Tektronix products are covered by U.S. and foreign patents, issued and pending. Information in this public ation supercedes
that in all previously published material. Specifications and price c hange privileges reserved.
Tektronix, Inc., P.O. Box 500, Beavert on, OR 97077
TEKTRONIX and TEK are registered trademarks of Tektronix, Inc.
WARRANTY 2
Tektronix warrants that the products that it manufactures and sells will be free from defects in materials and workmanship
for a period of one (1) year from the date of shipment. If a product proves defective during this warranty period, Tektronix,
at its option, either will repair the defective product without charge for parts and labor, or will provide a replacement in
exchange for the defective product.
In order to obtain service under this warranty, Customer must notify Tektronix of the defect before the expiration of the
warranty period and make suitable arrangements for the performance of service. Customer shall be responsible for
packaging and shipping the defective product to the service center designated by Tektronix, with shipping charges prepaid.
Tektronix shall pay for the return of the product to Customer if the shipment is to a location within the country in which the
Tektronix service center is located. Customer shall be responsible for paying all shipping charges, duties, taxes, and any
other charges for products returned to any other locations.
This warranty shall not apply to any defect, failure or damage caused by improper use or improper or inadequate
maintenance and care. Tektronix shall not be obligated to furnish service under this warranty a) to repair damage resulting
from attempts by personnel other than Tektronix representatives to install, repair or service the product; b) to repair
damage resulting from improper use or connection to incom patible equipm ent; c) to repair any damage or malfunction
caused by the use of non-Tektronix supplies; or d) to service a product that has been modified or integrated with other
products when the effect of such modification or integration increases the time or difficulty of servicing the product.
THIS WARRANTY IS GIVEN BY TEKTRONIX IN LIEU OF ANY OTHER W ARRANTIES, EXPRESS OR
IMPLIED. TEKTRONIX AND ITS VENDORS DISCLAIM ANY IMPLIED WARRANTIES OF
MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE. TEKTRONIX’ RESPONSIBILITY TO
REPAIR OR REPLACE DEFECTIVE PRODUCTS IS THE SOLE AND EXCLUSIVE REMEDY PROVIDED TO
THE CUSTOMER FOR BREACH OF THIS WARRANTY. TEKTRONIX AND ITS VENDORS WILL NOT BE
LIABLE FOR ANY INDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIAL DAMAGES IRRESPECTIVE
OF WHETHER TEKTRONIX OR THE VENDOR HAS ADV ANCE NOTICE OF THE POSSIBILITY OF SUCH
DAMAGES.
WARRANTY 9b
Tektronix warrants that the media on which this software product is furnished and the encoding of the programs on the
media will be free from defects in materials and workmanship for a period of three (3) months from the date of shipment.
If a medium or encoding proves defect ive during the warranty period, Tektronix will provide a replacem ent in exchange
for the defective medium. Except as to the me dia on which this software product is furnished, this software product is
provided “as is” without warranty of any kind, either express or implied. Tektronix does not warrant that the functions
contained in this software product will meet Customer’s requirements or that the operation of the programs will be
uninterrupted or error-free.
In order to obtain service under this warranty, Customer must notify Tektronix of the defect before the expiration of the
warranty period. If Tektronix is unable to provide a replacement that is free from defects in materials and workmanship
within a reasonable time thereafter, Customer may terminate the license for this software product and return this software
product and any associated materia ls for credit or refund.
THIS WARRANTY IS GIVEN BY TEKTRONIX IN LIEU OF ANY OTHER W ARRANTIES, EXPRESS OR
IMPLIED. TEKTRONIX AND ITS VENDORS DISCLAIM ANY IMPLIED WARRANTIES OF
MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE. TEKTRONIX’ RESPONSIBILITY TO
REPLACE DEFECTIVE MEDIA OR REFUND CUSTOMER’S PAYMENT IS THE SOLE AND EXCLUSIVE
REMEDY PROVIDED TO THE CUSTOMER FOR BREACH OF THIS W ARRANTY. TEKTRONIX AND ITS
VENDORS WILL NOT BE LIABLE FOR ANY INDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIAL
DAMAGES IRRESPECTIVE OF WHETHER TEKTRONIX OR THE VENDOR HAS ADVANCE NOTICE OF
THE POSSIBILITY OF SUCH DAMAGES.
Table of Contents
Getting Started
General Safety Summaryv...................................
Service Safety Summaryvii....................................
Table 2--5: Certifications and compliances2--6....................
TMSSM3 700-Pin Socket Support
iii
Table of Contents
iv
TMSSM3 700-Pin Socket Support
General Safety Summary
Review the following safety precautions to avoid injury and prevent damage to
this product or any products connected to it. To avoid potential hazards, use this
product only as specified.
Only qualified personnel should perform service procedures.
While using this product, you may need to access other parts of the system. Read
the General Safety Summary in other system manuals for warnings and cautions
related to operating the system.
ToAvoidFireor
Personal Injury
Use Proper Power Cord. Use only the power cord specified for this product and
certified for the country of use.
Connect and Disconnect Properly. Do not connect or disconnect probes or test
leads while they are connected to a voltage source.
Ground the Product. This product is grounded through the grounding conductor
of the power cord. To avoid electric shock, the grounding conductor must be
connected to earth ground. Before making connections to the input or output
terminals of the product, ensure that the product is properly grounded.
Observe All Terminal Ratings. To avoid fire or shock hazard, observe all ratings
and markings on the product. Consult the product manual for further ratings
information before making connections to the product.
Connect the ground lead of the probe to earth ground only.
Do Not Operate Without Covers. Do not operate this product with covers or panels
removed.
Use Proper Fuse. Use only the fuse type and rating specified for this product.
Avoid Exposed Circuitry. Do not touch exposed connections and components
when power is present.
Do Not Operate With Suspected Failures. If you suspect there is damage to this
product, have it inspected by qualified service personnel.
Do Not Operate in Wet/Damp Conditions.
Do Not Operate in an Explosive Atmosphere.
Keep Product Surfaces Clean and Dry.
Provide Proper Ventilation. Refer to the manual’s installation instructions for
details on installing the product so it has proper ventilation.
TMSSM3 700-Pin Socket Support
v
General Safety Summary
Symbols and Terms
Terms in this Manual. These terms may appear in this manual:
WARNING. Warning statements identify conditions or practices that could result
in injury or loss of life.
CAUTION. Caution statements identify conditions or practices that could result in
damage to this product or other property.
Terms on the Product. These terms may appear on the product:
DANGER indicates an injury hazard immediately accessible as you read the
marking.
WARNING indicates an injury hazard not immediately accessible as you read the
marking.
CAUTION indicates a hazard to property including the product.
Symbols on the Product. The following symbols may appear on the product:
CAUTION
Refer to Manual
WARNING
High Voltage
Protective Ground
(Earth) Terminal
vi
TMSSM3 700-Pin Socket Support
Service Safety Summary
Only qualified personnel should perform service procedures. Read this Service
Safety Summary and the General Safety Summary before performing any service
procedures.
Do Not Service Alone. Do not perform internal service or adjustments of this
product unless another person capable of rendering first aid and resuscitation is
present.
Disconnect Power. To avoid electric shock, switch off the instrument power, then
disconnect the power cord from the mains power.
Use Care When Servicing With Power On. Dangerous voltages or currents may
exist in this product. Disconnect power, remove battery (if applicable), and
disconnect test leads before removing protective panels, soldering, or replacing
components.
To avoid electric shock, do not touch exposed connections.
TMSSM3 700-Pin Socket Support
vii
Service Safety Summary
viii
TMSSM3 700-Pin Socket Support
Preface
Manual Conventions
This instruction manual contains specific information about the TMSSM3
microprocessor support product and is part of a set of information on how to
operate this product on compatible Tektronix logic analyzers.
If you are familiar with operating microprocessor support products on the logic
analyzer, all you need is this instruction manual to set up and run the support
product.
If you are not familiar with operating microprocessor support products, you need
to supplement this instruction manual with information on basic operations from
the Tektronix logic analyzer online help to set up and run the support product.
This manual uses the following conventions:
HThe phrase “information on basic operations” refers to basic information in
the Tektronix logic analyzer online help.
HThe terms “Master” and “Slave” refer to modules that are located in
numbered slots (see Figure 1--6 on page 1--12).
HThe term “LAI” is an acronym for Logic Analyzer Interface.
TMSSM3 700-Pin Socket Support
ix
Preface
Contacting Tektronix
Phone1-800-833-9200*
AddressTektronix, Inc.
Department or name (if known)
14200 SW Karl Braun Drive
P.O. Box 500
Beaverton, OR 97077
USA
Web sitewww.tektronix.com
Sales support1-800-833-9200, select option 1*
Service support1-800-833-9200, select option 2*
Technical supportEmail: techsupport@tektronix.com
1-800-833-9200, select option 3*
6:00 a.m. -- 5:00 p.m. Pacific time
*This phone number is toll free in North America. After office hours, please leave a
voice mail message.
Outside North America, contact a Tektronix sales office or distributor; see the
Tektronix web site for a list of offices.
x
TMSSM3 700-Pin Socket Support
Getting Started
Getting Started
Product Description
This section contains information about configuring the probe adapter and
applying power to the TMSSM3 product.
The TMSSM3 product is an interposer design that allows the logic analyzer to
acquire data from a microprocessor in an operating environment with little effect
on the target system.
The probe adapter is connected to the target system and the microprocessor is
connected to the probe adapter. Signals from the microprocessor-based system
flow through the probe adapter to the logic analyzer.
Product Software
Compatibility
The TMSSM3 product is shipped with the PUB64G4 software. The PUB64G4
software acquires signals for viewing state and timing signals.
NOTE. The TMS123 (IA64G4, IA64G4_T, IA64G4_C5, IA64G4_T_C5, and
IA64G4_SST) software is compatible with the TMSSM3 product. The
TMS123 software provides disassembly and timing analysis capabilities,
synchronous transactions, and instruction decoding. The TMS123 software
product is available only to customers with a valid, restricted, secret nondisclosure agreement (RS-NDA) with Intel.
Logic Analyzer Software Compatibility
Software version 4.3 SP1 of the logic analyzer software is compatible with the
TMSSM3 PUB64G4 software and the TMS123 software products.
Logic Analyzer Configuration
To use the probe adapter to acquire either disassembly or timing signals, you
need a TLA7AAX or TLA7ABX logic analyzer equipped with a minimum of
four, 136-channel, 450 MHz modules. The modules must be configured and
merged. The memory depth is chosen automatically based on the shallowest
memory depth of the modules.
TMSSM3 700-Pin Socket Support
1--1
Getting Started
Two additional merged modules can be added to acquire both disassembly and
timing signals. The TLA7XM mainframe is needed when using six modules.
P6860 Probes
Labeling P6860 Probes
LAI Cables
You can use the logic analyzer modules and P6860 probes to connect to the
TMSSM3 probe adapter.
For more information on connecting the P6860 Probes to the preprocessor unit,
seepage1--10.
The probe adapter relies on the default channel mapping and labeling scheme for
the probes. Apply labels using the instructions described in the P6860 HighDensity Logic Analyzer Probe Label Instructions, Tektronix part number
071-1123-XX. This manual can be accessed from the Tektronix Web site (see the
contact page at the front of this manual. This information is also located in the
logic analyzer online help.
Refer to the P6810, P6860, and P6880 Logic Analyzer Probes Instructionmanual, Tektronix part number 071-1059-XX, for more information. You can
find information about the P6860 probes in the logic analyzer online help.
The LAI cables are designed to connect the logic analyzer modules to the
TMSSM3 probe adapter.
For more information on connecting the LAI cables to the preprocessor unit, see
page 1--10.
Labeling LAI Cables
For information on how to label the LAI cables, see page 1--9.
Standard and Optional Accessories
A complete list of standard and optional accessories is provided in the Replace able Parts List on page 4--4.
1--2
TMSSM3 700-Pin Socket Support
Probe Adapter Review
Getting Started
Along with this TMSSM3 instruction manual, each logic analyzer includes
additional information about performing tasks that are common to microprocessor support packages on that platform.
This additional information is located in the logic analyzer online help, an
installation manual, or a user manual. Review the additional information if you
are unfamiliar with using support products on a logic analyzer product.
Review electrical, environmental, and mechanical specifications in the Specifica-tions section on page 2--1 as they pertain to the target system, as well as the
following information.
System Clock Rate
Acquisition before Reset
Data Bus
Address Bus
Disabling the Cache
The TMSSM3 hardware support can acquire data from the microprocessor
operating at speeds of up to 333 MHz and 400 MHz. The tested clock rate is
200 MHz.
Contact the Tektronix sales representative for current information on the fastest
devices supported.
If data is acquired just before a power on Reset signal is observed by the target
system, the data acquired by the logic analyzer will be inaccurate.
The TMSSM3 probe adapter supports only a double data bus.
The TMSSM3 probe adapter supports only a common clock address bus.
The cache bus is not monitored; therefore, the cache must be disabled. Disabling
the cache makes all instruction prefetches visible on the bus so that they are
acquired and displayed and correctly disassembled.
TMSSM3 700-Pin Socket Support
1--3
Getting Started
Configuring the Probe Adapter
Position the jumper on the probe adapter as described in Table 1--1. Figure 1--1
shows the location of the jumper on the preprocessor unit.
Table 1--1: Jumper information
Jumper
designation
BINIT_OBS2--3Observe BINIT
Pin numbersJumper name
1--2Ignore BINIT assertion
BINIT OBS Jumper
Place the jumper in the pin 2 to pin 3 position to select BINIT observed, allowing
the BINIT signal to act as another reset input. Place the jumper in the pin 1 to pin
2 position to select BINIT unobserved.
Preprocessor
unit
BINIT_OBS
Figure 1--1: Jumper location
1--4
TMSSM3 700-Pin Socket Support
Connect the Logic Analyzer to the Target System
This probe-adaptor product comes with different mechanical kits that allow you
to attach the probe adapter to specific platforms, processors, and power-pod
adapters. If you do not know which of these mechanical kits you need to use,
contact your Tektronix application engineer.
WARNING. To prevent harm to yourself or damage to the preprocessor unit, do
not open the preprocessor unit. There are no operator serviceable parts inside
the preprocessor unit. Refer servicing of internal parts in the preprocessor unit to
Tektronix authorized personnel only. External parts may be replaced by qualified
service personnel.
To prevent static damage to the microprocessor, the probe adapter, the probes,
and the module, you must handle components only in a static-free environment.
Always wear a grounding wrist strap, heel strap, or similar device while
handling the microprocessor and probe adapter.
Getting Started
Tools
You must allow airflow clearance for the preprocessor unit. Refer to the
dimensions described in Table 2--4 on page 2--6 for the required clearance.
Read the following instructions before installing parts.
The following tools are required:
HPhillips (P1) to attach the brackets to the target system.
3
H
/32-inch (2.5 mm) hexagonal wrench for the ZIF sockets
HDremel (hand grinder) or wire cutters to trim off the heatsink alignment pins.
H(optional) A torque wrench helps to ensure reliable connections by meeting
the nominal torque values. When attaching screws to the probe head, use
4 in-lbs (0.451 Newton meters) of torque.
To connect the logic analyzer to the target system, follow these steps:
1. Power off the target system. It is not necessary to power off the logic analyzer.
2. Power off any probe adapters that may be attached to your target system.
3. T o discharge static electricity, touch the ground connector located on the logic
analyzer.
4. Remove the microprocessor from your target system.
5. Follow the steps in Figures 1--2 and 1--3 to install the probe head.
TMSSM3 700-Pin Socket Support
1--5
Getting Started
Lower bracket
Unlock the target
system ZIF socket
Target system
Nonspecific bracket — Use the bracket
instruction sheet that came with your black
case to attach the lower bracket to the target
system.
1
2
Remove the pin protector,
and then connect the
probe head to the
target-system socket
3
Figure 1--2: Attach the brackets and probe head
Probe head
Target system
1--6
TMSSM3 700-Pin Socket Support
Getting Started
Lock the target
system ZIF socket
Using the four
captured screws,
attach the heatsink
to the top bracket.
Upper bracket
8
Nonspecific bracket — Use the bracket
instruction sheet that came with your black
case to attach the top bracket to the target
5
system.
4
Target system
Heatsink
Connect the
microprocessor assembly
to the probe-head socket
Lock the probe
head ZIF socket
7
Power pod
6
Target system
Figure 1--3: Connect the microprocessor and attach your heatsink
TMSSM3 700-Pin Socket Support
1--7
Getting Started
Removing the Probe Head
from the Target System
Follow these steps to remove the probe head from the target system:
1. Power off the target system, and unplug the AC power cord on the preproces-
sor unit. The power switch for the probe adapter is located on the back of the
preprocessor unit. It is not necessary to power off the logic analyzer.
2. Reverse the steps in Figures 1--2 and 1--3 to remove the probe head.
3. Store the probe head in the original packing material.
1--8
TMSSM3 700-Pin Socket Support
Applying LAI Labels
Getting Started
The LAI cables are shipped without labels; you must attach labels to the module
end and the preprocessor end of the LAI cables. Read the following note before
you begin attaching labels.
NOTE. Always use flat-nosed tweezers to remove the labels from the sheet of
labels. Never peel labels with your fingers. The labels are made of soft vinyl and
can stretch and distort easily. To avoid stretching a label, always grasp it from
the top right corner while removing it from the sheet of labels.
The adhesive on the vinyl labels is extremely strong. Carefully align the label to
the indented outline on the module end and preprocessor unit end. Once labels
are placed on the LAI cables, they are difficult to remove.
To attach labels, perform the following steps:
1. Determine which channel groups you are planning to use and identify the
matching labels.
2. Follow the steps in Figure 1--4 while attaching the labels.
Module
end
Blank
4
Align and place the labels
in the label indents.
Repeat for all steps.
LAI cable
3
Blank
1
Match the
color and the
channel name.
Probe-head
end
2
Figure 1--4: Apply LAI labels
TMSSM3 700-Pin Socket Support
1--9
Getting Started
Connect the Probes and the LAI Cables
To configure the P6860 probes and LAI cables for the disassembly and timing
support functions, you must determine if you are using the four or six module
configuration (see Table 1--2 on page 1--11). Then follow the steps on page 1--12
to connect the logic analyzer modules to the preprocessor unit.
To apply labels to the LAI cables, see page 1--9. Figure 1--5 shows a P6860
probe, an LAI cable, and the preprocessor unit.
P6860 probe
LAI cable
Preprocessor
unit
1--10
Figure 1--5: LAI cable, P6860 probe, and preprocessor unit
TMSSM3 700-Pin Socket Support
Table 1--2 lists the 4- or 6-module hardware and software configurations.
Table 1--2: P6860 probe and LAI cable configuration
Getting Started
Software
loaded
PUB64G4State47 (M,S1,S2,S3**)-- -- --Acquires state only
7 (M,S1,S2,S3**)6Acquires complete disassembly and timing:
P6860
probes
Description
S Can on trigger common clock signals
S Can view common clock signals in timing
S Can trigger on data content
S Cannot view source synchronous data in
timing
S Can trigger on common clock signals
S Can view common clock signals in timing
S Cannot trigger on data content
S Can view source synchronous data in timing
S Can trigger on common clock signals
S Can view common clock signals in timing
S Can trigger on data content
S Can view source synchronous data in timing
on a separately unmerged modules
(IA64G4_SST software on two auxiliary
modules)
**Do not connect to RESERVED on the Slave3 module.
TMSSM3 700-Pin Socket Support
1--11
Getting Started
Figure 1--6 shows the configuration for a 4-wide and 6-wide module merge. An
expanded mainframe is needed for 6 modules and the order of the modules does
not matter.
PUB64G4 , IA64G4, or IA64G4_C5
7 LAI cables
IA64G4_T
M
A
S
T
E
R
or IA32G4_T_C5
IA64G4
7 LAI cables
S
L
A
V
E
1
S
L
A
V
E
3
and
S
L
A
V
E
2
4 LAI cables and 6 P6860 probes
Figure 1--6: Module, cable, and probe configuration
Expanded mainframe
M
A
S
T
E
R
IA64G4_SST
6 P6860 probes
TLA7XM
S
L
A
V
E
1
PUB64G4, IA64G4, or
IA64G4_C5 Setups
IA64G4_T or IA32G4_T_C5
Setups
Choose your software support, and then follow the steps to connect your logic
analyzer module to the preprocessor unit:
1. Match the A, D, C, and E LAI cables from the Master module with the
corresponding M_ D3/D2 and A3/A2, M_D1/D0 and A1/A0, M_C1/C0 and
C3/C2, and M_E3/E2 and E1/E0 connector labels on the preprocessor unit.
The LAI cable connector is keyed for correct alignment to the preprocessor
unit. Connect the LAI cable to the preprocessor.
2. Match and connect the rest of the LAI cables between the Slave1 (S1),
Slave2 (S2), and Slave3 (S3) modules to the top of the preprocessor unit. Do
not connect to RESERVED on the Slave3 module.
1. Match the A, D, C, and E LAI cables from the Master module with the
corresponding M_ D3/D2 and A3/A2, M_D1/D0 and A1/A0, M_C1/C0 and
C3/C2, and M_E3/E2 and E1/E0 connector labels on the preprocessor unit.
The LAI cable connector is keyed for correct alignment to the preprocessor
unit. Connect the LAI cables to the top of the preprocessor.
2. Match and connect an LAI cable to the Slave3(S3) module and preprocessor.
Do not connect to RESERVED on the Slave3 module.
1--12
TMSSM3 700-Pin Socket Support
Getting Started
3. Match and connect the P6860 probes between the Slave1 and Slave2
modules and the top of the preprocessor unit.
CAUTION. To prevent damage to the P6860 probe and the preprocessor unit, you
must always position the probes perpendicular to the footprint on the PCB.
Incorrect handling of the P6860 probe while connecting to or disconnecting from
the preprocessor unit can damage the probe.
NOTE. For more detailed information about how to attach a P6860 probe, refer
to the P6860 probe manual references listed on page 1--2.
IA64G4 and IA64G4_SST
Setups
1. Match the A, D, C, and E LAI cables from the Master module with the
corresponding M_ D3/D2 and A3/A2, M_D1/D0 and A1/A0, M_C1/C0 and
C3/C2, and M_E3/E2 and E1/E0 connector labels on top of the preprocessor
unit. Connect the LAI cable.
2. Match and connect the LAI cables between the Slave1 (S1), Slave2 (S2), and
Slave3 (S3) modules on top of the preprocessor unit. Do not connect to
RESERVED on the Slave3 module.
3. Match and connect the P6860 probes between the Master and Slave1
modules in the expanded mainframe and the top of the preprocessor unit.
Applying and Removing Power
To apply power to the probe adapter and target system, follow these steps:
1. Check that the power switch on the preprocessor unit is in the off position. If
powered off, the zero (0) is visible on the power switch.
2. Plug the AC power cord into the IEC connector on the back of the preproces-
sor unit.
3. Plug the AC power cord into an electrical outlet that you know is working
properly.
4. Power on the probe adapter at the back of the preprocessor unit. A green,
5. Power on the target system.
To remove power from the target system and the probe adapter, reverse the
preceding steps. You can skip step 1.
TMSSM3 700-Pin Socket Support
power-on LED lights on the front of the preprocessor unit, indicating that the
probe adapter is active.
1--13
Getting Started
Installing the Software
If you have not used a support product, you may want to refer to microprocessor
support information in the Tektronix logic analyzer online help or the user
manual.
NOTE. Before you install any software, verify that the microprocessor support
software is compatible with the logic analyzer software (see page 1--1).
To install the software on your Tektronix logic analyzer, follow these steps:
1. Insert the disk in the disk drive.
2. Click the Windows Start button, point to Settings, and click Control Panel.
3. In the Control Panel window, double-click Add/Remove Programs.
4. Follow the instructions on the screen for installing the software from the
disk.
To remove or uninstall software, follow the above instructions except select
Uninstall. You must close all windows before you uninstall any software.
1--14
TMSSM3 700-Pin Socket Support
Care and Maintenance
Getting Started
Before cleaning this product, read the following information:
CAUTION. To prevent static damage, you must handle components only in a
static-free environment. Static discharge can damage the microprocessor, the
probe adapter, the probes, and the module.
The probe adapter, consisting of the probe head and preprocessor unit, does not
require scheduled or periodic maintenance. However, to keep good electrical
contact and efficient heat dissipation, keep the probe adapter free of dirt, dust,
and contaminants. When not in use, store the probe adapter in the original
shipping bags and cardboard carton.
External Cleaning Only
Fuses
Clean dirt and dust with a soft bristle brush. For more extensive cleaning, use
only a damp cloth moistened with deionized water; do not use any chemical
cleaning agents.
WARNING. To prevent harm to yourself or damage to the preprocessor unit, do
not open the preprocessor unit for cleaning and do not allow any moisture to get
inside the preprocessor unit. There are no operator serviceable parts inside the
preprocessor unit. Refer servicing of internal parts in the preprocessor unit to
Tektronix authorized personnel only. External parts may be replaced by qualified
service personnel.
All fuses in the probe adapter are not replaceable by the customer (operator). If
the probe adapter is not functioning correctly, contact your Tektronix sales
representative.
TMSSM3 700-Pin Socket Support
1--15
Getting Started
Short-Term Storage
Follow steps 1 through 4 for short-term storage of the probe head:
CAUTION. To prevent static damage to the microprocessor, the probe adapter, the
probes, and the module, handle components only in a static-free environment.
Always wear a grounding wrist strap, heel strap, or similar device while
handling the microprocessor and probe adapter.
1. Power off the target system, and unplug the AC power cord on the preproces-
sor unit. The power switch for the probe adapter is located on the back of the
preprocessor unit. It is not necessary to power off the logic analyzer.
2. To remove the probe head, reverse the instructions in Figures 1--2 and 1--3 on
pages 1--6 and 1--7.
CAUTION. To prevent damage to the sensitive probe head cables, you must
position the cables so that they are not pinched or contacting any sharp objects.
When you fold the cables, use a minimum radius of 0.25 (0.64 cm) at the fold.
3. Using antistatic nongenerating tape, tape the pin-protector board onto the pin
header on the bottom of the probe head.
4. Store the probe head in an antistatic bag.
1--16
TMSSM3 700-Pin Socket Support
Getting Started
Long-Term Storage
For long-term storage, use the existing cardboard carton and packaging, and
follow these steps:
1. Disconnect the preprocessor unit from the logic analyzer by removing the
probes and LAI cables from the top of the preprocessor unit.
2. Follow Figures 1--7 through 1 --12 to repackage the probe adapter.
Figure 1--7: Place the preprocessor unit and probe head in static-shielding bags.
Figure 1--8: Place foam in the cardboard carton
TMSSM3 700-Pin Socket Support
1--17
Getting Started
Place the foam end caps
on both sides of the
preprocessor unit.
Figure 1--9: Place the preprocessor unit in the cardboard carton
Figure 1--10: Place the cables carefully over the preprocessor unit
Figure 1--11: Place the foam and probe head in place
1--18
TMSSM3 700-Pin Socket Support
Figure 1--12: Place accessories in the accessory tray
3. Close and tape the cardboard carton.
To ship the probe adapter, refer to Shipping the Probe Adapter.
Getting Started
Shipping the Probe Adapter
To commercially transport the TMSSM3 probe adapter, package as follows:
1. Use the existing cardboard shipping carton and cushioning material to ship
the probe adapter.
If the existing shipping carton is not available, use a double-walled,
corrugated cardboard shipping carton that allows a 3 inch (7.62 cm)
minimum on all sides of the product.
2. Follow Figures 1--7 through 1 --12 on pages 1--17 through 1--19 to package
the probe head and preprocessor unit.
3. If you are shipping a probe adapter to a Tektronix service center for Warranty
service, attach a tag to the probe adapter showing the following:
HOwner’s name and address
HName of a person who can be contacted
HProbe adapter type and serial number
HDescription of the problem
TMSSM3 700-Pin Socket Support
1--19
Getting Started
1--20
TMSSM3 700-Pin Socket Support
Specifications
Specifications
Circuit Description
This section contains information regarding the s pecifications of the TMSSM3
hardware support.
The TMSSM3 probe adapter hardware uses a custom ASIC to preprocess all
signals on the
analyzer. The custom ASIC performs the following functions:
HDeterministically synchronizes source-synchronous signals to BCLK
700-pin microprocessor before being captured by the logic
Latched Operation
1x Common-Clock Signals
These 2x double-pumped signals include D[127:00]# and DEP[15:0]#. The ASIC
latches these signals using their dedicated strobes: STBN[...]#, STBP[...]#. The
ASIC then performs two-way demultiplexing on these signals and synchronizes
the STB[7:0]# results to BCLK. The resulting signals are sent out by the ASIC
four clock cycles after they were received on the system bus.
These signals include all of the remaining front-side bus signals. The ASIC
latches these signals using the rising edge of BCLK. The ASIC then delays the
signals so that the final results are sent out four clock cycles after they were
received onto the system bus.
TMSSM3 700-Pin Socket Support
2--1
Specifications
Derived Signals
The TMSSM3 probe adapter hardware derives several custom signals from the
front-side bus signals captured by the ASIC. These signals are used by the logic
analyzer support software to provide clocking, transaction phase linking, and
disassembly. Following is a description of custom signals:
PHASE_D. This signal can be used by the logic analyzer to store only bus cycles
that contain active information. The PHASE_D signal is asserted when any of the
following signals are asserted: ADS#, DRDY#, INIT#, RESET#, RS[2:0]#, and
SNOOP_D.
SNOOP_D. This signal is asserted at the end of each successful snoop phase,
taking into account any stall conditions that might have occurred. SNOOP_D is
asserted only once per each request and is not asserted during a stall condition.
RCNT_D[2:0]. The request counter tracks the number of outstanding requests on
the front-side bus. The request counter is incremented by each new request phase
and decrememted by each response phase. The maximum allowable count is 8.
SCNT_D[2:0]. The snoop counter tracks the number of outstanding snoops on the
front-side bus. The snoop counter is incremented by each new request phase and
decrememted by each successful snoop phase. The maximum allowable count is
8.
Signal Probing
Bus Tracking Logic
Common Clock
TRACK_ERR_D. This signal is asserted whenever the request or snoop counters
exceed their maximum value of 8, or a minimum value of 0. This signal is also
asserted when ADS# has been observed active for two clock cycles in a row.
The
700-Pin Socket probe adapter uses passive series isolation to acquire data.
The
700-Pin Socket probe adapter uses a bus tracking PAL to aid the disassembly
software in linking various bus phases.
The TMSSM3 software allows disassembly from a data bus operating at up to
200 MHz. The setup and hold sample points are set to default timing numbers
based on FSB specifications.
2--2
TMSSM3 700-Pin Socket Support
Probe Adapter Loading Diagrams
Specifications
700-pin socket microprossor
header1
sig1
pin_header
sig2
vss
out1
out2
C26
0.5 pF
+
C25
0.5 pF
sig1
Socket1
probe
mck_load
in
out1
probe
mck_load
in
zif_socket
sig2
+
+
R56
180
vss
TLSE9
a=2
L=57.5 m
td=0.384 n
z0=78
out2
+
C27
0.5 pF
TLSE10
a=1.5
L=1.219
td=5.97 n
z0=75
TLSE16
a=2
L=50.8 m
td=0.324 n
z0=75
Tip resistor varies +--10%
TLSE18
a=2
L=50.8
td=0.324 n
z0=75
R60
180
TLSE12
a=2
L=57.5 m
td=0.384 n
+
z0=78
C30
+
TLSE17
a=1.5
L=1.219
td=5.97 n
z0=75
0.5 pF
Logic Board
mictor mtd16
mictor_mtd
+
C28
0.5 pF
TLSE11
a=2
L=50.8 m
td=0.324 n
z0=75
mictor mtd17
mictor_mtd
+
C31
0.5 pF
TLSE15
a=2
L=50.8 m
td=0.324 n
z0=75
Figure 2--1: Pin header electrical load model for typical signals
+
V28
0.75
+
V31
0.75
+
+
R57
75
R61
75
C29
0.5 pF
ecl_buffer6
buffer
C32
0.5 pF
ecl_buffer7
buffer
TMSSM3 700-Pin Socket Support
2--3
Specifications
TF2_1
K12= 0.082
L1=1.685 n
L2=1.685 n
Signal In 1
Signal In 2
Vss
+
C1
0.44 pF
+
C2
0.44 pF
+
Signal out 1
Signal out 2
C3
0.44 pF
Vss
Figure 2--2: Pin header electrical load model for typical signals
TF2_1
K12= 0.318
L1=5.20 n
L2=5.20 n
Signal In 1
Signal In 2
Vss
+
C1
0.66 pF
+
C2
1.3 pF
+
Signal out 1
Signal out 2
C3
1.3 pF
Vss
Figure 2--3: ZIF electrical load model for typical signals
Signal In 1
R1
10 m
C4
0.5 pF
3.2 n
C3
0.7 pF
L1
Signal Out 2
C2
0.5 pF
Figure 2--4: Mated Mictor model
BCLKP
BCLKN
To TLSE11
(see Figure 2--1)
To TLSE15
(see Figure 2--1)
75 Ω
0.8 V
75 Ω
0.8 V
0.5 p
0.5 pF
Figure 2--5: BCLK model
buffer
2--4
TMSSM3 700-Pin Socket Support
Specification Tables
Specifications
These specifications are for a probe adapter connected between a compatible
Tektronix logic analyzer and a target system. Signal voltage swing in your target
system must be at least 600 mV
around the GTL+ reference voltage.
p-p
Table 2--1 lists the electrical requirements of the target system. Table 2--2 lists the
electrical requirements for the power supply that provides power to the
700-Pin Socket probe adapter. Table 2--3 lists the BCLK timing and electrical
specifications. Table 2--4 lists the environmental specifications.
Table 2--1: Electrical specifications for the target system
CharacteristicsRequirements
Target system DC power requirements
Voltage, V
Current, VREF6I maximum <1 mA, I typical <1 mA
Target system clock rateMaximum 333 MHz and 400 MHz
Target system tested clock rateMaximum 200 MHz
Common clock capture
T
su
T
hd
Source Synchronous capture
T
su
T
hd
TT
1.2 V ᐔ5%
0.4 ns
0.1 ns
0.3 ns
0.3 ns
Table 2--2: Electrical specifications for the AC input
CharacteristicDescription
Input Voltage rating100 -- 240 VAC CAT II
Input Frequency Rating50 -- 60 Hz
Input Current Rating6.0 A maximum
TMSSM3 700-Pin Socket Support
Table 2--3: BCLK timing and electrical specifications
CharacteristicsMinimumMaximumUnitsNotes
Vin(lo)0.4V
Vin(hi)1.0V
2--5
Specifications
Table 2--3: BCLK timing and electrical specifications (cont.)
CharacteristicsNotesUnitsMaximumMinimum
Duty Cycle2575%
t
lh
t
hl
1.25nsMonotonically increasing
1.25nsMonotonically decreasing
Table 2--4: Environmental specifications
Characteristic
1
Description
Temperature
Maximum operating+50 °C (+122 °F)
2
Minimum operating0 °C (+32 °F)
Nonoperating-- 5 5 °Cto+75°C(--67° to +167 °F)
Humidity10 to 95% relative humidity, noncondensing
Altitude
Operating3 km (10,000 ft) maximum
Nonoperating15 km (50,000 ft) maximum
Electrostatic immunityThe probe adapter is static sensitive
Required airflow clearances
for the preprocessor unit
Front, top, left side5.08 cm (2 in)
Back7.62 cm (3 in)
Bottom, right side0.635 cm (0.250 in)
1
Designed to meet Tektronix standard 062-2847-00 class 5.
2
Not to exceed microprocessor thermal considerations. Customer supplied cooling
might be required across the CPU.
Table 2--5: Certifications and compliances
EC Declaration of Conformity -Low Voltage
Compliance was demonstrated to the following specification as listed in the Official Journal of the
European Communities:
Low Voltage Directive 73/23/EEC, Amended by 93/68/EEC
EN 61010-1:1993/A2:1995Safety requirements for electrical equipment for measurement,
2--6
control, and laboratory use
TMSSM3 700-Pin Socket Support
Specifications
Table 2--5: Certifications and compliances (cont.)
ApprovalsUL3111-1 -- Standard for electrical measuring and test equipment
CAN/CSA C22.2 No. 1010.1--92 -- Safety requirements for measurement, control, and laboratory
use.
Installation Category DescriptionsTerminals on this product may have different installation category designations. The installation
categories are:
CAT IIIDistribution-level mains (usually permanently connected). Equipment at this level is
typically in a fixed industrial location
CAT IILocal-level mains (wall sockets). Equipment at this level includes appliances, portable
tools, and similar products. Equipment is usually cord-connected
CAT ISecondary (signal level) or battery operated circuits of electronic equipment
71.12 mm
(2.800 in)
12.70 mm
(0.500 in)
Dimensions
Figure 2--6 shows the dimensions of the TMSSM3 probe head.
190.50 mm
(7.500 in)
Figure 2--6: Dimensions of the probe head
TMSSM3 700-Pin Socket Support
2--7
Specifications
Figure 2--7 shows the dimensions of the preprocessor unit. For required
clearances around the preprocessor unit, refer to Table 2--4 on page 2--6).
474.32 mm
(18.674 in)
425.45 mm
(16.750 in)
420.37 mm
(16.550 in)
139.70 mm
(5.500 in)
Figure 2--7: Dimensions of the preprocessor unit
160.27 mm
(6.310 in)
2--8
TMSSM3 700-Pin Socket Support
Reference
Reference Tables
The TMSSM3 software disk contains the following reference tables. Viewing a
table is not a requirement when preparing the module for use. You can view the
reference tables without connecting the TLA to your target system. These tables
are provided to assist you when you are debugging a target system.
HChannel and Group Definition Tables — The TMSSM3 software
automatically defines channel groups. These groups define the channel
assignments and the groups for a software support setup. If you want to
know what the group definition is for a channel group or which signal is in
which channel group, refer to these tables.
HSymbol Tables — Symbol files are files of alphanumeric symbol names and
associated data values. Symbol files are used to map a channel group value
to a text string and/or color. For example, a symbol file could map an
address group value to a function name. This is faster and easier to interpret
than a numeric value.
NOTE. The Color symbol table is not associated with any channel groups.
Viewing Reference Tables
You must load your support and merge the modules before completing the
following steps.
To view a symbol table, follow these steps:
1. In the System window under System, select Symbol to display the Symbol
2. Select Load to display the Load Symbol File window.
3. Select and right click one of the .tsf files to display the Select menu.
4. Select Open and select the appropriate editor, (Word Pad for example) to
window.
view the symbol table.
TMSSM3 700-Pin Socket Support
3- 1
Reference Tables
To Extract Groups
To extract a channel group or a group definition table, follow these steps:
1. Open a System window.
2. Select the Setup icon.
3. In the Setup window, open the Window menu and select Setup: <support file
name>.
4. In the Setup window under Group Name, s elect a group.
5. Open File, select Export Channel Setup to display a Channel Setup Export
window. Notice the Export Path name to locate your exported file later.
In the Channel Setup Export window under Export S elections, check that the
Export Channel Information and the Export Group Information boxes are
checked.
The Field delimiter box controls how the tables are displayed. See the
Tektronix logic analyzer online help for more information.
6. Select Export.
3- 2
TMSSM3 700-Pin Socket Support
Replaceable Parts List
Replaceable Parts List
This section contains a list of the replaceable components or modules for the
TMSSM3 Hardware Support package.
Parts Ordering Information
Replacement parts are available through your local Tektronix field office or
representative.
Changes to Tektronix products are sometimes made to accommodate improved
components as they become available and to give you the benefit of the latest
improvements. Therefore, when ordering parts, it is important to include the
following information in your order:
HPart number
HInstrument type or model number
HInstrument serial number
HInstrument modification number, if applicable
Module Servicing
If you order a part that has been replaced with a different or improved part, your
local Tektronix field office or representative will contact you concerning any
change in part number.
Modules can be serviced by selecting one of the following three options. Contact
your local Tektronix service center or representative for repair assistance.
Module Exchange. In some cases you may exchange your module for a remanufactured module. These modules cost significantly less than new modules and
meet the same factory specifications. For more information about the module
exchange program, call 1-800-833-9200. Outside North America, contact a
Tektronix sales office or distributor; see the Tektronix Web site for a list of
offices: www.tektronix.com.
Module Repair and Return. You may ship your module to us for repair, after which
we will return it to you.
New Modules. You may purchase replacement modules in the same way as other
replacement parts.
TMSSM3 700-Pin Socket Support
4--1
Replaceable Parts List
Using the Replaceable Parts List
This section contains a list of the mechanical and/or electrical components that
are replaceable for the TMSSM3 Hardware Support package. Use this list to
identify and order replacement parts. The following table describes each column
in the parts list.
Parts list column descriptions
ColumnColumn nameDescription
1Figure & index numberItems in this section are referenced by figure and index numbers to the exploded view illustrations
that follow.
2Tektronix part numberUse this part number when ordering replacement parts from Tektronix.
3 and 4Serial numberColumn three indicates the serial number at which the part was first effective. Column four
indicates the serial number at which the part was discontinued. No entry indicates the part is
good for all serial numbers.
5QtyThis indicates the quantity of parts used.
6Name & descriptionAn item name is separated from the description by a colon (:). Because of space limitations, an
item name may sometimes appear as incomplete. Use the U.S. Federal Catalog handbook H6-1
for further item name identification.
7Mfr. codeThis indicates the code of the actual manufacturer of the part.
8Mfr. part numberThis indicates the actual manufacturer’s or vendor’s part number.
Abbreviations
Mfr. Code to Manufacturer
Cross Index
Abbreviations conform to American National Standard ANSI Y1.1--1972.
The table titled Manufacturers Cross Index shows codes, names, and addresses of
manufacturers or vendors of components listed in the parts list.
4--2
TMSSM3 700-Pin Socket Support
Replaceable Parts List
Manufacturers cross index
Mfr.
code
060D9TENSOLITE COMPANYPRECISION HARNESS AND ASSEMBLY,3000
0B445ELECTRI--CORD MFG CO INC312 EAST MAIN STREETWESTFIELD, PA 16950
0KB01STAUFFER SUPPLY CO810 SE SHERMANPORTLAND, OR 97214--4657
S3109FELLER U.S. CORPORATION10B VAN DYKE AVENUENEW BRUNSWICK, NJ 08901
(Return the preprocessor unit to the factory if
service is required)
4--6
Figure 4--2: Preprocessor unit exploded view
TMSSM3 700-Pin Socket Support
Index
Index
A
About this manual set, ix
AC adapter, 2--5
Address, Tektronix, x
Address bus, 1--3
Airflow clearance, 2--6
Application, logic analyzer configuration, 1--1