Texas Instruments OPA171AID, OPA171AIDBVT, OPA171AIDRLT, OPA2171AID, OPA2171AIDCUT Schematic [ru]

PackageFootprintComparison(toScale)

PackageHeight (toScale)Comparison

D(SO-8) DBV(SOT23-5) DRL(SOT553)

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36V, Single-Supply, SOT553, General-Purpose

OPERATIONAL AMPLIFIERS

Value Line Series

Check for Samples: OPA171, OPA2171, OPA4171

1

FEATURES

• Supply Range: +2.7V to +36V, ±1.35V to ±18V

• Low Noise: 14nV/√Hz

• Low Offset Drift: ±0.3µV/°C (typ)

• RFI Filtered Inputs

• Input Range Includes the Negative Supply

• Input Range Operates to Positive Supply

• Rail-to-Rail Output

• Gain Bandwidth: 3MHz

• Low Quiescent Current: 475µA per Amplifier

• High Common-Mode Rejection: 120dB (typ)

• Low Input Bias Current: 8pA

• Industry-Standard Packages:
– 8-Pin SOIC
– 8-Pin MSOP
– 14-Pin TSSOP

• microPackages:
– Single in SOT553
– Dual in VSSOP-8

OPA171
OPA2171
OPA4171

SBOS516D –SEPTEMBER 2010–REVISED SEPTEMBER 2012

DESCRIPTION

The OPA171, OPA2171 and OPA4171 (OPAx171)2
are a family of 36V, single-supply, low-noise
operational amplifiers with the ability to operate on
supplies ranging from +2.7V (±1.35V) to +36V
(±18V). These devices are available in micro­packages and offer low offset, drift, and bandwidth
with low quiescent current. The single, dual, and
quad versions all have identical specifications for
maximum design flexibility.

Unlike most op amps, which are specified at only one
supply voltage, the OPAx171 family is specified from
+2.7V to +36V. Input signals beyond the supply rails
do not cause phase reversal. The OPAx171 family is
stable with capacitive loads up to 300pF. The input
can operate 100mV below the negative rail and within
2V of the top rail during normal operation. Note that
these devices can operate with full rail-to-rail input
100mV beyond the top rail, but with reduced
performance within 2V of the top rail.

The OPAx171 series of op amps are specified from
–40°C to +125°C.

APPLICATIONS

• Tracking Amplifier in Power Modules

• Merchant Power Supplies

• Transducer Amplifiers

• Bridge Amplifiers

• Temperature Measurements

• Strain Gauge Amplifiers

• Precision Integrators

• Battery-Powered Instruments

• Test Equipment
Product Family

DEVICE PACKAGE
OPA171 SOT553, SOT23-5, SO-8

OPA2171 (dual) VSSOP-8, SO-8, MSOP-8

OPA4171 (quad) TSSOP-14, SO-14

1

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2All trademarks are the property of their respective owners.

PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.

Smallest Packaging for 36V Op Amps

Copyright © 2010–2012, Texas Instruments Incorporated

OPA171
OPA2171
OPA4171

SBOS516D –SEPTEMBER 2010–REVISED SEPTEMBER 2012

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

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PACKAGE/ORDERING INFORMATION

PACKAGE PACKAGE TRANSPORT MEDIA,

PRODUCT PACKAGE-LEAD DESIGNATOR MARKING ORDERING NUMBER QUANTITY

SOT553 DRL DAP

OPA171 SOT23-5 DBV OSUI

SO-8 D O171A

MSOP-8 DGK OPMI

OPA2171 VSSOP-8 DCU OPOC

SO-8 D 2171A

SO-14 D OPA4171

OPA4171

TSSOP-14 PW OPA4171

(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the

device product folder at www.ti.com.

(1)

OPA171AIDRLT Tape and Reel, 250
OPA171AIDRLR Tape and Reel, 4000
OPA171AIDBVT Tape and Reel, 250

OPA171AIDBVR Tape and Reel, 3000

OPA171AID Rail, 75

OPA171AIDR Tape and Reel, 2500

OPA2171AIDGK Rail, 80
OPA2171AIDGKR Tape and Reel, 2500
OPA2171AIDCUT Tape and Reel, 250
OPA2171AIDCUR Tape and Reel, 3000

OPA2171AID Rail, 75

OPA2171AIDR Tape and Reel, 2500

OPA4171AID Rail, 50

OPA4171AIDR Tape and Reel, 2500

OPA4171AIPW Rail, 90

OPA4171AIPWR Tape and Reel, 2000

ABSOLUTE MAXIMUM RATINGS

(1)

Over operating free-air temperature range, unless otherwise noted.

OPAx171 UNIT

Supply voltage ±20 V

Signal input terminals

Output short circuit
Operating temperature –55 to +150 °C
Storage temperature –65 to +150 °C
Junction temperature +150 °C

ESD ratings:

(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may

degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not implied.

(2) Short-circuit to ground, one amplifier per package.

Voltage (V–) – 0.5 to (V+) + 0.5 V
Current ±10 mA

(2)

Human body model (HBM) 4 kV
Charged device model (CDM) 750 V

Continuous

2 Submit Documentation Feedback Copyright © 2010–2012, Texas Instruments Incorporated

Product Folder Links: OPA171 OPA2171 OPA4171

OPA171
OPA2171
OPA4171

www.ti.com

ELECTRICAL CHARACTERISTICS

Boldface limits apply over the specified temperature range, TA= –40°C to +125°C.

At TA= +25°C, VS= +2.7V to +36V, VCM= V

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

OFFSET VOLTAGE

Input offset voltage V

Over temperature 0.3 ±2 mV
Drift dVOS/dT 0.3 ±2 µV/°C
vs power supply PSRR VS= +4V to +36V 1 ±3 µV/V

Channel separation, dc dc 5 µV/V

INPUT BIAS CURRENT

Input bias current I

Over temperature ±3.5 nA

Input offset current I

Over temperature ±3.5 nA

NOISE

Input voltage noise f = 0.1Hz to 10Hz 3 µV

Input voltage noise density e

INPUT VOLTAGE

Common-mode voltage range

Common-mode rejection ratio CMRR

INPUT IMPEDANCE

Differential 100 || 3 MΩ || pF
Common-mode 6 || 3

OPEN-LOOP GAIN
Open-loop voltage gain AOLVS= +4V to +36V, (V–) + 0.35V < VO< (V+) – 0.35V 110 130 dB
FREQUENCY RESPONSE

Gain bandwidth product GBP 3.0 MHz
Slew rate SR G = +1 1.5 V/µs

Settling time t

Overload recovery time VIN× Gain > V
Total harmonic distortion + noise THD+N G = +1, f = 1kHz, VO= 3V

OUTPUT

Voltage output swing from rail V

Over temperature RL= 10kΩ, AOL≥ 110dB (V–) + 0.35 (V+) – 0.35 V

Short-circuit current I
Capacitive load drive C
Open-loop output resistance R

POWER SUPPLY

Specified voltage range V
Quiescent current per amplifier I

Over temperature IO= 0A 650 µA

TEMPERATURE

Specified range –40 +125 °C
Operating range –55 +150 °C

(1)

(1) The input range can be extended beyond (V+) – 2V up to V+. See the Typical Characteristics and Application Information sections for

additional information.

OS

B

OS

n

V

CM

S

To 0.01% (12 bit), VS= ±18V, G = +1, 10V step 10 µs

O

SC

LOAD

O

S
Q

= VS/2, and R

OUT

f = 100Hz 25 nV/√Hz

f = 1kHz 14 nV/√Hz

VS= ±2V, (V–) – 0.1V < VCM< (V+) – 2V 90 104 dB

VS= ±18V, (V–) – 0.1V < VCM< (V+) – 2V 104 120 dB

To 0.1%, VS= ±18V, G = +1, 10V step 6 µs

VS= 5V, RL= 10kΩ 30 mV

f = 1MHz, IO= 0A 150 Ω

IO= 0A 475 595 µA

= 10kΩ connected to VS/2, unless otherwise noted.

LOAD

S

SBOS516D –SEPTEMBER 2010–REVISED SEPTEMBER 2012

OPA171, OPA2171, OPA4171

0.25 ±1.8 mV

±8 ±15 pA

±4 pA

(V–) – 0.1V (V+) – 2V V

2 µs

RMS

See Typical Characteristics pF

+2.7 +36 V

0.0002 %

+25/–35 mA

1012Ω ||

pF

PP

Copyright © 2010–2012, Texas Instruments Incorporated Submit Documentation Feedback 3

Product Folder Links: OPA171 OPA2171 OPA4171

OPA171
OPA2171
OPA4171

SBOS516D –SEPTEMBER 2010–REVISED SEPTEMBER 2012

THERMAL INFORMATION: OPA171

THERMAL METRIC

(1)

D (SO) DBV (SOT23) DRL (SOT553) UNITS
8 PINS 5 PINS 5 PINS

θ

JA

θ

JC(top)

θ

JB

ψ

JT

ψ

JB

θ

JC(bottom)

Junction-to-ambient thermal resistance 149.5 245.8 208.1
Junction-to-case(top) thermal resistance 97.9 133.9 0.1
Junction-to-board thermal resistance 87.7 83.6 42.4
Junction-to-top characterization parameter 35.5 18.2 0.5
Junction-to-board characterization parameter 89.5 83.1 42.2
Junction-to-case(bottom) thermal resistance N/A N/A N/A

(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

OPA171

THERMAL INFORMATION: OPA2171

THERMAL METRIC

(1)

D (SO) DCU (VSSOP) DGK (MSOP) UNITS
8 PINS 8 PINS 8 PINS

θ

JA

θ

JC(top)

θ

JB

ψ

JT

ψ

JB

θ

JC(bottom)

Junction-to-ambient thermal resistance 134.3 175.2 195.3
Junction-to-case(top) thermal resistance 72.1 74.9 59.4
Junction-to-board thermal resistance 60.6 22.2 115.1
Junction-to-top characterization parameter 18.2 1.6 4.7
Junction-to-board characterization parameter 53.8 22.8 114.4
Junction-to-case(bottom) thermal resistance N/A N/A N/A

(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

OPA2171

www.ti.com

°C/W

°C/W

THERMAL INFORMATION: OPA4171

THERMAL METRIC

(1)

D (SO) PW (TSSOP) UNITS

14 PINS 14 PINS

θ

JA

θ

JC(top)

θ

JB

ψ

JT

ψ

JB

θ

JC(bottom)

Junction-to-ambient thermal resistance 93.2 106.9
Junction-to-case(top) thermal resistance 51.8 24.4
Junction-to-board thermal resistance 49.4 59.3
Junction-to-top characterization parameter 13.5 0.6
Junction-to-board characterization parameter 42.2 54.3
Junction-to-case(bottom) thermal resistance N/A N/A

(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

OPA4171

°C/W

4 Submit Documentation Feedback Copyright © 2010–2012, Texas Instruments Incorporated

Product Folder Links: OPA171 OPA2171 OPA4171

1

2

3

4

8

7

6

5

NC

(1)

V+

OUT

NC

(1)

NC

(1)

-IN

+IN

V-

1

2

3

4

14

13

12

11

OUTD

-IND

+IND

V-

OUTA

-INA

+INA

V+

5

6

7

10

9

8

+INC

-INC

OUTC

+INB

-INB

OUTB

1

2

3

5

4

V+

-IN

OUT

V-

+IN

1

2

3

4

8

7

6

5

V+

OUTB

-INB

+INB

OUTA

-INA

+INA

V-

1

2

3

5

4

V+

OUT

IN+

V-

IN-

www.ti.com

OPA171
OPA2171
OPA4171

SBOS516D –SEPTEMBER 2010–REVISED SEPTEMBER 2012

PIN CONFIGURATIONS

DRL PACKAGE: OPA171

SOT-553

(TOP VIEW)

DBV PACKAGE: OPA171

SOT23-5

(TOP VIEW)

D PACKAGE: OPA171

SO-8

(TOP VIEW)

D, DCU, AND DGK PACKAGES: OPA2171

SO-8, VSSOP-8, AND MSOP-8

(TOP VIEW)

D AND PW PACKAGES: OPA4171

SO-14 AND TSSOP-14

(TOP VIEW)

(1) No internal connection.

Product Folder Links: OPA171 OPA2171 OPA4171

Copyright © 2010–2012, Texas Instruments Incorporated Submit Documentation Feedback 5

OPA171
OPA2171
OPA4171

SBOS516D –SEPTEMBER 2010–REVISED SEPTEMBER 2012

TYPICAL CHARACTERISTICS

Table 1. Characteristic Performance Measurements

DESCRIPTION FIGURE

Offset Voltage Production Distribution Figure 1

Offset Voltage Drift Distribution Figure 2
Offset Voltage vs Temperature Figure 3

Offset Voltage vs Common-Mode Voltage Figure 4

Offset Voltage vs Common-Mode Voltage (Upper Stage) Figure 5

Offset Voltage vs Power Supply Figure 6

IBand IOSvs Common-Mode Voltage Figure 7

Input Bias Current vs Temperature Figure 8

Output Voltage Swing vs Output Current (Maximum Supply) Figure 9

CMRR and PSRR vs Frequency (Referred-to Input) Figure 10

CMRR vs Temperature Figure 11

PSRR vs Temperature Figure 12

0.1Hz to 10Hz Noise Figure 13

Input Voltage Noise Spectral Density vs Frequency Figure 14

THD+N Ratio vs Frequency Figure 15

THD+N vs Output Amplitude Figure 16

Quiescent Current vs Temperature Figure 17

Quiescent Current vs Supply Voltage Figure 18

Open-Loop Gain and Phase vs Frequency Figure 19

Closed-Loop Gain vs Frequency Figure 20

Open-Loop Gain vs Temperature Figure 21

Open-Loop Output Impedance vs Frequency Figure 22

Small-Signal Overshoot vs Capacitive Load (100mV Output Step) Figure 23, Figure 24

No Phase Reversal Figure 25

Positive Overload Recovery Figure 26

Negative Overload Recovery Figure 27

Small-Signal Step Response (100mV) Figure 28, Figure 29

Large-Signal Step Response Figure 30, Figure 31

Large-Signal Settling Time (10V Positive Step) Figure 32

Large-Signal Settling Time (10V Negative Step) Figure 33

Short-Circuit Current vs Temperature Figure 34

Maximum Output Voltage vs Frequency Figure 35

Channel Separation vs Frequency Figure 36

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6 Submit Documentation Feedback Copyright © 2010–2012, Texas Instruments Incorporated

Product Folder Links: OPA171 OPA2171 OPA4171

10000

8000

6000

4000

2000

0

2000

4000

6000

8000

10000

-

-

-

-

-

V ( V)m

OS

15.5 16 16.5 17 17.5 18 18.5

V (V)

CM

10TypicalUnitsShown

Normal

Operation

V =+18.1V

CM

350

250

150

50

50

150

250

350

-

-

-

-

V ( V)m

OS

0 2 4 6 8 16 20

V (V)

SUPPLY

V = 1.35Vto 18V
10TypicalUnitsShown

±

SUPPLY

±

18141210

600

400

200

0

200

400

600

800

-

-

-

-

OffsetVoltage( V)m

-75 -50 -25 0 25 150

Temperature( C)°

50 12510075

5TypicalUnitsShown

1000

800

600

400

200

0

200

400

600

800

1000

-

-

-

-

-

V ( V)m

OS

-20 -15 -10 -5 0 5 10 15 20

V (V)

CM

V = 18.1V-

CM

10TypicalUnitsShown

-1200

-1100

-1000

-900

-800

-700

-600

-500

-400

-300

-100

0

100

200

300

400

500

600

700

800

900

1000

1200

OffsetVoltage( V)m

PercentageofAmplifiers(%)

16

14

12

10

8

6

4

2

0

-200

1100

DistributionTakenFrom3500Amplifiers

0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.1

1.2

1.3

2

OffsetVoltageDrift( V/ C)m °

PercentageofAmplifiers(%)

25

20

15

10

5

0

1

DistributionTakenFrom110Amplifiers

1.5

1.7

1.9

1.8

1.6

1.4

www.ti.com

OPA2171
OPA4171

SBOS516D –SEPTEMBER 2010–REVISED SEPTEMBER 2012

TYPICAL CHARACTERISTICS

VS= ±18V, VCM= VS/2, R

OFFSET VOLTAGE PRODUCTION DISTRIBUTION OFFSET VOLTAGE DRIFT DISTRIBUTION

Figure 1. Figure 2.

= 10kΩ connected to VS/2, and CL= 100pF, unless otherwise noted.

LOAD

OPA171

OFFSET VOLTAGE vs TEMPERATURE OFFSET VOLTAGE vs COMMON-MODE VOLTAGE

Figure 3. Figure 4.

OFFSET VOLTAGE vs COMMON-MODE VOLTAGE

(Upper Stage) OFFSET VOLTAGE vs POWER SUPPLY

Copyright © 2010–2012, Texas Instruments Incorporated Submit Documentation Feedback 7

Figure 5. Figure 6.

Product Folder Links: OPA171 OPA2171 OPA4171

30

20

10

0

10

20

30

-

-

-

Common-ModeRejectionRatio( V/V)m

-75 -50 -25 0 25 150

Temperature( C)°

50 12510075

V =2.7V

S

V =4V

S

V =36V

S

3

2

1

0

1

2

3

-

-

-

Power-SupplyRejectionRatio( V/V)m

-75 -50 -25 0 25 150

Temperature( C)°

50 12510075

V =2.7Vto36V

S

V =4Vto36V

S

18

OutputVoltage(V)

0 2 4 6 8 16

OutputCurrent(mA)

10 12 14

17

16

15

14.5

-14.5

-15

-16

-17

-18

- °40 C

+25 C°
+85 C°
+125 C°

140

120

100

80

60

40

20

0

Common-ModeRejectionRatio(dB),

Power-SupplyRejectionRatio(dB)

1 10 100 1k 10k 10M

Frequency(Hz)

100k 1M

+PSRR

-PSRR
CMRR

15
14
13
12
11
10

9
8
7
6
5
4
3
2
1
0

I andI (pA)

B OS

-20 -12 -6 0 6 20

V (V)

CM

12

-I

B

+I

B

-I

OS

-18 18

V = 18.1V-

CM

V =16V

CM

I

B+

I

B-

I

OS

10000

1000

100

10

1

0

InputBiasCurrent(pA)

-75 -50 -25 0 25 150

Temperature( C)°

50 12510075

I

B

I

OS

OPA171
OPA2171
OPA4171

SBOS516D –SEPTEMBER 2010–REVISED SEPTEMBER 2012

TYPICAL CHARACTERISTICS (continued)

VS= ±18V, VCM= VS/2, R

IBAND IOSvs COMMON-MODE VOLTAGE INPUT BIAS CURRENT vs TEMPERATURE

OUTPUT VOLTAGE SWING vs OUTPUT CURRENT CMRR AND PSRR vs FREQUENCY

= 10kΩ connected to VS/2, and CL= 100pF, unless otherwise noted.

LOAD

Figure 7. Figure 8.

(Maximum Supply) (Referred-to Input)

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Figure 9. Figure 10.

CMRR vs TEMPERATURE PSRR vs TEMPERATURE

8 Submit Documentation Feedback Copyright © 2010–2012, Texas Instruments Incorporated

Figure 11. Figure 12.

Product Folder Links: OPA171 OPA2171 OPA4171

0.65

0.6

0.55

0.5

0.45

0.4

0.35

I (mA)

Q

-75 -50 -25 0 25 150

Temperature( C)°

1251007550

0.6

0.55

0.5

0.45

0.4

0.35

0.3

0.25

I (mA)

Q

0 4 8 12 16 36

SupplyVoltage(V)

32282420

SpecifiedSupply-VoltageRange

0.01

0.001

0.0001

0.00001

TotalHarmonicDistortion+Noise(%)

10 100 1k 10k 20k

Frequency(Hz)

TotalHarmonicDistortion+Noise(dB)

V =3V
BW=80kHz

OUT RMS

G=+1,R =10kW

L

G= 1,R =2k- W

L

-80

-100

-120

-140

0.1

0.01

0.001

0.0001

0.00001

TotalHarmonicDistortion+Noise(%)

0.01 0.1 1 10 20

OutputAmplitude(V )

RMS

-80

TotalHarmonicDistortion+Noise(dB)

BW=80kHz

G=+1,R =10kW

L

G= 1,R =2k- W

L

-100

-120

-140

1000

100

10

1

VoltageNoiseDensity(nV/ )Ö

Hz

1 10 100 1k 10k 1M

Frequency(Hz)

100k

1 V/divm

Time(1s/div)

www.ti.com

VS= ±18V, VCM= VS/2, R

THD+N RATIO vs FREQUENCY THD+N vs OUTPUT AMPLITUDE

SBOS516D –SEPTEMBER 2010–REVISED SEPTEMBER 2012

TYPICAL CHARACTERISTICS (continued)

= 10kΩ connected to VS/2, and CL= 100pF, unless otherwise noted.

LOAD

0.1Hz TO 10Hz NOISE FREQUENCY

Figure 13. Figure 14.

INPUT VOLTAGE NOISE SPECTRAL DENSITY vs

OPA171
OPA2171
OPA4171

QUIESCENT CURRENT vs TEMPERATURE QUIESCENT CURRENT vs SUPPLY VOLTAGE

Copyright © 2010–2012, Texas Instruments Incorporated Submit Documentation Feedback 9

Figure 15. Figure 16.

Figure 17. Figure 18.

Product Folder Links: OPA171 OPA2171 OPA4171

50

45

40

35

30

25

20

15

10

5

0

Overshoot(%)

0 100 200 300 400 500 600 700 800 900 1000

CapacitiveLoad(pF)

+18V

-18V

R

OUT

C

L

OPA171

R

L

G=+1

R =0W

OUT

R =25W

OUT

R =50W

OUT

R =10kW

L

50

45

40

35

30

25

20

15

10

5

0

Overshoot(%)

0 100 200 300 400 500 600 700 800 900 1000

CapacitiveLoad(pF)

OPA171

R =I10kW

R

OUT

C

L

RF=10kW

+18V

-18V

G= 1-

R =0W

OUT

R =25W

OUT

R =50W

OUT

3

2.5

2

1.5

1

0.5

0

A ( V/V)m

OL

-75 150

Temperature( C)°

-25-50 0

5TypicalUnitsShown

125100755025

V =2.7V

S

V =4V

S

V =36V

S

1M

100k

10k

1k

100

10

1

1m

Z ( )W

O

1 10 100 1k 10k 10M

Frequency(Hz)

100k 1M

180

135

90

45

0

45-

Gain(dB)

1 10 100 1k 10k 10M

Frequency(Hz)

1M100k

Phase

Gain

Phase( )°

180

135

90

45

0

-45

25

20

15

10

5

0

5

10

15

20

-

-

-

-

Gain(dB)

10k 100M

Frequency(Hz)

1M100k 10M

G=10
G=1
G= 1-

OPA171
OPA2171
OPA4171

SBOS516D –SEPTEMBER 2010–REVISED SEPTEMBER 2012

TYPICAL CHARACTERISTICS (continued)

VS= ±18V, VCM= VS/2, R

OPEN-LOOP GAIN AND PHASE vs FREQUENCY CLOSED-LOOP GAIN vs FREQUENCY

OPEN-LOOP GAIN vs TEMPERATURE OPEN-LOOP OUTPUT IMPEDANCE vs FREQUENCY

= 10kΩ connected to VS/2, and CL= 100pF, unless otherwise noted.

LOAD

Figure 19. Figure 20.

www.ti.com

Figure 21. Figure 22.

SMALL-SIGNAL OVERSHOOT vs CAPACITIVE LOAD SMALL-SIGNAL OVERSHOOT vs CAPACITIVE LOAD

(100mV Output Step) (100mV Output Step)

10 Submit Documentation Feedback Copyright © 2010–2012, Texas Instruments Incorporated

Figure 23. Figure 24.

Product Folder Links: OPA171 OPA2171 OPA4171

Time(20 s/div)m

20mV/div

+18V

-18V

R 2kW

F

=

R 2kW

I

=

C

L

OPA171

G= 1-

C =100pF

L

2V/div

Time(5 s/div)m

G=+1
R =10k

C =100pF

W

L

L

Time(5 s/div)m

5V/div

V

IN

V

OUT

2kW

20kW

V

IN

V

OUT

OPA171

G= 10-

+18V

-18V

20mV/div

Time(1 s/div)m

+18V

-18V

C

L

R

L

OPA171

G=+1

R =10k
C =100pF

W

L

L

Output

Output

Time(100 s/div)m

5V/div

+18V

-18V

37V

PP

SineWave

( 18.5V)±

OPA171

Time(5 s/div)m

5V/div

V

IN

V

OUT

2kW

20kW

V

IN

V

OUT

OPA171

G= 10-

+18V

-18V

www.ti.com

VS= ±18V, VCM= VS/2, R

NO PHASE REVERSAL POSITIVE OVERLOAD RECOVERY

NEGATIVE OVERLOAD RECOVERY (100mV)

SBOS516D –SEPTEMBER 2010–REVISED SEPTEMBER 2012

TYPICAL CHARACTERISTICS (continued)

= 10kΩ connected to VS/2, and CL= 100pF, unless otherwise noted.

LOAD

Figure 25. Figure 26.

SMALL-SIGNAL STEP RESPONSE

OPA171
OPA2171
OPA4171

Figure 27. Figure 28.

SMALL-SIGNAL STEP RESPONSE

(100mV) LARGE-SIGNAL STEP RESPONSE

Figure 29. Figure 30.

Copyright © 2010–2012, Texas Instruments Incorporated Submit Documentation Feedback 11

Product Folder Links: OPA171 OPA2171 OPA4171

15

12.5

10

7.5

5

2.5

0

OutputVoltage(V )

PP

10k 100k 1M 10M

Frequency(Hz)

V = 15V±

S

V = 5V±

S

V = 1.35V±

S

Maximumoutputvoltagewithout
slew-rateinduceddistortion.

-60

70

80

90

100

110

120

-

-

-

-

-

-

ChannelSeparation(dB)

10 100 1k 10k 100k

Frequency(Hz)

10

8

6

4

2

0

2

4

6

8

10

-

-

-

-

-

D FromFinalValue(mV)

0 36

Time( s)m

84 28 3224201612

12-BitSettling

( 1/2LSB= 0.024%)± ±

G= 1-

50

45

40

35

30

25

20

15

10

5

0

I (mA)

SC

-75 -50 -25 0 25 150

Temperature( C)°

50 125

I ,Source

SC

10075

I ,Sink

SC

10

8

6

4

2

0

2

4

6

8

10

-

-

-

-

-

D FromFinalValue(mV)

0 36

Time( s)m

84 28 3224201612

12-BitSettling

( 1/2LSB= 0.024%)± ±

G= 1-

Time(4 s/div)m

2V/div

G= 1
R =10k

C =100pF

­W

L

L

OPA171
OPA2171
OPA4171

SBOS516D –SEPTEMBER 2010–REVISED SEPTEMBER 2012

TYPICAL CHARACTERISTICS (continued)

VS= ±18V, VCM= VS/2, R

LARGE-SIGNAL STEP RESPONSE (10V Positive Step)

LARGE-SIGNAL SETTLING TIME

= 10kΩ connected to VS/2, and CL= 100pF, unless otherwise noted.

LOAD

Figure 31. Figure 32.

(10V Negative Step) SHORT-CIRCUIT CURRENT vs TEMPERATURE

www.ti.com

LARGE-SIGNAL SETTLING TIME

Figure 33. Figure 34.

MAXIMUM OUTPUT VOLTAGE vs FREQUENCY CHANNEL SEPARATION vs FREQUENCY

12 Submit Documentation Feedback Copyright © 2010–2012, Texas Instruments Incorporated

Figure 35. Figure 36.

Product Folder Links: OPA171 OPA2171 OPA4171

Output

Output

Time(100 s/div)m

5V/div

+18V

-18V

37V

PP

SineWave

( 18.5V)±

OPA171

OPA171
OPA2171
OPA4171

www.ti.com

APPLICATION INFORMATION

The OPAx171 family of operational amplifiers provide This device can operate with full rail-to-rail input
high overall performance, making them ideal for many 100mV beyond the top rail, but with reduced
general-purpose applications. The excellent offset performance within 2V of the top rail. The typical
drift of only 2µV/°C provides excellent stability over performance in this range is summarized in Table 2.
the entire temperature range. In addition, the device
offers very good overall performance with high
CMRR, PSRR, and AOL. As with all amplifiers,
applications with noisy or high-impedance power
supplies require decoupling capacitors close to the
device pins. In most cases, 0.1µF capacitors are
adequate.

OPERATING CHARACTERISTICS

The OPAx171 family of amplifiers is specified for The input of the OPAx171 prevents phase reversal
operation from 2.7V to 36V (±1.35V to ±18V). Many with excessive common-mode voltage. Instead, the
of the specifications apply from –40°C to +125°C. output limits into the appropriate rail. This
Parameters that can exhibit significant variance with performance is shown in Figure 37.
regard to operating voltage or temperature are
presented in the Typical Characteristics.

PHASE-REVERSAL PROTECTION

The OPAx171 family has an internal phase-reversal
protection. Many op amps exhibit a phase reversal
when the input is driven beyond its linear common­mode range. This condition is most often encountered
in noninverting circuits when the input is driven
beyond the specified common-mode voltage range,
causing the output to reverse into the opposite rail.

SBOS516D –SEPTEMBER 2010–REVISED SEPTEMBER 2012

GENERAL LAYOUT GUIDELINES

For best operational performance of the device, good
printed circuit board (PCB) layout practices are
recommended. Low-loss, 0.1µF bypass capacitors
should be connected between each supply pin and
ground, placed as close to the device as possible. A
single bypass capacitor from V+ to ground is
applicable to single-supply applications.

COMMON-MODE VOLTAGE RANGE

The input common-mode voltage range of the
OPAx171 series extends 100mV below the negative
rail and within 2V of the top rail for normal operation.

Table 2. Typical Performance Range

PARAMETER MIN TYP MAX UNIT

Input Common-Mode Voltage (V+) – 2 (V+) + 0.1 V

Offset voltage 7 mV

vs Temperature 12 µV/°C

Common-mode rejection 65 dB
Open-loop gain 60 dB
GBW 0.7 MHz
Slew rate 0.7 V/µs
Noise at f = 1kHz 30 nV/√Hz

Figure 37. No Phase Reversal

Product Folder Links: OPA171 OPA2171 OPA4171

Copyright © 2010–2012, Texas Instruments Incorporated Submit Documentation Feedback 13

50

45

40

35

30

25

20

15

10

5

0

Overshoot(%)

0 100 200 300 400 500 600 700 800 900 1000

CapacitiveLoad(pF)

OPA171

R =I10kW

R

OUT

C

L

RF=10kW

+18V

-18V

G= 1-

R =0W

OUT

R =25W

OUT

R =50W

OUT

50

45

40

35

30

25

20

15

10

5

0

Overshoot(%)

0 100 200 300 400 500 600 700 800 900 1000

CapacitiveLoad(pF)

+18V

-18V

R

OUT

C

L

OPA171

R

L

G=+1

R =0W

OUT

R =25W

OUT

R =50W

OUT

R =10kW

L

5kW

OPA171

10mAmax

V+

V

IN

V

OUT

I

OVERLOAD

OPA171
OPA2171
OPA4171

SBOS516D –SEPTEMBER 2010–REVISED SEPTEMBER 2012

CAPACITIVE LOAD AND STABILITY or even the output pin. Each of these different pin

The dynamic characteristics of the OPAx171 have
been optimized for commonly encountered operating
conditions. The combination of low closed-loop gain
and high capacitive loads decreases the phase
margin of the amplifier and can lead to gain peaking
or oscillations. As a result, heavier capacitive loads
must be isolated from the output. The simplest way to
achieve this isolation is to add a small resistor (for
example, R

equal to 50Ω) in series with the These ESD protection diodes also provide in-circuit,

OUT

output. Figure 38 and Figure 39 illustrate graphs of input overdrive protection, as long as the current is
small-signal overshoot versus capacitive load for limited to 10mA as stated in the Absolute Maximum
several values of R

. Also, refer to Applications Ratings. Figure 40 shows how a series input resistor

OUT

Bulletin AB-028 (SBOA015), available for download may be added to the driven input to limit the input

from the TI website for details of analysis techniques current. The added resistor contributes thermal noise
and application circuits. at the amplifier input and its value should be kept to a

functions have electrical stress limits determined by
the voltage breakdown characteristics of the
particular semiconductor fabrication process and
specific circuits connected to the pin. Additionally,
internal electrostatic discharge (ESD) protection is
built into these circuits to protect them from
accidental ESD events both before and during
product assembly.

minimum in noise-sensitive applications.

www.ti.com

Figure 38. Small-Signal Overshoot versus

Capacitive Load (100mV Output Step)

Figure 39. Small-Signal Overshoot versus

Capacitive Load (100mV Output Step)

ELECTRICAL OVERSTRESS

Designers often ask questions about the capability of
an operational amplifier to withstand electrical
overstress. These questions tend to focus on the
device inputs, but may involve the supply voltage pins

14 Submit Documentation Feedback Copyright © 2010–2012, Texas Instruments Incorporated

An ESD event produces a short duration, high­voltage pulse that is transformed into a short
duration, high-current pulse as it discharges through
a semiconductor device. The ESD protection circuits
are designed to provide a current path around the
operational amplifier core to prevent it from being
damaged. The energy absorbed by the protection
circuitry is then dissipated as heat.

When the operational amplifier connects into a circuit,
the ESD protection components are intended to
remain inactive and not become involved in the
application circuit operation. However, circumstances
may arise where an applied voltage exceeds the
operating voltage range of a given pin. Should this
condition occur, there is a risk that some of the
internal ESD protection circuits may be biased on,
and conduct current. Any such current flow occurs
through ESD cells and rarely involves the absorption
device.

If there is an uncertainty about the ability of the
supply to absorb this current, external zener diodes
may be added to the supply pins. The zener voltage
must be selected such that the diode does not turn
on during normal operation.

However, its zener voltage should be low enough so
that the zener diode conducts if the supply pin begins
to rise above the safe operating supply voltage level.

Product Folder Links: OPA171 OPA2171 OPA4171

Figure 40. Input Current Protection

OPA171
OPA2171
OPA4171

www.ti.com

REVISION HISTORY

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision C (June 2011) to Revision D Page

• Added "Value Line Series" to title ......................................................................................................................................... 1

Changes from Revision B (November 2010) to Revision C Page

• Added MSOP-8 package to device graphic .......................................................................................................................... 1

• Added MSOP-8 package to Features bullets ....................................................................................................................... 1

• Added MSOP-8 package to Product Family table ................................................................................................................ 1

• Added MSOP-8 package to Package/Ordering Information table ........................................................................................ 2

• Deleted "A" suffix from OPA4171 package markings in Package/Ordering Information table. ............................................ 2

• Added new row for Voltage Output Swing from Rail parameter to Output subsection of Electrical Characteristics ............ 3

• Changed Voltage Output Swing from Rail parameter to over temperature in Output subsection of Electrical

Characteristics ...................................................................................................................................................................... 3

• Updated format of thermal information tables ...................................................................................................................... 4

• Added MSOP-8 package to OPA2171 Thermal Information table ....................................................................................... 4

• Updated pinout configurations for OPA2171 and OPA4171 ................................................................................................ 5

• Changed Figure 9 ................................................................................................................................................................. 8

SBOS516D –SEPTEMBER 2010–REVISED SEPTEMBER 2012

Changes from Revision A (November, 2010) to Revision B Page

• Changed input offset voltage specification ........................................................................................................................... 3

• Changed input offset voltage, over temperature specification .............................................................................................. 3

• Changed quiescent current per amplifier, over temperature specification ........................................................................... 3

Copyright © 2010–2012, Texas Instruments Incorporated Submit Documentation Feedback 15

Product Folder Links: OPA171 OPA2171 OPA4171

PACKAGE OPTION ADDENDUM

www.ti.com

PACKAGING INFORMATION

Orderable Device Status

OPA171AID ACTIVE SOIC D 8 75 Green (RoHS

OPA171AIDBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS

OPA171AIDBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS

OPA171AIDR ACTIVE SOIC D 8 2500 Green (RoHS

OPA171AIDRLR ACTIVE SOT DRL 5 4000 Green (RoHS

OPA171AIDRLT ACTIVE SOT DRL 5 250 Green (RoHS

OPA2171AID ACTIVE SOIC D 8 75 Green (RoHS

OPA2171AIDCUR ACTIVE US8 DCU 8 3000 Green (RoHS

OPA2171AIDCUT ACTIVE US8 DCU 8 250 Green (RoHS

OPA2171AIDGK ACTIVE VSSOP DGK 8 80 Green (RoHS

OPA2171AIDGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS

OPA2171AIDR ACTIVE SOIC D 8 2500 Green (RoHS

OPA4171AID ACTIVE SOIC D 14 50 Green (RoHS

OPA4171AIDR ACTIVE SOIC D 14 2500 Green (RoHS

OPA4171AIPW ACTIVE TSSOP PW 14 90 Green (RoHS

OPA4171AIPWR ACTIVE TSSOP PW 14 2000 Green (RoHS

(1)

The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

Package Type Package

(1)

Drawing

Pins Package

Qty

Eco Plan

(2)

& no Sb/Br)

& no Sb/Br)

& no Sb/Br)

& no Sb/Br)

& no Sb/Br)

& no Sb/Br)

& no Sb/Br)

& no Sb/Br)

& no Sb/Br)

& no Sb/Br)

& no Sb/Br)

& no Sb/Br)

& no Sb/Br)

& no Sb/Br)

& no Sb/Br)

& no Sb/Br)

Lead/Ball Finish

(6)

MSL Peak Temp

(3)

Op Temp (°C) Device Marking

CU NIPDAU Level-2-260C-1 YEAR -40 to 125 O171A

CU NIPDAU Level-2-260C-1 YEAR -40 to 125 OSUI

CU NIPDAU Level-2-260C-1 YEAR -40 to 125 OSUI

CU NIPDAU Level-2-260C-1 YEAR -40 to 125 O171A

CU NIPDAU Level-1-260C-UNLIM -40 to 125 DAP

CU NIPDAU Level-1-260C-UNLIM -40 to 125 DAP

CU NIPDAU Level-2-260C-1 YEAR -40 to 125 2171A

CU NIPDAU Level-1-260C-UNLIM -40 to 125 OPOC

CU NIPDAU Level-1-260C-UNLIM -40 to 125 OPOC

CU NIPDAU |

Level-2-260C-1 YEAR -40 to 125 OPMI

CU NIPDAUAG

CU NIPDAU |

Level-2-260C-1 YEAR -40 to 125 OPMI

CU NIPDAUAG

CU NIPDAU Level-2-260C-1 YEAR -40 to 125 2171A

CU NIPDAU Level-3-260C-168 HR -40 to 125 OPA4171

CU NIPDAU Level-3-260C-168 HR -40 to 125 OPA4171

CU NIPDAU Level-2-260C-1 YEAR -40 to 125 OPA4171

CU NIPDAU Level-2-260C-1 YEAR -40 to 125 OPA4171

18-Oct-2013

Samples

(4/5)

Addendum-Page 1

PACKAGE OPTION ADDENDUM

www.ti.com

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.

18-Oct-2013

(2)

Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)

(3)

MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4)

There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5)

Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

(6)

Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish

value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

OTHER QUALIFIED VERSIONS OF OPA171 :

Automotive: OPA171-Q1

•

NOTE: Qualified Version Definitions:

Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects

•

Addendum-Page 2

PACKAGE MATERIALS INFORMATION

www.ti.com 18-Sep-2013

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package

Type

OPA171AIDBVR SOT-23 DBV 5 3000 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
OPA171AIDBVR SOT-23 DBV 5 3000 180.0 8.4 3.23 3.17 1.37 4.0 8.0 Q3
OPA171AIDBVT SOT-23 DBV 5 250 180.0 8.4 3.23 3.17 1.37 4.0 8.0 Q3
OPA171AIDBVT SOT-23 DBV 5 250 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
OPA171AIDRLR SOT DRL 5 4000 180.0 8.4 1.98 1.78 0.69 4.0 8.0 Q3

OPA171AIDRLT SOT DRL 5 250 180.0 8.4 1.98 1.78 0.69 4.0 8.0 Q3
OPA2171AIDCUR US8 DCU 8 3000 180.0 8.4 2.25 3.35 1.05 4.0 8.0 Q3
OPA2171AIDCUT US8 DCU 8 250 180.0 8.4 2.25 3.35 1.05 4.0 8.0 Q3
OPA2171AIDGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
OPA2171AIDGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1

OPA2171AIDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1

OPA4171AIPWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1

Package
Drawing

Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

A0

(mm)B0(mm)K0(mm)P1(mm)W(mm)

Pin1

Quadrant

Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION

www.ti.com 18-Sep-2013

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

OPA171AIDBVR SOT-23 DBV 5 3000 195.0 200.0 45.0

OPA171AIDBVR SOT-23 DBV 5 3000 202.0 201.0 28.0

OPA171AIDBVT SOT-23 DBV 5 250 202.0 201.0 28.0
OPA171AIDBVT SOT-23 DBV 5 250 195.0 200.0 45.0
OPA171AIDRLR SOT DRL 5 4000 202.0 201.0 28.0
OPA171AIDRLT SOT DRL 5 250 202.0 201.0 28.0

OPA2171AIDCUR US8 DCU 8 3000 202.0 201.0 28.0

OPA2171AIDCUT US8 DCU 8 250 202.0 201.0 28.0
OPA2171AIDGKR VSSOP DGK 8 2500 366.0 364.0 50.0
OPA2171AIDGKR VSSOP DGK 8 2500 358.0 335.0 35.0

OPA2171AIDR SOIC D 8 2500 367.0 367.0 35.0

OPA4171AIPWR TSSOP PW 14 2000 367.0 367.0 35.0

Pack Materials-Page 2

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regulatory requirements in connection with such use.

TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.

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