Supermicro X11DDW-NT operation manual

X11DDW-L/NT
USER’S MANUAL
Revision 1.0a
The information in this User’s Manual has been carefully reviewed and is believed to be accurate. The vendor assumes no responsibility for any inaccuracies that may be contained in this document, and makes no commitment to update or to keep current the information in this manual, or to notify any person or organization of the updates. Please Note:
For the most up-to-date version of this manual, please see our website at www.supermicro.com.
Super Micro Computer, Inc. ("Supermicro") reserves the right to make changes to the product described in this manual at any time and without notice. This product, including software and documentation, is the property of Supermicro and/ or its licensors, and is supplied only under a license. Any use or reproduction of this product is not allowed, except as expressly permitted by the terms of said license.
IN NO EVENT WILL Super Micro Computer, Inc. BE LIABLE FOR DIRECT, INDIRECT, SPECIAL, INCIDENTAL, SPECULATIVE OR CONSEQUENTIAL DAMAGES ARISING FROM THE USE OR INABILITY TO USE THIS PRODUCT OR DOCUMENTATION, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. IN PARTICULAR, SUPER MICRO COMPUTER, INC. SHALL NOT HAVE LIABILITY FOR ANY HARDWARE, SOFTWARE, OR DATA STORED OR USED WITH THE PRODUCT, INCLUDING THE COSTS OF REPAIRING, REPLACING, INTEGRATING, INSTALLING OR RECOVERING SUCH HARDWARE, SOFTWARE, OR DATA.
Any disputes arising between manufacturer and customer shall be governed by the laws of Santa Clara County in the State of California, USA. The State of California, County of Santa Clara shall be the exclusive venue for the resolution of any such disputes. Supermicro's total liability for all claims will not exceed the price paid for the hardware product.
FCC Statement: This equipment has been tested and found to comply with the limits for a Class A digital device pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the manufacturer’s instruction manual, may cause harmful interference with radio communications. Operation of this equipment in a residential area is likely to cause harmful interference, in which case you will be required to correct the interference at your own expense.
California Best Management Practices Regulations for Perchlorate Materials: This Perchlorate warning applies only to products containing CR (Manganese Dioxide) Lithium coin cells. “Perchlorate Material-special handling may apply. See www.dtsc.ca.gov/hazardouswaste/perchlorate”.
WARNING: Handling of lead solder materials used in this product may expose you to lead, a chemical known to the State of California to cause birth defects and other reproductive harm.
The products sold by Supermicro are not intended for and will not be used in life support systems, medical equipment, nuclear facilities or systems, aircraft, aircraft devices, aircraft/emergency communication devices or other critical
systems whose failure to perform be reasonably expected to result in signicant injury or loss of life or catastrophic
property damage. Accordingly, Supermicro disclaims any and all liability, and should buyer use or sell such products for use in such ultra-hazardous applications, it does so entirely at its own risk. Furthermore, buyer agrees to fully indemnify, defend and hold Supermicro harmless for and against any and all claims, demands, actions, litigation, and proceedings of any kind arising out of or related to such ultra-hazardous use or sale.
Manual Revision 1.0a
Release Date: August 14, 2017
Unless you request and receive written permission from Super Micro Computer, Inc., you may not copy any part of this
document. Information in this document is subject to change without notice. Other products and companies referred
to herein are trademarks or registered trademarks of their respective companies or mark holders.
Copyright © 2017 by Super Micro Computer, Inc. All rights reserved.
Printed in the United States of America
Preface
Preface
About This Manual
This manual is written for system integrators, IT technicians, and knowledgeable end users. It provides information for the installation and use of the X11DDW-L/NT motherboard.
About This Motherboard
The Super X11DDW-L/NT motherboard supports dual Intel Xeon 81xx/61xx/51xx/41xx/31xx series processors (Socket P -F) with a TDP (Thermal Design Power) of up to 205W and a QPI (QuickPath Interconnect) of up to 10.4GT/s. Built with the Intel® C621/C622 PCH, this
motherboard supports 1536GB Registered ECC DDR4 in 12 memory slots. It o󰀨ers support for
Intel Intelligent Power Node Manager, Active Management Technology, and vPro technology. The X11DDW-L/NT includes four NVMe connectors, slots for riser card support, fourteen SATA 3.0 ports, and dual LAN and USB 3.0 ports. The X11DDW-L/NT provides maximum performance, system cooling, and PCI-E capacity. This motherboard is optimized for PCI-
Express expansion with exible IO support, and is ideal for general-purpose server platforms.
Please note that this motherboard is intended to be installed and serviced by professional technicians only. For processor/memory updates, please refer to our website at http://www. supermicro.com/products/.
Manual organization
Chapter 1 describes the features, specications and performance of the motherboard, and
provides detailed information on the Intel C621/C622 chipsets.
Chapter 2 provides hardware installation instructions. Read this chapter when installing the processor, memory modules and other hardware components into the system.
If you encounter any problems, see Chapter 3, which describes troubleshooting procedures for video, memory and system setup stored in the CMOS.
Chapter 4 includes an introduction to the BIOS, and provides detailed information on running the CMOS Setup utility.
Appendix A provides BIOS Error Beep Codes.
Appendix B lists software program installation instructions.
Appendix C lists standardized warning statements in various languages.
Appendix D contains UEFI BIOS Recovery instructions.
3
X11DDW-L/NT User's Manual
Contacting Supermicro
Headquarters
Address: Super Micro Computer, Inc.
980 Rock Ave.
San Jose, CA 95131 U.S.A.
Tel: +1 (408) 503-8000
Fax: +1 (408) 503-8008
Email: marketing@supermicro.com (General Information)
support@supermicro.com (Technical Support)
Website: www.supermicro.com
Europe
Address: Super Micro Computer B.V.
Het Sterrenbeeld 28, 5215 ML
's-Hertogenbosch, The Netherlands
Tel: +31 (0) 73-6400390
Fax: +31 (0) 73-6416525
Email: sales@supermicro.nl (General Information)
support@supermicro.nl (Technical Support)
rma@supermicro.nl (Customer Support)
Website: www.supermicro.nl
Asia-Pacic
Address: Super Micro Computer, Inc.
3F, No. 150, Jian 1st Rd.
Zhonghe Dist., New Taipei City 235
Taiwan (R.O.C)
Tel: +886-(2) 8226-3990
Fax: +886-(2) 8226-3992
Email: support@supermicro.com.tw
Website: www.supermicro.com.tw
4
Preface
Table of Contents
Chapter 1 Introduction
1.1 Checklist ...............................................................................................................................8
Quick Reference ...............................................................................................................11
Quick Reference Table ......................................................................................................12
Motherboard Features .......................................................................................................14
1.2 Processor and Chipset Overview .......................................................................................18
1.3 Special Features ................................................................................................................18
Recovery from AC Power Loss .........................................................................................18
1.4 System Health Monitoring ..................................................................................................19
Onboard Voltage Monitors ................................................................................................19
Fan Status Monitor with Firmware Control .......................................................................19
Environmental Temperature Control .................................................................................19
System Resource Alert......................................................................................................19
1.5 ACPI Features ....................................................................................................................20
1.6 Power Supply .....................................................................................................................20
1.7 Super I/O ............................................................................................................................20
1.8 Advanced Power Management ..........................................................................................21
Intel® Intelligent Power Node Manager (IPNM).................................................................21
Management Engine (ME) ................................................................................................21
Chapter 2 Installation
2.1 Static-Sensitive Devices .....................................................................................................22
Precautions .......................................................................................................................22
Unpacking .........................................................................................................................22
2.2 Motherboard Installation .....................................................................................................23
Tools Needed ....................................................................................................................23
Location of Mounting Holes ..............................................................................................23
Installing the Motherboard.................................................................................................24
2.3 Processor and Heatsink Installation ....................................................................................25
The Processor ...................................................................................................................25
Overview of the Processor Socket Assembly ...................................................................26
Overview of the Processor Heatsink Module ....................................................................27
5
X11DDW-L/NT User's Manual
Preparing the CPU Socket for Installation ........................................................................28
Removing the Dust Cover from the CPU Socket .............................................................28
Attaching the Processor to the CPU/Heatsink Carrier ......................................................29
Attaching the CPU/Carrier Assembly to the Passive Heatsink to Form the Processor
Heatsink Module (PHM) ....................................................................................................30
Installing the Processor Heatsink Module (PHM) ............................................................31
Removing the Processor Heatsink Module (PHM) ...........................................................32
2.4 Memory Support and Installation .......................................................................................33
Memory Support ................................................................................................................33
DIMM Population Requirements .......................................................................................34
DIMM Installation ..............................................................................................................37
DIMM Removal .................................................................................................................37
2.5 Rear I/O Ports ....................................................................................................................38
2.6 Front Control Panel ............................................................................................................42
2.7 Connectors .........................................................................................................................47
Power Connector ..............................................................................................................47
Headers .............................................................................................................................49
2.8 Jumper Settings .................................................................................................................57
How Jumpers Work ...........................................................................................................57
2.9 LED Indicators ....................................................................................................................62
2.10 PCI-E 3.0 Slots .................................................................................................................65
Chapter 3 Troubleshooting
3.1 Troubleshooting Procedures ..............................................................................................66
Before Power On ..............................................................................................................66
No Power ..........................................................................................................................66
No Video ...........................................................................................................................67
System Boot Failure .......................................................................................................67
Memory Errors ..................................................................................................................67
Losing the System's Setup Conguration .........................................................................68
When the System Becomes Unstable ..............................................................................68
3.2 Technical Support Procedures ...........................................................................................70
3.3 Frequently Asked Questions ..............................................................................................71
3.4 Battery Removal and Installation .......................................................................................72
6
Battery Removal ................................................................................................................72
Proper Battery Disposal ....................................................................................................72
Battery Installation .............................................................................................................72
3.5 Returning Merchandise for Service ....................................................................................73
Chapter 4 BIOS
4.1 Introduction .........................................................................................................................74
4.2 Main Setup .........................................................................................................................75
4.3 Advanced Setup Congurations .........................................................................................77
4.4 Event Logs ........................................................................................................................105
4.5 IPMI ...................................................................................................................................107
4.6 Security ...........................................................................................................................110
4.7 Boot .................................................................................................................................114
4.8 Save & Exit .......................................................................................................................116
Appendix A BIOS Codes
Appendix B Software Installation
B.1 Installing Software Programs ...........................................................................................120
B.2 SuperDoctor® 5 .................................................................................................................121
Appendix C Standardized Warnings
Battery Handling ..............................................................................................................122
Product Disposal .............................................................................................................124
Appendix D UEFI BIOS Recovery
7
X11DDW-L/NT User's Manual
Chapter 1
Introduction
Congratulations on purchasing your computer motherboard from an industry leader. Supermicro motherboards are designed to provide you with the highest standards in quality and performance.
In addition to the motherboard, several important parts that are included with your shipment are listed below. If anything listed is damaged or missing, please contact your retailer.
1.1 Checklist
Main Parts List
Description Part Number Quantity
Supermicro Motherboard X11DDW-L/NT 1
SATA Cables CBL-0044L 2
Quick Reference Guide MNL-1907-QRG 1
Important Links
For your system to work properly, please follow the links below to download all necessary drivers/utilities and the user’s manual for your server.
Supermicro product manuals: http://www.supermicro.com/support/manuals/
Product drivers and utilities: ftp://ftp.supermicro.com
Product safety info: http://www.supermicro.com/about/policies/safety_information.cfm
If you have any questions, please contact our support team at: support@supermicro.com
This manual may be periodically updated without notice. Please check the Supermicro website
for possible updates to the manual revision level.
8
Figure 1-1. Motherboard Image
Chapter 1: Introduction
Lorem ipsum
Note: All graphics shown in this manual were based upon the latest PCB revision available at the time of publication of the manual. The motherboard you received may or may not look exactly the same as the graphics shown in this manual.
9
X11DDW-L/NT User's Manual
Figure 1-2. X11DDW-L Motherboard Layout
(not drawn to scale)
LE1
C
A
JUIDB1
JPME1
JPME2
USB2/3
JSXB1_1
LAN2
JM2_1
LE3
CPU2_PORT3
LAN1
(3.0)
IPMI_LAN USB0/1(3.0)
C621
SXB1B:CPU1 PCI-E 3.0 X16 + CPU2 PCI-E 3.0 X16
SXB2:CPU2 PCI-E 3.0 X16
BMC
CPU1_PORT3BCPU1_PORT3ACPU1_PORT3BCPU1_PORT3A
JSXB1_2
S-SGPIO2
CPU2_PORT2ACPU2_PORT2BCPU2_PORT2CCPU2_PORT2DCPU1_PORT3CCPU1_PORT3DCPU1_PORT3CCPU1_PORT3D
P2_NVME1
JRK1
JL1
JP3
JNVI2C2
P2 DIMM
F1
E1
CPU2
D1
P2_NVME0
JSXB1_3
P2 DIMM
A1
BIOS LICENSE
B1
SRW1
X11DDW-L
REV:1.02 DESIGNED IN USA
CPU2
C1
S-SATA 0~3
MAC CODE
P1 DIMM
F1
E1
I-SATA 4~7
I-SATA 0~3
BAR CODE
BT1
CPU1
D1
JBT1
JNVI2C1
P1_NVME1
JSDCARD1
P1_NVME0
+
X NMIPWR
NIC HDD
NIC
UID
PWRRST ON
LED
LED
2 1
LEDPSFAIL
VGA
10G PHY
LEDM1
CPU1
P1 DIMM
A1
JP2
JAOM
B1
C1
JIPMB1
LE2
S-SATA5
S-SATA4
JSTBY1
USB4/5(3.0)
JVRM1JVRM2
JTPM1
1
JBMC_DEBUG
JD1
JF1
JPL1
JWD1
JPG1
JBR1
FAN5FAN6
Di󰀨erences between X11DDW-L/NT
X11DDW-L X11DDW-NT 10G No Yes
NVME No Yes
FAN4
FAN3
JPWR3
FAN2
JPI2C1
JPWR1
JPWR2
FAN1
Note: Components not documented are for internal testing only.
10
Quick Reference
JPG1
JBR1
Chapter 1: Introduction
CPU2 PCI-E 3.0 X16
P1_NVME1 (-NT)
CPU1+CPU2 PCI-E 3.0 X16
JRK1
JL1
JP3
JNVI2C2 P2_NVME1 (-NT) P2_NVME0 (-NT)
JSXB1_1
JM2_1
LE3
I-SATA4~7
I-SATA0~3
S-SATA0~3
JNVI2C2
S-SGPIO2
SRW1
JSXB1_3
JRK1
JL1
JNVI2C2
P2 DIMM
F1
E1
JP3
D1
CPU2
P2_NVME1
P2_NVME0
LE1
JUIDB1
JPME1
JPME2
LE1
C
A
JUIDB1
JPME1
JPME2
JSXB1_1
JM2_1
LE3
CPU2_PORT3
SXB1B:CPU1 PCI-E 3.0 X16 + CPU2 PCI-E 3.0 X16
SXB2:CPU2 PCI-E 3.0 X16
CPU1_PORT3BCPU1_PORT3ACPU1_PORT3BCPU1_PORT3A
JSXB1_2
S-SGPIO2
CPU2_PORT2ACPU2_PORT2BCPU2_PORT2CCPU2_PORT2DCPU1_PORT3CCPU1_PORT3DCPU1_PORT3CCPU1_PORT3D
JSXB1_3
P2 DIMM
A1
SRW1
BIOS LICENSE
B1
C1
CPU2
S-SATA 0~3
MAC CODE
X11DDW-L
REV:1.02 DESIGNED IN USA
P1 DIMM
F1
E1
D1
CPU1
C621
I-SATA 0~3
LAN2
LAN2
I-SATA 4~7
BAR CODE
BT1
LAN1
LAN1
+
USB2/3
JBT1
JNVI2C1
P1_NVME1
P1_NVME0
PWRRST ON
USB2/3 (3.0)
JSDCARD1
NICHDD
NIC
UID
LED
2 1
LEDPSFAIL
LED
IPMI LAN
USB0/1
IPMI_LAN USB0/1(3.0)
10G PHY
BMC
LEDM1
X NMIPWR
VGA
CPU1
P1 DIMM A1
VGA
JIPMB1
S-SATA5
S-SATA4
JSTBY1
USB4/5(3.0)
JPL1
JWD1
S-SATA5
JIPMB1 JPG1
JPL1
JBR1
JWD1
S-SATA4
JSTBY1
USB4/5
JTPM1
1
JBMC_DEBUG
JF1
JBT1
LEDM1
JVRM2
JVRM1
JTPM1
JD1
JBMC DEBUG
JF1
LE2
JVRM1JVRM2
JD1
JP2
JAOM
LE2
JP2
C1
B1
JSDCARD1
P1_NVME0 (-NT)
BT1
JPI2C1
JPI2C1
JPWR3
JPWR3
JPWR1
JPWR1
JPWR2
JPWR2
FAN4
FAN6
FAN5FAN6
FAN5 FAN4 FAN3 FAN2 FAN1
FAN3
CPU1CPU2
FAN1
FAN2
Notes:
See Chapter 2 for detailed information on jumpers, I/O ports, and JF1 front panel con-
nections.
" " indicates the location of Pin 1.
Jumpers/LED indicators not indicated are used for internal testing only.
Use only the correct type of onboard CMOS battery as specied by the manufacturer. Do
not install the onboard battery upside down to avoid possible explosion.
11
X11DDW-L/NT User's Manual
Quick Reference Table
Jumper Description Default Setting
JBT1 Clear CMOS Open (Normal)
JPG1 VGA Enable Pins 1-2 (Enabled)
JPL1 LAN1/LAN2 Enable Pins 1-2 (Enabled)
JPME1 ME Recovery Pins 1-2 (Normal)
JPME2 Manufacturing (ME) Mode Select Pins 1-2 (Normal)
JVRM1 VRM SMB Clock (to BMC or PCH) Pins 1-2 (BMC, Normal)
JVRM2 VRM SMB Data (to BMC or PCH) Pins 1-2 (BMC, Normal)
JWD1 Watch Dog Timer Enable Pins 1-2 (Normal)
Connector Description
Battery (BT1) Onboard CMOS battery
FAN1~6 System cooling fan headers
IPMI_LAN Dedicated IPMI LAN port
JAOM PCI-E 3.0 x16 SAS3 AOM controller slot
JD1 Power LED/Speaker header (Pins 1-3: Power LED, Pins 4-7: Speaker)
JF1 Front control panel header
JIPMB1 4-pin external BMC I2C header (for an IPMI card)
JL1 Chassis intrusion header
JM2_1 M.2 slot supported by PCH
JNVI2C1/JNVI2C2 NVMe I2C headers
JPI2C1 Power Supply SMBbus I2C header
JPWR1/JPWR2 12V 8-pin power supply connectors
JPWR3 24-pin ATX main power supply connector
JRK1 RAID Key for onboard SATA devices
JSDCARD1 Micro SD Card slot
JSTBY1 Standby power header
JTPM1 Trusted Platform Module (TPM)/Port 80 connector
JUIDB1 Unit Identier (UID) switch
LAN1/LAN2 Gigabit LAN (GLAN) Ethernet ports on the back panel
P1_NVME0/P1_NVME1 (-NT) NVM Express PCI-E 3.0 x4 ports (from CPU1)
P2_NVME0/P2_NVME1 (-NT) NVM Express PCI-E 3.0 x4 ports (from CPU2)
(I-)SATA0~3, 4~7 I- SATA 3.0 connectors supported by the Intel PCH
(S-)SATA0~3 S-SATA 3.0 connectors supported by the Intel SCU
(S-)SATA4/S-SATA5
SXB1 PCI-E 3.0 (x16 + x16) Left Riser Card slot supported by CPU1 and CPU2
S-SATA connectors with built-in power pins and support of Supermicro SuperDOM (Disk-on
Module) devices
Note: Table is continued on the next page.
12
Chapter 1: Introduction
Connector Description
SXB2 PCI-E 3.0 x16 Right Riser Card slot supported by CPU2
S-SGPIO2 Serial General Purpose I/O port
USB0/1 Back panel USB 3.0 ports
USB2/3 Back panel USB 3.0 ports
USB4/5 USB 3.0 headers
VGA Back panel VGA port
LED Description Status
LE1 UID (Unit Identier) LED Solid Blue: Unit Identied
LE2 Onboard Power LED On: Onboard Power On
LE3 M.2 LED Blinking Green: Device Working
LEDM1 BMC Heartbeat LED Blinking Green: BMC Normal
13
X11DDW-L/NT User's Manual
Motherboard Features
Motherboard Features
CPU
Dual Intel Xeon 81xx/61xx/51xx/41xx/31xx series processors (Socket P)
Note: Both CPUs need to be installed for full access to the PCI-E slots, DIMM slots, and onboard controllers. Refer
to the block diagram on page 16 to determine which slots or devices may be a󰀨ected.
Memory
Integrated memory controller supports up to 1536GB of ECC Load Reduced DIMM (LRDIMM), Registered DIMM (RDIMM),
and Non-Volatile DIMM (NV-DIMM) DDR4 (288-pin) 2666MT/s modules in 12 slots
DIMM Size
Up to 128GB at 1.2V
Note 1: Memory speed support depends on the processors used in the system.
Note 2: For the latest CPU/memory updates, please refer to our website at http://www.supermicro.com/products/
motherboard.
Chipset
Intel C621 (-L)
Intel C622 (NT)
Expansion Slots
One (1) PCI-Express 3.0 (x16 + x16) slot supported by CPU1 and CPU2 for Left Riser Card (SXB1)
One (1) PCI-Express 3.0 x16 slot supported by CPU2 for Right Riser Card (SXB2)
One (1) PCI-Express 3.0 x16 slot supported by CPU1 for SAS3 AOM controller (JAOM)
BaseBoard Management Controller (BMC)
ASpeed AST 2500 Baseboard Controller (BMC) supports IPMI 2.0
One (1) dedicated IPMI LAN located on the rear IO backpanel
Graphics
Graphics controller via AST 2500 BMC (BaseBoard Management Controller)
I/O Devices
Fourteen (14) SATA ports
SATA 3.0
I-SATA0~3, I-SATA4~7
S-SATA0~3
S-SATA4,S-SATA5 (SuperDOM support)
RAID (PCH) • RAID 0, 1, 10
Note: The table above is continued on the next page.
14
Chapter 1: Introduction
Motherboard Features
Peripheral Devices
Two (2) USB 3.0 ports on the rear I/O panel (USB 0/1)
Two (2) USB 3.0 ports on the rear I/O panel (USB 2/3)
Two (2) USB 3.0 front accessible header (USB 4/5)
BIOS
256MB Aten BIOS
ACPI 3.0 or later, SPI dual/quad speed support, and SMBIOS 2.7 or later
Power Management
ACPI power management
Power button override mechanism
Wake-On-LAN
Power-on mode for AC power recovery
Intel® Intelligent Power Node Manager 3.0 (available when the Supermicro Power Manager [SPM] is installed and a
special power supply is used. See the note on page 20.)
Management Engine (ME)
System Health Monitoring
Onboard voltage monitoring for +1.8V, +3.3V, +5V, +/-12V, +3.3V standby, +5V standby, VBAT, HT, memory, PCH
temperature, system temperature, and memory temperature
CPU 5-phase switching voltage regulator
CPU thermal trip support
Status monitor for speed control
Status monitor for on/o󰀨 control
CPU Thermal Design Power (TDP) support of up to 145W (See Note 1 on next page.)
Fan Control
Five 4-pin fan headers
Fan status monitoring via IPMI connections
Low-noise fan speed control
System Management
Trusted Platform Module (TPM) support
PECI (Platform Environment Control Interface) 2.0 support
Power supply monitoring
SuperDoctor® 5, Watch Dog, Non-maskable interrupt (NMI), RoHS
Chassis intrusion detection
LED Indicators
CPU/Overheating
Power/Suspend-state indicator
Fan failure
UID/remote UID
HDD activity
LAN activity.
Note: The table above is continued on the next page.
15
X11DDW-L/NT User's Manual
Dimensions
12" (L) x 13" (W) (30.48 mm x 33.02 mm)
Note 1: The CPU maximum thermal design power (TDP) is subject to chassis and
heatsink cooling restrictions. For proper thermal management, please check the chas-
sis and heatsink specications for proper CPU TDP sizing.
Note 2: For IPMI conguration instructions, please refer to the Embedded IPMI Con­guration User's Guide available at http://www.supermicro.com/support/manuals/.
Note 3: It is strongly recommended that you change BMC log-in information upon initial system power-on. The manufacture default username is ADMIN and the password is
ADMIN. For proper BMC conguration, please refer to http://www.supermicro.com/ products/info/les/IPMI/Best_Practices_BMC_Security.pdf
Motherboard Features
16
Figure 1-3.
System Block Diagram
Chapter 1: Introduction
RJ45
DDR4
BMC Boot Flash
BIOS
(OPTION)
VGA CONN
LUIO
PCI-E X16 G3
JAOM
2 x NVME
RJ45
10G/1G
RJ45
10G/1G
LAN3
RTL8211E-VB-CG
SPI
SPI
VCCP0 12v
VR13
5+1 PHASE
205W
VCCP0-(F)
CPU1 CPU2
SOCKET ID : 0
#3
#2
UPI
10.4/11.2G
P1
P0
UPI
P1
PECI : 30 PECI : 31
DMI3
#1B#1A
UPI
P0
P2P2
#1A
PCI-E X8 G3
#1B #2 #3
#E-0
#D-0
#C-0
#B-0
#A-0
DDRIV
2133/2666
PCI-E X16 G3
#F-0
(LANE REVERSE)
(LANE REVERSE)
PCI-E X4 + X4 G3
LAN 10G/1G
X557-AT2/88E1512
RGRMII
BMC
AST2500
RMII/NCSI
PCI-E X1 G2
USB 2.0
ESPI
ESPI Header
DMI3
KR/KX
INTEL
PCH
X8 UPLINK NO QAT (~15W) X8 UPLINK NO QAT (~17W)
#5
#12
USB2.0
TPM HEADER
Debug Card
PCI-E X4 + X4 G3
6.0 Gb/S
USB 2.0
USB 3.0
SPI
BIOS
SYSTEM POWER
Temp Sensor
EMC1402-1 *2 at diff SMBUS
FRONT PANEL
FAN SPEED
CTRL
Note: ports available on the (-NT) model only.
4 x NVME (2+2)
VCCP1 12v
VR13
5+1 PHASE
205W
VCCP1
SOCKET ID : 1
PCI-E X8 G3
#1
#0
#M-0
#L-0
#K-0
#J-0
#H-0
#G-0
DMI3
DDRIV
2133/2666
(LANE REVERSE)PCI-E X16 G3
(LANE REVERSE)PCI-E X16 G3
RUIO
LUIO
NA
2 x NVME
#12
#11
#10
Rear x4 Header x2
iPass 4x3 SuperDOM x2
#13
SATA
#9
#8
#7
#6
#5
#4
#3
#2
SATA
USB
USB
Note: This is a general block diagram and may not exactly represent the features on
your motherboard. See the previous pages for the actual specications of your moth­erboard.
17
X11DDW-L/NT User's Manual
1.2 Processor and Chipset Overview
Built upon the functionality and capability of the Dual Intel Xeon 81xx/61xx/51xx/41xx/31xx series processors (Socket P) and the Intel C621/C622 chipsets, the X11DDW-L/NT
motherboard provides system performance, power e󰀩ciency, and feature sets to address
the needs of next-generation computer users. With features like a 6-channel DDR4 memory controller and up to 28 cores with Hyper-Threading technology, the X11DDW-L/NT provides maximum performance, system cooling, and PCI-E capacity. This motherboard is optimized for general purpose server platforms.
The Intel Xeon 81xx/61xx/51xx/41xx/31xx series processor and the Intel C621/C622 PCH support the following features:
Intel® AVX-512 support with memory bandwidth increase to 6 channels (x1.5 from the
previous generation)
High availability interconnect between multiple nodes
Rich set of available IOs, full exibility in usage model, and software stack
Dedicated subsystems for customer innovation
Increased platform security with Intel® Boot Guard for hardware-based boot integrity pro-
tection; prevention of bu󰀨er overow class security threads
Integrated solution for real-time compression, streaming write & read performance in-
creases from gen-to-gen
Hot plug and enclosure management with Intel Volume Management Device (Intel VMD)
Single standard server development (Accelerate NFV transition) consolidating application,
control, and data plane workloads, reducing total platform investment needs
1.3 Special Features
This section describes the health monitoring features of the motherboard. The motherboard has an onboard ASpeed 2500 Baseboard Management Controller (BMC) that supports system health monitoring.
Recovery from AC Power Loss
The Basic I/O System (BIOS) provides a setting that determines how the system will respond when AC power is lost and then restored to the system. You can choose for the system to
remain powered o󰀨 (in which case you must press the power switch to turn it back on), or
18
Chapter 1: Introduction
for it to automatically return to the power-on state. See the Advanced BIOS Setup section for this setting. The default setting is Last State.
1.4 System Health Monitoring
This section describes the health monitoring features of the X11DDW-L/NT motherboard. The motherboard has an onboard Baseboard Management Controller (BMC) chip that supports system health monitoring. Once a voltage becomes unstable, a warning is given or an error
message is sent to the screen. The user can adjust the voltage thresholds to dene the
sensitivity of the voltage monitor.
Onboard Voltage Monitors
The onboard voltage monitor will continuously scan crucial voltage levels. Once a voltage becomes unstable, it will give a warning or send an error message to the screen. The user
can adjust the voltage thresholds to dene the sensitivity of the voltage monitor. Real time
readings of these voltage levels are all displayed in BIOS.
Fan Status Monitor with Firmware Control
The system health monitor embedded in the BMC chip can check the RPM status of the cooling fans. The CPU and chassis fans are controlled via lPMI.
Environmental Temperature Control
System Health sensors in the BMC monitor the temperatures and voltage settings of onboard processors and the system in real time via the IPMI interface. Whenever the temperature of
the CPU or the system exceeds a user-dened threshold, system/CPU cooling fans will be
turned on to prevent the CPU or the system from overheating.
Note: To avoid possible system overheating, please be sure to provide adequate air-
ow to your system.
System Resource Alert
This feature is available when used with SuperDoctor 5®. SuperDoctor 5 is used to notify the
user of certain system events. For example, you can congure SuperDoctor 5 to provide you
with warnings when the system temperature, CPU temperatures, voltages and fan speeds
go beyond a predened range.
19
X11DDW-L/NT User's Manual
1.5 ACPI Features
ACPI stands for Advanced Conguration and Power Interface. The ACPI specication denes a exible and abstract hardware interface that provides a standard way to integrate power
management features throughout a computer system including its hardware, operating system
and application software. This enables the system to automatically turn on and o󰀨 peripherals
such as network cards, hard disk drives and printers.
In addition to enabling operating system-directed power management, ACPI also provides a generic system event mechanism for Plug and Play and an operating system-independent
interface for conguration control. ACPI leverages the Plug and Play BIOS data structures
while providing a processor architecture-independent implementation that is compatible with Windows 8, Windows 10, and Windows 2012 operating systems.
1.6 Power Supply
As with all computer products, a stable power source is necessary for proper and reliable operation. It is even more important for processors that have high CPU clock rates. In areas
where noisy power transmission is present, you may choose to install a line lter to shield
the computer from noise. It is recommended that you also install a power surge protector to help avoid problems caused by power surges.
1.7 Super I/O
The Super I/O (ASpeed AST2500 chip) provides a high-speed, 16550 compatible serial communication port (UART), which supports serial infrared communication. The UART includes send/receive FIFO, a programmable baud rate generator, complete modem control capability, and a processor interrupt system. The UART provides legacy speed with baud rate of up to 115.2 Kbps as well as an advanced speed with baud rates of 250 K, 500 K, or 1 Mb/s, supporting higher speed modems.
The Super I/O provides functions that comply with ACPI (Advanced Conguration and Power
Interface), which includes support of legacy and ACPI power management through a SMI or SCI function pin. It also features auto power management to reduce power consumption.
20
Chapter 1: Introduction
1.8 Advanced Power Management
The following new advanced power management features are supported by the motherboard.
Intel® Intelligent Power Node Manager (IPNM)
Available when the Supermicro Power Manager (SPM) is installed, Intel's Intelligent Power Node Manager (IPNM) provides your system with real-time thermal control and power
management for maximum energy e󰀩ciency. Although IPNM Specication Version 2.0/3.0
is supported by the BMC (Baseboard Management Controller), your system must also have
IPNM-compatible Management Engine (ME) rmware installed to use this feature.
Note: Support for IPNM 2.0/3.0 support is dependent on the power supply used in the system.
Management Engine (ME)
The Management Engine, which is an ARC controller embedded in the IOH (I/O Hub), provides
Server Platform Services (SPS) to your system. The services provided by SPS are di󰀨erent
from those provided by the ME on client platforms.
21
X11DDW-L/NT User's Manual
Chapter 2
Installation
2.1 Static-Sensitive Devices
Electrostatic Discharge (ESD) can damage electronic com ponents. To avoid damaging your motherboard and your system, it is important to handle it very carefully. The following
measures are generally su󰀩cient to protect your equipment from ESD.
Precautions
Use a grounded wrist strap designed to prevent static discharge.
Touch a grounded metal object before removing the board from the antistatic bag.
Handle the board by its edges only; do not touch its components, peripheral chips, memory
modules or gold contacts.
When handling chips or modules, avoid touching their pins.
Put the motherboard and peripherals back into their antistatic bags when not in use.
For grounding purposes, make sure that your chassis provides excellent conductivity be-
tween the power supply, the case, the mounting fasteners and the motherboard.
Use only the correct type of CMOS onboard battery as specied by the manufacturer. Do
not install the CMOS battery upside down, which may result in a possible explosion.
Unpacking
The motherboard is shipped in antistatic packaging to avoid static damage. When unpacking the motherboard, make sure that the person handling it is static protected.
22
Chapter 2: Installation
2.2 Motherboard Installation
All motherboards have standard mounting holes to t di󰀨erent types of chassis. Make sure
that the locations of all the mounting holes for both the motherboard and the chassis match. Although a chassis may have both plastic and metal mounting fasteners, metal ones are highly recommended because they ground the motherboard to the chassis. Make sure that
the metal stando󰀨s click in or are screwed in tightly.
Phillips Screwdriver (1)
Tools Needed
JRK1
JL1
JNVI2C2
CPU2
P2 DIMM
F1
E1
JP3
D1
P2_NVME1
P2_NVME0
Phillips Screws (7)
LE1
C
A
JUIDB1
JPME1
JPME2
JSXB1_1
JM2_1
LE3
CPU2_PORT3
SXB1B:CPU1 PCI-E 3.0 X16 + CPU2 PCI-E 3.0 X16
SXB2:CPU2 PCI-E 3.0 X16
CPU1_PORT3BCPU1_PORT3ACPU1_PORT3BCPU1_PORT3A
JSXB1_2
S-SGPIO2
CPU2_PORT2ACPU2_PORT2BCPU2_PORT2CCPU2_PORT2DCPU1_PORT3CCPU1_PORT3DCPU1_PORT3CCPU1_PORT3D
JSXB1_3
P2 DIMM
A1
BIOS LICENSE
B1
C1
SRW1
CPU2
S-SATA 0~3
MAC CODE
X11DDW-L
REV:1.02 DESIGNED IN USA
P1 DIMM
F1
E1
Stando󰀨s (7)
Only if Needed
VGA
S-SATA5
10G PHY
LEDM1
CPU1
P1 DIMM A1
JIPMB1
JPL1
JPG1
JWD1
JBR1
S-SATA4
JSTBY1
USB4/5(3.0)
JVRM1JVRM2
JTPM1
1
JBMC_DEBUG
JD1
JP2
JAOM
JF1
LE2
C1
B1
JPI2C1
USB2/3
LAN2
(3.0)
LAN1
IPMI_LAN USB0/1(3.0)
C621
BMC
JBT1
I-SATA 4~7
I-SATA 0~3
BAR CODE
BT1
CPU1
D1
JNVI2C1
P1_NVME1
JSDCARD1
P1_NVME0
+
X NMIPWR
NICHDD
NIC
UID
PWRRST ON
LED
LED
2 1
LEDPSFAIL
JPWR3
JPWR1
JPWR2
FAN4
FAN5FAN6
FAN3
FAN1
FAN2
Location of Mounting Holes
Notes: 1) To avoid damaging the motherboard and its components, please do not use
a force greater than 8 lb/inch on each mounting screw during motherboard installation.
2) Some components are very close to the mounting holes. Please take precautionary measures to avoid damaging these components when installing the motherboard to the chassis.
23
X11DDW-L/NT User's Manual
Installing the Motherboard
1. Install the I/O shield into the back of the chassis.
2. Locate the mounting holes on the motherboard. See the previous page for the location.
3. Locate the matching mounting holes on the chassis. Align the mounting holes on the motherboard against the mounting holes on the chassis.
4. Install stando󰀨s in the chassis as needed.
5. Install the motherboard into the chassis carefully to avoid damaging other motherboard components.
6. Using the Phillips screwdriver, insert a Phillips head #6 screw into a mounting hole on the motherboard and its matching mounting hole on the chassis.
7. Repeat Step 5 to insert #6 screws into all mounting holes.
8. Make sure that the motherboard is securely placed in the chassis.
Note: Images displayed in this manual are for illustration only. Your chassis or
components might look di󰀨erent from those shown in this manual.
24
Chapter 2: Installation
2.3 Processor and Heatsink Installation
Warning: When handling the processor package, avoid placing direct pressure on the label
area of the fan. Also, improper CPU installation or socket misalignment can cause serious damage to the CPU or the motherboard that will require RMA repairs. Please read and follow all instructions thoroughly before installing your CPU and heatsink.
Notes:
Always connect the power cord last, and always remove it before adding, removing or
changing any hardware components. Make sure that you install the processor into the CPU socket before you install the CPU heatsink.
If you buy a CPU separately, make sure that you use an Intel-certied multi-directional
heatsink only.
Make sure to install the motherboard into the chassis before you install the CPU heatsink.
When receiving a motherboard without a processor pre-installed, make sure that the plastic
CPU socket cap is in place and none of the socket pins are bent; otherwise, contact your retailer immediately.
Refer to the Supermicro website for updates on CPU support.
The Processor
(The 81xx/61xx/51xx/41xx/31xx Processor)
Note: All graphics, drawings and pictures shown in this manual are for illustration only.
The components that came with your machine may or may not look exactly the same as those shown in this manual.
25
X11DDW-L/NT User's Manual
Overview of the Processor Socket Assembly
The processor socket assembly contains 1) the 81/xx/61xx/51xx/41xx/31xx processor, 2) CPU/heatsink carrier, 3) dust cover, and 4) CPU socket.
1. The 81xx/61xx/51xx/41xx/31xx Processor
2. CPU/Heatsink Carrier
3. Dust Cover
4. CPU Socket
WARNING!
CPU Socket Assembly
Note: Be sure to cover the CPU socket with the dust cover when the CPU is not in-
stalled.
26
Chapter 2: Installation
Overview of the Processor Heatsink Module
The processor heatsink module (PHM) contains 1) a passive heatsink, 2) a CPU/heatsink carrier, and 3) the 81/xx/61xx/51xx/41xx/31xx processor.
1. Passive Heatsink
2. CPU/Heatsink Carrier
3. 81/xx/61xx/51xx/41xx/31xx processor
Processor Heatsink Module
(Bottom View)
27
X11DDW-L/NT User's Manual
Preparing the CPU Socket for Installation
This motherboard comes with the CPU socket pre-assembled in the factory. The CPU socket contains 1) a dust cover, 2) a socket bracket, 3) the CPU (LGA3647) socket, and 4) a back plate. These components are pre-installed on the motherboard before shipping.
Processor Socket Assembly
Removing the Dust Cover from the CPU Socket
Remove the dust cover from the CPU socket, exposing the LGA3647 socket and socket pins as shown on the illustration below.
Note: Do not touch the socket pins to avoid damaging them, causing the CPU to malfunction.
WARNING!
Socket Cover
Socket Pins
LGA3647 Socket
28
Chapter 2: Installation
Attaching the Processor to the CPU/Heatsink Carrier
To properly install the CPU onto the CPU/heatsink carrier, please follow the steps below.
1. Locate Pin 1 (Notch A), Notch B, and Notch C on the CPU and locate Pin 1 (Notch A), Notch B, and Notch C on the CPU/heatsink carrier.
2. Align Pin 1 (Notch A), Notch B, and Notch C on the CPU with the corresponding notches on the carrier. Once they are aligned, carefully insert the CPU into the carrier until you hear a click. Once the CPU is properly mounted onto the carrier, the CPU/ carrier assembly is made.
Pin 1
CPU (Upside Down)
Align CPU Notch C and Clip C
A
A
B
Align CPU Pin 1
Align CPU Notch B and Clip B
C
A
B
C
Allow Clip B to Latch on to CPU
Package Carrier (Upside Down)
B
C
Allow Clip C to Latch on to CPU
CPU Mounted on Package Carrier (Upside Down)
CPU Mounted on Package Carrier (Rightside Up)
29
X11DDW-L/NT User's Manual
Attaching the CPU/Carrier Assembly to the Passive Heatsink to
Form the Processor Heatsink Module (PHM)
After you have made a CPU/carrier assembly, please follow the steps below to mount the assembly onto the heatsink to create the Processor Heatsink Module (PHM).
1. Place the heatsink upside down with the thermal grease facing up. Locate two larger
mounting holes (A, B) at the diagonal corners of the heatsink, and two smaller mounting holes (C, D) on the heatsink.
2. Hold the CPU/carrier at the center edge, and turn it upside down with the CPU pins
facing up. Locate the two larger holes (1, 2) at the diagonal corners of the carrier and the smaller holes of the same size (3, 4) on the carrier. Please note the mounting clips located next to every mounting hole on the carrier.
3. Align the larger holes (1, 2) on the
carrier against the larger mounting holes (A, B) on the heatsink and smaller holes (3, 4) on the carrier against the smaller mounting holes (C, D) on the heatsink. Insert the mounting clips next to the larger hole on the carrier into the larger mounting hole on the heatsink (1 A, 2 B) and snap the mounting clips next to the smaller holes on the carrier onto the edges of the heatsink next to the smaller holes (3 C, 4 D) making sure that the mounting clips snap into place, and that the CPU/carrier assembly is properly mounted onto the heatsink. By mounting the CPU/carrier assembly to the heatsink, the Processor Heatsink Module (PHM) is assembled.
CPU and Carrier Package
(Upside Down)
Mounting Clips
CPU and Carrier Package
(Upside Down)
4
D
Heatsink
(Upside Down)
D
Mounting Clips
2
1
B
A
B
CPU and Carrier Package
(Rightside Up)
Mounting Clips
3
c
Thermal paste
On Locations (C, D), the clips snap onto the heatsink’s sides
c
30
On Locations of (A, B), the clips snap through the heatsink’s mounting holes
A
Make sure Mounting Clips snap into place
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