Application Report
SSZA002B–August 2009–Revised August 2015
Plastic Ball Grid Array (PBGA)
SSZA002B – August 2009 – Revised August 2015 Plastic Ball Grid Array (PBGA) 1
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SSZA002B – August 2015
1.0 Introduction:
The Plastic Ball Grid Array or PBGA package, qualified and ramped by Texas Instruments Philippines is a cavityup laminate based substrate package in which the die is attached to the substrate in the norm al die up manner. The
wire- bonded device and the complete assembly is then overmolded and solder balls attached to form the package.
This package provides a cost-effective packaging solution, offering higher density over traditional leadframe
packages. Texas Instruments’ advanced design and simulation capabilities enable package optimizations needed for
maximum electrical and thermal performance. The PBGA package is offered in a range of sizes from 17mm x 17mm
to 35mm x 35mm, in ball pitch of 0.8mm and 1.0mm, to provide a ball count ranging from 208 to 976 balls. PBGA
ckages are available in 2 and 4 layer substrate designs.
pa
Conventional PBGA
Substrate and Structure
Wire Bonds
Conductor Traces
Die
Transfer Molded Overmold
Solder Balls
PBGA Package Configuration
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SSZA002B – August 2015
Features
Dimensions (mm)
Comments
Substrates Thickness (2ML)
0.56 +/- 0.04
Overall thickness ( Core+SR+inner layer+outer layer)
Substrate Thickness (4ML)
0.61 +/- 0.05
Overall thickness ( Core+SR+inner layer+outer layer)
Copper Thickness
0.015
Trace/Space Widths
0.05
minimum
Soldermask Thickness
0.02
Over Copper
Via
0.2
Normal
Solder Pad Cu
0.60~0.65
Solder Mask Opening
0.40~0.50
Typical process flow for PBGA assembly
WAFER
Typical Nominal Dimensions of Selected pBGA Substrate Features
SA
PMC
BALL ATTACH
ENCAPSULATION
IR REFLOW
PACK/PACK LA
SHIP
inc. Bake
DIE
VM/LA
HEATSLUG DISPENSE
BALL INSPECT
Plasma
Clean
FLUX
WIRE
Plasma
Clean
MARK/
SINGULAT
ELECTRICAL
V A
Ω
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SSZA002B – August 2015
17x17 23x23 27x27 31x31 35x35
208ZFE/ZKB 288ZDQ 388ZDS 772ZXM 976ZEY
256ZDH/ZFE/ZKB 324ZDU/ZDW 456ZXF/ZXZ 900ZXM
352ZDU 484ZED
376ZDW/ZDU 520ZXF
388ZDW 580ZEQ
420ZDQ 632ZXZ
432ZDU
0.8
640ZKK
pBGA Package Product Guide
Packag e S ize (mm)
Pitch
(mm)
1
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SSZA002B – August 2015
A typical package outline with 1mm pitch and appropriate tolerances are shown below.
ZXZ (S-PBGA-N456)
2.0 PC Board Design Guidelines:
The PBGA is compliant with JEDEC MS-034. IPC-SM-782 usually dictates the guidelines by which the PC Board
(PCB) pattern should be designed. Working with an Electronics Manufacturing Service provider and/or PCB design
house with experience designing and mounting this package type is recommended. The following guidelines are
offered based on best known practice at the moment based on Texas Instruments evaluations and research.
Package Height .......... ranges depending on body size, ball size and layer count.
Package Size ............. Ranging from 17mm x 17mm to 35mm x35mm
Ball Pitch .................... 0.8 mm and 1.0mm
The PBGA package is primarily composed of copper laminated BT substrate. This adds stiffness to the package
and uniform expansion during board mount and board level temperature cycling. Also, because of cavity up
configuration, the solder balls for this package may be placed in a complete array over the entire bottom side.
Therefore, balls immediately under the die may be used as thermal paths to further enhance the thermal performance.
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SSZA002B – August 2015
All measurements in mm
Ball size, SMO, Pad Size and Apertures are shown in Diameters
PCB Design
Stencil Design
SMO
Pad Size
Thickness
Aperature
SMD
0.400
0.500
NSMD
0.500
0.400
SMD
0.450
0.550
NSMD
0.550
0.450
2.1 PCB Land Pattern and Solder Mask Design
The solder lands on the package side are always Solder Mask Defined (SMD). The land pattern on the PCB
should be designed to correspond with the land pattern on the package. The land on the PCB should be Non-Solder
Mask Defined (NSMD) in order to realize the best board level reliability performance.
SOLDER PAD GEOMETRY
For NSMD pads, TI recommends a clearance (typically 3 mils) between the copper pad and solder mask to avoid
overlap between the solder joint and solder mask due to mask registration tolerances.
The diameter of the solder ball land on the PCB should be the same or up to 20% less than that of the package
substrate solder land. The trace leading into the NSMD ball land on the PCB should not exceed more than 50% of the
land diameter. Again, this is to avoid too much solder wetting this lead-in to the ball thereby creating too much ball
collapse and possibly i mpacting board level reliability.
Optium Land Configurations
Ball Pitch Solder Mask Type
0.8
1
Note: Area Aspect Ratio = Area of Aperture / Area of Aperture Wall
Note: For optial release of solder paste, it is recommended Area Aspect Ratio ≥ 0.66
0.152 0.400 0.66
0.152 0.450 0.74
Area Aspect Ratio
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SSZA002B – August 2015
2.2 Escape routing guidelines
A typical PBGA has four or five rows of solder balls around the periphery of the package. The number of lines routed (N)
between the pads on the PCB is defined by the pad size and trace (width and spacing) fabrication capabilities of the PCB
manufacturer. For NSMD pads, exposure of underlying copper traces is forbidden, so the diameter and tolerance of the
solder mask opening define D. The following relationship is used to define N:
Figure 8. P = Pad Pitch
D = Pad Diameter
L = Line Width
S = Line Space
As shown below, 1 mm ball pitch with 4 rows of solder balls can be routed to 4 layers of PCB which uses a 0.125 mm
line width and 0.125 mm line space.
1 mm Ball Pitch with 0.125 mm Line Width/Spacing
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SSZA002B – August 2015
Routing for 5 rows of solder ball
1 mm Ball Pitch with 0.1 mm Line Width/Spacing
3.0 Assembly Recommendations
3.1 PROCESS FLOW & SET-UP RECOMMENDATION
The BGA surface mount assembly process flow includes:
• PCB plating requirements
• Screen printing the solder paste on the PCB
• Monitoring the solder paste volume (uniformity) , preferably using solder paste inspection machine
• Package placement using standard SMT placement equipment
• X-ray inspection prior to reflow to check for placement accuracy and other defects such as solder paste bridging
• Reflow and flux residue cleaning (dependent upon the paste type)
• X-ray inspection after reflow to check for defects such as solder bridging & voids
3.2 PCB PLATING RECOMMENDATIONS
A uniform PCB plating thickness is key for high assembly yield.
• PCB with Organic Solderability Preservative coating (OSP) finish is recommended.
• For PCBs with electroless or immersion gold finish, the gold thickness recommendation is 0.15 μm ±0.05 μm to avoid
solder joint embrittlement. For PCBs with Hot Air Solder Leveling (HASL), the surface flatness should be controlled
within 28 μm.
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SSZA002B – August 2015
3.3
SOLDER PASTE PRINTING
Solder paste deposition by the stencil-printing process involves the transfer of the solder paste through pre-defined
apertures with the application of pressure. Stencil parameters such as aperture area ratio and the stencil fabrication
method have a significant impact on paste deposition. Inspection of the stencil prior to placement of the BGA package is
highly recommended to improve board assembly yields. Aperture size to PCB pad size is typically 1:1 ratio with 0.100 to
0.125 mm thick stencil.
Three typical stencil fabrication methods include:
• Chem-etch
• Laser cut
• Electroform (Metal additive processes)
Nickel-plated electr o po lis hed ch em-etch or laser cut with tapered aperture walls (5° tapering) is recommended to
facilitate paste release.
3.4
PASTE RECOMMENDATIONS
Type 3/4 water soluble or no-clean solder pastes are acceptable.
o 37%Pb-63%Sn eutectic paste for tin-lead process with tin-lead PBGA device
o Sn-3%Ag-0.5%Cu lead free paste for lead free process lead free PBGA device
3.5 COMPONENT PLACEMENT
BGA packages are placed using standard pick and place equipment with a placement accuracy of ±0.10 mm.
Component pick and place systems are composed of a vision system that recognizes and positions the component and
a mechanical system which physically performs the pick and place operation. Two commonly used types of vision
systems are: (1) a vision system that locates a package silhouette and (2) a vision system that locates individual bumps
on the interconnect pattern. Both methods are valid since the parts align due to self-centering feature of the BGA solder
joint during solder reflow. The latter vision system while providing greater accuracy tends to be more expensive and time
consuming. BGAs have excellent self-alignment during solder reflow if a minimum of 50% of the ball is aligned with the
pad. The 50% accuracy is in both the X and Y direction as determined by the following relation.
BGA self centering
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SSZA002B – August 2015
3.6 REFLOW
Finally, successful reflow cycles strike a balance among temperature, timing, and length of cycle. Mistiming may lead
to excessive fluxing activation, oxidation, excessive voiding, or even damage to the package. Heating the paste too
hot, too quickly before it melts can also dry the paste, which leads to poor wetting. Process development is n eeded
to optimize reflow profiles for each solder paste/flux combination
The BGA may be assembled using standard IR or IR convection SMT reflow processes. As with other packages, the
thermal profile for specific board locations must be determined. The BGA is qualified for up to three reflow cycles at 245°
C peak (J-STD-020). The actual temperature used in the reflow oven is a function of:
• Board density
• Board geometries
• Component location on the board
• Size of surrounding components
• Component mass
• Furnace loading
• Board finish
• Solder paste types
It is recommended that the temperature profile be validated at the ball location of the BGA as well as several other
locations on the PCB surface.
Solder Ball Collapse
To produce the optimum solder joint, it is important to understand the amount of collapse of the solder balls, and the
overall shape of the joint. These are a function of:
•
The diameter of the package solder ball via.
•
The volume and type of paste screened onto the PCB.
•
The diameter of the PCB land.
•
The board assembly reflow conditions.
•
The weight of the package.
Controlling the collapse, and thus defining the package standoff, is critical to obtaining the optimum joint reliability.
Generally, a larger standoff gives better solder joint fatigue strength, but this should not be achieved by reducing the
board land diameter. Reducing the land diameter will increase the standoff, but will also reduce the minimum crosssection area of the joint. This, in turn, wil l increase the maximum shear force at the PCB side of the solder joint.
Therefore, a reduction of land diameter will normally result in a worse fatigue life, and should be avoided unless all the
consequences are well understood
0.50+/-0.1mm
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SSZA002B – August 2015
S/N
per Board
Atmosphere
01
4
5-mil Thick, 0.6mm Diameter Aperture
Air
SAC305
02
4
5-mil Thick, 0.6mm Diameter Aperture
Nitrogen
SAC305
03
4
4-mil Thick, 0.6mm Square Aperture
Air
SAC305
04
4
4-mil Thick, 0.6mm Square Aperture
Nitrogen
SAC305
3.6.1 For Pb Free paste reflow
A DOE (design of experiment) was performed to assemble the board under different assembly conditions.
3.6.1.1 Assembly build matr ix
PCBA
3.6.1.2 Board properties
• 228.6 mm x 63.7 mm
• 3.7 mm thick
• 8 Layers
• OSP finish over Cu
• 0.45mm Pad Size
• NSMD pad
• 4 components per board
3.6.1.3 Package information:
• 27 mm x 27 mm
• 2.48 mm thick
• 1.0 mm pitch
• 456 balls
• SAC305 solder ball
3.6.1.4 Thermocouple locations:
•U4 Bottom Right Solder Joint
•U4 Center Solder Joint
•U4 Top Left Solder Joint
•U1 Top Right Solder Joint
•U1 Center Solder Joint
•U1 Bottom Left Solder Joint
•PCB
Packages
Stencil Parameters Reflow
: Thermocouples were attached to the solder joint through the other side of
the board by drilling through the PCB. Then the components were placed on
the board.
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Solder Alloy
SSZA002B – August 2015
3.6.1.5 Lead free reflow profile for lead free components using lead free solder paste
An actual reflow profile using no clean paste that produce good board level reliability result.
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SSZA002B – August 2015
3.6.2 Reflow profile for PbSn components using PbSn solder paste
The reflow peak temperature should be kept in the 215°C to 225°C range. An actual reflow profile used to produce good
board level reliability result is shown below (no clean paste):
PbSn Reflow Profile:
Time between 150°C – 170°C: 100 sec
Time above 183C: 60 sec
Peak Temp: 220C
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SSZA002B – August 2015
REPLACEMENT AND REWORK
4.0
Removing BGA packages involves heating the solder joints above the liquidus temperature of the solder and picking
the part off the PCB when the solder melts. The quality of rework is controlled by directing thermal energy to solder
without over-heating the adjacent components. Heating should occur in an encapsulated, inert, gas-purg ed e nv ironment
where the temperature gradients do not exceed ±5° C across the heating zone using a convective bottom side preheater to maximize temperature uniformity. If possible, the PCB area should be preheated through the bottom side of
the board, to 100°C before heating the BGA to ensure a controlled process. Interchangeable nozzles designed with
different geometries will accommodate different applications to direct the airflow path. Once the liquidus temperature is
reached, the nozzle vacuum is automatically activated and the component is removed.
4.1
SITE PREPARATION
It is recommended that the reflow profile used to reflow the BGA be as close to the PCB mount profile as possible.
Preheat from the bottom side of the board is recommended where possible. Once the liquidus temperature is reached,
the solder will reflow and the BGA will self-align.
4.2 COMPONENT PLACEMENT
Most BGA rework stations will have a pick and place feature for accurate placement and alignment. Manual pick and
place, with only eyeball alignment, is not recommended. It is difficult to achieve consistent placement accuracy.
4.3 COMPONENT REFLOW
It is recommended that the reflow profile used to reflow the BGA be as close to the PCB mount profile as possible.
Preheat from the bottom side of the board is recommended where possible. Once the liquidus temperature is reached,
the solder will reflow and the BGA will self-align.
5.0 Reliability
Reliability is one of the first questions designers ask about any new packaging technology. They want to know how
well the package will survive handling and assembly operation, and how long it will last on the board. The elements of
package reliability and system reliability, while related, focus on different material properties and characteristics and ar e
tested by different methods.
Package reliability focuses on materials of construction, thermal flows, material adherence/ delamination issues,
resistance to high temperatures, moisture resistance and ball/stitch bond reliability. Thorough engineering of the
package is performed to prevent delamination caused by the interaction of the substrate material and the mold
compound. TI subjects each PBGA to rigorous qualification testing before the package is released to production.
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SSZA002B – August 2015
Package-Level
Reliability
Test
Results
PinPkg
376ZDW
256ZDH
388ZDS
PkgSize (mm)
23x23
17x17
27x27
Die (mm)
8.64x8.44
5.13x4.67
6.41x6.54
Level
4 3 4
Test Environments
THB, 85RH/85°C
168 hrs
0/26
0/78
na
300 hrs
0/26
na
na
600hrs
0/26
0/78
na 1000hrs
0/26
0/78
na
uHAST,85RH/110°C
96 hrs
0/77
0/78
0/78
192 hrs
0/77
0/78
0/78
264 hrs
0/77
0/78
0/78
TC, -55/125°C
100cyc
0/77
0/78
0/78
500cyc
0/77
0/78
0/78
1000cyc
0/77
0/78
0/78
2000cyc
0/77
na
0/78
TS, -55/125°C
200cyc
0/77
0/26
0/78
500cyc
0/77
0/26
0/78
1000cyc
0/77
na
0/78
HTOL, 125°C
168cyc
0/77
na
na
300cyc
0/77
na
na
600cyc
0/77
na
na 1000cyc
0/77
na
na
Bake, 150°C
168hrs
na
0/78
0/78
300hrs
na
na
0/78
500hrs
na
0/78
0/78
1000hrs
na
0/78
0/78
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SSZA002B – August 2015
Sample Size/Failures
Test Cycle Requirements
Test Cycle Extended range
Package
Pkg Size
Pitch
Die
Temp Cyc
256ZKB
17X17
1
6.949 X 5.820
-40/125
38/0
38/0
38/0
38/0
456ZXZ
27X27
1
8.500 X 8.800
-40/125
32/0
32/0
32/0
32/0
640ZKK
23X23
0.8
8.010 X 8.098
-40/125
42/0
42/0
42/0
42/0
17 x 17
6 x 15
90
900
19 x 19
6 x 14
84
840
23 x 23
5 x 12
60
600
27 x 27
4 x 10
40
200
31 x 31
3 x 9
27
135
35 x 35
3 x 8
24
120
Board-level Reliability Summary
Package Information
Test
Conditions
(mm)
(mm)
(mm)
(degC)
500 1000 1500 2000
6.0 Packing and Shipping
PBGA packages are shipped in trays or “Tape-and-Reels”.
6.1 Trays
Thermally resistant plastic trays are used to ship these packages. Each family of parts with the same package outline
has its own individually designed tray. The trays are designed to be used with pick-and-place machines.
Typical tray details
Table with number of units per tray.
Package Size, mm
Matrix
Units/Tray
Units/Box
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SSZA002B – August 2015
WIDTH DIAMETER
HUB
PBGA
256 GDH
PBGA
256 ZKB
PBGA
256 ZEP
PBGA
491
ZCN
PBGA
491 ZDN
PBGA
256 ZFE
PBGA
208 ZFE
PBGA
1088 CYL
PBGA
208
ZKB
PBGA 754
AAN
PBGA
256 ZDH
PBGA 208
ZDH
PBGA 289 ZEL
PBGA
289
GDY
PBGA
289 ZDY
PBGA
484 ZVK
PBGA 288 GDQ
PBGA
324 GDU
PBGA 324 GDW
PBGA
324 ZKD
PBGA 376 ZKD
PBGA
324
ZDU
PBGA
768
ZDU
PBGA
640
ZKK
PBGA
324 ZDW
PBGA
376 ZDU
PBGA
376 ZDW
PBGA
388 ZDW
PBGA 420
ZDQ
PBGA
484 ZDU
PBGA 376
ZKC
PBGA 324
ZKC
PBGA
484 ZER
PBGA 484
ZDW
PBGA
256 GFN
PBGA 256
ZFN
PBGA 272 GDP
PBGA
272 GFN
PBGA
584 ZEQ
PBGA 580
ZEQ
PBGA 316 GFN
PBGA
352 GPC
PBGA
352 ZPC
PBGA 388
GDS
PBGA
388 GED
PBGA 388 GPC
PBGA 388 ZDS
PBGA 388
ZED
PBGA
388 ZPC
PBGA 456 GXF
PBGA
456 ZXF
PBGA 484
ZED
PBGA 520 ZXF
PBGA 676
GPY
PBGA 352 GFT
PBGA
352 ZFT
PBGA 388 GFW
PBGA 388 GFT
PBGA 420
GDC
PBGA 474 GPJ
PBGA
520 GPJ
PBGA 580 GPA
PBGA 624 GPA
PBGA 624 ZPA
PBGA 676 GXD
PBGA
676 ZXD
PBGA 680 GPA
PBGA 680 ZPA
PBGA 680 ZWZ
PBGA 976 ZWZ
PBGA
729 GXB
4 in
13 in
32mm
7 in
13 in
44mm
19x19
500
4 in
13 in
32mm
6 in
Reel
13 in
44mm
35x35
6 in
27x27
250
250
23X23
13 in
56mm
Qty per reel
Pkg
Group
Package
Pkg
Size
250
17x17
750
6.2 Tape-and-Reel
7.0 Sockets
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SSZA002B – August 2015
7.1 PBGA Test Contactor Pin and Ball Contact
Typical testing of TI pbga packages is done through the use of a pogo pin style contactor. See below for an image of
an actual test socket and contactor. Also note the typical witness marks on the ball after testing.
Contactor for 0.8/1.0mm pitch PBGA (23X23)
Pogo Pin
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SSZA002B – August 2015
• Pin – Ball Contact is pricking
• Expected toolmark - Crown Tip marks on balls.
19
SSZA002B – August 2015
7.2 PBGA Burn- In Pin and Ball Contact
A pinch style contact has been use d extensively f or contacting solder balls in conventional BGAs and is the proposed
method for burn-in of these packages, providing the most reliable solution w ith less ball deformation at an affordable
cost. Further information on the availability of these sockets can be obtained from your local TI Field Sales
representative.
Picture below showing a typical Texas Instruments burn-in socket and pins
Socket Pins
Actual Socket Pin Magnification
PBGA socket
Socket Pin Package: 456 ZXF
The contact is designed to grip the solder ball with a pinching action. This not only provides electrical contact to the
solder ball but also he lps r etain t he pack age in t he so ck et. Each cont act incorporates two beams that prov ide an oxidepiercing interface with the sides of the balls above the central area—the equator. No contact is made on the bottom of
the solder ball so the original package planarity specifications are unchanged. The contact is shown below:
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SSZA002B – August 2015
Horizontal
Cross Section:
Ball Contact on
Socket Pin
Cross-section
Magnification:
Device
Ball
Socket
Pin
Result:
Good
Contact between
the ball and the
socket pin
Vertical Cross
Section:
The witness marks left on the solder ball from the contact are shown below. There is no damage to the bottom of the
ball and typical pin contact signature is seen in the ball marking magnification photograph below.
Sample PBGA Device
Ball Contact on
Socket Pin
Cross-section Magnification:
Device
Ball
Socket
Pin
Pin contact Signature
Remarks: Good
Ball Contact on the
socket pin; No
Abnormalities seen
inside the socket
Ball Marking Magnification
21
Rev B. August 2015
Changed the “Optium Land Configurations“ table on page 6
Frequently Asked Questions
A.1 Package Questions
Q Do the solder balls come off during shipping?
A No, this has never been observed. The balls are inspected for coplanarity, diameter, and other
physical properties prior to packing for shipment. Because solder is used during the ball-attachment process,
uniformly high ball-attachment strengths ar e de veloped. Also, the
ball-attachment strength is monitored frequently in the assembly process to prevent ball
loss from vibration and other shipping forces.
Q Is package repair possible? Are tools available?
A Yes, some limited package repair is possible, and there are some semiautomatic
M/C tools available. However, TI does not specify the reliability of repaired packages.
A.2 Assembly Questions
Q What alignment accuracy is possible?
Alignment accuracy for the package is depend ent upon board-level pad tolerance, placement accuracy, and
solder ball
position tolerance. Nominal ball position tolerances are specified at ±100 μm. These packages are self-aligning
during solder reflow, so final alignment accuracy may be better than placement accuracy.
Q Can the solder joints be inspected after reflow?
A No final in-line inspection is necessary. Some customers are achieving satisfactory results during process set-
up with lamographic X-ray techniques.
Q Are there specific recommendations for SMT
processing? A SMT processing must match the
recommended reflow profile.
Q Can the boards be repaired?
A TI strongly recommends that removed packages be discarded.
Q What size land diameter for these packages should I design on my board?
A Land size is the key to board-level reliability, and Texas Instruments strongly
recommends following the design rules included in this document.
----END APPLICATION NOTE----
Revision History
22
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