Supermicro X11DPG-QT operation manual

X11DPG-QT

USER’S MANUAL

Revision 1.0

The information in this user’s manual has been carefully reviewed and is believed to be accurate. The vendor assumes
no responsibility for any inaccuracies that may be contained in this document, and makes no commitment to update
or to keep current the information in this manual, or to notify any person or organization of the updates. Please Note:

For the most up-to-date version of this manual, please see our website at www.supermicro.com.

Super Micro Computer, Inc. ("Supermicro") reserves the right to make changes to the product described in this manual
at any time and without notice. This product, including software and documentation, is the property of Supermicro and/
or its licensors, and is supplied only under a license. Any use or reproduction of this product is not allowed, except
as expressly permitted by the terms of said license.

IN NO EVENT WILL Super Micro Computer, Inc. BE LIABLE FOR DIRECT, INDIRECT, SPECIAL, INCIDENTAL,
SPECULATIVE OR CONSEQUENTIAL DAMAGES ARISING FROM THE USE OR INABILITY TO USE THIS PRODUCT
OR DOCUMENTATION, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. IN PARTICULAR, SUPER
MICRO COMPUTER, INC. SHALL NOT HAVE LIABILITY FOR ANY HARDWARE, SOFTWARE, OR DATA STORED
OR USED WITH THE PRODUCT, INCLUDING THE COSTS OF REPAIRING, REPLACING, INTEGRATING,
INSTALLING OR RECOVERING SUCH HARDWARE, SOFTWARE, OR DATA.

Any disputes arising between manufacturer and customer shall be governed by the laws of Santa Clara County in the
State of California, USA. The State of California, County of Santa Clara shall be the exclusive venue for the resolution
of any such disputes. Supermicro's total liability for all claims will not exceed the price paid for the hardware product.

FCC Statement: This equipment has been tested and found to comply with the limits for a Class A digital device
pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful
interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can
radiate radio frequency energy and, if not installed and used in accordance with the manufacturer’s instruction manual,
may cause harmful interference with radio communications. Operation of this equipment in a residential area is likely
to cause harmful interference, in which case you will be required to correct the interference at your own expense.

California Best Management Practices Regulations for Perchlorate Materials: This Perchlorate warning applies only
to products containing CR (Manganese Dioxide) Lithium coin cells. “Perchlorate Material-special handling may apply.
See www.dtsc.ca.gov/hazardouswaste/perchlorate”.

WARNING: Handling of lead solder materials used in this product may expose you to lead, a
chemical known to the State of California to cause birth defects and other reproductive harm.

The products sold by Supermicro are not intended for and will not be used in life support systems, medical equipment,
nuclear facilities or systems, aircraft, aircraft devices, aircraft/emergency communication devices or other critical

systems whose failure to perform be reasonably expected to result in signicant injury or loss of life or catastrophic

property damage. Accordingly, Supermicro disclaims any and all liability, and should buyer use or sell such products
for use in such ultra-hazardous applications, it does so entirely at its own risk. Furthermore, buyer agrees to fully
indemnify, defend and hold Supermicro harmless for and against any and all claims, demands, actions, litigation, and
proceedings of any kind arising out of or related to such ultra-hazardous use or sale.

Manual Revision 1.0

Release Date: August 25, 2017

Unless you request and receive written permission from Super Micro Computer, Inc., you may not copy any part of this

document. Information in this document is subject to change without notice. Other products and companies referred

to herein are trademarks or registered trademarks of their respective companies or mark holders.

Copyright © 2017 by Super Micro Computer, Inc.
All rights reserved.

Printed in the United States of America

Preface

Preface

About This Manual

This manual is written for system integrators, IT technicians, and knowledgeable end users.
It provides information for the installation and use of the X11DPG-QT motherboard.

About This Motherboard

The Super X11DPG-QT motherboard supports dual Intel® Xeon® 81xx/61xx/51xx/41xx/31xx
series processors (Socket P). With the Intel® C621 chipset built-in, this motherboard supports
3DS LRDIMM/RDIMM/LRDIMM/NV-DIMM DDR4 ECC memory of up to 2666 MT/s in 16 slots.
The X11DPG-QT provides maximum performance, system cooling, and PCI-E capacity. Also,
this motherboard is optimized for high-performance cloud-computing or high-end graphics
server and workstation platforms. Please note that this motherboard is intended to be installed
and serviced by professional technicians only. For processor/memory updates, please refer
to our website at http://www.supermicro.com/products/.

Manual organization

Chapter 1 describes the features, specications and performance of the motherboard, and

provides detailed information on the Intel® C621 chipset.

Chapter 2 provides hardware installation instructions. Read this chapter when installing the
processor, memory modules, and other hardware components into the system.

If you encounter any problems, see Chapter 3, which describes troubleshooting procedures
for video, memory, and system setup stored in the CMOS.

Chapter 4 includes an introduction to the BIOS, and provides detailed information on running
the CMOS Setup utility.

Appendix A provides BIOS Error Beep Codes.

Appendix B lists software program installation instructions.

Appendix C contains UEFI BIOS Recovery instructions.

Appendix D lists standardized warning statements in various languages.

3

Super X11DPG-QT User's Manual

Contacting Supermicro

Headquarters

Address: Super Micro Computer, Inc.

980 Rock Ave.

San Jose, CA 95131 U.S.A.

Tel: [phone]

Fax: [phone]

Email: [e-mail] (General Information)

[e-mail] (Technical Support)

Website: www.supermicro.com

Europe

Address: Super Micro Computer B.V.

Het Sterrenbeeld 28, 5215 ML

's-Hertogenbosch, The Netherlands

Tel: [phone]

Fax: [phone]

Email: [e-mail] (General Information)

[e-mail] (Technical Support)

[e-mail] (Customer Support)

Website: www.supermicro.nl

Asia-Pacic

Address: Super Micro Computer, Inc.

3F, No. 150, Jian 1st Rd.

Zhonghe Dist., New Taipei City 235

Taiwan (R.O.C)

Tel: [phone]

Fax: [phone]

Email: [e-mail]

Website: www.supermicro.com.tw

4

Preface

Table of Contents

Chapter 1 Introduction

1.1 Processor and Chipset Overview .......................................................................................18

1.2 Special Features ................................................................................................................18

Recovery from AC Power Loss .........................................................................................18

1.3 System Health Monitoring ..................................................................................................19

Onboard Voltage Monitors ................................................................................................19

Fan Status Monitor with Firmware Control .......................................................................19

Environmental Temperature Control .................................................................................19

System Resource Alert......................................................................................................19

1.4 ACPI Features ....................................................................................................................19

1.5 Power Supply .....................................................................................................................20

1.6 Super I/O ............................................................................................................................20

1.7 Advanced Power Management ..........................................................................................20

Intel® Intelligent Power Node Manager (IPNM).................................................................20

Management Engine (ME) ................................................................................................21

Chapter 2 Installation

2.1 Static-Sensitive Devices .....................................................................................................22

Precautions .......................................................................................................................22

Unpacking .........................................................................................................................22

2.2 Motherboard Installation .....................................................................................................23

Tools Needed ....................................................................................................................23

Location of Mounting Holes ..............................................................................................23

Installing the Motherboard.................................................................................................24

2.3 Processor and Heatsink Installation ...................................................................................25

The Intel 81xx/61xx/51xx/41xx/31xx Series Processors ...................................................25

Overview of the Processor Socket Assembly ...................................................................26

Overview of the Processor Heatsink Module (PHM) ........................................................27

Attaching the Non-F Model Processor to the Narrow Processor Clip to Create the

Processor Package Assembly ...........................................................................................28

Attaching the F Model Processor to the Narrow Processor Clip to Create the Processor

Package Assembly ............................................................................................................29

Attaching the Non-F Model Processor Package Assembly to the Heatsink to Form the

5

Super X11DPG-QT User's Manual

Processor Heatsink Module (PHM) ...................................................................................30

Attaching the F Model Processor Package Assembly to the Heatsink to Form the

Processor Heatsink Module (PHM) ...................................................................................31

Preparing the CPU Socket for Installation ........................................................................32

Removing the Dust Cover from the CPU Socket .............................................................32

Installing the Processor Heatsink Module (PHM) ............................................................33

Installing an HFI Carrier Card for Host Fabric Interface (HFI) Support as Needed

(Available when the F Model CPU is Used) .....................................................................34

Removing the Processor Heatsink Module (PHM) from the Motherboard .......................35

2.4 Memory Support and Installation .......................................................................................36

Memory Support ................................................................................................................36

DIMM Module Population Conguration ...........................................................................36

DIMM Population Requirements for the 81xx/61xx/51xx/41xx/31xx Series Processors ..37

DIMM Installation ..............................................................................................................40

DIMM Removal .................................................................................................................40

2.5 Rear I/O Ports ....................................................................................................................41

2.6 Front Control Panel ............................................................................................................45

2.7 Connectors .........................................................................................................................49

Power Connections ...........................................................................................................49

Headers .............................................................................................................................50

2.8 Jumper Settings .................................................................................................................61

How Jumpers Work ...........................................................................................................61

2.9 LED Indicators ....................................................................................................................66

Chapter 3 Troubleshooting

3.1 Troubleshooting Procedures ..............................................................................................68

3.2 Technical Support Procedures ...........................................................................................72

3.3 Frequently Asked Questions ..............................................................................................73

3.4 Battery Removal and Installation .......................................................................................74

3.5 Returning Merchandise for Service ....................................................................................75

Chapter 4 BIOS

4.1 Introduction .........................................................................................................................76

Starting the Setup Utility ...................................................................................................76

4.2 Main Setup .........................................................................................................................77

6

Preface

4.3 Advanced Setup Congurations .........................................................................................79

4.4 Event Logs .......................................................................................................................114

4.5 IPMI ..................................................................................................................................116

4.6 Security .............................................................................................................................119

4.7 Boot ..................................................................................................................................122

4.8 Save & Exit .......................................................................................................................125

Appendix A BIOS Codes

Appendix B Software Installation

B.1 Installing Software Programs ...........................................................................................129

B.2 SuperDoctor® 5 .................................................................................................................130

Appendix C UEFI BIOS Recovery

Appendix D Standardized Warning Statements

Battery Handling ..............................................................................................................136

Product Disposal .............................................................................................................138

7

Super X11DPG-QT User's Manual

Chapter 1

Introduction

Congratulations on purchasing your computer motherboard from an acknowledged leader
in the industry. Supermicro motherboards are designed with the utmost attention to detail to
provide you with the highest standards in quality and performance.

The X11DPG-QT motherboard was designed to be used with a Supermicro-proprietary
chassis as an integrated server platform. It is not to be used as a stand-alone product and
will not be shipped independently in a retail box. No motherboard shipping package will be
provided in your shipment.

Important Links

For your system to work properly, please follow the links below to download all necessary
drivers/utilities and the user’s manual for your server.

• Supermicro product manuals: http://www.supermicro.com/support/manuals/

• Product drivers and utilities: ftp://ftp.supermicro.com

• Product safety info: http://www.supermicro.com/about/policies/safety_information.cfm

• If you have any questions, please contact our support team at: [e-mail]

This manual may be periodically updated without notice. Please check the Supermicro website

for possible updates to the manual revision level.

8

Figure 1-1. X11DPG-QT Motherboard Image

Chapter 1: Introduction

Note: All graphics shown in this manual were based upon the latest PCB revision
available at the time of publication of the manual. The motherboard you received may
or may not look exactly the same as the graphics shown in this manual.

9

Super X11DPG-QT User's Manual

JGPIO_P2: CPU2-HSSI GPIO

JGPIO_P1: CPU1-HSSI GPIO

JIPMB1

JSEN1

COM2

JPTG1

JRK1

JVRM_SEL1

JWD1

JSTBY1

MAC CODE
SAN MAC

S-UM12

BIOS
LICENSE

IPMI CODE
BAR CODE

DESIGNED IN USA

FAN C FAN D

JPCIE2

(CPU1 SLOT2 PCI-E 3.0 x16)

Figure 1-2. X11DPG-QT Motherboard Layout

(not drawn to scale)

JUIDB1

P1-DIMMD2

(UID)

LED2

(UID-LED)

JPCIE11

(CPU2 SLOT11 PCI-E 3.0 x4 (IN x8))

P2-DIMMC1

JSDCARD1

JPCIE4

(CPU1 SLOT4 PCI-E 3.0 x16)

REV:1.02

X11DPG-QT

BMC

M.2 CONNECOR

JPCIE6

(CPU2 SLOT6 PCI-E 3.0 x16)

JPCIE8

JPCIE9

(CPU2 SLOT8 PCI-E 3.0 x16)

(CPU1 SLOT9 PCI-E 3.0 x16)

JHFI1

JNVI2C1

LAN
CTRL

JTBT1

JHFI2

JNVI2C2

P1-DIMMF1

LEDM1

JPCIE10

(CPU2 SLOT10 PCI-E 3.0 x16)

P1-DIMME1

P1-DIMMD1

JNCSI1

P2-DIMMB1

VGA

P2-DIMMA1

P2-DIMMA2

LAN 2

FAN 4

LAN 1

CPU2

USB 0/1

IPMI_LAN

USB 4/5 (3.0)

P1-DIMMA2

P1-DIMMA1

FAN 3

P1-DIMMB1

P1-DIMMC1

COM1

P2-DIMMD2

P2-DIMMD1

P2-DIMME1

FAN 6

JPI2C1

P2-DIMMF1

JSD2

S-SATA5

JL1

S-SGPIO

JSD1

FAN B

S-SATA4

USB 2/3

USB 6/7 (3.0)

PCH

JPWR4

FAN 5

JPWR3

JPWR2

JPWR1

FAN 1

JBT1

BT1

JTAG_HFI1

JTPM1

USB 8 (3.0)

JPAC1

JPME2

JSPDIF_IN1

AUDIO_FP

JHD_AC1

SP1

LEDPWR

JF1

FAN A

I-SATA0~3I-SATA4~7

CPU1

FAN 2

Note: Components not documented are for internal testing only.

10

Quick Reference

Chapter 1: Introduction

COM2

JPTG1

JRK1

JIPMB1

JVRM_SEL1

JWD1

JSEN1

JSTBY1

S-SGPIO

JSD2
JSD1

S-SATA5

USB 2/3

USB 6/7

(3.0)

JL1

MAC CODE
SAN MAC

DESIGNED IN USA

FANC

BIOS
LICENSE

S-SATA4

I-SATA4~7

I-SATA0~3

JSDCARD1

IPMI CODE
BAR CODE

FAND

JBT1

PCH

X11DPG-QT

REV:1.02

M.2 CONNECTOR

BT1

USB 8 (3.0)

JPME2

JHD_AC1

AUDIO_FP

JSPDIF_IN1

JPAC1

BMC

JNVI2C1

JTAG_HFI1
JTPM1

JF1

JTBT1

JHFI2

JHFI1

SP1

LEDPWR

LED2

LEDM1

JNCSI1

LAN
CTRL

JNVI2C2

P1-DIMME1

P1-DIMMF1

P1-DIMMD2

P1-DIMMD1

JUIDB1

VGA

P2-DIMMB1

P2-DIMMC1

P2-DIMMA1

FAN2FANAFANB

LAN2

FAN4

USB 4/5 (3.0)

P2-DIMMA2

CPU1

LAN1

USB 0/1

CPU2

IPMI_LAN

FAN3

P1-DIMMA1

P1-DIMMA2

P1-DIMMC1

P1-DIMMB1

COM1

FAN5

P2-DIMMF1

P2-DIMME1

P2-DIMMD1

P2-DIMMD2

FAN6

JPI2C1

JPWR4

JPWR3

JPWR2

JPWR1

FAN1

Notes:

• See Chapter 2 for detailed information on jumpers, I/O ports, and JF1 front panel con-

nections.

• " " indicates the location of Pin 1.

• Components/jumpers/LED indicators not documented are reserved for internal testing only.

• Use only the correct type of onboard CMOS battery as specied by the manufacturer. Do

not install the onboard battery upside down to avoid possible explosion.

11

Super X11DPG-QT User's Manual

Quick Reference Table

Jumper Description Default Setting

JBT1 CMOS Clear Open (Normal)

JHD_AC1 AC97/High Denition Audio Enable Off (HD Enabled)

JPAC1 Audio Enable Pins 1-2 (Enabled)

JPME2 ME Manufacturing Mode Pins 1-2 (Normal)

JPTG1 Onboard 10Gb LAN1/2 Enable/Disable Pins 1-2 (Enabled)

JVRM_SEL1 VRM_I2C Jumper Pins 1-2 (Normal)

JWD1 Watch Dog Timer Reset Pins 1-2 (Reset)

Connector Description

AUDIO_FP Front Panel Audio Header

BT1 Onboard Battery

COM1 COM Port (COM1) on the I/O Backplane

COM2 COM Header

FAN1 ~ FAN6, FANA,

FANB, FANC, FAND

IPMI_LAN Dedicated IPMI LAN Port

I-SATA0~3, I-SATA4~7 Intel® PCH SATA 3.0 Ports (0-3, 4-7)

JF1 Front Control Panel Header

JHFI1/JHFI2

(*Notes below)

JIPMB1 4-pin BMC External IC Header (for an IPMI card)

JL1 Chassis Intrusion Header

JNCSI1 NC-SI Header for IPMI Support

JNVI2C1 VPP Header for the NVMe Add-on Card on PCI-E Slot 9

JNVI2C2 VPP Header for the NVMe Add-on Card on PCI-E Slot 10

JPI2C1 Power Supply SMBus I2C Header

JPWR1 24-pin ATX Power Connector

JPWR2/JPWR3

JPWR4 12V 4-pin Power Connectors

JRK1 RAID_Key for Onboard SATA Devices

JSD1/JSD2 SATA DOM Power Connectors 1/2

JSDCARD1 Micro SD Card Slot

JSEN1 Inlet Sensor Header

JSPDIF_IN1 Sony/Philips Digital Interface Audio Input Header

System/CPU Fan Headers (FAN5: CPU1 Fan, FAN6: CPU2 Fan)

Host Fabric Interface (HFI) Sideband Connection Headers Used for the HFI Carrier Card (when the

F model processor is used) (JHFI1: for CPU1, JHFI2: for CPU2)

12V 8-pin CPU Power Connector (To provide alternative power for special enclosure when the 24-

pin ATX power is not in use.)

Notes: 1. For the HFI sideband carrier card to function properly, please install the HFI
card to an appropriate PCI-E slot of your choice, and install an F model processor in
the CPU socket. 2. Connect an HFI cable from the HFI card to JHFI (HFI headers)
and connect an IFP cable from the HFI card to the processor. (See Pages 34 and 51
in Chapter 2 for more information.)

12

Chapter 1: Introduction

Connector Description

JSTBY1 Standby Power Connector

JTAG_HFI1 HFI Debug Port for Fabric CPU (See Note below)

JTBT1 General Purpose Header for Thunderbolt Add-on Card

JTPM1 Trusted Platform Module/Port 80 connector

JUIDB1 UID (Unit Identier) Switch

LAN1/2 LAN Ports

M.2 CONNECTOR

S-SATA4/S-SATA5 SATA 3.0 Ports with Power-pin Built-in w/support of SuperDOM (Device-On Module)

S-SGPIO Serial Link General Purpose I/O Header

SP1 Internal Speaker/Buzzer

USB 0/1 Back Panel USB 2.0 Ports

USB 2/3 Front Access USB 2.0 Header

USB 4/5 Back Panel USB 3.0 Ports

USB 6/7 Front Access USB 3.0 Header

USB 8 USB 3.0 Type A Header

VGA VGA Port (Back Panel)

PCI-E M.2 Connector, small form factor devices and other portable devices for High speed NVMe

SSDs

LED Description Status

LED2 UID (Unit Identier) LED Solid Blue: Unit Identied

LEDM1 BMC Heartbeat LED Blinking Green: BMC Normal

LEDPWR Onboard Power LED Solid Green: Power On

Note: Fabric CPU is an abbreviation for Intel® Xeon® Scalable Processor Fabric CPU
in this manual.

13

Super X11DPG-QT User's Manual

Motherboard Features

Motherboard Features

CPU

• Dual Intel® Xeon® 81xx/61xx/51xx/41xx/31xx series processors (Socket P) with Intel® Omni-Path Fabric

Note 1: The Intel® Xeon® Processor Scalable Family includes Intel® Xeon® Platinum 8100 processor, Intel® Xeon®

Gold 6100/5100 processor, Intel® Xeon® Silver 4100 processor, and Intel® Xeon® Bronze 3100 processor.

Note 2: For the latest CPU/memory updates, please refer to our website at http://www.supermicro.com/products/

motherboard.

Memory

• Integrated memory controller embedded in the processor supports up to 2TB of 3DS Load Reduced DIMM (3DS LRDIMM),

Load Reduced DIMM (LRDIMM), Registered DIMM (RDIMM), Non-Volatile DIMM (NV-DIMM) DDR4 (288-pin) ECC

2666/2400/2133 MHz modules in 16 slots

Note: The memory capacity support will differ according to the SKUs.

DIMM Size

• Up to 128 GB at 1.2V

Note 1: Memory speed support depends on the processors used in the system.

Note 2: For the latest CPU/memory updates, please refer to our website at http://www.supermicro.com/products/

motherboard.

Chipset

• Intel® C621

Expansion Slots

• Four (4) PCI Express 3.0 x16

• Two (2) PCI Express 3.0 x16 or HSSI (High Speed Serial Interface)

• One (1) PCI Express 3.0 x4 in x8 slot

Non Volatile Memory Express (NVMe) Slot

• One (1) PCI Express 3.0 M.2 slot

BaseBoard Management Controller (BMC)

• ASpeed AST 2500 Baseboard Controller (BMC) supports IPMI 2.0

• One (1) IPMI_dedicated_LAN located on the rear IO backpanel

Graphics

• Graphics controller via AST 2500 BMC

Note: The table above is continued on the next page.

14

Chapter 1: Introduction

Motherboard Features

I/O Devices

• Serial (COM) Port • One (1) Fast UART 16550 port on the I/O back panel

• Eight (8) SATA 3.0 connections supported by Intel® PCH (I-SATA 0-3, 4-7)

• SATA 3.0

• RAID (PCH) • RAID 0/1/5/10 (RSTe 5.x)

Peripheral Devices

• Two (2) USB 3.0 ports on the rear I/O panel (USB 4/5)

• One (1) internal USB 3.0 header with two (2) USB connections on the motherboard for front access (USB 6/7)

• One (1) Type A USB 3.0 connector for front access (USB 8)

• Two (2) USB 2.0 ports on the rear I/O panel (USB 0/1)

• One (1) internal USB 2.0 header with two (2) USB connections on the motherboard for front access (USB 2/3)

BIOS

• 64 MB SPI AMI BIOS

®

SM Flash UEFI BIOS

• ACPI 3.0/4.0, USB keyboard, Plug-and-Play (PnP), SPI dual/quad speed support, riser-card auto detection support, and

SMBIOS 2.7 or later

• Two (2) SATA 3.0 ports with power-pin built-in, w/support of Supermicro

SuperDOM (S-SATA4/S-SATA5)

Power Management

• Main switch override mechanism

• Power-on mode for AC power recovery

• Intel® Intelligent Power Node Manager 4.0 (available when the Supermicro Power Manager [SPM] is installed and a

special power supply is used. See the note on page 22.)

• Management Engine (ME)

System Health Monitoring

• Onboard voltage monitoring for +3.3V, 3.3V standby, +5V, +5V standby, +12V, CPU core, memory, chipset, BMC, PCH,

and battery voltages

• CPU System LED and control

• CPU Thermal Trip support

• Status monitor for speed control

• Status monitor for on/off control

• CPU Thermal Design Power (TDP) support of up to 255W (See Note 1 on next page.)

Fan Control

• Fan status monitoring via IPMI connections

• Dual cooling zone

• Low-noise fan speed control

• Pulse Width Modulation (PWM) fan control

Note: The table above is continued on the next page.

15

Super X11DPG-QT User's Manual

Motherboard Features

System Management

• Trusted Platform Module (TPM) support

• PECI (Platform Environment Control Interface) 2.0 support

• UID (Unit Identication)/Remote UID

• System resource alert via SuperDoctor® 5

• SuperDoctor® 5, Watch Dog, NMI

• Chassis intrusion header and detection

LED Indicators

• CPU/Overheating

• Fan Failure

• UID/remote UID.

• HDD activity. LAN activity.

Dimensions

• 15.12" (L) x 13.2" (W) (384 mm x 335.3 mm)

Note 1: The CPU maximum thermal design power (TDP) is subject to chassis and

heatsink cooling restrictions. For proper thermal management, please check the chas-

sis and heatsink specications for proper CPU TDP sizing.

Note 2: For IPMI conguration instructions, please refer to the Embedded IPMI Con­guration User's Guide available at http://www.supermicro.com/support/manuals/.

Note 3: It is strongly recommended that you change BMC log-in information upon ini­tial system power-on. The manufacture default username is ADMIN and the password

is ADMIN. For proper BMC conguration, please refer to http://www.supermicro.com/
products/info/les/IPMI/Best_Practices_BMC_Security.pdf

16

Figure 1-3.

System Block Diagram

Chapter 1: Introduction

#1

#1

64MB BIOS

SPI FLASH

DDR4 DIMM

DDR4 DIMM

#2

DDR4 DIMM

#2

DDR4 DIMM

EXT CONN

JNCSI1

32MB BMC

SPI FLASH

DDR4

VGA

D

D

x16

x16

NC-SI(RMII)

32GB/s

32GB/s

P2 P1

P2

PE2 PE1 DMIPE3

CPU 2

UPI

P0

CPU 1

BMC

AST2500

HWM

JPCIE8

Slot 8

PCIE 3.0 x16

JPCIE10

Slot 10

PCIE 3.0 x16

#1 #1

DDR4 DIMM

F

DDR4 DIMM

JPCIE9

Slot 9

PCIE 3.0 x16

JPCIE4

Slot 4

PCIE 3.0 x16

JPCIE2

Slot 2

PCIE 3.0 x16

BMC SPI

MUX

PCH SPI

#1

EF

#1

E

x16

x16

x16

32GB/s

UPI

UL1

x 16

JPCIE6

PCIE 3.0 x16

x 4

JPCIE11

Slot 11

PCIE 3.0 x4

A

P0

UPI

P0

A

DMIPE3 PE2 PE1

PET [0,1,2,3]

PET [4,5,6,7]

DMI

PCH

PET9

SPI

USB2.0 [7] ESPI

PHY
RTL8211E

COM1

COM2

Slot 6

#1

#2

DDR4 DIMM

#2

#1

DDR4 DIMM

SATA Gen3 [0..3]

SATA Gen3 [4..7]

sSATA Gen3 [4..5]

HD LINK

USB2.0 [2..5]
USB2.0 [7..12]
USB3.0 [1..5]

IPMI LAN
RJ45

B

DDR4 DIMM

#1#1

B

DDR4 DIMM

x4

x4

I-SATA-0~3
IPASS CONN

I-SATA-4~7
IPASS CONN

S-SATA4
S-SATA5

ALC888 AUDIO FP

TPM Header

VCCP1&2

C

C

port 4,5(USB2.0)

REAR (USB2.0)

VR13
6+1 PHASE
205W

#1

DDR4 DIMMDDR4 DIMM

#1

port 1,2(USB3.0)
+
port 11,12(USB2.0)

REAR(USB3.0)

M.2 CONN
PCIE 3.0 x4

10G

X550

10G

NC-SI

port 3,4(USB3.0)
+
port 2,3(USB2.0)

HDR 2x10

port 8,9(USB2.0)

(USB3.0) (USB2.0)

HDR 2x5

JLAN1
RJ45

JLAN2
RJ45

To BMC RMII port

port 5(USB3.0)
+
port 10(USB2.0)

TYPE A(USB3.0)

Note: This is a general block diagram and may not exactly represent the features on

your motherboard. See the previous pages for the actual specications of your moth­erboard.

17

Super X11DPG-QT User's Manual

1.1 Processor and Chipset Overview

Built upon the functionality and capability of the Intel® Xeon® scalable processors (in Socket
P) and the Intel® C621 chipset, the X11DPG-QT motherboard provides system performance,

power efciency, and feature sets to address the needs of next-generation computer users.

This motherboard is ideal for general purpose, cloud computing, and is optimized for server
platforms used in data centers.

With support of the new Intel® Omni-Path Fabric support, the X11DPG-QT drastically
increases system performance for a multitude of server applications.

The Intel® C621 chipset provides Enterprise SMbus support and includes the following
features:

• DDR4 288-pin memory support on Socket P

• Support for MCTP Protocol

• Support for Management Engine (ME)

• Support of SMBus speeds of up to 400KHz for BMC connectivity

• Improved I/O capabilities to high-storage-capacity congurations

• SPI enhancements

• Intel® Node Manager 4.0 for advanced power monitoring, capping, and management for

BMC enhancement

• The BMC supports remote management, virtualization, and the security package for en-

terprise platforms

Note: Node Manager 4.0 support is dependent on the power supply used in the system.

1.2 Special Features

This section describes the health monitoring features of the X11DPG-QT motherboard. The
motherboard has an onboard ASpeed 2500 Baseboard Management Controller (BMC) that
supports system health monitoring.

Recovery from AC Power Loss

The Basic I/O System (BIOS) provides a setting that determines how the system will respond
when AC power is lost and then restored to the system. You can choose for the system to
remain powered off (in which case you must press the power switch to turn it back on), or
for it to automatically return to the power-on state. See the Advanced BIOS Setup section
for this setting. The default setting is Last State.

18

Chapter 1: Introduction

1.3 System Health Monitoring

This section describes the health monitoring features of the X11DPG-QT motherboard. The
motherboard has an onboard Baseboard Management Controller (BMC) chip that supports
system health monitoring. Once a voltage becomes unstable, a warning is given or an error

message is sent to the screen. The user can adjust the voltage thresholds to dene the

sensitivity of the voltage monitor.

Onboard Voltage Monitors

The onboard voltage monitor will continuously scan crucial voltage levels. Once a voltage
becomes unstable, it will give a warning or send an error message to the screen. The user

can adjust the voltage thresholds to dene the sensitivity of the voltage monitor. Real time

readings of these voltage levels are all displayed in BIOS.

Fan Status Monitor with Firmware Control

The system health monitor embedded in the BMC chip can check the RPM status of the
cooling fans. The CPU and chassis fans are controlled via lPMI.

Environmental Temperature Control

System Health sensors in the BMC monitor the temperatures and voltage settings of onboard
processors and the system in real time via the IPMI interface. Whenever the temperature of

the CPU or the system exceeds a user-dened threshold, system/CPU cooling fans will be

turned on to prevent the CPU or the system from overheating.

Note: To avoid possible system overheating, please be sure to provide adequate air-

ow to your system.

System Resource Alert

This feature is available when used with SuperDoctor 5®. SuperDoctor 5 is used to notify the

user of certain system events. For example, you can congure SuperDoctor 5 to provide you

with warnings when the system temperature, CPU temperatures, voltages and fan speeds

go beyond a predened range.

1.4 ACPI Features

ACPI stands for Advanced Conguration and Power Interface. The ACPI specication denes
a exible and abstract hardware interface that provides a standard way to integrate power

management features throughout a computer system including its hardware, operating system
and application software. This enables the system to automatically turn on and off peripherals
such as network cards, hard disk drives and printers.

19

Super X11DPG-QT User's Manual

In addition to enabling operating system-directed power management, ACPI also provides a
generic system event mechanism for Plug and Play and an operating system-independent

interface for conguration control. ACPI leverages the Plug and Play BIOS data structures

while providing a processor architecture-independent implementation that is compatible with
Windows server 2012/R2 and Windows server 2016 operating systems.

1.5 Power Supply

As with all computer products, a stable power source is necessary for proper and reliable
operation. It is even more important for processors that have high CPU clock rates. In areas

where noisy power transmission is present, you may choose to install a line lter to shield

the computer from noise. It is recommended that you also install a power surge protector to
help avoid problems caused by power surges.

1.6 Super I/O

The Super I/O (ASpeed AST2500 chip) provides a high-speed, 16550 compatible serial
communication port (UART), which supports serial infrared communication. The UART
includes send/receive FIFO, a programmable baud rate generator, complete modem control
capability, and a processor interrupt system. The UART provides legacy speed with baud
rate of up to 115.2 Kbps as well as an advanced speed with baud rates of 250 K, 500 K, or
1 Mb/s, supporting higher speed modems.

The Super I/O provides functions that comply with ACPI (Advanced Conguration and Power

Interface), which includes support of legacy and ACPI power management through a SMI
or SCI function pin. It also features auto power management to reduce power consumption.

1.7 Advanced Power Management

The following new advanced power management features are supported by the motherboard.

Intel® Intelligent Power Node Manager (IPNM)

Available when the Supermicro Power Manager (SPM) is installed, Intel's Intelligent Power
Node Manager (IPNM) provides your system with real-time thermal control and power

management for maximum energy efciency. Although IPNM Specication Version 2.0/3.0

is supported by the BMC (Baseboard Management Controller), your system must also have

IPNM-compatible Management Engine (ME) rmware installed to use this feature.

Note: Support for IPNM 2.0/3.0 support is dependent on the power supply used in
the system.

20

Chapter 1: Introduction

Management Engine (ME)

The Management Engine, which is an ARC controller embedded in the IOH (I/O Hub), provides
Server Platform Services (SPS) to your system. The services provided by SPS are different
from those provided by the ME on client platforms.

21

Super X11DPG-QT User's Manual

Chapter 2

Installation

2.1 Static-Sensitive Devices

Electrostatic Discharge (ESD) can damage electronic com ponents. To avoid damaging
your motherboard and your system, it is important to handle it very carefully. The following

measures are generally sufcient to protect your equipment from ESD.

Precautions

• Use a grounded wrist strap designed to prevent static discharge.

• Touch a grounded metal object before removing the motherboard from the antistatic bag.

• Handle the motherboard by its edges only; do not touch its components, peripheral chips,

memory modules or gold contacts.

• When handling chips or modules, avoid touching their pins.

• Put the motherboard and peripherals back into their antistatic bags when not in use.

• For grounding purposes, make sure that your chassis provides excellent conductivity be-

tween the power supply, the case, the mounting fasteners and the motherboard.

• Use only the correct type of CMOS onboard battery as specied by the manufacturer. Do

not install the CMOS battery upside down, which may result in a possible explosion.

Unpacking

The motherboard is shipped in antistatic packaging to avoid static damage. When unpacking
the motherboard, make sure that the person handling it is static protected.

22

Chapter 2: Installation

X11DPG-QT

DESIGNED IN USA

REV:1.02

IPMI CODE

MAC CODE
SAN MAC

BAR CODE

BIOS
LICENSE

CPU1

CPU2

PCH

BMC

LAN
CTRL

2.2 Motherboard Installation

All motherboards have standard mounting holes to t different types of chassis. Make sure

that the locations of all the mounting holes for both the motherboard and the chassis match.
Although a chassis may have both plastic and metal mounting fasteners, metal ones are
highly recommended because they ground the motherboard to the chassis. Make sure that
the metal standoffs click in or are screwed in tightly.

Tools Needed

Philips
Screwdriver
(1)

Philips Screws
(14)

Standoffs (14)
Only if Needed

Location of Mounting Holes

Note: 1) To avoid damaging the motherboard and its components, please do not use

a force greater than 8 lb/inch on each mounting screw during motherboard installation.

2) Some components are very close to the mounting holes. Please take precautionary
measures to avoid damaging these components when installing the motherboard to
the chassis.

23

Super X11DPG-QT User's Manual

Installing the Motherboard

1. Install the I/O shield into the back of the chassis.

2. Locate the mounting holes on the motherboard. See the previous page for the location.

3. Locate the matching mounting holes on the chassis. Align the mounting holes on the
motherboard against the mounting holes on the chassis.

4. Install standoffs in the chassis as needed.

5. Install the motherboard into the chassis carefully to avoid damaging other motherboard
components.

6. Using the Phillips screwdriver, insert a Phillips head #6 screw into a mounting hole on
the motherboard and its matching mounting hole on the chassis.

7. Repeat Step 5 to insert Pan head #6 screws into all mounting holes.

8. Make sure that the motherboard is securely placed in the chassis.

Note: Images displayed in this manual are for illustration only. Your chassis or
components might look different from those shown in this manual.

24

Chapter 2: Installation

2.3 Processor and Heatsink Installation

Warning: When handling the processor package, avoid placing direct pressure on the label

area of the CPU or CPU socket. Also, improper CPU installation or socket misalignment can
cause serious damage to the CPU or motherboard which may result in RMA repairs. Please
read and follow all instructions thoroughly before installing your CPU and heatsink.

Notes:

• Always connect the power cord last, and always remove it before adding, removing, or

changing any hardware components. Please note that the processor and heatsink should

be assembled together rst to form the Processor Heatsink Module (PHM), and then install

the entire PHM into the CPU socket.

• When you receive a motherboard without a processor pre-installed, make sure that the

plastic CPU socket cap is in place and that none of the socket pins are bent; otherwise,
contact your retailer immediately.

• Refer to the Supermicro website for updates on CPU support.

• Please follow the instructions given in the ESD Warning section on the rst page of this

chapter before handling, installing, or removing system components.

The Intel 81xx/61xx/51xx/41xx/31xx Series Processors

Note: The 81xx/61xx/51xx/41xx/31xx processors contain two models-the F model pro-

cessors and the Non-F model processors. The installation instructions for the F model
processors differ from the installation instructions for the Non-F model processors. For
this reason, two sets of instructions (one for the F model, and the other, for the Non­F model) are provided in this section.

Intel Processor (Non-F Model) Intel Processor (F Model)

Note: All graphics, drawings, and pictures shown in this manual are for illustration only.

The components that came with your machine may or may not look exactly the same
as those shown in this manual.

25

Super X11DPG-QT User's Manual

Overview of the Processor Socket Assembly

The processor socket assembly contains 1) the Intel 81xx/61xx/51xx/41xx/31xx processor,

2) the narrow processor clip, 3) the dust cover, and 4) the CPU socket.

1. The 81xx/61xx/51xx/41xx/31xx
Processor

(The 81xx/61xx/51xx/41xx/31xx Processor)

2. Narrow processor clip (the plastic processor package carrier used for the CPU)

3. Dust Cover

4. CPU Socket

(for the non-F Model)

Note: Be sure to cover the CPU socket with the dust cover when the CPU is not in-

stalled.

26

Chapter 2: Installation

Overview of the Processor Heatsink Module (PHM)

The Processor Heatsink Module (PHM) contains 1) a heatsink, 2) a narrow processor clip,
and 3) the 81xx/61xx/51xx/41xx/31xx processor.

1. Heatsink

2. Narrow processor clip

3. Intel Processor

Processor Heatsink Module (PHM)

(Bottom View for the non-F Model) (Bottom View for the F Model)

27

Super X11DPG-QT User's Manual

A

Allow Notch B to
latch on to CPU

Attaching the Non-F Model Processor to the Narrow Processor
Clip to Create the Processor Package Assembly

To properly install the CPU into the narrow processor clip, please follow the steps below.

1. Locate pin 1 (notch A), which is the triangle located on the top of the narrow processor
clip. Also locate notch B and notch C on the processor clip.

2. Locate pin 1 (notch A), which is the triangle on the substrate of the CPU. Also, locate
notch B and notch C on the CPU as shown below.

3. Align pin 1 (the triangle on the substrate) of the CPU with pin 1 (the triangle) of
the narrow processor clip. Once they are aligned, carefully insert the CPU into the
processor clip by sliding notch B of the CPU into notch B of the processor clip, and

sliding notch C of the CPU into notch C of the processor clip.

4. Examine all corners of the CPU to ensure that it is properly seated on the processor
clip. Once the CPU is securely attached to the processor clip, the processor package
assembly is created.

Note: Please exercise extreme caution when handling the CPU. Do not touch the
CPU LGA-lands to avoid damaging the LGA-lands or the CPU. Be sure to wear ESD
gloves when handling components.

CPU (Upside Down)
w/CPU LGA Lands up

Align Notch B of the CPU
and Notch B of the Processor Clip

Align CPU Pin 1

C

Align Notch C of the CPU
and Notch C of the Processor Clip

B

Allow Notch C to
latch on to CPU

A

Pin 1

C

C

B

CPU/Heatsink Package
(Upside Down)

B

A

Processor Package Carrier (w/CPU mounted

on the Processor Clip)

28

Chapter 2: Installation

Attaching the F Model Processor to the Narrow Processor Clip
to Create the Processor Package Assembly

To properly install the CPU into the narrow processor clip, please follow the steps below.

1. Locate pin 1 (notch A), which is the triangle located on the top of the narrow processor
clip. Also locate notch B and notch C on the processor clip.

2. Locate pin 1 (notch A), which is the triangle on the substrate of the CPU. Also, locate
notch B and notch C on the CPU as shown below.

3. Align pin 1 (the triangle on the substrate) of the CPU with pin 1 (the triangle) of the
narrow processor clip. Once they are aligned, carefully insert the CPU into the processor
clip by sliding notch B of the CPU into notch B of the processor clip, and sliding notch C

of the CPU into notch C of the processor clip.

4. Examine all corners of the CPU to ensure that it is properly seated on the processor
clip. Once the CPU is securely attached to the processor clip, the processor package
assembly is created.

Note: Please exercise extreme caution when handling the CPU. Do not touch the CPU
LGA-lands to avoid damaging the LGA-lands or the CPU. Be sure to wear ESD gloves
when handling components.

CPU (Upside Down)
w/CPU LGA Lands up

Align Notch C of the CPU
and Notch C of the Processor Clip

Align Notch B of the CPU
and Notch B of the Processor Clip

C

B

Align CPU Pin 1

D

A

Pin 1

Align Notch D of the CPU
and Notch D of the Processor Clip

D

C

B

CPU/Heatsink Package
(Upside Down)

A

Allow Notch D to
latch on to CPU

D

Processor Package Carrier (w/CPU mounted on the

Processor Clip)

29

Allow Notch C to
latch on to CPU

Allow Notch B to
latch on to CPU

C

B

A

Super X11DPG-QT User's Manual

Attaching the Non-F Model Processor Package Assembly to the
Heatsink to Form the Processor Heatsink Module (PHM)

After you have made a processor package assembly by following the instructions on the
previous page, please follow the steps below to mount the processor package assembly onto
the heatsink to create the Processor Heatsink Module (PHM).

1. Locate "1" on the heatsink label and the triangular corner next to it on the heatsink.

With your index nger pressing against the screw at this triangular corner, carefully hold

and turn the heatsink upside down with the thermal-grease side facing up. Remove the

protective thermal lm if present, and apply the proper amount of the thermal grease

as needed. (Skip this step if you have a new heatsink because the necessary thermal
grease is pre-applied in the factory.)

2. Holding the processor package assembly at the center edge, turn it upside down. With
the thermal-grease side facing up, locate the hollow triangle located at the corner of the
processor carrier assembly ("a" in the graphic). Note a larger hole and plastic mounting
clicks located next to the hollow triangle. Also locate another set of mounting clicks and
a larger hole at the diagonal corner
of the same (reverse) side of the
processor carrier assembly ("b" in
the graphic).

3. With the back of heatsink and
the reverse side of the processor
package assembly facing up, align
the triangular corner on the heatsink
("A" in the graphic) against the
mounting clips next to the hollow
triangle ("a") on the processor
package assembly.

4. Also align the triangular corner ("B")
at the diagonal side of the heatsink
with the corresponding clips on the
processor package assembly ("b").

Triangle on the CPU

Triangle on the
Processor Clip

Non-Fabric CPU and Processor Clip

(Upside Down)

b

d

B

a

D

Heatsink

(Upside Down)

A

On Locations of (C, D), the notches

snap onto the heat sink’s

B

c

C

mounting holes

5. Once the mounting clips on the
processor package assembly
are properly aligned with the
corresponding holes on the back
of heatsink, securely attach the
heatsink to the processor package
assembly by snapping the mounting
clips at the proper places on the
heatsink to create the processor
heatsink module (PHM).

30

D

A

On Locations (A, B), the notches
snap onto the heatsink’s sides

C

Make sure Mounting

Notches snap into place