Texas Instruments BQ24380DSGR, BQ24381DSGR, BQ24382DSGR Schematic

1

8

VDC

GND

1 Fm

IN

OUT

VBAT

bq24380

1 Fm

Charging

Circuit

6

SYSTEM

AC Adapter

2

VSS

bq24380 bq24381 bq24382

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......................................................................................................................................................... SLUS805B – APRIL 2008 – REVISED MARCH 2009

Overvoltage and Overcurrent Protection IC and Li+ Charger Front-End Protection IC With

LDO Mode

1

FEATURES DESCRIPTION

2

• Input Overvoltage Protection

• Accurate Battery Overvoltage Protection

• Output Short-Circuit Protection

• Soft-Start to Prevent Inrush Currents

• Soft-Stop to Prevent Voltage Spikes regulator, maintaining a 5.5-V (bq24380) or 5-V

• 30-V Maximum Input Voltage

• Supports up to 1.7-A Load Current

• Thermal Shutdown

• Enable Function

• Fault Status Indication

• Small 2 mm × 2 mm 8-Pin SON Package

APPLICATIONS

• Smart Phones, Mobile Phones

• PDAs

• MP3 Players

• Low-Power Handheld Devices

The bq2438x family are charger front-end integrated circuits designed to provide protection to Li-ion batteries from failures of the charging circuitry. The IC continuously monitors the input voltage and the battery voltage. The device operates like a linear

(bq24381, bq24382) output with input voltages up to the Input overvoltage threshold. During input overvoltage conditions, the IC immediately turns off the internal pass FET disconnecting the charging circuitry from the damaging input source. Additionally, if the battery voltage rises to unsafe levels while charging, power is removed from the system. The IC checks for short-circuit or overload conditions at its output when turning the pass FET on, and if it finds unsafe conditions, it switches off, and then rechecks the conditions. Additionally, the IC also monitors its die temperature and switches off if it exceeds 140 ° C.

When the IC is controlled by a processor, the IC provides status information about fault conditions to the host.

APPLICATION SCHEMATIC

1

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2 PowerPAD is a trademark of Texas Instruments.

PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.

bq24380 bq24381 bq24382

SLUS805B – APRIL 2008 – REVISED MARCH 2009 .........................................................................................................................................................

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

ORDERING INFORMATION

DEVICE V

bq24380 6.3 V 5.5 V 2mm x 2mm SON CFE bq24381 7.1 V 5 V 2mm x 2mm SON CFW bq24382 10.5 V 5 V 2mm x 2mm SON OBE

(1) For the most current package and ordering information, see the Package Option Addendum at the end

of this document, or see the TI Web site at www.ti.com .

OVP

V

O(REG)

PACKAGE

(1)

MARKING

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ABSOLUTE MAXIMUM RATINGS

(1)

over operating free-air temperature range (unless otherwise noted)

VALUE UNIT

IN (with respect to VSS) – 0.3 to 30 V

V

I

max Output source current OUT 2 A

OUT

T

J

T

stg

(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage values are with respect to the network ground terminal unless otherwise noted.

Input voltage OUT (with respect to VSS) – 0.3 to 12 V

FAULT, CE, VBAT (with respect to VSS) – 0.3 to 7 V

Output sink current FAULT 15 mA Junction temperature – 40 to 150 ° C Storage temperature – 65 to 150 ° C

DISSIPATION RATINGS

PACKAGE R

DSG 5 ° C/W 75 ° C/W

θ JC

R

θ JA

RECOMMENDED OPERATING CONDITIONS

MIN MAX UNIT

V

I

O

T

J

IN voltage range 3.3 30 V Current, OUT pin 1.7 A Junction temperature -40 125 ° C

Product Folder Link(s): bq24380 bq24381 bq24382

bq24380 bq24381 bq24382

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ELECTRICAL CHARACTERISTICS

Over junction temperature range -40 ° C ≤ TJ≤ 125 ° C and recommended supply voltage (unless otherwise noted)

IN

UVLO CE = LO or HI, VIN: 0 V → 3 V 2.5 2.8 V V

hys(UVLO)

t

DGL(PGOOD)

I

DD

I

STDBY

INPUT-TO-OUTPUT CHARACTERISTICS

V

DO

I

OFF

INPUT OVERVOLTAGE PROTECTION

V

O(REG)

V

OVP

V

hys(OVP)

t

PD(OVP)

t

REC(OVP)

OUTPUT SHORT-CIRCUIT PROTECTION (only at start-up)

I

O(SC)

t

REC(SC)

BATTERY OVERVOLTAGE PROTECTION

BV

OVP

V

hys(BVovp)

I

(VBAT)

t

DGL(BVovp)

THERMAL PROTECTION

T

J(OFF)

T

J(OFF-HYS)

LOGIC LEVELS ON CE

V

IL

V

IH

I

IL

I

IH

LOGIC LEVELS ON FAULT

V

OL

I

lkg

(1) Not tested. Specified by design

......................................................................................................................................................... SLUS805B – APRIL 2008 – REVISED MARCH 2009

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

Undervoltage lock-out, input power detected threshold

Hysteresis on UVLO CE = LO or HI, VIN: 3 V → 0 V 200 300 mV Deglitch time, input power detected status 8 ms

Operating current bq24381 300 µ A

CE = LO or HI. Time measured from VIN0 V → 5 V 1- µ s rise-time

CE = LO, no load on OUT pin, VIN= 5 V

bq24380 250

bq24382 300

Standby current CE = HI, VIN= 5.5 V 100 µ A

Dropout voltage IN to OUT CE = LO, VIN= 5 V, I

= 1 A 280 mV

(OUT)

Q1 off-state leakage current CE = HI, VIN= 5.5 V 10 µ A

bq24380 5.3 5.5 5.7

Output voltage CE = LO, VIN= 6 V bq24381 4.8 5 5.2 V

bq24382 4.8 5 5.2 bq24380 6.1 6.3 6.5

Input overvoltage protection threshold CE = LO, VIN: 5 V → 8 V bq24831 6.88 7.1 7.31 V

bq24382 10.17 10.5 10.83

CE = LO or HI, VIN: 7 V → 5 V bq24380 25 110

Hysteresis on OVP bq24831 25 120 mV

(1)

Input OV propagation delay VIN: 5 V → 10 V 200 ns Recovery time from input overvoltage condition 8 ms

Short-circuit detection threshold 3 V < VIN< V

CE = LO or HI, VIN: 8 V → 5 V

CE = LO. Time measured from VIN: 7 V → 5 V, 1- µ s fall-time

- V

OVP

hys(OVP)

bq24382 150 300

1.3 1.5 1.7 A

Retry interval if short-circuit detected 64 ms

Battery overvoltage protection threshold VIN> 4.5 V, CE = LO 4.3 4.35 4.4 V Hysteresis on BV

(OVP)

VIN> 4.5 V, CE = LO 200 320 mV

Input bias current on VBAT pin TJ= 25 ° C 10 nA

VIN> 4.5 V, CE = LO, Time measured from

Deglitch time, battery overvoltage detected V

rising from 4.1 V to 4.4 V to FAULT 176 µ s

VSAT

going low.

Thermal shutdown temperature 140 150 ° C Thermal shutdown hysteresis 20 ° C

Logic LOW input voltage 0 0.4 V Logic HIGH input voltage 1.4 V

VCE= 1.8 V 15 µ A

Output LOW voltage I Off-state leakage current, HI-Z V

= 5 mA 0.2 V

SINK

= 5 V 10 µ A

FAULT

1 µ A

Product Folder Link(s): bq24380 bq24381 bq24382

IN

VSS

NC

FAULT

OUT

NC

VBAT

CE

bq2438x

1

2

3

4

8

7

6

5

bq24380 bq24381 bq24382

SLUS805B – APRIL 2008 – REVISED MARCH 2009 .........................................................................................................................................................

DEVICE INFORMATION

TERMINAL FUNCTIONS

TERMINAL

NAME NO.

IN 1 I Input power, connected to external DC supply. Bypass IN to VSS with a ceramic capacitor (1 µ F minimum) VSS 2 – Ground terminal. Connect to the thermal pad and to the ground rail of the circuit. NC 3, 7 Do not connect to any external circuits. These pins may have internal connections used for test purposes.

FAULT 4 O off due to input overvoltage or output short-circuit conditions, an overtemperature condition, or because the

CE 5 I VBAT 6 I Battery voltage sense input. Connected to pack positive terminal through a 100-k Ω resistor.

OUT 8 O Output terminal to the charging system. Bypass OUT to VSS with a ceramic capacitor (1 µ F minimum)

Thermal PAD potential as the VSS pin on the printed circuit board. Do not use the thermal pad as the primary ground input

I/O DESCRIPTION

Open-drain device status output. FAULT is pulled to VSS internally when the input pass FET has been turned battery voltage is outside safe limits. FAULT is high impedance during normal operation.

Active-low chip enable input. Connect CE = HI to turn the input pass FET off. Connect CE = LOW to turn the internal pass FET on and connect the input to the charging circuitry. CE is Internally pulled down, ~200 k Ω .

The thermal pad is electrically connected to VSS internally. The thermal pad must be connected to the same for the device. VSS pin must be connected to ground at all times.

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Product Folder Link(s): bq24380 bq24381 bq24382

V 2V/div

FAULT

V 500mV/div

OUT

t-Time-2ms/div

V 5V/div

IN

V 2V/div

IN

V

2V/div

OUT

I 500mA/div

OUT

R =6.6

OUT

W

t-Time-2ms/div

V

2V/div

IN

V 2V/div

OUT

V 2V/div

FAULT

t-Time-200ms/div

V

2V/div

IN

V

2V/div

OUT

V

2V/div

FAULT

V =6Vto9Vstep

IN

t-Time-5 s/divm

V 5V/div

IN

V

2V/div

OUT

V =10Vto6Vstep

IN

V 2V/div

FAULT

t-Time-2ms/div

V 5V/div

IN

V

5V/div

OUT

I

1 A/div

OUT

V

2V/div

FAULT

t-Time-5ms/div

bq24380 bq24381 bq24382

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......................................................................................................................................................... SLUS805B – APRIL 2008 – REVISED MARCH 2009

TYPICAL CHARACTERISTICS

NORMAL POWER-ON

SHOWING SOFT-START (bq24380) OVP at POWER-ON

Figure 1. Figure 2.

OVP RESPONSE for INPUT STEP (bq24380) SLOW INPUT RAMPINTO OVP EVENT (bq24380)

Figure 3. Figure 4.

RECOVERY FROM OVP (bq24380) POWER UP INTO SHORT CIRCUIT

Figure 5. Figure 6.

Product Folder Link(s): bq24380 bq24381 bq24382

V 2V/div

OUT

V =3.8Vto4.5Vstep

BAT

V 2V/div

FAULT

t-Time-50 s/divm

V 1V/div

BAT

V 5V/div

IN

V 500mV/div

OUT

I 1 A/div

OUT

t-Time-20 s/divm

2.40

2.45

2.50

2.55

2.60

2.65

2.70

2.75

-40 -15 10 35 60 85 110 135

T -Free-AirTemperature-°C

A

UVLO-UndervoltageLockout-V

V Rising

IN

V Falling

IN

50

90

130

170

210

250

-40 -15 10 35 60 85 110 135

DROPOUTVOLTAGE-mV

T -Free-AirTemperature-°C

A

I =1 A

OUT

V =5V

IN

V =4V

IN

6.0

6.4

6.8

7.0

7.2

7.4

–40 –15 10 35 60 85 110 135

V – Threshold – V

OVP

T – Free-AirTemperature – °C

A

6.6

6.2

V Rising

IN

V Rising

IN

V Falling

IN

bq24380

bq24381

V Falling

IN

4.90

5.00

5.10

5.20

5.30

5.40

5.50

5.60

–40 –15

10 35 60 85

110 135

V – OutputVoltage

–

V

OUT(REG)

T – Free-AirTemperature – °C

A

bq24380

bq24381

bq24380 bq24381 bq24382

SLUS805B – APRIL 2008 – REVISED MARCH 2009 .........................................................................................................................................................

TYPICAL CHARACTERISTICS (continued)

SOFT-STOP DURING OCP EVENT (bq24380) BATTERY OVP EVENT (bq24380)

Figure 7. Figure 8.

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UVLO DROPOUT VOLTAGE

vs vs

FREE-AIR TEMPERATURE FREE-AIR TEMPERATURE

Figure 9. Figure 10.

OUTPUT VOLTAGE REGULATION, V

vs vs

O(REG)

FREE-AIR TEMPERATURE FREE-AIR TEMPERATURE

OVP THRESHOLD

Figure 11. Figure 12.

Product Folder Link(s): bq24380 bq24381 bq24382

4.05

4.10

4.15

4.20

4.25

4.30

4.35

4.40

-40 -15 10 35 60 85 110 135

V

-Threshold-V

BOVP

T -Free-AirTemperature-°C

A

V Rising

BAT

V Falling

BAT

0

5

10

15

20

25

-40 -15 10 35 60 85 110 135

I -BatLeakageCurrent-nA

Ikg

T -Free-AirTemperature-°C

A

0

100

200

300

400

500

600

700

800

900

1000

0 5 10 15 20 25 30

V – InputVoltage – V

IN

I – SupplyCurrent – A

CC

m

ICEnabled

ICDisabled

V

O(REG)

0

100

200

300

400

500

600

700

800

900

1000

0 5 10 15 20 25 30

V – InputVoltage – V

IN

I – SupplyCurrent – A

CC

m

V

O(REG)

ICEnabled

ICDisabled

bq24380 bq24381 bq24382

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......................................................................................................................................................... SLUS805B – APRIL 2008 – REVISED MARCH 2009

TYPICAL CHARACTERISTICS (continued)

OVP THRESHOLD, V

vs vs

BOVP

LEAKAGE CURRENT (VBAT PIN)

FREE-AIR TEMPERATURE FREE-AIR TEMPERATURE

Figure 13. Figure 14.

SUPPLY CURRENT SUPPLY CURRENT

vs vs

INPUT VOLTAGE (bq24380) INPUT VOLTAGE (bq24381)

Figure 15. Figure 16.

Product Folder Link(s): bq24380 bq24381 bq24382

1

8

VDC

GND

1 Fm

IN

OUT

VBAT

bq24380

1 Fm

Charging

Circuit

6

SYSTEM

AC Adapter

2

VSS

4

5

FAULT

CE

R

PU

100kW

47kW

R

FAULT

47kW

R

CE

R

BAT

1. Short-circuitduringstart-up

2. Normalstart-upcondition

3. Batteryovervoltageevent

4. V

UVLO

< VIN< V

OREG

-- V

OUT

tracksV

IN

5. Inputovervoltageevent

6. InputbelowUVLO

7. High-currenteventduringnormaloperation

t

CHK(SC)

t

SStart

t

SStop

t

REC(SC)

t

SStart

t

DGL(BVOVP)

t

PD(OVP)

t

DGL(PGOOD)

t

REC(OVP)

5

4

2

4

6

7

22

1

3

Input

Voltage

Output

Voltage

CE

UVLO

FAULT

Output

Current

Battery Voltage

V

OVP

V

OVP hys(OVP)

-V

V

O(REG)

V

O(REG)

I

O(SC)

BV

BV -V

(OVP)

(OVP) hys(BVOVP)

bq24380 bq24381 bq24382

SLUS805B – APRIL 2008 – REVISED MARCH 2009 .........................................................................................................................................................

Figure 17. Typical Application Circuit

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Figure 18. Timing Diagram

Product Folder Link(s): bq24380 bq24381 bq24382

bq24380 bq24381 bq24382

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The bq2438x is a highly integrated circuit designed to provide protection to Li-ion batteries from failures of the charging circuit and the input source. The IC continuously monitors the input voltage and the battery voltage. The device operates like a linear regulator, maintaining a 5.5-V (bq24380) or 5-V (bq24381, bq24382) output with input voltages up to the input overvoltage threshold (V pass FET and disconnects the system from input power. Additionally, if the battery voltage rises above 4.35 V, the IC switches off the pass FET, removing the power from the system until the battery voltage falls to safe levels. The IC also monitors its die temperature and switches the pass FET off if it exceeds 140 ° C.

The IC can be controlled by a processor, and also provides status information about fault conditions to the host.

POWER DOWN

The device remains in power-down mode when the input voltage at the IN pin is below the undervoltage threshold (UVLO) of 2.8 V. The FET connected between the IN and OUT pins is off, and the status output, FAULT, is set to HI-Z.

POWER ON RESET

The device resets when the input voltage at the IN pin exceeds the UVLO threshold. During power-on reset, the IC waits for duration t voltage are within operation limits, the pass FET is turned ON. The IC has a soft-start feature to control the inrush current. The soft-start minimizes the ringing at the input due to the resonant circuit formed by the parasitic inductance of the adapter cable and the input bypass capacitor. During the soft-start time, t is stepped up in 8 equal steps every 625 µ s. Each step is 1/8 of the I the IC samples the load current. If the load current exceeds I

Startup Short-Circuit Protection section for details. If no overcurrent event is measured, the current monitoring

circuitry is disabled for normal operation. In the event a short-circuit is detected at power-on, to prevent the input voltage from spiking up when the pass

FET is switched off (due to the inductance of the input cable), The pass FET is turned off by gradually reducing its gate-drive, resulting in a soft-stop (t

......................................................................................................................................................... SLUS805B – APRIL 2008 – REVISED MARCH 2009

DETAILED FUNCTIONAL DESCRIPTION

). If the input voltage exceeds V

OVP

DGL(PGOOD)

for the input voltage to stabilize. If, after t

O(SC)

, the IC initiates short circuit protection. See the

O(SC)

).

SStop

DGL(PGOOD)

. After the soft-start sequence is over,

, the input voltage and battery

, the IC shuts off the

OVP

, the current limit

SStart

DETAILED FUNCTIONAL DESCRIPTION

The device continuously monitors the input voltage and the battery voltage as described in detail below:

Input Overvoltage Protection

The OUT output of the bq2438x operates similar to a linear regulator. While the input voltage is less than V pass FET). When the input voltage is greater than V voltage is regulated to V input voltage is increased above V circuitry connected to OUT. The FAULT output is then asserted low. When the input voltage drops below V V ensures that the input supply has stabilized. The condition 5 in Figure 18 illustrates an input overvoltage event.

Battery Overvoltage Protection

The battery overvoltage threshold BV illustrates a battery overvoltage event. If the battery voltage exceeds the BV t (using the soft-start sequence) once the battery voltage drops to BV

Thermal Protection

If the junction temperature of the device exceeds T asserted low. The FET is turned on when the junction temperature falls below T

, and above the UVLO, the output voltage tracks the input voltage (less the drop caused by R

O(REG)

. V

O(REG)

hys(OVP)

DGL(BVovp)

(but is still above UVLO), the pass FET is turned on after a deglitch time of t

, the pass FET is turned off (using soft-stop), and FAULT is asserted low. The pass FET is turned on

is 5.5 V for the bq24380, and 5 V for the bq24381 and bq24382. If the

O(REG)

, the internal pass FET is turned off, removing power from the charging

OVP

is internally set to 4.35 V for the bq2438x. Condition 3 in Figure 18

OVP

(plus the R

O(REG)

OVP

, the pass FET is turned off, and the FAULT output is

J(OFF)

drop) and less than V

DS(on)

– V

hys(BVovp)

J(OFF)

OVP

.

OVP

REC(OVP)

. The deglitch time

threshold for longer than

– T

J(OFF-HYS)

.

DS(on)

, the output

of the

–

OVP

Product Folder Link(s): bq24380 bq24381 bq24382

bq24380 bq24381 bq24382

SLUS805B – APRIL 2008 – REVISED MARCH 2009 .........................................................................................................................................................

Start-Up Short-Circuit Protection

The bq2438x features overload current protection during start-up. The condition 1 in Figure 18 illustrates start-up into an overload condition. If after the eight soft-start steps are complete, and the current limit is exceeded, the IC initiates a short-circuit check timer (t t

CHK(SC)

timer expires and the current remains clamped by the current limit, the internal pass FET is turned off

using the soft-stop method, FAULT is pulled low and the t

). During this check, the current is clamped to I

CHK(SC)

REC(SC)

timer begins. Once the t

O(SC)

REC(SC)

FAULT becomes high impedance and the soft-start sequence restarts. The device repeats the start/fail sequence until the overload condition is removed. Once the overload condition is removed, the current limit circuitry is disabled and the device enters normal operation. Additionally, if the current is not limited after the completion of the soft-start sequence, the t

CHK(SC)

timer does not start and the current limit circuitry is disabled for normal

operation.

Enable Function

The IC has an enable pin which is used to enable and disable the device. Connect the CE pin high to turn off the internal pass FET. Connect the CE pin low to turn on the internal pass FET and enter the start-up routine. The CE pin has an internal pulldown resistor and can be left unconnected. The FAULT pin is high impedance when the CE pin is high.

Fault Indication

The FAULT pin is an active-low, open-drain output. It is in a high-impedance state when operating conditions are safe, or when the device is disabled by setting CE high. With CE low, the FAULT pin goes low whenever any of these events occurs:

1. Output short-circuit at power-on

2. Input overvoltage

3. Battery overvoltage

4. IC overtemperature

See Figure 18 for an example of FAULT conditions during these events. Connect the FAULT pin to the desired logic level voltage rail through a resistor between 1 k Ω and 50 k Ω .

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. If the 5-ms

timer expires,

Product Folder Link(s): bq24380 bq24381 bq24382

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......................................................................................................................................................... SLUS805B – APRIL 2008 – REVISED MARCH 2009

APPLICATION INFORMATION

Selection of R

(BAT)

It is recommended that the battery not be tied directly to the VBAT pin of the device, as under some failure modes of the IC, the voltage at the IN pin may appear on the VBAT pin. This voltage can be as high as 30 V, and applying 30 V to the battery may cause failure of the device and can be hazardous. Connecting the VBAT pin through R must have a high value. The problem with a large R the VBAT bias current, I tolerance on the nominal 4.35-V BV

Choosing R

prevents a large current from flowing into the battery in the event of failure. For safety, R

(BAT)

, which causes an error in the BV

(VBAT)

in the range of 100 k Ω to 470 k Ω is a good compromise. If the IC fails with R

(BAT)

threshold.

OVP

is that the voltage drops across the resistor because of

(BAT)

threshold. This error is over and above the

OVP

equal to 100

(BAT)

k Ω , the maximum current flowing into the battery would be (30 V – 3 V) ÷ 100 k Ω = 246 µ A, which is low enough to be absorbed by the bias currents of the system components. R voltage drop of R BV

threshold.

OVP

× I

(BAT)

≈ 1 mV. This is negligible compared to the internal tolerance of 50 mV on the

(VBAT)

equal to 100 k Ω results in a worst-case

(BAT)

If the Bat-OVP function is not required, the VBAT pin must be connected to VSS.

Selection of R

(CE)

The CE pin can be used to enable and disable the IC. If host control is not required, the CE pin can be tied to ground or left unconnected, permanently enabling the device.

In applications where external control is required, the CE pin can be controlled by a host processor. As with the VBAT pin (see previous discussion), the CE pin must be connected to the host GPIO pin through as large a resistor as possible. The limitation on the resistor value is that the minimum V drop across the resistor must be greater than V R

× IIH.

(CE)

of the bq2430x CE pin. The drop across the resistor is given by

IH

of the host GPIO pin less the

OH

(BAT)

Selection of Input and Output Bypass Capacitors

The input capacitor C downwards in the system load current occurs, the inductance of the input cable causes the input voltage to spike up. C

prevents the input voltage from overshooting to dangerous levels. It is recommended that a ceramic

IN

capacitor of at least 1 µ F be used at the input of the device. It must be located in close proximity to the IN pin. C

in Figure 17 is also important. During an overvoltage transient, this capacitance limits the output overshoot

OUT

until the power FET is turned off by the overvoltage protection circuitry. C least 1 µ F, located close to the OUT pin. C circuit downstream of the protection IC.

in Figure 17 is for decoupling and serves an important purpose. Whenever a step change

IN

must be a ceramic capacitor of at

also serves as the input decoupling capacitor for the charging

OUT

PCB Layout Guidelines

1. This device is a protection device and is meant to protect down-stream circuitry from hazardous voltages. Potentially, high voltages may be applied to this IC. It has to be ensured that the edge-to-edge clearances of PCB traces satisfy the design rules for the maximum voltages expected to be seen in the system.

2. The device uses SON packages with a PowerPAD™. For good thermal performance, the PowerPAD must be thermally coupled with the PCB ground plane. In most applications, this requires a copper pad directly under the IC. This copper pad should be connected to the ground plane with an array of thermal vias.

3. C

and C

IN

should be located close to the IC. Other components like R

OUT

should also be located close to

(BAT)

the IC.

Product Folder Link(s): bq24380 bq24381 bq24382

PACKAGE OPTION ADDENDUM

www.ti.com

11-Apr-2013

PACKAGING INFORMATION

Orderable Device Status

BQ24380DSGR ACTIVE WSON DSG 8 3000 Green (RoHS

BQ24380DSGRG4 ACTIVE WSON DSG 8 3000 Green (RoHS

BQ24380DSGT ACTIVE WSON DSG 8 250 Green (RoHS

BQ24380DSGTG4 ACTIVE WSON DSG 8 250 Green (RoHS

BQ24381DSGR ACTIVE WSON DSG 8 3000 Green (RoHS

BQ24381DSGRG4 ACTIVE WSON DSG 8 3000 Green (RoHS

BQ24381DSGT ACTIVE WSON DSG 8 250 Green (RoHS

BQ24381DSGTG4 ACTIVE WSON DSG 8 250 Green (RoHS

BQ24382DSGR ACTIVE WSON DSG 8 3000 Green (RoHS

BQ24382DSGT ACTIVE WSON DSG 8 250 Green (RoHS

(1)

The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device.

Package Type Package

(1)

Drawing

Pins Package

Qty

Eco Plan

(2)

& no Sb/Br)

Lead/Ball Finish MSL Peak Temp

(3)

Op Temp (°C) Top-Side Markings

CU NIPDAU Level-2-260C-1 YEAR -40 to 125 CFE

CU NIPDAU Level-2-260C-1 YEAR -40 to 125 CFW

CU NIPDAU Level-2-260C-1 YEAR -40 to 125 OBE

(4)

(2)

Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

Samples

Addendum-Page 1

PACKAGE OPTION ADDENDUM

www.ti.com

11-Apr-2013

(3)

MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4)

Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a

continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 2

PACKAGE MATERIALS INFORMATION

www.ti.com 4-Sep-2010

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package

Type

BQ24380DSGR WSON DSG 8 3000 179.0 8.4 2.2 2.2 1.2 4.0 8.0 Q2

BQ24380DSGT WSON DSG 8 250 179.0 8.4 2.2 2.2 1.2 4.0 8.0 Q2

BQ24381DSGR WSON DSG 8 3000 179.0 8.4 2.2 2.2 1.2 4.0 8.0 Q2

BQ24381DSGT WSON DSG 8 250 179.0 8.4 2.2 2.2 1.2 4.0 8.0 Q2

BQ24382DSGR WSON DSG 8 3000 179.0 8.4 2.2 2.2 1.2 4.0 8.0 Q2

BQ24382DSGT WSON DSG 8 250 179.0 8.4 2.2 2.2 1.2 4.0 8.0 Q2

Package

Drawing

Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

A0

(mm)B0(mm)K0(mm)P1(mm)W(mm)

Pin1

Quadrant

Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION

www.ti.com 4-Sep-2010

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

BQ24380DSGR WSON DSG 8 3000 195.0 200.0 45.0 BQ24380DSGT WSON DSG 8 250 195.0 200.0 45.0 BQ24381DSGR WSON DSG 8 3000 195.0 200.0 45.0 BQ24381DSGT WSON DSG 8 250 195.0 200.0 45.0 BQ24382DSGR WSON DSG 8 3000 195.0 200.0 45.0 BQ24382DSGT WSON DSG 8 250 195.0 200.0 45.0

Pack Materials-Page 2

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Texas Instruments BQ24380DSGR, BQ24381DSGR, BQ24382DSGR Schematic [ru]

Specifications and Main Features

Frequently Asked Questions

User Manual

FEATURES DESCRIPTION

APPLICATIONS

APPLICATION SCHEMATIC

ABSOLUTE MAXIMUM RATINGS

DISSIPATION RATINGS

RECOMMENDED OPERATING CONDITIONS

ELECTRICAL CHARACTERISTICS

DEVICE INFORMATION

TYPICAL CHARACTERISTICS

POWER DOWN

POWER ON RESET

DETAILED FUNCTIONAL DESCRIPTION

DETAILED FUNCTIONAL DESCRIPTION

Input Overvoltage Protection

Battery Overvoltage Protection

Thermal Protection

Start-Up Short-Circuit Protection

Enable Function

Fault Indication

APPLICATION INFORMATION

Selection of Input and Output Bypass Capacitors

PCB Layout Guidelines