Supermicro X11DPX-T operation manual

X11DPX-T

USER’S MANUAL

Revision 1.1

The information in this user’s manual has been carefully reviewed and is believed to be accurate. The vendor assumes

!

no responsibility for any inaccuracies that may be contained in this document, and makes no commitment to update
or to keep current the information in this manual, or to notify any person or organization of the updates. Please Note:

For the most up-to-date version of this manual, please see our website at www.supermicro.com.

Super Micro Computer, Inc. ("Supermicro") reserves the right to make changes to the product described in this manual
at any time and without notice. This product, including software and documentation, is the property of Supermicro and/
or its licensors, and is supplied only under a license. Any use or reproduction of this product is not allowed, except
as expressly permitted by the terms of said license.

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OR DOCUMENTATION, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. IN PARTICULAR, SUPER
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pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful
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to products containing CR (Manganese Dioxide) Lithium coin cells. “Perchlorate Material-special handling may apply.
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WARNING: This product can expose you to chemicals including
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to www.P65Warnings.ca.gov.

The products sold by Supermicro are not intended for and will not be used in life support systems, medical equipment,
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systems whose failure to perform be reasonably expected to result in signicant injury or loss of life or catastrophic

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Manual Revision 1.1

Release Date: October 08, 2020

Unless you request and receive written permission from Super Micro Computer, Inc., you may not copy any part of this

document. Information in this document is subject to change without notice. Other products and companies referred

to herein are trademarks or registered trademarks of their respective companies or mark holders.

Copyright © 2020 by Super Micro Computer, Inc.
All rights reserved.

Printed in the United States of America

Preface

Preface

About This Manual

This manual is written for system integrators, IT technicians, and knowledgeable end users.
It provides information for the installation and use of the X11DPX-T motherboard.

About This Motherboard

The X11DPX-T motherboard supports dual Intel® Xeon® Scalable-SP and 2nd Generation
Intel Xeon Scalable-SP processors (Socket P) with a TDP (Thermal Design Power) of up to
205W and three UPI (Ultra Path Interconnect) links of up to 10.4 GT/s (Note 1 below). With
the Intel C621 chipset built-in, this motherboard supports 3DS LRDIMM/RDIMM/LRDIMM/
NVDIMM DDR4 ECC memory of up to 2933*/2666 MHz in 16 slots (Note 2 below). It also
supports up to 2TB Intel Optane™ DC Persistent Memory in memory mode (2nd Gen Intel
Xeon Scalable-SP 82xx/62xx/52xx/4215 series processors only). The X11DPX-T provides
maximum performance, system cooling, and PCIe capacity. Also, this motherboard is optimized
for high-performance computing head-node, I/O intensive storage, security monitoring/DVR,
and industry applications. Please note that this motherboard is intended to be installed and
serviced by professional technicians only. For processor/memory updates, please refer to our
website at http://www.supermicro.com/products/.

Notes: 1. UPI/memory speeds are dependent on the processors installed in your sys-

tem. 2. Support for 2933MHz memory is dependent on the CPU SKU.

Manual organization

Chapter 1 describes the features, specications and performance of the motherboard, and

provides detailed information on the Intel C621 chipset.

Chapter 2 provides hardware installation instructions. Read this chapter when installing the

processor, memory modules, and other hardware components into the system.

Chapter 3 describes troubleshooting procedures for video, memory, and system setup stored

in the CMOS.

Chapter 4 includes an introduction to the BIOS, and provides detailed information on running

the CMOS Setup utility.

Appendix A provides BIOS Error Beep Codes.

Appendix B lists software program installation instructions.

Appendix C lists standardized warning statements in various languages.

Appendix D contains UEFI BIOS Recovery instructions.

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Super X11DPX-T User's Manual

Appendix E explains Intel VROC RAID settings.

Appendix F describes secure boot settings.

Appendix G states iSCSI settings.

Appendix H provides Network Interface Card (NIC) settings.

4

Contacting Supermicro

Headquarters

Address: Super Micro Computer, Inc.

980 Rock Ave.

San Jose, CA 95131 U.S.A.

Tel: [phone]

Fax: [phone]

Email: [e-mail] (General Information)

[e-mail] (Technical Support)

Website: www.supermicro.com

Europe

Contacting Supermicro

Address: Super Micro Computer B.V.

Het Sterrenbeeld 28, 5215 ML

's-Hertogenbosch, The Netherlands

Tel: [phone]

Fax: [phone]

Email: [e-mail] (General Information)

[e-mail] (Technical Support)

[e-mail] (Customer Support)

Website: www.supermicro.nl

Asia-Pacic

Address: Super Micro Computer, Inc.

3F, No. 150, Jian 1st Rd.

Zhonghe Dist., New Taipei City 235

Taiwan (R.O.C)

Tel: [phone]

Fax: [phone]

Email: [e-mail]

Website: www.supermicro.com.tw

5

Super X11DPX-T User's Manual

Table of Contents

Chapter 1 Introduction

Quick Reference ...............................................................................................................12

Quick Reference Table ......................................................................................................13

Motherboard Features .......................................................................................................15

1.1 Processor and Chipset Overview .......................................................................................19

1.2 Special Features ................................................................................................................20

Recovery from AC Power Loss .........................................................................................20

1.3 System Health Monitoring ..................................................................................................20

Onboard Voltage Monitors ................................................................................................21

Fan Status Monitor with Firmware Control .......................................................................21

Environmental Temperature Control .................................................................................21

System Resource Alert......................................................................................................21

1.4 ACPI Features ....................................................................................................................21

1.5 Power Supply .....................................................................................................................22

1.6 Advanced Power Management ..........................................................................................22

Intel Intelligent Power Node Manager (IPNM) ..................................................................22

Management Engine (ME) ................................................................................................22

1.7 Intel Optane DC Persistent Memory Overview ..................................................................22

Chapter 2 Installation

2.1 Static-Sensitive Devices .....................................................................................................23

Precautions .......................................................................................................................23

Unpacking .........................................................................................................................23

2.2 Motherboard Installation .....................................................................................................24

Location of Mounting Holes ..............................................................................................24

Tools Needed ....................................................................................................................24

Installing the Motherboard.................................................................................................25

2.3 Processor and Heatsink Installation ...................................................................................26

Intel Xeon Scalable-SP and 2nd Gen Intel Xeon Scalable-SP Processors .....................26

Overview of the Processor Socket Assembly ...................................................................27

Overview of the Processor Heatsink Module (PHM) ........................................................28

Attaching the Processor to the Narrow Processor Clip to Create the Processor Package

Assembly ...........................................................................................................................29

6

Table of Contents

Attaching the Processor Package Assembly to the Heatsink to Form the Processor

Heatsink Module (PHM) ....................................................................................................30

Preparing the CPU Socket for Installation ........................................................................31

Removing the Dust Cover from the CPU Socket .............................................................31

Installing the Processor Heatsink Module (PHM) ............................................................32

Removing the Processor Heatsink Module (PHM) from the Motherboard .......................33

2.4 Memory Support and Installation .......................................................................................34

Memory Support ................................................................................................................34

Memory Installation Sequence ..........................................................................................34

General Memory Population Requirements ......................................................................34

DDR4 Memory Support for Intel Xeon Scalable-SP Processors ......................................35

DDR4 Memory Support for 2nd Gen Intel Xeon Scalable-SP Processors .......................35

DIMM Population Guidelines for Optimal Performance ....................................................36

DIMM Population Table .....................................................................................................37

DIMM Installation ..............................................................................................................40

DIMM Removal .................................................................................................................40

2.5 Rear I/O Ports ....................................................................................................................41

2.6 Front Control Panel ............................................................................................................45

2.7 Connectors .........................................................................................................................49

Power Connections ...........................................................................................................49

Headers .............................................................................................................................50

2.8 Jumper Settings .................................................................................................................60

How Jumpers Work ...........................................................................................................60

2.9 LED Indicators ....................................................................................................................64

Chapter 3 Troubleshooting

3.1 Troubleshooting Procedures ..............................................................................................66

3.2 Technical Support Procedures ...........................................................................................70

3.3 Battery Removal and Installation .......................................................................................71

3.4 Frequently Asked Questions ..............................................................................................72

3.5 Returning Merchandise for Service ....................................................................................74

Chapter 4 UEFI BIOS

4.1 Introduction .........................................................................................................................75

4.2 Main Setup .........................................................................................................................76

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Super X11DPX-T User's Manual

4.3 Advanced Setup Congurations .........................................................................................78

4.4 Event Logs .......................................................................................................................157

4.5 IPMI ..................................................................................................................................159

4.6 Security .............................................................................................................................162

4.7 Boot ..................................................................................................................................165

4.8 Save & Exit .......................................................................................................................167

Appendix A BIOS Codes

Appendix B Software

B.1 Microsoft Windows OS Installation ...................................................................................171

B.2 Driver Installation ..............................................................................................................173

B.3 SuperDoctor 5 ..................................................................................................................174

B.4 IPMI ..................................................................................................................................175

B.5 Logging into the BMC (Baseboard Management Controller) ...........................................175

Appendix C Standardized Warning Statements

Appendix D UEFI BIOS Recovery

D.1 Overview ...........................................................................................................................179

D.2 Recovering the UEFI BIOS Image ...................................................................................179

D.3 Recovering the Main BIOS Block with a USB Device .....................................................180

Appendix E Conguring VROC RAID Settings

E.1 All Intel VMD Controllers Menu ........................................................................................184

E.2 Conguring RAID Settings ...............................................................................................188

E.3 Use of Journaling Drive ....................................................................................................204

Appendix F Secure Boot Settings

F.1 Boot mode select Feature ................................................................................................208

F.2 Secure Boot/ Secure Boot Mode/ CSM Support Features ..............................................209

F.3 Secure Boot Settings .......................................................................................................210

F.4 Key Management Settings ...............................................................................................213

Appendix G Conguring iSCSI Settings

G.1 PCIe/PCI/PnP Features ....................................................................................................230

G.2 Conguring iSCSI Settings ...............................................................................................233

Appendix H Conguring Network Interface Card (NIC) Settings

H.1 Network Interface Card (NIC) Settings ............................................................................252

8

Chapter 1: Introduction

Chapter 1

Introduction

Congratulations on purchasing your computer motherboard from an acknowledged leader
in the industry. Supermicro motherboards are designed with the utmost attention to detail to
provide you with the highest standards in quality and performance.

The X11DPX-T motherboard was designed to be used with a Supermicro-proprietary chassis
as an integrated server platform. It is not to be used as a stand-alone product and will not
be shipped independently in a retail box. No motherboard shipping package will be provided
in your shipment.

Important Links

For your system to work properly, please follow the links below to download all necessary
drivers/utilities and the user’s manual for your server.

• Supermicro product manuals: http://www.supermicro.com/support/manuals/

• Product drivers and utilities: http://www.supermicro.com/wftp

• Product safety info: http://www.supermicro.com/about/policies/safety_information.cfm

• A secure data deletion tool designed to fully erase all data from storage devices can be

found at our website: https://www.supermicro.com/about/policies/disclaimer.cfm?url=/

wftp/utility/Lot9_Secure_Data_Deletion_Utility/

• If you have any questions, please contact our support team at: support@supermicro.

com

This manual may be periodically updated without notice. Please check the Supermicro website

for possible updates to the manual revision level.

9

Super X11DPX-T User's Manual

Figure 1-1. X11DPX-T Motherboard Image

Note: All graphics shown in this manual were based upon the latest PCB revision

available at the time of publication of the manual. The motherboard you received may
or may not look exactly the same as the graphics shown in this manual.

10

Chapter 1: Introduction

FAN6

JIPMB1

JPTG1

COM2

JRK1

JWD1

JSEN1

JSTBY1

DESIGNED IN USA

FANC FAND

JPCIE1

JPCIE2

(CPU1 SLOT1 PCI-E 3.0 x8)

(CPU1 SLOT2 PCI-E 3.0 x16)

JNVI2C1

S-UM12

X11DPX-T

REV:1.01A

JPCIE4

JPCIE3

(CPU1 SLOT4 PCI-E 3.0 x16)

(CPU1 SLOT3 PCI-E 3.0 x8)

BIOS
LICENSE

Figure 1-2. X11DPX-T Motherboard Layout

(not drawn to scale)

JUIDB1

LED2

(UID)

BMC

JPCIE6

JPCIE5

(CPU2 SLOT6 PCI-E 3.0 x16)

(CPU2 SLOT5 PCI-E 3.0 x8)

JPCIE7

JPCIE8

(CPU1 SLOT7 PCI-E 3.0 x8)

(CPU2 SLOT8 PCI-E 3.0 x16)

LEDBMC

LAN
CTRL

JNCSI1

JPCIE11

JNVI2C2

(CPU2 SLOT11 PCI-E 3.0 x4 (IN x8))

JPCIE10

JPCIE9

(CPU2 SLOT9 PCI-E 3.0 x8)

(CPU2 SLOT10 PCI-E 3.0 x8)

P1-DIMMF1

P1-DIMME1

P1-DIMMD1

P1-DIMMD2

(UID-LED)

P2-DIMMC1

P2-DIMMB1

VGA

ALWAYS POPULATE DIMMx1 FIRST

P2-DIMMA1

P2-DIMMA2

LAN 2 LAN 1

FAN4

CPU2

USB 0/1

USB 4/5 (3.0)

IPMI_LAN

FAN3

P1-DIMMA2

P1-DIMMA1

COM1

ALWAYS POPULATE DIMMx1 FIRST

P2-DIMMD2

P1-DIMMB1

P1-DIMMC1

P2-DIMMF1

P2-DIMMD1

P2-DIMME1

S-SGPIO

JSD2

S-SATA1

USB 2/3

JL1

M.2 CONNECTOR

ALWAYS POPULATE DIMMx1 FIRST

JBT1

BT1

JSD1

PCH

S-SATA0

USB 6/7 (3.0)

FANB

IPMI CODE

I-SATA4~7 I-SATA0~3

JPME2

USB8 (3.0)

BAR CODE

SAN MAC
MAC CODE

JF1

JTPM1

LEDPWR

SP1

FANA

FAN2

Notes:

1. Components not documented are for internal testing only.

CPU1

ALWAYS POPULATE DIMMx1 FIRST

JPI2C1

JPWR4

JPWR3

JPWR2

JPWR1

FAN5

FAN1

2. Intel VMD is supported by CPU2 SLOT9 and CPU2 SLOT10. After you’ve enabled
VMD in the BIOS on a PCIe slot of your choice, this PCIe slot will be dedicated for
VMD use only, and it will no longer support any PCIe device. To re-activate this slot
for PCIe use, please disable VMD in the BIOS.

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Super X11DPX-T User's Manual

Quick Reference

COM2

JPTG1

JRK1

JIPMB1

CPU1 SLOT1

JWD1

JSEN1

JSTBY1

S-SGPIO

JSD2
JSD1

S-SATA1

USB 2/3
USB 6/7

(3.0)

CPU1 SLOT2

FANC

JNVI2C1

S-SATA0

JL1

FANB

DESIGNED IN USA

FAND

CPU1 SLOT3

CPU1 SLOT4

JBT1

PCH

IPMI CODE

I-SATA4~7

I-SATA0~3

X11DPX-T

REV:1.01A

CPU2 SLOT5

BIOS
LICENSE

USB8 (3.0)

CPU2 SLOT6

BMC

CPU1 SLOT7

M.2 CONNECTOR

BT1

BAR CODE

JPME2

SAN MAC
MAC CODE

JF1

LEDPWR

CPU2 SLOT8

CPU2 SLOT9

JNVI2C2

CPU2 SLOT10

CPU2 SLOT11

JTPM1

SP1

FAN2

FANA

LED2

LEDBMC

JNCSI1

LAN
CTRL

P1-DIMME1

P1-DIMMF1

P1-DIMMD2

P1-DIMMD1

JUIDB1

VGA

P2-DIMMB1

P2-DIMMC1

P2-DIMMA1

LAN2

FAN4

USB 4/5 (3.0)

P2-DIMMA2

CPU1

LAN1

USB 0/1

CPU2

IPMI_LAN

FAN3

P1-DIMMA1

P1-DIMMA2

P1-DIMMC1

P1-DIMMB1

COM1

FAN1

FAN5

P2-DIMMF1

P2-DIMME1

P2-DIMMD1

P2-DIMMD2

FAN6

JPI2C1

JPWR4

JPWR3

JPWR2

JPWR1

Notes:

• See Chapter 2 for detailed information on jumpers, I/O ports, and JF1 front panel connec-

tions.

• " " indicates the location of Pin 1.

• Components/jumpers/LED indicators not documented are reserved for internal testing only.

• Use only the correct type of onboard CMOS battery as specied by the manufacturer. Do

not install the onboard battery upside down to avoid possible explosion.

12

Chapter 1: Introduction

Quick Reference Table

Jumper Description Default Setting

JBT1 CMOS Clear Open (Normal)

JPME2 ME Manufacturing Mode Pins 1-2 (Normal)

JPTG1 Onboard 10Gb LAN1/LAN2 Enable/Disable Pins 1-2 (Enabled)

JWD1 Watch Dog Timer Reset Pins 1-2 (Reset)

Connector Description

BT1 Onboard Battery

COM1 COM Port (COM1) on the I/O Back Panel

COM2 COM Header

FAN1 ~ FAN6, FANA,

FANB, FANC, FAND

I-SATA0~3, I-SATA4~7 Intel PCH SATA 3.0 Ports (0~3, 4~7)

IPMI_LAN Dedicated IPMI LAN Port

JF1 Front Control Panel Header

JIPMB1 4-pin BMC External I2C Header (for an IPMI card)

JL1

JNCSI1 NC-SI Header for IPMI Support

JNVI2C1

JNVI2C2

JPI2C1 Power Supply SMBus I2C Header

JPWR1 24-pin ATX Power Connector

JPWR2, JPWR3 12V 8-pin CPU Power Connectors

JPWR4 12V 4-pin Power Connector

JRK1 (VROC) Intel VROC RAID Key Header for NVMe SSD

JSD1, JSD2 SATA DOM Power Connectors 1/2

JSEN1 Inlet Sensor Header

JSTBY1 Standby Power Connector

JTPM1 Trusted Platform Module/Port 80 connector

JUIDB1 UID (Unit Identier) Switch

System/CPU Fan Headers (FAN5: CPU1 Fan, FAN6: CPU2 Fan)

Chassis Intrusion Header (Note: Please connect a cable from the Chassis Intrusion header at JL1

to the chassis to receive an alert via IPMI.)

NVMe SMBus (I2C) headers used for PCIe hot-plug SMBus clock & data connections, and for

the NVMe Add-on Card on PCIe Slot9 (an SMCI-proprietary NVMe add-on card and cable are

required; available for a Supermicro complete system only)

NVMe SMBus (I2C) headers used for PCIe hot-plug SMBus clock & data connections, and for

the NVMe Add-on Card on PCIe Slot10 (an SMCI-proprietary NVMe add-on card and cable are

required; available for a Supermicro complete system only)

Note 1: Intel VMD is supported by CPU2 SLOT9 and CPU2 SLOT10.

Note 2: After you’ve enabled VMD in the BIOS on a PCIe slot of your choice, this PCIe

slot will be dedicated for VMD use only, and it will no longer support any PCIe device.
To re-activate this slot for PCIe use, please disable VMD in the BIOS.

13

Super X11DPX-T User's Manual

Connector Description

LAN1, LAN2 LAN Ports

M.2 CONNECTOR

S-SATA0, S-SATA1 SATA 3.0 Ports with Power-pin Built-in w/support of SuperDOM (Disk-On-Module)

S-SGPIO Serial Link General Purpose I/O Header

SP1 Internal Speaker/Buzzer

USB0, USB1 Back Panel USB 2.0 Ports

USB2, USB3 Front Access USB 2.0 Header

USB4, USB5 Back Panel USB 3.0 Ports

USB6, USB7 Front Access USB 3.0 Header

USB8 USB 3.0 Type A Header

VGA VGA Port (Back Panel)

LED Description Status

LED2 UID (Unit Identier) LED Solid Blue: Unit Identied

LEDBMC BMC Heartbeat LED Blinking Green: BMC Normal

LEDPWR Onboard Power LED Solid Green: Power On

PCIe M.2 Connector (small form factor devices and other portable devices for high speed NVMe

SSDs)

Note: To avoid causing interference with other components, please be sure to use an

add-on card that is fully compliant with the PCIe standard on a PCIe slot.

14

Chapter 1: Introduction

Motherboard Features

Motherboard Features

CPU

• Dual Intel Xeon Scalable-SP and 2nd Gen Intel Xeon Scalable-SP processors (Socket P) with three Intel UltraPath

Interconnect (UPI) links of up to 10.4 GT/s

Note: For the latest CPU/memory updates, please refer to our website at http://www.supermicro.com/products/

motherboard.

Memory

• Integrated memory controller embedded in the processor supports up to 4TB of 3DS Load Reduced DIMM (3DS LRDIMM),

3DS Registered DIMM (3DS RDIMM), or up to 2TB of Load Registered DIMM (LRDIMM), with speeds of 2933*/2666/24

00/2133/1866/1600/1333 MHz modules in 16 memory slots

Notes: 1. The memory capacity support will di󰀨er according to the processor SKUs. 2. Up to 2TB DCPMM memory

is supported (2nd Gen Intel Xeon Scalable-SP 82xx/62xx/52xx/4215 series processors only). 3. Support for 2933MHz

memory is dependent on the CPU SKU. 4. Refer to page 35 for detailed DDR4 memory support list.

DIMM Size

• Up to 256GB at 1.2V

Note 1: Memory speed support depends on the processors used in the system.

Note 2: For the latest CPU/memory updates, please refer to our website at http://www.supermicro.com/products/

motherboard.

Chipset

• Intel C621

Expansion Slots

• Two PCIe 3.0 x16 Slots (Slot4, Slot8)

• Two PCIe 3.0 x16 Slots (Slot2, Slot6), or four PCIe 3.0 x8 Slots (Slot1, Slot2, Slot5, Slot6)

• Two PCIe 3.0 x8 Slots (Slot9, Slot10)

• One PCIe 3.0 x4 in x8 Slot (Slot11)

Non Volatile Memory Express (NVMe) Slot

• One PCIe 3.0 x4 M.2 Slot

• M.2 Form Factor: 2280, 22110

• M.2 Key: M-Key

BaseBoard Management Controller (BMC)

• ASPEED AST2500 Baseboard Controller (BMC) supports IPMI 2.0

• One IPMI_dedicated_LAN located on the rear IO back panel

Graphics

• Graphics controller via ASPEED AST2500 BMC

Note: The table above is continued on the next page.

15

Super X11DPX-T User's Manual

Motherboard Features

I/O Devices

• Serial (COM) Port

• SATA 3.0

• RAID (PCH) • RAID 0/1/5/10 (RSTe 5.x)

Peripheral Devices

• Two USB 3.0 ports on the rear I/O panel (USB 4/5)

• One internal USB 3.0 header with two USB connections on the motherboard for front access (USB 6/7)

• One Type A USB 3.0 connector for front access (USB 8)

• Two USB 2.0 ports on the rear I/O panel (USB 0/1)

• One internal USB 2.0 header with two USB connections on the motherboard for front access (USB 2/3)

BIOS

• 32 MB SPI AMI BIOS

®

SM Flash UEFI BIOS

• ACPI 3.0/4.0, USB keyboard, Plug-and-Play (PnP), SPI dual/quad speed support, and SMBIOS 2.7 or later

• Two Fast UART 16550 ports (one port on the I/O back panel, one header on

the motherboard)

• Eight SATA 3.0 connections supported by Intel PCH (I-SATA 0-3, 4-7)

• Two SATA 3.0 ports with power-pin built-in, w/support of Supermicro SuperDOM

(S-SATA0/S-SATA1)

Power Management

• Main switch override mechanism

• Power-on mode for AC power recovery

• Intel Intelligent Power Node Manager 4.0 (Available when the Supermicro Power Manager [SPM] is installed and a special

power supply is used. See the note on page 22.)

• Management Engine (ME)

System Health Monitoring

• Onboard voltage monitoring for +3.3V, 3.3V standby, +5V, +5V standby, +12V, CPU core, memory, chipset, BMC, and

PCH voltages

• CPU System LED and control

• CPU Thermal Trip support

• Status monitor for on/o󰀨 control

• CPU Thermal Design Power (TDP) support of up to 205W (See Note 1 on the next page.)

Fan Control

• Fan status monitoring via IPMI

• Dual cooling zone

• Multi-speed fan control via onboard BMC

• Pulse Width Modulation (PWM) fan control

Note: The table above is continued on the next page.

16

Chapter 1: Introduction

Motherboard Features

System Management

• Trusted Platform Module (TPM) support

• PECI (Platform Environment Control Interface) 2.0 support

• UID (Unit Identication)/Remote UID

• System resource alert via SuperDoctor 5

• SuperDoctor 5, Watch Dog, NMI

• Chassis intrusion header and detection (Note: Please connect a cable from the Chassis Intrusion header at JL1 to the

chassis to receive an alert via IPMI.)

LED Indicators

• CPU/Overheating

• Fan Failure

• UID/remote UID

• HDD activity, LAN activity

Dimensions

• 15.12" (L) x 13.2" (W) (384 mm x 335.3 mm)

Note 1: The CPU maximum thermal design power (TDP) is subject to chassis and

heatsink cooling restrictions. For proper thermal management, please check the chas-

sis and heatsink specications for proper CPU TDP sizing.

Note 2: For IPMI conguration instructions, please refer to the Embedded IPMI Con­guration User's Guide available at http://www.supermicro.com/support/manuals/.

17

Super X11DPX-T User's Manual

JPCIE9 Slot 9

PCIE 3.0 x8

JPCIE10 Slot 10

PCIE 3.0 x8

JPCIE8
Slot 8

PCIE 3.0 x16

Figure 1-3.

System Block Diagram

16GB/s

x8 x8

x8

16GB/s

32GB/s

x16

16GB/s

16GB/s

x8

x4

8GB/s

JPCIE5 Slot 5

PCIE 3.0 x8

JPCIE6 Slot 6

PCIE 3.0 x16

JPCIE11
Slot 11

PCIE 3.0 x4

ASMedia Switch

ASM1480

VCCP1&2 12v

VR13
6+1 PHASE
205W

ASMedia Switch

ASM1480

#1

#1

LANE Reversal

32MB BIOS

SPI FLASH

DDR4 DIMM

DDR4 DIMM

M

F

#1

DDR4 DIMM

#1

DDR4 DIMM

JPCIE4
Slot 4

PCIE 3.0 x16

JPCIE7 Slot 7

PCIE 3.0 x8

JPCIE3 Slot 3

PCIE 3.0 x8

JPCIE2 Slot 2

PCIE 3.0 x16

JPCIE1 Slot 1

PCIE 3.0 x8

BMC SPI

MUX

PCH SPI

#1

#2

L

E

3 CH 3 CH

DDR4 DIMM

#1

#2

3 CH 3 CH

DDR4 DIMM

32GB/s

x16

16GB/s

x8

x8

16GB/s

16GB/s

x8

x8

EXT CONN

JNCSI1

16GB/s

32MB BMC

SPI FLASH

DDR4

VGA

K

PE2 PE1 DMIPE3

CPU 2

P2 P1 P0

UPI

P2 P0

CPU 1

NC-SI(RMII)

BMC

AST2500

HWM

UPI

UL1

UPI

P1

DMIPE3 PE2 PE1

8GB/s

10.4GT/s
Polarity Inversion

G

AD

PET [0,1,2,3]

PET [4,5,6,7]

DMI

PET9

SPI

PHY
RTL8211E

COM1

COM2

#1

#2

DDR4 DIMM

#2

#1

DDR4 DIMM

SATA Gen3 [0..3]

SATA Gen3 [4..7]

sSATA Gen3 [4..5]

PCH

USB2.0 [2..5]
USB2.0 [7..12]
USB3.0 [1..5]

USB2.0 [9] ESPI

#1

H J

#1

B C

x4x48GB/s

TPM Header

IPMI LAN
RJ45

DDR4 DIMM

DDR4 DIMM

8GB/s

I-SATA-0~3
IPASS CONN

I-SATA-4~7
IPASS CONN

S-SATA0
S-SATA1

port 4,5(USB2.0)

REAR USB0/1

#1

DDR4 DIMM

#1

DDR4 DIMM

port 1,2(USB3.0)
+
port 11,12(USB2.0)

REAR USB4/5 (3.0)

M.2 CONN
PCIE 3.0 x4

X550

port 3,4(USB3.0)
+
port 2,3(USB2.0)

HDR 2x10

USB6/7 (3.0) USB2/3

JLAN1

10G

RJ45

10G

JLAN2
RJ45

NC-SI

To BMC RMII port

port 8,9(USB2.0)

HDR 2x5

port 5(USB3.0)
+
port 10(USB2.0)

TYPE A USB8 (3.0)

Note: This is a general block diagram and may not exactly represent the features on

your motherboard. See the previous pages for the actual specications of your moth­erboard.

18

Chapter 1: Introduction

1.1 Processor and Chipset Overview

Built upon the functionality and capability of the Intel Xeon Scalable-SP series and 2nd
Gen Intel Xeon Scalable-SP series processors with the Intel C621 chipset, the X11DPX-T

motherboard provides system performance, power e󰀩ciency, and feature sets to address the

needs of next-generation computer users. This motherboard is ideal for high-performance
computing, I/O intensive storage and application, and industry embedded appliances.

The Intel C621 chipset provides Enterprise SMbus support and includes the following features:

• DDR4 288-pin memory support on Socket P

• Support for MCTP Protocol

• Support for Management Engine (ME)

• Support of SMBus speeds of up to 400KHz for BMC connectivity

• Improved I/O capabilities to high-storage-capacity congurations

• SPI enhancements

• Intel Node Manager 4.0 for advanced power monitoring, capping, and management for

BMC enhancement

• The BMC supports remote management, virtualization, and the security package for en-

terprise platforms

Note: Node Manager 4.0 support is dependent on the power supply used in the system.

Features Supported by Intel Xeon Scalable-SP Processors

Intel Xeon Scalable-SP processors support the following features:

• Intel AVX-512 instruction support to handle complex workloads

• 1.5x memory bandwidth increased to 6 channels

• Hot plug and enclosure management with Intel Volume Management Device (Intel VMD)

• Rich set of available IOs with increased PCIe lanes (48 lanes)

19

Super X11DPX-T User's Manual

New features supported by 2nd Gen Intel Xeon Scalable-SP Series Processors

2nd Generation Intel Xeon Scalable-SP processors support the following features:

• Higher performance for a wider range of workloads with per-core performance increase

• Support of Optane DC Persistent Memory (DCPMM) with a󰀨ordable, persistent, and

large capacity (Refer to Section 1.7 for details.)

• Up to 2933 MHz memory supported

• Vector Neural Network Instruction (VNNI) support for Accelerate Deep Learning & Arti-

cial Intelligence (AI) workloads

• Speed Select Technology provides multiple CPU proles that can be set in the BIOS.

(This feature is available on select CPU SKUs).

• Seamless hardware security mitigations & performance/frequency exibility

Note: Support for 2933MHz memory and DCPMM memory is dependent on the CPU

SKU.

1.2 Special Features

This section describes the health monitoring features of the X11DPX-T motherboard. The
motherboard has an onboard ASPEED AST2500 Baseboard Management Controller (BMC)
that supports system health monitoring.

Recovery from AC Power Loss

The Basic I/O System (BIOS) provides a setting that determines how the system will respond
when AC power is lost and then restored to the system. You can choose for the system to

remain powered o󰀨 (in which case you must press the power switch to turn it back on), or

for it to automatically return to the power-on state. See the Advanced BIOS Setup section
for this setting. The default setting is Last State.

1.3 System Health Monitoring

This section describes the health monitoring features of the X11DPX-T motherboard. The
motherboard has an onboard Baseboard Management Controller (BMC) chip that supports
system health monitoring.

20

Chapter 1: Introduction

Onboard Voltage Monitors

The onboard voltage monitor will continuously scan crucial voltage levels. Once a voltage
becomes unstable, it will give a warning or send an error message to the IPMI WebGUI and
IPMIView. Real time readings of these voltage levels are all displayed in IPMI.

Fan Status Monitor with Firmware Control

The system health monitor embedded in the BMC chip can check the RPM status of the
cooling fans. The CPU and chassis fans are controlled via lPMI.

Environmental Temperature Control

System Health sensors in the BMC monitor the temperatures and voltage settings of onboard
processors and the system in real time via the IPMI interface. Whenever the temperature

of the CPU or the system exceeds the manufacturer-dened threshold, system/CPU cooling
fans will increase fan spin to provide better air ow to prevent the CPU or the system from

overheating.

Note: To avoid possible system overheating, please be sure to provide adequate air-

ow to your system.

System Resource Alert

This feature is available when used with SuperDoctor® 5. SuperDoctor 5 is used to notify the

user of certain system events. For example, you can congure SuperDoctor 5 to provide you

with warnings when the system temperature, CPU temperatures, voltages and fan speeds

go beyond a predened range.

1.4 ACPI Features

ACPI stands for Advanced Conguration and Power Interface. The ACPI specication denes
a exible and abstract hardware interface that provides a standard way to integrate power

management features throughout a computer system including its hardware, operating system

and application software. This enables the system to automatically turn on and o󰀨 peripherals

such as network cards, hard disk drives and printers.

In addition to enabling operating system-directed power management, ACPI also provides a
generic system event mechanism for Plug and Play and an operating system-independent

interface for conguration control. ACPI leverages the Plug and Play BIOS data structures

while providing a processor architecture-independent implementation that is compatible with
appropriate Windows operating systems. For detailed information on OS support, please refer
to our website at www.supermicro.com.

21

Super X11DPX-T User's Manual

1.5 Power Supply

As with all computer products, a stable power source is necessary for proper and reliable
operation. It is even more important for processors that have high CPU clock rates.

1.6 Advanced Power Management

The following new advanced power management features are supported by the motherboard.

Intel Intelligent Power Node Manager (IPNM)

Intel's Intelligent Power Node Manager (IPNM) provides your system with real-time thermal
control and power management for maximum energy e󰀩ciency. Although IPNM Specication

Version 2.0/3.0 is supported by the BMC (Baseboard Management Controller), your system

must also have IPNM-compatible Management Engine (ME) rmware installed to use this

feature.

Note: Support for IPNM 2.0/3.0 support is dependent on the power supply used in the

system.

Management Engine (ME)

The Management Engine, which is an ARC controller embedded in the IOH (I/O Hub), provides

Server Platform Services (SPS) to your system. The services provided by SPS are di󰀨erent

from those provided by the ME on client platforms.

1.7 Intel Optane DC Persistent Memory Overview

2nd Generation Intel Xeon Scalable-SP processors support new DCPMM (Optane™ DC

Persistent Memory Modules) technology that o󰀨ers data persistence with higher capacity than

existing memory modules and lower latency than NVMe SSDs. DCPMM memory provides

hyper-speed storage capability for high performance computing platforms with exible
conguration options.

22

Chapter 2: Installation

Chapter 2

Installation

2.1 Static-Sensitive Devices

Electrostatic Discharge (ESD) can damage electronic com ponents. To avoid damaging
your motherboard and your system, it is important to handle it very carefully. The following

measures are generally su󰀩cient to protect your equipment from ESD.

Precautions

• Use a grounded wrist strap designed to prevent static discharge.

• Touch a grounded metal object before removing the motherboard from the antistatic bag.

• Handle the motherboard by its edges only; do not touch its components, peripheral chips,

memory modules or gold contacts.

• When handling chips or modules, avoid touching their pins.

• Put the motherboard and peripherals back into their antistatic bags when not in use.

• For grounding purposes, make sure that your chassis provides excellent conductivity be-

tween the power supply, the case, the mounting fasteners and the motherboard.

• Use only the correct type of CMOS onboard battery as specied by the manufacturer. Do

not install the CMOS battery upside down, which may result in a possible explosion.

Unpacking

The motherboard is shipped in antistatic packaging to avoid static damage. When unpacking
the motherboard, make sure that the person handling it is static protected.

23

Super X11DPX-T User's Manual

LAN
CTRL

DESIGNED IN USA

X11DPX-T

REV:1.01A

CPU2

CPU1

BIOS
LICENSE

SAN MAC
MAC CODE

BAR CODE

PCH

IPMI CODE

BMC

2.2 Motherboard Installation

All motherboards have standard mounting holes to t di󰀨erent types of chassis. Make sure

that the locations of all the mounting holes for both the motherboard and the chassis match.
Although a chassis may have both plastic and metal mounting fasteners, metal ones are
highly recommended because they ground the motherboard to the chassis. Make sure that

the metal stando󰀨s click in or are screwed in tightly.

Tools Needed

Philips
Screwdriver (1)

Location of Mounting Holes

Philips Screws (14)

Stando󰀨s (14)

Only if Needed

Notes: 1. To avoid damaging the motherboard and its components, please do not use

a force greater than 8 lb/inch on each mounting screw during motherboard installation.

2. Some components are very close to the mounting holes. Please take precautionary
measures to avoid damaging these components when installing the motherboard to
the chassis.

24

Chapter 2: Installation

Installing the Motherboard

1. Install the I/O shield into the back of the chassis if needed.

2. Locate the mounting holes on the motherboard. See the previous page for the location.

3. Locate the matching mounting holes on the chassis. Align the mounting holes on the
motherboard against the mounting holes on the chassis.

4. Install stando󰀨s in the chassis as needed.

5. Install the motherboard into the chassis carefully to avoid damaging other motherboard
components.

6. Using the Phillips screwdriver, insert a Phillips head #6 screw into a mounting hole on
the motherboard and its matching mounting hole on the chassis.

7. Repeat Step 6 to insert Pan head #6 screws into all mounting holes.

8. Make sure that the motherboard is securely placed in the chassis.

Note: Images displayed in this manual are for illustration only. Your chassis or compo-

nents might look di󰀨erent from those shown in this manual.

25

Super X11DPX-T User's Manual

2.3 Processor and Heatsink Installation

Warning: When handling the processor package, avoid placing direct pressure on the label

area of the CPU or CPU socket. Also, improper CPU installation or socket misalignment can
cause serious damage to the CPU or motherboard which may result in RMA repairs. Please
read and follow all instructions thoroughly before installing your CPU and heatsink.

Notes:

• Always connect the power cord last, and always remove it before adding, removing, or

changing any hardware components. Please note that the processor and heatsink should

be assembled together rst to form the Processor Heatsink Module (PHM), and then install

the entire PHM into the CPU socket.

• When you receive a motherboard without a processor pre-installed, make sure that the

plastic CPU socket cap is in place and that none of the socket pins are bent; otherwise,
contact your retailer immediately.

• Refer to the Supermicro website for updates on CPU support.

• Please follow the instructions given in the ESD Warning section on the rst page of this

chapter before handling, installing, or removing system components.

Intel Xeon Scalable-SP and 2nd Gen Intel Xeon Scalable-SP
Processors

Intel Xeon Scalable-SP and 2nd Gen Intel Xeon Scalable-SP Processor

Note: All graphics, drawings, and pictures shown in this manual are for illustration only.

The components that came with your machine may or may not look exactly the same
as those shown in this manual.

26

Chapter 2: Installation

Overview of the Processor Socket Assembly

The processor socket assembly contains 1) Intel Xeon Scalable-SP or 2nd Generation Intel
Xeon Scalable-SP processor, 2) the narrow processor clip, 3) the dust cover, and 4) the CPU
socket.

1. Intel Processor

2. Narrow processor clip (the plastic processor package carrier used for the CPU)

3. Dust Cover

4. CPU Socket

Note: Be sure to cover the CPU socket with the dust cover when the CPU is not installed.

27

Super X11DPX-T User's Manual

Overview of the Processor Heatsink Module (PHM)

The Processor Heatsink Module (PHM) contains 1) a heatsink, 2) a narrow processor clip,
and 3) Intel Xeon Scalable-SP or 2nd Generation Intel Xeon Scalable-SP processor.

1. Heatsink

2. Narrow processor clip

3. Intel Processor

Processor Heatsink Module (PHM)

(Bottom View)

28

Chapter 2: Installation

A

Allow Notch B to
latch on to CPU

Attaching the Processor to the Narrow Processor Clip to Create
the Processor Package Assembly

To properly install the CPU into the narrow processor clip, please follow the steps below.

1. Locate pin 1 (notch A), which is the triangle located on the top of the narrow processor
clip. Also locate notch B and notch C on the processor clip.

2. Locate pin 1 (notch A), which is the triangle on the substrate of the CPU. Also, locate
notch B and notch C on the CPU as shown below.

3. Align pin 1 (the triangle on the substrate) of the CPU with pin 1 (the triangle) of
the narrow processor clip. Once they are aligned, carefully insert the CPU into the
processor clip by sliding notch B of the CPU into notch B of the processor clip, and

sliding notch C of the CPU into notch C of the processor clip.

4. Examine all corners of the CPU to ensure that it is properly seated on the processor
clip. Once the CPU is securely attached to the processor clip, the processor package
assembly is created.

Note: Please exercise extreme caution when handling the CPU. Do not touch the CPU

LGA-lands to avoid damaging the LGA-lands or the CPU. Be sure to wear ESD gloves
when handling components.

CPU (Upside Down)
w/CPU LGA Lands up

Align Notch B of the CPU
and Notch B of the Processor Clip

Align CPU Pin 1

C

Align Notch C of the CPU
and Notch C of the Processor Clip

B

Allow Notch C to
latch on to CPU

A

Pin 1

C

C

B

CPU/Heatsink Package
(Upside Down)

B

A

Processor Package Carrier (w/CPU mounted

on the Processor Clip)

29

Super X11DPX-T User's Manual

Attaching the Processor Package Assembly to the Heatsink to
Form the Processor Heatsink Module (PHM)

After you have made a processor package assembly by following the instructions on the
previous page, please follow the steps below to mount the processor package assembly onto
the heatsink to create the Processor Heatsink Module (PHM).

1. Locate "1" on the heatsink label and the triangular corner next to it on the heatsink.

With your index nger pressing against the screw at this triangular corner, carefully hold

and turn the heatsink upside down with the thermal-grease side facing up. Remove the

protective thermal lm if present, and apply the proper amount of the thermal grease

as needed. (Skip this step if you have a new heatsink because the necessary thermal
grease is pre-applied in the factory.)

2. Holding the processor package assembly at the center edge, turn it upside down. With
the thermal-grease side facing up, locate the hollow triangle located at the corner of the
processor carrier assembly ("a" in the graphic). Note a larger hole and plastic mounting
clicks located next to the hollow triangle. Also locate another set of mounting clicks and
a larger hole at the diagonal corner of the same (reverse) side of the processor carrier
assembly ("b" in the graphic).

3. With the back of heatsink and
the reverse side of the processor
package assembly facing up,
align the triangular corner on
the heatsink ("A" in the graphic)
against the mounting clips next
to the hollow triangle ("a") on the
processor package assembly.

4. Also align the triangular corner
("B") at the diagonal side of the
heatsink with the corresponding
clips on the processor package
assembly ("b").

5. Once the mounting clips on the
processor package assembly
are properly aligned with the
corresponding holes on the back
of heatsink, securely attach
the heatsink to the processor
package assembly by snapping the
mounting clips at the proper places
on the heatsink to create the
processor heatsink module (PHM).

Triangle on the CPU

Triangle on the
Processor Clip

On Locations (A, B), the notches
snap onto the heatsink’s sides

Non-Fabric CPU and Processor Clip

(Upside Down)

b

d

B

a

D

Heatsink

(Upside Down)

A

On Locations of (C, D), the notches

snap onto the heat sink’s

B

D

A

Make sure Mounting

Notches snap into place

c

C

mounting holes

C

30