1A, Single-Input, Single Cell Li-Ion Battery Charger
Check for Samples: bq24090, bq24091, bq24092, bq24093
1
FEATURES
•CHARGING
– 1% Charge Voltage Accuracy
– 10% Charge Current Accuracy
– Pin Selectable USB 100mA and 500mA
Maximum Input Current Limit
– Programmable Termination and Precharge
Threshold
•PROTECTION
– 6.6V Over-Voltage Protection
– Input Voltage Dynamic Power Management
– 125°C Thermal Regulation; 150°C Thermal
Shutdown Protection
– OUT Short-Circuit Protection and ISET
Short Detection
– Operation Over JEITA Range via Battery
NTC – ½ Fast-Charge-Current at Cold,
4.06V at Hot, bq24092/3
– Fixed 10 Hour Safety Timer
•SYSTEM
– Automatic Termination and Timer Disable
Mode (TTDM) for Absent Battery Pack With
Thermistor
– Status Indication – Charging/Done
– Available in Small 10-Pin MSOP Package
APPLICATIONS
•Smart Phones
•PDAs
•MP3 Players
•Low-Power Handheld Devices
DESCRIPTION
The bq2409x series of devices are highly integrated
Li-ionlinearchargersdevicestargetedat
space-limited portable applications. The devices
operate from either a USB port or AC adapter. The
high input voltage range with input overvoltage
protection supports low-cost unregulated adapters.
The bq2409x has a single power output that charges
the battery. A system load can be placed in parallel
with the battery as long as the average system load
does not keep the battery from charging fully during
the 10 hour safety timer.
The battery is charged in three phases: conditioning,
constant current and constant voltage. In all charge
phases, an internal control loop monitors the IC
junction temperature and reduces the charge current
if an internal temperature threshold is exceeded.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
DESCRIPTION CONTINUED
The charger power stage and charge current sense functions are fully integrated. The charger function has high
accuracy current and voltage regulation loops, charge status display, and charge termination. The pre-charge
current and termination current threshold are programmed via an external resistor. The fast charge current value
is also programmable via an external resistor.
over operating free-air temperature range (unless otherwise noted)
VALUEUNIT
IN (with respect to VSS)–0.3 to 7V
Input Voltage
Input CurrentIN1.25A
Output Current (Continuous)OUT1.25A
Output Sink CurrentCHG15mA
T
T
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
Junction temperature–40 to 150°C
J
Storage temperature–65 to 150°C
STG
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage
values are with respect to the network ground terminal unless otherwise noted.
PACKAGE DISSIPATION RATINGS
PACKAGER
5x3mm MSOP52°C/W48°C/W1.92 W19.2 mW/°C
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
Web site at www.ti.com.
(2) This data is based on using the JEDEC High-K board and the exposed die pad is connected to a copper pad on the board. This is
connected to the ground plane by a 2×3 via matrix
OUT (with respect to VSS)–0.3 to 7V
PRE-TERM, ISET, ISET2, TS, CHG, PG, ASI, ASO (with respect to
IN voltage range3.57V
IN operating voltage range, Restricted by V
DPM
and V
OVP
4.456.45V
Input current, IN pin1.0A
Current, OUT pin1.0A
Junction temperature0125°C
Programs precharge and termination current thresholds110kΩ
Fast-charge current programming resistor0.67549.9kΩ
10k NTC thermistor range without entering BAT_EN or TTDM1.66258kΩ
(1) Operation with VINless than 4.5V or in drop-out may result in reduced performance.
ELECTRICAL CHARACTERISTICS
Over junction temperature range 0°C ≤ TJ≤ 125°C and recommended supply voltage (unless otherwise noted)
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
INPUT
UVLOUndervoltage lock-out ExitVIN: 0V → 4V Update based on sim/char3.153.33.45V
V
HYS_UVLO
V
IN-DT
V
HYS-INDT
t
DGL(PG_PWR)
t
DGL(PG_NO-
PWR)
V
OVP
t
DGL(OVP-SET)
V
HYS-OVP
t
DGL(OVP-REC)
V
IN-DPM
I
IN-USB-CL
Hysteresis on V
Input power good detection threshold
is V
+ V
OUT
IN-DT
Hysteresis on V
Deglitch time on exiting sleep.45ms
Deglitch time on V
down. Same as entering sleep.PG = OC, V
Input over-voltage protection threshold VIN: 5V → 7V6.56.656.8V
Input over-voltage blanking timeVIN: 5V → 7V113ms
Hysteresis on OVPVIN: 7V → 5V95mV
Deglitch time exiting OVP30ms
USB/Adaptor low input voltage
protection. Restricts lout at V
USB input I-Limit 100mAISET2 = Float; R
USB input I-Limit 500mAISET2 = High; R
ISET SHORT CIRCUIT TEST
R
ISET_SHORT
t
DGL_SHORT
I
OUT_CL
Highest Resistor value considered aRiset: 600Ω → 250Ω, I
fault (short). Monitored for Iout>90mAReset.
Deglitch time transition from ISET
short to Iout disable
Maximum OUT current limit Regulation
(Clamp)
BATTERY SHORT PROTECTION
V
OUT(SC)
V
OUT(SC-HYS)
I
OUT(SC)
OUT pin short-circuit detection
threshold/ precharge threshold
OUT pin Short hysteresis77mV
Source current to OUT pin during
short-circuit detection
UVLO_RISE
IN-DT
falling175227280mV
fallingV
powerTime measured from VIN: 5V → 3.2V 1ms fall-time to
HYS-INDT
IN-DPM
VIN: 4V→0V,
V
UVLO_FALL
(Input power good if VIN> V
V
OUT
OUT
= V
UVLO_RISE–VHYS-UVLO
+ V
= 3.6V, VIN: 3.5V → 4V
OUT
IN-DT
);
3080145mV
= 3.6V, VIN: 4V → 3.5V31mV
Time measured from VIN: 0V → 5V 1ms rise-time to
PG = low, V
OUT
OUT
= 3.6V
= 3.6V
29ms
Time measured from VIN: 7V → 5V 1ms fall-time to
PG = LO
Feature active in USB mode; Limit Input Source
Current to 50mA; V
OUT
= 3.5V; R
ISET
= 825Ω
Feature active in Adaptor mode; Limit Input Source
Current to 50mA; V
= 3.5V; R
OUT
= 825Ω8592100
ISET
= 825Ω430462500
ISET
latches off. Cycle power to
OUT
ISET
= 825Ω
4.344.44.46
4.244.34.36
280500Ω
Clear fault by cycling IN or TS/BAT_EN1ms
VIN= 5V, V
NTC bias current, bq24090/2VTS= 0.3V485052mA
NTC bias current, bq24091/3VTS= 0.3V4.85.05.2mA
10k NTC bias current when Charging
is disabled, bq24090/2
10k NTC bias current when Charging
is disabled, bq24091/3
INTC is reduced prior to entering
I
NTC-FLDBK-10k
TTDM to keep cold thermistor fromVTS: Set to 1.525V456.5mA
entering TTDM, bq24090/2
INTC is reduced prior to entering
I
NTC-FLDBK-100k
V
TTDM(TS)
V
HYS-TTDM(TS)
V
CLAMP(TS)
t
DGL(TTDM)
V
TS_I-FLDBK
C
TS
V
TS-0°C
V
HYS-0°C
V
TS-10°C
V
HYS-10°C
V
TS-45°C
V
HYS-45°C
TTDM to keep cold thermistor fromVTS: Set to 1.525V1.11.51.9mA
entering TTDM, bq24091/3
Termination and timer disable mode
Threshold – Enter
Hysteresis exiting TTDMVTS: 1.7V → 0.5V; Timer Enabled100mV
TS maximum voltage clampVTS= Open (Float)180019502000mV
Deglitch exit TTDM between states57ms
Deglitch enter TTDM between states8ms
TS voltage where INTC is reduce to
keep thermistor from entering TTDM
Optional Capacitance – ESD0.22mF
Low temperature CHG Pending120512301255mV
Hysteresis at 0°C86mV
Low temperature, half charge,Normal charging to low temp charging;
bq24092/3VTS: 0.5V → 1V
Hysteresis at 10°C, bq24092/335mV
High temperature at 4.1V263278293mV
Hysteresis at 45°C10.7mV
VIN= 5V, VTS= 0.5V, V
VIN= 5V, VTS= 0.2V, V
is time to ISET ramp
DGL(RCH)
: 4.25V → V
OUT
: 4.15V → V
OUT
: 4.25V → 3.5V in 1ms;
OUT
= 3.5V inserted; t
OUT
RCH
RCH
VIN= 5V, VTS= 0.5V, Battery Absent710mA
Restarts when entering Pre-charge; Always enabled
when in pre-charge.
Clears fault or resets at UVLO, TS/BAT_EN disable,
OUT Short, exiting LOWV and Refresh
VTS= 0V273034mA
VTS= 0V4.45.05.8mA
VTS: 0.5V → 1.7V; Timer Held in Reset155016001650mV
INTC adjustment (90 to 10%; 45 to 6.6uS) takes
place near this spec threshold. VTS: 1.425V →1475mV
1.525V
Low Temp Charging to Pending;
VTS: 1.0V → 1.5V
Charge pending to low temp charging;
VTS: 1.5V → 1V
Low temp charging to normal CHG;
VTS: 1.0V → 0.5V
Normal charging to high temp CHG;
VTS: 0.5V → 0.2V
High temp charging to normal CHG;
VTS: 0.2V → 0.5V
Over junction temperature range 0°C ≤ TJ≤ 125°C and recommended supply voltage (unless otherwise noted)
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
V
TS-60°C
V
HYS-60°C
t
DGL(TS_10C)
t
DGL(TS)
V
TS-EN-10k
V
TS-DIS_HYS-10k
V
TS-EN-100k
V
TS-DIS_HYS-
100k
High temperature Disable, bq24092/3170178186mV
Hysteresis at 60°C, bq24092/311.5mV
Deglitch for TS thresholds: 10C,
bq24092/3
Deglitch for TS thresholds: 0/45/60C.Battery charging30ms
Charge Enable Threshold, (10k NTC)VTS: 0V → 0.175V;808896mV
HYS below V
NTC)
TS-EN-10k
Charge Enable Threshold, bq24090/2VTS: 0V → 0.175V;140150160mV
HYS below V
bq24091/3
TS-EN-100k
THERMAL REGULATION
T
J(REG)
T
J(OFF)
T
J(OFF-HYS)
Temperature regulation limit125°C
Thermal shutdown temperature155°C
Thermal shutdown hysteresis20°C
LOGIC LEVELS ON ISET2
V
IL
V
IH
I
IL
I
IH
V
FLT
Logic LOW input voltageSink 8 mA0.4V
Logic HIGH input voltageSource 8 mA1.4V
Sink current required for LOV
Source current required for HIV
ISET2 Float Voltage5759001225mV
LOGIC LEVELS ON CHG AND PG
V
I
LEAK
OL
Output LOW voltageI
Leakage current into ICV
to Disable, (10k
to Disable,
High temp charge to pending;
VTS: 0.2V → 0.1V
Charge pending to high temp CHG;
VTS: 0.1V → 0.2V
Normal to Cold Operation; VTS: 0.6V → 1V50
Cold to Normal Operation; VTS: 1V → 0.6V12
OUT10Obattery to charge within the 10 hour safety timer window. Expected range of bypass capacitors 1mF to
PRE-TERM4I
ISET2I
ISET27I
TS9IMode and disable TS monitoring, Timers and Termination. Pulling pin Low disables the IC. If NTC
VSS3–Ground terminal
CHG8OLow (FET on) indicates charging and Open Drain (FET off) indicates no Charging or Charge complete.
PG5OLow (FET on) indicates the input voltage is above UVLO and the OUT (battery) voltage.
NC6NADo not make a connection to this pin (for internal use) – Do not route through this pin
Thermal PADPaddevice. The thermal pad must be connected to the same potential as the VSS pin on the printed circuit
and Package5x3mm
2
Input power, connected to external DC supply (AC adapter or USB port). Expected range of bypass
capacitors 1mF to 10mF, connect from IN to VSS.
Battery Connection. System Load may be connected. Average load should not be excessive, allowing
10mF.
Programs the Current Termination Threshold (5 to 50% of Iout which is set by ISET) and Sets the
Pre-Charge Current to twice the Termination Current Level.
Expected range of programming resistor is 1k to 10kΩ (2k: Ipgm/10 for term; Ipgm/5 for precharge)
Programs the Fast-charge current setting. External resistor from ISET to VSS defines fast charge current
value. Range is 10.8k (50mA) to 675 Ω (800mA).
Programming the Input/Output Current Limit for the USB or Adaptor source:
High = 500mAmax, Low = ISET, FLOAT = 100mAmax.
Temperature sense pin connected to bq24090/2 -10k at 25°C NTC thermistor & bq24091/3 -100k at
25°C NTC thermistor, in the battery pack. Floating TS Pin or pulling High puts part in TTDM “Charger”
sensing is not needed, connect this pin to VSS through an external 10 kΩ/100kΩ resistor. A 250kΩ from
TS to ground will prevent IC entering TTDM mode when battery with thermistor is removed.
There is an internal electrical connection between the exposed thermal pad and the VSS pin of the
–
board. Do not use the thermal pad as the primary ground input for the device. VSS pin must be
connected to ground at all times
The IC temperature rises to 125°C and enters thermal regulation. Charge current is reduced to regulate the IC at
125°C. VIN is reduced, the IC temperature drops, the charge current returns to the programmed value.