1-4 Cell Li+ Battery SMBus Charge Controller With Independent Comparator and
Advanced Circuit Protection
Check for Samples: bq24707, bq24707A
bq24707
bq24707A
1
FEATURES
•SMBus Host-Controlled NMOS-NMOS
Synchronous Buck Converter with
Programmable 615kHz, 750kHz, and 885kHz
Switching Frequency
•Real Time System Control on ILIM Pin to Limit
Charge Current
•Enhanced Safety Features for Over Voltage
Protection, Over Current Protection, Battery,
Inductor, and MOSFET Short Circuit Protection
•Programmable Input Current, Charge Voltage,
Charge Current Limits
DESCRIPTION
The bq24707 and bq24707A are high-efficiency,
synchronous battery charger, offering low component
count for space-constraint, multi-chemistry battery
charging applications.
SMBus controlled input current, charge current, and
charge voltage DACs allow for very high regulation
accuracies that can be easily programmed by the
system power management micro-controller.
The IC uses the internal input current register or
external ILIM pin to throttle down PWM modulation to
reduce the charge current.
– ±0.5% Charge Voltage Accuracy up to 19.2VThe IC provides an IFAULT output to alarm if any
– ±3% Charge Current Accuracy up to 8.128A
– ±3% Input Current Accuracy up to 8.064A
– ±2% 20x Adapter Current or Charge Current
Output Accuracy
•Programmable Adapter Detection and
Indicator
•Independent Comparator with Internal
Reference
MOSFET fault or input over current occurs. This
alarm output allows users to turn off input power
selectors when the fault occurs. Meanwhile, an
independent comparator with internal reference is
available to monitor input current, output current, or
output voltage.
The IC charges one, two, three, or four series Li+
cells, and is available in a 20-pin, 3.5×3.5 mm2QFN
package.
•Integrated Soft Start
•Integrated Loop Compensation
•AC Adapter Operating Range 5V-24V
•15µA Off-State Battery Discharge Current
•20-pin 3.5 x 3.5 mm2QFN Package
•bq24707: ACOK delay default 1.3s
•bq24707A: ACOK delay default 1.2ms
APPLICATIONS
•Portable Notebook Computers, UMPC,
Ultra-Thin Notebook, and Netbook
•Personal Digital Assistant
•Handheld Terminal
•Industrial and Medical Equipment
•Portable Equipment
1
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
If no adapter,
and Iout is
needed, this
rail is on
+1.5V
R10
10k
R11
39.2k
R12
100k
R13
3.01M
C13
0.1µF
C14
0.1µF
R14
10Ω
R15
7.5Ω
*
*
bq24707
bq24707A
SLUSA78B –JULY 2010– REVISED MARCH 2011
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
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TYPICAL APPLICATION
Fs= 750kHz, I
= 4.096A, I
adpt
= 2.944A, I
chrg
lim
= 4A, V
= 12.592V, 90W adapter and 3S2P battery pack
chrg
See the application information about negative output voltage protection for hard shorts on battery to ground or
battery reverse connection.
full scale charge voltage(12.592V for 3S battery)0V
COMPARISON TABLE
Product Folder Link(s): bq24707 bq24707A
ORDERING NUMBER
(Tape and Reel)
bq24707RGRR3000
bq24707RGRT250
bq24707ARGRR3000
bq24707ARGRT250
0A0A
bq24707
bq24707A
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ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)
SRN, SRP, ACN, ACP, VCC–0.3 to 30
PHASE–2 to 30
Voltage range
Maximum difference voltageSRP–SRN, ACP–ACN–0.5 to 0.5
Junction temperature range, T
Storage temperature range, T
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operatingconditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to GND if not specified. Currents are positive into, negative out of the specified terminal. Consult Packaging
Section of the data book for thermal limitations and considerations of packages.
≤ 24 V, 0°C ≤ TJ≤ 125°C, typical values are at TA= 25°C, with respect to GND (unless otherwise noted)
(VCC)
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
VCC Input voltage operating range4.524V
BAT voltage regulation range1.02419.2V
Charge voltage regulation accuracy
Charge current regulation differential voltage rangeV
Charge current regulation accuracy 10mΩ current
sensing resistor
Input current regulation differential voltage rangeV
Input current regulation accuracy 10mΩ current
sensing resistor
Input common mode rangeVoltage on ACP/ACN4.524V
Output common mode rangeVoltage on SRP/SRN019.2V
IOUT output voltage range01.6V
IOUT output current01mA
Current sense amplifier gainV
Current sense output accuracy
Maximum output load capacitanceFor stability with 0 to 1mA load100pF
(1) User can adjust threshold via SMBus ChargeOption() REG0x12.
≤ 24 V, 0°C ≤ TJ≤ 125°C, typical values are at TA= 25°C, with respect to GND (unless otherwise noted)
(VCC)
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
Input under voltage rising thresholdV
Input under voltage falling hysteresisV
Fast DPM comparator stop charging rising threshold108%
with respect to input current limit, voltage across input
sense resistor rising edge (specified by design)
Total battery leakage current to I
I
+ I
+ I
VCC
ACP
ACN
Standby quiescent current, I
Adapter bias current during charge,V
I
+ I
+ I
VCC
ACP
ACN
Adapter bias current during charge,V
I
+ I
+ I
VCC
ACP
ACN
VCC
SRN
+ I
+ I
ACP
SRP+IPHASE
+ I
ACN
+
ACOK falling thresholdV
ACOK rising hysteresisV
ACOK falling deglitch (specified by design)0.81.22ms
ChargeOption() bit [15] = 0 (default), (bq24707 only)
V
VCC>VUVLO
ChargeOption() bit [15] = 0 (default), (bq24707A only)
V
VCC>VUVLO
ChargeOption() bit [15] = 1
VCC>VUVLO
VCC>VUVLO
falling towards V
VCC
rising above V
VCC
ChargeOption() bit [8:7] = 00200300450
ACP to PHASE rising thresholdmV
ChargeOption() bit [8:7] = 01330500700
ChargeOption() bit [8:7] = 10 (default)4507001000
ChargeOption() bit [8:7] = 116009001250
PHASE to GND rising threshold40110160mV
(1)
Adapter over current rising threshold with respect to
input current limit, voltage across input sense resistor ChargeOption() bit [2:1] = 10 (default)150%166%180%
rising edge
Min ACOC threshold clamp voltage404550mV
Max ACOC threshold clamp voltage140150160mV
ChargeOption() bit [2:1] = 01120%133%145%
ChargeOption() bit [2:1] = 11200%222%240%
ChargeOption() bit [2:1] = 01 (133%),
InputCurrent() = 0x0400H (10.24mV)
ChargeOption() bit [2:1] = 11 (222%),
InputCurrent() = 0x1F80H (80.64mV)
ACOC deglitch time (specified by design)Voltage across input sense resistor rising to disable charge1.72.53.3ms
Over voltage rising threshold as percentage ofV
V
BAT_REG
Over voltage falling threshold as percentage ofV
V
BAT_REG
Charge over current rising threshold, measure voltage
drop across current sensing resistor
LOGIC OUTPUT OPEN DRAIN (ACOK, SDA, IFAULT, CMPOUT)
V
OUT_ LO
I
OUT_ LEAK
ANALOG INPUT (ACDET, ILIM)
I
IN_ LEAK
ANALOG INPUT (CMPIN has 50kΩ series resistor and 2000kΩ pull down resistor)
I
IN_LEAK
PWM OSCILLATOR
F
SW
F
SW+
F
SW–
PWM HIGH SIDE DRIVER (HIDRV)
R
DS_HI_ON
R
DS_HI_OFF
V
BTST_REFRESH
PWM LOW SIDE DRIVER (LODRV)
R
DS_LO_ON
R
DS_LO_OFF
PWM DRIVER TIMING
t
LOW_HIGH
t
HIGH_LOW
INTERNAL SOFT START
I
STEP
t
STEP
INDEPENDENT COMPARATOR
V
IC_REF1
V
IC_REF2
R
S
R
DOWN
(2) User can adjust threshold via SMBus ChargeOption() REG0x12.
≤ 24 V, 0°C ≤ TJ≤ 125°C, typical values are at TA= 25°C, with respect to GND (unless otherwise noted)
(VCC)
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
Charge under current falling thresholdV
falling towards V
SRP
Light load falling thresholdMeasure voltage drop across current sensing resistor1.25mV
Light load rising hysteresisMeasure voltage drop across current sensing resistor1.25mV
(3) Devices participating in a transfer timeout when any clock low exceeds the 25ms minimum timeout period. Devices that have detected a
timeout condition must reset the communication no later than the 35ms maximum timeout period. Both a master and a slave must
adhere to the maximum value specified as it incorporates the cumulative stretch limit for both a master (10ms) and a slave (25ms).
(4) User can adjust threshold via SMBus ChargeOption() REG0x12.
≤ 24 V, 0°C ≤ TJ≤ 125°C, typical values are at TA= 25°C, with respect to GND (unless otherwise noted)
(VCC)
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
SCLK/SDATA rise time1μs
SCLK/SDATA fall time300ns
SCLK pulse width high450μs
SCLK pulse width low4.7μs
Setup time for START condition4.7μs
START condition hold time after which first clock
pulse is generated
Data setup time250ns
Data hold time300ns
Setup time for STOP condition4µs
Bus free time between START and STOP condition4.7μs
Clock frequency10100kHz
SMBus bus release timeout
Deglitch for watchdog reset signal10ms
Watchdog timeout period, ChargeOption()
bit [14:13] = 01
Watchdog timeout period, ChargeOption()
bit [14:13] = 10
Watchdog timeout period, ChargeOption()
VCC, ACDET, REGN and ACOK Power up (bq24707)Figure 3
Charge Enable by ILIMFigure 4
Current Soft-startFigure 5
Charge Disable by ILIMFigure 6
Continuous Conduction Mode Switching WaveformsFigure 7
Cycle-by-Cycle Synchronous to Non-synchronousFigure 8
100% Duty and Refresh PulseFigure 9
System Load Transient (Input DPM)Figure 10
Battery InsertionFigure 11
Battery to Ground Short ProtectionFigure 12
Battery to Ground Short TransitionFigure 13
Efficiency vs Output CurrentFigure 14
Input current sense resistor negative input. Place an optional 0.1µF ceramic capacitor from ACN to GND for
common-mode filtering. Place a 0.1µF ceramic capacitor from ACN to ACP to provide differential mode filtering.
Input current sense resistor positive input. Place a 0.1µF ceramic capacitor from ACP to GND for common-mode
filtering. Place a 0.1µF ceramic capacitor from ACN to ACP to provide differential-mode filtering.
Open-drain output of independent comparator. Place a 10kΩ pull-up resistor from CMPOUT to pull-up supply rail.
reference, CMPOUT goes HIGH. Place a resistor between CMPIN and CMPOUT to program hysteresis.
Input of independent comparator. It has one 50kΏ series resistor and one 2000kΏ pull-down resistor. Program CMPIN
voltage by connecting a resistor divider from the IOUT pin to the CMPIN pin to the GND pin for adapter or charge
reference is 0.6V or 2.4V, selectable by SMBus command ChargeOption(). When CMPIN is above the internal
reference, CMPOUT goes HIGH. Place a resistor between CMPIN and CMPOUT to program hysteresis.
AC adapter detect open drain output. It is pulled LOW to GND by an internal MOSFET when the voltage on the
ACDET pin is above 2.4V, voltage on the VCC pin is above UVLO and voltage on the VCC pin is 245mV above the
meet, it is pulled HIGH to the external pull-up supply rail by an external pull-up resistor. Connect a 10kΩ pull-up
resistor from the ACOK pin to the pull-up supply rail.
Adapter detection input. Program the adapter valid input threshold by connecting a resistor divider from the adapter
present, ACOK comparator and IOUT are both active.
Buffered adapter or charge current output, selectable with SMBus command ChargeOption(). IOUT voltage is 20 times
pin to GND.
SMBus open-drain data I/O. Connect to the SMBus data line from the host controller or smart battery. Connect a 10kΩ
pull-up resistor according to SMBus specifications.
SMBus open-drain clock input. Connect to the SMBus clock line from the host controller or smart battery. Connect a
10kΩ pull-up resistor according to SMBus specifications.
Charge current limit input. Program ILIM voltage by connecting a resistor divider from the system reference 3.3V rail to
the ILIM pin to the GND pin. The lower of the ILIM voltage or DAC limit voltage sets the charge current regulation limit.
To disable control on ILIM, set ILIM above 1.6V. Once the voltage on the ILIM pin falls below 75mV, charge is
disabled. Charge is enabled when the ILIM pin rises above 105mV.
Open-drain output. It is pulled LOW by an internal MOSFET when ACOC or a short circuit is detected. It is pulled
HIGH to the external pull-up supply rail by an external pull-up resistor in normal condition.
Charge current sense resistor negative input. The SRN pin is for battery voltage sensing as well. Connect SRN pin to
a 7.5 Ω resistor first then from resistor another terminal connect a 0.1µF ceramic capacitor to GND for common-mode
to provide differential mode filtering. See application information about negative output voltage protection for hard
shorts on battery to ground or battery reverse connection by adding small resistor.
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PIN FUNCTIONS – 20-PIN QFN
DESCRIPTION
Product Folder Link(s): bq24707 bq24707A
bq24707
bq24707A
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PIN FUNCTIONS – 20-PIN QFN (continued)
PIN
NO.NAME
Charge current sense resistor positive input. Connect SRP pin to a 10 Ω resistor first then from resistor another
13SRP
14GND
15LODRVLow side power MOSFET driver output. Connect to low side n-channel MOSFET gate.
16REGNvoltage on the ACDET pin is above 0.6V and voltage on VCC is above UVLO. Connect a 1uF ceramic capacitor from
17BTST
18HIDRVHigh side power MOSFET driver output. Connect to the high side n-channel MOSFET gate.
19PHASEHigh side power MOSFET driver source. Connect to the source of the high side n-channel MOSFET.
20VCC
PowerPADsolder PowerPAD to the board, and have vias on the PowerPAD plane connecting to analog ground and power
terminal connect to current sensing resistor. Connect a 0.1µF ceramic capacitor between current sensing resistor to
provide differential mode filtering. See application information about negative output voltage protection for hard shorts
on battery to ground or battery reverse connection by adding small resistor.
IC ground. On PCB layout, connect to the analog ground plane, and only connect to power ground plane through the
PowerPAD underneath the IC.
Linear regulator output. REGN is the output of the 6V linear regulator supplied from VCC. The LDO is active when the
REGN to GND.
High side power MOSFET driver power supply. Connect a 0.047µF capacitor from BTST to PHASE, and a bootstrap
Schottky diode from REGN to BTST.
Input supply, diode OR from adapter or battery voltage. Use 10Ω resistor and 1µF capacitor to ground as low pass
filter to limit inrush current.
Exposed pad beneath the IC. Analog ground and power ground star-connected only at the PowerPAD plane. Always
ground planes. It also serves as a thermal pad to dissipate the heat.