Texas Instruments LM2727MTC, LM2737MTC Schematic [ru]

LM27x7

HG

BOOT

I

SEN

LG

PGND

FB

V

CC

SD

PWGD

FREQ

SS

SGND

EAO

PGND

+5V

VIN = 3.3V

VO = 1.2V@5A

CO1,2

2200PF

6.3V, 2.8A

1.5 PH

6.1 A, 9.6 m:

R

FB2

C

C2

R

C1

R

CS

C

SS

R

FADJ

R

IN

C

IN

D1

C

BOOT

Q1

Q2

10PF

6.3V

10k

2.2k

10k

392k

2.2p

180p

12n

63.4k

2.2PF

10:

0.1P
CIN1,2

L1

+

C

C1

R

FB1

Si4884DY

Si4884DY

LM2727, LM2737

www.ti.com

SNVS205D –AUGUST 2002–REVISED MARCH 2013

LM2727/LM2737 N-Channel FET Synchronous Buck Regulator Controller for Low Output

Voltages

Check for Samples: LM2727, LM2737

1

FEATURES

2

• Input Power from 2.2V to 16V

• Output Voltage Adjustable Down to 0.6V

• Power Good flag, Adjustable Soft-Start and
Output Enable for Easy Power Sequencing

• Output Over-Voltage and Under-Voltage Latch­Off (LM2727)

• Output Over-Voltage and Under-Voltage Flag
(LM2737)

• Reference Accuracy: 1.5% (0°C - 125°C)

• Current Limit Without Sense Resistor

• Soft Start

• Switching Frequency from 50 kHz to 2 MHz adjusting the value of an external resistor. Current

• TSSOP-14 Package

APPLICATIONS

• Cable Modems

• Set-Top Boxes/ Home Gateways

• DDR Core Power

• High-Efficiency Distributed Power

• Local Regulation of Core Power

DESCRIPTION

The LM2727 and LM2737 are high-speed,
synchronous, switching regulator controllers. They
are intended to control currents of 0.7A to 20A with
up to 95% conversion efficiencies. The LM2727
employs output over-voltage and under-voltage latch­off. For applications where latch-off is not desired, the
LM2737 can be used. Power up and down
sequencing is achieved with the power-good flag,
adjustable soft-start and output enable features. The
LM2737 and LM2737 operate from a low-current 5V
bias and can convert from a 2.2V to 16V power rail.
Both parts utilize a fixed-frequency, voltage-mode,
PWM control architecture and the switching
frequency is adjustable from 50kHz to 2MHz by

limit is achieved by monitoring the voltage drop
across the on-resistance of the low-side MOSFET,
which enhances low duty-cycle operation. The wide
range of operating frequencies gives the power
supply designer the flexibility to fine-tune component
size, cost, noise and efficiency. The adaptive, non­overlapping MOSFET gate-drivers and high-side
bootstrap structure helps to further maximize
efficiency. The high-side power FET drain voltage can
be from 2.2V to 16V and the output voltage is
adjustable down to 0.6V.

Typical Application

1

2All trademarks are the property of their respective owners.

PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

Copyright © 2002–2013, Texas Instruments Incorporated

LM27x7

HG

BOOT

ISEN

LG
PGND

FB

Vcc

SD

PWGD

FREQ

SS

SGND

EAO

PGND

1
2
3
4
5
6
7 8

9

10

11

12

13

14

LM2727, LM2737

SNVS205D –AUGUST 2002–REVISED MARCH 2013

www.ti.com

Connection Diagram

Figure 1. 14-Lead Plastic TSSOP

θ

= 155°C/W

See Package Number PW0014A

BOOT (Pin 1) - Supply rail for the N-channel MOSFET gate drive. The voltage should be at least one gate threshold above the regulator

input voltage to properly turn on the high-side N-FET.

LG (Pin 2) - Gate drive for the low-side N-channel MOSFET. This signal is interlocked with HG to avoid shoot-through problems.
PGND (Pins 3, 13) - Ground for FET drive circuitry. It should be connected to system ground.
SGND (Pin 4) - Ground for signal level circuitry. It should be connected to system ground.
VCC(Pin 5) - Supply rail for the controller.
PWGD (Pin 6) - Power Good. This is an open drain output. The pin is pulled low when the chip is in UVP, OVP, or UVLO mode. During

normal operation, this pin is connected to VCCor other voltage source through a pull-up resistor.
ISEN (Pin 7) - Current limit threshold setting. This sources a fixed 50µA current. A resistor of appropriate value should be connected

between this pin and the drain of the low-side FET.
EAO (Pin 8) - Output of the error amplifier. The voltage level on this pin is compared with an internally generated ramp signal to determine

the duty cycle. This pin is necessary for compensating the control loop.
SS (Pin 9) - Soft start pin. A capacitor connected between this pin and ground sets the speed at which the output voltage ramps up. Larger

capacitor value results in slower output voltage ramp but also lower inrush current.
FB (Pin 10) - This is the inverting input of the error amplifier, which is used for sensing the output voltage and compensating the control

loop.

FREQ (Pin 11) - The switching frequency is set by connecting a resistor between this pin and ground.
SD (Pin 12) - IC Logic Shutdown. When this pin is pulled low the chip turns off the high side switch and turns on the low side switch. While

this pin is low, the IC will not start up. An internal 20µA pull-up connects this pin to VCC.

HG (Pin 14) - Gate drive for the high-side N-channel MOSFET. This signal is interlocked with LG to avoid shoot-through problems.

JA

PIN DESCRIPTION

2 Submit Documentation Feedback Copyright © 2002–2013, Texas Instruments Incorporated

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.

Product Folder Links: LM2727 LM2737

LM2727, LM2737

www.ti.com

Absolute Maximum Ratings

V

CC

(1)(2)

SNVS205D –AUGUST 2002–REVISED MARCH 2013

BOOTV 21V
Junction Temperature 150°C
Storage Temperature −65°C to 150°C
Soldering Information
Lead Temperature (soldering, 10sec) 260°C
Infrared or Convection (20sec) 235°C
ESD Rating

(3)

2 kV

(1) Absolute maximum ratings indicate limits beyond which damage to the device may occur. Operating ratings indicate conditions for

which the device operates correctly. Opearting Ratings do not imply ensured performance limits.

(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and

specifications.

(3) The human body model is a 100pF capacitor discharged through a 1.5k resistor into each pin.

Operating Ratings

Supply Voltage (VCC) 4.5V to 5.5V
Junction Temperature Range −40°C to +125°C
Thermal Resistance (θJA) 155°C/W

Electrical Characteristics

VCC= 5V unless otherwise indicated. Typicals and limits appearing in plain type apply for TA=TJ=+25°C. Limits appearing in
boldface type apply over full Operating Temperature Range. Datasheet min/max specification limits are ensured by design,
test, or statistical analysis.

Symbol Parameter Conditions Min Typ Max Units

VCC= 4.5V, 0°C to +125°C 0.591 0.6 0.609
VCC= 5V, 0°C to +125°C 0.591 0.6 0.609

V

FB_ADJ

V

I

Q-V5

t

PWGD1

t

PWGD2

I

I

SS-ON

I

SS-OC

I

SEN-TH

SD

ON

FB Pin Voltage V

UVLO Thresholds Rising 4.2

Operating VCCCurrent mA

Shutdown VCCCurrent SD = 0V 0.15 0.4 0.7 mA
PWGD Pin Response Time FB Voltage Going Up 6 µs
PWGD Pin Response Time FB Voltage Going Down 6 µs
SD Pin Internal Pull-up Current 20 µA
SS Pin Source Current SS Voltage = 2.5V

SS Pin Sink Current During Over SS Voltage = 2.5V
Current

I

Pin Source Current Trip Point 0°C to +125°C 35 50 65

SEN

VCC= 5.5V, 0°C to +125°C 0.591 0.6 0.609
VCC= 4.5V, −40°C to +125°C 0.589 0.6 0.609
VCC= 5V, −40°C to +125°C 0.589 0.6 0.609
VCC= 5.5V, −40°C to +125°C 0.589 0.6 0.609

Falling 3.6
SD = 5V, FB = 0.55V

Fsw = 600kHz
SD = 5V, FB = 0.65V

Fsw = 600kHz

1 1.5 2

0.8 1.7 2.2

0°C to +125°C 8 11 15 µA

-40°C to +125°C 5 11 15
95 µA

-40°C to +125°C 28 50 65

µA

V

7V

Copyright © 2002–2013, Texas Instruments Incorporated Submit Documentation Feedback 3

Product Folder Links: LM2727 LM2737

LM2727, LM2737

SNVS205D –AUGUST 2002–REVISED MARCH 2013

www.ti.com

Electrical Characteristics (continued)

VCC= 5V unless otherwise indicated. Typicals and limits appearing in plain type apply for TA=TJ=+25°C. Limits appearing in
boldface type apply over full Operating Temperature Range. Datasheet min/max specification limits are ensured by design,
test, or statistical analysis.

Symbol Parameter Conditions Min Typ Max Units

ERROR AMPLIFIER

GBW Error Amplifier Unity Gain

Bandwidth

G Error Amplifier DC Gain 60 dB

SR Error Amplifier Slew Rate 6 V/µA

I

I

EAO

V

FB

EA

FB Pin Bias Current FB = 0.55V 0 15 100

FB = 0.65V 0 30 155

EAO Pin Current Sourcing and V
Sinking V

= 2.5, FB = 0.55V 2.8

EAO

= 2.5, FB = 0.65V 0.8

EAO

Error Amplifier Maximum Swing Minimum 1.2

Maximum 3.2

GATE DRIVE

I

Q-BOOT

BOOT Pin Quiescent Current BOOTV = 12V, EN = 0

0°C to +125°C 95 160 µA

-40°C to +125°C 95 215

R

DS1

R

DS2

R

DS3

R

DS4

Top FET Driver Pull-Up ON
resistance

Top FET Driver Pull-Down ON
resistance

Bottom FET Driver Pull-Up ON
resistance

Bottom FET Driver Pull-Down ON
resistance

BOOT-SW = 5V@350mA 3 Ω

BOOT-SW = 5V@350mA 2 Ω

BOOT-SW = 5V@350mA 3 Ω

BOOT-SW = 5V@350mA 2 Ω

OSCILLATOR

R

= 590kΩ 50

FADJ

R

= 88.7kΩ 300

FADJ

R

= 42.2kΩ, 0°C to +125°C 500 600 700

f

OSC

PWM Frequency kHz

D Max Duty Cycle f

FADJ

R

= 42.2kΩ, -40°C to +125°C 490 600 700

FADJ

R

= 17.4kΩ 1400

FADJ

R

= 11.3kΩ 2000

FADJ

= 300kHz 90 %

PWM

f

= 600kHz 88

PWM

LOGIC INPUTS AND OUTPUTS

V

SD-IH

V

SD-IL

V

PWGD-TH-LO

SD Pin Logic High Trip Point 2.6 3.5 V
SD Pin Logic Low Trip Point 0°C to +125°C 1.3 1.6

-40°C to +125°C 1.25 1.6

PWGD Pin Trip Points FB Voltage Going Down

0°C to +125°C 0.413 0.430 0.446 V

-40°C to +125°C 0.410 0.430 0.446

V

PWGD-TH-HI

PWGD Pin Trip Points FB Voltage Going Up

0°C to +125°C 0.691 0.710 0.734 V

-40°C to +125°C 0.688 0.710 0.734

V

PWGD-HYS

PWGD Hysteresis (LM2737 only) FB Voltage Going Down FB Voltage 35

Going Up 110

5 MHz

nA

mA

V

V

mV

4 Submit Documentation Feedback Copyright © 2002–2013, Texas Instruments Incorporated

Product Folder Links: LM2727 LM2737

PWM FREQUENCY (kHz)

612

614

616

618

620

622

624

626

628

630

AMBIENT TEMPERATURE (oC)

0

10

20

25

35

45

55

65

75

85

95

105

115

125

7

7.2

7.4

7.6

7.8

8

8.2

8.4

8.6

BOOT PIN CURRENT (mA)

AMBIENT TEMPERATURE (oC)

0

10

20

25

35

45

55

65

75

85

95

105

115

125

AMBIENT TEMPERATURE (oC)

OPEARTING CURRENT(mA)

0 20

35

55

75

95

115

Without

Bootstrap

(V

boot

= 12V)

With

Bootstrap

(V

boot

= 5V)

1.46

1.48

1.5

1.52

1.54

1.56

1.58

1.6

1.62

1.64

BOOT PIN CURRENT (mA)

28.9

29.1

29.3

29.5

29.7

29.9

30.1

30.3

AMBIENT TEMPERATURE (oC)

0 10

20

25

35

45

55

65

75

85

95

105

115

125

20

30

40

50

60

70

80

90

100

0.2

1

3 5

7

9

OUTPUT CURRENT (A)

EFFICIENCY (%)

Vin = 5V

Vin = 12V

Vin = 3.3V

30

40

50

60

70

80

90

100

0.1 0.5

2

4

6

8

10

Vin = 5V

Vin = 12V

OUTPUT CURRENT (A)

EFFICIENCY (%)

LM2727, LM2737

www.ti.com

SNVS205D –AUGUST 2002–REVISED MARCH 2013

Typical Performance Characteristics

Efficiency (VO= 1.5V) Efficiency (VO= 3.3V)

FSW= 300kHz, TA= 25°C FSW= 300kHz, TA= 25°C

Figure 2. Figure 3.

VCCOperating Current Bootpin Current

FSW= 600kHz, No-Load FSW= 600kHz, Si4826DY FET, No-Load

vs vs

Temperature Temperature for BOOTV = 12V

Figure 4. Figure 5.

Bootpin Current PWM Frequency

vs vs

= 43.2kΩ

FADJ

Figure 6. Figure 7.

Temperature with 5V Bootstrap Temperature

FSW= 600kHz, Si4826DY FET, No-Load for R

Copyright © 2002–2013, Texas Instruments Incorporated Submit Documentation Feedback 5

Product Folder Links: LM2727 LM2737

V

CC

PLUS BOOT CURRENT

0

5

10

15

20

25

30

35

40

100300 500 700 90011001300150017001900

PWM FREQUENCY (kHz)

10

15

20

25

30

900

1000

11001200

1300

1400

1500

1600

1700

1800

1900

PWM FREQUENCY (kHz)

RF-ADJ (k:)

PWM FREQUENCY (kHz)

RF-ADJ (k:)

0

100

200

300

400

500

100 150

200

250

300350400

450

500600

700

800

LM2727, LM2737

SNVS205D –AUGUST 2002–REVISED MARCH 2013

Typical Performance Characteristics (continued)

R

FADJ

vs vs

(in 100 to 800kHz range), TA= 25°C (in 900 to 2000kHz range), TA= 25°C

VCCOperating Current Plus Boot Current vs IO= 3A, CSS= 10nF

PWM Frequency (Si4826DY FET, TA= 25°C) FSW= 600kHz

PWM Frequency PWM Frequency

Figure 8. Figure 9.

R

FADJ

Switch Waveforms (HG Falling)

VIN= 5V, VO= 1.8V

www.ti.com

6 Submit Documentation Feedback Copyright © 2002–2013, Texas Instruments Incorporated

Figure 10. Figure 11.

Switch Waveforms (HG Rising) Start-Up (No-Load)

VIN= 5V, VO= 1.8V VIN= 10V, VO= 1.2V

IO= 3A, FSW= 600kHz CSS= 10nF, FSW= 300kHz

Figure 12. Figure 13.

Product Folder Links: LM2727 LM2737

LM2727, LM2737

www.ti.com

SNVS205D –AUGUST 2002–REVISED MARCH 2013

Typical Performance Characteristics (continued)

Start-Up (Full-Load)
VIN= 10V, VO= 1.2V Start Up (No-Load, 10x CSS)

IO= 10A, CSS= 10nF VIN= 10V, VO= 1.2V

FSW= 300kHz CSS= 100nF, FSW= 300kHz

Figure 14. Figure 15.

Start Up (Full Load, 10x CSS) Shutdown

VIN= 10V, VO= 1.2V VIN= 10V, VO= 1.2V

IO= 10A, CSS= 100nF IO= 10A, CSS= 10nF

FSW= 300kHz FSW= 300kHz

Figure 16. Figure 17.

Start Up (Full Load, 10x CSS)

VIN= 10V, VO= 1.2V Load Transient Response (IO= 0 to 4A)

IO= 10A, CSS= 100nF VIN= 12V, VO= 1.2V

FSW= 300kHz FSW= 300kHz

Figure 18. Figure 19.

Copyright © 2002–2013, Texas Instruments Incorporated Submit Documentation Feedback 7

Product Folder Links: LM2727 LM2737

LM2727, LM2737

SNVS205D –AUGUST 2002–REVISED MARCH 2013

Typical Performance Characteristics (continued)

Load Transient Response (IO= 4 to 0A) Line Transient Response (VIN=5V to 12V)

Line Transient Response (VIN=12V to 5V) Line Transient Response

VIN= 12V, VO= 1.2V VO= 1.2V, IO= 5A

FSW= 300kHz FSW= 300kHz

Figure 20. Figure 21.

VO= 1.2V, IO= 5A VO= 1.2V, IO= 5A

FSW= 300kHz FSW= 300kHz

www.ti.com

Figure 22. Figure 23.

8 Submit Documentation Feedback Copyright © 2002–2013, Texas Instruments Incorporated

Product Folder Links: LM2727 LM2737

BG =

0.6V

50PA

10PA

OUTPUT CLAMP

HI: 3.25V

LO: 1.25V

3.25V

1.25V

SYNCHRONOUS

DRIVER LOGIC

10Ps

DELAY

0.708V
tol.=+/-2%

0.42V
tol.=+/-2%
hyst.=12%

SHUT

DOWN

LATCH

CLOCK &

RAMP

LOGIC

S

R

R>S

off

oc

UVLO

SD

FREQ

Vcc PGND SGND

FB

EAO

BOOT

HG

LG

ISEN

PWGD

SS

PGND

95P$

oc

off

off

20PA

EA

HIGH LOW

PWM

ILIM

3.05V

SS

CMP

LM2727, LM2737

www.ti.com

SNVS205D –AUGUST 2002–REVISED MARCH 2013

Block Diagram

Copyright © 2002–2013, Texas Instruments Incorporated Submit Documentation Feedback 9

Product Folder Links: LM2727 LM2737

LM2727, LM2737

SNVS205D –AUGUST 2002–REVISED MARCH 2013

www.ti.com

APPLICATION INFORMATION

THEORY OF OPERATION

The LM2727 is a voltage-mode, high-speed synchronous buck regulator with a PWM control scheme. It is
designed for use in set-top boxes, thin clients, DSL/Cable modems, and other applications that require high
efficiency buck converters. It has power good (PWRGD), output shutdown (SD), over voltage protection (OVP)
and under voltage protection (UVP). The over-voltage and under-voltage signals are OR gated to drive the
Power Good signal and a shutdown latch, which turns off the high side gate and turns on the low side gate if
pulled low. Current limit is achieved by sensing the voltage VDSacross the low side FET. During current limit the
high side gate is turned off and the low side gate turned on. The soft start capacitor is discharged by a 95µA
source (reducing the maximum duty cycle) until the current is under control. The LM2737 does not latch off
during UVP or OVP, and uses the HIGH and LOW comparators for the powergood function only.

START UP

When VCCexceeds 4.2V and the enable pin EN sees a logic high the soft start capacitor begins charging through
an internal fixed 10µA source. During this time the output of the error amplifier is allowed to rise with the voltage
of the soft start capacitor. This capacitor, Css, determines soft start time, and can be determined approximately
by:

(1)

An application for a microprocessor might need a delay of 3ms, in which case CSSwould be 12nF. For a different
device, a 100ms delay might be more appropriate, in which case CSSwould be 400nF. (390 10%) During soft
start the PWRGD flag is forced low and is released when the voltage reaches a set value. At this point this chip
enters normal operation mode, the Power Good flag is released, and the OVP and UVP functions begin to
monitor Vo.

NORMAL OPERATION

While in normal operation mode, the LM2727/37 regulates the output voltage by controlling the duty cycle of the
high side and low side FETs. The equation governing output voltage is:

(2)

The PWM frequency is adjustable between 50kHz and 2MHz and is set by an external resistor, R

, between

FADJ

the FREQ pin and ground. The resistance needed for a desired frequency is approximately:

(3)

MOSFET GATE DRIVERS

The LM2727/37 has two gate drivers designed for driving N-channel MOSFETs in a synchronous mode. Power
for the drivers is supplied through the BOOTV pin. For the high side gate (HG) to fully turn on the top FET, the
BOOTV voltage must be at least one V
a separate, higher voltage source, or supplied from a local charge pump structure. In a system such as a
desktop computer, both 5V and 12V are usually available. Hence if Vin was 5V, the 12V supply could be used for
BOOTV. 12V is more than 2*Vin, so the HG would operate correctly. For a BOOTV of 12V, the initial gate
charging current is 2A, and the initial gate discharging current is typically 6A.

greater than Vin. (BOOTV ≥ 2*Vin) This voltage can be supplied by

GS(th)

10 Submit Documentation Feedback Copyright © 2002–2013, Texas Instruments Incorporated

Product Folder Links: LM2727 LM2737

LM27x7

BOOTV

HG

LG

+

+

5V

Vo

Cb

LM2727, LM2737

www.ti.com

SNVS205D –AUGUST 2002–REVISED MARCH 2013

Figure 24. BOOTV Supplied by Charge Pump

In a system without a separate, higher voltage, a charge pump (bootstrap) can be built using a diode and small
capacitor, Figure 24. The capacitor serves to maintain enough voltage between the top FET gate and source to
control the device even when the top FET is on and its source has risen up to the input voltage level.

The LM2727/37 gate drives use a BiCMOS design. Unlike some other bipolar control ICs, the gate drivers have
rail-to-rail swing, ensuring no spurious turn-on due to capacitive coupling.

POWER GOOD SIGNAL

The power good signal is the or-gated flag representing over-voltage and under-voltage protection. If the output
voltage is 18% over it's nominal value, VFB= 0.7V, or falls 30% below that value, VFB= 0.41V, the power good
flag goes low. The converter then turns off the high side gate, and turns on the low side gate. Unlike the output
(LM2727 only) the power good flag is not latched off. It will return to a logic high whenever the feedback pin
voltage is between 70% and 118% of 0.6V.

UVLO

The 4.2V turn-on threshold on VCChas a built in hysteresis of 0.6V. Therefore, if VCCdrops below 3.6V, the chip
enters UVLO mode. UVLO consists of turning off the top FET, turning on the bottom FET, and remaining in that
condition until VCCrises above 4.2V. As with shutdown, the soft start capacitor is discharged through a FET,
ensuring that the next start-up will be smooth.

CURRENT LIMIT

Current limit is realized by sensing the voltage across the low side FET while it is on. The R
known value, hence the current through the FET can be determined as:

VDS= I * R

DSON

The current limit is determined by an external resistor, RCS, connected between the switch node and the ISEN
pin. A constant current of 50µA is forced through Rcs, causing a fixed voltage drop. This fixed voltage is
compared against VDSand if the latter is higher, the current limit of the chip has been reached. RCScan be found
by using the following:

RCS= R

For example, a conservative 15A current limit in a 10A design with a minimum R

DSON

(LOW) * I

/50µA (5)

LIM

of 10mΩ would require a

DSON

3.3kΩ resistor. Because current sensing is done across the low side FET, no minimum high side on-time is
necessary. In the current limit mode the LM2727/37 will turn the high side off and the keep low side on for as
long as necessary. The chip also discharges the soft start capacitor through a fixed 95µA source. In this way,
smooth ramping up of the output voltage as with a normal soft start is ensured. The output of the LM2727/37
internal error amplifier is limited by the voltage on the soft start capacitor. Hence, discharging the soft start
capacitor reduces the maximum duty cycle D of the controller. During severe current limit, this reduction in duty
cycle will reduce the output voltage, if the current limit conditions lasts for an extended time.

During the first few nanoseconds after the low side gate turns on, the low side FET body diode conducts. This
causes an additional 0.7V drop in VDS. The range of VDSis normally much lower. For example, if R
10mΩ and the current through the FET was 10A, VDSwould be 0.1V. The current limit would see 0.7V as a 70A
current and enter current limit immediately. Hence current limit is masked during the time it takes for the high
side switch to turn off and the low side switch to turn on.

Copyright © 2002–2013, Texas Instruments Incorporated Submit Documentation Feedback 11

Product Folder Links: LM2727 LM2737

of the FET is a

DSON

DSON

(4)

were

LM2727, LM2737

SNVS205D –AUGUST 2002–REVISED MARCH 2013

www.ti.com

UVP/OVP

The output undervoltage protection and overvoltage protection mechanisms engage at 70% and 118% of the
target output voltage, respectively. In either case, the LM2727 will turn off the high side switch and turn on the
low side switch, and discharge the soft start capacitor through a MOSFET switch. The chip remains in this state
until the shutdown pin has been pulled to a logic low and then released. The UVP function is masked only during
the first charging of the soft start capacitor, when voltage is first applied to the VCCpin. In contrast, the LM2737 is
designed to continue operating during UVP or OVP conditions, and to resume normal operation once the fault
condition is cleared. As with the LM2727, the powergood flag goes low during this time, giving a logic-level
warning signal.

SHUT DOWN

If the shutdown pin SD is pulled low, the LM2727/37 discharges the soft start capacitor through a MOSFET
switch. The high side switch is turned off and the low side switch is turned on. The LM2727/37 remains in this
state until SD is released.

DESIGN CONSIDERATIONS

The following is a design procedure for all the components needed to create the circuit shown in Figure 26 in the
Example Circuits section, a 5V in to 1.2V out converter, capable of delivering 10A with an efficiency of 85%. The
switching frequency is 300kHz. The same procedures can be followed to create the circuit shown in Figure 26,

Figure 27, and to create many other designs with varying input voltages, output voltages, and output currents.

INPUT CAPACITOR

The input capacitors in a Buck switching converter are subjected to high stress due to the input current
waveform, which is a square wave. Hence input caps are selected for their ripple current capability and their
ability to withstand the heat generated as that ripple current runs through their ESR. Input rms ripple current is
approximately:

(6)

The power dissipated by each input capacitor is:

(7)

Here, n is the number of capacitors, and indicates that power loss in each cap decreases rapidly as the number
of input caps increase. The worst-case ripple for a Buck converter occurs during full load, when the duty cycle D
= 50%.

In the 5V to 1.2V case, D = 1.2/5 = 0.24. With a 10A maximum load the ripple current is 4.3A. The Sanyo
10MV5600AX aluminum electrolytic capacitor has a ripple current rating of 2.35A, up to 105°C. Two such
capacitors make a conservative design that allows for unequal current sharing between individual caps. Each
capacitor has a maximum ESR of 18mΩ at 100 kHz. Power loss in each device is then 0.05W, and total loss is

0.1W. Other possibilities for input and output capacitors include MLCC, tantalum, OSCON, SP, and POSCAPS.

INPUT INDUCTOR

The input inductor serves two basic purposes. First, in high power applications, the input inductor helps insulate
the input power supply from switching noise. This is especially important if other switching converters draw
current from the same supply. Noise at high frequency, such as that developed by the LM2727 at 1MHz
operation, could pass through the input stage of a slower converter, contaminating and possibly interfering with
its operation.

An input inductor also helps shield the LM2727 from high frequency noise generated by other switching
converters. The second purpose of the input inductor is to limit the input current slew rate. During a change from
no-load to full-load, the input inductor sees the highest voltage change across it, equal to the full load current
times the input capacitor ESR. This value divided by the maximum allowable input current slew rate gives the
minimum input inductance:

12 Submit Documentation Feedback Copyright © 2002–2013, Texas Instruments Incorporated

Product Folder Links: LM2727 LM2737

LM2727, LM2737

www.ti.com

SNVS205D –AUGUST 2002–REVISED MARCH 2013

(8)

In the case of a desktop computer system, the input current slew rate is the system power supply or "silver box"
output current slew rate, which is typically about 0.1A/µs. Total input capacitor ESR is 9mΩ, hence ΔV is
10*0.009 = 90 mV, and the minimum inductance required is 0.9µH. The input inductor should be rated to handle
the DC input current, which is approximated by:

(9)

In this case I

is about 2.8A. One possible choice is the TDK SLF12575T-1R2N8R2, a 1.2µH device that can

IN-DC

handle 8.2Arms, and has a DCR of 7mΩ.

OUTPUT INDUCTOR

The output inductor forms the first half of the power stage in a Buck converter. It is responsible for smoothing the
square wave created by the switching action and for controlling the output current ripple. (ΔIo) The inductance is
chosen by selecting between tradeoffs in efficiency and response time. The smaller the output inductor, the more
quickly the converter can respond to transients in the load current. As shown in the efficiency calculations,
however, a smaller inductor requires a higher switching frequency to maintain the same level of output current
ripple. An increase in frequency can mean increasing loss in the FETs due to the charging and discharging of the
gates. Generally the switching frequency is chosen so that conduction loss outweighs switching loss. The
equation for output inductor selection is:

(10)

Plugging in the values for output current ripple, input voltage, output voltage, switching frequency, and assuming
a 40% peak-to-peak output current ripple yields an inductance of 1.5µH. The output inductor must be rated to
handle the peak current (also equal to the peak switch current), which is (Io + 0.5*ΔIo). This is 12A for a 10A
design. The Coilcraft D05022-152HC is 1.5µH, is rated to 15Arms, and has a DCR of 4mΩ.

OUTPUT CAPACITOR

The output capacitor forms the second half of the power stage of a Buck switching converter. It is used to control
the output voltage ripple (ΔVo) and to supply load current during fast load transients.

In this example the output current is 10A and the expected type of capacitor is an aluminum electrolytic, as with
the input capacitors. (Other possibilities include ceramic, tantalum, and solid electrolyte capacitors, however the
ceramic type often do not have the large capacitance needed to supply current for load transients, and tantalums
tend to be more expensive than aluminum electrolytic.) Aluminum capacitors tend to have very high capacitance
and fairly low ESR, meaning that the ESR zero, which affects system stability, will be much lower than the
switching frequency. The large capacitance means that at switching frequency, the ESR is dominant, hence the
type and number of output capacitors is selected on the basis of ESR. One simple formula to find the maximum
ESR based on the desired output voltage ripple, ΔVoand the designed output current ripple, ΔIo, is:

(11)

In this example, in order to maintain a 2% peak-to-peak output voltage ripple and a 40% peak-to-peak inductor
current ripple, the required maximum ESR is 6mΩ. Three Sanyo 10MV5600AX capacitors in parallel will give an
equivalent ESR of 6mΩ. The total bulk capacitance of 16.8mF is enough to supply even severe load transients.
Using the same capacitors for both input and output also keeps the bill of materials simple.

Copyright © 2002–2013, Texas Instruments Incorporated Submit Documentation Feedback 13

Product Folder Links: LM2727 LM2737

LM2727, LM2737

SNVS205D –AUGUST 2002–REVISED MARCH 2013

www.ti.com

MOSFETS

MOSFETS are a critical part of any switching controller and have a direct impact on the system efficiency. In this
case the target efficiency is 85% and this is the variable that will determine which devices are acceptable. Loss
from the capacitors, inductors, and the LM2727 itself are detailed in the Efficiency section, and come to about

0.54W. To meet the target efficiency, this leaves 1.45W for the FET conduction loss, gate charging loss, and
switching loss. Switching loss is particularly difficult to estimate because it depends on many factors. When the
load current is more than about 1 or 2 amps, conduction losses outweigh the switching and gate charging losses.
This allows FET selection based on the R

of the FET. Adding the FET switching and gate-charging losses to

DSON

the equation leaves 1.2W for conduction losses. The equation for conduction loss is:

= D(I

2

* R

o

DSON

*k) + (1-D)(I

P

Cnd

The factor k is a constant which is added to account for the increasing R

1.3. The Si4442DY has a typical R

2

* R

o

DSON

*k) (12)

DSON

DSON

of 4.1mΩ. When plugged into the equation for P

of a FET due to heating. Here, k =

the result is a loss of

CND

0.533W. If this design were for a 5V to 2.5V circuit, an equal number of FETs on the high and low sides would be
the best solution. With the duty cycle D = 0.24, it becomes apparent that the low side FET carries the load
current 76% of the time. Adding a second FET in parallel to the bottom FET could improve the efficiency by
lowering the effective R

. The lower the duty cycle, the more effective a second or even third FET can be. For

DSON

a minimal increase in gate charging loss (0.054W) the decrease in conduction loss is 0.15W. What was an 85%
design improves to 86% for the added cost of one SO-8 MOSFET.

CONTROL LOOP COMPONENTS

The circuit is this design example and the others shown in the Example Circuits section have been compensated
to improve their DC gain and bandwidth. The result of this compensation is better line and load transient
responses. For the LM2727, the top feedback divider resistor, Rfb2, is also a part of the compensation. For the
10A, 5V to 1.2V design, the values are:

Cc1 = 4.7pF 10%, Cc2 = 1nF 10%, Rc = 229kΩ 1%. These values give a phase margin of 63° and a bandwidth
of 29.3kHz.

SUPPORT CAPACITORS AND RESISTORS

The Cinx capacitors are high frequency bypass devices, designed to filter harmonics of the switching frequency
and input noise. Two 1µF ceramic capacitors with a sufficient voltage rating (10V for the Circuit of Figure 26) will
work well in almost any case.

Rbypass and Cbypass are standard filter components designed to ensure smooth DC voltage for the chip supply
and for the bootstrap structure, if it is used. Use 10Ω for the resistor and a 2.2µF ceramic for the cap. Cb is the
bootstrap capacitor, and should be 0.1µF. (In the case of a separate, higher supply to the BOOTV pin, this 0.1µF
cap can be used to bypass the supply.) Using a Schottky device for the bootstrap diode allows the minimum drop
for both high and low side drivers. The On Semiconductor BAT54 or MBR0520 work well.

Rp is a standard pull-up resistor for the open-drain power good signal, and should be 10kΩ. If this feature is not
necessary, it can be omitted.

RCSis the resistor used to set the current limit. Since the design calls for a peak current magnitude (Io + 0.5 *
ΔIo) of 12A, a safe setting would be 15A. (This is well below the saturation current of the output inductor, which is
25A.) Following the equation from the Current Limit section, use a 3.3kΩ resistor.

R

is used to set the switching frequency of the chip. Following the equation in the Theory of Operation

FADJ

section, the closest 1% tolerance resistor to obtain fSW= 300kHz is 88.7kΩ.
CSSdepends on the users requirements. Based on the equation for CSSin the Theory of Operation section, for a

3ms delay, a 12nF capacitor will suffice.

14 Submit Documentation Feedback Copyright © 2002–2013, Texas Instruments Incorporated

Product Folder Links: LM2727 LM2737

LM2727, LM2737

www.ti.com

SNVS205D –AUGUST 2002–REVISED MARCH 2013

EFFICIENCY CALCULATIONS

A reasonable estimation of the efficiency of a switching controller can be obtained by adding together the loss is
each current carrying element and using the equation:

(13)

The following shows an efficiency calculation to complement the Circuit of Figure 26. Output power for this circuit
is 1.2V x 10A = 12W.

Chip Operating Loss

Q-V

*V

CC

CC

PIQ= I

2mA x 5V = 0.01W

FET Gate Charging Loss

PGC= n * VCC* QGS* f

OSC

The value n is the total number of FETs used. The Si4442DY has a typical total gate charge, QGS, of 36nC and
an r

of 4.1mΩ. For a single FET on top and bottom: 2*5*36E-9*300,000 = 0.108W

ds-on

FET Switching Loss

PSW= 0.5 * Vin* IO* (tr+ tf)* f

OSC

The Si4442DY has a typical rise time trand fall time tfof 11 and 47ns, respectively. 0.5*5*10*58E-9*300,000 =

0.435W

FET Conduction Loss

PCn= 0.533W (17)

Input Capacitor Loss

(14)

(15)

(16)

4.282*0.018/2 = 0.084W

Input Inductor Loss

2

P

= I

Lin

* DCR

in

input-L

2.822*0.007 = 0.055W

Output Inductor Loss

2

P

= I

Lout

* DCR

o

output-L

102*0.004 = 0.4W

System Efficiency

(18)
(19)

(20)

(21)

(22)

(23)

Copyright © 2002–2013, Texas Instruments Incorporated Submit Documentation Feedback 15

Product Folder Links: LM2727 LM2737

LM27x7

HG

BOOT

ISEN

LG

PGND

FB

Vcc

SD

PWGD

FREQ

SS

SGND

EAO

PGND

+

+

Vin = 5V

Vo = 1.2V@10A

3 x 5600 uF
10V, 3.1A
18 m:

1.5 uH

15 A, 4 m:

Rfb2

Rfb1

Cc1

Cc2 Rc1

Rcs

Css

Rfadj

Rin

Cin

D1

Cboot

Q1

Q2

1.2 uH

8.2 A, 6.9 m:

0.1u

1.5k

10

2.2u

88.7k

12n

270p

4.7p

229k

4.99k

4.99k

Co1-3

Lin

L1

2 x 5600uF
10V, 2.35A

Cin1,2

2x1uF
10V

Cinx1, 2

LM27x7

HG

BOOT

ISEN

LG

PGND

FB

Vcc

SD

PWGD

FREQ

SS

SGND

EAO

PGND

+

+

+5V

Vin = 12V

Vo = 3.3V@10A

2 x 10 uF
25V, 3.3A

4 x 100 uF
10V, 55 m:

2.7 uH

14.4 A, 4.5 m:

Rfb2

Rfb1

Cc1

Cc2 Rc1

Rcs

Css

Rfadj

Rin

Cin

D1

Cboot

Q1

Q2

1uF
25V

1.2 uH

8.2 A, 6.9 m:

Rc2 Cc3

0.1u

1.8k

10

2.2u

88.7k

12n

270p

6.8p

143.3k

8.45k 470p

11k

49.9k

Cin1,2

Cinx

Co1-4

Lin

L1

LM2727, LM2737

SNVS205D –AUGUST 2002–REVISED MARCH 2013

www.ti.com

Example Circuits

Figure 25. 5V-16V to 3.3V, 10A, 300kHz

This circuit and the one featured on the front page have been designed to deliver high current and high efficiency
in a small package, both in area and in height The tallest component in this circuit is the inductor L1, which is
6mm tall. The compensation has been designed to tolerate input voltages from 5 to 16V.

Figure 26. 5V to 1.2V, 10A, 300kHz

This circuit design, detailed in the Design Considerations section, uses inexpensive aluminum capacitors and off­the-shelf inductors. It can deliver 10A at better than 85% efficiency. Large bulk capacitance on input and output
ensure stable operation.

16 Submit Documentation Feedback Copyright © 2002–2013, Texas Instruments Incorporated

Product Folder Links: LM2727 LM2737

HG

BOOT

ISEN

LG

PGND

FB

Vcc

SD

PWGD

FREQ

SS

SGND

EAO

PGND

+

+

+5V

Vin = 3.3V

Vo = 0.8V@5A

1 x 5600 uF
10V, 2.35A

2 x 4700 uF
16V, 2.8A

1 uH

11 A, 3.7 m:

Rfb2

Rfb1

Cc1

Cc2

Rc1

Rcs

Css

Rfadj

Rin

Cin

D1

Cboot

Q1

Q2

1uF
10V

1 uH

4.5 A, 7.5 m:

4.99k

3.3k

14.9k

147k

4.7p

680p

12n

49.9k

2.2u

10

0.1u

Co1,2

Cin1

Cinx

Lin

L1

LM27x7

HG

BOOT

ISEN

LG

PGND

FB

Vcc

SD

PWGD

FREQ

SS

SGND

EAO

PGND

+

+

Vin = 5V

Vo = 1.8V@3A

100 uF
10V, 1.9A

1 x 220 uF
4V, 55 m:

2.2 uH

6.1A, 12 m:

Rfb2

Rfb1

Cc1

Cc2 Rc1

Rcs

Css

Rfadj

Rin

Cin

Cc

Q1/Q2

+12V

4.99k

2.49k

2.7k

12n

43.2k

10

2.2u

0.1u

10p

560p 51.1k

Cin1

Co1

L1

LM27x7

LM2727, LM2737

www.ti.com

SNVS205D –AUGUST 2002–REVISED MARCH 2013

Figure 27. 5V to 1.8V, 3A, 600kHz

The example circuit of Figure 27 has been designed for minimum component count and overall solution size. A
switching frequency of 600kHz allows the use of small input/output capacitors and a small inductor. The
availability of separate 5V and 12V supplies (such as those available from desk-top computer supplies) and the
low current further reduce component count. Using the 12V supply to power the MOSFET drivers eliminates the
bootstrap diode, D1. At low currents, smaller FETs or dual FETs are often the most efficient solutions. Here, the
Si4826DY, an asymmetric dual FET in an SO-8 package, yields 92% efficiency at a load of 2A.

Figure 28. 3.3V to 0.8V, 5A, 500kHz

The circuit of Figure 28 demonstrates the LM2727 delivering a low output voltage at high efficiency (87%) A
separate 5V supply is required to run the chip, however the input voltage can be as low as 2.2

Product Folder Links: LM2727 LM2737

Copyright © 2002–2013, Texas Instruments Incorporated Submit Documentation Feedback 17

LM27x7

HG

BOOT

ISEN

LG

PGND

FB

Vcc

SD

PWGD

FREQ

SS

SGND

EAO

PGND

+

+

+5V

Vin = 5 to 15V

Vo = 1.8V@1A

1 x 15uF

25V, 3.3A

1 x 15uF
25V 3.1mohm

3.3uH

4.1A, 17.4 m:

Rfb2

Rfb1

Cc1

Cc2 Rc1

Rcs

Css

Rfadj

Rin

Cin

D1

Cboot

1uH

6.4A, 7.3 m:

Rc2

Cc3

LM27x7

HG

BOOT

ISEN

LG

PGND

FB

Vcc

SD

PWGD

FREQ

SS

SGND

EAO

PGND

+

+

+5V

Vin = 5 to 15V

Vo = 3.3V@1A

1 x 15uF
25V, 3.3A

1 x 15uF
25V 3.1 m:

4.7uH

3.4A, 26 m:

Rfb2

Rfb1

Cc1

Cc2 Rc1

Rcs

Rfadj

Rin

Cin

D1

Cboot

Q1/Q2

1uH

6.4 A, 7.3 m:

Rc2

Cc3

10

2.2u

0.1u

1.5k

10k

2.21k

0.1u

10

2.2u

17.4k

39n

22p

680p 10.7k

680p66.5

10k

4.99k

1.5k

17.4k

27p

1n

820p

12.1k

54.9

Co1

Cin1

Lin

L1

L1

Lin

Co1

Q1/Q2

LM2727, LM2737

SNVS205D –AUGUST 2002–REVISED MARCH 2013

www.ti.com

Figure 29. 1.8V and 3.3V, 1A, 1.4MHz, Simultaneous

The circuits in Figure 29 are intended for ADSL applications, where the high switching frequency keeps noise out
of the data transmission range. In this design, the 1.8 and 3.3V outputs come up simultaneously by using the
same softstart capacitor. Because two current sources now charge the same capacitor, the capacitance must be
doubled to achieve the same softstart time. (Here, 40nF is used to achieve a 5ms softstart time.) A common
softstart capacitor means that, should one circuit enter current limit, the other circuit will also enter current limit.
In addition, if both circuits are built with the LM2727, a UVP or OVP fault on one circuit will cause both circuits to
latch off. The additional compensation components Rc2 and Cc3 are needed for the low ESR, all ceramic output
capacitors, and the wide (3x) range of Vin.

18 Submit Documentation Feedback Copyright © 2002–2013, Texas Instruments Incorporated

Product Folder Links: LM2727 LM2737

LM27x7

HG

BOOT

ISEN

LG

PGND

FB

Vcc

SD

PWGD

FREQ

SS

SGND

EAO

PGND

+

+

Vin = 12V

Vo = 5V@1.8A

2 x 680uF
16V
26 m:

47uH 2.7A

53 m:

Rfb2

Rfb1

Cc1

Cc2 Rc1

Css

Rfadj

Cin

Cboot

Q1

Rc2 Cc3

10uF
16V

10uF

6.3V

+5V (low current source)

D1

D2

10k

1.37k

22n

56p

3.9n 61.9k

750

12n

267k

0.1u

2.2u

L1

Cinx

Cox

Co1,2

680uF
16V

1.54A

Cin1

LM27x7

HG

BOOT

ISEN

LG

PGND

FB

Vcc

SD

PWGD

FREQ

SS

SGND

EAO

PGND

+

+

+5V

Vin = 11 to 13V

Vo = 3.3V@3A

4.2uH, 5.5A
15 m:

Rfb1

Cc1

Cc2 Rc1

Rcs

Css

Rfadj

Cin

D1

Cboot

Q1/Q2

1uH, 6.4A

7.3 m:

Rc2

Cc3

2 x 680uF
16V 1.54A

LM78L05

Vin = 11 to 13V

To 2nd LM27x7

2.21k

0.1u

2k

2.2u

32.5k

12n

8.2p

1n

4.7n2.37k

52.3k

Lin

Co1,2

680uF
16V, 1.54A

Cin1
10uF
16V

Cinx

Rfb2

10k

10uF
25V

Cox

LM2727, LM2737

www.ti.com

SNVS205D –AUGUST 2002–REVISED MARCH 2013

Figure 30. 12V Unregulated to 3.3V, 3A, 750kHz

This circuit shows the LM27x7 paired with a cost effective solution to provide the 5V chip power supply, using no
extra components other than the LM78L05 regulator itself. The input voltage comes from a 'brick' power supply
which does not regulate the 12V line tightly. Additional, inexpensive 10uF ceramic capacitors (Cinx and Cox)
help isolate devices with sensitive databands, such as DSL and cable modems, from switching noise and
harmonics.

Figure 31. 12V to 5V, 1.8A, 100kHz

In situations where low cost is very important, the LM27x7 can also be used as an asynchronous controller, as
shown in the above circuit. Although a a schottky diode in place of the bottom FET will not be as efficient, it will
cost much less than the FET. The 5V at low current needed to run the LM27x7 could come from a zener diode or
inexpensive regulator, such as the one shown in Figure 30. Because the LM27x7 senses current in the low side
MOSFET, the current limit feature will not function in an asynchronous design. The ISEN pin should be left open
in this case.

Copyright © 2002–2013, Texas Instruments Incorporated Submit Documentation Feedback 19

Product Folder Links: LM2727 LM2737

LM2727, LM2737

SNVS205D –AUGUST 2002–REVISED MARCH 2013

Table 1. Bill of Materials for Typical Application Circuit

ID Part Number Type Size Parameters Qty. Vendor

U1 LM2727 TSSOP-14 TSSOP-14 1

Q1, Q2 Si4884DY N-MOSFET SO-8 30V, 4.1mΩ, 36nC 1 Vishay

L1 RLF7030T-1R5N6R1 Inductor 7.1x7.1x3.2mm 1.5µH, 6.1A 9.6mΩ 1 TDK

Cin1, Cin2 C2012X5R1J106M MLCC 0805 10µF 6.3V 2 TDK

Cinx C3216X7R1E105K Capacitor 1206 1µF, 25V 1 TDK

Co1, Co2 6MV2200WG AL-E 10mm D 20mm H 2200µF 6.3V125mΩ 2 Sanyo

Cboot VJ1206X104XXA Capacitor 1206 0.1µF, 25V 1 Vishay

Cin C3216X7R1E225K Capacitor 1206 0.1µF, 25V 1 TDK
Css VJ1206X123KXX Capacitor 1206 12nF, 25V 1 Vishay
Cc1 VJ1206A2R2KXX Capacitor 1206 2.2pF 10% 1 Vishay
Cc2 VJ1206A181KXX Capacitor 1206 180pF 10% 1 Vishay

Rin CRCW1206100J Resistor 1206 10Ω 5% 1 Vishay

Rfadj CRCW12066342F Resistor 1206 63.4kΩ 1% 1 Vishay

Rc1 CRCW12063923F Resistor 1206 392kΩ 1% 1 Vishay

Rfb1 CRCW12061002F Resistor 1206 10kΩ 1% 1 Vishay
Rfb2 CRCW12061002F Resistor 1206 10kΩ 1% 1 Vishay

Rcs CRCW1206222J Resistor 1206 2.2kΩ 5% 1 Vishay

Synchronous Texas
Controller Instruments

www.ti.com

Table 2. Bill of Materials for Circuit of Figure 25

(Identical to BOM for 1.5V except as noted below)

ID Part Number Type Size Parameters Qty. Vendor

L1 RLF12560T-2R7N110 Inductor 12.5x12.8x6mm 2.7µH, 14.4A 4.5mΩ 1 TDK

Co1, Co2,

Co3, Co4

Cc1 VJ1206A6R8KXX Capacitor 1206 6.8pF 10% 1 Vishay
Cc2 VJ1206A271KXX Capacitor 1206 270pF 10% 1 Vishay
Cc3 VJ1206A471KXX Capacitor 1206 470pF 10% 1 Vishay
Rc2 CRCW12068451F Resistor 1206 8.45kΩ 1% 1 Vishay

Rfb1 CRCW12061102F Resistor 1206 11kΩ 1% 1 Vishay

10TPB100M POSCAP 7.3x4.3x2.8mm 100µF 10V 1.9Arms 4 Sanyo

Table 3. Bill of Materials for Circuit of Figure 26

ID Part Number Type Size Parameters Qty. Vendor

U1 LM2727 TSSOP-14 1

Q1 Si4442DY N-MOSFET SO-8 30V, 4.1mΩ, @ 4.5V, 36nC 1 Vishay

Q2 Si4442DY N-MOSFET SO-8 30V, 4.1mΩ, @ 4.5V, 36nC 1 Vishay

D1 BAT-54 Schottky Diode SOT-23 30V 1 Vishay

Lin SLF12575T-1R2N8R2 Inductor 12.5x12.5x7.5mm 12µH, 8.2A, 6.9mΩ 1 Coilcraft

L1 D05022-152HC Inductor 22.35x16.26x8mm 1.5µH, 15A,4mΩ 1 Coilcraft

Cin1, Cin2 10MV5600AX 16mm D 25mm H 5600µF10V 2.35Arms 2 Sanyo

Cinx C3216X7R1E105K Capacitor 1206 1µF, 25V 1 TDK

Co1, Co2, Aluminum

Co3 Electrolytic

Cboot VJ1206X104XXA Capacitor 1206 0.1µF, 25V 1 Vishay

Cin C3216X7R1E225K Capacitor 1206 2.2µF, 25V 1 TDK
Css VJ1206X123KXX Capacitor 1206 12nF, 25V 1 Vishay
Cc1 VJ1206A4R7KXX Capacitor 1206 4.7pF 10% 1 Vishay

10MV5600AX 16mm D 25mm H 5600µF10V 2.35Arms 2 Sanyo

Synchronous Texas
Controller Instruments

Aluminum
Electrolytic

20 Submit Documentation Feedback Copyright © 2002–2013, Texas Instruments Incorporated

Product Folder Links: LM2727 LM2737

LM2727, LM2737

www.ti.com

SNVS205D –AUGUST 2002–REVISED MARCH 2013

Table 3. Bill of Materials for Circuit of Figure 26 (continued)

ID Part Number Type Size Parameters Qty. Vendor

Cc2 VJ1206A102KXX Capacitor 1206 1nF 10% 1 Vishay

Rin CRCW1206100J Resistor 1206 10Ω 5% 1 Vishay

Rfadj CRCW12068872F Resistor 1206 88.7kΩ 1% 1 Vishay

Rc1 CRCW12062293F Resistor 1206 229kΩ 1% 1 Vishay

Rfb1 CRCW12064991F Resistor 1206 4.99kΩ 1% 1 Vishay
Rfb2 CRCW12064991F Resistor 1206 4.99kΩ 1% 1 Vishay

Rcs CRCW1206152J Resistor 1206 1.5kΩ 5% 1 Vishay

Table 4. Bill of Materials for Circuit of Figure 27

ID Part Number Type Size Parameters Qty. Vendor

U1 LM2727 Synchronous TSSOP-14 1 Texas

Q1/Q2 Si4826DY Asymetric Dual SO-8 30V, 24mΩ/ 8nC 1 Vishay

L1 DO3316P-222 Inductor 12.95x9.4x 5.21mm 2.2µH, 6.1A, 12mΩ 1 Coilcraft

Cin1 10TPB100ML POSCAP 7.3x4.3x3.1mm 100µF 10V 1.9Arms 1 Sanyo

Co1 4TPB220ML POSCAP 7.3x4.3x3.1mm 220µF 4V 1.9Arms 1 Sanyo

Cc C3216X7R1E105K Capacitor 1206 1µF, 25V 1 TDK

Cin C3216X7R1E225K Capacitor 1206 2.2µF, 25V 1 TDK
Css VJ1206X123KXX Capacitor 1206 12nF, 25V 1 Vishay
Cc1 VJ1206A100KXX Capacitor 1206 10pF 10% 1 Vishay
Cc2 VJ1206A561KXX Capacitor 1206 560pF 10% 1 Vishay

Rin CRCW1206100J Resistor 1206 10Ω 5% 1 Vishay

Rfadj CRCW12064222F Resistor 1206 42.2kΩ 1% 1 Vishay

Rc1 CRCW12065112F Resistor 1206 51.1kΩ 1% 1 Vishay

Rfb1 CRCW12062491F Resistor 1206 2.49kΩ 1% 1 Vishay
Rfb2 CRCW12064991F Resistor 1206 4.99kΩ 1% 1 Vishay

Rcs CRCW1206272J Resistor 1206 2.7kΩ 5% 1 Vishay

Controller Instruments

N-MOSFET Top 16.5mΩ/ 15nC

Table 5. Bill of Materials for Circuit of Figure 28

ID Part Number Type Size Parameters Qty. Vendor

U1 LM2727 Synchronous TSSOP-14 1 Texas

Q1 Si4884DY N-MOSFET SO-8 30V, 13.5mΩ, @ 4.5V 1 Vishay

Q2 Si4884DY N-MOSFET SO-8 30V, 13.5mΩ, @ 4.5V 1 Vishay

D1 BAT-54 Schottky Diode SOT-23 30V 1 Vishay

Lin P1166.102T Inductor 7.29x7.29 3.51mm 1µH, 11A 3.7mΩ 1 Pulse

L1 P1168.102T Inductor 12x12x4.5 mm 1µH, 11A, 3.7mΩ 1 Pulse

Cin1 10MV5600AX Aluminum 16mm D 25mm H 5600µF 10V 2.35Arms 1 Sanyo

Cinx C3216X7R1E105K Capacitor 1206 1µF, 25V 1 TDK

Co1, Co2, 16MV4700WX Aluminum 12.5mm D 30mm H 4700µF 16V 2.8Arms 2 Sanyo

Co3 Electrolytic

Cboot VJ1206X104XXA Capacitor 1206 0.1µF, 25V 1 Vishay

Cin C3216X7R1E225K Capacitor 1206 2.2µF, 25V 1 TDK
Css VJ1206X123KXX Capacitor 1206 12nF, 25V 1 Vishay
Cc1 VJ1206A4R7KXX Capacitor 1206 4.7pF 10% 1 Vishay

Copyright © 2002–2013, Texas Instruments Incorporated Submit Documentation Feedback 21

Controller Instruments

15.3nC

15.3nC

Electrolytic

Product Folder Links: LM2727 LM2737

LM2727, LM2737

SNVS205D –AUGUST 2002–REVISED MARCH 2013

Table 5. Bill of Materials for Circuit of Figure 28 (continued)

ID Part Number Type Size Parameters Qty. Vendor

Cc2 VJ1206A681KXX Capacitor 1206 680pF 10% 1 Vishay

Rin CRCW1206100J Resistor 1206 10Ω 5% 1 Vishay

Rfadj CRCW12064992F Resistor 1206 49.9kΩ 1% 1 Vishay

Rc1 CRCW12061473F Resistor 1206 147kΩ 1% 1 Vishay

Rfb1 CRCW12061492F Resistor 1206 14.9kΩ 1% 1 Vishay
Rfb2 CRCW12064991F Resistor 1206 4.99kΩ 1% 1 Vishay

Rcs CRCW1206332J Resistor 1206 3.3kΩ 5% 1 Vishay

Table 6. Bill of Materials for Circuit of Figure 29

ID Part Number Type Size Parameters Qty. Vendor

U1 LM2727 Synchronous TSSOP-14 1 Texas

Controller Instruments

Q1/Q2 Si4826DY Assymetric Dual SO-8 30V, 24mΩ/ 8nC 1 Vishay

N-MOSFET Top 16.5mΩ/ 15nC

D1 BAT-54 Schottky Diode SOT-23 30V 1 Vishay

Lin RLF7030T-1R0N64 Inductor 6.8x7.1x3.2mm 1µH, 6.4A, 7.3mΩ 1 TDK

L1 RLF7030T-3R3M4R1 Inductor 6.8x7.1x3.2mm 3.3µH, 4.1A, 17.4mΩ 1 TDK

Cin1 C4532X5R1E156M MLCC 1812 15µF 25V 3.3Arms 1 Sanyo

Co1 C4532X5R1E156M MLCC 1812 15µF 25V 3.3Arms 1 Sanyo

Cboot VJ1206X104XXA Capacitor 1206 0.1µF, 25V 1 TDK

Cin C3216X7R1E225K Capacitor 1206 2.2µF, 25V 1 TDK
Css VJ1206X393KXX Capacitor 1206 39nF, 25V 1 Vishay
Cc1 VJ1206A220KXX Capacitor 1206 22pF 10% 1 Vishay
Cc2 VJ1206A681KXX Capacitor 1206 680pF 10% 1 Vishay
Cc3 VJ1206A681KXX Capacitor 1206 680pF 10% 1 Vishay

Rin CRCW1206100J Resistor 1206 10Ω 5% 1 Vishay

Rfadj CRCW12061742F Resistor 1206 17.4kΩ 1% 1 Vishay

Rc1 CRCW12061072F Resistor 1206 10.7kΩ 1% 1 Vishay
Rc2 CRCW120666R5F Resistor 1206 66.5Ω 1% 1 Vishay

Rfb1 CRCW12064991F Resistor 1206 4.99kΩ 1% 1 Vishay
Rfb2 CRCW12061002F Resistor 1206 10kΩ 1% 1 Vishay

Rcs CRCW1206152J Resistor 1206 1.5kΩ 5% 1 Vishay

www.ti.com

Table 7. Bill of Materials for 3.3V Circuit of Figure 29

(Identical to BOM for 1.8V except as noted below)

ID Part Number Type Size Parameters Qty. Vendor

L1 RLF7030T-4R7M3R4 Inductor 6.8x7.1x 3.2mm 4.7µH, 3.4A, 26mΩ 1 TDK
Cc1 VJ1206A270KXX Capacitor 1206 27pF 10% 1 Vishay
Cc2 VJ1206X102KXX Capacitor 1206 1nF 10% 1 Vishay
Cc3 VJ1206A821KXX Capacitor 1206 820pF 10% 1 Vishay
Rc1 CRCW12061212F Resistor 1206 12.1kΩ 1% 1 Vishay
Rc2 CRCW12054R9F Resistor 1206 54.9Ω 1% 1 Vishay

Rfb1 CRCW12062211F Resistor 1206 2.21kΩ 1% 1 Vishay
Rfb2 CRCW12061002F Resistor 1206 10kΩ 1% 1 Vishay

22 Submit Documentation Feedback Copyright © 2002–2013, Texas Instruments Incorporated

Product Folder Links: LM2727 LM2737

LM2727, LM2737

www.ti.com

SNVS205D –AUGUST 2002–REVISED MARCH 2013

Table 8. Bill of Materials for Circuit of Figure 30

ID Part Number Type Size Parameters Qty. Vendor

U1 LM2727 Synchronous Controller TSSOP-14 1 Texas

U2 LM78L05 Voltage Regulator SO-8 1 Texas

Q1/Q2 Si4826DY Assymetric Dual N-MOSFET SO-8 30V, 24mΩ/ 8nC 1 Vishay

Top 16.5mΩ/ 15nC
D1 BAT-54 Schottky Diode SOT-23 30V 1 Vishay
Lin RLF7030T-1R0N64 Inductor 6.8x7.1x3.2mm 1µH, 6.4A, 7.3mΩ 1 TDK

L1 SLF12565T-4R2N5R5 Inductor 12.5x12.5x6.5mm 4.2µH, 5.5A, 15mΩ 1 TDK

Cin1 16MV680WG Al-E D: 10mm L: 12.5mm 680µF 16V 3.4Arms 1 Sanyo

Cinx C3216X5R1C106M MLCC 1210 10µF 16V 3.4Arms 1 TDK

Co1 Co2 16MV680WG MLCC 1812 15µF 25V 3.3Arms 1 Sanyo

Cox C3216X5R10J06M MLCC 1206 10µF 6.3V 2.7A TDK

Cboot VJ1206X104XXA Capacitor 1206 0.1µF, 25V 1 Vishay

Cin C3216X7R1E225K Capacitor 1206 2.2µF, 25V 1 TDK

Css VJ1206X123KXX Capacitor 1206 12nF, 25V 1 Vishay
Cc1 VJ1206A8R2KXX Capacitor 1206 8.2pF 10% 1 Vishay
Cc2 VJ1206X102KXX Capacitor 1206 1nF 10% 1 Vishay
Cc3 VJ1206X472KXX Capacitor 1206 4.7nF 10% 1 Vishay

Rfadj CRCW12063252F Resistor 1206 32.5kΩ 1% 1 Vishay

Rc1 CRCW12065232F Resistor 1206 52.3kΩ 1% 1 Vishay
Rc2 CRCW120662371F Resistor 1206 2.37Ω 1% 1 Vishay

Rfb1 CRCW12062211F Resistor 1206 2.21kΩ 1% 1 Vishay
Rfb2 CRCW12061002F Resistor 1206 10kΩ 1% 1 Vishay

Rcs CRCW1206202J Resistor 1206 2kΩ 5% 1 Vishay

Instrument

Instrument

s

s

Table 9. Bill of Materials for Circuit of Figure 31

ID Part Number Type Size Parameters Qty. Vendor

U1 LM2727 Synchronous TSSOP-14 1 Texas

Q1 Si4894DY N-MOSFET SO-8 30V, 15mΩ, 11.5nC 1 Vishay

D2 MBRS330T3 Schottky Diode SO-8 30V, 3A 1 ON
L1 SLF12565T-470M2R4 Inductor 12.5x12.8x 4.7mm 47µH, 2.7A 53mΩ 1 TDK

D1 MBR0520 Schottky Diode 1812 20V 0.5A 1 ON
Cin1 16MV680WG Al-E 1206 680µF, 16V, 1.54Arms 1 Sanyo
Cinx C3216X5R1C106M MLCC 1206 10µF, 16V, 3.4Arms 1 TDK

Co1, Co2 16MV680WG Al-E D: 10mm L: 12.5mm 680µF 16V 26mΩ 2 Sanyo

Cox C3216X5R10J06M MLCC 1206 10µF, 6.3V 2.7A 1 TDK

Cboot VJ1206X104XXA Capacitor 1206 0.1µF, 25V 1 Vishay

Cin C3216X7R1E225K Capacitor 1206 2.2µF, 25V 1 TDK
Css VJ1206X123KXX Capacitor 1206 12nF, 25V 1 Vishay
Cc1 VJ1206A561KXX Capacitor 1206 56pF 10% 1 Vishay
Cc2 VJ1206X392KXX Capacitor 1206 3.9nF 10% 1 Vishay
Cc3 VJ1206X223KXX Capacitor 1206 22nF 10% 1 Vishay

Rfadj CRCW12062673F Resistor 1206 267kΩ 1% 1 Vishay

Rc1 CRCW12066192F Resistor 1206 61.9kΩ 1% 1 Vishay
Rc2 CRCW12067503F Resistor 1206 750kΩ 1% 1 Vishay

Copyright © 2002–2013, Texas Instruments Incorporated Submit Documentation Feedback 23

Controller Instruments

Product Folder Links: LM2727 LM2737

LM2727, LM2737

SNVS205D –AUGUST 2002–REVISED MARCH 2013

Table 9. Bill of Materials for Circuit of Figure 31 (continued)

ID Part Number Type Size Parameters Qty. Vendor

Rfb1 CRCW12061371F Resistor 1206 1.37kΩ 1% 1 Vishay
Rfb2 CRCW12061002F Resistor 1206 10kΩ 1% 1 Vishay

Rcs CRCW1206122F Resistor 1206 1.2kΩ 5% 1 Vishay

www.ti.com

24 Submit Documentation Feedback Copyright © 2002–2013, Texas Instruments Incorporated

Product Folder Links: LM2727 LM2737

LM2727, LM2737

www.ti.com

SNVS205D –AUGUST 2002–REVISED MARCH 2013

REVISION HISTORY

Changes from Revision C (March 2013) to Revision D Page

• Changed layout of National Data Sheet to TI format .......................................................................................................... 23

Copyright © 2002–2013, Texas Instruments Incorporated Submit Documentation Feedback 25

Product Folder Links: LM2727 LM2737

PACKAGE OPTION ADDENDUM

www.ti.com

PACKAGING INFORMATION

Orderable Device Status

LM2727MTC NRND TSSOP PW 14 94 TBD Call TI Call TI 0 to 125 2727

LM2727MTC/NOPB ACTIVE TSSOP PW 14 94 Green (RoHS

LM2727MTCX/NOPB ACTIVE TSSOP PW 14 2500 Green (RoHS

LM2737MTC NRND TSSOP PW 14 94 TBD Call TI Call TI -40 to 125 2737

LM2737MTC/NOPB ACTIVE TSSOP PW 14 94 Green (RoHS

LM2737MTCX NRND TSSOP PW 14 2500 TBD Call TI Call TI -40 to 125 2737

LM2737MTCX/NOPB ACTIVE TSSOP PW 14 2500 Green (RoHS

(1)

The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.

Package Type Package

(1)

Drawing

Pins Package

Qty

Eco Plan

(2)

& no Sb/Br)

& no Sb/Br)

& no Sb/Br)

& no Sb/Br)

Lead/Ball Finish

(6)

CU NIPDAU | CU SN Level-1-260C-UNLIM 0 to 125 2727

CU NIPDAU | CU SN Level-1-260C-UNLIM 0 to 125 2727

CU NIPDAU | CU SN Level-1-260C-UNLIM -40 to 125 2737

CU NIPDAU | CU SN Level-1-260C-UNLIM -40 to 125 2737

MSL Peak Temp

(3)

Op Temp (°C) Device Marking

MTC

MTC

MTC

MTC

MTC

MTC

MTC

(4/5)

(2)

Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)

(3)

MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4)

There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

5-Sep-2014

Samples

Addendum-Page 1

PACKAGE OPTION ADDENDUM

www.ti.com

(5)

Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

(6)

Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish

value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

5-Sep-2014

Addendum-Page 2

PACKAGE MATERIALS INFORMATION

www.ti.com 30-Apr-2016

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package

Type

LM2727MTCX/NOPB TSSOP PW 14 2500 330.0 12.4 6.95 5.6 1.6 8.0 12.0 Q1

LM2737MTCX TSSOP PW 14 2500 330.0 12.4 6.95 5.6 1.6 8.0 12.0 Q1

LM2737MTCX/NOPB TSSOP PW 14 2500 330.0 12.4 6.95 5.6 1.6 8.0 12.0 Q1

Package
Drawing

Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

A0

(mm)B0(mm)K0(mm)P1(mm)W(mm)

Pin1

Quadrant

Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION

www.ti.com 30-Apr-2016

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

LM2727MTCX/NOPB TSSOP PW 14 2500 367.0 367.0 35.0

LM2737MTCX TSSOP PW 14 2500 367.0 367.0 35.0

LM2737MTCX/NOPB TSSOP PW 14 2500 367.0 367.0 35.0

Pack Materials-Page 2

IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.

TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.

TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.

TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.

Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.

Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.

Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.

In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.

No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.

Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.

TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.

Products Applications

Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive
Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications
Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers
DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps
DSP dsp.ti.com Energy and Lighting www.ti.com/energy
Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial
Interface interface.ti.com Medical www.ti.com/medical
Logic logic.ti.com Security www.ti.com/security
Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense
Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video
RFID www.ti-rfid.com
OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com
Wireless Connectivity www.ti.com/wirelessconnectivity

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265

Copyright © 2016, Texas Instruments Incorporated