTL_USB PAGE5

SCL_CTL/SWAPPAGE3

SDA_CTL/PREPAGE3

TUSB3410

RESET

DP0

DM0

VCC1

PUR

SUSP

X1/CLKI

GND3

TEST0

TEST1

VREGEN

VDD1V8

DTR

RTS

SOUT/IR_SOUT

SIN/IR_SIN

RI/CP

DCD

DSR

CTS

VCC2

P3_0

P3_1

P3_3

SDA

SCL

GND218GND1

P3_4

CLKOUT

WAKEUP

C46

0.1uF

R80 1K

C45

22pF

C50

0.1uF

R83 2K

CRYSTAL

R81 1K

C4733pF

C51 1 uF

J19

SDA

SDA_USB

SDA_AAR

1 2 3

J16

USB Micro B

VBUS

GND

R73 1.5K

J17

SCL

SCL_USB

SCL_AAR

1 2 3

R84 2K

R76 10K

C4933pF

R79 10K

0402 5%

C44

0.01uF

R82 15K

C42

2.2uF

R75 33

R77 1K

C40

0.01uF

R78 1K

J18

CONN PCB5x2-S

2 4 6 8 10

1 3 5 7 9

CAT24C256WI-GT3

Vcc

SDA

Vss

SCL

C43

0.1uF

C48

22pF

C39

0.01uF

C41

0.1uF

R74 33

Schematic and Bill of Materials

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TDP158 RSB Evaluation Module

Figure 6. TDP158RSBEVM Schematics (4 of 4) - TUSB3410 Implementation

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Schematic and Bill of Materials

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TDP158 RSB Evaluation Module

4.2 Bill of Materials

Table 5 lists the EVM BOM.

Table 5. Bill of Materials

Item Qty Reference Part PCB Footprint Manufacturer Part Number Pkg Description

1 2 C1,C51 1uF 603 Taiyo Yuden LMK107B7105KA-T 603 CAP CER 1UF 10V 10% X7R 0603 2 5 C38,C41,C43,C46,C50 0.1uF 402 Yageo CC0402KRX5R6BB104 402 CAPCER 0.1UF 10V 10% X5R 0402 3 6 C2,C11,C25,C28,C29,C3

10uF 805 TDK C2012X5R1C106K085AC 805 CAP CER 10UF 16V 10% X5R 0805

4 8 C16,C17,C18,C19,C20,C

21,C22,C23

0.1uF 201 TDK C0603X5R0J104M 201 CAPCER .10UF 6.3V X5R 0201

5 11 C3,C4,C5,C8,C9,C12,C1

3,C30,C39,C40,C44

0.01uF 402 Murata GRM155R71H103KA88D 402 CAPCER 1000PF 50V 10% X7R 0402

6 4 C6,C10,C14,C33 10 Pf 402 Murata GRM1555C1H100JA01D 402 CAP CER 10PF 50V 10% X7R 0402 7 1 C36 18pF 402 AVX 04025A180JAT2A 402 CAP CERM 18PF 5% 50V NP0 0402 8 1 C37 220pF 402 Taiyo Yuden UMK105B7221KV-F 402 CAP CER 220PF 50V 10% X7R 0402

9 1 C24 220uF 7343 Kemet T491D227K016AT 7343 CAP TANT 220UF 16V 10% 2917 10 1 C27 3.3nF 402 Samsung CL05B332KB5NNNC 402 CAP CER 3300PF 50V 10% X7R 0402 11 1 C26 22uF 805 Murata GRM21BR60J226ME39L 805 CAP CER 22UF 6.3V 20% X5R 0805 12 2 C31,C42 2.2uF 805 Taiyo Yuden EMK212BJ225KG-T 805 CAP CER 2.2UF 16V 10% X5R 0805 13 0 C34,C35,R9,R10,R11,R1

4,R15,R16,R17,R18, R19,R20,R22,R23,R24,R 25, R12,R13,R21,R64

DNI 402 / 201

14 2 C45,C48 22pF 402 Murata GRM1555C1H220JA01D 402 CAP CER 22PF 50V 5% NP0 0402 15 2 C47,C49 33pF 402 Murata GRM1555C1H330JA01D 402 CAP CER 33PF 50V 5% NP0 0402 16 2 C7,C15 4.7pF 402 Murata GRM1555C1H4R7CA01D 402 CAP CER 4.7PF 50V 5% NP0 0402 17 1 D1 LED Green 0805 805 LiteOn LTST-C171GKT 805 LED GREEN CLEAR THIN 0805 SMD 18 2 J14,J15 HDR2X1 M .1 HDR_THVT_1x2_100 3M 961102-6404-AR HDR2X1 CONN HEADER VERT SGL 2POS GOLD 19 11 J3,J5,J6,J7,J8,J9,J10,J1

1,J12,J17,J19

HDR3X1 M .1 HDR_THVT_1x3_100 3M 961103-6404-AR HDR3X1 CONN HEADER VERT SGL 3POS GOLD

20 1 J2 Display_Port_Connect

or_Sink_0

DISPLAYPORT Molex 47272-0001 DISPLAYPORT CONN RCPT 20POS UDI R/A SMD

21 1 J18 Header 5x2 0.1" thru-

hole

con_thvt_shrd_2x5_100_m 3M N2510-6002-RB con_thvt_shrd_2x5_100_mCONN HEADER 10 POS STRGHT GOLD

22 1 J13 2.1mm x 5.5mm PJ-202AH CUI Inc. PJ-202AH (PJ-002AH) 2.1mm x 5.5mm CONN PWR JACK 2.1X5.5MM HIGH CUR 23 1 J16 USB Micro B USBMicro B FCI 10103592-0001LF USB MICRO CONN RCPT REV MICRO USB B R/A 24 10 LP1,LP2,LP3,LP4,LP5,L

P6,LP7,LP8,LP9,LP10

LP TESTLOOP Keystone Electronics 5006 THRU TESTPOINT PC COMPACT .063"D BLK

25 1 L1 2.2 uH 1008 TDK VLS252010ET-2R2M 1008 INDUCTOR POWER 2.2UH 1.3A SMD 26 1 L2 1 uH 1008 TDK NLCV25T-1R0M-EFR 1008 INDUCTOR POWER 1.0UH 1008 27 2 J1,J4 HDMI CON_HDMI_RT_19_0p50mm Molex 471510001 CON_HDMI_RT_19_0p5

0mm

CONN RCPT 19POS HDMI RT ANG SMD

28 8 R1,R2,R3,R4,R5,R6,R7,

49.9 201 Panasonic ERJ-1GEF49R9C 201 RES SMD 49.9 OHM 1% 1/20W 0201

29 5 R42,R77,R78,R80,R81 1K 402 Yageo RC0402JR-071KL 402 RES SMD 1K OHM 5% 1/16W 0402

Schematic and Bill of Materials

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TDP158 RSB Evaluation Module

Table 5. Bill of Materials (continued)

Item Qty Reference Part PCB Footprint Manufacturer Part Number Pkg Description

30 2 R28,R60 100K 402 Yageo RC0402JR-07100KL 402 RES SMD 100K OHM 5% 1/16W 0402 31 10 R26,R27,R31,R32,R33,R

34,R35,R37,R38,R39

0 201 Panasonic ERJ-1GN0R00C 201 RES SMD 0.0 OHM JUMPER 1/20W

32 6 R29,R30,R40,R41,R83,R

2K 402 Yageo RC0402JR-072KL 402 RES SMD 2K OHM 5% 1/16W 0402

33 17 R43,R44,R45,R46,R47,R

48,R49,R50,R52,R53,R5 4,R57,R58,R59,R62,R70, R72

0 Ohm 402 Panasonic ERJ-2GE0R00X 402 RES SMD 0.0 OHM JUMPER 1/10W

34 1 R36 1M 402 Yageo RC0402JR-071ML 402 RES SMD 1M OHM 5% 1/16W 0402 35 1 R51 5.49K 402 Panasonic ERJ-2RKF5491X 402 RES SMD 5.49K OHM 1% 1/10W 0402 36 1 R55 PTV09 10K POT THRUHOLE Bourns PTV09A-4015F-B103 THRUHOLE POT 10K OHM 9MM SQ .05W CARB 37 3 R69,R76,R79 10K 402 Yageo RC0402JR-0710KL 402 RES SMD 10K OHM 5% 1/16W 0402 38 2 R65,R71 4.7K 402 Yageo RC0402JR-074K7L 402 RESSMD 4.7K OHM 5% 1/16W 0402 39 1 R67 499 402 Vishay Dale CRCW0402499RDHEDP 402 RES SMD 499 OHM 0.5% 1/16W 0402 40 1 R61 750K 402 Vishay Dale CRCW0402750KJNED 402 RES SMD 750K OHM 5% 1/16W 0402 41 1 R63 240K 402 Vishay Dale CRCW0402240KJNED 402 RES SMD 240K OHM 5% 1/16W 0402 42 1 R66 1.87K 402 Stackpole RMCF0402FT1K87 402 RES SMD 1.87K OHM 1% 1/16W 0402 43 1 R68 4.99K 402 Yageo RC0402FR-074K99L 402 RES SMD 4.99K OHM 1% 1/16W 0402 44 1 R73 1.5K 402 Yageo RC0402JR-071K5L 402 RES SMD 1.5K OHM 5% 1/16W 0402 45 2 R74,R75 33 201 Yageo RC0201JR-0733RL 201 RES SMD 33 OHM 5% 1/20W 0201 46 1 R82 15K 402 Yageo RC0402JR-0715KL 402 RES SMD 15K OHM 5% 1/16W 0402 47 1 R56 47K 402 Rohm MCR01MRTJ473 402 RES SMD 47K OHM 5% 1/16W 0402 48 1 SW2 PB_SWITCH SW_MOM_2NO OMRON B3SN-3012P SW_MOM_2NO SWITCH TACTILE SPST-NO 0.05A 24V 49 1 SW1 3POS_SPDT THRUHOLE_3POS NKK Switches MS13ANW03 THRUHOLE_3POS SW SLIDE SPDT 6A SILVER STR 125V 50 1 U1 TDP158RSB 40_RSB TI TDP158RSB 40_RSB 6 Gbps AC Coupled to TMDS™/HDMI™ Redriver 51 1 U5 TPS3808G30DBVT 6DBV TI TPS3808G30DBVT 6DBV IC VOLT SUPERVISOR 3.0V SOT23-6 52 1 U2 TPS62150A RGT16 TI TPS62150ARGTT RGT16 IC REG BUCK SYNC ADJ 1A 16QFN 53 1 U4 TPS61240 6DRV TI TPS61240DRVT 6DRV IC REG BOOST SYNC 5V 0.45A 6SON 54 1 U3 TPS74201RGWT RGW20 TI TPS74201RGWT RGW20 IC REG LDO ADJ 1.5A 20VQFN 55 1 U6 TUSB3410 LQFP32 TI TUSB3410VF LQFP-32 IC CONV SERIAL-TO-USB 32-LQFP 56 1 U7 CAT24C256WI-GT3 8SOIC ON Semiconductor CAT24C256WI-GT3 8SOIC IC EEPROM 256KBIT 400KHZ 8SOIC 57 1 Y1 12 MHz Crystal ECX-32 ECS Inc. ECS-120-20-33-TR 4-SMD CRYSTAL 12MHZ 20PF SMD 58 4 EVM Assembly 0.75" Standoff 4-40 - F/F Keystone Electronics 2029 OD 0.187" ROUND STANDOFF 4-40 ALUM 3/4" 59 4 EVM Assembly 0.25"- Stainless Steel

Screws

4-40 Phillips Panhead Building Fasteners PMSSS440 0025 PH OD 0.187" MACHINE SCREW PAN PHILLIPS 4-40

60 9 Shunts Shunt SHUNT 3M 969102-0000-DA SHUNT SHUNT JUMPER .1" BLACK GOLD 61 1 PCB TDP158RSBEVM ANY INT043 Printed Circuit Board

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5 Board Layout

Figure 7 through Figure 12 display the EVM board layouts.

Board Layout

Figure 7. Layer 1 (Top)

Figure 8. Layer 2 (GND)

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Board Layout

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Figure 9. Layer 3 (PWR)

TDP158 RSB Evaluation Module

Figure 10. Layer 4 (PWR)

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Board Layout

Figure 11. Layer 5 (GND)

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Figure 12. Layer 6 (Bottom)

TDP158 RSB Evaluation Module

Total Phase Aardvark I2C Host Adapter Scripts

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6 Total Phase Aardvark I2C Host Adapter Scripts

Request the latest scripts from your TI representative.

7 References

1. TDP158 6-Gbps AC-Coupled to TMDS™/HDMI™ Redriver

2. Aardvark™ Adapter User Manual

3. High-Definition Multimedia Interface Specification Version 1.4b.

4. High-Definition Multimedia Interface Specification Version 2.0.

Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Original (February 2017) to A Revision .................................................................................................. Page

• Changed the EVM Figure 1.............................................................................................................. 2

• Corrected Reference Designators column in Table 4 ................................................................................ 5

• Corrected TPD158 coulmn resistor values in Table 4................................................................................ 5

• Changed the Section 2.6.1............................................................................................................... 6

• Changed the Section 2.6.2............................................................................................................... 6

• Changed From: TDP158 product preview To: the production datasheet in Section 7 ......................................... 16

Revision History

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STANDARD TERMS FOR EVALUATION MODULES

1. Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, and/or documentation which may be provided together or separately (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance with the terms set forth herein. User's acceptance of the EVM is expressly subject to the following terms.

1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions set forth herein but rather shall be subject to the applicable terms that accompany such Software

1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned, or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production system.

2 Limited Warranty and Related Remedies/Disclaimers:

2.1 These terms do not apply to Software. The warranty, if any, for Software is covered in the applicable Software License Agreement.

2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM to User. Notwithstanding the foregoing, TI shall not be liable for a nonconforming EVM if (a) the nonconformity was caused by neglect, misuse or mistreatment by an entity other than TI, including improper installation or testing, or for any EVMs that have been altered or modified in any way by an entity other than TI, (b) the nonconformity resulted from User's design, specifications or instructions for such EVMs or improper system design, or (c) User has not paid on time. Testing and other quality control techniques are used to the extent TI deems necessary. TI does not test all parameters of each EVM. User's claims against TI under this Section 2 are void if User fails to notify TI of any apparent defects in the EVMs within ten (10) business days after delivery, or of any hidden defects with ten (10) business days after the defect has been detected.

2.3 TI's sole liability shall be at its option to repair or replace EVMs that fail to conform to the warranty set forth above, or credit User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the warranty period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to repair or replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall be warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day warranty period.

3 Regulatory Notices:

3.1 United States

3.1.1 Notice applicable to EVMs not FCC-Approved:

FCC NOTICE: This kit is designed to allow product developers to evaluate electronic components, circuitry, or software associated with the kit to determine whether to incorporate such items in a finished product and software developers to write software applications for use with the end product. This kit is not a finished product and when assembled may not be resold or otherwise marketed unless all required FCC equipment authorizations are first obtained. Operation is subject to the condition that this product not cause harmful interference to licensed radio stations and that this product accept harmful interference. Unless the assembled kit is designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must operate under the authority of an FCC license holder or must secure an experimental authorization under part 5 of this chapter.

3.1.2 For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:

CAUTION

This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment.

FCC Interference Statement for Class A EVM devices

NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to correct the interference at his own expense.

FCC Interference Statement for Class B EVM devices

NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

• Reorient or relocate the receiving antenna.

• Increase the separation between the equipment and receiver.

• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.

• Consult the dealer or an experienced radio/TV technician for help.

3.2 Canada

3.2.1 For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210 or RSS-247

Concerning EVMs Including Radio Transmitters:

This device complies with Industry Canada license-exempt RSSs. Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may

cause undesired operation of the device.

Concernant les EVMs avec appareils radio:

Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.

Concerning EVMs Including Detachable Antennas:

Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device.

Concernant les EVMs avec antennes détachables

Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de l'émetteur

3.3 Japan

3.3.1 Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に

輸入される評価用キット、ボードについては、次のところをご覧ください。

http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page

3.3.2 Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certified by TI as conforming to Technical Regulations of Radio Law of Japan.

If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required to follow the instructions set forth by Radio Law of Japan, which includes, but is not limited to, the instructions below with respect to EVMs (which for the avoidance of doubt are stated strictly for convenience and should be verified by User):

1. Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for Enforcement of Radio Law of Japan,

2. Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to EVMs, or

3. Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan.

【無線電波を送信する製品の開発キットをお使いになる際の注意事項】開発キットの中には技術基準適合証明を受けていないものがあります。技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの措置を取っていただく必要がありますのでご注意ください。

1. 電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用いただく。

2. 実験局の免許を取得後ご使用いただく。

3. 技術基準適合証明を取得後ご使用いただく。

なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。

上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。日本テキサス・インスツルメンツ株式会社東京都新宿区西新宿６丁目２４番１号西新宿三井ビル

3.3.3 Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page

電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧ください。http:/

/www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page

3.4 European Union

3.4.1 For EVMs subject to EU Directive 2014/30/EU (Electromagnetic Compatibility Directive): This is a class A product intended for use in environments other than domestic environments that are connected to a

low-voltage power-supply network that supplies buildings used for domestic purposes. In a domestic environment this product may cause radio interference in which case the user may be required to take adequate measures.

4 EVM Use Restrictions and Warnings:

4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.

4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information related to, for example, temperatures and voltages.

4.3 Safety-Related Warnings and Restrictions:

4.3.1 User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or property damage. If there are questions concerning performance ratings and specifications, User should contact a TI field representative prior to connecting interface electronics including input power and intended loads. Any loads applied outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative. During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit components may have elevated case temperatures. These components include but are not limited to linear regulators, switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the information in the associated documentation. When working with the EVM, please be aware that the EVM may become very warm.

4.3.2 EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the dangers and application risks associated with handling electrical mechanical components, systems, and subsystems. User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees, affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or designees.

4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal, state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local requirements.

5. Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as accurate, complete, reliable, current, or error-free.

6. Disclaimers:

6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY MATERIALS PROVIDED WITH THE EVM (INCLUDING, BUT NOT LIMITED TO, REFERENCE DESIGNS AND THE DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL FAULTS." TI DISCLAIMS ALL OTHER WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT NOT LIMITED TO ANY EPIDEMIC FAILURE WARRANTY OR IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY THIRD PARTY PATENTS, COPYRIGHTS, TRADE SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS.

6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS SHALL BE CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY OTHER INDUSTRIAL OR INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD PARTY, TO USE THE EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY INVENTION, DISCOVERY OR IMPROVEMENT, REGARDLESS OF WHEN MADE, CONCEIVED OR ACQUIRED.

7. USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES, EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS. THIS OBLIGATION SHALL APPLY WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY OTHER LEGAL THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED.

8. Limitations on Damages and Liability:

8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE TERMS OR THE USE OF THE EVMS , REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED TO, COST OF REMOVAL OR REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES, RETESTING, OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS, LOSS OF SAVINGS, LOSS OF USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL BE BROUGHT AGAINST TI MORE THAN TWELVE (12) MONTHS AFTER THE EVENT THAT GAVE RISE TO THE CAUSE OF ACTION HAS OCCURRED.

8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY USE OF AN EVM PROVIDED HEREUNDER, INCLUDING FROM ANY WARRANTY, INDEMITY OR OTHER OBLIGATION ARISING OUT OF OR IN CONNECTION WITH THESE TERMS, , EXCEED THE TOTAL AMOUNT PAID TO TI BY USER FOR THE PARTICULAR EVM(S) AT ISSUE DURING THE PRIOR TWELVE (12) MONTHS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE CLAIMED. THE EXISTENCE OF MORE THAN ONE CLAIM SHALL NOT ENLARGE OR EXTEND THIS LIMIT.

9. Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s) will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s), excluding any postage or packaging costs.

10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas, without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas. Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief in any United States or foreign court.

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265

IMPORTANT NOTICE FOR TI DESIGN INFORMATION AND RESOURCES

Texas Instruments Incorporated (‘TI”) technical, application or other design advice, services or information, including, but not limited to, reference designs and materials relating to evaluation modules, (collectively, “TI Resources”) are intended to assist designers who are developing applications that incorporate TI products; by downloading, accessing or using any particular TI Resource in any way, you (individually or, if you are acting on behalf of a company, your company) agree to use it solely for this purpose and subject to the terms of this Notice.

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Texas Instruments TDP158RSBEVM User Manual

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