Center-Pin VCC and GND Configurations
Minimize High-Speed Switching Noise
D
EPIC
(Enhanced-Performance Implanted
CMOS) 1-µm Process
D
500-mA Typical Latch-Up Immunity at
125°C
D
Package Options Include Plastic
Small-Outline (D) Packages and Standard
Plastic 300-mil DIPs (N)
D OR N PACKAGE
(TOP VIEW)
1A
1
1Y
2
2Y
3
GND
GND
3Y
4Y
4B
4
5
6
7
8
16
15
14
13
12
11
10
1B
2A
2B
V
CC
V
CC
3A
3B
4A
9
description
This device contains four independent 2-input exclusive-OR gates. It performs the Boolean function
Y = A ⊕ B = AB + AB in positive logic.
A common application is as a true/complement element. If one of the inputs is low, the other input is reproduced
in true form at the output. If one of the inputs is high, the signal on the other input is reproduced inverted at the
output.
The 74AC11086 is characterized for operation from –40°C to 85°C.
FUNCTION TABLE
(each gate)
INPUTS
AB
LLL
LHH
HLH
HHL
OUTPUT
Y
logic symbol
†
This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12.
EPIC is a trademark of Texas Instruments Incorporated.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
†
1
1A
16
1B
15
2A
14
2B
11
3A
10
3B
9
4A
8
4B
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
=1
2
1Y
3
2Y
6
3Y
7
4Y
Copyright 1996, Texas Instruments Incorporated
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
1
74AC11086
QUADRUPLE 2-INPUT EXCLUSIVE-OR GATE
SCAS081A – NOVEMBER 1989 – REVISED APRIL 1996
logic diagram (positive logic)
1
1A
16
1B
15
2A
14
2B
11
3A
10
3B
9
4A
8
4B
exclusive-OR logic
An exclusive-OR gate has many applications, some of which can be represented better by alternative logic symbols.
EXCLUSIVE OR
2
1Y
3
2Y
6
3Y
7
4Y
= 1
These are five equivalent exclusive-OR symbols valid for a 74AC1 1086 gate in positive logic; negation may be shown
at any two ports.
LOGIC-IDENTITY ELEMENT
=
The output is active (high) if
all inputs stand at the same
logic level (i.e., A=B).
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
EVEN-PARITY ELEMENTODD-PARITY ELEMENT
2k
The output is active (high) if
an even number of inputs
(i.e., 0 or 2) are active (high).
The output is active (high) if an
odd number of inputs (i.e., only
1 of the 2) are active (high).
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The maximum package power dissipation is calculated using a junction temperature of 150_C and a board trace length of 750 mils,
except for the N package, which has a trace length of zero.
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(RoHS)
(RoHS)
(2)
Lead/Ball Finish MSL Peak Temp
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAUN / A for Pkg Type
CU NIPDAUN / A for Pkg Type
(3)
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.