TEXAS INSTRUMENTS LMV321, LMV358, LMV324, LMV324S Operation Manual

1

2

3

4

5

6

7

14

13

12

11

10

9

8

1OUT

1IN– 1IN+

V

CC+

2IN+ 2IN–

2OUT

4OUT 4IN– 4IN+ GND 3IN+ 3IN– 3OUT

LMV324 . . . D (SOIC) OR PW (TSSOP) PACKAGE

(TOP VIEW)

LMV358 . . . D (SOIC), DDU (VSSOP),

DGK (MSOP), OR PW (TSSOP) PACKAGE

(TOP VIEW)

1

2

3

4

8

7

6

5

1OUT

1IN– 1IN+ GND

V

CC+

2OUT 2IN– 2IN+

LMV321 . . . DBV (SOT-23) OR DCK (SC-70) PACKAGE

(TOP VIEW)

V

CC+

OUT

1

2

3

5

4

1IN+

GND

1IN–

1OUT

1IN– 1IN+

V

CC

2IN+ 2IN–

2OUT

1/2 SHDN

4OUT 4IN– 4IN+ GND 3IN+ 3IN– 3OUT 3/4 SHDN

1

2

3

4

5

6

7

8

16

15

14

13

12

11

10

9

LMV324S . . . D (SOIC) OR PW (TSSOP) PACKAGE

(TOP VIEW)

www.ti.com

1

FEATURES

LOW-VOLTAGE RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS

• 2.7-V and 5-V Performance

• – 40 ° C to 125 ° C Operation

• Low-Power Shutdown Mode (LMV324S)

• No Crossover Distortion

• Low Supply Current

– LMV321 . . . 130 μ A Typ – LMV358 . . . 210 μ A Typ – LMV324 . . . 410 μ A Typ – LMV324S . . . 410 μ A Typ

• Rail-to-Rail Output Swing

• ESD Protection Exceeds JESD 22

– 2000-V Human-Body Model (A114-A) – 1000-V Charged-Device Model (C101)

DESCRIPTION/ ORDERING INFORMATION

The LMV321, LMV358, and LMV324/LMV324S are single, dual, and quad low-voltage (2.7 V to 5.5 V) operational amplifiers with rail-to-rail output swing. The LMV324S, which is a variation of the standard LMV324, includes a power-saving shutdown feature that reduces supply current to a maximum of 5 μ A per channel when the amplifiers are not needed. Channels 1 and 2 together are put in shutdown, as are channels 3 and 4. While in shutdown, the outputs actively are pulled low.

The LMV321, LMV358, LMV324, and LMV324S are the most cost-effective solutions for applications where low-voltage operation, space saving, and low cost are needed. These amplifiers are designed specifically for low-voltage (2.7 V to 5 V) operation, with performance specifications meeting or exceeding the LM358 and LM324 devices that operate from 5 V to 30 V. Additional features of the LMV3xx devices are a common-mode input voltage range that includes ground, 1-MHz unity-gain bandwidth, and 1-V/ μ s slew rate.

The LMV321 is available in the ultra-small DCK (SC-70) package, which is approximately one-half the size of the DBV (SOT-23) package. This package saves space on printed circuit boards and enables the design of small portable electronic devices. It also allows the designer to place the device closer to the signal source to reduce noise pickup and increase signal integrity.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

1

PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.

LMV321 SINGLE, LMV358 DUAL

LMV324 QUAD, LMV324S QUAD WITH SHUTDOWN

SLOS263T – AUGUST 1999 – REVISED SEPTEMBER 2007

www.ti.com

LMV321 SINGLE, LMV358 DUAL LMV324 QUAD, LMV324S QUAD WITH SHUTDOWN LOW-VOLTAGE RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS

SLOS263T – AUGUST 1999 – REVISED SEPTEMBER 2007

ORDERING INFORMATION

T

A

SC-70 – DCK R3_

Single

SOT-23 – DBV RC1_

MSOP/VSSOP – DGK

Dual Reel of 2500 LMV358IDR

– 40 ° C to 85 ° C Tube of 150 LMV358IPW

Quad LMV324SI

Dual Reel of 2500 LMV358QDR

– 40 ° C to 125 ° C Reel of 2000 LMV358QPWR

Quad

(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

web site at www.ti.com . (2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging . (3) DBV/DCK/DDU/DGK: The actual top-side marking has one additional character that designates the wafer fab/assembly site.

SOIC – D MV358I

TSSOP – PW MV358I

VSSOP – DDU Reel of 3000 LMV358IDDUR RA5_

SOIC – D

TSSOP – PW

MSOP/VSSOP – DGK RH_

SOIC – D MV358Q

TSSOP – PW MV358Q

VSSOP – DDU Reel of 3000 LMV358QDDUR RAH_

SOIC – D LMV324Q

TSSOP – PW MV324Q

PACKAGE

(2)

Reel of 3000 LMV321IDCKR Reel of 250 LMV321IDCKT Reel of 3000 LMV321IDBVR Reel of 250 LMV321IDBVT Reel of 2500 LMV358IDGKR R5_ Reel of 250 LMV358IDGKT PREVIEW Tube of 75 LMV358ID

Reel of 2000 LMV358IPWR

Tube of 50 LMV324ID Reel of 2500 LMV324IDR Tube of 50 LMV324SID Reel of 2500 LMV324SIDR Reel of 2000 LMV324IPWR MV324I Reel of 2000 LMV324SIPWR MV324SI Reel of 2500 LMV358QDGKR Reel of 250 LMV358QDGKT Tube of 75 LMV358QD

Tube of 150 LMV358QPW

Tube of 50 LMV324QD Reel of 2500 LMV324QDR Tube of 90 LMV324QPW Reel of 2000 LMV324QPWR

(1)

ORDERABLE PART NUMBER

TOP-SIDE

MARKING

LMV324I

(3)

www.ti.com

+

–

IN–

IN+

OUT

V

BIAS4

–

+

–

+

IN+

IN-

V

BIAS1

V

BIAS2

V

BIAS3

–

+

–

+

Output

V

CC

V

CC

V

CC

V

CC

LMV321 SINGLE, LMV358 DUAL

LMV324 QUAD, LMV324S QUAD WITH SHUTDOWN

LOW-VOLTAGE RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS

SLOS263T – AUGUST 1999 – REVISED SEPTEMBER 2007

SYMBOL (EACH AMPLIFIER)

LMV324 SIMPLIFIED SCHEMATIC

www.ti.com

LMV321 SINGLE, LMV358 DUAL LMV324 QUAD, LMV324S QUAD WITH SHUTDOWN LOW-VOLTAGE RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS

SLOS263T – AUGUST 1999 – REVISED SEPTEMBER 2007

Absolute Maximum Ratings

(1)

over operating free-air temperature range (unless otherwise noted)

MIN MAX UNIT

V

CC

V

ID

V

I

Supply voltage Differential input voltage Input voltage range (either input) – 0.2 5.5 V

Duration of output short circuit (one amplifier) to ground

θ

JA

T

J

T

stg

Package thermal impedance

Operating virtual junction temperature 150 ° C Storage temperature range – 65 150 ° C

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltage values (except differential voltages and V (3) Differential voltages are at IN+ with respect to IN – . (4) Short circuits from outputs to V (5) Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient

temperature is PD= (TJ(max) – TA)/ θJA. Operating at the absolute maximum TJof 150 ° C can affect reliability. (6) The package thermal impedance is calculated in accordance with JESD 51-7.

(2)

(3)

At or below TA= 25 ° C,

(4)

V

≤ 5.5 V

CC

Unlimited

8 pin 97

D package 14 pin 86

16 pin 73

DBV package 5 pin 206

(5) (6)

DCK package 5 pin 252 DDU package 8 pin TBD DGK package 8 pin 172

8 pin 149

PW package 14 pin 113

16 pin 108

specified for the measurement of IOS) are with respect to the network GND.

CC

can cause excessive heating and eventual destruction.

CC

5.5 V

± 5.5 V

° C/W

Recommended Operating Conditions

V

CC

V

IH

V

IL

T

A

(1) All unused control inputs of the device must be held at V

Supply voltage (single-supply operation) 2.7 5.5 V

Amplifier turn-on voltage level (LMV324S)

Amplifier turn-off voltage level (LMV324S) V

Operating free-air temperature ° C

Implications of Slow or Floating CMOS Inputs, literature number SCBA004 .

(1)

(2)

or GND to ensure proper device operation. See the TI application report,

CC

(2) VIHshould not be allowed to exceed VCC.

MIN MAX UNIT

V

= 2.7 V 1.7

CC

V

= 5 V 3.5

CC

V

= 2.7 V 0.7

CC

V

= 5 V 1.5

CC

I temperature – 40 85 Q temperature – 40 125

V

www.ti.com

LMV321 SINGLE, LMV358 DUAL

LMV324 QUAD, LMV324S QUAD WITH SHUTDOWN

LOW-VOLTAGE RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS

SLOS263T – AUGUST 1999 – REVISED SEPTEMBER 2007

Electrical Characteristics

V

= 2.7 V, TA= 25 ° C (unless otherwise noted)

CC+

PARAMETER TEST CONDITIONS MIN TYP

V

α

VIO

I

IB

I

IO

CMRR Common-mode rejection ratio V k

SVR

V

Input offset voltage 1.7 7 mV

IO

Average temperature coefficient of input offset voltage

Input bias current 11 250 nA Input offset current 5 50 nA

= 0 to 1.7 V 50 63 dB

CM

Supply-voltage rejection ratio V Common-mode input voltage

ICR

range

Output swing RL= 10 k Ω to 1.35 V mV

O

= 2.7 V to 5 V, VO= 1 V 50 60 dB

CC

– 100 V

CC

0 – 0.2

CMRR ≥ 50 dB V

High level V Low level 60 180

LMV321I 80 170

I

CC

Supply current LMV358I (both amplifiers) 140 340 μ A

LMV324I/LMV324SI (all four amplifiers) 260 680

B

Φ

G V I

n

Unity-gain bandwidth CL= 200 pF 1 MHz

1

Phase margin 60 deg

m

Gain margin 10 dB

m

Equivalent input noise voltage f = 1 kHz 46 nV/ √ Hz

n

Equivalent input noise current f = 1 kHz 0.17 pA/ √ Hz

(1) Typical values represent the likely parametric nominal values determined at the time of characterization. Typical values depend on the

application and configuration and may vary over time. Typical values are not ensured on production material.

(1)

5 μ V/ ° C

1.9 1.7

– 10

CC

MAX UNIT

Shutdown Characteristics (LMV324S)

V

= 2.7 V, TA= 25 ° C (unless otherwise noted)

CC+

PARAMETER TEST CONDITIONS MIN TYP

I

CC(SHDN)

t

(on)

t

(off)

Supply current in shutdown mode (per channel)

SHDN ≤ 0.6 V 5 μ A

Amplifier turn-on time AV= 1, RL= Open (measured at 50% point) 2 μ s Amplifier turn-off time AV= 1, RL= Open (measured at 50% point) 40 ns

(1) Typical values represent the likely parametric nominal values determined at the time of characterization. Typical values depend on the

application and configuration and may vary over time. Typical values are not ensured on production material.

(1)

MAX UNIT

www.ti.com

LMV321 SINGLE, LMV358 DUAL LMV324 QUAD, LMV324S QUAD WITH SHUTDOWN LOW-VOLTAGE RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS

SLOS263T – AUGUST 1999 – REVISED SEPTEMBER 2007

Electrical Characteristics

V

= 5 V, at specified free-air temperature (unless otherwise noted)

CC+

PARAMETER TEST CONDITIONS T

V

IO

Input offset voltage mV

(1)

A

MIN TYP

25 ° C 1.7 7

Full range 9

Average temperature

α

VIO

I

IB

I

IO

CMRR V

k

SVR

V

ICR

V

O

A

VD

I

OS

I

CC

B

1

Φ

m

G

m

V

n

I

n

coefficient of input offset 25 ° C 5 μ V/ ° C voltage

Input bias current nA

Input offset current nA

Common-mode rejection ratio

Supply-voltage V rejection ratio V

Common-mode input voltage range

= 0 to 4 V 25 ° C 50 65 dB

CM

= 2.7 V to 5 V, VO= 1 V,

CC

= 1 V

CM

CMRR ≥ 50 dB 25 ° C V

High level

RL= 2 k Ω to 2.5 V

Low level

Output swing mV

High level

RL= 10 k Ω to 2.5 V

Low level

Large-signal differential voltage gain

Output short-circuit current

RL= 2 k Ω V/mV

Sourcing, VO= 0 V 5 60 Sinking, VO= 5 V 10 160

LMV321I

Supply current LMV358I (both amplifiers) μ A

LMV324I/LMV324SI (all four amplifiers)

25 ° C 15 250

Full range 500

25 ° C 5 50

Full range 150

25 ° C 50 60 dB

0 – 0.2

25 ° C V

Full range V

– 300 V

CC

– 400

CC

25 ° C 120 300

Full range 400

25 ° C V

Full range V

– 100 V

CC

– 200

CC

25 ° C 65 180

Full range 280

25 ° C 15 100

Full range 10

25 ° C mA

25 ° C 130 250

Full range 350

25 ° C 210 440

Full range 615

25 ° C 410 830

Full range 1160 Unity-gain bandwidth CL= 200 pF 25 ° C 1 MHz Phase margin 25 ° C 60 deg Gain margin 25 ° C 10 dB Equivalent input

noise voltage Equivalent input

noise current

f = 1 kHz 25 ° C 39 nV/ √ Hz

f = 1 kHz 25 ° C 0.21 pA/ √ Hz

SR Slew rate 25 ° C 1 V/ μ s

(1) Full range TA= – 40 ° C to 85 ° C for I temperature and – 40 ° C to 125 ° C for Q temperature. (2) Typical values represent the likely parametric nominal values determined at the time of characterization. Typical values depend on the

application and configuration and may vary over time. Typical values are not ensured on production material.

4.2 4

– 40

CC

– 10

CC

(2)

MAX UNIT

www.ti.com

LMV321 SINGLE, LMV358 DUAL

LMV324 QUAD, LMV324S QUAD WITH SHUTDOWN

LOW-VOLTAGE RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS

SLOS263T – AUGUST 1999 – REVISED SEPTEMBER 2007

Shutdown Characteristics (LMV324S)

V

= 5 V, TA= 25 ° C (unless otherwise noted)

CC+

PARAMETER TEST CONDITIONS MIN TYP

I

CC(SHDN)

t

(on)

t

(off)

(1) Typical values represent the likely parametric nominal values determined at the time of characterization. Typical values depend on the

Supply current in shutdown mode (per channel)

Amplifier turn-on time AV= 1, RL= Open (measured at 50% point) 2 μ s Amplifier turn-off time AV= 1, RL= Open (measured at 50% point) 40 ns

application and configuration and may vary over time. Typical values are not ensured on production material.

SHDN ≤ 0.6 V, TA= – 40 ° C to 85 ° C 5 μ A

(1)

MAX UNIT

www.ti.com

80

70

60

50

40

30

20

10

0

−10

120

105

90

75

60

45

30

15

0

−15

1 k 10 k 100 k 1 M 10 M

Phase Margin − Deg

Gain − dB

LMV321 FREQUENCY RESPONSE

vs

RESISTIVE LOAD

Vs = 2.7 V RL = 100 kΩ, 2 kΩ, 600 Ω

Frequency − Hz

Gain

Phase

600 Ω

100 kΩ

2 kΩ

600 Ω

2 kΩ

100 kΩ

1 k 10 k 100 k 1 M 10 M

80

70

60

50

40

30

20

10

0

−10

120

105

90

75

60

45

30

15

0

−15

Phase Margin − Deg

LMV321 FREQUENCY RESPONSE

vs

RESISTIVE LOAD

Vs = 5.0 V RL = 100 kΩ, 2 kΩ, 600 Ω

Frequency − Hz

Gain

Phase

Gain − dB

100 kΩ

2 kΩ

600 Ω

100 kΩ

2 kΩ

10 k 100 k 1 M 10 M

70

60 50 40 30

20 10

0

−10

−30

100

80 60

40

20

0

−20

−40

−60

−80

Phase Margin − Deg

Gain − dB

LMV321 FREQUENCY RESPONSE

vs

CAPACITIVE LOAD

−20

−100

Frequency − Hz

Gain

Phase

0 pF

100 pF

500 pF

1000 pF

0 pF

100 pF

500 pF

1000 pF

Vs = 5.0 V RL = 600 Ω C

L

= 0 pF

100 pF 500 pF 1000 pF

10 k 100 k 1 M 10 M

70

60 50 40 30

20 10

0

−10

−30

100

80 60

40

20

0

−20

−40

−60

−80

Phase Margin − Deg

Gain − dB

LMV321 FREQUENCY RESPONSE

vs

CAPACITIVE LOAD

−20

−100

Frequency − Hz

Gain

Phase

0 pF

100 pF

500 pF

0 pF

1000 pF

500 pF

100 pF

Vs = 5.0 V RL = 100 kΩ C

L

= 0 pF

100 pF 500 pF 1000 pF

1000 pF

LMV321 SINGLE, LMV358 DUAL LMV324 QUAD, LMV324S QUAD WITH SHUTDOWN LOW-VOLTAGE RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS

SLOS263T – AUGUST 1999 – REVISED SEPTEMBER 2007

TYPICAL CHARACTERISTICS

Figure 1. Figure 2.

Figure 3. Figure 4.

www.ti.com

80

70

60

50

40

30

20

10

0

−10

120

105

90

75

60

45

30

15

0

−15

Phase Margin − Deg

LMV321 FREQUENCY RESPONSE

vs

TEMPERATURE

Vs = 5.0 V RL = 2 kΩ

Frequency − Hz

Gain

Phase

85°C

25°C

−40°C

85°C

25°C

−40°C

Gain − dB

1 k 10 k 100 k 1 M 10 M

10

100

1000

10000

1.510.50−0.5−1−1.5−2

LMV3xx

(25% Overshoot)

LMV324S

(25% Overshoot)

VCC = ±2.5 V A

V

= +1

RL = 2 kΩ VO = 100 mV

PP

Output Voltage − V

Capacitive Load − pF

STABILITY

vs

CAPACITIVE LOAD

_ +

V

I

−2.5 V

R

L

2.5 V

V

O

C

L

10

100

1000

10000

1.510.50−0.5−1−1.5−2.0

Output Voltage − V

Capacitive Load − pF

STABILITY

vs

CAPACITIVE LOAD

LMV3xx

(25% Overshoot)

LMV324S

(25% Overshoot)

VCC = ±2.5 V A

V

= +1

RL = 1 MΩ VO = 100 mV

PP

_

+

V

I

2.5 V

R

L

2.5 V

V

O

C

L

10

100

1000

10000

1.510.50−0.5−1−1.5−2.0

Capacitive Load − nF

STABILITY

vs

CAPACITIVE LOAD

Output Voltage − V

VCC = ±2.5 V RL = 2 kΩ AV = 10 VO = 100 mV

PP

_ +

V

I

−2.5 V

R

L

+2.5 V

V

O

C

L

LMV3xx

(25% Overshoot)

LMV324S

(25% Overshoot)

134 kΩ

1.21 MΩ

LMV321 SINGLE, LMV358 DUAL

LMV324 QUAD, LMV324S QUAD WITH SHUTDOWN

LOW-VOLTAGE RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS

SLOS263T – AUGUST 1999 – REVISED SEPTEMBER 2007

TYPICAL CHARACTERISTICS (continued)

Figure 5. Figure 6.

Figure 7. Figure 8.

www.ti.com

10

100

1000

10000

1.510.50−0.5−1−1.5−2.0

STABILITY

vs

CAPACITIVE LOAD

Output Voltage − V

Capacitive Load − nF

VCC = ±2.5 V RL = 1 MΩ AV = 10 VO = 100 mV

PP

_ +

V

I

−2.5 V

R

L

+2.5 V

V

O

C

L

LMV3xx

(25% Overshoot)

LMV324S

(25% Overshoot)

134 kΩ

1.21 MΩ

0.500

0.600

0.700

0.800

0.900

1.000

1.100

1.200

1.300

1.400

1.500

2.5 3.0 3.5 4.0 4.5 5.0

PSLEW

NSLEW

− Supply Voltage − V

Slew Rate − V/

SLEW RATE

vs

SUPPLY VOLTAGE

LMV3xx

PSLEW

RL = 100 kΩ

µs

V

CC

Gain

LMV324S

0

100

200

300

400

500

600

700

0 1 2 3 4 5

LMV3xx LMV324S

SUPPLY CURRENT

vs

SUPPLY VOLTAGE − QUAD AMPLIFIER

VCC − Supply Voltage − V

Supply Current − Aµ

TA = 85°C

TA = 25°C

T

A

= −40°C

6

Input Current − nA

INPUT CURRENT

vs

TEMPERATURE

−60

−50

−40

−30

−20

−10

−40 −30−20 −10 0 10 20 30 40 50 60 70 80

LMV3xx

LMV324S

TA − °C

VCC = 5 V VI = VCC/2

LMV321 SINGLE, LMV358 DUAL LMV324 QUAD, LMV324S QUAD WITH SHUTDOWN LOW-VOLTAGE RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS

SLOS263T – AUGUST 1999 – REVISED SEPTEMBER 2007

TYPICAL CHARACTERISTICS (continued)

Figure 9. Figure 10.

Figure 11. Figure 12.

www.ti.com

0.001

0.01

0.1

1

10

100

0.001 0.01 0.1 1 10

Sourcing Current − mA

SOURCE CURRENT

vs

OUTPUT VOLTAGE

Output Voltage Referenced to V

CC+

− V

LMV324S

LMV3xx

V

CC

= 5 V

0.001

0.01

0.1

1

10

100

0.001 0.01 0.1 1 10

Sourcing Current − mA

SOURCE CURRENT

vs

OUTPUT VOLTAGE

Output Voltage Referenced to V

CC+

− V

LMV324S

LMV3xx

V

CC

= 2.7 V

0.001

0.01

0.1

1

10

100

0.001 0.01 0.1 1 10

Sinking Current − mA

SINKING CURRENT

vs

OUTPUT VOLTAGE

Output Voltage Referenced to GND − V

V

CC

= 5 V

LMV324S

LMV324

0.001

0.01

0.1

1

10

100

0.001 0.01 0.1 1 10

Sinking Current − mA

SINKING CURRENT

vs

OUTPUT VOLTAGE

Output Voltage Referenced to GND − V

LMV3xx

V

CC

= 2.7 V

LMV324S

LMV321 SINGLE, LMV358 DUAL

LMV324 QUAD, LMV324S QUAD WITH SHUTDOWN

LOW-VOLTAGE RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS

SLOS263T – AUGUST 1999 – REVISED SEPTEMBER 2007

TYPICAL CHARACTERISTICS (continued)

Figure 13. Figure 14.

Figure 15. Figure 16.

www.ti.com

TA − °C

SHORT-CIRCUIT CURRENT

vs

TEMPERATURE

Sourcing Current − mA

0

20

40

60

80

100

120

−40 −30 −20−10 0 10 20 30 40 50 60 70 80 90

LMV324S VCC = 2.7 V

LMV3xx VCC = 5 V

LMV324S VCC = 5 V

LMV3xx VCC = 2.7 V

0

30

60

90

120

150

180

210

240

270

300

−40−30−20−10 0 10 20 30 40 50 60 70 80 90

SHORT-CIRCUIT CURRENT

vs

TEMPERATURE

Sinking Current − mA

TA − °C

LMV324S

VCC = 5 V

LMV3xx VCC = 5 V

LMV324S

VCC = 2.7 V

LMV3xx

VCC = 2.7 V

0

10

20

30

40

50

60

70

80

100 1k 10k 100k 1M

−k

SVR

vs

FREQUENCY

Frequency − Hz

−k

VCC = −5 V RL = 10 kΩ

SVR

− dB

LMV324S

LMV3xx

0

10

20

30

40

50

60

70

80

90

100

1k

10k

100k

1M

+k

SVR

vs

FREQUENCY

Frequency − Hz

VCC = 5 V RL = 10 kΩ

+k

SVR

− dB

LMV324S

LMV3xx

LMV321 SINGLE, LMV358 DUAL LMV324 QUAD, LMV324S QUAD WITH SHUTDOWN LOW-VOLTAGE RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS

SLOS263T – AUGUST 1999 – REVISED SEPTEMBER 2007

TYPICAL CHARACTERISTICS (continued)

Figure 17. Figure 18.

Figure 19. Figure 20.

www.ti.com

0

10

20

30

40

50

60

70

80

100 1k 10k 100k 1M

−k

SVR

vs

FREQUENCY

Frequency − Hz

VCC = −2.7 V RL = 10 kΩ

−k

SVR

− dB

LMV324S

LMV3xx

+k

SVR

0

10

20

30

40

50

60

70

80

100 1k 10k 100k 1M

Frequency − Hz

+k

SVR

vs

FREQUENCY

VCC = 2.7 V RL = 10 kΩ

− dB

LMV324S

LMV3xx

VCC − Supply Voltage − V

0

10

20

30

40

50

60

70

2.5 3.0 3.5 4.0 4.5 5.0

Output Voltage Swing − mV

LMV3xx LMV324S

OUTPUT VOLTAGE SWING FROM RAILS

vs

SUPPLY VOLTAGE

Negative Swing

Positive Swing

RL = 10 kΩ

OUTPUT VOLTAGE

vs

FREQUENCY

Peak Output Voltage − V

Frequency − Hz

OPP

0

1

2

3

4

5

6

1k 10k 100k 1M 10M

RL = 10 kΩ THD > 5% A

V

= 3

LMV3xx VCC = 5 V

LMV324S VCC = 5 V

LMV3xx VCC = 2.7 V

LMV324S

VCC = 2.7 V

LMV321 SINGLE, LMV358 DUAL

LMV324 QUAD, LMV324S QUAD WITH SHUTDOWN

LOW-VOLTAGE RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS

SLOS263T – AUGUST 1999 – REVISED SEPTEMBER 2007

TYPICAL CHARACTERISTICS (continued)

Figure 21. Figure 22.

Figure 23. Figure 24.

www.ti.com

20

30

40

50

60

70

80

90

100

110

1 1M 2M 3M 4M

LMV3xx VCC = 5 V

Impedance −

OPEN-LOOP OUTPUT IMPEDANCE

vs

FREQUENCY

Frequency − Hz

Ω

LMV3xx VCC = 2.7 V

LMV324S VCC = 5 V

LMV324S

VCC = 2.7 V

90

100

110

120

130

140

150

100 1k 10k 100k

Crosstalk Rejection − dB

CROSSTALK REJECTION

vs

FREQUENCY

Frequency − Hz

VCC = 5 V RL = 5 kΩ A

V = 1

V

O

= 3 V

PP

1 V/Div

LMV3xx

LMV324S

Input

1 µs/Div

NONINVERTING LARGE-SIGNAL

PULSE RESPONSE

VCC = ±2.5 V RL = 2 kΩ TA = 85°C

1 V/Div

NONINVERTING LARGE-SIGNAL

PULSE RESPONSE

1 µs/Div

LMV3xx

LMV324S

Input

VCC = ±2.5 V RL = 2 kΩ T = 25°C

LMV321 SINGLE, LMV358 DUAL LMV324 QUAD, LMV324S QUAD WITH SHUTDOWN LOW-VOLTAGE RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS

SLOS263T – AUGUST 1999 – REVISED SEPTEMBER 2007

TYPICAL CHARACTERISTICS (continued)

Figure 25. Figure 26.

Figure 27. Figure 28.

www.ti.com

LMV3xx

LMV324S

Input

50 mV/Div

NONINVERTING SMALL-SIGNAL

PULSE RESPONSE

1 µs/Div

VCC = ±2.5 V RL = 2 kΩ TA = 25°C

1 V/Div

LMV3xx

LMV324S

Input

NONINVERTING LARGE-SIGNAL

PULSE RESPONSE

1 µs/Div

VCC = ±2.5 V RL = 2 kΩ TA = −40°C

LMV3xx

Input

LMV324S

NONINVERTING SMALL-SIGNAL

PULSE RESPONSE

1 µs/Div

50 mV/Div

VCC = ±2.5 V RL = 2 kΩ TA = −40°C

NONINVERTING SMALL-SIGNAL

PULSE RESPONSE

1 µs/Div

50 mV/Div

LMV3xx

LMV324S

Input

VCC = ±2.5 V RL = 2 kΩ TA = 85°C

LMV321 SINGLE, LMV358 DUAL

LMV324 QUAD, LMV324S QUAD WITH SHUTDOWN

LOW-VOLTAGE RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS

SLOS263T – AUGUST 1999 – REVISED SEPTEMBER 2007

TYPICAL CHARACTERISTICS (continued)

Figure 29. Figure 30.

Figure 31. Figure 32.

www.ti.com

1 V/Div

INVERTING LARGE-SIGNAL

PULSE RESPONSE

1 µs/Div

LMV3xx

LMV324S

Input

VCC = ±2.5 V RL = 2 kΩ TA = 25°C

LMV3xx

LMV324S

Input

INVERTING LARGE-SIGNAL

PULSE RESPONSE

1 µs/Div

1 V/Div

VCC = ±2.5 V RL = 2 kΩ TA = 85°C

1 V/Div

1 µs/Div

VCC = ±2.5 V RL = 2 kΩ TA = −40°C

INVERTING LARGE-SIGNAL

PULSE RESPONSE

LMV324S

LMV3xx

Input

LMV3xx

LMV324S

Input

1 µs/Div

50 mV/Div

INVERTING SMALL-SIGNAL

PULSE RESPONSE

VCC = ±2.5 V RL = 2 kΩ TA = 25°C

LMV321 SINGLE, LMV358 DUAL LMV324 QUAD, LMV324S QUAD WITH SHUTDOWN LOW-VOLTAGE RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS

SLOS263T – AUGUST 1999 – REVISED SEPTEMBER 2007

TYPICAL CHARACTERISTICS (continued)

Figure 33. Figure 34.

Figure 35. Figure 36.

www.ti.com

LMV3xx

LMV324S

Input

1 µs/Div

50 mV/Div

INVERTING SMALL-SIGNAL

PULSE RESPONSE

VCC = ±2.5 V RL = 2 kΩ TA = 85°C

INVERTING SMALL-SIGNAL

PULSE RESPONSE

1 µs/Div

50 mV/Div

VCC = ±2.5 V RL = 2 kΩ T

A

= −40°C

LMV3xx

LMV324S

Input

0.00

0.05

0.10

0.15

0.20

0.25

0.30

0.35

0.40

0.45

0.50

10 100 1k

10k

Input Current Noise − pA/

INPUT CURRENT NOISE

vs

FREQUENCY

Frequency − Hz

Hz

VCC = 5 V

0.00

0.20

0.40

0.60

0.80

10 100 1k 10k

Input Current Noise − pA/

INPUT CURRENT NOISE

vs

FREQUENCY

Frequency − Hz

Hz

VCC = 2.7 V

LMV321 SINGLE, LMV358 DUAL

LMV324 QUAD, LMV324S QUAD WITH SHUTDOWN

LOW-VOLTAGE RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS

SLOS263T – AUGUST 1999 – REVISED SEPTEMBER 2007

TYPICAL CHARACTERISTICS (continued)

Figure 37. Figure 38.

Figure 39. Figure 40.

www.ti.com

0.001

0.010

0.100

1.000

10.000

10

100

1000 10000

100000

Frequency − Hz

THD + N

vs

FREQUENCY

LMV3xx

VCC = 2.7 V RL = 10 kΩ AV = 1 VO = 1 V

PP

THD − %

LMV324S

20

40

60

80

100

120

140

160

180

200

10 100 1k 10k

INPUT VOLTAGE NOISE

vs

FREQUENCY

Frequency − Hz

VCC = 2.7 V

VCC = 5 V

Input Voltage Noise − nV/ Hz

THD + N

vs

FREQUENCY

Frequency − Hz

0.001

0.010

0.100

1.000

10.000

10 100 1000 10000 100000

LMV324S

LMV3xx

THD − %

VCC = 2.7 V RL = 10 kΩ AV = 10 VO = 1 V

PP

0.001

0.010

0.100

1.000

10.000

10

100

1000 10000

100000

Frequency − Hz

THD + N

vs

FREQUENCY

LMV324S

LMV3xx

VCC = 5 V RL = 10 kΩ AV = 1 VO = 1 V

PP

THD − %

LMV321 SINGLE, LMV358 DUAL LMV324 QUAD, LMV324S QUAD WITH SHUTDOWN LOW-VOLTAGE RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS

SLOS263T – AUGUST 1999 – REVISED SEPTEMBER 2007

TYPICAL CHARACTERISTICS (continued)

Figure 41. Figure 42.

Figure 43. Figure 44.

www.ti.com

0.001

0.010

0.100

1.000

10.000

10 100 1000 10000 100000

THD + N

vs

FREQUENCY

Frequency − Hz

THD − %

LMV324S

LMV3xx

VCC = 5 V RL = 10 kΩ AV = 10 VO = 2.5 V

PP

LMV321 SINGLE, LMV358 DUAL

LMV324 QUAD, LMV324S QUAD WITH SHUTDOWN

LOW-VOLTAGE RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS

SLOS263T – AUGUST 1999 – REVISED SEPTEMBER 2007

TYPICAL CHARACTERISTICS (continued)

Figure 45.

PACKAGE OPTION ADDENDUM

www.ti.com

PACKAGING INFORMATION

Orderable Device Status

LMV321IDBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS &

LMV321IDBVRG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS &

LMV321IDBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS &

LMV321IDBVTE4 ACTIVE SOT-23 DBV 5 250 Green (RoHS &

LMV321IDBVTG4 ACTIVE SOT-23 DBV 5 250 Green (RoHS &

LMV321IDCKR ACTIVE SC70 DCK 5 3000 Green (RoHS &

LMV321IDCKRG4 ACTIVE SC70 DCK 5 3000 Green (RoHS &

LMV321IDCKT ACTIVE SC70 DCK 5 250 Green (RoHS &

LMV321IDCKTE4 ACTIVE SC70 DCK 5 250 Green (RoHS &

LMV321IDCKTG4 ACTIVE SC70 DCK 5 250 Green (RoHS &

LMV324ID ACTIVE SOIC D 14 50 Green (RoHS &

LMV324IDG4 ACTIVE SOIC D 14 50 Green (RoHS &

LMV324IDR ACTIVE SOIC D 14 2500 Green (RoHS &

LMV324IDRG4 ACTIVE SOIC D 14 2500 Green (RoHS &

LMV324IPWR ACTIVE TSSOP PW 14 2000 Green (RoHS &

LMV324IPWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS &

LMV324QD ACTIVE SOIC D 14 50 Green (RoHS &

LMV324QDG4 ACTIVE SOIC D 14 50 Green (RoHS &

LMV324QDR ACTIVE SOIC D 14 2500 Green (RoHS &

LMV324QDRG4 ACTIVE SOIC D 14 2500 Green (RoHS &

LMV324QPW ACTIVE TSSOP PW 14 90 Green (RoHS &

LMV324QPWE4 ACTIVE TSSOP PW 14 90 Green (RoHS &

LMV324QPWG4 ACTIVE TSSOP PW 14 90 Green (RoHS &

LMV324QPWR ACTIVE TSSOP PW 14 2000 Green (RoHS &

LMV324QPWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS &

(1)

Package

Type

Package Drawing

Pins Package

Qty

Eco Plan

no Sb/Br)

(2)

Lead/Ball Finish MSL Peak Temp

CU NIPDAU Level-1-260C-UNLIM

18-Sep-2008

(3)

Addendum-Page 1

PACKAGE OPTION ADDENDUM

www.ti.com

Orderable Device Status

(1)

Package

Type

Package Drawing

Pins Package

Qty

Eco Plan

(2)

LMV324SID ACTIVE SOIC D 16 40 Green (RoHS &

no Sb/Br)

LMV324SIDE4 ACTIVE SOIC D 16 40 Green (RoHS &

no Sb/Br)

LMV324SIDG4 ACTIVE SOIC D 16 40 Green (RoHS &

no Sb/Br)

LMV324SIDR ACTIVE SOIC D 16 2500 Green (RoHS &

no Sb/Br)

LMV324SIDRE4 ACTIVE SOIC D 16 2500 Green (RoHS &

no Sb/Br)

LMV324SIDRG4 ACTIVE SOIC D 16 2500 Green (RoHS &

no Sb/Br)

LMV324SIPWR ACTIVE TSSOP PW 16 2000 Green (RoHS &

no Sb/Br)

LMV324SIPWRE4 ACTIVE TSSOP PW 16 2000 Green (RoHS &

no Sb/Br)

LMV324SIPWRG4 ACTIVE TSSOP PW 16 2000 Green (RoHS &

no Sb/Br)

LMV358ID ACTIVE SOIC D 8 75 Green (RoHS &

no Sb/Br)

LMV358IDDUR ACTIVE VSSOP DDU 8 3000 Green (RoHS &

no Sb/Br)

LMV358IDDURE4 ACTIVE VSSOP DDU 8 3000 Green (RoHS &

no Sb/Br)

LMV358IDDURG4 ACTIVE VSSOP DDU 8 3000 Green (RoHS &

no Sb/Br)

LMV358IDE4 ACTIVE SOIC D 8 75 Green (RoHS &

no Sb/Br)

LMV358IDG4 ACTIVE SOIC D 8 75 Green (RoHS &

no Sb/Br)

LMV358IDGKR ACTIVE MSOP DGK 8 2500 Green (RoHS &

no Sb/Br)

LMV358IDGKRG4 ACTIVE MSOP DGK 8 2500 Green (RoHS &

no Sb/Br)

LMV358IDR ACTIVE SOIC D 8 2500 Green (RoHS &

no Sb/Br)

LMV358IDRE4 ACTIVE SOIC D 8 2500 Green (RoHS &

no Sb/Br)

LMV358IDRG4 ACTIVE SOIC D 8 2500 Green (RoHS &

no Sb/Br)

LMV358IPW ACTIVE TSSOP PW 8 150 Green (RoHS &

no Sb/Br)

LMV358IPWE4 ACTIVE TSSOP PW 8 150 Green (RoHS &

no Sb/Br)

LMV358IPWG4 ACTIVE TSSOP PW 8 150 Green (RoHS &

no Sb/Br)

LMV358IPWR ACTIVE TSSOP PW 8 2000 Green (RoHS &

no Sb/Br)

LMV358IPWRE4 ACTIVE TSSOP PW 8 2000 Green (RoHS &

no Sb/Br)

LMV358IPWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS &

no Sb/Br)

18-Sep-2008

Lead/Ball Finish MSL Peak Temp

CU NIPDAU Level-1-260C-UNLIM

(3)

Addendum-Page 2

PACKAGE OPTION ADDENDUM

www.ti.com

Orderable Device Status

(1)

Package

Type

Package Drawing

Pins Package

Qty

Eco Plan

LMV358QD ACTIVE SOIC D 8 75 Green (RoHS &

(2)

Lead/Ball Finish MSL Peak Temp

CU NIPDAU Level-1-260C-UNLIM

18-Sep-2008

(3)

no Sb/Br)

LMV358QDDUR ACTIVE VSSOP DDU 8 3000 Green (RoHS &

CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

LMV358QDDURE4 ACTIVE VSSOP DDU 8 3000 Green (RoHS &

CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

LMV358QDDURG4 ACTIVE VSSOP DDU 8 3000 Green (RoHS &

CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

LMV358QDE4 ACTIVE SOIC D 8 75 Green (RoHS &

CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

LMV358QDG4 ACTIVE SOIC D 8 75 Green (RoHS &

CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

LMV358QDGKR ACTIVE MSOP DGK 8 2500 Green (RoHS &

CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

LMV358QDGKRG4 ACTIVE MSOP DGK 8 2500 Green (RoHS &

CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

LMV358QDR ACTIVE SOIC D 8 2500 Green (RoHS &

CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

LMV358QDRE4 ACTIVE SOIC D 8 2500 Green (RoHS &

CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

LMV358QDRG4 ACTIVE SOIC D 8 2500 Green (RoHS &

CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

LMV358QPW ACTIVE TSSOP PW 8 150 Green (RoHS &

CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

LMV358QPWE4 ACTIVE TSSOP PW 8 150 Green (RoHS &

CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

LMV358QPWG4 ACTIVE TSSOP PW 8 150 Green (RoHS &

CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

LMV358QPWR ACTIVE TSSOP PW 8 2000 Green (RoHS &

CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

LMV358QPWRE4 ACTIVE TSSOP PW 8 2000 Green (RoHS &

CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

LMV358QPWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS &

CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

(1)

The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in

a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device.

(2)

Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check

http://www.ti.com/productcontent for the latest availability information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements

for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

Addendum-Page 3

PACKAGE OPTION ADDENDUM

www.ti.com

(3)

MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder

temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

OTHER QUALIFIED VERSIONS OF LMV321, LMV324, LMV358 :

Automotive: LMV321-Q1, LMV324-Q1, LMV358-Q1

•

NOTE: Qualified Version Definitions:

Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects

•

18-Sep-2008

Addendum-Page 4

PACKAGE MATERIALS INFORMATION

www.ti.com

TAPE AND REEL INFORMATION

7-Nov-2008

*All dimensions are nominal

Device Package

Type

LMV321IDBVR SOT-23 DBV 5 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 LMV321IDBVR SOT-23 DBV 5 3000 180.0 9.2 3.23 3.17 1.37 4.0 8.0 Q3 LMV321IDBVT SOT-23 DBV 5 250 180.0 9.2 3.23 3.17 1.37 4.0 8.0 Q3 LMV321IDCKR SC70 DCK 5 3000 178.0 9.0 2.4 2.5 1.2 4.0 8.0 Q3 LMV321IDCKR SC70 DCK 5 3000 180.0 9.2 2.24 2.34 1.22 4.0 8.0 Q3 LMV321IDCKR SC70 DCK 5 3000 180.0 9.2 2.24 2.34 1.22 4.0 8.0 Q3 LMV321IDCKT SC70 DCK 5 250 178.0 9.0 2.4 2.5 1.2 4.0 8.0 Q3 LMV321IDCKT SC70 DCK 5 250 180.0 9.2 2.24 2.34 1.22 4.0 8.0 Q3 LMV321IDCKT SC70 DCK 5 250 180.0 9.2 2.24 2.34 1.22 4.0 8.0 Q3

LMV324IDR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1

LMV324IPWR TSSOP PW 14 2000 330.0 12.4 7.0 5.6 1.6 8.0 12.0 Q1

LMV324QDR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1

LMV324QPWR TSSOP PW 14 2000 330.0 12.4 7.0 5.6 1.6 8.0 12.0 Q1

LMV324SIDR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 LMV324SIPWR TSSOP PW 16 2000 330.0 12.4 7.0 5.6 1.6 8.0 12.0 Q1 LMV358IDDUR VSSOP DDU 8 3000 180.0 9.2 2.25 3.35 1.05 4.0 8.0 Q3 LMV358IDGKR MSOP DGK 8 2500 330.0 12.4 5.3 3.3 1.3 8.0 12.0 Q1 LMV358IDGKR MSOP DGK 8 2500 330.0 13.0 5.3 3.4 1.4 8.0 12.0 Q1

Package Drawing

Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

A0 (mm) B0 (mm) K0 (mm) P1

(mm)W(mm)

Pin1

Quadrant

Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION

www.ti.com

Device Package

Type

LMV358IDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LMV358IDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1

LMV358IPWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1

LMV358QDDUR VSSOP DDU 8 3000 180.0 9.2 2.25 3.35 1.05 4.0 8.0 Q3 LMV358QDGKR MSOP DGK 8 2500 330.0 12.4 5.3 3.3 1.3 8.0 12.0 Q1 LMV358QDGKR MSOP DGK 8 2500 330.0 13.0 5.3 3.4 1.4 8.0 12.0 Q1

LMV358QDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1

LMV358QPWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1

Package Drawing

Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

A0 (mm) B0 (mm) K0 (mm) P1

7-Nov-2008

(mm)W(mm)

Pin1

Quadrant

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

LMV321IDBVR SOT-23 DBV 5 3000 565.0 140.0 75.0 LMV321IDBVR SOT-23 DBV 5 3000 205.0 200.0 33.0

LMV321IDBVT SOT-23 DBV 5 250 205.0 200.0 33.0

LMV321IDCKR SC70 DCK 5 3000 565.0 140.0 75.0 LMV321IDCKR SC70 DCK 5 3000 205.0 200.0 33.0 LMV321IDCKR SC70 DCK 5 3000 202.0 201.0 28.0 LMV321IDCKT SC70 DCK 5 250 565.0 140.0 75.0 LMV321IDCKT SC70 DCK 5 250 202.0 201.0 28.0 LMV321IDCKT SC70 DCK 5 250 205.0 200.0 33.0

Pack Materials-Page 2

PACKAGE MATERIALS INFORMATION

www.ti.com

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

LMV324IDR SOIC D 14 2500 346.0 346.0 33.0

LMV324IPWR TSSOP PW 14 2000 346.0 346.0 29.0

LMV324QDR SOIC D 14 2500 346.0 346.0 33.0

LMV324QPWR TSSOP PW 14 2000 346.0 346.0 29.0

LMV324SIDR SOIC D 16 2500 333.2 345.9 28.6

LMV324SIPWR TSSOP PW 16 2000 346.0 346.0 29.0

LMV358IDDUR VSSOP DDU 8 3000 202.0 201.0 28.0 LMV358IDGKR MSOP DGK 8 2500 370.0 355.0 55.0 LMV358IDGKR MSOP DGK 8 2500 358.0 335.0 35.0

LMV358IDR SOIC D 8 2500 340.5 338.1 20.6 LMV358IDR SOIC D 8 2500 346.0 346.0 29.0

LMV358IPWR TSSOP PW 8 2000 346.0 346.0 29.0 LMV358QDDUR VSSOP DDU 8 3000 202.0 201.0 28.0 LMV358QDGKR MSOP DGK 8 2500 370.0 355.0 55.0 LMV358QDGKR MSOP DGK 8 2500 358.0 335.0 35.0

LMV358QDR SOIC D 8 2500 340.5 338.1 20.6

LMV358QPWR TSSOP PW 8 2000 346.0 346.0 29.0

7-Nov-2008

Pack Materials-Page 3

MECHANICAL DATA

MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999

PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE

14 PINS SHOWN

0,65

1,20 MAX

14

0,30 0,19

8

4,50 4,30

PINS **

7

Seating Plane

0,15 0,05

8

1

A

DIM

6,60 6,20

14

0,10

M

0,10

0,15 NOM

2016

0°–8°

Gage Plane

24

0,25

0,75 0,50

28

A MAX

A MIN

NOTES: A. All linear dimensions are in millimeters.

B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion not to exceed 0,15. D. Falls within JEDEC MO-153

3,10

2,90

5,10

4,90

5,10

4,90

6,60

6,40

7,90

7,70

9,80

9,60

4040064/F 01/97

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.

TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed.

TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards.

TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.

Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions.

Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.

TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications.

TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.

TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.

Following are URLs where you can obtain information on other Texas Instruments products and application solutions:

Products Applications

Amplifiers amplifier.ti.com Audio www.ti.com/audio Data Converters dataconverter.ti.com Automotive www.ti.com/automotive DSP dsp.ti.com Broadband www.ti.com/broadband Clocks and Timers www.ti.com/clocks Digital Control www.ti.com/digitalcontrol Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Military www.ti.com/military Power Mgmt power.ti.com Optical Networking www.ti.com/opticalnetwork Microcontrollers microcontroller.ti.com Security www.ti.com/security RFID www.ti-rfid.com Telephony www.ti.com/telephony RF/IF and ZigBee® Solutions www.ti.com/lprf Video & Imaging www.ti.com/video

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265

Wireless www.ti.com/wireless

TEXAS INSTRUMENTS LMV321, LMV358, LMV324, LMV324S Operation Manual

Specifications and Main Features

Frequently Asked Questions

User Manual

FEATURES

DESCRIPTION/ ORDERING INFORMATION

Absolute Maximum Ratings

Recommended Operating Conditions

Electrical Characteristics

Shutdown Characteristics (LMV324S)

Electrical Characteristics

Shutdown Characteristics (LMV324S)

TYPICAL CHARACTERISTICS