Texas Instruments MSP430F2272TDA, MSP430F2252IYFF, MSP430F2232IDA, MSP430F2232IYFF, MSP430F2252IDA User Manual

...
MSP430F22x2 MSP430F22x4
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MIXED SIGNAL MICROCONTROLLER
1
FEATURES
23
Low Supply Voltage Range: 1.8 V to 3.6 V
Ultra-Low Power Consumption – Active Mode: 270 µA at 1 MHz, 2.2 V – Standby Mode: 0.7 µA – Off Mode (RAM Retention): 0.1 µA
Ultra-Fast Wake-Up From Standby Mode in Less Than 1 µs
16-Bit RISC Architecture, 62.5-ns Instruction Cycle Time
Basic Clock Module Configurations – Internal Frequencies up to 16 MHz With
Four Calibrated Frequencies to ±1% – 512B RAM
– Internal Very-Low-Power Low-Frequency – MSP430F2252
Oscillator – 32-kHz Crystal – High-Frequency (HF) Crystal up to 16 MHz – Resonator – External Digital Clock Source – External Resistor
16-Bit Timer_A With Three Capture/Compare Registers
16-Bit Timer_B With Three Capture/Compare Registers
Universal Serial Communication Interface – Enhanced UART Supporting Auto-Baudrate
Detection (LIN) – IrDA Encoder and Decoder – Synchronous SPI – I2C™
10-Bit 200-ksps Analog-to-Digital (A/D) Converter With Internal Reference, Sample­and-Hold, Autoscan, and Data Transfer Controller
Brownout Detector
Serial Onboard Programming, No External Programming Voltage Needed, Programmable Code Protection by Security Fuse
Bootstrap Loader
On-Chip Emulation Module
Family Members Include: – MSP430F2232
– 8KB + 256B Flash Memory
– 16KB + 256B Flash Memory – 512B RAM
– MSP430F2272
– 32KB + 256B Flash Memory – 1KB RAM
– MSP430F2234
– 8KB + 256B Flash Memory – 512B RAM
– MSP430F2254
– 16KB + 256B Flash Memory – 512B RAM
– MSP430F2274
– 32KB + 256B Flash Memory – 1KB RAM
Available in a 38-Pin Thin Shrink Small-Outline Package (TSSOP) (DA), 40-Pin QFN Package (RHA), and 49-Pin Ball Grid Array Package (YFF) (See Table 1)
For Complete Module Descriptions, See the MSP430x2xx Family User's Guide (SLAU144)
SLAS504G –JULY 2006–REVISED AUGUST 2012
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2MSP430 is a trademark of Texas Instruments. 3All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
Copyright © 2006–2012, Texas Instruments Incorporated
MSP430F22x2 MSP430F22x4
SLAS504G –JULY 2006–REVISED AUGUST 2012
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
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DESCRIPTION
The Texas Instruments MSP430™ family of ultra-low-power microcontrollers consist of several devices featuring different sets of peripherals targeted for various applications. The architecture, combined with five low-power modes is optimized to achieve extended battery life in portable measurement applications. The device features a powerful 16-bit RISC CPU, 16-bit registers, and constant generators that contribute to maximum code efficiency. The digitally controlled oscillator (DCO) allows wake-up from low-power modes to active mode in less than 1 µs.
The MSP430F22x4/MSP430F22x2 series is an ultra-low-power mixed signal microcontroller with two built-in 16­bit timers, a universal serial communication interface, 10-bit A/D converter with integrated reference and data transfer controller (DTC), two general-purpose operational amplifiers in the MSP430F22x4 devices, and 32 I/O pins.
Typical applications include sensor systems that capture analog signals, convert them to digital values, and then process the data for display or for transmission to a host system. Stand-alone radio-frequency (RF) sensor front ends are another area of application.
Table 1. Available Options
PACKAGED DEVICES
T
A
-40°C to 85°C
-40°C to 105°C
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
PLASTIC 49-PIN BGA PLASTIC 38-PIN TSSOP PLASTIC 40-PIN QFN
(YFF) (DA) (RHA)
MSP430F2232IYFF MSP430F2232IDA MSP430F2232IRHA MSP430F2252IYFF MSP430F2252IDA MSP430F2252IRHA MSP430F2272IYFF MSP430F2272IDA MSP430F2272IRHA MSP430F2234IYFF MSP430F2234IDA MSP430F2234IRHA MSP430F2254IYFF MSP430F2254IDA MSP430F2254IRHA MSP430F2274IYFF MSP430F2274IDA MSP430F2274IRHA
MSP430F2232TDA MSP430F2232TRHA MSP430F2252TDA MSP430F2252TRHA MSP430F2272TDA MSP430F2272TRHA MSP430F2234TDA MSP430F2234TRHA MSP430F2254TDA MSP430F2254TRHA MSP430F2274TDA MSP430F2274TRHA
(1)(2)
Development Tool Support
All MSP430™ microcontrollers include an Embedded Emulation Module (EEM) that allows advanced debugging and programming through easy-to-use development tools. Recommended hardware options include:
Debugging and Programming Interface – MSP-FET430UIF (USB) – MSP-FET430PIF (Parallel Port)
Debugging and Programming Interface with Target Board – MSP-FET430U38 (DA package)
Production Programmer – MSP-GANG430
2 Copyright © 2006–2012, Texas Instruments Incorporated
1TEST/SBWTCK
2DVCC
3P2.5/R
OSC
4
XOUT/P2.7
5
XIN/P2.6 6
RST/NMI/SBWTDIO
7
P2.0/ACLK/A0/OA0I0
8
P2.1/TAINCLK/SMCLK/A1/OA0O 9
P2.2/TA0/A2/OA0I1
10
P3.0/UCB0STE/UCA0CLK/A5
11
P3.1/UCB0SIMO/UCB0SDA 12
P3.2/UCB0SOMI/UCB0SCL
13
P3.3/UCB0CLK/UCA0STE 14
P4.0/TB0
15
P4.1/TB1
16
P4.2/TB2
17
P4.3/TB0/A12/OA0O
18 P4.4/TB1/A13/OA1O
19
38 P1.7/TA2/TDO/TDI
37 P1.6/TA1/TDI
36
P1.5/TA0/TMS
35 P1.4/SMCLK/TCK
34
P1.3/TA2
33
P1.2/TA1
32 P1.1/TA0
31
P1.0/TACLK/ADC10CLK
30
P2.4/TA2/A4/VREF+/VeREF+/OA1I0
29 P2.3/TA1/A3/VREF−/VeREF−/OA1I1/OA1O
28 P3.7/A7/OA1I2
27 P3.6/A6/OA0I2
26 P3.5/UCA0RXD/UCA0SOMI
25
P3.4/UCA0TXD/UCA0SIMO
24
23AVCC
22
AVSS
21
P4.7/TBCLK
20
P4.6/TBOUTH/A15/OA1I3
DVSS
P4.5/TB2/A14/OA0I3
1TEST/SBWTCK
2DVCC
3P2.5/R
OSC
4
XOUT/P2.7
5
XIN/P2.6 6
RST/NMI/SBWTDIO
7
P2.0/ACLK/A0
8
P2.1/TAINCLK/SMCLK/A1 9
P2.2/TA0/A2
10
P3.0/UCB0STE/UCA0CLK/A5
11
P3.1/UCB0SIMO/UCB0SDA 12
P3.2/UCB0SOMI/UCB0SCL
13
P3.3/UCB0CLK/UCA0STE 14
P4.0/TB0
15
P4.1/TB1
16
P4.2/TB2
17
P4.3/TB0/A12
18 P4.4/TB1/A13
19
38 P1.7/TA2/TDO/TDI
37 P1.6/TA1/TDI
36
P1.5/TA0/TMS
35 P1.4/SMCLK/TCK
34
P1.3/TA2
33
P1.2/TA1
32 P1.1/TA0
31
P1.0/TACLK/ADC10CLK
30
P2.4/TA2/A4/VREF+/VeREF+
29 P2.3/TA1/A3/VREF−/VeREF−
28 P3.7/A7
27 P3.6/A6
26 P3.5/UCA0RXD/UCA0SOMI
25
P3.4/UCA0TXD/UCA0SIMO
24
23AVCC
22
AVSS
21
P4.7/TBCLK
20
P4.6/TBOUTH/A15
DVSS
P4.5/TB2/A14
MSP430F22x2 MSP430F22x4
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MSP430F22x2 Device Pinout, DA Package
SLAS504G –JULY 2006–REVISED AUGUST 2012
MSP430F22x4 Device Pinout, DA Package
Copyright © 2006–2012, Texas Instruments Incorporated 3
1DVSS
P1.5/TA0/TMS
P1.0/TACLK/ADC10CLK
P1.1/TA0
P1.2/TA1
P1.3/TA2
P1.4/SMCLK/TCK
13
P2.4/TA2/A4/VREF+/VeREF+
P2.5/R
OSC
DVCC
TEST/SBWTCK
P1.6/TA1/TDI/TCLK
2
3
4
5
6
7
8
10
9
12 14 15 16 17 18 19
30
29
28
27
26
25
24
23
21
22
3839 37 36 35 34 33 32
XOUT/P2.7
XIN/P2.6
DVSS
RST/NMI/SBWTDIO
P2.0/ACLK/A0
P2.1/TAINCLK/SMCLK/A1
P2.2/TA0/A2
P3.0/UCB0STE/UCA0CLK/A5
P3.1/UCB0SIMO/UCB0SDA
DVCC
P1.7/TA2/TDO/TDI
P2.3/TA1/A3/VREF−/VeREF−
P3.7/A7
P3.6/A6
P3.5/UCA0RXD/UCA0SOMI
P3.4/UCA0TXD/UCA0SIMO
AVCC
AVSS
P3.2/UCB0SOMI/UCB0SCL
P3.3/UCB0CLK/UCA0STE
P4.0/TB0
P4.1/TB1
P4.2/TB2
P4.3/TB0/A12
P4.4/TB1/A13
P4.5/TB2/A14
P4.6/TBOUTH/A15
P4.7/TBCLK
MSP430F22x2 MSP430F22x4
SLAS504G –JULY 2006–REVISED AUGUST 2012
MSP430F22x2 Device Pinout, RHA Package
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4 Copyright © 2006–2012, Texas Instruments Incorporated
1DVSS
P1.5/TA0/TMS
P1.0/TACLK/ADC10CLK
P1.1/TA0
P1.2/TA1
P1.3/TA2
P1.4/SMCLK/TCK
13
P2.4/TA2/A4/VREF+/VeREF+/OA1I0
P2.5/R
OSC
DVCC
TEST/SBWTCK
P1.6/TA1/TDI/TCLK
2
3
4
5
6
7
8
10
9
12 14 15 16 17 18 19
30
29
28
27
26
25
24
23
21
22
3839 37 36 35 34 33 32
XOUT/P2.7
XIN/P2.6
DVSS
RST/NMI/SBWTDIO
P2.0/ACLK/A0/OA0I0
P2.1/TAINCLK/SMCLK/A1/OA0O
P2.2/TA0/A2/OA0I1
P3.0/UCB0STE/UCA0CLK/A5
P3.1/UCB0SIMO/UCB0SDA
DVCC
P1.7/TA2/TDO/TDI
P2.3/TA1/A3/VREF−/VeREF−/OA1I1/OA1O
P3.7/A7/OA1I2
P3.6/A6/OA0I2
P3.5/UCA0RXD/UCA0SOMI
P3.4/UCA0TXD/UCA0SIMO
AVCC
AVSS
P3.2/UCB0SOMI/UCB0SCL
P3.3/UCB0CLK/UCA0STE
P4.0/TB0
P4.1/TB1
P4.2/TB2
P4.3/TB0/A12/OA0O
P4.4/TB1/A13/OA1O
P4.5/TB2/A14/OA0I3
P4.6/TBOUTH/A15/OA1I3
P4.7/TBCLK
MSP430F22x2 MSP430F22x4
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MSP430F22x4 Device Pinout, RHA Package
SLAS504G –JULY 2006–REVISED AUGUST 2012
Copyright © 2006–2012, Texas Instruments Incorporated 5
A1 A2 A4A3 A5 A6 A7
TOP VIEW
B1 B2 B4B3 B5 B6 B7
C1 C2 C4C3 C5 C6 C7
D1 D2 D4D3 D5 D6 D7
E1 E2 E4E3 E5 E6 E7
F1 F2 F4F3 F5 F6 F7
G1 G2 G4G3 G5 G6 G7
MSP430F22x2 MSP430F22x4
SLAS504G –JULY 2006–REVISED AUGUST 2012
MSP430F22x4, MSP430F22x2 Device Pinout, YFF Package
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Package Dimensions
The package dimensions for this YFF package are shown in Table 2. See the package drawing at the end of this data sheet for more details.
Table 2. YFF Package Dimensions
PACKAGED DEVICES D E
MSP430F22x2 MSP430F22x4
3.33 ± 0.03 mm 3.49 ± 0.03 mm
6 Copyright © 2006–2012, Texas Instruments Incorporated
Basic Clock
System+
RAM
1kB 512B 512B
Brownout
Protection
RST/NMI
VCC VSS
MCLK
SMCLK
Watchdog
WDT+
15/16−Bit
Timer_A3
3 CC
Registers
16MHz
CPU
incl. 16
Registers
Emulation
(2BP)
XOUT
JTAG
Interface
Flash
32kB 16kB
8kB
ACLK
XIN
MDB
MAB
Spy−Bi Wire
Timer_B3
3 CC
Registers,
Shadow
Reg
USCI_A0:
UART/LIN,
IrDA, SPI
USCI_B0:
SPI, I2C
OA0, OA1
2 Op Amps
ADC10
10−Bit
12 Channels, Autoscan,
DTC
Ports P1/P2
2x8 I/O
Interrupt
capability,
pull−up/down
resistors
Ports P3/P4
2x8 I/O
pull−up/down
resistors
P1.x/P2.x
2x8
P3.x/P4.x
2x8
Basic Clock
System+
RAM
1kB 512B 512B
Brownout
Protection
RST/NMI
VCC VSS
MCLK
SMCLK
Watchdog
WDT+
15/16−Bit
Timer_A3
3 CC
Registers
16MHz
CPU
incl. 16
Registers
Emulation
(2BP)
XOUT
JTAG
Interface
Flash
32kB 16kB
8kB
ACLK
XIN
MDB
MAB
Spy−Bi Wire
Timer_B3
3 CC
Registers,
Shadow
Reg
USCI_A0:
UART/LIN,
IrDA, SPI
USCI_B0:
SPI, I2C
ADC10
10−Bit
12 Channels, Autoscan,
DTC
Ports P1/P2
2x8 I/O
Interrupt
capability,
pull−up/down
resistors
Ports P3/P4
2x8 I/O
pull−up/down
resistors
P1.x/P2.x
2x8
P3.x/P4.x
2x8
MSP430F22x2 MSP430F22x4
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MSP430F22x2 Functional Block Diagram
SLAS504G –JULY 2006–REVISED AUGUST 2012
MSP430F22x4 Functional Block Diagram
Copyright © 2006–2012, Texas Instruments Incorporated 7
MSP430F22x2 MSP430F22x4
SLAS504G –JULY 2006–REVISED AUGUST 2012
Table 3. Terminal Functions, MSP430F22x2
TERMINAL
NAME
P1.0/TACLK/ADC10CLK F2 31 29 I/O Timer_A, clock signal TACLK input
P1.1/TA0 G2 32 30 I/O Timer_A, capture: CCI0A input, compare: OUT0 output
P1.2/TA1 E2 33 31 I/O
P1.3/TA2 G1 34 32 I/O
P1.4/SMCLK/TCK F1 35 33 I/O SMCLK signal output
P1.5/TA0/TMS E1 36 34 I/O Timer_A, compare: OUT0 output
P1.6/TA1/TDI/TCLK E3 37 35 I/O Timer_A, compare: OUT1 output
REF-
REF+
(1)
/ V
/ V
eREF-
eREF+
P1.7/TA2/TDO/TDI
P2.0/ACLK/A0 A4 8 6 I/O ACLK output
P2.1/TAINCLK/SMCLK/A1 B4 9 7 I/O
P2.2/TA0/A2 A5 10 8 I/O Timer_A, capture: CCI0B input/BSL receive, compare: OUT0 output
P2.3/TA1/A3/V
P2.4/TA2/A4/V
P2.5/R
OSC
XIN/P2.6 A2 6 3 I/O
YFF DA RHA
NO. I/O DESCRIPTION
General-purpose digital I/O pin
ADC10, conversion clock General-purpose digital I/O pin
BSL transmit General-purpose digital I/O pin Timer_A, capture: CCI1A input, compare: OUT1 output General-purpose digital I/O pin Timer_A, capture: CCI2A input, compare: OUT2 output General-purpose digital I/O pin
Test Clock input for device programming and test General-purpose digital I/O pin
Test Mode Select input for device programming and test General-purpose digital I/O pin
Test Data Input or Test Clock Input for programming and test General-purpose digital I/O pin
D2 38 36 I/O Timer_A, compare: OUT2 output
Test Data Output or Test Data Input for programming and test General-purpose digital I/O pin
ADC10, analog input A0 General-purpose digital I/O pin Timer_A, clock signal at INCLK SMCLK signal output ADC10, analog input A1 General-purpose digital I/O pin
ADC10, analog input A2 General-purpose digital I/O pin
F3 29 27 I/O
G3 30 28 I/O
C2 3 40 I/O
Timer_A, capture CCI1B input, compare: OUT1 output ADC10, analog input A3 Negative reference voltage input General-purpose digital I/O pin Timer_A, compare: OUT2 output ADC10, analog input A4 Positive reference voltage output or input General-purpose digital I/O pin Input for external DCO resistor to define DCO frequency Input terminal of crystal oscillator General-purpose digital I/O pin
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(1) TDO or TDI is selected via JTAG instruction. 8 Copyright © 2006–2012, Texas Instruments Incorporated
MSP430F22x2 MSP430F22x4
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SLAS504G –JULY 2006–REVISED AUGUST 2012
Table 3. Terminal Functions, MSP430F22x2 (continued)
TERMINAL
NAME
XOUT/P2.7 A1 5 2 I/O
P3.0/UCB0STE/UCA0CLK/ A5
P3.1/UCB0SIMO/ UCB0SDA
P3.2/UCB0SOMI/UCB0SCL A7 13 11 I/O USCI_B0 SPI mode: slave out/master in
P3.3/UCB0CLK/UCA0STE B6 14 12 I/O USCI_B0 clock input/output
P3.4/UCA0TXD/ UCA0SIMO
P3.5/UCA0RXD/ UCA0SOMI
P3.6/A6 F4 27 25 I/O
P3.7/A7 G4 28 26 I/O
P4.0/TB0 D6 17 15 I/O
P4.1/TB1 D7 18 16 I/O
P4.2/TB2 E6 19 17 I/O
P4.3/TB0/A12 E7 20 18 I/O Timer_B, capture: CCI0B input, compare: OUT0 output
P4.4/TB1/A13 F7 21 19 I/O Timer_B, capture: CCI1B input, compare: OUT1 output
P4.5/TB2/A14 F6 22 20 I/O Timer_B, compare: OUT2 output
P4.6/TBOUTH/A15 G7 23 21 I/O Timer_B, switch all TB0 to TB3 outputs to high impedance
YFF DA RHA
NO. I/O DESCRIPTION
Output terminal of crystal oscillator General-purpose digital I/O pin General-purpose digital I/O pin
B5 11 9 I/O
A6 12 10 I/O USCI_B0 SPI mode: slave in/master out
G6 25 23 I/O USCI_A0 UART mode: transmit data output
G5 26 24 I/O USCI_A0 UART mode: receive data input
USCI_B0 slave transmit enable USCI_A0 clock input/output ADC10, analog input A5 General-purpose digital I/O pin
USCI_B0 I2C mode: SDA I2C data General-purpose digital I/O pin
USCI_B0 I2C mode: SCL I2C clock General-purpose digital I/O pin
USCI_A0 slave transmit enable General-purpose digital I/O pin
USCI_A0 SPI mode: slave in/master out General-purpose digital I/O pin
USCI_A0 SPI mode: slave out/master in General-purpose digital I/O pin ADC10 analog input A6 General-purpose digital I/O pin ADC10 analog input A7 General-purpose digital I/O pin Timer_B, capture: CCI0A input, compare: OUT0 output General-purpose digital I/O pin Timer_B, capture: CCI1A input, compare: OUT1 output General-purpose digital I/O pin Timer_B, capture: CCI2A input, compare: OUT2 output General-purpose digital I/O pin
ADC10 analog input A12 General-purpose digital I/O pin
ADC10 analog input A13 General-purpose digital I/O pin
ADC10 analog input A14 General-purpose digital I/O pin
ADC10 analog input A15
(2)
(2) If XOUT/P2.7 is used as an input, excess current flows until P2SEL.7 is cleared. This is due to the oscillator output driver connection to
this pad after reset.
Copyright © 2006–2012, Texas Instruments Incorporated 9
MSP430F22x2 MSP430F22x4
SLAS504G –JULY 2006–REVISED AUGUST 2012
Table 3. Terminal Functions, MSP430F22x2 (continued)
TERMINAL
NAME
P4.7/TBCLK F5 24 22 I/O
RST/NMI/SBWTDIO B3 7 5 I
TEST/SBWTCK D1 1 37 I
DV
CC
AV
CC
DV
SS
AV
SS
QFN Pad NA NA Pad NA QFN package pad; connection to DVSSrecommended.
YFF DA RHA
E4, E5
NO. I/O DESCRIPTION
General-purpose digital I/O pin Timer_B, clock signal TBCLK input Reset or nonmaskable interrupt input Spy-Bi-Wire test data input/output during programming and test Selects test mode for JTAG pins on Port 1. The device protection fuse is
connected to TEST. Spy-Bi-Wire test clock input during programming and test
C1, D3, D4,
C6, C7, 16 14 Analog supply voltage
D5
A3, B1, B2, 4 1, 4 Digital ground reference C3,
C4
B7,
C5
2 38, 39 Digital supply voltage
15 13 Analog ground reference
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10 Copyright © 2006–2012, Texas Instruments Incorporated
MSP430F22x2 MSP430F22x4
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SLAS504G –JULY 2006–REVISED AUGUST 2012
Table 4. Terminal Functions, MSP430F22x4
TERMINAL
NAME
P1.0/TACLK/ADC10CLK F2 31 29 I/O Timer_A, clock signal TACLK input
P1.1/TA0 G2 32 30 I/O Timer_A, capture: CCI0A input, compare: OUT0 output
P1.2/TA1 E2 33 31 I/O
P1.3/TA2 G1 34 32 I/O
P1.4/SMCLK/TCK F1 35 33 I/O SMCLK signal output
P1.5/TA0/TMS E1 36 34 I/O Timer_A, compare: OUT0 output
P1.6/TA1/TDI/TCLK E3 37 35 I/O Timer_A, compare: OUT1 output
P1.7/TA2/TDO/TDI
P2.0/ACLK/A0/OA0I0 A4 8 6 I/O
P2.1/TAINCLK/SMCLK/ A1/OA0O
P2.2/TA0/A2/OA0I1 A5 10 8 I/O
P2.3/TA1/A3/ V OA1I1/OA1O
(1)
REF-/VeREF-
YFF DA RHA
/
NO. I/O DESCRIPTION
General-purpose digital I/O pin
ADC10, conversion clock General-purpose digital I/O pin
BSL transmit General-purpose digital I/O pin Timer_A, capture: CCI1A input, compare: OUT1 output General-purpose digital I/O pin Timer_A, capture: CCI2A input, compare: OUT2 output General-purpose digital I/O pin
Test Clock input for device programming and test General-purpose digital I/O pin
Test Mode Select input for device programming and test General-purpose digital I/O pin
Test Data Input or Test Clock Input for programming and test General-purpose digital I/O pin
D2 38 36 I/O Timer_A, compare: OUT2 output
Test Data Output or Test Data Input for programming and test General-purpose digital I/O pin ACLK output ADC10, analog input A0 OA0, analog input IO General-purpose digital I/O pin Timer_A, clock signal at INCLK
B4 9 7 I/O SMCLK signal output
ADC10, analog input A1 OA0, analog output General-purpose digital I/O pin Timer_A, capture: CCI0B input/BSL receive, compare: OUT0 output ADC10, analog input A2 OA0, analog input I1 General-purpose digital I/O pin Timer_A, capture CCI1B input, compare: OUT1 output
F3 29 27 I/O
ADC10, analog input A3 Negative reference voltage input OA1, analog input I1 OA1, analog output
(1) TDO or TDI is selected via JTAG instruction.
Copyright © 2006–2012, Texas Instruments Incorporated 11
MSP430F22x2 MSP430F22x4
SLAS504G –JULY 2006–REVISED AUGUST 2012
Table 4. Terminal Functions, MSP430F22x4 (continued)
TERMINAL
NAME
P2.4/TA2/A4/ V
REF+/VeREF+
P2.5/R
XIN/P2.6 A2 6 3 I/O
XOUT/P2.7 A1 5 2 I/O
P3.0/UCB0STE/UCA0CLK/ A5
P3.1/UCB0SIMO/ UCB0SDA
P3.2/UCB0SOMI/UCB0SCL A7 13 11 I/O USCI_B0 SPI mode: slave out/master in
P3.3/UCB0CLK/UCA0STE B6 14 12 I/O USCI_B0 clock input/output
P3.4/UCA0TXD/ UCA0SIMO
P3.5/UCA0RXD/ UCA0SOMI
P3.6/A6/OA0I2 F4 27 25 I/O ADC10 analog input A6
P3.7/A7/OA1I2 G4 28 26 I/O ADC10 analog input A7
P4.0/TB0 D6 17 15 I/O
P4.1/TB1 D7 18 16 I/O
P4.2/TB2 E6 19 17 I/O
/OA1I0
OSC
YFF DA RHA
NO. I/O DESCRIPTION
General-purpose digital I/O pin Timer_A, compare: OUT2 output
G3 30 28 I/O ADC10, analog input A4
Positive reference voltage output or input OA1, analog input I/O
C2 3 40 I/O
B5 11 9 I/O
A6 12 10 I/O USCI_B0 SPI mode: slave in/master out
G6 25 23 I/O USCI_A0 UART mode: transmit data output
G5 26 24 I/O USCI_A0 UART mode: receive data input
General-purpose digital I/O pin Input for external DCO resistor to define DCO frequency Input terminal of crystal oscillator General-purpose digital I/O pin Output terminal of crystal oscillator General-purpose digital I/O pin General-purpose digital I/O pin USCI_B0 slave transmit enable USCI_A0 clock input/output ADC10, analog input A5 General-purpose digital I/O pin
USCI_B0 I2C mode: SDA I2C data General-purpose digital I/O pin
USCI_B0 I2C mode: SCL I2C clock General-purpose digital I/O pin
USCI_A0 slave transmit enable General-purpose digital I/O pin
USCI_A0 SPI mode: slave in/master out General-purpose digital I/O pin
USCI_A0 SPI mode: slave out/master in General-purpose digital I/O pin
OA0 analog input I2 General-purpose digital I/O pin
OA1 analog input I2 General-purpose digital I/O pin Timer_B, capture: CCI0A input, compare: OUT0 output General-purpose digital I/O pin Timer_B, capture: CCI1A input, compare: OUT1 output General-purpose digital I/O pin Timer_B, capture: CCI2A input, compare: OUT2 output
(2)
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(2) If XOUT/P2.7 is used as an input, excess current flows until P2SEL.7 is cleared. This is due to the oscillator output driver connection to
this pad after reset.
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Table 4. Terminal Functions, MSP430F22x4 (continued)
TERMINAL
NAME
P4.3/TB0/A12/OA0O E7 20 18 I/O
P4.4/TB1/A13/OA1O F7 21 19 I/O
P4.5/TB2/A14/OA0I3 F6 22 20 I/O
P4.6/TBOUTH/A15/OA1I3 G7 23 21 I/O
P4.7/TBCLK F5 24 22 I/O
RST/NMI/SBWTDIO B3 7 5 I
TEST/SBWTCK D1 1 37 I
DV
CC
AV
CC
DV
SS
AV
SS
QFN Pad NA NA Pad NA QFN package pad; connection to DVSSrecommended.
YFF DA RHA
E4, E5
NO. I/O DESCRIPTION
General-purpose digital I/O pin Timer_B, capture: CCI0B input, compare: OUT0 output ADC10 analog input A12 OA0 analog output General-purpose digital I/O pin Timer_B, capture: CCI1B input, compare: OUT1 output ADC10 analog input A13 OA1 analog output General-purpose digital I/O pin Timer_B, compare: OUT2 output ADC10 analog input A14 OA0 analog input I3 General-purpose digital I/O pin Timer_B, switch all TB0 to TB3 outputs to high impedance ADC10 analog input A15 OA1 analog input I3 General-purpose digital I/O pin Timer_B, clock signal TBCLK input Reset or nonmaskable interrupt input Spy-Bi-Wire test data input/output during programming and test Selects test mode for JTAG pins on Port 1. The device protection fuse is
connected to TEST. Spy-Bi-Wire test clock input during programming and test
C1, D3, D4,
C6, C7, 16 14 Analog supply voltage
D5
A3, B1, B2, 4 1, 4 Digital ground reference C3,
C4
B7,
C5
2 38, 39 Digital supply voltage
15 13 Analog ground reference
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General-PurposeRegister
ProgramCounter
StackPointer
StatusRegister
ConstantGenerator
General-PurposeRegister
General-PurposeRegister
General-PurposeRegister
PC/R0
SP/R1
SR/CG1/R2
CG2/R3
R4
R5
R12
R13
General-PurposeRegister
General-PurposeRegister
R6
R7
General-PurposeRegister
General-PurposeRegister
R8
R9
General-PurposeRegister
General-PurposeRegister
R10
R11
General-PurposeRegister
General-PurposeRegister
R14
R15
MSP430F22x2 MSP430F22x4
SLAS504G –JULY 2006–REVISED AUGUST 2012
SHORT-FORM DESCRIPTION
CPU
The MSP430™ CPU has a 16-bit RISC architecture that is highly transparent to the application. All operations, other than program-flow instructions, are performed as register operations in conjunction with seven addressing modes for source operand and four addressing modes for destination operand.
The CPU is integrated with 16 registers that provide reduced instruction execution time. The register-to­register operation execution time is one cycle of the CPU clock.
Four of the registers, R0 to R3, are dedicated as program counter, stack pointer, status register, and constant generator respectively. The remaining registers are general-purpose registers.
Peripherals are connected to the CPU using data, address, and control buses and can be handled with all instructions.
Instruction Set
The instruction set consists of 51 instructions with three formats and seven address modes. Each instruction can operate on word and byte data.
Table 5 shows examples of the three types of
instruction formats; Table 6 shows the address modes.
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Dual operands, source-destination ADD R4,R5 R4 + R5 R5 Single operands, destination only CALL R8 PC (TOS), R8 PC Relative jump, unconditional/conditional JNE Jump-on-equal bit = 0
Register MOV Rs,Rd MOV R10,R11 R10 R11 Indexed MOV X(Rn),Y(Rm) MOV 2(R5),6(R6) M(2+R5) M(6+R6) Symbolic (PC relative) MOV EDE,TONI M(EDE) M(TONI) Absolute MOV &MEM,&TCDAT M(MEM) M(TCDAT) Indirect MOV @Rn,Y(Rm) MOV @R10,Tab(R6) M(R10) M(Tab+R6)
Indirect autoincrement MOV @Rn+,Rm MOV @R10+,R11 Immediate MOV #X,TONI MOV #45,TONI #45 M(TONI)
(1) S = source (2) D = destination
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INSTRUCTION FORMAT EXAMPLE OPERATION
ADDRESS MODE S
Table 5. Instruction Word Formats
Table 6. Address Mode Descriptions
(1)
(2)
D
SYNTAX EXAMPLE OPERATION
M(R10) R11
R10 + 2 R10
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Operating Modes
The MSP430 microcontrollers have one active mode and five software-selectable low-power modes of operation. An interrupt event can wake up the device from any of the five low-power modes, service the request, and restore back to the low-power mode on return from the interrupt program.
The following six operating modes can be configured by software:
Active mode (AM) – All clocks are active.
Low-power mode 0 (LPM0) – CPU is disabled. – ACLK and SMCLK remain active. MCLK is disabled.
Low-power mode 1 (LPM1) – CPU is disabled ACLK and SMCLK remain active. MCLK is disabled. – DCO dc-generator is disabled if DCO not used in active mode.
Low-power mode 2 (LPM2) – CPU is disabled. – MCLK and SMCLK are disabled. – DCO dc-generator remains enabled. – ACLK remains active.
Low-power mode 3 (LPM3) – CPU is disabled. – MCLK and SMCLK are disabled. – DCO dc-generator is disabled. – ACLK remains active.
Low-power mode 4 (LPM4) – CPU is disabled. – ACLK is disabled. – MCLK and SMCLK are disabled. – DCO dc-generator is disabled. – Crystal oscillator is stopped.
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Interrupt Vector Addresses
The interrupt vectors and the power-up starting address are located in the address range of 0FFFFh to 0FFC0h. The vector contains the 16-bit address of the appropriate interrupt handler instruction sequence.
If the reset vector (located at address 0FFFEh) contains 0FFFFh (for example, if flash is not programmed), the CPU goes into LPM4 immediately after power up.
Table 7. Interrupt Vector Addresses
INTERRUPT SOURCE INTERRUPT FLAG WORD ADDRESS PRIORITY
Power-up
External reset
Watchdog Reset 0FFFEh 31, highest Flash key violation PC out-of-range
(1)
PORIFG
RSTIFG
WDTIFG
(2)
KEYV
NMI NMIIFG (non)-maskable,
Oscillator fault OFIFG (non)-maskable, 0FFFCh 30
Flash memory access violation ACCVIFG
Timer_B3 TBCCR0 CCIFG Timer_B3 maskable 0FFF8h 28
TBCCR1 and TBCCR2 CCIFGs,
TBIFG
(2)(3)
(4)
(2)(4)
Watchdog Timer WDTIFG maskable 0FFF4h 26
Timer_A3 TACCR0 CCIFG (see Note 3) maskable 0FFF2h 25
TACCR1 CCIFG
Timer_A3 TACCR2 CCIFG maskable 0FFF0h 24
USCI_A0/USCI_B0 Receive UCA0RXIFG, UCB0RXIFG USCI_A0/USCI_B0 Transmit UCA0TXIFG, UCB0TXIFG
ADC10 ADC10IFG
I/O Port P2
(eight flags)
I/O Port P1
(eight flags)
(5) (6)
P2IFG.0 to P2IFG.7
P1IFG.0 to P1IFG.7
TAIFG
(2)(4)
(2)
(2)
(4)
(2)(4)
(2)(4)
(1) A reset is generated if the CPU tries to fetch instructions from within the module register memory address range (0h to 01FFh) or from
within unused address range. (2) Multiple source flags (3) (non)-maskable: the individual interrupt-enable bit can disable an interrupt event, but the general interrupt enable cannot.
Nonmaskable: neither the individual nor the general interrupt-enable bit will disable an interrupt event. (4) Interrupt flags are located in the module. (5) This location is used as bootstrap loader security key (BSLSKEY).
A 0AA55h at this location disables the BSL completely.
A zero (0h) disables the erasure of the flash if an invalid password is supplied. (6) The interrupt vectors at addresses 0FFDCh to 0FFC0h are not used in this device and can be used for regular program code if
necessary.
SYSTEM
INTERRUPT
(non)-maskable
maskable 0FFFAh 29
0FFF6h 27
maskable 0FFEEh 23 maskable 0FFECh 22 maskable 0FFEAh 21
0FFE8h 20
maskable 0FFE6h 19
maskable 0FFE4h 18
0FFE2h 17 0FFE0h 16
0FFDEh 15
0FFDCh to 0FFC0h 14 to 0, lowest
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Special Function Registers
Most interrupt and module enable bits are collected into the lowest address space. Special function register bits not allocated to a functional purpose are not physically present in the device. Simple software access is provided with this arrangement.
Legend
rw Bit can be read and written. rw-0, 1 Bit can be read and written. It is Reset or Set by PUC. rw-(0), (1) Bit can be read and written. It is Reset or Set by POR.
SFR bit is not present in device.
Table 8. Interrupt Enable 1
Address 7 6 5 4 3 2 1 0
00h ACCVIE NMIIE OFIE WDTIE
rw-0 rw-0 rw-0 rw-0
WDTIE Watchdog timer interrupt enable. Inactive if watchdog mode is selected. Active if watchdog timer is configured in interval
OFIE Oscillator fault interrupt enable NMIIE (Non)maskable interrupt enable ACCVIE Flash access violation interrupt enable
Address 7 6 5 4 3 2 1 0
01h UCB0TXIE UCB0RXIE UCA0TXIE UCA0RXIE
timer mode.
Table 9. Interrupt Enable 2
rw-0 rw-0 rw-0 rw-0
UCA0RXIE USCI_A0 receive-interrupt enable UCA0TXIE USCI_A0 transmit-interrupt enable UCB0RXIE USCI_B0 receive-interrupt enable UCB0TXIE USCI_B0 transmit-interrupt enable
Table 10. Interrupt Flag Register 1
Address 7 6 5 4 3 2 1 0
02h NMIIFG RSTIFG PORIFG OFIFG WDTIFG
rw-0 rw-(0) rw-(1) rw-1 rw-(0)
WDTIFG Set on watchdog timer overflow (in watchdog mode) or security key violation.
Reset on VCCpower-up or a reset condition at RST/NMI pin in reset mode. OFIFG Flag set on oscillator fault RSTIFG External reset interrupt flag. Set on a reset condition at RST/NMI pin in reset mode. Reset on VCCpower up. PORIFG Power-on reset interrupt flag. Set on VCCpower up. NMIIFG Set via RST/NMI pin
Table 11. Interrupt Flag Register 2
Address 7 6 5 4 3 2 1 0
03h UCB0TXIFG UCB0RXIFG UCA0TXIFG UCA0RXIFG
rw-1 rw-0 rw-1 rw-0
UCA0RXIFG USCI_A0 receive-interrupt flag UCA0TXIFG USCI_A0 transmit-interrupt flag UCB0RXIFG USCI_B0 receive-interrupt flag UCB0TXIFG USCI_B0 transmit-interrupt flag
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Memory Organization
Table 12. Memory Organization
MSP430F223x MSP430F225x MSP430F227x
Memory Size 8KB Flash 16KB Flash 32KB Flash Main: interrupt vector Flash 0FFFFh-0FFC0h 0FFFFh-0FFC0h 0FFFFh-0FFC0h Main: code memory Flash 0FFFFh-0E000h 0FFFFh-0C000h 0FFFFh-08000h
Information memory
Boot memory
RAM Size
Peripherals 8-bit 0FFh-010h 0FFh-010h 0FFh-010h
Size 256 Byte 256 Byte 256 Byte
Flash 010FFh-01000h 010FFh-01000h 010FFh-01000h
Size 1KB 1KB 1KB
ROM 0FFFh-0C00h 0FFFh-0C00h 0FFFh-0C00h
512 Byte 512 Byte 1KB
03FFh-0200h 03FFh-0200h 05FFh-0200h
16-bit 01FFh-0100h 01FFh-0100h 01FFh-0100h
8-bit SFR 0Fh-00h 0Fh-00h 0Fh-00h
Bootstrap Loader (BSL)
The MSP430 bootstrap loader (BSL) enables users to program the flash memory or RAM using a UART serial interface. Access to the MSP430 memory via the BSL is protected by user-defined password. For complete description of the features of the BSL and its implementation, see the MSP430 Programming Via the Bootstrap Loader User’s Guide (SLAU319).
Table 13. BSL Function Pins
BSL FUNCTION DA PACKAGE PINS RHA PACKAGE PINS YFF PACKAGE PINS
Data transmit 32 - P1.1 30 - P1.1 G3 - P1.1
Data receive 10 - P2.2 8 - P2.2 A5 - P2.2
Flash Memory
The flash memory can be programmed via the JTAG port, the bootstrap loader, or in-system by the CPU. The CPU can perform single-byte and single-word writes to the flash memory. Features of the flash memory include:
Flash memory has n segments of main memory and four segments of information memory (A to D) of 64 bytes each. Each segment in main memory is 512 bytes in size.
Segments 0 to n may be erased in one step, or each segment may be individually erased.
Segments A to D can be erased individually, or as a group with segments 0 to n. Segments A to D are also called information memory.
Segment A contains calibration data. After reset, segment A is protected against programming and erasing. It can be unlocked, but care should be taken not to erase this segment if the device-specific calibration data is required.
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Peripherals
Peripherals are connected to the CPU through data, address, and control buses and can be handled using all instructions. For complete module descriptions, see the MSP430x2xx Family User's Guide (SLAU144).
Oscillator and System Clock
The clock system is supported by the basic clock module that includes support for a 32768-Hz watch crystal oscillator, an internal very-low-power low-frequency oscillator, an internal digitally-controlled oscillator (DCO), and a high-frequency crystal oscillator. The basic clock module is designed to meet the requirements of both low system cost and low power consumption. The internal DCO provides a fast turn-on clock source and stabilizes in less than 1 µs. The basic clock module provides the following clock signals:
Auxiliary clock (ACLK), sourced from a 32768-Hz watch crystal, a high-frequency crystal, or the internal very­low-power LF oscillator.
Main clock (MCLK), the system clock used by the CPU.
Sub-Main clock (SMCLK), the sub-system clock used by the peripheral modules.
Table 14. DCO Calibration Data
(Provided From Factory in Flash Information Memory Segment A)
DCO FREQUENCY CALIBRATION REGISTER SIZE ADDRESS
1 MHz
8 MHz
12 MHz
16 MHz
CALBC1_1MHZ byte 010FFh
CALDCO_1MHZ byte 010FEh
CALBC1_8MHZ byte 010FDh
CALDCO_8MHZ byte 010FCh
CALBC1_12MHZ byte 010FBh
CALDCO_12MHZ byte 010FAh
CALBC1_16MHZ byte 010F9h
CALDCO_16MHZ byte 010F8h
Brownout
The brownout circuit is implemented to provide the proper internal reset signal to the device during power on and power off.
Digital I/O
There are four 8-bit I/O ports implemented—ports P1, P2, P3, and P4:
All individual I/O bits are independently programmable.
Any combination of input, output, and interrupt condition is possible.
Edge-selectable interrupt input capability for all eight bits of port P1 and P2.
Read/write access to port-control registers is supported by all instructions.
Each I/O has an individually programmable pullup/pulldown resistor.
Because there are only three I/O pins implemented from port P2, bits [5:1] of all port P2 registers read as 0, and write data is ignored.
Watchdog Timer (WDT+)
The primary function of the WDT+ module is to perform a controlled system restart after a software problem occurs. If the selected time interval expires, a system reset is generated. If the watchdog function is not needed in an application, the module can be disabled or configured as an interval timer and can generate interrupts at selected time intervals.
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Timer_A3
Timer_A3 is a 16-bit timer/counter with three capture/compare registers. Timer_A3 can support multiple capture/compares, PWM outputs, and interval timing. Timer_A3 also has extensive interrupt capabilities. Interrupts may be generated from the counter on overflow conditions and from each of the capture/compare registers.
Table 15. Timer_A3 Signal Connections
INPUT PIN NUMBER DEVICE MODULE MODULE OUTPUT PIN NUMBER
DA RHA YFF DA RHA YFF
31 - P1.0 29 - P1.0 F2 - P1.0 TACLK TACLK Timer NA
9 - P2.1 7 - P2.1 B4 - P2.1 TAINCLK INCLK 32 - P1.1 30 - P1.1 G2 - P1.1 TA0 CCI0A CCR0 TA0 32 - P1.1 30 - P1.1 G2 - P1.1 10 - P2.2 8 - P2.2 A5 - P2.2 TA0 CCI0B 10 - P2.2 8 - P2.2 A5 - P2.2
33 - P1.2 31 - P1.2 E2 - P1.2 TA1 CCI1A CCR1 TA1 33 - P1.2 31 - P1.2 E2 - P1.2 29 - P2.3 27 - P2.3 F3 - P2.3 TA1 CCI1B 29 - P2.3 27 - P2.3 F3 - P2.3
34 - P1.3 32 - P1.3 G1 - P1.3 TA2 CCI2A CCR2 TA2 34 - P1.3 32 - P1.3 G1 - P1.3
INPUT INPUT OUTPUT
SIGNAL NAME SIGNAL
ACLK ACLK
SMCLK SMCLK
V
SS
V
CC
V
SS
V
CC
ACLK
(internal)
V
SS
V
CC
GND 36 - P1.5 34 - P1.5 E1 - P1.5
V
CC
GND 37 - P1.6 35 - P1.6 E3 - P1.6
V
CC
CCI2B 30 - P2.4 28 - P2.4 G3 - P2.4
GND 38 - P1.7 36 - P1.7 D2 - P1.7
V
CC
MODULE
BLOCK
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Timer_B3
Timer_B3 is a 16-bit timer/counter with three capture/compare registers. Timer_B3 can support multiple capture/compares, PWM outputs, and interval timing. Timer_B3 also has extensive interrupt capabilities. Interrupts may be generated from the counter on overflow conditions and from each of the capture/compare registers.
Table 16. Timer_B3 Signal Connections
INPUT PIN NUMBER DEVICE MODULE MODULE OUTPUT PIN NUMBER
DA RHA YFF DA RHA YFF
24 - P4.7 22 - P4.7 F5 - P4.7 TBCLK TBCLK Timer NA
24 - P4.7 22 - P4.7 F5 - P4.7 TBCLK INCLK 17 - P4.0 15 - P4.0 D6 - P4.0 TB0 CCI0A CCR0 TB0 17 - P4.0 15 - P4.0 D6 - P4.0 20 - P4.3 18 - P4.3 E7 - P4.3 TB0 CCI0B 20 - P4.3 18 - P4.3 E7 - P4.3
18 - P4.1 16 - P4.1 D7 - P4.1 TB1 CCI1A CCR1 TB1 18 - P4.1 16 - P4.1 D7 - P4.1 21 - P4.4 19 - P4.4 F7 - P4.4 TB1 CCI1B 21 - P4.4 19 - P4.4 F7 - P4.4
19 - P4.2 17 - P4.2 E6 - P4.2 TB2 CCI2A CCR2 TB2 19 - P4.2 17 - P4.2 E6 - P4.2
INPUT INPUT OUTPUT
SIGNAL NAME SIGNAL
ACLK ACLK
SMCLK SMCLK
V
SS
V
CC
V
SS
V
CC
ACLK
(internal)
V
SS
V
CC
GND
V
CC
GND
V
CC
CCI2B 22 - P4.5 20 - P4.5 F6 - P4.5
GND
V
CC
MODULE
BLOCK
Universal Serial Communications Interface (USCI)
The USCI module is used for serial data communication. The USCI module supports synchronous communication protocols like SPI (3 or 4 pin), I2C and asynchronous communication protocols such as UART, enhanced UART with automatic baudrate detection (LIN), and IrDA.
USCI_A0 provides support for SPI (3 or 4 pin), UART, enhanced UART, and IrDA. USCI_B0 provides support for SPI (3 or 4 pin) and I2C.
ADC10
The ADC10 module supports fast, 10-bit analog-to-digital conversions. The module implements a 10-bit SAR core, sample select control, reference generator and data transfer controller, or DTC, for automatic conversion result handling allowing ADC samples to be converted and stored without any CPU intervention.
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Operational Amplifier (OA) (MSP430F22x4 only)
The MSP430F22x4 has two configurable low-current general-purpose operational amplifiers. Each OA input and output terminal is software-selectable and offer a flexible choice of connections for various applications. The OA op amps primarily support front-end analog signal conditioning prior to analog-to-digital conversion.
Table 17. OA0 Signal Connections
ANALOG INPUT PIN NUMBER
DA RHA YFF
8 - A0 6 - A0 B4 - A0 OA0I0 OAxI0 10 - A2 8 - A2 B5 - A2 OA0I1 OA0I1 10 - A2 8 - A2 B5 - A2 OA0I1 OAxI1 27 - A6 25 - A6 F4 - A6 OA0I2 OAxIA
22 - A14 20 - A14 F6 - A14 OA0I3 OAxIB
Table 18. OA1 Signal Connections
ANALOG INPUT PIN NUMBER
DA RHA YFF
30 - A4 28 - A4 G3 - A4 OA1I0 OAxI0 10 - A2 8 - A2 B5 - A2 OA0I1 OA0I1 29 - A3 27 - A3 F3 - A3 OA1I1 OAxI1 28 - A7 26 - A7 G4 - A7 OA1I2 OAxIA
23 - A15 21 - A15 G7 - A15 OA1I3 OAxIB
DEVICE INPUT SIGNAL MODULE INPUT NAME
DEVICE INPUT SIGNAL MODULE INPUT NAME
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Peripheral File Map
Table 19. Peripherals With Word Access
MODULE REGISTER NAME SHORT NAME ADDRESS
ADC10 ADC data transfer start address ADC10SA 1BCh
ADC memory ADC10MEM 1B4h ADC control register 1 ADC10CTL1 1B2h ADC control register 0 ADC10CTL0 1B0h ADC analog enable 0 ADC10AE0 04Ah ADC analog enable 1 ADC10AE1 04Bh ADC data transfer control register 1 ADC10DTC1 049h ADC data transfer control register 0 ADC10DTC0 048h
Timer_B Capture/compare register TBCCR2 0196h
Capture/compare register TBCCR1 0194h Capture/compare register TBCCR0 0192h Timer_B register TBR 0190h Capture/compare control TBCCTL2 0186h Capture/compare control TBCCTL1 0184h Capture/compare control TBCCTL0 0182h Timer_B control TBCTL 0180h Timer_B interrupt vector TBIV 011Eh
Timer_A Capture/compare register TACCR2 0176h
Capture/compare register TACCR1 0174h Capture/compare register TACCR0 0172h Timer_A register TAR 0170h Capture/compare control TACCTL2 0166h Capture/compare control TACCTL1 0164h Capture/compare control TACCTL0 0162h Timer_A control TACTL 0160h Timer_A interrupt vector TAIV 012Eh
Flash Memory Flash control 3 FCTL3 012Ch
Flash control 2 FCTL2 012Ah Flash control 1 FCTL1 0128h
Watchdog Timer+ Watchdog/timer control WDTCTL 0120h
OFFSET
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Table 20. Peripherals With Byte Access
MODULE REGISTER NAME SHORT NAME ADDRESS
OA1 (MSP430F22x4 only) Operational Amplifier 1 control register 1 OA1CTL1 0C3h
Operational Amplifier 1 control register 1 OA1CTL0 0C2h
OA0 (MSP430F22x4 only) Operational Amplifier 0 control register 1 OA0CTL1 0C1h
Operational Amplifier 0 control register 1 OA0CTL0 0C0h
USCI_B0 USCI_B0 transmit buffer UCB0TXBUF 06Fh
USCI_B0 receive buffer UCB0RXBUF 06Eh USCI_B0 status UCB0STAT 06Dh USCI_B0 bit rate control 1 UCB0BR1 06Bh USCI_B0 bit rate control 0 UCB0BR0 06Ah USCI_B0 control 1 UCB0CTL1 069h USCI_B0 control 0 UCB0CTL0 068h USCI_B0 I2C slave address UCB0SA 011Ah USCI_B0 I2C own address UCB0OA 0118h
USCI_A0 USCI_A0 transmit buffer UCA0TXBUF 067h
USCI_A0 receive buffer UCA0RXBUF 066h USCI_A0 status UCA0STAT 065h USCI_A0 modulation control UCA0MCTL 064h USCI_A0 baud rate control 1 UCA0BR1 063h USCI_A0 baud rate control 0 UCA0BR0 062h USCI_A0 control 1 UCA0CTL1 061h USCI_A0 control 0 UCA0CTL0 060h USCI_A0 IrDA receive control UCA0IRRCTL 05Fh USCI_A0 IrDA transmit control UCA0IRTCTL 05Eh USCI_A0 auto baud rate control UCA0ABCTL 05Dh
Basic Clock System+ Basic clock system control 3 BCSCTL3 053h
Basic clock system control 2 BCSCTL2 058h Basic clock system control 1 BCSCTL1 057h DCO clock frequency control DCOCTL 056h
Port P4 Port P4 resistor enable P4REN 011h
Port P4 selection P4SEL 01Fh Port P4 direction P4DIR 01Eh Port P4 output P4OUT 01Dh Port P4 input P4IN 01Ch
Port P3 Port P3 resistor enable P3REN 010h
Port P3 selection P3SEL 01Bh Port P3 direction P3DIR 01Ah Port P3 output P3OUT 019h Port P3 input P3IN 018h
Port P2 Port P2 resistor enable P2REN 02Fh
Port P2 selection P2SEL 02Eh Port P2 interrupt enable P2IE 02Dh Port P2 interrupt edge select P2IES 02Ch Port P2 interrupt flag P2IFG 02Bh Port P2 direction P2DIR 02Ah Port P2 output P2OUT 029h Port P2 input P2IN 028h
OFFSET
24 Copyright © 2006–2012, Texas Instruments Incorporated
MSP430F22x2 MSP430F22x4
www.ti.com
SLAS504G –JULY 2006–REVISED AUGUST 2012
Table 20. Peripherals With Byte Access (continued)
MODULE REGISTER NAME SHORT NAME ADDRESS
Port P1 Port P1 resistor enable P1REN 027h
Port P1 selection P1SEL 026h Port P1 interrupt enable P1IE 025h Port P1 interrupt edge select P1IES 024h Port P1 interrupt flag P1IFG 023h Port P1 direction P1DIR 022h Port P1 output P1OUT 021h Port P1 input P1IN 020h
Special Function SFR interrupt flag 2 IFG2 003h
SFR interrupt flag 1 IFG1 002h SFR interrupt enable 2 IE2 001h SFR interrupt enable 1 IE1 000h
OFFSET
Copyright © 2006–2012, Texas Instruments Incorporated 25
4.15 MHz
12 MHz
16 MHz
1.8 V 2.2 V 2.7 V 3.3 V 3.6 V
Supply Voltage −V
System Frequency −MHz
Supply voltage range, during flash memory programming
Supply voltage range, during program execution
Legend:
7.5 MHz
MSP430F22x2 MSP430F22x4
SLAS504G –JULY 2006–REVISED AUGUST 2012
Absolute Maximum Ratings
Voltage applied at VCCto V Voltage applied to any pin
SS
(2)
(1)
-0.3 V to 4.1 V
-0.3 V to VCC+ 0.3 V
www.ti.com
Diode current at any device terminal ±2 mA
Storage temperature, T
stg
(3)
Unprogrammed device -55°C to 150°C Programmed device -55°C to 150°C
(1) Stresses beyond those listed under absolute maximum ratingsmay cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditionsis not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages referenced to VSS. The JTAG fuse-blow voltage, VFB, is allowed to exceed the absolute maximum rating. The voltage is
applied to the TEST pin when blowing the JTAG fuse.
(3) Higher temperature may be applied during board soldering process according to the current JEDEC J-STD-020 specification with peak
reflow temperatures not higher than classified on the device label on the shipping boxes or reels.
Recommended Operating Conditions
(1)(2)
MIN NOM MAX UNIT
V
CC
V
SS
T
A
f
SYSTEM
During program
Supply voltage AVCC= DVCC= V
CC
execution During program/erase
flash memory
Supply voltage AVSS= DVSS= V
Operating free-air temperature °C
Processor frequency (maximum MCLK frequency) (see Figure 1)
VCC= 1.8 V, Duty cycle = 50% ±10% dc 4.15
(1)(2)
VCC= 2.7 V, Duty cycle = 50% ±10% dc 12 MHz VCC≥ 3.3 V, Duty cycle = 50% ±10% dc 16
SS
I version -40 85 T version -40 105
1.8 3.6 V
2.2 3.6 V 0 V
(1) The MSP430 CPU is clocked directly with MCLK. Both the high and low phase of MCLK must not exceed the pulse width of the
specified maximum frequency.
(2) Modules might have a different maximum input clock specification. See the specification of the respective module in this data sheet.
NOTE: Minimum processor frequency is defined by system clock. Flash program or erase operations require a minimum V
of 2.2 V.
26 Copyright © 2006–2012, Texas Instruments Incorporated
Figure 1. Operating Area
CC
MSP430F22x2 MSP430F22x4
www.ti.com
Active Mode Supply Current (into DVCC+ AVCC) Excluding External Current
SLAS504G –JULY 2006–REVISED AUGUST 2012
(1)(2)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
I
AM,1MHz
I
AM,1MHz
I
AM,4kHz
I
AM,100kHz
PARAMETER TEST CONDITIONS T
f
= f
Active mode (AM) current (1 MHz)
DCO
f
ACLK
Program executes in flash,
= f
MCLK
= 32768 Hz,
BCSCTL1 = CALBC1_1MHZ, µA DCOCTL = CALDCO_1MHZ,
= 1 MHz, 2.2 V 270 390
SMCLK
CPUOFF = 0, SCG0 = 0, SCG1 = 0, OSCOFF = 0
f
= f
Active mode (AM) current (1 MHz)
DCO
f
ACLK
Program executes in RAM,
= f
MCLK
= 32768 Hz,
BCSCTL1 = CALBC1_1MHZ, µA DCOCTL = CALDCO_1MHZ,
= 1 MHz, 2.2 V 240
SMCLK
CPUOFF = 0, SCG0 = 0, SCG1 = 0, OSCOFF = 0
f
= f
MCLK
4096 Hz, 85°C f
= 0 Hz,
Active mode (AM) Program executes in flash,
DCO
current (4 kHz) SELMx = 11, SELS = 1,
DIVMx = DIVSx = DIVAx = 11, CPUOFF = 0, SCG0 = 1, SCG1 = 0, OSCOFF = 0
SMCLK
= f
= 32768 Hz/8 = -40°C to
ACLK
105°C 18
-40°C to 85°C
105°C 20
-40°C to 85°C
105°C 95
-40°C to 85°C
Active mode (AM) current (100 kHz)
f
= f
MCLK
f
= 0 Hz,
ACLK
Program executes in flash, µA
SMCLK
= f
DCO(0, 0)
100 kHz,
RSELx = 0, DCOx = 0, CPUOFF = 0, SCG0 = 0, SCG1 = 0, OSCOFF = 1
105°C 105
A
V
CC
MIN TYP MAX UNIT
3 V 390 550
3.3 V 340
2.2 V
3 V
2.2 V
3 V
5 9
µA
6 10
60 85
72 95
(1) All inputs are tied to 0 V or VCC. Outputs do not source or sink any current. (2) The currents are characterized with a Micro Crystal CC4V-T1A SMD crystal with a load capacitance of 9 pF. The internal and external
load capacitance is chosen to closely match the required 9 pF.
Copyright © 2006–2012, Texas Instruments Incorporated 27
0.0
1.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
1.5 2.0 2.5 3.0 3.5 4.0
VCC− Supply Voltage − V
Active Mode Current − mA
f
DCO
= 1 MHz
f
DCO
= 8 MHz
f
DCO
= 12 MHz
f
DCO
= 16 MHz
0.0
1.0
2.0
3.0
4.0
5.0
0.0 4.0 8.0 12.0 16.0
f
DCO
− DCO Frequency − MHz
Active Mode Current − mA
TA= 25 °C
TA= 85 °C
VCC= 2.2 V
VCC= 3 V
TA= 25 °C
TA= 85 °C
MSP430F22x2 MSP430F22x4
SLAS504G –JULY 2006–REVISED AUGUST 2012
Typical Characteristics - Active-Mode Supply Current (Into DVCC+ AVCC)
ACTIVE-MODE CURRENT
vs ACTIVE-MODE CURRENT
SUPPLY VOLTAGE vs
TA= 25°C DCO FREQUENCY
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Figure 2. Figure 3.
28 Copyright © 2006–2012, Texas Instruments Incorporated
MSP430F22x2 MSP430F22x4
www.ti.com
Low-Power-Mode Supply Currents (Into VCC) Excluding External Current
SLAS504G –JULY 2006–REVISED AUGUST 2012
(1)(2)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
I
LPM0,1MHz
PARAMETER TEST CONDITIONS T
f
= 0 MHz, 2.2 V 75 90
MCLK
f
= f
= 1 MHz,
DCO
= 32768 Hz,
Low-power mode 0 (LPM0) current
(3)
SMCLK
f
ACLK
BCSCTL1 = CALBC1_1MHZ, µA DCOCTL = CALDCO_1MHZ,
A
CPUOFF = 1, SCG0 = 0, SCG1 = 0, OSCOFF = 0
f
= 0 MHz, 2.2 V 37 48
MCLK
f
I
LPM0,100kHz
Low-power mode 0 f (LPM0) current
(3)
= f
SMCLK
= 0 Hz,
ACLK
RSELx = 0, DCOx = 0,
DCO(0, 0)
100 kHz,
CPUOFF = 1, SCG0 = 0, SCG1 = 0, OSCOFF = 1
-40°C to 85°C
105°C 31
-40°C to 85°C
105°C 34
I
LPM2
Low-power mode 2 (LPM2) current
(4)
f
= f
MCLK
f
= 1 MHz,
DCO
f
= 32768 Hz,
ACLK
BCSCTL1 = CALBC1_1MHZ, µA
SMCLK
= 0 MHz,
DCOCTL = CALDCO_1MHZ, CPUOFF = 1, SCG0 = 0, SCG1 = 1, OSCOFF = 0
-40°C 0.7 1.4 25°C 0.7 1.4 85°C 2.4 3.3
105°C 5 10
-40°C 0.9 1.5 25°C 0.9 1.5
I
LPM3,LFXT1
Low-power mode 3 f (LPM3) current
(4)
f
= f
DCO ACLK
CPUOFF = 1, SCG0 = 1,
= f
MCLK
= 32768 Hz,
SMCLK
= 0 MHz,
SCG1 = 1, OSCOFF = 0
85°C 2.6 3.8
105°C 6 12
-40°C 0.4 1 25°C 0.5 1 85°C 1.8 2.9
105°C 4.5 9
-40°C 0.5 1.2 25°C 0.6 1.2
I
LPM3,VLO
Low-power mode 3 current, (LPM3)
(4)
f
= f
DCO
f
ACLK
(VLO), µA
= f
MCLK
from internal LF oscillator
SMCLK
= 0 MHz,
CPUOFF = 1, SCG0 = 1, SCG1 = 1, OSCOFF = 0
85°C 2.1 3.3
105°C 5.5 11
-40°C 0.1 0.5 25°C 0.1 0.5 85°C 1.5 3
105°C 4.5 9
I
LPM4
Low-power mode 4 f (LPM4) current
(5)
f
= f
DCO ACLK
CPUOFF = 1, SCG0 = 1, 3 V
= f
MCLK
= 0 Hz, 2.2 V/
SMCLK
= 0 MHz,
SCG1 = 1, OSCOFF = 1
(1) All inputs are tied to 0 V or VCC. Outputs do not source or sink any current. (2) The currents are characterized with a Micro Crystal CC4V-T1A SMD crystal with a load capacitance of 9 pF. The internal and external
load capacitance is chosen to closely match the required 9 pF. (3) Current for brownout and WDT clocked by SMCLK included. (4) Current for brownout and WDT clocked by ACLK included. (5) Current for brownout included.
V
MIN TYP MAX UNIT
CC
3 V 90 120
3 V 41 65
2.2 V
3 V
22 29
25 32
2.2 V
3 V
2.2 V
3 V
µA
µA
µA
Copyright © 2006–2012, Texas Instruments Incorporated 29
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