Supermicro X11DPH-T operation manual

X11DPH-I

X11DPH-T

X11DPH-TQ

USER’S MANUAL

Revision 1.2b

The information in this user’s manual has been carefully reviewed and is believed to be accurate. The vendor assumes
no responsibility for any inaccuracies that may be contained in this document, and makes no commitment to update
or to keep current the information in this manual, or to notify any person or organization of the updates. Please Note:

For the most up-to-date version of this manual, please see our website at

www.supermicro.com.

Super Micro Computer, Inc. ("Supermicro") reserves the right to make changes to the product described in this manual
at any time and without notice. This product, including software and documentation, is the property of Supermicro and/
or its licensors, and is supplied only under a license. Any use or reproduction of this product is not allowed, except
as expressly permitted by the terms of said license.

IN NO EVENT WILL SUPER MICRO COMPUTER, INC. BE LIABLE FOR DIRECT, INDIRECT, SPECIAL,
INCIDENTAL, SPECULATIVE OR CONSEQUENTIAL DAMAGES ARISING FROM THE USE OR INABILITY TO
USE THIS PRODUCT OR DOCUMENTATION, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.
IN PARTICULAR, SUPER MICRO COMPUTER, INC. SHALL NOT HAVE LIABILITY FOR ANY HARDWARE,
SOFTWARE, OR DATA STORED OR USED WITH THE PRODUCT, INCLUDING THE COSTS OF REPAIRING,
REPLACING, INTEGRATING, INSTALLING OR RECOVERING SUCH HARDWARE, SOFTWARE, OR DATA.

Any disputes arising between manufacturer and customer shall be governed by the laws of Santa Clara County in the
State of California, USA. The State of California, County of Santa Clara shall be the exclusive venue for the resolution
of any such disputes. Supermicro's total liability for all claims will not exceed the price paid for the hardware product.

FCC Statement: This equipment has been tested and found to comply with the limits for a Class A digital device
pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful
interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can
radiate radio frequency energy and, if not installed and used in accordance with the manufacturer’s instruction manual,
may cause harmful interference with radio communications. Operation of this equipment in a residential area is likely
to cause harmful interference, in which case you will be required to correct the interference at your own expense.

California Best Management Practices Regulations for Perchlorate Materials: This Perchlorate warning applies only
to products containing CR (Manganese Dioxide) Lithium coin cells. “Perchlorate Material-special handling may apply.
See

www.dtsc.ca.gov/hazardouswaste/perchlorate”.

WARNING: This product can expose you to chemicals including
lead, known to the State of California to cause cancer and birth

!

defects or other reproductive harm. For more information, go
to www.P65Warnings.ca.gov

.

The products sold by Supermicro are not intended for and will not be used in life support systems, medical equipment,
nuclear facilities or systems, aircraft, aircraft devices, aircraft/emergency communication devices or other critical
systems whose failure to perform be reasonably expected to result in signifi cant injury or loss of life or catastrophic
property damage. Accordingly, Supermicro disclaims any and all liability, and should buyer use or sell such products
for use in such ultra-hazardous applications, it does so entirely at its own risk. Furthermore, buyer agrees to fully
indemnify, defend and hold Supermicro harmless for and against any and all claims, demands, actions, litigation, and
proceedings of any kind arising out of or related to such ultra-hazardous use or sale.

Manual Revision 1.2b

Release Date: September 10, 2019

Unless you request and receive written permission from Super Micro Computer, Inc., you may not copy any part of this
document. Information in this document is subject to change without notice. Other products and companies referred
to herein are trademarks or registered trademarks of their respective companies or mark holders.

Copyright © 2019 by Super Micro Computer, Inc.
All rights reserved.

Printed in the United States of America

Preface

Preface

About This Manual

This manual is written for system integrators, IT technicians, and knowledgeable end users.
It provides information for the installation and use of the X11DPH-i/T(q) motherboard.

About This Motherboard

The X11DPH-i/X11DPH-T/X11DPH-Tq motherboard supports dual Intel® Xeon Scalable-SP
and 2nd Generation Intel® Xeon Scalable-SP (Socket P) processors with the TDP (Thermal
Design Power) of up to 205W and three UltaPath Interconnect (UPI) links of up to 10.4 GT/s.
With the Intel C621/C622/C627* chipset built-in, this motherboard supports seven PCI-E

3.0 x16/x8 slots, two PCI-E 3.0 x4 M.2 slots, ten SATA3 ports, seven USB 3.0 connections,
and up to 4TB of 3DS LRDIMM/LRDIMM/3DS RDIMM/RDIMM/NV-DIMM DDR4 ECC
2933**/2666/2400/2133 MHz memory in 16 memory slots. (See Notes 1, 2 below.) It also
supports up to 5TB memory with DCPMM*** modules. (See Note 3 below.) This motherboard
is optimized for PCI-E expansion with fl exible IO support, and is ideal for high-performance,
general-purpose server platforms. Please note that this motherboard is intended to be installed
and serviced by professional technicians only. For processor/memory updates, please refer
to our website at http://www.supermicro.com/products/.

Notes:

1. Intel C621 is used for X11DPH-i, C622 for X11DPH-T, and C627 for X11DPT-Tq.

2. 2933 MHz memory is supported by the 2nd Generation Intel Xeon Scalable-SP

(82xx/62xx series) processors only.

3. DCPMM memory is supported by the 2nd Generation Intel Xeon Scalable-SP
(82xx/62xx/52xx/42xx series) processors only.

4. UPI/memory speeds are dependent on the processors installed in your system.

Manual organization

Chapter 1 describes the features, specifi cations, and performance of the motherboard. It

provides detailed information on the Intel processors and chipset.

Chapter 2 provides hardware installation instructions. Read this chapter when installing the
processor, memory modules, and other hardware components into the system.

Chapter 3 describes troubleshooting procedures for video, memory, and system setup stored
in the CMOS.

Chapter 4 includes an introduction to the BIOS, and provides detailed information on running
the CMOS setup utility.

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Super X11DPH-i/X11DPH-T/X11DPH-Tq User's Manual

Appendix A provides BIOS Error Beep codes.

Appendix B lists software installation instructions.

Appendix C lists standardized warning statements in various languages.

Appendix D contains UEFI BIOS Recovery instructions.

Appendix E provides information on how to confi gure VROC RAID settings.

Appendix F provides information on how to confi gure secure boot settings.

Appendix G provides information on how to confi gure iSCSI settings.

Appendix H provides information on how to confi gure Network Interface Card (NIC) settings.

4

Contacting Supermicro

Headquarters

Address: Super Micro Computer, Inc.

980 Rock Ave.

San Jose, CA 95131 U.S.A.

Tel: [phone]

Fax: [phone]

Email: [e-mail] (General Information)

[e-mail] (Technical Support)

Contacting Supermicro

Website:

Europe

Address: Super Micro Computer B.V.

Tel: [phone]

Fax: [phone]

Email: [e-mail] (General Information)

Website:

Asia-Pacifi c

Address: Super Micro Computer, Inc.

www.supermicro.com

Het Sterrenbeeld 28, 5215 ML

's-Hertogenbosch, The Netherlands

[e-mail] (Technical Support)

[e-mail] (Customer Support)

www.supermicro.nl

3F, No. 150, Jian 1st Rd.

Zhonghe Dist., New Taipei City 235

Taiwan (R.O.C)

Tel: [phone]

Fax: [phone]

Email: [e-mail]

Website:

www.supermicro.com.tw

5

Super X11DPH-i/X11DPH-T/X11DPH-Tq User's Manual

Table of Contents

Chapter 1 Introduction

1.1 Checklist ...............................................................................................................................8

1.2 Processor and Chipset Overview .......................................................................................18

1.3 Special Features ................................................................................................................19

1.4 System Health Monitoring ..................................................................................................19

1.5 ACPI Features ....................................................................................................................20

1.6 Power Supply .....................................................................................................................20

1.7 Advanced Power Management ..........................................................................................20

1.8 Intel® QuickAssist Technology (For the X11DPH-Tq only) ................................................21

1.9 Intel® Optane DC Persistent Memory Overview ...............................................................21

Chapter 2 Installation

2.1 Static-Sensitive Devices .....................................................................................................22

2.2 Motherboard Installation .....................................................................................................23

2.3 Processor and Heatsink Installation ...................................................................................25

2.4 Memory Support and Installation .......................................................................................33

Memory Support ................................................................................................................33

General Memory Population Requirements ......................................................................33

DDR4 Memory Support for Intel Xeon Scalable-SP Processors ......................................34

DDR4 Memory Support for 2nd Gen Intel Xeon Scalable-SP Processors .......................34

DIMM Population Guidelines for Optimal Performance ....................................................35

DIMM Population Table .....................................................................................................36

DIMM Installation ..............................................................................................................38

DIMM Module Removal .....................................................................................................38

2.5 Rear I/O Ports ....................................................................................................................39

2.6 Front Control Panel ............................................................................................................44

2.7 Connectors .........................................................................................................................49

2.8 Jumper Settings .................................................................................................................59

2.9 LED Indicators ....................................................................................................................62

Chapter 3 Troubleshooting

3.1 Troubleshooting Procedures ..............................................................................................64

3.2 Technical Support Procedures ...........................................................................................68

3.3 Frequently Asked Questions ..............................................................................................69

3.4 Battery Removal and Installation .......................................................................................70

6

Table of Contents

3.5 Returning Merchandise for Service ....................................................................................71

Chapter 4 UEFI BIOS

4.1 Introduction .........................................................................................................................72

4.2 Main Setup .........................................................................................................................73

4.3 Advanced Setup Confi gurations .........................................................................................75

4.4 Event Logs .......................................................................................................................122

4.5 IPMI ..................................................................................................................................124

4.6 Security Settings ..............................................................................................................127

4.7 Boot Settings ....................................................................................................................131

4.8 Save & Exit .......................................................................................................................134

Appendix A BIOS Codes

A.1 BIOS Error POST (Beep) Codes .....................................................................................136

A.2 Additional BIOS POST Codes ..........................................................................................137

Appendix B Software

B.1 Microsoft Windows OS Installation ...................................................................................138

B.2 Driver Installation ..............................................................................................................140

B.3 SuperDoctor

B.4 IPMI ..................................................................................................................................142

®

5 .................................................................................................................141

Appendix C Standardized Warning Statements

Appendix DUEFI BIOS Recovery

Appendix E Confi guring VROC RAID Settings

E.1 All Intel® VMD Controllers Features ................................................................................151

E.2 Confi guring RAID Settings ...............................................................................................158

E.3 Use of Journaling Drive ....................................................................................................171

Appendix F Secure Boot Settings

F.1 Boot mode select Feature ................................................................................................175

F.2 Secure Boot/ Secure Boot Mode/ CSM Support Features ..............................................176

F.3 Secure Boot Settings .......................................................................................................177

F.4 Key Management Settings ...............................................................................................180

Appendix G Confi guring iSCSI Settings

G.1 PCIe/PCI/PnP Features ....................................................................................................197

G.2 Confi guring iSCSI Settings ...............................................................................................200

Appendix H Confi guring Network Interface Card (NIC) Settings

H.1 Network Interface Card (NIC) Settings ............................................................................220

7

Super X11DPH-i/X11DPH-T/X11DPH-Tq User's Manual

Chapter 1

Introduction

Congratulations on purchasing your computer motherboard from an industry leader.
Supermicro motherboards are designed to provide you with the highest standards in quality
and performance.

In addition to the motherboard, several important parts that are included with your shipment
are listed below. If anything listed is damaged or missing, please contact your retailer.

1.1 Checklist

Main Parts List

Description Part Number Quantity

Supermicro motherboard (X11DPH-i/X11DPH-T/X11DPH-Tq) MNL-1912 1

SATA cables CBL-0044L (x2) 2

I/O Shield MCP-260-00042-ON 1

Important Links

For your system to work properly, please follow the links below to download all necessary
drivers/utilities and the user’s manual for your system.

• Supermicro product manuals: http://www.supermicro.com/support/manuals/

• Product drivers and utilities: http://www.supermicro.com/wftp

• Product safety info: http://www.supermicro.com/about/policies/safety_information.cfm

• If you have any questions, please contact our support team at: [e-mail]

his manual may be periodically updated without notice. Please check the Supermicro website

T

for possible updates to the manual revision level.

8

X11DPH-i/T(q) Motherboard Image

Chapter 1: Introduction

Note: All graphics shown in this manual were based upon the latest PCB revision
available at the time of publication of the manual. The motherboard you received may
or may not look exactly the same as the graphics shown in this manual.

9

Super X11DPH-i/X11DPH-T/X11DPH-Tq User's Manual

USB 2/3(3.0)

LE1

JUIDB1

JTPM1

JPME2

CPU1 SLOT1 PCI-E 3.0 x8

USB 6 (3.0)

BMC

LEDM1

ASPEED
AST2500

CPU2 SLOT2 PCI-E 3.0 x16

CPU1 SLOT3 PCI-E 3.0 x8

JNCSI

JSDCARD1

CPU2 SLOT5 PCI-E 3.0 x16

CPU2 SLOT4 PCI-E 3.0 x16

LAN

CTRL

CPU1 SLOT6 PCI-E 3.0 x8

FAN6

CPU1 SLOT7 PCI-E 3.0 x8

VGA

FAN5

LAN2

LAN1

IPMI_LAN
USB 0/1(3.0)

COM1

JD1

JP4

M.2-C1

M.2-C2

LE4

JWD1

T-SGPIO1

JSD1

SATA2

JL1

BIOS

I- SATA 0~3

I- SATA 4~7

USB 4/5(3.0)

JSD2

S-SATA0

S-SATA1

SATA1

FANB

LE3

JRK1

JIPMB1

FANA

Intel
PCH

JSTBY1

CPU1-HSSI GPIO

P1-DIMMD2

JHSSI

P2-DIMMA2

P2-DIMMA1

P2-DIMMB1

P2-DIMMC1

MAC CODE

BAR CODE

BIOS LICENSE

X11DPH-i

REV: 1.10

Battery

+

BT1

MH4

MH11

P1-DIMMD1

P1-DIMME1

JBT1

P1-DIMMF1

CPU2

P1-DIMMA1

P1-DIMMA2

P2-DIMMD2

P1-DIMMC1

P1-DIMMB1

P2-DIMMD1

P2-DIMME1

JPWR4

JPWR2

P2-DIMMF1

CPU1

JPWR3

JPI2C1

JF1

IPMI CODE

FAN4 FAN 3

LE2

JPWR1

FAN2

FAN1

Note: All graphics shown in this manual were based upon the latest PCB revision
available at the time of publication of the manual. The motherboard you received may
or may not look exactly the same as the graphics shown in this manual.

10

Chapter 1: Introduction

JTPM1

JPME2

USB6 (3.0)

JD1

JIPMB1

JP4

BT1

M.2-C1

M.2-C2

LE3

LE4

JWD1

JBT1

T-SGPIO1

I-SATA 0~3

I-SATA 4~7

USB4/5 (3.0)

JSD2

JSD1

S-SATA1

S-SATA0

JL1

LEDM1

SLOT1

JTPM1

JPME2

USB 6 (3.0)

JD1

JP4

M.2-C1

M.2-C2

LE4

JWD1

T-SGPIO1

USB 4/5(3.0)

JSD1

S-SATA1

SATA2

JL1

FANB

JRK1

SLOT3

JNCSI

SLOT2

BMC

LEDM1

ASPEED

AST2500

CPU2 SLOT2 PCI-E 3.0 x16

CPU1 SLOT1 PCI-E 3.0 x8

JIPMB1

LE3

BIOS

I-S ATA 0~3

JSD2

S-SATA0

FANB

JRK1

FANA

Intel
PCH

JSTBY1

I-S ATA 4~7

SATA1

JSTBY1

FANA

X11DPH-i/T(q) Motherboard Layout

(not drawn to scale)

JSDCARD1

SLOT4

JSDCARD1

CPU1 SLOT3 PCI-E 3.0 x8

CPU2 SLOT4 PCI-E 3.0 x16

JNCSI

Battery

+

BT1

JBT1

IPMI CODE

FAN4 FAN3

FAN4

FAN3

SLOT5

MH4

MH11

SLOT7

SLOT6

LAN

CTRL

CPU2 SLOT5 PCI-E 3.0 x16

CPU1 SLOT6 PCI-E 3.0 x8

CPU1-HSSI GPIO

JHSSI

P1-DIMMD2

P1-DIMMD1

P1-DIMME1

P1-DIMMF1

P1-DIMMD1

P1-DIMME1

P1-DIMMF1

FAN6

VGA

LE1

JUIDB1

LE1

JUIDB1

FAN6

CPU1 SLOT7 PCI-E 3.0 x8

P2-DIMMA2

P2-DIMMA1

P2-DIMMB1

P2-DIMMC1

MAC CODE

BIOS LICENSE

BAR CODE

P1-DIMMD2

FAN5

VGA

FAN5

X11DPH-i

REV: 1.10

LAN2

LAN2

CPU1

CPU1

USB2/3 (3.0)

LAN1

USB 2/3(3.0)

LAN1

CPU2

IPMI LAN

USB0/1 (3.0)

IPMI_LAN
USB 0/1(3.0)

P2-DIMMD2

P1-DIMMA1

P1-DIMMA2

P1-DIMMC1

P1-DIMMB1

JPI2C1

FAN2

COM1

COM1

P2-DIMMD1

JF1

LE2

FAN2

FAN1

P2-DIMME1

JPWR4

JPWR2

JPWR3

JPWR1

FAN1

P2-DIMMF1

P2-DIMMD2
P2-DIMMD1
P2-DIMME1
P2-DIMMF1

CPU2

JHSSI

P2-DIMMC1

P2-DIMMB1
P2-DIMMA1
P2-DIMMA2

JPWR4

JPWR2

P1-DIMMA2
P1-DIMMA1
P1-DIMMB1
P1-DIMMC1

JPI2C1

JPWR3

JF1

LE2

JPWR1

Notes:

• See Chapter 2 for detailed information on jumpers, I/O ports, and JF1 front panel con-

nections.

• " " indicates the location of Pin 1.

• Jumpers/LED indicators not documented in this user manual are reserved for internal

testing only.

• Use only the correct type of onboard CMOS battery as specifi ed by the manufacturer. Do

not install the onboard battery upside down to avoid possible explosion.

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Super X11DPH-i/X11DPH-T/X11DPH-Tq User's Manual

Quick Reference Table

Jumper Description Default Setting

JBT1 CMOS Clear Open (Normal)

JPME2 ME Manufacturing Mode Pins 1-2 (Normal)

JWD1 Watch Dog Timer Enable Pins 1-2 (Reset)

Connector Description

BT1 Onboard CMOS battery

COM1 COM port on the I/O back panel

FAN1-6, FANA/FANB System/cooling fan headers

IPMI_LAN Dedicated IPMI LAN port

I-SATA0~3, I-SATA4~7 SATA 3.0 Ports supported by the Intel PCH

JD1 Speaker/buzzer header (use in conjunction with an external speaker/buzzer) (optional)

JF1 Front control panel header

JHSSI High-Speed Serial Interface (HSSI) card header

JIPMB1 4-pin External I2C Header (for an IPMI card)

JL1

JNCSI Network Controller Sideband Interface (NCSI) header

JPI2C1 Power I2C System Management Bus (SMBus) header

JPWR1, JPWR2, JPWR4 8-pin power supply connectors

JPWR3 24-pin ATX main power supply connector

JRK1 Intel RAID key for NVMe SSD (Solid State Devices)

JSD1, JSD2 SATA DOM (Device-on-Module) power connectors

JSDCARD1 Micro SD card slot

JSTBY1 Standby power header

JTPM1 Trusted Platform Module (TPM)/Port 80 connector

JUIDB1 Unit Identifi er (UID) switch

LAN1, LAN2 10GbE LAN ports (for the X11DPH-T(q)) and Gigabit LAN ports (for the X11DPH-i)

M.2-C1, M.2-C2 PCI-E M.2 slots (w/VMD support) (See the notes below.)

MH4, MH11 M.2 mounting holes

(CPU1) SLOT1, SLOT3,

SLOT6, SLOT7

(CPU2) SLOT2, SLOT4,

SLOT5

S-SATA0, S-SATA1

Chassis intrusion header (For this feature to work properly, please connect an optional external

speaker to the onboard speaker header at JD1.)

PCI-Express 3.0 x8 Slots supported by CPU1 (See the notes below.)

PCI-Express 3.0 x16 Slot supported by CPU2 (See the notes below.)

Powered SATA 3.0 ports with support of Supermicro SuperDOM (Disk-On-Module)

Note 1: Intel VMD is supported by PCI-E Slot 1 - Slot 7, M.2-C1 ,and M.2-C2 slots. 2:
After you’ve enabled VMD in the BIOS on a PCI-E slot of your choice, this PCI-E slot
will be dedicated for VMD use only, and it will no longer support any PCI-E device.
To re-activate this slot for PCI-E use, please disable VMD in the BIOS. 3: To avoid
interference with other components, please be sure to use an add-on card that is fully
compliant with the PCI Standards on a PCI slot.

12

Chapter 1: Introduction

Connector Description

T-SGPIO1 Serial_Link General Purpose I/O (GPI/O) port

USB0/1, USB2/3 Back Panel Universal Serial Bus (USB) 3.0 ports

USB4/5 Internal USB 3.0 header with two USB (USB4/5) connections supported for front access

USB6 Type A USB 3.0 header for front access

VGA VGA port

LED Description Status

LE1 Unit Identifi er (UID) LED Solid Blue: Unit Identifi ed

LE2 Onboard power LED Solid Green: Power On

LEDM1 BMC Heartbeat LED Blinking Green: BMC normal

13

Super X11DPH-i/X11DPH-T/X11DPH-Tq User's Manual

Motherboard Features

Motherboard Features

CPU

• Dual Intel Xeon Scalable-SP or 2nd Generation Intel Xeon Scalable-SP (Socket P) processors with support of three

UltraPath Interconnect (UPI) links of up to 10.4 GT/s. (Note: QAT is supported by X11DPH-Tq only.)

Note: Both processors need to be installed for full access to the PCI-E slots, DIMM slots, and onboard controllers.

Refer to the block diagram to determine which slots or devices may be affected.

Memory

• Integrated memory controller supports up to 4TB of 3DS Load Reduced DIMM (3DS LRDIMM), Load Reduced DIMM

(LRDIMM), 3DS Registered DIMM (3DS RDIMM), Registered DIMM (RDIMM), Non-Volatile DIMM (NV-DIMM) DDR4

(288-pin) ECC memory with speeds of 2933*/2666/2400/2133 in 16 slots

Notes: 1. Up to 5TB of memory is supported with DCPMM modules installed. 2. 2933 MHz memory is supported

by 2nd Gen Intel Xeon Scalable-SP (82xx/62xx series) processors only.

DIMM Size

• Up to 256GB at 1.2V

Note 1: Memory speed support depends on the processors used in the system.

Note 2: For the latest CPU/memory updates, please refer to our website at http://www.supermicro.com/products/

motherboard.

Chipset

• Intel C621/C622/C627 Chipset (C621: is for X11DPH-i, C622 for X11DPH-T, and C627: X11DPT-Tq.)

Expansion Slots

• Four (4) PCI-Express 3.0 X8 slots supported by CPU1 (SLOT1, SLOT3, SLOT6, SLOT7 3; No Slot1 for X11DPH-Tq)

• Three (3) PCI-Express 3.0 X16 slots supported by CPU2 (SLOT2, SLOT4, SLOT5)

Baseboard Management Controller (BMC)

• ASPEED AST2500 BMC with IPMI 2.0 support

Graphics

• Graphics controller via ASPEED AST2500 BMC

Network Connection

• Intel C627 supports two 10 Gigabit LAN ports on the X11DPH-Tq

• Intel C622 supports two 10 Gigabit LAN ports on the X11DPH-T

• Intel C621 supports two Gigabit LAN ports (X11DPH-i)

• One (1) Dedicated IPMI LAN located on the rear I/O panel

I/O Devices

• Serial (COM) Port • One (1) serial port on the rear I/O panel

• SATA 3.0

• Eight (8) SATA 3.0 ports (I-SATA0~3, I-SATA4~7)

• Two (2) SATA 3.0 ports with SATA DOM power (S-SATA0, S-SATA1)

• RAID (PCH) • RAID 0, 1, 10

Note: Please refer to the Memory Confi guration User Guide for the X11 UP/DP/MP
Motherboards posted on our website for detailed information on memory support.

14

Chapter 1: Introduction

Motherboard Features

Peripheral Devices

• Four (4) USB 3.0 ports on the I/O back panel (USB 0/1, USB2/3)

• One (1) USB 3.0 header with two (2) USB connections for front access (USB4/5)

• One (1) USB 3.0 Type A header (USB6)

BIOS

• 64MB SPI AMI BIOS® SM Flash UEFI BIOS

• ACPI 3.0 or later, USB keyboard, Plug-and-Play (PnP), SPI dual/quad speed support, and SMBIOS 2.7 or later

Power Management

• ACPI power management

• SuperDoctor® 5

• Power button override mechanism

• Power-on mode for AC power recovery

• Intel® Intelligent Power Node Manager 4.0 (available when the Supermicro Power Manager [SPM] is installed and a

special power supply is used

• Management Engine (ME)

System Health Monitoring

• Onboard voltage monitoring for +5V, +/-12V, +3.3V Standby, +5V Standby, HT, memory, PCH temperature, system

temperature, and memory temperature

• 6+1 CPU switch phase voltage regulator for CPU1

• 5+1 CPU switch phase voltage regulator for CPU2

• CPU thermal trip support

• Status monitor for on/off control

• CPU Thermal Design Power (TDP) support of up to 165W

Fan Control

• Fan status monitoring via IPMI

• Eight 4-pin fan headers

• Dual cooling zone

• Multi-speed fan control via onboard BMC

System Management

• Trusted Platform Module (TPM) support

• PECI (Platform Environment Control Interface) 2.0 support

• System resource alert via SuperDoctor® 5

• SuperDoctor® 5, Watch Dog, NMI, RoHS

• Power supply monitoring

• Chassis intrusion header and detection (when an optional external speaker is connected to the onboard speaker header

at JD1)

15

Super X11DPH-i/X11DPH-T/X11DPH-Tq User's Manual

Motherboard Features

LED Indicators

• CPU/Overheating

• Power/Suspend-state indicator

• Fan failure

• UID/remote UID.

• HDD activity

• LAN activity.

Dimensions

•

13" (W) x 12" (L) (330.2 mm x 304.8 mm)

Note 1: The CPU maximum thermal design power (TDP) is subject to chassis and
heatsink cooling restrictions. For proper thermal management, please check the chas­sis and heatsink specifi cations for proper CPU TDP sizing.

Note 2: For IPMI confi guration instructions, please refer to the Embedded IPMI Con-
fi guration User's Guide available at http://www.supermicro.com/support/manuals/.

Note 3: It is strongly recommended that you change BMC log-in information upon initial
system power-on. The manufacturer default username is ADMIN and the password
is ADMIN. For proper BMC confi guration, please refer to http://www.supermicro.com/
products/info/fi les/IPMI/Best_Practices_BMC_Security.pdf

16

System Block Diagram

Chapter 1: Introduction

RJ45

DDR4

BMC Boot Flash

BIOS

(OPTION)

* TBD

LAN3

RTL8211E-VB-CG

SPI

SPI

VGA CONN

Temp Sensor

EMC1402-1 *2 at diff SMBUS

SLOT 7
(HSSI)

SLOT 6
(HSSI)

10G
1G

10G
1G

#B-0

#A-1

#A-0

DDR4

2133/2666/2933*

PCI-E x8

PCI-E x8

HSSI
GPIO

LAN

Intel X557-AT2
Marvell 88E1512

RGRMII

BMC

AST2500

#F-0

#E-0

#D-1

#D-0

#C-0

PCI-E X8/X8 G3 (Reversal)

M.2

M.2

SLOT 3

PCI-E x8 G3 (Reversal)

PCI-E x8

SLOT 1

PCI-E x8

PCI-E x1

(QAT AOC)

RMII/NCSI

Micro
SDCard

PCI-E x1 G2

USB 2.0

COM1

Connector

#3

PCI-E x4/x4 G3

PCI-E x8 G3(Opt)

4x10G(Opt)

ESPI

ESPI
Header

VCCP0 12v

VR13
6+1 PHASE
up to 255W

VCCP0

SNB CORE
DDR4

#2C #1B/A

#2A/B

KR/KX/SFI

#5

#12 USB2.0

TPM HEADER

Debug Card

FRONT PANEL

X11DPH

10.4/11.2G

P0

P1

PECI: 30

SOCKET ID: 0

DMI3

PCI-E x8 G3 (Opt x16)

DMI3

PCH

(QAT: Optional x16)

VCCP1 12v

VR13

P1

P0

P2P2

#1

5+1 PHASE

VCCP1

SNB CORE
DDR4

SOCKET ID: 1

#2

#3

PCI-E x16 G3 (Reversal)

PCI-E x16 G3

#3

#2

#1

#0

6.0 Gb/S

USB 2.0

USB 3.0

PECI: 31

DMI2

PCI-E x16 G3 (Reversal)

#6

#5

#4

SATA

USB

USB

UPI

UPI

UPI

UPI

*Note: 2933 memory is supported
by 2nd Gen Intel Xeon Scalable-SP

SPI

(82xx/62xx series) processors only.

BIOS

SYSTEM POWER

FAN SPEED

CTRL

PCI-E x16

SLOT 2

#9

#8

#7

6 CH6 CH

iPass 4x2
SuperDOM x2

Rear x4
Header x2
Type A x1

#H-0

#G-1

#G-0

DDR4

2133/2666/2933*

PCI-E x16

SLOT 4

PCI-E x16

SLOT 5

#J-0

#K-0

#K-1

#L-0

#M-0

Note: This is a general block diagram and may not exactly represent the features on
your motherboard. See the previous pages for the actual specifi cations of your moth-
erboard.

17

Super X11DPH-i/X11DPH-T/X11DPH-Tq User's Manual

1.2 Processor and Chipset Overview

Built upon the functionality and capability of Intel Xeon Scalable-SP and 2nd Generation
Intel Xeon Scalable-SP processors (Socket P) with support of the Intel C621/C622/C627
chipset (Note 1), the X11DPH-i/X11DPH-T/X11DPH-Tq motherboard provides superb system
performance, effi cient power management, and a rich feature set based on cutting-edge
technologies to address the needs of next-generation computer users. It offers innovative
solutions with unprecedented system reliability and scalability to meet the demands of High
Performance Computing (HPC) platforms.

Features Supported by Intel Xeon Scalable-SP Processors

Intel Xeon Scalable-SP processors support the following features:

• Intel AVX-512 instruction support to handle complex workloads

• 1.5x memory bandwidth increased to 6 channels

• Hot plug and enclosure management with Intel Volume Management Device (Intel VMD)

• Rich set of available IOs with increased PCI-E lanes (48 lanes)

• Integrated Intel Ethernet Connection X722 with iWARP RDMA

New features supported by 2nd Generation Intel Xeon Scalable-SP Processors

2nd Generation Intel Xeon Scalable-SP processors support the following features:

• Higher performance for a wider range of workloads with per-core performance in-

crease

• Support of Optane DC Persistent Memory (DCPMM) with affordable, persistent, and

large capacity

• Up to 2993 MHz memory supported (Refer to Section 1.9 for details.)

• Vector Neural Network Instruction (VNNI) support for Accelerate Deep Learning & Arti-

fi cial Intelligence (AI) workloads

• Speed Select Technology provides multiple CPU profi les that can be set in the BIOS.

(This feature is available on select CPU SKUs).

• Seamless hardware security mitigations & performance/frequency fl exibility

Notes: 1. Intel C621 is used for X11DPH-i, C622 for X11DPH-T, and C627 for
X11DPT-Tq. 2. DCPMM memory is supported by 2nd Gen Intel Xeon Scalable-SP
(82xx/62xx/52xx/42xx series) processors. 3. 2933 MHz memory is supported by 2nd
Gen Intel Xeon Scalable-SP (82xx/62xx series) processors only.

18

Chapter 1: Introduction

1.3 Special Features

This section describes the health monitoring features of the motherboard. The motherboard
has an onboard ASPEED AST 2500 Baseboard Management Controller (BMC) that supports
system health monitoring.

Recovery from AC Power Loss

The Basic I/O System (BIOS) provides a setting that determines how the system will respond
when AC power is lost and then restored to the system. You can choose for the system to
remain powered off (-in which case you must press the power switch to turn it back on), or
for it to automatically return to the power-on state. See the Advanced BIOS Setup section
for this setting. The default setting is Last State.

1.4 System Health Monitoring

This section describes the health monitoring features of the X11DPH-i/T(q) motherboard. The
motherboard has an onboard Baseboard Management Controller (BMC) chip that supports
system health monitoring.

Onboard Voltage Monitors

The onboard voltage monitor will continuously scan crucial voltage levels. Once a voltage
becomes unstable, it will give a warning or send an error message to the IPMI WebGUI and
IPMIView. Real time readings of these voltage levels are all displayed in the BIOS.

Fan Status Monitor with Firmware Control

The system health monitor embedded in the BMC chip can check the RPM status of the
cooling fans. The CPU and chassis fans are controlled via lPMI.

Environmental Temperature Control

System Health sensors in the BMC monitor the temperatures and voltage settings of onboard
processors and the system in real time via the IPMI interface. Whenever the temperature of
the CPU or the system exceeds a manufacturer-defi ned threshold, system/CPU cooling fans
will be turned on to prevent the CPU or the system from overheating.

Note: To avoid possible system overheating, please be sure to provide adequate air­fl ow to your system.

19

Super X11DPH-i/X11DPH-T/X11DPH-Tq User's Manual

System Resource Alert

This feature is available when used with Supermicro® SuperDoctor 5. SuperDoctor 5 is used
to notify the user of certain system events. For example, you can confi gure SuperDoctor 5 to
provide you with warnings when the system temperature, CPU temperatures, voltages and
fan speeds go beyond a predefi ned range.

1.5 ACPI Features

ACPI stands for Advanced Confi guration and Power Interface. The ACPI specifi cation defi nes
a fl exible and abstract hardware interface that provides a standard way to integrate power
management features throughout a computer system including its hardware, operating system
and application software. This enables the system to automatically turn on and off peripherals
such as network cards, hard disk drives and printers.

In addition to enabling operating system-directed power management, ACPI also provides a
generic system event mechanism for Plug and Play, and an operating system-independent
interface for confi guration control. ACPI leverages the Plug and Play BIOS data structures
while providing a processor architecture-independent implementation that is compatible with
appropriate Windows operating systems. For detailed information on OS support, please refer
to our website at www.supermicro.com.

1.6 Power Supply

As with all computer products, a stable power source is necessary for proper and reliable
operation. It is even more important for processors that have high CPU clock rates. It is
recommended that you also install a power surge protector to help avoid problems caused
by power surges.

1.7 Advanced Power Management

The following new advanced power management features are supported by the motherboard.

Intel® Intelligent Power Node Manager (IPNM)

Intel's Intelligent Power Node Manager (IPNM) provides your system with real-time thermal
control and power management for maximum energy effi ciency. IPNM is available when the
Supermicro Power Manager (SPM) is installed. Although IPNM Specifi cation Version 2.0 or

3.0 is supported by the BMC (Baseboard Management Controller), your system must also
have the IPNM-compatible Management Engine (ME) fi rmware installed to use this feature.

Note: Support for IPNM 2.0/3.0 is dependent on the power supply used in the system.

20

Chapter 1: Introduction

Management Engine (ME)

The Management Engine, which is an ARC controller embedded in the IOH (I/O Hub), provides
Server Platform Services (SPS) to your system. The services provided by SPS are different
from those provided by the ME on client platforms.

1.8 Intel® QuickAssist Technology (For the X11DPH-Tq
only)

This X11DPH-T(q) supports Intel QuickAssist Technolog (QAT) that offers a software-based
platform for data compression, security, and authentication. These features greatly enhance
system performance and effi ciency across applications and platforms. The improvements
include data symmetric/asymmetric encryption, authentication, public key functions, data
compression and decompression. With Intel QAT technology support, this motherboard is
optimized for the following applications:

For High Computing Platform (HCP):

• This motherboard offers secure browsing, email searching, data transferring, and multi-

tenancy.

For Networking:

• This motherboard offers secure routing, fi rewalls, web proxy, WAN optimization, authenti-

cation, and 3G/4G wireless.

For Big Data:

• This motherboard supports Affi nity Analytic (HADOOP).

For Storage:

• This motherboard provides real-time data compression and secure storage.

1.9 Intel® Optane DC Persistent Memory Overview

2nd Generation Intel Xeon Scalable-SP (82xx/62xx/52xx/42xx series) processors support
new DCPMM (Optane™ DC Persistent Memory Modules) technology that offers data
persistence with higher capacity than existing memory modules and lower latency than
NVMe SSDs. DCPMM memory provides hyper-speed storage capability for high performance
computing platforms with fl exible confi guration options.

21

Super X11DPH-i/X11DPH-T/X11DPH-Tq User's Manual

Chapter 2

Installation

2.1 Static-Sensitive Devices

Electrostatic Discharge (ESD) can damage electronic com ponents. To avoid damaging
your motherboard and your system, it is important to handle it very carefully. The following
measures are generally suffi cient to protect your equipment from ESD.

Precautions

• Use a grounded wrist strap designed to prevent static discharge.

• Touch a grounded metal object before removing the motherboard from the antistatic bag.

• Handle the motherboard by its edges only; do not touch its components, peripheral chips,

memory modules or gold contacts.

• When handling chips or modules, avoid touching their pins.

• Put the motherboard and peripherals back into their antistatic bags when not in use.

• For grounding purposes, make sure that your chassis provides excellent conductivity be-

tween the power supply, the case, the mounting fasteners, and the motherboard.

• Use only the correct type of CMOS onboard battery as specifi ed by the manufacturer. Do

not install the CMOS battery upside down, which may result in a possible explosion.

Unpacking

The motherboard is shipped in antistatic packaging to avoid static damage. When unpacking
the motherboard, make sure that the person handling it is static protected.

22

Chapter 2: Installation

2.2 Motherboard Installation

All motherboards have standard mounting holes to fi t different types of chassis. Make sure
that the locations of all the mounting holes for both the motherboard and the chassis match.
Although a chassis may have both plastic and metal mounting fasteners, metal ones are
highly recommended because they ground the motherboard to the chassis. Make sure that
the metal standoffs click in or are screwed in tightly.

Tools Needed

JTPM1

JPME2

CPU1 SLOT1 PCI-E 3.0 x8

USB 6 (3.0)

JD1

JP4

M.2-C1

M.2-C2

LE4

JWD1

T-SGPIO1

BIOS

I-S ATA 0~3

BMC

LEDM1

ASPEED
AST2500

CPU2 SLOT2 PCI-E 3.0 x16

JNCSI

JIPMB1

+

LE3

JSDCARD1

CPU1 SLOT3 PCI-E 3.0 x8

CPU2 SLOT4 PCI-E 3.0 x16

Battery

BT1

MH4

MH11

JBT1

LAN

CTRL

CPU2 SLOT5 PCI-E 3.0 x16

CPU1 SLOT6 PCI-E 3.0 x8

CPU1-HSSI GPIO

JHSSI

P1-DIMMD2

P1-DIMMD1

P1-DIMME1

P1-DIMMF1

Screws (9)

LE1

JUIDB1

VGA

FAN6

CPU1 SLOT7 PCI-E 3.0 x8

P2-DIMMA2

P2-DIMMA1

P2-DIMMB1

P2-DIMMC1

X11DPH-i

MAC CODE

BAR CODE

REV: 1.10

BIOS LICENSE

Standoffs (9) as Needed

USB 2/3(3.0)

FAN5

LAN1

LAN2

CPU2

IPMI_LAN
USB 0/1(3.0)

P1-DIMMA1

P1-DIMMA2

P1-DIMMC1

P1-DIMMB1

P2-DIMMD2

COM1

P2-DIMMD1

P2-DIMME1

JPWR4

JPWR2

P2-DIMMF1

I-S ATA 4~7

Intel

PCH

CPU1

JSD1

SATA2

JL1

USB 4/5(3.0)

JSD2

S-SATA0

S-SATA1

SATA1

FANB

JRK1

FANA

IPMI CODE

JSTBY1

FAN4 FAN3

JPI2C1

LE2

FAN2

JPWR3

JF1

JPWR1

FAN1

Location of Mounting Holes

Notes: 1. To avoid damaging the motherboard and its components, please do not use

a force greater than 8 lb/inch on each mounting screw during motherboard installation.

2. Some components are very close to the mounting holes. Please take precautionary
measures to avoid damaging these components when installing the motherboard to
the chassis.

23

Super X11DPH-i/X11DPH-T/X11DPH-Tq User's Manual

Installing the Motherboard

1. Install the I/O shield into the back of the chassis if needed.

2. Locate the mounting holes on the motherboard. See the previous page for the location.

3. Locate the matching mounting holes on the chassis. Align the mounting holes on the
motherboard against the mounting holes on the chassis.

4. Install standoffs in the chassis as needed.

5. Install the motherboard into the chassis carefully to avoid damaging other motherboard
components.

6. Using the Phillips screwdriver, insert a Pan head #6 screw into a mounting hole on the
motherboard and its matching mounting hole on the chassis.

7. Repeat Step 5 to insert Pan head #6 screws into all mounting holes.

8. Make sure that the motherboard is securely placed in the chassis.

Note: Images displayed in this manual are for illustration only. Your chassis or
components might look different from those shown in this manual.

24

Chapter 2: Installation

2.3 Processor and Heatsink Installation

Warning: When handling the processor package, avoid placing direct pressure on the label

area of the CPU or CPU socket. Also, improper CPU installation or socket misalignment can
cause serious damage to the CPU or motherboard which may result in RMA repairs. Please
read and follow all instructions thoroughly before installing your CPU and heatsink.

Notes:

• Always connect the power cord last, and always remove it before adding, removing, or

changing any hardware components. Please note that the processor and heatsink should
be assembled together fi rst to form the Processor Heatsink Module (PHM), and then install
the entire PHM into the CPU socket.

• When you receive a motherboard without a processor pre-installed, make sure that the

plastic CPU socket cap is in place and that none of the socket pins are bent; otherwise,
contact your retailer immediately.

• Refer to our website at www.Supermicro.com for CPU support updates.

• Please follow the instructions given in the ESD Warning section on the fi rst page of this

chapter before handling, installing, or removing system components.

Intel Xeon Scalable-SP and 2nd Gen Intel Xeon Scalable-SP
Processors

Note: All graphics, drawings, and pictures shown in this manual are for illustration only.

The components that came with your system may or may not look exactly the same
as those shown in this manual.

25

Super X11DPH-i/X11DPH-T/X11DPH-Tq User's Manual

Overview of the Processor Socket Assembly

The processor socket assembly contains 1) the Intel Xeon Scalable-SP or
2nd Generation Intel Xeon Scalable-SP processor, 2) the narrow processor clip, 3) the dust
cover, and 4) the CPU socket.

1. Intel Processor

2. Narrow processor clip (the plastic processor package carrier used for the CPU)

3. Dust Cover

4. CPU Socket

Note: Be sure to cover the CPU socket with the dust cover when the CPU is not in-

stalled.

26

Chapter 2: Installation

Overview of the Processor Heatsink Module (PHM)

The Processor Heatsink Module (PHM) contains 1) a heatsink, 2) a narrow processor clip,
and 3) Intel Xeon Scalable-SP or 2nd Generation Intel Xeon Scalable-SP processor.

1. Heatsink

2. Narrow processor clip

3. Intel Processor

Processor Heatsink Module (PHM)

(Bottom View)

27

Super X11DPH-i/X11DPH-T/X11DPH-Tq User's Manual

Attaching the Processor to the Narrow Processor Clip to Create
the Processor Package Assembly

To properly install the CPU into the narrow processor clip, please follow the steps below.

1. Locate pin 1 (notch A), which is the triangle located on the top of the narrow processor
clip. Also locate notch B and notch C on the processor clip.

2. Locate pin 1 (notch A), which is the triangle on the substrate of the CPU. Also, locate
notch B and notch C on the CPU as shown below.

3. Align pin 1 (the triangle on the substrate) of the CPU with pin 1 (the triangle) of
the narrow processor clip. Once they are aligned, carefully insert the CPU into the
processor clip by sliding notch B of the CPU into notch B of the processor clip, and

sliding notch C of the CPU into notch C of the processor clip.

4. Examine all corners of the CPU to ensure that it is properly seated on the processor
clip. Once the CPU is securely attached to the processor clip, the processor package
assembly is created.

Note: Please exercise extreme caution when handling the CPU. Do not touch the
CPU LGA-lands to avoid damaging the LGA-lands or the CPU. Be sure to wear ESD
gloves when handling components.

CPU (Upside Down)
w/CPU LGA Lands up

Align Notch B of the CPU
and Notch B of the Processor Clip

Align CPU Pin 1

C

Align Notch C of the CPU
and Notch C of the Processor Clip

B

Allow Notch C to
latch on to CPU

A

Pin 1

C

C

B

CPU/Heatsink Package
(Upside Down)

A

Allow Notch B to
latch on to CPU

B

A

Processor Package Carrier (w/CPU mounted

on the Processor Clip)

28

Chapter 2: Installation

Attaching the Processor Package Assembly to the Heatsink to
Form the Processor Heatsink Module (PHM)

After you have made a processor package assembly by following the instructions on the
previous page, please follow the steps below to mount the processor package assembly onto
the heatsink to create the Processor Heatsink Module (PHM).

1. Locate "1" on the heatsink label and the triangular corner next to it on the heatsink.
With your index fi nger pressing against the screw at this triangular corner, carefully hold
and turn the heatsink upside down with the thermal-grease side facing up. Remove the
protective thermal fi lm if present, and apply the proper amount of the thermal grease
as needed. (Skip this step if you have a new heatsink because the necessary thermal
grease is pre-applied in the factory.)

2. Holding the processor package assembly at the center edge, turn it upside down. With
the thermal-grease side facing up, locate the hollow triangle located at the corner of the
processor carrier assembly ("a" in the graphic). Note a larger hole and plastic mounting
clicks located next to the hollow triangle. Also locate another set of mounting clicks and
a larger hole at the diagonal corner
of the same (reverse) side of the
processor carrier assembly ("b" in
the graphic).

3. With the back of heatsink and
the reverse side of the processor
package assembly facing up, align
the triangular corner on the heatsink
("A" in the graphic) against the
mounting clips next to the hollow
triangle ("a") on the processor
package assembly.

4. Also align the triangular corner ("B")
at the diagonal side of the heatsink
with the corresponding clips on the
processor package assembly ("b").

Triangle on the CPU

Triangle on the
Processor Clip

Non-Fabric CPU and Processor Clip

(Upside Down)

b

d

B

a

D

Heatsink

(Upside Down)

A

On Locations of (C, D), the notches

snap onto the heat sink’s

B

c

C

mounting holes

5. Once the mounting clips on the
processor package assembly
are properly aligned with the
corresponding holes on the back
of heatsink, securely attach the
heatsink to the processor package
assembly by snapping the mounting
clips at the proper places on the
heatsink to create the processor
heatsink module (PHM).

29

D

A

On Locations (A, B), the notches
snap onto the heatsink’s sides

C

Make sure Mounting

Notches snap into place

Super X11DPH-i/X11DPH-T/X11DPH-Tq User's Manual

Preparing the CPU Socket for Installation

This motherboard comes with the CPU socket pre-assembled in the factory. The CPU socket
contains 1) a dust cover, 2) a socket bracket, 3) the CPU (P0) socket, and 4) a back plate.
These components are pre-installed on the motherboard before shipping.

CPU Socket w/Dust Cover On

Removing the Dust Cover from the CPU Socket

Remove the dust cover from the CPU socket, exposing the CPU socket and socket pins as
shown on the illustration below.

Note: Do not touch the socket pins to avoid damaging them, causing the CPU to
malfunction.

Dusk Cover

Remove the dust cover from

the CPU socket. Do not

touch the socket pins!

Socket Pins

CPU Socket

30