User's Guide
SBOU084 – February 2010
PGA309EVM-USB
This user’s guide describes the characteristics, operation, and use of the PGA309EVM-USB evaluation module (EVM). This EVM is designed to evaluate the performance of the PGA309, a voltage output, programmable sensor conditioner. This document covers all pertinent areas involved to properly use this EVM board, allowing for user evaluation suitable to a variety of applications. This document also includes the physical printed circuit board (PCB) layout and circuit descriptions. A schematic of the PGA309EVM-USB is available as a separate download from the TI web site.
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Contents |
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1 |
Introduction and Overview ................................................................................................. |
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System Setup ................................................................................................................ |
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PGA309EVM-USB Hardware Setup .................................................................................... |
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PGA309EVM-USB Software Overview ................................................................................. |
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25 |
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List of Figures |
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Hardware Included with the INA282-286EVM........................................................................... |
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2 |
PGA309EVM-USB Hardware Setup...................................................................................... |
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PGA309_Test_Board Block Diagram .................................................................................... |
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5 |
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PGA309_Test_Board Schematic: Input Circuitry ....................................................................... |
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7 |
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PGA309_Test_Board Schematic: Power, Reference, and Digital Connections .................................... |
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8 |
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PGA309_Test_Board Schematic: Output Circuitry ..................................................................... |
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9 |
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PGA309_Test_Board Schematic: Sensor Emulator Circuitry........................................................ |
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10 |
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PGA309_Test_Board Connections to USB-DAQ-Platform and EEPROM......................................... |
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11 |
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Theory of Operation For USB-DAQ-Platform .......................................................................... |
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16 |
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PGA309EVM-USB Typical Hardware Connections ................................................................... |
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17 |
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Connecting the Two EVM PCBs ........................................................................................ |
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18 |
12 |
Connecting Power to the EVM........................................................................................... |
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19 |
13 |
Connecting the USB Cable............................................................................................... |
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20 |
14 |
Default Jumper Settings (PGA309_Test_Board)...................................................................... |
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21 |
15 |
Default Jumper Settings (USB-DAQ-Platform) ........................................................................ |
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22 |
16 |
PGA309EVM-USB Software: Registers Tab........................................................................... |
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26 |
17 |
PGA309EVM-USB Software: EEPROM Tab .......................................................................... |
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27 |
18 |
PGA309EVM-USB Software: Block Diagram .......................................................................... |
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28 |
19 |
PGA309EVM-USB Software: Auto Calibrate Tab— Sensor Definition.............................................. |
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29 |
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PGA309EVM-USB Software: Sensor Emulator Control Panel Tool ................................................ |
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30 |
21 |
PGA309EVM-USB Software: Auto Calibrate Tab— PGA Setup..................................................... |
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PGA309EVM-USB Software: Auto Calibrate Tab— Two-Point Calibration and Linearization ................... |
32 |
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23 |
PGA309EVM-USB Software: Auto Calibrate Tab— Temperature Error Compensation.......................... |
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33 |
24 |
PGA309EVM-USB Software: Auto Calibrate Tab— Post Cal Error Check......................................... |
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34 |
25 |
PGA309EVM-USB Software: Auto Calibrate Tab— DMM Options.................................................. |
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35 |
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I2C is a trademark of NXP Semiconductors. |
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All other trademarks are the property of their respective owners. |
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SBOU084 –February 2010 |
PGA309EVM-USB |
1 |
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Submit Documentation Feedback |
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Copyright © 2010, Texas Instruments Incorporated
Introduction and Overview |
www.ti.com |
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List of Tables |
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1 |
PGA309 Test Board Parts List........................................................................................... |
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2 |
J1 |
Pinout (25-Pin Male DSUB) .......................................................................................... |
14 |
3 |
J2 |
Pinout (25-Pin Female DSUB) ...................................................................................... |
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PGA309_Test_Board Jumper Functions: General .................................................................... |
22 |
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5 |
PGA309_Test_Board Jumper Functions: Miscellaneous Connections............................................. |
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PGA309_Test_Board Jumper Functions: Sensor Emulator Section ............................................... |
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USB-DAQ-Platform Jumper Settings ................................................................................... |
24 |
1Introduction and Overview
This document provides the information needed to set up and operate the PGA309EVM-USB evaluation module, a test platform for the PGA309 programmable sensor conditioner. For a more detailed description of the PGA309, refer to the product data sheet (SBOS292) available from the Texas Instruments web site at http://www.ti.com. Additional support documents are listed in the section of this guide entitled Related Documentation from Texas Instruments.
The PGA309EVM-USB is an evaluation module that is used to fully evaluate the PGA309. The PGA309 is an integrated circuit that provides temperature compensation and linearization for bridge sensors. The PGA309EVM-USB consists of two PCBs. One board (the USB-DAQ-Platform) generates the digital signals required to communicate with the PGA309. The other board (the PGA309_Test_Board) contains the PGA309 device, as well as support and configuration circuitry.
Throughout this document, the abbreviation EVM and the term evaluation module are synonymous with the PGA309EVM-USB.
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Introduction and Overview |
1.1PGA309EVM-USB Hardware
Figure 1 shows the hardware included with the PGA309EVM-USB kit. Contact the factory if any component is missing. It is highly recommended that you check the TI web site (at http://www.ti.com) to verify that you have the latest software. It is also recommended that you refer to the PGA309 User's Guide if you have questions about the PGA309 device itself.
The complete kit includes the following items:
•PGA309_Test_Board
•USB DAQ Platform Board
•USB cable
•6V wall power-supply unit
•CD-ROM containing this user'sguide and product software
Figure 1. Hardware Included with the INA282-286EVM
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Introduction and Overview |
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The following documents provides information regarding Texas Instruments integrated circuits used in the assembly of the PGA309EVM-USB. This user'sguide is available from the TI web site under literature number SBOU084. Any letter appended to the literature number corresponds to the document revision that is current at the time of the writing of this document. Newer revisions may be available from the TI web site at http://www.ti.com, or call the Texas Instruments Literature Response Center at (800) 477-8924 or the Product Information Center at (972) 644-5580. When ordering, identify the document by both title and literature number.
Document |
Literature Number |
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PGA309 |
SBOS292 |
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USB DAQ Platform Users Guide |
SBOU056 |
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PGA309 Users Guide |
SBOU024 |
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OPA333 Product Data Sheet |
SBOS351 |
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DAC8555 Product Data Sheet |
SLAS475 |
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XTR117 Product Data Sheet |
SBOS344 |
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PGA309EVM-USB Schematic |
SBOR010 |
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Sensor-Emulator EVM Reference Guide |
SBOA102 |
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If you have questions about the PGA309EVM-USB evaluation module, send an e-mail to the Linear Application Team at precisionamps@list.ti.com. Include PGA309EVM-USB as the subject heading.
This document contains caution statements.
CAUTION
This is an example of a caution statement. A caution statement describes a situation that could potentially damage your software or equipment.
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System Setup |
2System Setup
Figure 2 shows the system setup for the PGA309EVM. The PC runs software that communicates with the USB-DAQ-Platform. The USB-DAQ-Platform generates the digital signals used to communicate with the PGA309_Test_Board. Connectors on the PGA309_Test_Board allow for connection to the bridge sensor.
EVM
POWER
USB DAQ
PLATFORM
PGA309
TEST BOARD
Figure 2. PGA309EVM-USB Hardware Setup
Figure 3 shows the block diagram of the PGA309_Test_Board. The PGA309_Test_Board provides connections to the I2C™ , one-wire, analog-to-digital converters (ADCs) and digital-to-analog converters (DACs) on the USB-DAQ-Platform. It also provides connection points for external connection of the bridge sensor. The PGA309_Test_Board has circuitry to convert the PGA309 voltage output to 4mA to 20mA current.
25-Pin Male DSUB Signals From USB DAQ Platform
VDUT Supply |
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Switched 5.0V Power |
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I2C |
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Interface |
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One-Wire Interface |
PGA309 |
4mA to 20mA I/V Converter
Sensor
Emulator
25-Pin Female DSUB Signals From USB DAQ Platform
Sensor
Connection
Figure 3. PGA309_Test_Board Block Diagram
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The PGA309_Test_Board also has an onboard sensor emulator. The sensor emulator is a circuit that generates the same type of signals generated by a bridge sensor. The sensor emulator circuit is controlled by the PGA309EVM-USB software. Using the sensor emulator allows you to get a deeper understanding of the PGA309EVM-USB software and hardware more quickly. When the capabilities and functions of the PGA309EVM-USB are fully understood, you can connect the real-world sensor to the EVM and perform a full calibration.
Note that calibrations with real-world sensors are time-consuming because devices such as these are normally calibrated at multiple temperatures in an environmental chamber. It is not unusual for temperature calibration to require 12 hours.
See Figure 4 for the input connections on the PGA309_Test_Board schematic. T1 provides the power connection for an external bridge sensor. T4 allows connections to each input of the external bridge sensor. T5 allows connection of the external temperature sensor. JMP7, JMP4, JMP5, and JMP6 allow users to select either the onboard sensor emulator or an external sensor. JMP12 allows users to choose between VS or VEXC for the sensor power.
The input is filtered with R3, R4, C14, C15, and C16. Note that C14 is ten times larger then C15, and C16 is used for good ac common-mode rejection. The cutoff frequency of this filter is 40.6Hz (f = 1/(2 p R3 C14)). This input filter is recommended in your final design if you have available board space.
VEXC has a 100pF capacitor and TEMPin has a 1nF capacitor. These components are also recommended in your final design.
Refer to Figure 5 to see the power, reference, and digital connections on the PGA309_Test_Board schematic. T2 provides a connection for an external reference voltage. JMP1 and JMP2 allow users to select between the internal reference, an external reference, or power-supply reference. JMP7 and JMP8 allows users to connect the One-Wire signal to the PRG pin directly or through VOUT.
D2 is a transient voltage suppressor. It is useful in helping to prevent damage in an electrical overstress (EOS) condition. R5 is useful in preventing EOS damage to the output. C6 filters noise at the output. C5 filters the reference output. These components are recommended for your design if PCB space permits. C4 is a decoupling capacitor; it is required in the final design.
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System Setup |
Figure 4. PGA309_Test_Board Schematic: Input Circuitry
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Figure 5. PGA309_Test_Board Schematic: Power, Reference, and Digital Connections
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System Setup |
Figure 6 shows the output section of the PGA309EVM_Test_Board. There are two output options: voltage output and current output. The voltage output option is selected by placing JMP9 in the NC position. The current output option is selected by moving JMP9 to the VOUT to XTR position.
Figure 6. PGA309_Test_Board Schematic: Output Circuitry
In voltage output mode, C10 = 10nF is connected to the PGA309 output. This capacitor is used for radio frequency interference (RFI) and electromagnetic interference (EMI) immunity. This component should be included in your design, if possible.
In current output mode, the PGA309 output is connected to a voltage-to-current (V-I) converter (XTR117). The sum of R6 and R8 convert the output voltage from the PGA309 to an input current for the XTR117. R7 can be used to create an input offset current using the reference. The total input current is IIN = VOUT / (R6 + R8) + VREF/R7. The output current is equal to the input current times the current gain (x 100).
D4 is used for reverse polarity protection. D3 is used for over-voltage transient protection. D3 was selected for low leakage. Leakage on D3 directly contributes to error. C11 is a decoupling capacitor and is required for proper operation. The external transistor, Q1, conducts the majority of the full-scale output current. Power dissipation in this transistor can approach 0.8W with high loop voltage (40V) and 20mA output current.
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Figure 7 shows the sensor emulator circuit. The sensor emulator generates signals to help users evaluate the PGA309. No part of this circuit is required in your final design. The sensor emulator uses a DAC8555 (U8) to generate an emulated temperature signal, common-mode signal, and differential signal. These signals can be controlled using software to produce levels that closely match real-world sensors.
Figure 7. PGA309_Test_Board Schematic: Sensor Emulator Circuitry
The operational amplifier U4 and associated resistors is a differential amplifier with jumper selectable attenuation. The possible attenuations are 0.12 and 0.012. The attenuation produces a more accurate and stable emulated sensor output. For example, when the DAC outputs 3V, the sensor emulator outputs 3V × 0.012 = 36mV (assuming that attenuation is set in the 0.012 position). Thus, the maximum output of the sensor emulator is 120mV/V and 12mV/V.
The op amp U6 buffers the emulated temperature signal. Resistors R16, R17, R18, and R19 are used to attenuate the DAC output for temperature emulation and to reference the temperature signal to supply or ground. JMP13 allows the resistor network to be bypassed for direct connection to the DAC (diode temperature sensor mode).
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System Setup |
Figure 8 illustrates the two 25-pin D-SUB connectors J1 and J2. These connectors provide all the signals necessary to communicate with the PGA309. U5 is the EEPROM used to store the calibration look-up table used with the PGA309.
Figure 8. PGA309_Test_Board Connections to USB-DAQ-Platform and EEPROM
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Table 1 describes the parts list for the PGA309_Test_Board.
Table 1. PGA309 Test Board Parts List
Qty |
Value |
Ref Des |
Description |
Vendor |
Part Number |
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1 |
560pF |
C6 |
Capacitor, ceramic 560pF 50V NP0 |
Panasonic - ECG |
ECJ-1VC1H561J |
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0603 |
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3 |
100pF |
C3 C5, C13 |
Capacitor, ceramic 560pF 50V NP0 |
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ECJ-1VC2A101J |
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0603 |
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6 |
0.1µF |
C4, C7, C8, C9, C14, C17 |
Capacitor, 0.1µF 25V, ceramic Y5V |
Kemet |
CC0603ZRY5V8BB104 |
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0603 |
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2 |
.01µF |
C15, C16 |
Capacitor, ceramic .01µF 10% |
AVX |
06031C103KAT2A |
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100V X7R 0603 |
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1 |
1nF |
C18 |
Capacitor, 1000pF, 100V, ceramic |
Panasonic - ECG |
ECJ-1VB2A102K |
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X7R 0603 |
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2 |
10nF |
C10, C11 |
Capacitor, 10000pF, 50V, ceramic |
Kemet |
C0603C103K5RACTU |
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X7R 0603 |
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1 |
0.02µF |
C12 |
Capacitor, ceramic 22000pF, 100V |
TDK Corporation |
C1608X7R2A223K |
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X7R 10%0603 |
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1 |
1000pF |
C2 |
Omit; not installed |
JOHANSON DIELECTRICS |
501R18W102KV4E |
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4 |
100kΩ |
R11, R15, R18, R19 |
Resistor, 100kΩ 1/6W 0.1% 0603 |
Susumu Co Ltd |
RGH1608-2C-P-104-B |
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SMD |
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2 |
1.2kΩ |
R12, R13 |
Resistor, 1.2kΩ 1/6W 0.1% 0603 |
Susumu Co Ltd |
RGH1608-2C-P-122-B |
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SMD |
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5 |
10kΩ |
R8, R10, R14, R16, R17 |
Resistor, 10.0kΩ 1/6W 0.1% 0603 |
Susumu Co Ltd |
RGH1608-2C-P-103-B |
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SMD |
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4 |
100Ω |
R5, R20, R21, R22 |
Resistor, 100kΩ 1/10W 1% 0603 |
Yageo Corporation |
RC0603FR-07100RL |
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SMD |
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1 |
191kΩ |
R7 |
Resistor, 191kΩ 1/10W 1% 0603 |
Yageo Corporation |
ERJ-3EKF1913V |
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SMD |
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1 |
11.3kΩ |
R6 |
Resistor, 11.3kΩ 1/10W 1% 0603 |
Yageo Corporation |
ERJ-3EKF1132V |
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SMD |
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2 |
39.2kΩ |
R3, R4 |
Resistor, 39.2kΩ 1/10W 1% 0603 |
Yageo Corporation |
RC0603FR-0739K2L |
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SMD |
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1 |
50kΩ |
R23 |
Resistor, 49.9kΩ 1/16W .5% 0603 |
Sunsuma |
RR0816P-4992-D-68C |
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SMD |
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1 |
2.49kΩ |
R24 |
Resistor, 2.49kΩ 1/16W .5% 0603 |
Sunsuma |
RR0816P-2491-D-39H |
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SMD |
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0 |
omit |
R1, R2, R9 |
Omit; not installed |
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1 |
PGA309 |
U1 |
Smart Programmable Sensor |
Texas Instruments |
PGA309AIPWT |
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1 |
BNC |
P1 |
Connector, Jack BNC Vertical 50Ω |
Tyco Electronics/Amp |
5227699-1 |
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PCB |
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2 |
OPA333AID |
U4 U6 |
IC Op Amp 1.8V 0-DRIFT SOT23-5 |
Texas Instruments |
OPA333AIDBVT |
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BVT |
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1 |
DAC8555 |
U3 |
IC DAC 16BIT QUAD 16-TSSOP |
Texas Instruments |
DAC8555IPW |
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1 |
24LC16BT |
U5 |
IC SRL EEPROM 16K 2.5V |
Microchip Technology |
24LC16BT-I/OT |
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SOT23-5 |
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1 |
XTR117 |
U2 |
IC 4mA-20mA Current-Loop TX |
Texas Instruments |
XTR117AIDGKT |
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8-MSOP |
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1 |
6.8V |
D2 |
TVS Zener Unidirectional 600W |
ON Semiconductor |
P6SMB6.8AT3G |
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transzorb |
6.8V SMB |
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1 |
SMAJ43A |
D3 |
TVS 400W 43V Unidirectional SMA |
Micro Commercial |
SMAJ43A-TP |
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Components |
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1 |
BAS70TP |
D4 |
Diode, Schottky 70V 200mA |
Micro Commercial |
BAS70TPMSCT-ND |
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SOT23 |
Components |
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1 |
NPN |
Q1 |
IC, Transistor NPN SS GP 1.5A |
Fairchild Semiconductor |
BCP55 |
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SOT223-4 |
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5 |
ED300/2 |
T1, T2, T3, T4, T5 |
2-Position Terminal Strip, Cage |
On-Shore Technology Inc |
ED300/2 |
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Clamp, 45º, 15A, Dove-tailed |
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12 PGA309EVM-USB |
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