Small-Outline (DW) and Shrink
Small-Outline (DB) Packages, Ceramic Chip
Carriers (FK) and Flatpacks (W), and
Standard Plastic and Ceramic 300-mil DIPs
(J, N)
description
These octal buffers and line drivers are designed
specifically to improve both the performance and
density of 3-state memory address drivers, clock
drivers, and bus-oriented receivers and
transmitters. Taken together with the ′BCT240
and ′BCT241, these devices provide the choice of
selected combinations of inverting and
noninverting outputs, symmetrical OE
output-enable) inputs, and complementary OE
and OE inputs.
(active-low
SN54BCT244 ...J OR W PACKAGE
SN74BCT244 . . . DB OR DW OR N PACKAGE
SN54BCT244 . . . FK PACKAGE
1A2
2Y3
1A3
2Y2
1A4
(TOP VIEW)
1OE
1A1
2Y4
1A2
2Y3
1A3
2Y2
1A4
2Y1
GND
3 2 1 20 19
4
5
6
7
8
9 10 11 12 13
1
20
2
19
3
18
4
17
5
16
6
15
7
14
8
13
9
12
10
11
(TOP VIEW)
2Y4
1A1
1OE
V
CC
2OE
1Y1
2A4
1Y2
2A3
1Y3
2A2
1Y4
2A1
CC
V
1Y1
18
2A4
17
1Y2
16
2A3
15
1Y3
14
The ′BCT244 is organized as two 4-bit buffers/line
drivers with separate output-enable (OE) inputs.
When OE is low, the device passes data from the
A inputs to the Y outputs. When OE
is high, the
outputs are in the high-impedance state.
The SN54BCT244 is characterized for operation
over the full military temperature range of –55°C
to 125°C. The SN74BCT244 is characterized for
operation from 0°C to 70°C.
FUNCTION TABLE
(each buffer)
INPUTS
OEA
LHH
LLL
HXZ
OUTPUT
Y
2Y1
GND
2A1
1Y4
2A22OE
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
Copyright 1994, Texas Instruments Incorporated
2–1
SN54BCT244, SN74BCT244
OCTAL BUFFERS/DRIVERS
WITH 3-STATE OUTPUTS
SCBS006E – OCTOBER 1987 – REVISED APRIL 1994
1
2
4
6
8
19
11
13
15
17
†
EN
EN
logic symbol
1OE
1A1
1A2
1A3
1A4
2OE
2A1
2A2
2A3
2A4
†
This symbol is in accordance with ANSI/IEEE Std 91-1984
and IEC Publication 617-12.
18
16
14
12
logic diagram (positive logic)
1OE
1Y1
1Y2
1Y3
1Y4
9
2Y1
7
2Y2
5
2Y3
3
2Y4
1A1
1A2
1A3
1A4
2OE
2A1
2A2
1
2
4
6
8
19
11
13
18
16
14
12
1Y1
1Y2
1Y3
1Y4
9
2Y1
7
2Y2
2A3
2A4
15
173
5
2Y3
2Y4
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
VCC = 4.5 V to 5.5 V,
CL = 50 pF,
R1 = 500 Ω,
R2 = 500 Ω,
TA = MIN to MAX
†
UNIT
2–4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
IMPORTANT NOTICE
T exas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue
any product or service without notice, and advise customers to obtain the latest version of relevant information
to verify, before placing orders, that information being relied on is current and complete. All products are sold
subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those
pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent
TI deems necessary to support this warranty . Specific testing of all parameters of each device is not necessarily
performed, except those mandated by government requirements.
CERTAIN APPLICA TIONS USING SEMICONDUCT OR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF
DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL
APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR
WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER
CRITICAL APPLICA TIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERST OOD TO
BE FULLY AT THE CUSTOMER’S RISK.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other
intellectual property right of TI covering or relating to any combination, machine, or process in which such
semiconductor products or services might be or are used. TI’s publication of information regarding any third
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
Copyright 1998, Texas Instruments Incorporated
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