Texas Instruments LM2734XMK, LM2734XQMK, LM2734YMK, LM2734YQMK Schematic [ru]

LM2734
VIN
VIN
EN
BOOST
FB
GND
V
OUT
C3
L1
C1
C2
R1
R2
D1
D2
ON
OFF
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SNVS288J –SEPTEMBER 2004–REVISED DECEMBER 2014
LM2734 Thin SOT 1-A Load Step-Down DC-DC Regulator

1 Features 3 Description

1
Thin SOT-6 Package
3.0-V to 20-V Input Voltage Range
0.8-V to 18-V Output Voltage Range
1-A Output Current
550-kHz (LM2734Y) and 1.6-MHz (LM2734X) Switching Frequencies
300-mNMOS Switch
30-nA Shutdown Current
0.8-V, 2% Internal Voltage Reference
Internal Soft-Start
Current-Mode, PWM Operation
WEBENCH®Online Design Tool
Thermal Shutdown
LM2734XQ and LM2734YQ are AEC-Q100 Grade 1 Qualified and are Manufactured on an Automotive Grade Flow.

2 Applications

Local Point-of-Load Regulation
Core Power in HDDs
Set-Top Boxes
Battery-Powered Devices
USB Powered Devices
DSL Modems
Notebook Computers
Automotive
Typical Application Circuit
The LM2734 regulator is a monolithic, high­frequency, PWM step-down DC-DC converter in a 6­pin Thin SOT package. The device provides all the active functions to provide local DC-DC conversion with fast transient response and accurate regulation in the smallest possible PCB area.
With a minimum of external components and online design support through WEBENCH, the LM2734 regulator is easy to use. The ability to drive 1-A loads with an internal 300-mNMOS switch using state-of­the-art 0.5-µm BiCMOS technology results in the best power density available. The world-class control circuitry allows for on-times as low as 13 ns, thus supporting exceptionally high-frequency conversion over the entire 3-V to 20-V input operating range down to the minimum output voltage of 0.8 V. Switching frequency is internally set to 550 kHz (LM2734Y) or 1.6 MHz (LM2734X), allowing the use of extremely small surface-mount inductors and chip capacitors. Even though the operating frequencies are very high, efficiencies up to 90% are easy to achieve. External shutdown is included, featuring an ultra-low standby current of 30 nA.
The LM2734 regulator uses current-mode control and internal compensation to provide high-performance regulation over a wide range of operating conditions. Additional features include internal soft-start circuitry to reduce inrush current, pulse-by-pulse current limit, thermal shutdown, and output overvoltage protection.
Device Information
PART NUMBER PACKAGE BODY SIZE (NOM)
LM2734 SOT (6) 2.90 mm x 1.60 mm (1) For all available packages, see the orderable addendum at
the end of the datasheet.
Efficiency vs Load Current
VIN= 5 V, V
OUT
LM2734
(1)
= 3.3 V
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA.
LM2734
SNVS288J –SEPTEMBER 2004–REVISED DECEMBER 2014
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Table of Contents

1 Features.................................................................. 1
2 Applications ........................................................... 1
3 Description............................................................. 1
4 Revision History..................................................... 2
5 Pin Configuration and Functions......................... 3
6 Specifications......................................................... 4
6.1 Absolute Maximum Ratings ...................................... 4
6.2 ESD Ratings.............................................................. 4
6.3 Recommended Operating Conditions....................... 4
6.4 Thermal Information.................................................. 4
6.5 Electrical Characteristics........................................... 5
6.6 Typical Performance Characteristics ........................ 6
7 Detailed Description.............................................. 8
7.1 Overview................................................................... 8
7.2 Functional Block Diagram ......................................... 9
7.3 Feature Description................................................... 9
7.4 Device Functional Modes........................................ 10
8 Application and Implementation ........................ 11
8.1 Application Information............................................ 11
8.2 Typical Applications................................................ 14
9 Power Supply Recommendations...................... 28
10 Layout................................................................... 28
10.1 Layout Guidelines................................................. 28
10.2 Layout Example.................................................... 29
11 Device and Documentation Support................. 30
11.1 Third-Party Products Disclaimer........................... 30
11.2 Trademarks........................................................... 30
11.3 Electrostatic Discharge Caution............................ 30
11.4 Glossary................................................................ 30
12 Mechanical, Packaging, and Orderable
Information........................................................... 30

4 Revision History

Changes from Revision I (April 2013) to Revision J Page
Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section.................................................................................................. 1
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1
2
3
6
5
4
BOOST
GND
FB
SW
V
IN
EN
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5 Pin Configuration and Functions

LM2734
SNVS288J –SEPTEMBER 2004–REVISED DECEMBER 2014
See Package Number DDC (R-PDSO-G6)
6-Lead SOT
Top View
Pin Functions
PIN
NAME NO.
BOOST 1 I
GND 2 GND FB 3 I Feedback pin. Connect FB to the external resistor divider to set output voltage. EN 4 I V
IN
5 I Input supply voltage. Connect a bypass capacitor to this pin.
SW 6 O Output switch. Connects to the inductor, catch diode, and bootstrap capacitor.
I/O DESCRIPTION
Boost voltage that drives the internal NMOS control switch. A bootstrap capacitor is connected between the BOOST and SW pins.
Signal and Power ground pin. Place the bottom resistor of the feedback network as close as possible to this pin for accurate regulation.
Enable control input. Logic high enables operation. Do not allow this pin to float or be greater than VIN+ 0.3 V.
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6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature (unless otherwise noted)
V
IN
SW Voltage -0.5 24 V Boost Voltage -0.5 30 V Boost to SW Voltage -0.5 6.0 V FB Voltage -0.5 0.3 V EN Voltage -0.5 VIN+ 0.3 V Junction Temperature 150 °C Soldering Information Reflow Peak Pkg. Temp.(15s) 260 °C T
Storage temperature -65 150 °C
stg
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.

6.2 ESD Ratings

V
Electrostatic discharge Human Body Model (HBM), per ANSI/ESDA/JEDEC JS001
ESD
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(1)(2)
MIN MAX UNIT
-0.5 24 V
VALUE UNIT
(1)
±2000 V

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
V
IN
SW Voltage -0.5 20 V Boost Voltage -0.5 25 V Boost to SW Voltage 1.6 5.5 V Junction Temperature Range 40 125 °C
3 20 V

6.4 Thermal Information

LM2734
THERMAL METRIC
R
θJA
R
θJC(top)
R
θJB
ψ
JT
ψ
JB
R
θJC(bot)
Junction-to-ambient thermal resistance 158.1 Junction-to-case (top) thermal resistance 46.5 Junction-to-board thermal resistance 29.5 Junction-to-top characterization parameter 0.8 Junction-to-board characterization parameter 29.2 Junction-to-case (bottom) thermal resistance n/a
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(1)
DDC UNIT
6 PINS
°C/W
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6.5 Electrical Characteristics

VIN= 5V, V statistical analysis.
V ΔVFB/Δ Feedback Voltage Line VIN= 3V to 20V
V I
FB
UVLO Undervoltage Lockout VINFalling 2.3 2.0 V
F
D
D
R I
CL
I
Q
I
BOOST
V
I
EN
I
SW
(1) Specified to Average Outgoing Quality Level (AOQL). (2) Typicals represent the most likely parametric norm.
Feedback Voltage 0.800 0.784 0.816 V
FB
Regulation
IN
Feedback Input Bias Sink/Source Current
Undervoltage Lockout VINRising 2.74 2.90
UVLO Hysteresis 0.44 0.30 0.62
Switching Frequency MHz
SW
Maximum Duty Cycle
MAX
Minimum Duty Cycle
MIN
Switch ON Resistance V
DS(ON)
Switch Current Limit V Quiescent Current Switching 1.5 2.5 mA Quiescent Current VEN= 0V
(shutdown)
Boost Pin Current mA
Shutdown Threshold VENFalling Voltage
EN_TH
Enable Threshold VENRising 1.8 Voltage
Enable Pin Current Sink/Source 10 nA Switch Leakage 40 nA
- VSW= 5V unless otherwise specified. Datasheet min/max specification limits are ensured by design, test, or
BOOST
PARAMETER TEST CONDITIONS UNIT
MIN
TJ= 25°C TJ= -40°C to 125°C
(1)
TYP
(2)
MAX
(1)
MIN TYP MAX
0.01 % / V
10 250 nA
LM2734X 1.6 1.2 1.9 LM2734Y 0.55 0.40 0.66 LM2734X 92 85% LM2734Y 96 90% LM2734X 2% LM2734Y 1%
- VSW= 3V 300 600 m
BOOST
- VSW= 3V 1.7 1.2 2.5 A
BOOST
30 nA
LM2734X (50% Duty Cycle)
LM2734Y (50% Duty Cycle)
2.5 3.5
1.0 1.8
0.4 V
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SNVS288J –SEPTEMBER 2004–REVISED DECEMBER 2014

6.6 Typical Performance Characteristics

All curves taken at VIN= 5 V, V
Figure 1. Oscillator Frequency vs Temperature - L1 = 4.7 µH Figure 2. Oscillator Frequency vs Temperature - L1 = 10 μH
- VSW= 5 V and TA= 25°C, unless specified otherwise.
BOOST
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Figure 3. Current Limit vs Temperature Figure 4. Current Limit vs Temperature
VIN= 20 V
Figure 5. VFBvs Temperature Figure 6. R
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vs Temperature
DSON
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Typical Performance Characteristics (continued)
LM2734
SNVS288J –SEPTEMBER 2004–REVISED DECEMBER 2014
All curves taken at VIN= 5 V, V
Figure 7. IQSwitching vs Temperature Figure 8. Line Regulation - L1 = 4.7 µH
- VSW= 5 V and TA= 25°C, unless specified otherwise.
BOOST
V
OUT
= 1.5 V, I
OUT
= 500 mA
Figure 9. Line Regulation - L1 = 10 μH Figure 10. Line Regulation - L1 = 4.7 µH
V
OUT
= 1.5 V, I
= 500 mA V
OUT
OUT
= 3.3 V, I
OUT
= 500 mA
Figure 11. Line Regulation - L1 = 10 μH
V
= 3.3 V, I
OUT
Copyright © 2004–2014, Texas Instruments Incorporated Submit Documentation Feedback 7
OUT
= 500 mA
Product Folder Links: LM2734
0
0
V
IN
V
D
T
ON
t
t
Inductor
Current
D = TON/T
SW
V
SW
T
OFF
T
SW
I
L
I
PK
SW
Voltage
LM2734
SNVS288J –SEPTEMBER 2004–REVISED DECEMBER 2014
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7 Detailed Description

7.1 Overview

The LM2734 device is a constant frequency PWM buck regulator IC that delivers a 1-A load current. The regulator has a preset switching frequency of either 550 kHz (LM2734Y) or 1.6 MHz (LM2734X). These high frequencies allow the LM2734 device to operate with small surface-mount capacitors and inductors, resulting in DC-DC converters that require a minimum amount of board space. The LM2734 device is internally compensated, so it is simple to use, and requires few external components. The LM2734 device uses current­mode control to regulate the output voltage.
The following operating description of the LM2734 device will refer to the Simplified Block Diagram () and to the waveforms in Figure 12. The LM2734 device supplies a regulated output voltage by switching the internal NMOS control switch at constant frequency and variable duty cycle. A switching cycle begins at the falling edge of the reset pulse generated by the internal oscillator. When this pulse goes low, the output control logic turns on the internal NMOS control switch. During this on-time, the SW pin voltage (VSW) swings up to approximately VIN, and the inductor current (IL) increases with a linear slope. ILis measured by the current-sense amplifier, which generates an output proportional to the switch current. The sense signal is summed with the regulator’s corrective ramp and compared to the error amplifier’s output, which is proportional to the difference between the feedback voltage and V next switching cycle begins. During the switch off-time, inductor current discharges through Schottky diode D1, which forces the SW pin to swing below ground by the forward voltage (VD) of the catch diode. The regulator loop adjusts the duty cycle (D) to maintain a constant output voltage.
. When the PWM comparator output goes high, the output switch turns off until the
REF
Figure 12. LM2734 Waveforms of SW Pin Voltage and Inductor Current
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L
R 1
R 2
D 1
D2
BOOST
Output Control
Logic
Current
Limit
Thermal
Shutdown
Under Voltage Lockout
Corrective Ramp
Reset Pulse
PWM
Comparator
Current-Sense Amplifier
R
SENSE
+
+
Internal
Regulator
and
Enable
Circuit
Oscillator
Driver
0.3:
Switch
Internal
Compensation
SW
EN
FB
GND
Error Amplifier
-
+
V
REF
0.8V
C
OUT
ON
OFF
V
BOOST
I
L
V
SW
+
-
C
BOOST
V
OUT
C
IN
V
IN
V
IN
I
SENSE
+
-
+
-
+
-
0.88V
-
+
OVP
Comparator
Error
Signal
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7.2 Functional Block Diagram

LM2734
SNVS288J –SEPTEMBER 2004–REVISED DECEMBER 2014

7.3 Feature Description

7.3.1 Output Overvoltage Protection

The overvoltage comparator compares the FB pin voltage to a voltage that is 10% higher than the internal reference Vref. Once the FB pin voltage goes 10% above the internal reference, the internal NMOS control switch is turned off, which allows the output voltage to decrease toward regulation.

7.3.2 Undervoltage Lockout

Undervoltage lockout (UVLO) prevents the LM2734 from operating until the input voltage exceeds 2.74 V (typical).
The UVLO threshold has approximately 440 mV of hysteresis, so the part will operate until VINdrops below 2.3 V (typical). Hysteresis prevents the part from turning off during power up if VINis nonmonotonic.

7.3.3 Current Limit

The LM2734 device uses cycle-by-cycle current limiting to protect the output switch. During each switching cycle, a current limit comparator detects if the output switch current exceeds 1.7 A (typical), and turns off the switch until the next switching cycle begins.

7.3.4 Thermal Shutdown

Thermal shutdown limits total power dissipation by turning off the output switch when the IC junction temperature exceeds 165°C. After thermal shutdown occurs, the output switch does not turn on until the junction temperature drops to approximately 150°C.
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7.4 Device Functional Modes

7.4.1 Enable Pin / Shutdown Mode

The LM2734 device has a shutdown mode that is controlled by the enable pin (EN). When a logic low voltage is applied to EN, the part is in shutdown mode and its quiescent current drops to typically 30 nA. Switch leakage adds another 40 nA from the input supply. The voltage at this pin should never exceed VIN+ 0.3 V.

7.4.2 Soft-Start

This function forces V reference voltage ramps from 0 V to its nominal value of 0.8 V in approximately 200 µs. This forces the regulator output to ramp up in a more linear and controlled fashion, which helps reduce inrush current. Under some circumstances at start-up, an output voltage overshoot may still be observed. This may be due to a large output load applied during start up. Large amounts of output external capacitance can also increase output voltage overshoot. A simple solution is to add a feed forward capacitor with a value between 470 pf and 1000 pf across the top feedback resistor (R1). See Figure 23 for further detail.
to increase at a controlled rate during start up. During soft-start, the error amplifier’s
OUT
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LM2734
BOOST
SW
GND
L
D1
D2
C
OUT
C
BOOST
V
OUT
C
IN
V
IN
V
IN
V
BOOST
LM2734
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SNVS288J –SEPTEMBER 2004–REVISED DECEMBER 2014

8 Application and Implementation

NOTE
Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality.

8.1 Application Information

8.1.1 Boost Function

Capacitor C drive voltage to the internal NMOS control switch. To properly drive the internal NMOS switch during its on-time, V
needs to be at least 1.6 V greater than VSW. Although the LM2734 device will operate with this minimum
BOOST
voltage, it may not have sufficient gate drive to supply large values of output current. Therefore, it is recommended that V the maximum operating limit of 5.5 V.
5.5 V > V
BOOST
and diode D2 in Figure 13 are used to generate a voltage V
BOOST
be greater than 2.5 V above VSWfor best efficiency. V
BOOST
– VSW> 2.5 V for best performance.
BOOST
BOOST
. V
- VSWis the gate
BOOST
– VSWshould not exceed
Figure 13. V
Charges C
OUT
BOOST
When the LM2734 device starts up, internal circuitry from the BOOST pin supplies a maximum of 20 mA to C source current to C
There are various methods to derive V
. This current charges C
BOOST
to a voltage sufficient to turn the switch on. The BOOST pin will continue to
BOOST
until the voltage at the feedback pin is greater than 0.76 V.
BOOST
:
BOOST
1. From the input voltage (VIN)
2. From the output voltage (V
3. From an external distributed voltage rail (V
OUT
)
)
EXT
4. From a shunt or series Zener diode
In the simplified block diagram of Functional Block Diagram, capacitor C drive current for the NMOS switch. Capacitor C cycle, when the internal NMOS control switch is off (T forward voltage of D2 (V (V
). Therefore the voltage stored across C
FD1
V
- VSW= VIN- V
BOOST
), during which the current in the inductor (L) forward biases the Schottky diode D1
FD2
BOOST
+ V
FD2
FD1
is charged via diode D2 by VIN. During a normal switching
BOOST
) (refer to Figure 12), V
OFF
is:
and diode D2 supply the gate-
BOOST
equals VINminus the
BOOST
(1)
When the NMOS switch turns on (TON), the switch pin rises to:
VSW= VIN– (R
forcing V
V
BOOST
to rise thus reverse biasing D2. The voltage at V
BOOST
= 2VIN– (R
which is approximately:
2VIN- 0.4 V (4)
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× IL), (2)
DSON
is then:
BOOST
DSON
× IL) – V
+ V
FD2
FD1
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(3)
LM2734
V
IN
BOOST
SW
GND
C
BOOST
L
D1
D2
D3
C
IN
V
IN
C
OUT
V
OUT
V
BOOST
LM2734
SNVS288J –SEPTEMBER 2004–REVISED DECEMBER 2014
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Application Information (continued)
for many applications. Thus the gate-drive voltage of the NMOS switch is approximately:
VIN- 0.2 V (5)
An alternate method for charging C voltage should be from 2.5 V and 5.5 V, so that proper gate voltage will be applied to the internal switch. In this circuit, C
provides a gate drive voltage that is slightly less than V
BOOST
In applications where both VINand V directly from these voltages. If VINto V a Zener voltage by placing a Zener diode D3 in series with D2, as shown in Figure 14. When using a series Zener diode from the input, ensure that the regulation of the input supply does not create a voltage that falls outside the recommended V
(V (V
– VD3) < 5.5 V (6)
INMAX
– VD3) > 1.6 V (7)
INMIN
BOOST
voltage.
is to connect D2 to the output as shown in Figure 13. The output
BOOST
.
OUT
are greater than 5.5 V, or less than 3 V, C
OUT
are greater than 5.5 V, C
OUT
can be charged from VINor V
BOOST
cannot be charged
BOOST
OUT
minus
Figure 14. Zener Reduces Boost Voltage from V
IN
An alternative method is to place the Zener diode D3 in a shunt configuration as shown in Figure 15. A small 350 mW to 500 mW 5.1-V Zener diode in a SOT or SOD package can be used for this purpose. A small ceramic capacitor such as a 6.3 V, 0.1-µF capacitor (C4) should be placed in parallel with the Zener diode. When the internal NMOS switch turns on, a pulse of current is drawn to charge the internal NMOS gate capacitance. The
0.1-µF parallel shunt capacitor ensures that the V
voltage is maintained during this time.
BOOST
Resistor R3 should be chosen to provide enough RMS current to the Zener diode (D3) and to the BOOST pin. A recommended choice for the Zener current (I
) is 1 mA. The current I
ZENER
into the BOOST pin supplies the
BOOST
gate current of the NMOS control switch and varies typically according to the following formula for the X version:
I
= 0.56 × (D + 0.54) × (V
BOOST
I
can be calculated for the Y version using the following:
BOOST
I
= 0.22 × (D + 0.54) × (V
BOOST
where D is the duty cycle, V
ZENER
– VD2) mA (8)
ZENER
- VD2) µA (9)
ZENER
and VD2are in volts, and I
is in milliamps. V
BOOST
is the voltage applied to
ZENER
the anode of the boost diode (D2), and VD2is the average forward voltage across D2. Note that this formula for I
gives typical current. For the worst case I
BOOST
, increase the current by 40%. In that case, the worst case
BOOST
boost current will be:
I
BOOST-MAX
= 1.4 × I
BOOST
(10)
R3 will then be given by:
R3 = (VIN- V
For example, using the X-version let VIN= 10 V, V
ZENER
) / (1.4 × I
BOOST
+ I
) (11)
ZENER
= 5 V, VD2= 0.7 V, I
ZENER
= 1 mA, and duty cycle D =
ZENER
50%. Then:
I
= 0.56 × (0.5 + 0.54) × (5 - 0.7) mA = 2.5 mA (12)
BOOST
R3 = (10 V - 5 V) / (1.4 × 2.5 mA + 1 mA) = 1.11 k (13)
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