The information in this User’s Manual has been carefully reviewed and is believed to be accurate. The vendor assumes
no responsibility for any inaccuracies that may be contained in this document, and makes no commitment to update
or to keep current the information in this manual, or to notify any person or organization of the updates. Please Note:
For the most up-to-date version of this manual, please see our website at www.supermicro.com.
Super Micro Computer, Inc. ("Supermicro") reserves the right to make changes to the product described in this manual
at any time and without notice. This product, including software and documentation, is the property of Supermicro and/
or its licensors, and is supplied only under a license. Any use or reproduction of this product is not allowed, except
as expressly permitted by the terms of said license.
IN NO EVENT WILL Super Micro Computer, Inc. BE LIABLE FOR DIRECT, INDIRECT, SPECIAL, INCIDENTAL,
SPECULATIVE OR CONSEQUENTIAL DAMAGES ARISING FROM THE USE OR INABILITY TO USE THIS PRODUCT
OR DOCUMENTATION, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. IN PARTICULAR, SUPER
MICRO COMPUTER, INC. SHALL NOT HAVE LIABILITY FOR ANY HARDWARE, SOFTWARE, OR DATA STORED
OR USED WITH THE PRODUCT, INCLUDING THE COSTS OF REPAIRING, REPLACING, INTEGRATING,
INSTALLING OR RECOVERING SUCH HARDWARE, SOFTWARE, OR DATA.
Any disputes arising between manufacturer and customer shall be governed by the laws of Santa Clara County in the
State of California, USA. The State of California, County of Santa Clara shall be the exclusive venue for the resolution
of any such disputes. Supermicro's total liability for all claims will not exceed the price paid for the hardware product.
FCC Statement: This equipment has been tested and found to comply with the limits for a Class A digital device
pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful
interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can
radiate radio frequency energy and, if not installed and used in accordance with the manufacturer’s instruction manual,
may cause harmful interference with radio communications. Operation of this equipment in a residential area is likely
to cause harmful interference, in which case you will be required to correct the interference at your own expense.
California Best Management Practices Regulations for Perchlorate Materials: This Perchlorate warning applies only
to products containing CR (Manganese Dioxide) Lithium coin cells. “Perchlorate Material-special handling may apply.
See www.dtsc.ca.gov/hazardouswaste/perchlorate”.
WARNING: Handling of lead solder materials used in this product may expose you to lead, a
chemical known to the State of California to cause birth defects and other reproductive harm.
The products sold by Supermicro are not intended for and will not be used in life support systems, medical equipment,
nuclear facilities or systems, aircraft, aircraft devices, aircraft/emergency communication devices or other critical
systems whose failure to perform be reasonably expected to result in signicant injury or loss of life or catastrophic
property damage. Accordingly, Supermicro disclaims any and all liability, and should buyer use or sell such products
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Manual Revision 1.0a
Release Date: August 14, 2017
Unless you request and receive written permission from Super Micro Computer, Inc., you may not copy any part of this
document. Information in this document is subject to change without notice. Other products and companies referred
to herein are trademarks or registered trademarks of their respective companies or mark holders.
This manual is written for system integrators, IT technicians, and knowledgeable end users.
It provides information for the installation and use of the X11DDW-L/NT motherboard.
About This Motherboard
The Super X11DDW-L/NT motherboard supports dual Intel Xeon 81xx/61xx/51xx/41xx/31xx
series processors (Socket P -F) with a TDP (Thermal Design Power) of up to 205W and a
QPI (QuickPath Interconnect) of up to 10.4GT/s. Built with the Intel® C621/C622 PCH, this
motherboard supports 1536GB Registered ECC DDR4 in 12 memory slots. It oers support for
Intel Intelligent Power Node Manager, Active Management Technology, and vPro technology.
The X11DDW-L/NT includes four NVMe connectors, slots for riser card support, fourteen
SATA 3.0 ports, and dual LAN and USB 3.0 ports. The X11DDW-L/NT provides maximum
performance, system cooling, and PCI-E capacity. This motherboard is optimized for PCI-
Express expansion with exible IO support, and is ideal for general-purpose server platforms.
Please note that this motherboard is intended to be installed and serviced by professional
technicians only. For processor/memory updates, please refer to our website at http://www.
supermicro.com/products/.
Manual organization
Chapter 1 describes the features, specications and performance of the motherboard, and
provides detailed information on the Intel C621/C622 chipsets.
Chapter 2 provides hardware installation instructions. Read this chapter when installing the
processor, memory modules and other hardware components into the system.
If you encounter any problems, see Chapter 3, which describes troubleshooting procedures
for video, memory and system setup stored in the CMOS.
Chapter 4 includes an introduction to the BIOS, and provides detailed information on running
the CMOS Setup utility.
Appendix A provides BIOS Error Beep Codes.
Appendix B lists software program installation instructions.
Appendix C lists standardized warning statements in various languages.
Appendix D contains UEFI BIOS Recovery instructions.
Congratulations on purchasing your computer motherboard from an industry leader.
Supermicro motherboards are designed to provide you with the highest standards in quality
and performance.
In addition to the motherboard, several important parts that are included with your shipment
are listed below. If anything listed is damaged or missing, please contact your retailer.
1.1 Checklist
Main Parts List
DescriptionPart NumberQuantity
Supermicro MotherboardX11DDW-L/NT1
SATA CablesCBL-0044L2
Quick Reference GuideMNL-1907-QRG1
Important Links
For your system to work properly, please follow the links below to download all necessary
drivers/utilities and the user’s manual for your server.
• If you have any questions, please contact our support team at: support@supermicro.com
This manual may be periodically updated without notice. Please check the Supermicro website
for possible updates to the manual revision level.
8
Figure 1-1. Motherboard Image
Chapter 1: Introduction
Lorem ipsum
Note: All graphics shown in this manual were based upon the latest PCB revision
available at the time of publication of the manual. The motherboard you received may
or may not look exactly the same as the graphics shown in this manual.
Note: The table above is continued on the next page.
15
X11DDW-L/NT User's Manual
Dimensions
• 12" (L) x 13" (W) (30.48 mm x 33.02 mm)
Note 1: The CPU maximum thermal design power (TDP) is subject to chassis and
heatsink cooling restrictions. For proper thermal management, please check the chas-
sis and heatsink specications for proper CPU TDP sizing.
Note 2: For IPMI conguration instructions, please refer to the Embedded IPMI Conguration User's Guide available at http://www.supermicro.com/support/manuals/.
Note 3: It is strongly recommended that you change BMC log-in information upon initial
system power-on. The manufacture default username is ADMIN and the password is
ADMIN. For proper BMC conguration, please refer to http://www.supermicro.com/
products/info/les/IPMI/Best_Practices_BMC_Security.pdf
Motherboard Features
16
Figure 1-3.
System Block Diagram
Chapter 1: Introduction
RJ45
DDR4
BMC Boot Flash
BIOS
(OPTION)
VGA CONN
LUIO
PCI-E X16 G3
JAOM
2 x NVME
RJ45
10G/1G
RJ45
10G/1G
LAN3
RTL8211E-VB-CG
SPI
SPI
VCCP0 12v
VR13
5+1 PHASE
205W
VCCP0-(F)
CPU1CPU2
SOCKET ID : 0
#3
#2
UPI
10.4/11.2G
P1
P0
UPI
P1
PECI : 30PECI : 31
DMI3
#1B#1A
UPI
P0
P2P2
#1A
PCI-E X8 G3
#1B #2 #3
#E-0
#D-0
#C-0
#B-0
#A-0
DDRIV
2133/2666
PCI-E X16 G3
#F-0
(LANE REVERSE)
(LANE REVERSE)
PCI-E X4 + X4 G3
LAN 10G/1G
X557-AT2/88E1512
RGRMII
BMC
AST2500
RMII/NCSI
PCI-E X1 G2
USB 2.0
ESPI
ESPI
Header
DMI3
KR/KX
INTEL
PCH
X8 UPLINK NO QAT (~15W)
X8 UPLINK NO QAT (~17W)
#5
#12
USB2.0
TPM HEADER
Debug Card
PCI-E X4 + X4 G3
6.0 Gb/S
USB 2.0
USB 3.0
SPI
BIOS
SYSTEM POWER
Temp Sensor
EMC1402-1 *2 at diff SMBUS
FRONT PANEL
FAN SPEED
CTRL
Note: ports available on the (-NT) model only.
4 x NVME (2+2)
VCCP1 12v
VR13
5+1 PHASE
205W
VCCP1
SOCKET ID : 1
PCI-E X8 G3
#1
#0
#M-0
#L-0
#K-0
#J-0
#H-0
#G-0
DMI3
DDRIV
2133/2666
(LANE REVERSE)PCI-E X16 G3
(LANE REVERSE)PCI-E X16 G3
RUIO
LUIO
NA
2 x NVME
#12
#11
#10
Rear x4
Header x2
iPass 4x3
SuperDOM x2
#13
SATA
#9
#8
#7
#6
#5
#4
#3
#2
SATA
USB
USB
Note: This is a general block diagram and may not exactly represent the features on
your motherboard. See the previous pages for the actual specications of your motherboard.
17
X11DDW-L/NT User's Manual
1.2 Processor and Chipset Overview
Built upon the functionality and capability of the Dual Intel Xeon 81xx/61xx/51xx/41xx/31xx
series processors (Socket P) and the Intel C621/C622 chipsets, the X11DDW-L/NT
motherboard provides system performance, power eciency, and feature sets to address
the needs of next-generation computer users. With features like a 6-channel DDR4 memory
controller and up to 28 cores with Hyper-Threading technology, the X11DDW-L/NT provides
maximum performance, system cooling, and PCI-E capacity. This motherboard is optimized
for general purpose server platforms.
The Intel Xeon 81xx/61xx/51xx/41xx/31xx series processor and the Intel C621/C622 PCH
support the following features:
• Intel® AVX-512 support with memory bandwidth increase to 6 channels (x1.5 from the
previous generation)
• High availability interconnect between multiple nodes
• Rich set of available IOs, full exibility in usage model, and software stack
• Dedicated subsystems for customer innovation
• Increased platform security with Intel® Boot Guard for hardware-based boot integrity pro-
tection; prevention of buer overow class security threads
• Hot plug and enclosure management with Intel Volume Management Device (Intel VMD)
• Single standard server development (Accelerate NFV transition) consolidating application,
control, and data plane workloads, reducing total platform investment needs
1.3 Special Features
This section describes the health monitoring features of the motherboard. The motherboard
has an onboard ASpeed 2500 Baseboard Management Controller (BMC) that supports system
health monitoring.
Recovery from AC Power Loss
The Basic I/O System (BIOS) provides a setting that determines how the system will respond
when AC power is lost and then restored to the system. You can choose for the system to
remain powered o (in which case you must press the power switch to turn it back on), or
18
Chapter 1: Introduction
for it to automatically return to the power-on state. See the Advanced BIOS Setup section
for this setting. The default setting is Last State.
1.4 System Health Monitoring
This section describes the health monitoring features of the X11DDW-L/NT motherboard. The
motherboard has an onboard Baseboard Management Controller (BMC) chip that supports
system health monitoring. Once a voltage becomes unstable, a warning is given or an error
message is sent to the screen. The user can adjust the voltage thresholds to dene the
sensitivity of the voltage monitor.
Onboard Voltage Monitors
The onboard voltage monitor will continuously scan crucial voltage levels. Once a voltage
becomes unstable, it will give a warning or send an error message to the screen. The user
can adjust the voltage thresholds to dene the sensitivity of the voltage monitor. Real time
readings of these voltage levels are all displayed in BIOS.
Fan Status Monitor with Firmware Control
The system health monitor embedded in the BMC chip can check the RPM status of the
cooling fans. The CPU and chassis fans are controlled via lPMI.
Environmental Temperature Control
System Health sensors in the BMC monitor the temperatures and voltage settings of onboard
processors and the system in real time via the IPMI interface. Whenever the temperature of
the CPU or the system exceeds a user-dened threshold, system/CPU cooling fans will be
turned on to prevent the CPU or the system from overheating.
Note: To avoid possible system overheating, please be sure to provide adequate air-
ow to your system.
System Resource Alert
This feature is available when used with SuperDoctor 5®. SuperDoctor 5 is used to notify the
user of certain system events. For example, you can congure SuperDoctor 5 to provide you
with warnings when the system temperature, CPU temperatures, voltages and fan speeds
go beyond a predened range.
19
X11DDW-L/NT User's Manual
1.5 ACPI Features
ACPI stands for Advanced Conguration and Power Interface. The ACPI specication denes
a exible and abstract hardware interface that provides a standard way to integrate power
management features throughout a computer system including its hardware, operating system
and application software. This enables the system to automatically turn on and o peripherals
such as network cards, hard disk drives and printers.
In addition to enabling operating system-directed power management, ACPI also provides a
generic system event mechanism for Plug and Play and an operating system-independent
interface for conguration control. ACPI leverages the Plug and Play BIOS data structures
while providing a processor architecture-independent implementation that is compatible with
Windows 8, Windows 10, and Windows 2012 operating systems.
1.6 Power Supply
As with all computer products, a stable power source is necessary for proper and reliable
operation. It is even more important for processors that have high CPU clock rates. In areas
where noisy power transmission is present, you may choose to install a line lter to shield
the computer from noise. It is recommended that you also install a power surge protector to
help avoid problems caused by power surges.
1.7 Super I/O
The Super I/O (ASpeed AST2500 chip) provides a high-speed, 16550 compatible serial
communication port (UART), which supports serial infrared communication. The UART
includes send/receive FIFO, a programmable baud rate generator, complete modem control
capability, and a processor interrupt system. The UART provides legacy speed with baud
rate of up to 115.2 Kbps as well as an advanced speed with baud rates of 250 K, 500 K, or
1 Mb/s, supporting higher speed modems.
The Super I/O provides functions that comply with ACPI (Advanced Conguration and Power
Interface), which includes support of legacy and ACPI power management through a SMI
or SCI function pin. It also features auto power management to reduce power consumption.
20
Chapter 1: Introduction
1.8 Advanced Power Management
The following new advanced power management features are supported by the motherboard.
Intel® Intelligent Power Node Manager (IPNM)
Available when the Supermicro Power Manager (SPM) is installed, Intel's Intelligent Power
Node Manager (IPNM) provides your system with real-time thermal control and power
management for maximum energy eciency. Although IPNM Specication Version 2.0/3.0
is supported by the BMC (Baseboard Management Controller), your system must also have
IPNM-compatible Management Engine (ME) rmware installed to use this feature.
Note: Support for IPNM 2.0/3.0 support is dependent on the power supply used in
the system.
Management Engine (ME)
The Management Engine, which is an ARC controller embedded in the IOH (I/O Hub), provides
Server Platform Services (SPS) to your system. The services provided by SPS are dierent
from those provided by the ME on client platforms.
21
X11DDW-L/NT User's Manual
Chapter 2
Installation
2.1 Static-Sensitive Devices
Electrostatic Discharge (ESD) can damage electronic com ponents. To avoid damaging
your motherboard and your system, it is important to handle it very carefully. The following
measures are generally sucient to protect your equipment from ESD.
Precautions
• Use a grounded wrist strap designed to prevent static discharge.
• Touch a grounded metal object before removing the board from the antistatic bag.
• Handle the board by its edges only; do not touch its components, peripheral chips, memory
modules or gold contacts.
• When handling chips or modules, avoid touching their pins.
• Put the motherboard and peripherals back into their antistatic bags when not in use.
• For grounding purposes, make sure that your chassis provides excellent conductivity be-
tween the power supply, the case, the mounting fasteners and the motherboard.
• Use only the correct type of CMOS onboard battery as specied by the manufacturer. Do
not install the CMOS battery upside down, which may result in a possible explosion.
Unpacking
The motherboard is shipped in antistatic packaging to avoid static damage. When unpacking
the motherboard, make sure that the person handling it is static protected.
22
Chapter 2: Installation
2.2 Motherboard Installation
All motherboards have standard mounting holes to t dierent types of chassis. Make sure
that the locations of all the mounting holes for both the motherboard and the chassis match.
Although a chassis may have both plastic and metal mounting fasteners, metal ones are
highly recommended because they ground the motherboard to the chassis. Make sure that
the metal standos click in or are screwed in tightly.
Notes: 1) To avoid damaging the motherboard and its components, please do not use
a force greater than 8 lb/inch on each mounting screw during motherboard installation.
2) Some components are very close to the mounting holes. Please take precautionary
measures to avoid damaging these components when installing the motherboard to
the chassis.
23
X11DDW-L/NT User's Manual
Installing the Motherboard
1. Install the I/O shield into the back of the chassis.
2. Locate the mounting holes on the motherboard. See the previous page for the location.
3. Locate the matching mounting holes on the chassis. Align the mounting holes on the
motherboard against the mounting holes on the chassis.
4. Install standos in the chassis as needed.
5. Install the motherboard into the chassis carefully to avoid damaging other motherboard
components.
6. Using the Phillips screwdriver, insert a Phillips head #6 screw into a mounting hole on
the motherboard and its matching mounting hole on the chassis.
7. Repeat Step 5 to insert #6 screws into all mounting holes.
8. Make sure that the motherboard is securely placed in the chassis.
Note: Images displayed in this manual are for illustration only. Your chassis or
components might look dierent from those shown in this manual.
24
Chapter 2: Installation
2.3 Processor and Heatsink Installation
Warning: When handling the processor package, avoid placing direct pressure on the label
area of the fan. Also, improper CPU installation or socket misalignment can cause serious
damage to the CPU or the motherboard that will require RMA repairs. Please read and follow
all instructions thoroughly before installing your CPU and heatsink.
Notes:
• Always connect the power cord last, and always remove it before adding, removing or
changing any hardware components. Make sure that you install the processor into the
CPU socket before you install the CPU heatsink.
• If you buy a CPU separately, make sure that you use an Intel-certied multi-directional
heatsink only.
• Make sure to install the motherboard into the chassis before you install the CPU heatsink.
• When receiving a motherboard without a processor pre-installed, make sure that the plastic
CPU socket cap is in place and none of the socket pins are bent; otherwise, contact your
retailer immediately.
• Refer to the Supermicro website for updates on CPU support.
The Processor
(The 81xx/61xx/51xx/41xx/31xx Processor)
Note: All graphics, drawings and pictures shown in this manual are for illustration only.
The components that came with your machine may or may not look exactly the same
as those shown in this manual.
25
X11DDW-L/NT User's Manual
Overview of the Processor Socket Assembly
The processor socket assembly contains 1) the 81/xx/61xx/51xx/41xx/31xx processor, 2)
CPU/heatsink carrier, 3) dust cover, and 4) CPU socket.
1. The 81xx/61xx/51xx/41xx/31xx Processor
2. CPU/Heatsink Carrier
3. Dust Cover
4. CPU Socket
WARNING!
CPU Socket Assembly
Note: Be sure to cover the CPU socket with the dust cover when the CPU is not in-
stalled.
26
Chapter 2: Installation
Overview of the Processor Heatsink Module
The processor heatsink module (PHM) contains 1) a passive heatsink, 2) a CPU/heatsink
carrier, and 3) the 81/xx/61xx/51xx/41xx/31xx processor.
1. Passive Heatsink
2. CPU/Heatsink Carrier
3. 81/xx/61xx/51xx/41xx/31xx processor
Processor Heatsink Module
(Bottom View)
27
X11DDW-L/NT User's Manual
Preparing the CPU Socket for Installation
This motherboard comes with the CPU socket pre-assembled in the factory. The CPU socket
contains 1) a dust cover, 2) a socket bracket, 3) the CPU (LGA3647) socket, and 4) a back
plate. These components are pre-installed on the motherboard before shipping.
Processor Socket Assembly
Removing the Dust Cover from the CPU Socket
Remove the dust cover from the CPU socket, exposing the LGA3647 socket and socket pins
as shown on the illustration below.
Note: Do not touch the socket pins to avoid damaging them, causing the CPU to
malfunction.
WARNING!
Socket Cover
Socket Pins
LGA3647 Socket
28
Chapter 2: Installation
Attaching the Processor to the CPU/Heatsink Carrier
To properly install the CPU onto the CPU/heatsink carrier, please follow the steps below.
1. Locate Pin 1 (Notch A), Notch B, and Notch C on the CPU and locate Pin 1 (Notch A),
Notch B, and Notch C on the CPU/heatsink carrier.
2. Align Pin 1 (Notch A), Notch B, and Notch C on the CPU with the corresponding
notches on the carrier. Once they are aligned, carefully insert the CPU into the carrier
until you hear a click. Once the CPU is properly mounted onto the carrier, the CPU/
carrier assembly is made.
Pin 1
CPU
(Upside Down)
Align CPU Notch C
and Clip C
A
A
B
Align CPU Pin 1
Align CPU Notch B
and Clip B
C
A
B
C
Allow Clip B to
Latch on to CPU
Package Carrier
(Upside Down)
B
C
Allow Clip C to
Latch on to CPU
CPU Mounted on
Package Carrier
(Upside Down)
CPU Mounted on
Package Carrier
(Rightside Up)
29
X11DDW-L/NT User's Manual
Attaching the CPU/Carrier Assembly to the Passive Heatsink to
Form the Processor Heatsink Module (PHM)
After you have made a CPU/carrier assembly, please follow the steps below to mount the
assembly onto the heatsink to create the Processor Heatsink Module (PHM).
1. Place the heatsink upside down with the thermal grease facing up. Locate two larger
mounting holes (A, B) at the diagonal corners of the heatsink, and two smaller mounting
holes (C, D) on the heatsink.
2. Hold the CPU/carrier at the center edge, and turn it upside down with the CPU pins
facing up. Locate the two larger holes (1, 2) at the diagonal corners of the carrier and
the smaller holes of the same size (3, 4) on the carrier. Please note the mounting clips
located next to every mounting hole on the carrier.
3. Align the larger holes (1, 2) on the
carrier against the larger mounting holes
(A, B) on the heatsink and smaller holes
(3, 4) on the carrier against the smaller
mounting holes (C, D) on the heatsink.
Insert the mounting clips next to the
larger hole on the carrier into the larger
mounting hole on the heatsink (1 A,
2 B) and snap the mounting clips next
to the smaller holes on the carrier onto
the edges of the heatsink next to the
smaller holes (3 C, 4 D) making sure
that the mounting clips snap into place,
and that the CPU/carrier assembly is
properly mounted onto the heatsink. By
mounting the CPU/carrier assembly to
the heatsink, the Processor Heatsink
Module (PHM) is assembled.
CPU and Carrier Package
(Upside Down)
Mounting
Clips
CPU and Carrier Package
(Upside Down)
4
D
Heatsink
(Upside Down)
D
Mounting
Clips
2
1
B
A
B
CPU and Carrier Package
(Rightside Up)
Mounting
Clips
3
c
Thermal paste
On Locations (C, D), the
clips snap onto
the heatsink’s sides
c
30
On Locations of (A, B), the
clips snap through the heatsink’s
mounting holes
A
Make sure Mounting
Clips snap into place
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