Single Chip With Easy Interface Between
UART and Serial-Port Connector of IBM
PC/AT and Compatibles
D
Meets or Exceeds the Requirements of
ANSI Standard TIA/EIA-232-F and ITU
Recommendation V.28
D
Designed to Support Data Rates up to
120 kbit/s
D
Pinout Compatible With SN75C185 and
SN75185
D
ESD Protection to 2 kV on Bus Terminals
D
Package Options Include Plastic
DB, DW, OR N PACKAGE
(TOP VIEW)
V
DD
RA1
RA2
RA3
DY1
DY2
RA4
DY3
RA5
V
SS
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
V
CC
RY1
RY2
RY3
DA1
DA2
RY4
DA3
RY5
GND
Small-Outline (DW), Shrink Small-Outline
(DB) Packages, and DIPs (N)
description
The GD75232 combines three drivers and five receivers from TI trade-standard SN75188 and SN75189
bipolar quadruple drivers and receivers, respectively. The pinout matches the flow-through design of the
SN75C185 to decrease the part count, reduce the board space required, and allow easy interconnection of the
UART and serial-port connector of an IBM PC/AT and compatibles. The bipolar circuits and processing of
the GD75232 provide a rugged, low-cost solution for this function at the expense of quiescent power and
external passive components relative to the SN75C185.
The GD75232 complies with the requirements of the TIA/EIA-232-F and ITU (formerly CCITT) V .28 standards.
These standards are for data interchange between a host computer and a peripheral at signaling rates up to
20 kbit/s. The switching speeds of the GD75232 are fast enough to support rates up to 120 kbit/s with lower
capacitive loads (shorter cables). Interoperability at the higher signaling rates cannot be expected unless the
designer has design control of the cable and the interface circuits at both ends. For interoperability at signaling
rates up to 120 kbit/s, use of ANSI TIA/EIA-423-B (ITU V.10) and TIA/EIA-422-B (ITU V.11) standards is
recommended.
The GD75232 is characterized for operation over the temperature range of 0°C to 70°C.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
TI is a trademark of Texas Instruments Incorporated.
IBM and PC/AT are trademarks of International Business Machines Corporation.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
Copyright 1998, Texas Instruments Incorporated
1
GD75232
MULTIPLE RS-232 DRIVERS AND RECEIVERS
SLLS206C – MA Y 1995 – REVISED JULY 1998
logic symbol
RA1
RA2
RA3
DY1
DY2
RA4
DY3
RA5
†
This symbol is in accordance with ANSI/IEEE Std 91-1984
and IEC Publication 617-12.
†
2
3
4
5
6
7
8
9
schematic (each driver)
To Other Drivers
V
DD
19
18
17
16
15
14
13
12
RY1
RY2
RY3
DA1
DA2
RY4
DA3
RY5
logic diagram (positive logic)
2
3
4
5
6
7
8
9
9.4 kΩ11.6 kΩ
19
18
17
16
15
14
13
12
RY1RA1
RY2RA2
RY3RA3
DA1DY1
DA2DY2
RY4RA4
DA3DY3
RY5RA5
Input DAx
4.2 kΩ
GND
To Other
Drivers
V
SS
To Other Drivers
Resistor values shown are nominal.
10.4 kΩ
75.8 Ω
320 Ω
68.5 Ω3.3 kΩ
DYx Output
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
schematic (each receiver)
MULTIPLE RS-232 DRIVERS AND RECEIVERS
9 kΩ5 kΩ
2 kΩ
SLLS206C – MA Y 1995 – REVISED JULY 1998
To Other Receivers
V
CC
1.66 kΩ
RYx Output
GD75232
Input RAx
Resistor values shown are nominal.
3.8 kΩ
10 kΩ
GND
To Other Receivers
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage, V
Supply voltage, V
Supply voltage, V
Input voltage range, V
Driver output voltage range, V
Receiver low-level output current, I
Package thermal impedance, θ
Storage temperature range, T
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds 260°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltages are with respect to the network ground terminal.
2. The package thermal impedance is calculated in accordance with JESD 51, except for through-hole packages, which use a trace
length of zero.