Instruction Manual
TMSSY2
mPGA479 Socket Support
(Includes TMSMPH4 mPGA479
probe head installation instructions)
071-1899-00
www.tektronix.com
Copyright © Tektronix. All rights reserved. Licensed software products are owned by Tektronix or its subsidiaries or
suppliers, and are protected by national copyright laws and international treaty provisions.
Tektronix products are covered by U.S. and foreign patents, issued and pending. Information in this publication supercedes
that in all previously published material. Specifications and price change privileges reserved.
TEKTRONIX and TEK are registered tra demarks of Tektronix, Inc.
Contacting Tektronix
Tektronix, Inc.
14200 SW Karl Braun Drive
P.O. Box 500
Beaverton, OR 97077
USA
For product information, sales, service, and technical support:
H In North America, call 1-800-833-9200.
H Worldwide, visit www.tektronix.com to find contacts in your area.
WARRANTY 2
Tektronix warrants that the products that it manufactures and sells will be free from defec ts in materials and
workmanship for a period of one (1) year from the date of shipment. If a product proves defective during this
warranty period, Tektronix, at its option, either will repair the defective product without charge for parts and labor,
or will provide a replacement in exchange for the defective product.
In order to obtain service under this warranty, Customer must notify Tektronix of the defect before the expiration
of the warranty period and make suitable arrangements for the performance of service. Customer shall be
responsible for packaging and shipping the defective product to the service center designated by Tektronix, with
shipping charges prepaid. Tektronix shall pay for the return of the product to Customer if the shipment is to a
location within the country in which the Tektronix service center is located. Customer shall be responsible for
paying all shipping charges, duties, taxes, and any other charges for products returned to any other locations.
This warranty shall not apply to any defect, failure or damage caused by improper use or improper or inadequate
maintenance and care. Tektronix shall not be obligated to furnish service under this warranty a) to repair damage
resulting from attempts by personnel other than Tektronix representatives to install, repair or service the product;
b) to repair damage resulting from improper use or connection to incompatible equipment; c) to repair any
damage or malfunction caused by the use of non-Tektronix supplies; or d) to service a product that has been
modified or integrated with other products when the effect of such modification or integration increases the time
or difficulty of servicing the product.
THIS WARRANTY IS GIVEN BY TEKTRONIX IN LIEU OF ANY OTHER WARRANTIES, EXPRESS
OR IMPLIED. TEKTRONIX AND ITS VENDORS DISCLAIM ANY IMPLIED WARRANTIES OF
MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE. TEKTRONIX’
RESPONSIBILITY TO REPAIR OR REPLACE DEFECTIVE PRODUCTS IS THE SOLE AND
EXCLUSIVE REMEDY PROVIDED TO THE CUSTOMER FOR BREACH OF THIS WARRANTY.
TEKTRONIX AND ITS VENDORS WILL NOT BE LIABLE FOR ANY INDIRECT, SPECIAL,
INCIDENTAL, OR CONSEQUENTIAL DAMAGES IRRESPECTIVE OF WHETHER TEKTRONIX OR
THE VENDOR HAS ADVANCE NOTICE OF THE POSSIBILITY OF SUCH DAMAGES.
WARRANTY 9b
Tektronix warrants that the media on which this software product is furnished and the encoding of the programs on
the media will be free from defects in materials and workmanship for a period of three (3) months from the date of
shipment. If a medium or encoding proves defective during the warranty period, Tektronix will provide a
replacement in exchange for the defective medium. Except as to the media on which this software product is
furnished, this software product is provided “as is” without warranty of any kind, either express or implied.
Tektronix does not warrant that the functions contained in this software product will meet Customer’s
requirements or that the operation of the programs will be uninterrupted or error-free.
In order to obtain service under this warranty, Customer must notify Tektronix of the defect before the expiration
of the warranty period. If Tektronix is unable to provide a replacement that is free from defects in materials and
workmanship within a reasonable time thereafter, Customer may terminate the license for this software product
and return this software product and any associated materials for credit or refund.
THIS WARRANTY IS GIVEN BY TEKTRONIX IN LIEU OF ANY OTHER WARRANTIES, EXPRESS
OR IMPLIED. TEKTRONIX AND ITS VENDORS DISCLAIM ANY IMPLIED WARRANTIES OF
MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE. TEKTRONIX’
RESPONSIBILITY TO REPLACE DEFECTIVE MEDIA OR REFUND CUSTOMER’S PAYMENT IS
THE SOLE AND EXCLUSIVE REMEDY PROVIDED TO THE CUSTOMER FOR BREACH OF THIS
WARRANTY. TEKTRONIX AND ITS VENDORS WILL NOT BE LIABLE FOR ANY INDIRECT,
SPECIAL, INCIDENTAL, OR CONSEQUENTIAL DAMAGES IRRESPECTIVE OF WHETHER
TEKTRONIX OR THE VENDOR HAS ADVANCE NOTICE OF THE POSSIBILITY OF SUCH
DAMAGES.
Table of Contents
General Safety Summary iii...................................
Service Safety Summary v....................................
Environmental Considerations vii...............................
Preface ix...................................................
Getting Started 1............................................
Logic Analyzer Configuration 2......................................
Connect the P6960 Probes and TMSCAB1 Cables 3.......................
Connect the Logic Analyzer to a SUT 5................................
Replaceable Parts List 9.............................................
Logic Analyzer Software Compatibility 10...............................
Installing the Software 10............................................
Support Package Setup 10............................................
Maintenance and Shipping 11..................................
Care and Maintenance 11.............................................
Shipping the Probe Adapter 15........................................
Specifications 17............................................
Circuit Description 17...............................................
Loading Diagrams 18................................................
Specifications 20...................................................
Certifications and Compliances 23.....................................
Appendix 29.................................................
Accessories 29.....................................................
Apply TMSCAB1 Labels 30..........................................
Probe Adapter Notes 31..............................................
TMSSY2 mPGA479 Socket Hardware Support
i
Table of Contents
List of Figures
Figure 1: Master and Slave module configuration 2...............
Figure 2: Module configuration 3..............................
Figure 3: Probe, cable and preprocessor unit 4...................
Figure4:ProbeheadinstallationusingChipcool1&2heatsink
hardware 7.............................................
Figure 5: Install heat sink (Chipcool 1 & 2) 8....................
Figure 6: Preprocessor unit in static-shielding bags 13.............
Figure 7: Folded cables 13.....................................
Figure 8: Probe head storage case 14............................
Figure 9: Probe adapter load model for typical signals 18...........
Figure 10: Preprocessor load model for typical signals 18...........
Figure 11: Receiver topology A 19..............................
Figure 12: Receiver topology B 19..............................
Figure 13: Receiver topology C 19..............................
Figure 14: Eye diagram 21.....................................
Figure 15: Dimensions of the probe head 26......................
Figure 16: Dimensions of the preprocessor unit 27.................
Figure 17: Apply TMSCAB1 labels 30...........................
List of Tables
Table 1: Preprocessor airflow clearance 5.......................
Table 2: Replaceable parts list 9...............................
Table 3: Electrical specifications for the SUT 20..................
Table 4: Electrical specifications for the AC input to the
preprocessor unit 21......................................
Table 5: BCLK timing and electrical specifications at 25 5C 21.....
Table 6: Environmental specifications 21........................
ii
TMSSY2 mPGA479 Socket Hardware Support
General Safety Summary
Review the following safety precautions to avoid injury and prevent damage to
this product or any products connected to it.
To avoid potential hazards, use this product only as specified.
Only qualified personnel should perform service procedures.
While using this product, you may need to access other parts of a larger system.
Read the safety sections of the other component manuals for warnings and
cautions related to operating the system.
ToAvoidFireor
Personal Injury
Use Proper Power Cord. Use only the power cord specified for this product and
certified for the country of use.
Connect and Disconnect Properly. Do not connect or disconnect probes or test
leads while they are connected to a voltage source.
Ground the Product. This product is grounded through the grounding conductor
of the power cord. To avoid electric shock, the grounding conductor must be
connected to earth ground. Before making connections to the input or output
terminals of the product, ensure that the product is properly grounded.
Observe All Terminal Ratings. To avoid fire or shock hazard, observe all ratings
and markings on the product. Consult the product manual for further ratings
information before making connections to the product.
The inputs are not rated for connection to mains or Category II, III, or IV
circuits.
Connect the probe reference lead to earth ground only.
Power Disconnect. The power switch disconnects the product from the power
source. See instructions for the location. Do not block the power switch; it must
remain accessible to the user at all times.
Do Not Operate Without Covers. Do not operate this product with covers or panels
removed.
Do Not Operate With Suspected Failures. If you suspect there is damage to this
product, have it inspected by qualified service personnel.
Avoid Exposed Circuitry. Do not touch exposed connections and components
when power is present.
Do Not Operate in Wet/Damp Conditions.
Do Not Operate in an Explosive Atmosphere.
Keep Product Surfaces Clean and Dry.
TMSSY2 mPGA479 Socket Hardware Support
iii
General Safety Summary
Provide Proper Ventilation. Refer to the manual’s installation instructions for
details on installing the product so it has proper ventilation.
Terms in this Manual
Symbols and Terms
on the Product
These terms may appear in this manual:
WARNING. Warning statements identify conditions or practices that could result
in injury or loss of life.
CAUTION. Caution statements identify conditions or practices that could result in
damage to this product or other property.
These terms may appear on the product:
H DANGER indicates an injury hazard immediately accessible as you read the
marking.
H WARNING indicates an injury hazard not immediately accessible as you
read the marking.
H CAUTION indicates a hazard to property including the product.
The following symbol(s) may appear on the product:
CAUTION
Refer to Manual
WARNING
High Voltage
iv
Protective Ground
(Earth) Terminal
Mains Disconnected
OFF (Power)
Mains Connected
ON (Power)
TMSSY2 mPGA479 Socket Hardware Support
Service Safety Summary
Only qualified personnel should perform service procedures. Read this Service
Safety Summary and the General Safety Summary before performing any service
procedures.
Do Not Service Alone. Do not perform internal service or adjustments of this
product unless another person capable of rendering first aid and resuscitation is
present.
Disconnect Power. To avoid electric shock, switch off the instrument power, then
disconnect the power cord from the mains power.
Use Care When Servicing With Power On. Dangerous voltages or currents may
exist in this product. Disconnect power, remove battery (if applicable), and
disconnect test leads before removing protective panels, soldering, or replacing
components.
To avoid electric shock, do not touch exposed connections.
TMSSY2 mPGA479 Socket Hardware Support
v
Service Safety Summary
vi
TMSSY2 mPGA479 Socket Hardware Support
Environmental Considerations
This section provides information about the environmental impact of the
product.
Product End-of-Life
Handling
Observe the following guidelines when recycling an instrument or component:
Equipment Recycling. Production of this equipment required the extraction and
use of natural resources. The equipment may contain substances that could be
harmful to the environment or human health if improperly handled at the
product’s end of life. In order to avoid release of such substances into the
environment and to reduce the use of natural resources, we encourage you to
recycle this product in an appropriate system that will ensure that most of the
materials are reused or recycled appropriately.
The symbol shown to the left indicates that this product
complies with the European Union’s requirements
according to Directive 2002/96/EC on waste electrical and
electronic equipment (WEEE). For information about
recycling options, check the Support/Service section of the
Tektronix Web site (www.tektronix.com).
Battery Recycling. This product may contain a Nickel Cadmium (NiCd) or
lithium ion (Li--ion) rechargeable battery, which must be recycled or disposed of
properly. Please properly dispose of or recycle the battery according to local
government regulations.
Restriction of Hazardous
Substances
TMSSY2 mPGA479 Socket Hardware Support
This product has been classified as Monitoring and Control equipment, and is
outside the scope of the 2002/95/EC RoHS Directive. This product complies
with the RoHS Directive requirements except for the presence of hexavalent
chromium in the surface coating of the aluminum chassis parts, assembly
hardware, and 63/37 tin/lead solder used in the fabrication of the circuit boards.
vii
Environmental Considerations
viii
TMSSY2 mPGA479 Socket Hardware Support
Preface
This manual contains specific information about the TMSSY2 preprocessor unit
and the TMSMPH4 probe head that combine to make a probe adapter. This
manual is part of a set of information on how to operate this product on
compatible Tektronix Logic Analyzers.
If you are familiar with operating microprocessor support probe adapters with the
logic analyzer, you need only this manual to set up and run the probe adapter.
TMSSY2 mPGA479 Socket Hardware Support
ix
Preface
x
TMSSY2 mPGA479 Socket Hardware Support
Getting Started
The TMSSY2 support product (preprocessor unit) is an interposer design that
allows the logic analyzer to acquire data from a microprocessor in the operating
environment with little affect on the SUT.
To accomplish this, the probe adapter (preprocessor unit and probe head) is
connected to the SUT, and then the microprocessor is connected to the probe
adapter. Signals from the microprocessor-based system flow through the probe
adapter cables to the logic analyzer where the loaded support software disassembles data acquired from the SUT.
The TMSSY2 support product includes:
H TMSSY2 preprocessor unit
H CD-ROM with PUB32G15 support software and instruction manual
NOTE. To acquire signals from the SUT you also need compatible cables, probes,
and probe head to complete the connection between the logic analyzer and the
SUT. Contact your Tektronix sales representative for information about these
other products.
For optional and standard accessories for this product, see Accessories on
page 29.
TMSSY2 mPGA479 Socket Hardware Support
1
Getting Started
Logic Analyzer Configuration
To use the probe adapter to acquire state signals, you need a Tektronix Logic
Analyzer equipped with four, merged 235 MHz, TLA7Ax4 logic analyzer
modules.
The modules must be configured and merged as shown in Figure 1. The memory
depth is automatically based on the shallowest memory depth of the modules.
The term Master module refers to the second module of a 4-wide module
configuration. (See Figure 1). The term Slave module refers to the modules to
the left or right of the Master module.
S
L
A
V
E
2
Figure 1: Master and Slave module configuration
All signals are acquired through probes connected to the logic analyzer. Use the
logic analyzer modules and the P6960 probes to connect to the probe adapter.
The probes should already be labeled; if you need to apply labels, refer to the
instructions that came with your probe documentation.
CAUTION. To prevent damage to the P6960 connectors on the preprocessor unit,
Tektronix recommends that you use the strain relief method that is described in
the P69XX Series Instruction Manual, Tektronix part number 071-1528-XX, after
connecting the P6960 probes.
M
A
S
T
E
R
S
L
A
V
E
1
S
L
A
V
E
3
You can access the P69XX Series Instruction Manual from the Tektronix.com
Web site.
2
TMSSY2 mPGA479 Socket Hardware Support
Connect the P6960 Probes and TMSCAB1 Cables
Use the P6960 probes and the TMSCAB1 cables to connect to the TLA7Ax4
logic analyzer modules to the preprocessor unit.
NOTE. If you need to attach labels to TMSCAB1 cables, refer to Appendix 30.
Getting Started
TMSCAB1
Modules
4 5(M,S1,S2) 6(M,S3) Does not acquire auxiliary
cables
P6960 probes (2)
S
L
A
V
E
2
TMSCAB1 cables (5)
M
A
S
T
E
R
P6960
probes
S
L
A
V
E
1
S
L
A
V
E
3
P6960 probes (4)
Description
common clock signals
Support
Software
PUB32G15
Figure 2: Module configuration
TMSCAB1 Cables
TMSSY2 mPGA479 Socket Hardware Support
1. From the Master module, match the label on the TMSCAB1 cable with the
corresponding connector label on the preprocessor unit and connect the
cable. The TMSCAB1 cable connector is keyed for correct alignment to the
preprocessor unit.
2. Use care to evenly tighten both screws on the module end of the probes or
cables until they are snug. First slightly tighten both screws, then snug each
screw to 4 in-lbs (max).
3. Repeat step 1 to attach the TMSCAB1 cables with the Slave1 and Slave2
modules.
3
Getting Started
CAUTION. To prevent damage to the probe and preprocessor unit, always
position the probes perpendicular to the footprint on the circuit board. Incorrect
handling of the probe while connecting to or disconnecting from the preprocessor unit can damage the probe.
When attaching the probe head, use care to evenly tighten the probe head screws
until they are snug. First, tighten both screws until the nut bar makes contact
with the board surface, and then snug each screw to 1 in-lbs (max). Under-tightening the screws can result in intermittence. Over-tightening can result in
damage to the elastomer holder and stripped screws.
P6960 Probes
4. Match the A, D, C, and E probes from the Slave3 and Master module with
the corresponding D3/D2 and A3/A2, D1/D0 and A1/A0, C1/C0 and C3/C2,
and E3/E2 and E1/E0 connector labels on the preprocessor unit. The P6960
probe connector is keyed for correct alignment to the preprocessor unit.
NOTE. To prevent faulty connections and loss of data, check that the probe board
connections are clean and free of debris.
P6960
Single-ended probe
TMSCAB1 cable
Figure 3: Probe, cable and preprocessor unit
4
TMSSY2 mPGA479 Socket Hardware Support
Connect the Logic Analyzer to a SUT
CAUTION. To prevent static damage to the microprocessor, the probe adapters,
the probes, and the module, handle components only in a static-free environment.
Always wear a grounding wrist strap, heel strap, or similar device while
handling the microprocessor and probe adapter.
WARNING. To prevent harm to yourself or damage to the preprocessor unit, do
not open the preprocessor unit. There are no operator serviceable parts inside
the preprocessor unit. Refer servicing of internal parts in the preprocessor unit
to Tektronix authorized personnel only. External parts may be replaced by
qualified service personnel.
Getting Started
Airflow Clearance
Tools
Table 1 lists airflow clearances for the preprocessor unit.
Table 1: Preprocessor airflow clearance
Characteristic Description
Required airflow clearances for the
preprocessor
Front, top, left side 5.08 cm (2 in)
Back 7.60 cm (3 in)
Bottom, right side 0.635 cm (0.250 in)
Following is a list of tools:
H Required. Use a flatbladed screwdriver (0.1-in tip width) to lock the ZIF
socket.
H Required. Phillips (P1) screwdriver to tighten the screws that attach the
heatsink brackets.
H Optional. A torque wrench helps to ensure reliable connections to meet the
nominal torque values that may be listed in these instructions. When
attaching screws to the probe head use 2 in-lbs (0.226 Newton meters) of
torque, unless stated otherwise.
NOTE. For storage and shipping, retain the cardboard cartons and packing
material that are shipped with the probe adapter.
For a list of replaceable parts, see page 9.
TMSSY2 mPGA479 Socket Hardware Support
5
Getting Started
Read the following instructions before removing or installing parts.
Connect the Logic
Analyzer
Use the following steps to connect the logic analyzer to the SUT:
1. Power off the SUT. It is not necessary to power off the logic analyzer.
2. Power off any preprocessor units that may be attached to your SUT.
NOTE. T o dischar ge static electricity , touch the ground connector located on the
logic analyzer.
3. Remove the heat sink and any retention brackets from the SUT.
CAUTION. To prevent damage to the probe head and pins, you must always
handle the probe head carefully and use care to properly align the probe head
pins to the ZIF socket on the SUT. Also, reinstall the pin protector on the bottom
of the probe head when the probe head is not in use.
4. Attach the TMSMPH4 probe head.
To attach the probe head to the SUT use the Chipcool 1&2 heat sink
attachment kit (020-2616-XX) and follow the steps shown in Figures 4 & 5
startingonpage7.
6
TMSSY2 mPGA479 Socket Hardware Support
Getting Started
Heat sink attaching hardware:
Using the supplied screws, attach
the two bottom brackets as shown.
Bottom bracket
(blue)
SUT
Insert bottom
plate as shown.
1
2
Bottom
bracket
(black)
the socket and lock
the ZIF socket on the
Install the
microprocessor in
probe head.
SUT
3
Connect the probe head
to the SUT and lock the
4
ZIF socket on the SUT.
Probe head
Remove pin
protector
Pin 1
Bottom plate
Heat sink attaching hardware:
Using the supplied screws, attach
the two top brackets to the SUT.
Top bracket
(blue)
5
Figure 4: Probe head installation using Chipcool 1 & 2 heat sink hardware
Top bracket
(black)
SUT
TMSSY2 mPGA479 Socket Hardware Support
7
Getting Started
Place the heat sink on the
probe head with the four
bottom-plate posts inserted
into the heat-sink holes.
Post
Slide the heat sink
housing all the way
over to the post
Figure 5: Install heat sink (Chipcool 1 & 2)
6
SUT
Probe Head Removal
Applying and Removing
Power
Follow these steps to remove the probe head from the SUT:
1. Power off the SUT, and unplug the AC power cord on the preprocessor unit.
The power switch is located on the back of the preprocessor unit. It is not
necessary to power off the logic analyzer mainframe.
2. ReversethestepsinFigures4and5onpages7and8toremovetheprobe
head.
3. Store the probe head in the original packing material.
To apply power to the probe adapter and SUT, follow these steps:
1. Make sure the power switch on the preprocessor unit is in the off position. If
powered off, the zero (0) is visible on the power switch.
2. Plug the AC power cord into the IEC connector on the back of the preproces-
sor unit.
3. Plug the AC power cord into an electrical outlet.
4. Power on the preprocessor unit using the switch on the back of the prepro-
cessor unit. A green, power-on LED lights on the front of the preprocessor
unit, indicating that the preprocessor unit is active.
5. Power on the SUT.
To remove power from the SUT and the preprocessor unit, reverse the preceding
steps.
8
TMSSY2 mPGA479 Socket Hardware Support
Replaceable Parts List
Getting Started
Refer to Table 2 to reorder replaceable parts for the probe head and preprocessor
unit.
NOTE. For a list of standard and optional accessories, refer to Appendix 2.
Table 2: Replaceable parts list
Fig.
number
&page
number
3--4 TMSSY2 1 CIRCUIT BOARD ASSY; PROBE HEAD BOARD
4--7 TMSMPH4
8--14 016-1941-XX 1 CASE, STORAGE: PLASTIC, W/FOAM,
1
Part number Quantity Description
W/CABLES & PADDLE BOARD;TESTED
1
1 MICRO SUPPORT; PROBE HEAD; M--479 PIN
MPGA FOR USE WITH TMSSY2
12.4X8.9X2.9;FLEX CABLE ASSEMBLY
To replace the heat sink attaching hardware, refer to the Appendix under
Standard Accessories on page 29 for heat-sink kit part number.
TMSSY2 mPGA479 Socket Hardware Support
9
Getting Started
Logic Analyzer Software Compatibility
Refer to the label on the software support CD for the current compatible version
of the Tektronix Logic Analyzer system software.
Installing the Software
NOTE. Before you install any software, verify that the microprocessor support
software is compatible with the logic analyzer software. Compare the version
number on the CD to the Tektronix logic analyzer system software.
To install the PUB32G15 software on the Tektronix logic analyzer, follow these
steps:
1. Insert the CD in the CD drive.
2. Follow the on-screen instructions to install the software.
Support Package Setup
To remove or uninstall software, use the Add or Remove Programs utility in the
Windows Control Panel. Close all windows before you uninstall any software.
The PUB32G15 support software installs one setup file. After installing the
software, you need to load the PUB32G15 setup file. Follow these steps:
1. Open a logic analyzer system window and select File, Load Support
Package.
2. In the Load Support Package dialog box, select the support and click load.
3. Follow the on-screen instructions.
10
TMSSY2 mPGA479 Socket Hardware Support
Maintenance and Shipping
Care and Maintenance
Before cleaning this product, read the following information:
CAUTION. To prevent static damage to the microprocessor, the probe adapter, the
probes, and the module, handle components only in a static-free environment.
Always wear a grounding wrist strap, heel strap, or similar device while
handling the microprocessor and probe adapter.
The probe adapter, consisting of the probe head and preprocessor unit, does not
require scheduled or periodic maintenance. However, to keep good electrical
contact and efficient heat dissipation, keep the probe adapter free of dirt, dust,
and contaminants. When not in use, store the probe adapter in the original
shipping bags and cardboard carton.
External Cleaning Only
Fuses
Clean dirt and dust with a soft bristle brush. For more extensive cleaning, use
only a damp cloth moistened with deionized water; do not use any chemical
cleaning agents.
WARNING. To prevent harm to yourself or damage to the preprocessor unit, do
not open the preprocessor unit for cleaning and do not allow any moisture inside
the preprocessor unit. There are no operator serviceable parts inside the
preprocessor unit. Refer servicing of internal parts in the preprocessor unit to
Tektronix authorized personnel only. External parts may be replaced by qualified
service personnel.
There are no user-replaceable fuses in the preprocessor unit.
If the probe adapter is not functioning correctly, contact your Tektronix sales
representative.
TMSSY2 mPGA479 Socket Hardware Support
11
Maintenance and Shipping
Short-Term Storage
Follow steps 1 through 4 for short-term storage of the probe head:
CAUTION. To prevent static damage to the microprocessor, the probe adapter, the
probes, and the module, handle components only in a static-free environment.
Always wear a grounding wrist strap, heel strap, or similar device while
handling the microprocessor and probe adapter.
1. Power off the SUT and unplug the AC power cord on the preprocessor unit.
It is not necessary to power off the logic analyzer.
2. To remove the probe head, reverse the probe installation instructions
(starting on page 7) that apply to your heat sink attachment hardware.
CAUTION. To prevent damage to the sensitive probe head cables, you must
position the cables so that they are not pinched or contacting any sharp objects.
When you fold the cables, use a minimum radius of 0.25 (0.64 cm) at the fold.
3. Using antistatic nongenerating tape, tape the pin-protector board onto the pin
header on the bottom of the probe head.
4. Store the probe head in an antistatic bag.
12
TMSSY2 mPGA479 Socket Hardware Support
Maintenance and Shipping
Long-Term Storage
Follow these steps using the existing cardboard carton and packaging:
1. Disconnect the preprocessor unit from the logic analyzer by removing the
probes and TMSCAB1 cables from the top of the preprocessor unit.
2. Place the preprocessor unit and cables in static-shielding bags.
Figure 6: Preprocessor unit in static-shielding bags
3. Place the foam in the bottom of the cardboard carton.
4. Place the foam end caps on both sides of the preprocessor unit.
5. Place the preprocessor unit in the cardboard carton.
Figure 7: Folded cables
6. Place the preprocessor cables carefully over the preprocessor unit.
7. Place foam on top of the preprocessor unit and lay the preprocessor cables on
top of the foam.
TMSSY2 mPGA479 Socket Hardware Support
13
Maintenance and Shipping
8. Place the accessory tray in the cardboard carton.
9. Place the probe head in the black plastic storage case.
10. Place the storage case in the accessory tray.
Figure 8: Probe head storage case
11. Close and tape the cardboard carton.
To ship the probe adapter, refer to Shipping the Probe Adapter.
14
TMSSY2 mPGA479 Socket Hardware Support
Shipping the Probe Adapter
To commercially transport the probe adapter, package as follows:
1. Use the existing cardboard shipping carton and cushioning material to ship
the probe adapter. See Long-Term Storage for repackaging instructions.
If the existing shipping carton is not available, use a double-walled,
corrugated cardboard shipping carton that allows a 3 inch (7.62 cm)
minimum on all sides of the product.
2. If you are shipping a probe adapter to a Tektronix service center for Warranty
service, attach a tag to the probe adapter showing the following:
H Owner’s name and address
H Name of a person who can be contacted
H Probe adapter type and serial number
H Description of the problem
Maintenance and Shipping
TMSSY2 mPGA479 Socket Hardware Support
15
Maintenance and Shipping
16
TMSSY2 mPGA479 Socket Hardware Support
Specifications
Circuit Description
The probe adapter hardware uses a custom ASIC to preprocess the 4x (Quad
Pumped) Signals before the signals are captured by the logic analyzer. The
custom ASIC performs the following functions:
H Latches signals within a narrow valid window
H Demultiplexes double-pumped, source-synchronous signals
H Deterministically synchronizes source-synchronous signals to BCLK
All other signals are buffered and amplified in the probe adapter hardware before
being captured by the logic analyzer.
Latched Operation
Signal Probing
Bus Tracking Logic
The microprocessor signals are processed in the probe adapter according to their
type. Following is a description of each type:
4x Quad-Pumped Signals. These signals include D[63:00]# and DBI[3:0]#. The
ASIC latches these signals using their dedicated strobes, STBP[3:0] and
STBN[3:0], and then performs four-way demultiplexing on these signals. The
ASIC also inverts the appropriate signals when the DBI[3:0] signals are active.
2x Double-Pumped Signals. These signals include A[39:03]# and REQ[4:0]#. The
logic analyzer latches these signals using their dedicated strobes, ASTB[1:0],
and then performs two-way demultiplexing on these signals.
1x Common-Clock Signals. These signals include all of the remaining front-side bus
signals. The logic analyzer latches these signals using the rising edge of BCLK.
The probe adapters use passive series isolation to acquire data.
The probe adapter uses a bus tracking PAL to aid the disassembly software in
linking various bus phases.
TMSSY2 mPGA479 Socket Hardware Support
17
Specifications
Loading Diagrams
Processor and
mated PGA socket
Preprocessor
Model
Preprocessor
Model
Preprocessor
Model
VSS
75 Ω
4 inches
477 ps
--0.4 dB
75 Ω
4 inches
477 ps
--0.4 dB
75 Ω
4 inches
477 ps
--0.4 dB
Out 1
Out 2
Out 3
75 Ω
1300 mils
213 ps
0.7 pF 0.7 pF
0.7 pF 0.7 pF
75 Ω
1300 mils
213 ps
75 Ω
1300 mils
213 ps
200 Ω+/−1%
200 Ω+/−1%
200 Ω+/−1%
75 Ω
25 mils
4.6 ps
75 Ω
25 mils
4.6 ps
75 Ω
25 mils
4.6 ps
Node 6
Node 5
Node 8
Motherboard socket
mated with LAI pin
header and LAI PCB
VSS
Node 1
Node 4
Node 9
0.7 pF 0.7 pF
Figure 9: Probe adapter load model for typical signals
10 m Ω
0.5 pF
0.7 pF 0.5 pF
0.7 pF
Figure 10: Preprocessor load model for typical signals
18
75 Ω
44 inches
4.18 ns
--1.58 dB
75 Ω
25 mils
4.6 ps
0.4 pF
Receiver topology
A, B, or C
TMSSY2 mPGA479 Socket Hardware Support
Specifications
75 Ω
83 ps
225 fF
Figure 11: Receiver topology A
150 nH
75 Ω
750 Ω
+
0.53 V
--
Figure 12: Receiver topology B
0.2 Ω
150 nH
750 Ω
100 Ω
5ps
75 k Ω
450 fF
75 Ω
+
0.8 V
--
150 nH
750 Ω
Figure 13: Receiver topology C
150 nH
750 Ω
75 k Ω
TMSSY2 mPGA479 Socket Hardware Support
19
Specifications
Specifications
These specifications are for a probe adapter connected between a compatible
Tektronix logic analyzer and a SUT. Signal voltage swing in your SUT must be
at least 200 mV
around the GTL+ reference voltage.
p-p
Table 3 lists the electrical requirements of the SUT. Table 4 on page 21 lists the
electrical requirements for the power supply that provides power to the probe
adapter. Table 5 on page 21 lists the BCLK timing and electrical specifications.
Table 6 on page 21 lists the environmental specifications.
Table 3: Electrical specifications for the SUT
Characteristics Requirements (typical)
DC power requirements
Voltage, V
cc
Current, GLT
REF
1.05 V ᐔ5%
I maximum <15 nA, I typical <3 nA at 25 °C
Common clock rate Maximum 200 MHz
Common clock capture
Typical - - Vcc=1.05V,V
=0.7V,VIH=V
REF
+100 mV, VIL=V
REF,
Window 900 ps
T
su
T
hd
900 ps
0ps
2x Source-Synchronous capture
Window 750 ps
T
su
T
hd
375 ps
375 ps
4x Source-Synchronous capture
(DBI disabled)
Window 500 ps
T
su
T
hd
200 ps
300 ps
--100mV,at25°C
REF
20
TMSSY2 mPGA479 Socket Hardware Support
Specifications
In Figure 14, the
ᐔ100 mV must be centered around GTLREF and the ringback
cannot come within 60 mV of GTLREF after the initial 100 mV requirement to
detect the initial transition.
40 ps
100 mV
100 mV
DSTRB, ADSTRB
su hd
Composite LAI
time/voltage eye
60 mV
60 mV
Figure 14: Eye diagram
Table 4: Electrical specifications for the AC input to the preprocessor unit
Characteristic Description
Input Voltage rating 100 -- 240 VAC ᐔ10% CAT II
Input Frequency rating 50 -- 60 Hz
Input Current rating 6 A maximum
Table 5: BCLK timing and electrical specifications at 25 °C
Characteristics Minimum Maximum Units Notes
Vin(lo) min -- V
Vin(hi) max V
+100 mV -- V
REF
--100 mV V
REF
Duty Cycle 45 55 %
Table 6: Environmental specifications
Characteristic
Temperature
Maximum operating +50 °C (+122 °F)
1
Description
2
TMSSY2 mPGA479 Socket Hardware Support
21
Specifications
Table 6: Environmental specifications (cont.)
Characteristic
1
Description
Minimum operating 0 °C(+32°F)
Nonoperating -- 5 5 °Cto+75°C(--67°F to +167 °F)
Humidity 10 to 95% relative humidity, noncondensing
Altitude
Operating 3 km (10,000 ft) maximum
Nonoperating 15 km (50,000 ft) maximum
Electrostatic immunity The probe adapter is static sensitive
1
Designed to meet Tektronix standard 062-2847-00 class 5.
2
Not to exceed microprocessor thermal considerations. Customer supplied cooling
might be required across the CPU.
22
TMSSY2 mPGA479 Socket Hardware Support
Certifications and Compliances
Specifications
EC Declaration of
Conformity - EMC
Australia / New Zealand
Declaration of Conformity
-EMC
Meets intent of Directive 89/336/EEC for Electromagnetic Compatibility.
Compliance was demonstrated to the following specifications as listed in the
Official Journal of the European Communities:
EN 61326. EMC requirements for Class A electrical equipment for measurement,
control, and laboratory use (conducted emissions). Annex D.
H IEC 61000--4--2. Electrostatic discharge immunity
H IEC 61000--4--3. RF electromagnetic field immunity
H IEC 61000--4--4. Electrical fast transient / burst immunity
H IEC 61000--4--5. Power line surge immunity
H IEC 61000--4--6. Conducted RF Immunity
H IEC 61000--4--11. Voltage dips and interruptions immunity
EN 61000- 3- 2. AC power line harmonic emissions
EN 61000- 3- 3. Voltage changes, fluctuations, and flicker
Complies with EMC provision of Radiocommunications Act per these standard(s):
H AS/NZS 2064.1/2. Industrial, Scientific, and Medical Equipment: 1992
H AS/NZS 3548. Information Technology Equipment: 1995
EMC Compliance
FCC Compliance
Russian Federation
Peoples Republic of China
TMSSY2 mPGA479 Socket Hardware Support
Meets the intent of Directive 89/336/EEC for Electromagnetic Compatibility
when it is used with the product(s) stated in the specifications table. Refer to the
EMC specification published for the stated products. May not meet the intent of
the directive if used with other products.
Emissions comply with FCC 47 CFR, Part 15, Subpart B for Class A equipment.
This product was certified by the GOST ministry of Russia to be in compliance
with all applicable EMC regulations.
This product has received the Chinese Metrology Certification. (CMC).
23
Specifications
EC Declaration of
Conformity - Low Voltage
U.S. Nationally
Recognized Testing
Laboratory Listing
Canadian Certification
Additional Compliance
Equipment Type
Safety Class
Compliance was demonstrated to the following specification as listed in the
Official Journal of the European Communities:
Low Voltage Directive 73/23/EEC, amended by 93/68/EEC.
H EN 61010-1:2001. Safety requirements for electrical equipment for
measurement control and laboratory use.
H UL 61010B--1:2003. Standard for electrical measuring and test equipment.
H CAN/CSA C22.2 No. 1010.1:1997. Particular requirements for electrical
equipment for measurement, control, and laboratory use. Part 1.
H IEC 61010--1:2001. Safety requirements for electrical equipment for
measurement, control, and laboratory use.
Test and measuring equipment
Class 1 -- grounded product
Pollution Degree
Descriptions
Pollution Degree
A measure of the contaminates that could occur in the environment around and
within a product. Typically the internal environment inside a product is
considered to be the same as the external. Products should be used only in the
environment for which they are rated.
H Pollution Degree 1. No pollution or only dry, nonconductive pollution
occurs. Products in this category are generally encapsulated, hermetically
sealed, or located in clean rooms.
H Pollution Degree 2. Normally only dry, nonconductive pollution occurs.
Occasionally a temporary conductivity that is caused by condensation must
be expected. This location is a typical office/home environment. Temporary
condensation occurs only when the product is out of service.
H Pollution Degree 3. Conductive pollution, or dry, nonconductive pollution
that becomes conductive due to condensation. These are sheltered locations
where neither temperature nor humidity is controlled. The area is protected
from direct sunshine, rain, or direct wind.
H Pollution Degree 4. Pollution that generates persistent conductivity through
conductive dust, rain, or snow. Typical outdoor locations.
Pollution Degree 2 (as defined in IEC 61010-1). Note: Rated for indoor use only.
24
TMSSY2 mPGA479 Socket Hardware Support
Specifications
Installation (Overvoltage)
Category Descriptions
Overvoltage Category
Terminals on this product may have different installation (overvoltage) category
designations. The installation categories are:
H Measurement Category IV. For measurements performed at the source of
low-voltage installation.
H Measurement Category III. For measurements performed in the building
installation.
H Measurement Category II. For measurements performed on circuits directly
connected to the low-voltage installation.
H Measurement Category I. For measurements performed on circuits not
directly connected to MAINS.
Overvoltage Category II (as defined in IEC 61010-1), for power input only.
TMSSY2 mPGA479 Socket Hardware Support
25
Specifications
Dimensions
Figure 15 shows the dimensions of the probe head.
52.78 mm
(2.078 in)
10.52 mm
(0.414 in)
Pin 1
11.30 mm
(0.445 in)
63.14 mm
(2.486 in)
4.55 mm
(0.179 in)
3.66 mm
(0.144 in)
26
Platform and socket
Figure 15: Dimensions of the probe head
TMSSY2 mPGA479 Socket Hardware Support
Specifications
Figure 16 shows the dimensions of the preprocessor unit.
CAUTION. To prevent damage to the circuitry in the prepr ocessor unit, you must
observe the required clearances in T able 1 on page 5 (clearances are not shown in
Figure 16).
474.32 mm
(18.674 in)
425.45 mm
(16.750 in)
420.37 mm
(16.550 in)
139.70 mm
(5.500 in)
Figure 16: Dimensions of the preprocessor unit
160.27 mm
(6.310 in)
TMSSY2 mPGA479 Socket Hardware Support
27
Specifications
28
TMSSY2 mPGA479 Socket Hardware Support
Appendix
Accessories
Standard Accessory
Optional Accessories
The following standard accessories are shipped with these products, as noted by
a check mark.
TMSSY2 TMSMPH4 Quantity Description Part number
n
-- -- -- n 1 ACCESSORY KIT; CHIPCOOL 1 & 2
-- -- -- 1 SOFTWARE PKG; W/INSTRUCTIONS MANUAL, TMSSY2
PUB32G15
HEATSINK,JEWEL CASE & HEAT
SINK PARTS; TMSMPH4
063-3983-XX
020-2719-XX
The following optional accessories are available for the probe adapter.
Option Description Part number
--
-- PREPROCESSOR CABLE ASSEMBLY W/
-- TMS131 MICRO SUPPORT; IA32G15 SOFTWARE
LOGIC ANALYZER PROBE:SINGLE ENDED
34--CH HIGH--DENSITY
LABELS
W/HW & SW MANUALS; MICROPROCESSOR
SUPPORT, RUL *2
1
P6960
TMSCAB1
063-3927-XX
2
3
A0 US POWER CORD. (STANDARD ACCESSORY) 161-0104-00
A1 UNIVERSAL EURO POWER CORD 161-0104-06
A2 UNITED KINGDOM POWER CORD 161-0104-07
A3 AUSTRALIA POWER CORD 161-0166-13
A5 SWITZERLAND POWER CORD 161-0167-00
A6 JAPAN POWER CORD 161-0298-00
A10 CHINA POWER CORD 161-0304-00
1
Requires six probes
2
Requires five cables
3
This support software is available only to customers with a valid, restricted, and
secret nondisclosure agreement (RS-NDA) with Intel and Tektronix.
TMSSY2 mPGA479 Socket Hardware Support
29
Appendix
Apply TMSCAB1 Labels
To attach labels to the module- and preprocessor ends of the TMSCAB1 cables,
use the following instructions.
NOTE. Always use flat-nosed tweezers to remove the labels from the sheet of
labels. Never peel labels with your fingers. The labels are made of soft vinyl and
can stretch and distort easily. To avoid stretching the label, always grasp it from
the top right corner while removing it from the sheet of labels.
The adhesive on the vinyl labels is extremely strong. Carefully align the label to
the indented outline on the module end and preprocessor unit end. Once labels
are placed on the TMSCAB1 cables, they are difficult to remove.
1. Determine which channel groups you plan to use and identify the matching
labels.
2. Follow the steps in Figure 17 while attaching the labels.
Blank
Module end
4
Blank
Figure 17: Apply TMSCAB1 labels
Align and place the labels
in the label indents.
Repeat for all steps.
TMSCAB1 Cable
3
1
Preprocessor-unit
end
2
Match the
color and the
channel name.
30
TMSSY2 mPGA479 Socket Hardware Support
Probe Adapter Notes
Appendix
System Clock Rate
Acquisition before Reset
Data Bus
Address Bus
Disabling the Cache
(disassembly)
The TMSSY2 hardware support can acquire data from the microprocessor
operating at speeds of up to 200 MHz.
Contact your Tektronix sales representative for current information on the fastest
devices supported.
If data is acquired before a processor Reset signal is observed by the preprocessor unit, the data acquired by the logic analyzer will be inaccurate.
The TMSSY2 product supports only a quad-pumped data bus.
The TMSSY2 product supports only a double-pumped address bus.
The cache bus is not observable; therefore, disassembly requires that the cache
must be disabled. Disabling the cache makes all instruction prefetches visible on
the bus so that they are acquired, displayed and correctly disassembled.
TMSSY2 mPGA479 Socket Hardware Support
31
Appendix
32
TMSSY2 mPGA479 Socket Hardware Support
Index
A
About this manual set, ix
Address bus, 31
Airflow clearance, preprocessor, 5
Application, logic analyzer configuration, 2
C
Care and maintenance, external, 11
Circuit description, 17
Clock rate, 31
Connections
P6960, 2
TMSCAB1 cable, 30
TMSCAB1 cables, 3
to SUT, 6
D
Data bus, 31
Dimensions
preprocessor unit, 27
probe head, 26
Disabling the cache, 31
Disassembler, logic analyzer configuration, 2
E
I
Installing support software, 10
L
Loading diagrams, 18
Logic analyzer
configuration for disassembler, 2
configuration for the application, 2
M
Maintenance, fuses, 11
Manual, how to use the set, ix
Modules connections, 3, 30
O
Optional accessory, 29
P
P6960, 2
Power, applying, 8
Probe adpater review
clock rate, 31
reset, 31
Electrical specifications, 17
AC adapter, 21
BCKL timing, 21
clock rate, 20
power requirements, 20
setup time, 20
source synchronous capture, disabled, 20
Environmental specifications, 21
altitude, 22
electrostatic immunity, 22
humidity, 22
temperature, 21
F
Fuses, maintenance, 11
TMSSY2 mPGA479 Socket Hardware Support
R
Removing hardware, from SUT, 8, 12
Replaceable parts list, 9
Reset, 31
Restrictions
address bus, 31
data bus, 31
disabling the cache, 31
33
Index
S
Shipping, probe adapter, assembled, 15
Specifications, 17
airflow clearance, 5
electrical, 17
environmental, 21
mechanical (dimensions), 26, 27
Standard accessory, 29
Storage, long--term, 13
Support package setup, software, 10
T
TLA7AX4, probes, measurements, 2
TLA7AX4 module, measurements, 3, 30
TMSCAB1 cable, connections, 3, 30
TMSCAB1 Cables, appling lables, 3
34
TMSSY2 mPGA479 Socket Hardware Support
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