Telefunken TFDT6500E, TFDS6500E Datasheet

TELEFUNKEN

Semiconductors

TFDU6100E/TFDS6500E/TFDT6500E

2.7–5.5V Fast Infrared Transceiver Module Family
(FIR, 4 Mbit/s)

Features Applications

 Compliant to IrDA 1.2 (Up to

4 Mbit/s), HP–SIR, Sharp ASK
and TV Remote

 Wide Operating Voltage Range

(2.7 to 5.5 V )

 Low-Power Consumption (3 mA

Supply Current)

 Power Shutdown Mode (1 A

Shutdown Current)

 Long Range (Up to 2.0 m at

4 Mbit/s in Nominal Design)

 High Efficiency Emitter

(120 mW/sr min 15)

 Three Surface Mount Package

Options

– Universal (9.7 x 4.7 x 4.0 mm)
– Side View (13.0 x 5.95 x 5.3 mm)
– T op View (13.0 x 7.6 x 5.95 mm)

 BabyFace (Universal) Package

Capable of Surface Mount
Solderability to Side and T op
View Orientation

 Directly Interfaces With Various

Super I/O and Controller Devices

 Built–In EMI Protection – No

External Shielding Necessary

 Few External Components

Required

 Backward Compatible to All

TEMIC SIR and FIR Infrared
Transceivers

Description

The TFDU6100E, TFDS6500E, and TFDT6500E are a
family of low-power infrared transceiver modules
compliant to the IrDA 1.2 standard for fast infrared (FIR)
data communication, supporting IrDA speeds up to 4.0
Mbit/s, HP–SIR, Sharp ASK and carrier based remote
control modes up to 2 MHz. Integrated within the
transceiver modules are a photo PIN diode, infrared
emitter (IRED), and a low-power CMOS control IC to
provide a total front–end solution in a single package.
TEMIC’s FIR transceivers are available in three package
options, including our BabyFace package (TFDU6100E),
the smallest FIR transceiver available on the market. This

 Notebook Computers, Desktop

PCs, Palmtop Computers (Win
CE, Palm PC), PDAs

 Digital Still and Video Cameras
 Printers, Fax Machines,

Photocopiers, Screen Projectors

 T elecommunication Products

(Cellular Phones, Pagers)

 Internet TV Boxes, Video

Conferencing Systems

 External Infrared Adapters

(Dongles)

 Medical and Industrial Data

Collection Devices

wide selection provides flexibility for a variety of
applications and space constraints.

The transceivers are capable of directly interfacing with
a wide variety of I/O chips which perform the pulse-width
modulation/demodulation function, including National
Semiconductor’s PC87338, PC87108 and PC87109,
SMSC’s FDC37C669, FDC37N769 and CAM35C44,
and Hitachi’s SH3. At a minimum, a current-limiting
resistor in series with the infrared emitter and a V
bypass capacitor are the only external components
required to implement a complete solution.

CC

Package Options

TFDU6100E

Baby Face (Universal)

This product is currently in devleopment. Inquiries regarding the status of this product should be directed to TEMIC Marketing.

Pending—Rev. A, 03-Apr-98 1

TFDS6500E

Side View

TFDT6500E

Top View

Pre-Release Information

TFDU6100E/TFDS6500E/TFDT6500E

Functional Block Diagram

V

CC

Driver

Amplifier Comparator

TELEFUNKEN

Semiconductors

Rxd

IRED Anode

IRED Cathode

SD/Mode

Txd

AGC

Logic

Open Collector Driver

GND

Pin Assignment and Description

Pin Number

“ U ”, “ T ”

Option

1 8 IRED Anode IRED anode, should be externally connected to VCC through a current

2 1 IRED Cathode IRED cathode, internally connected to driver transistor
3 7 Txd Transmit Data Input I HIGH
4 2 Rxd Received Data Output, push–pull CMOS driver output capable of driving a

5 6 SD/Mode Shutdown/Mode I HIGH
6 3 V
7 5 NC Do not connect.
8 4 GND Ground

“ S ”

Option

Function Description I/O Active

control resistor

standard CMOS or TTL load. No external pull–up or pull–down resistor is
required (pin is floating when device is in shutdown mode).

CC

Supply Voltage

O LOW

5678

IRED Detector

12345678

”U” Option

BabyFace (Universal)

123 4

IRED Detector

”S” Option

Side View

IRED Detector

1 2345678

”T” Option

Top View

2 Pending—Rev . A, 03-Apr-98

Pre-Release Information

TELEFUNKEN

V

A

°C

A

Semiconductors

TFDU6100E/TFDS6500E/TFDT6500E

Ordering Information

Part Number Qty/ Reel Description

TFDU6100E–TR3 1000 pcs Oriented in carrier tape for side view surface mounting
TFDU6100E–TT3 1000 pcs Oriented in carrier tape for top view surface mounting

TFDS6500E–TR3 750 pcs

TFDT6500E–TR3 750 pcs

Absolute Maximum Ratings

Parameter Symbol Test Conditions

Supply Voltage Range V
Supply Voltage Range (Anode) V
Input Currents
Output Sinking Current 25
Power Dissipation
Junction Temperature T
Ambient Temperature Range (Operating) T
Storage Temperature Range T
Soldering Temperature See Recommended Solder Profile 240
Average Output Current I
Repetitive Pulsed Output Current I
IRED Anode Voltage at Current Output V
Transmitter Data Input Voltage V
Receiver Data Output Voltage V
Virtual Source Size
Maximum Intensity for Class 1 Operation

of IEC 825 or EN60825

Notes
a. Reference point GND pin unless otherwise noted.
b. The algebraic convention whereby the most negative value is a minimum and the most positive a maximum.
c. Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing.
d. Maximum input current for all pins (except IRED Anode pin).
e. See Derating Curve.
f. Method: (1-1/e) encircled energy.
g. Worst case IrDA SIR pulse pattern.

d

e

f

g

CC

anode

P

D

J

amb

stg

(DC) 130

IRED

(RP) <90 µs, ton <20% 600

IRED

IREDA

Txd

Rxd

d 2.5 2.8 mm

EN60825, 1997 320 mW/sr

a

MinbTyp

– 0.5 6

0 VCC+1.5

–25 85
–25 85

– 0.5 6
– 0.5 VCC+0.5
– 0.5 VCC+0.5

c

Max

b

Unit

10

350 mW
125

m

°

m

V

Pending—Rev. A, 03-Apr-98 3

Pre-Release Information

TFDU6100E/TFDS6500E/TFDT6500E

A

Electrical Characteristics

TELEFUNKEN

Semiconductors

Parameter Symbol Test Conditions

a

Min

b

Transceiver
Supply Voltage V
Dynamic Supply Current

d

Dynamic Supply Current I

Standby Supply Current

e

Standby Supply Current I

Standby Supply Current

e

Operating Temperature Range T
Output Voltage Low V
Output Voltage High V
Input Voltage Low V
Input Voltage High
Input Voltage High

f

g

Input Leakage Current I
Input Capacitance C

Notes
a. Tamb = 25, V
b. The algebraic convention whereby the most negative value is a minimum and the most positive a maximum.

= 2.7 – 5.5 V unless otherwise noted.

CC

CC

I

CC
CC

I

SD

SD

I

SD

A

OL

OH

IL

V

IH

V

IH

L

I

SD = Low, Ee = 0 mW/m

SD = Low, Ee = 1 klx

SD = High, Mode = floating,

25°C, E

= 0 klx

e

SD = High, Mode = floating,

T =25°C, E

= 1 klx

e

SD = High, Mode = floating,

T = 85°C

R

= 2.2 kΩ, C

load

R

load

= 2.2 kΩ, C

load
load

V

≥ 4.5V 2.4

CC

2

d

d

= 15 pF 0.5 0.8
= 15 pF VCC–0.5

2.7 5.5 V

–25 85 °C

0 0.8

0.9 * V

CC

–10 +10 µA

c. Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing.
d. Receive mode only. In transmit mode, add additional 100 mA (typ) to IRED current.
e. Not ambient light sensitive.
f. CMOS levels.
g. TTL levels.

TypcMax

3 4
3 4

1

1.5

5

5 pF

b

Unit

m

µA

V

4 Pending—Rev . A, 03-Apr-98

Pre-Release Information