The information in this user’s manual has been carefully reviewed and is believed to be accurate. The vendor assumes
no responsibility for any inaccuracies that may be contained in this document, and makes no commitment to update
or to keep current the information in this manual, or to notify any person or organization of the updates. Please Note:
For the most up-to-date version of this manual, please see our website at www.supermicro.com.
Super Micro Computer, Inc. ("Supermicro") reserves the right to make changes to the product described in this manual
at any time and without notice. This product, including software and documentation, is the property of Supermicro and/
or its licensors, and is supplied only under a license. Any use or reproduction of this product is not allowed, except
as expressly permitted by the terms of said license.
IN NO EVENT WILL Super Micro Computer, Inc. BE LIABLE FOR DIRECT, INDIRECT, SPECIAL, INCIDENTAL,
SPECULATIVE OR CONSEQUENTIAL DAMAGES ARISING FROM THE USE OR INABILITY TO USE THIS PRODUCT
OR DOCUMENTATION, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. IN PARTICULAR, SUPER
MICRO COMPUTER, INC. SHALL NOT HAVE LIABILITY FOR ANY HARDWARE, SOFTWARE, OR DATA STORED
OR USED WITH THE PRODUCT, INCLUDING THE COSTS OF REPAIRING, REPLACING, INTEGRATING,
INSTALLING OR RECOVERING SUCH HARDWARE, SOFTWARE, OR DATA.
Any disputes arising between manufacturer and customer shall be governed by the laws of Santa Clara County in the
State of California, USA. The State of California, County of Santa Clara shall be the exclusive venue for the resolution
of any such disputes. Supermicro's total liability for all claims will not exceed the price paid for the hardware product.
FCC Statement: This equipment has been tested and found to comply with the limits for a Class A digital device
pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful
interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can
radiate radio frequency energy and, if not installed and used in accordance with the manufacturer’s instruction manual,
may cause harmful interference with radio communications. Operation of this equipment in a residential area is likely
to cause harmful interference, in which case you will be required to correct the interference at your own expense.
California Best Management Practices Regulations for Perchlorate Materials: This Perchlorate warning applies only
to products containing CR (Manganese Dioxide) Lithium coin cells. “Perchlorate Material-special handling may apply.
See www.dtsc.ca.gov/hazardouswaste/perchlorate”.
WARNING: Handling of lead solder materials used in this product may expose you to lead, a
chemical known to the State of California to cause birth defects and other reproductive harm.
The products sold by Supermicro are not intended for and will not be used in life support systems, medical equipment,
nuclear facilities or systems, aircraft, aircraft devices, aircraft/emergency communication devices or other critical
systems whose failure to perform be reasonably expected to result in signicant injury or loss of life or catastrophic
property damage. Accordingly, Supermicro disclaims any and all liability, and should buyer use or sell such products
for use in such ultra-hazardous applications, it does so entirely at its own risk. Furthermore, buyer agrees to fully
indemnify, defend and hold Supermicro harmless for and against any and all claims, demands, actions, litigation, and
proceedings of any kind arising out of or related to such ultra-hazardous use or sale.
Manual Revision 1.0
Release Date: December 04, 2017
Unless you request and receive written permission from Super Micro Computer, Inc., you may not copy any part of this
document. Information in this document is subject to change without notice. Other products and companies referred
to herein are trademarks or registered trademarks of their respective companies or mark holders.
This manual is written for system integrators, IT technicians and knowledgeable end users.
It provides information for the installation and use of the A2SDi-H-TP4F/TF motherboard.
About This Motherboard
The Supermicro A2SDi-H-TP4F/TF motherboard comes with an integrated Intel® Atom
SoC C3000 series (FCBGA1310) that has up to 16 Cores, a TDP of 32W and is optimized
for low-power consumption. The integrated memory controller supports up to 256GB of
DDR4 ECC memory with a max data rate of 2400MHz, USB 3.0, and 10GbE Ethernet. The
A2SDi-H-TP4F/TF motherboard is an excellent choice for embedded storage solutions.
Please note that this motherboard is intended to be installed and serviced by professional
technicians only.
For processor/memory updates, please refer to our website at http://www.supermicro.com/
products/.
Conventions Used in the Manual
Special attention should be given to the following symbols for proper installation and to prevent
damage done to the components or injury to yourself:
Warning! Indicates important information given to prevent equipment/property damage
or personal injury.
Warning! Indicates high voltage may be encountered when performing a procedure.
Important: Important information given to ensure proper system installation or to
relay safety precautions.
Note: Additional Information given to differentiate various models or provides information for correct system setup.
Congratulations on purchasing your computer motherboard from an industry leader. Supermicro
boards are designed to provide you with the highest standards in quality and performance.
In additon to the motherboard and chassis, several important parts that are included with the
system are listed below. If anything listed is damaged or missing, please contact your retailer.
1.1 Checklist
Main Parts List
DescriptionPart NumberQuantity
Supermicro MotherboardMBD-A2SDi-H-TP4F/TF1
Quick Reference Guide (QRG)MNL-1861-QRG1
SATA CablesCBL-0044L4
SATA CablesCBL-SAST-06162
I/O ShieldMCP-260-00098-0N1
Important Links
For your system to work properly, please follow the links below to download all necessary
drivers/utilities and the user’s manual for your server.
• If you have any questions, please contact our support team at: support@supermicro.com
This manual may be periodically updated without notice. Please check the Supermicro website
for possible updates to the manual revision level.
8
Figure 1-1. A2SDi-H-TP4F Motherboard Image
Chapter 1: Introduction
Note: All graphics shown in this manual were based upon the latest PCB revision
available at the time of publication of the manual. The motherboard you received may
or may not look exactly the same as the graphics shown in this manual.
• One (1) Dedicated IPMI LAN port located on the rear IO back panel
Graphics
• Graphics controller via ASpeed 2400 BMC
I/O Devices
• Serial (COM) Port
• SATA 3.0 Ports
• One (1) serial port header
• Twelve (12) SATA 3.0 ports (four ports, eight ports via miniSAS)
Peripheral Devices
• Two (2) USB 2.0 ports on the rear I/O panel (USB0/1)
• One (1) internal USB 2.0 header with two (2) USB connections each for front access (USB2/3)
• One (1) USB 3.0 Type A Port (USB4)
BIOS
• 128 Mb SPI AMI BIOS
®
SM Flash UEFI BIOS
• ACPI 4.0, USB keyboard, Plug-and-Play (PnP), SPI quad speed support, Riser card auto detection support, RTC (Real
Time Clock) wakeup, Dual Boot Block support, and SMBIOS 2.7
Note: The table above is continued on the next page.
15
A2SDi-H-TP4F/TF User's Manual
Motherboard Features
Power Management
• Main switch override mechanism
• Power-on mode for AC power recovery
• ACPI power management
• S5 support
• Wake-on-Ring, Wake-on-LAN
• Management Engine (ME)
System Health Monitoring
• Onboard voltage monitoring for +3.3V, 3.3V Standby, +5V, +5V Standby, +12V, VBAT, Memory, SoC Temp., System Temp.,
Memory Temp.
• CPU/system overheat LED and control
• CPU Thermal Trip support
• Status monitor for speed control
• Status monitor for on/off control
• CPU Thermal Design Power (TDP) support of up to 32W (See Note 1 on next page.)
Fan Control
• Fan status monitoring via IPMI connections
• Dual cooling zone
• Low-noise fan speed control
• Pulse Width Modulation (PWM) fan control
System Management
• Trusted Platform Module (TPM) support
• PECI (Platform Environment Control Interface) 2.0 support
• UID (Unit Identication)/Remote UID
• System resource alert via SuperDoctor® 5
• SuperDoctor® 5, Watch Dog, NMI
• Chassis intrusion header and detection
LED Indicators
• CPU/Overheating
• Power/Suspend-state indicator LED
• Fan Failure
• UID/Remote UID.
• HDD activity. LAN activity.
Dimensions
• 6.7" (L) x 6.7" (W) (170.18 mm x 170.18 mm)
16
Chapter 1: Introduction
Note 1: The CPU maximum thermal design power (TDP) is subject to chassis and
heatsink cooling restrictions. For proper thermal management, please check the chas-
sis and heatsink specications for proper CPU TDP sizing.
Note 2: For IPMI conguration instructions, please refer to the Embedded IPMI Conguration User's Guide available at http://www.supermicro.com/support/manuals/.
Note 3: It is strongly recommended that you change BMC log-in information upon initial
system power-on. The manufacture default username is ADMIN and the password is
ADMIN. For proper BMC conguration, please refer to https://www.supermicro.com/
Note: This is a general block diagram and may not exactly represent the features on
your motherboard. See the previous pages for the actual specications of your motherboard.
18
Chapter 1: Introduction
1.2 Processor Overview
Built upon the functionality and capability of the Intel® Atom SoC C3000 series processor, the
A2SDi-H-TP4F/TF motherboard offers maximum I/O expandability, energy efciency, and data
reliability in a 14-nm process architecture, and is optimized for embedded storage solutions
The A2SDi-H-TP4F/TF supports the following features:
• Intel QuickAssist Technology
• Intel Manageability Engine
• Congurable TDP (cTDP) and Lower-Power Mode
• Adaptive Thermal Management/Monitoring
• PCI-E 3.0 Connectivity
• 10GbE Ethernet
• System Management Bus (SMBus) Specication, Version 2.0
• Intel Virtualization Technology for Directed I/O (Intel VT-x, VT-d)
1.3 Special Features
This section describes the health monitoring features of the A2SDi-H-TP4F/TF motherboard.
The motherboard has an onboard System Hardware Monitor chip that supports system health
monitoring.
Recovery from AC Power Loss
The Basic I/O System (BIOS) provides a setting that determines how the system will respond
when AC power is lost and then restored to the system. You can choose for the system to
remain powered off (in which case you must press the power switch to turn it back on), or
for it to automatically return to the power-on state. See the Advanced BIOS Setup section
for this setting. The default setting is Last State.
19
A2SDi-H-TP4F/TF User's Manual
1.4 System Health Monitoring
This section describes the health monitoring features of the A2SDi-H-TP4F/TF motherboard.
The motherboard has an onboard Baseboard Management Controller (BMC) chip that
supports system health monitoring. Once a voltage becomes unstable, a warning is given or
an error message is sent to the screen. The user can adjust the voltage thresholds to dene
the sensitivity of the voltage monitor.
Onboard Voltage Monitors
The onboard voltage monitor will continuously scan crucial voltage levels. Once a voltage
becomes unstable, it will give a warning or send an error message to the screen. Users can
adjust the voltage thresholds to dene the sensitivity of the voltage monitor. Real time readings
of these voltage levels are all displayed in BIOS.
Fan Status Monitor with Firmware Control
The system health monitor embedded in the BMC chip can check the RPM status of the
cooling fans. The CPU and chassis fans are controlled via lPMI.
Environmental Temperature Control
System Health sensors in the BMC monitor the temperatures and voltage settings of onboard
processors and the system in real time via the IPMI interface. Whenever the temperature of
the CPU or the system exceeds a user-dened threshold, system/CPU cooling fans will be
turned on to prevent the CPU or the system from overheating.
Note: To avoid possible system overheating, please be sure to provide adequate air-
ow to your system.
System Resource Alert
This feature is available when used with SuperDoctor 5®. SuperDoctor 5 is used to notify the
user of certain system events. For example, you can congure SuperDoctor 5 to provide you
with warnings when the system temperature, CPU temperatures, voltages and fan speeds
go beyond a predened range.
1.5 ACPI Features
ACPI stands for Advanced Conguration and Power Interface. The ACPI specication denes
a exible and abstract hardware interface that provides a standard way to integrate power
management features throughout a computer system including its hardware, operating system
and application software. This enables the system to automatically turn on and off peripherals
such as network cards, hard disk drives and printers.
20
Chapter 1: Introduction
In addition to enabling operating system-directed power management, ACPI also provides a
generic system event mechanism for Plug and Play and an operating system-independent
interface for conguration control. ACPI leverages the Plug and Play BIOS data structures
while providing a processor architecture-independent implementation that is compatible with
Windows 8/R2, and Windows 2012/R2 operating systems.
1.6 Power Supply
As with all computer products, a stable power source is necessary for proper and reliable
operation. It is even more important for processors that have high CPU clock rates. In areas
where noisy power transmission is present, you may choose to install a line lter to shield
the computer from noise. It is recommended that you also install a power surge protector to
help avoid problems caused by power surges.
1.7 Super I/O
The Super I/O (Aspeed AST2400 chip) includes a data separator, write pre-compensation
circuitry, decode logic, data rate selection, a clock generator, drive interface control logic and
interrupt and DMA logic. The wide range of functions integrated onto the Super I/O greatly
reduces the number of components required for interfacing with oppy disk drives.
The Super I/O provides two high-speed, 16550 compatible serial communication ports
(UARTs), one of which supports serial infrared communication. Each UART includes a 16-byte
send/receive FIFO, a programmable baud rate generator, complete modem control capability
and a processor interrupt system. Both UARTs provide legacy speed with baud rate of up to
115.2 Kbps as well as an advanced speed with baud rates of 250 K, 500 K, or 1 Mb/s, which
support higher speed modems.
The Super I/O provides functions that comply with ACPI (Advanced Conguration and Power
Interface), which includes support of legacy and ACPI power management through a SMI
or SCI function pin. It also features auto power management to reduce power consumption.
The IRQs, DMAs and I/O space resources of the Super I/O can be exibly adjusted to meet
ISA PnP requirements, which support ACPI and APM (Advanced Power Management).
21
A2SDi-H-TP4F/TF User's Manual
1.8 Advanced Power Management
The following new advanced power management features are supported by the motherboard.
Management Engine (ME)
The Management Engine, which is an ARC controller embedded in the IOH (I/O Hub), provides
Server Platform Services (SPS) to your system. The services provided by SPS are different
from those provided by the ME on client platforms.
22
Chapter 2: Installation
Chapter 2
Installation
2.1 Static-Sensitive Devices
Electrostatic Discharge (ESD) can damage electronic com ponents. To prevent damage to your
motherboard, it is important to handle it very carefully. The following measures are generally
sufcient to protect your equipment from ESD.
Precautions
• Use a grounded wrist strap designed to prevent static discharge.
• Touch a grounded metal object before removing the board from the antistatic bag.
• Handle the board by its edges only; do not touch its components, peripheral chips, memory
modules or gold contacts.
• When handling chips or modules, avoid touching their pins.
• Put the motherboard and peripherals back into their antistatic bags when not in use.
• For grounding purposes, make sure that your chassis provides excellent conductivity be-
tween the power supply, the case, the mounting fasteners and the motherboard.
• Use only the correct type of CMOS onboard battery as specied by the manufacturer. Do
not install the CMOS battery upside down, which may result in a possible explosion.
Unpacking
The motherboard is shipped in antistatic packaging to avoid static damage. When unpacking
the motherboard, make sure that the person handling it is static protected.
23
A2SDi-H-TP4F/TF User's Manual
JGP1
2.2 Motherboard Installation
All motherboards have standard mounting holes to t different types of chassis. Make sure
that the locations of all the mounting holes for both the motherboard and the chassis match.
Although a chassis may have both plastic and metal mounting fasteners, metal ones are
highly recommended because they ground the motherboard to the chassis. Make sure that
the metal standoffs click in or are screwed in tightly.
Note: 1) To avoid damaging the motherboard and its components, please do not use
a force greater than 8 lb/inch on each mounting screw during motherboard installation.
2) Some components are very close to the mounting holes. Please take precautionary
measures to avoid damaging these components when installing the motherboard to
the chassis.
24
Chapter 2: Installation
Installing the Motherboard
1. Install the I/O shield into the back of the chassis.
2. Locate the mounting holes on the motherboard. See the previous page for the location.
3. Locate the matching mounting holes on the chassis. Align the mounting holes on the
motherboard against the mounting holes on the chassis.
4. Install standoffs in the chassis as needed.
5. Install the motherboard into the chassis carefully to avoid damaging other motherboard
components.
6. Using the Phillips screwdriver, insert a Phillips head #6 screw into a mounting hole on
the motherboard and its matching mounting hole on the chassis.
7. Repeat Step 5 to insert #6 screws into all mounting holes.
8. Make sure that the motherboard is securely placed in the chassis.
Note: Images displayed are for illustration only. Your chassis or components might
look different from those shown in this manual.
25
A2SDi-H-TP4F/TF User's Manual
2.4 Memory Support and Installation
Note: Check the Supermicro website for recommended memory modules.
Important: Exercise extreme care when installing or removing DIMM modules to pre-
vent any possible damage.
Memory Support
The A2SDi-H-TP4F/TF supports up to 256GB RDIMM or 64GB UDIMM DDR4 ECC/Non
ECC with speeds of up to 2400MHz. Populating these DIMM slots with a pair of memory
modules of the same type and size will result in interleaved memory, which will improve
memory performance.
Memory Population Guidelines
For optimal memory performance, follow the table below when populating memory. Populate
DIMM slots in the following order: DIMMA1, DIMMB1, then DIMMA2, DIMMB2
Recommended Population (Balanced)
DIMMA1DIMMB1DIMMA2DIMMB2Total System Memory
2GB2GB4GB
2GB2GB2GB2GB8GB
4GB4GB8GB
4GB4GB4GB4GB16GB
8GB8GB16GB
8GB8GB8GB8GB32GB
16GB16GB32GB
16GB16GB16GB16GB64GB
32GB32GB64GB
32GB32GB32GB32GB128GB
64GB64GB64GB64GB256GB
Unbuffered DDR4 ECC/Non-ECC DIMM Memory
DIMMs per
channel
21Unbuffered
22Unbuffered
DIMMs per
channel
DIMM TypePOR Speed
DDR4 DIMM
DDR4 DIMM
MT/s
1600, 1866
2133, 2400
1600, 1866
2133, 2400
26
Memory Population
Sequence
A1, B1 (2 DIMMs)
A1, B1, A2, B2
(4 DIMMs)
Chapter 2: Installation
JBR1
JPME2
JI2C1
JI2C2
JGP1
DIMM Installation
1. Insert DIMM modules in the following
order: DIMMA1, DIMMB1, then DIMMA2,
DIMMB2. For the system to work properly,
please use memory modules of the same
type and speed.
2. Push the release tabs outwards on both
ends of the DIMM slot to unlock it.
3. Align the key of the DIMM module with the
receptive point on the memory slot.
4. Align the notches on both ends of the
module against the receptive points on the
ends of the slot.
5. Use two thumbs together to press the
notches on both ends of the module
straight down into the slot until the module
snaps into place.
6. Press the release tabs to the lock positions
to secure the DIMM module into the slot.
JPG1
COM1
USB2/3
JD1
JL1
FANA
JSD1
UIDLED1
UID
SRW2
CPU SLOT7 PCI-E 3.0 X4
BMC
AST2400
SRW1
JMD1
M.2:PCI-E 3.0 X2 / I-SATA
PRESS FIT
JSAS2
I-SATA
8-11
JSAS1
I-SATA
PRESS FIT
4-7
USB4(3.0)
PRESS FIT
VGA
Intel
X557-AT2
LEDT1
A
LEDT2
A
LEDM1
1
I-SATA1
I-SATA0
A
C
C
C
LEDT4
A
A
LEDT3
C
C
LAN3
LAN4
Intel SoC
FCBGA1310
JI2C1:
1-2:ENABLE
2-3:DISABLE
JPME2:
JI2C2:
1-2:NORMAL
1-2:ENABLE
2-3:ME MANUFACTURING MODE
2-3:DISABLE
I-SATA2
I-SATA3
JRT4
JRT3
DIMMA2
DIMMA1
DIMMB2
PWR2NIC
RST
ON
DIMMB1
IPMI LAN
USB0/1
JSMB1
JPI2C1: PWR I2C
JPI2C1
JPH1
JBT1
BT1
JPW1
JTGLED1
JPV1
PWR
HDDNIC
OH/FFX
1 LED
LED
FAN3
FAN2
FAN1
JPTG1
JWD1
JPTG1:
2-3:DISABLE
1-2:ENABLE
ALWAYS POPULATE DIMMx1 FIRST
10Gb LAN
JWD1:WATCH DOG
2-3:NMI
1-2:RST
LAN1
LAN2
BIOS LICENSE
DESIGNED IN USA
BAR CODE
A2SDi-H-TF
REV:1.02
JF1
JTPM1
LED1
A
Notches
DIMM Removal
Reverse the steps above to remove the DIMM
modules from the motherboard.
Release Tabs
Press both notches
straight down into
the memory slot.
27
A2SDi-H-TP4F/TF User's Manual
2.5 Rear I/O Ports
See Figure 2-2 below for the locations and descriptions of the various I/O ports on the rear
of the motherboard.
JI2C1
JI2C2
JPME2
JPG1
COM1
JD1
JL1
FANA
JSD1
UIDLED1
UID
CPU SLOT7 PCI-E 3.0 X4
USB2/3
JMD1
M.2:PCI-E 3.0 X2 / I-SATA
USB4(3.0)
SRW2
BMC
AST2400
SRW1
PRESS FIT
JSAS2
I-SATA
8-11
JSAS1
I-SATA
PRESS FIT
4-7
I-SATA0
VGA
Intel
X557-AT2
A
LEDM1
1
I-SATA1
PRESS FIT
LEDT1
A
LEDT2
A
C
C
A
LEDT3
C
LAN3
LAN4
Intel SoC
FCBGA1310
JI2C1:
1-2:ENABLE
2-3:DISABLE
JPME2:
JI2C2:
1-2:NORMAL
1-2:ENABLE
2-3:ME MANUFACTURING MODE
2-3:DISABLE
I-SATA2
I-SATA3
JRT4
JRT3
LAN1
C
LAN2
LEDT4
A
C
JTPM1
JPTG1
JWD1
2-3:DISABLE
2-3:NMI
1-2:RST
BIOS LICENSE
BAR CODE
REV:1.02
JF1
1-2:ENABLE
DIMMA2
DIMMA1
JPTG1:
ALWAYS POPULATE DIMMx1 FIRST
10Gb LAN
JWD1:WATCH DOG
DESIGNED IN USA
A2SDi-H-TF
PWR2NIC
RST
OH/FFX
ON
FAN3
LED1
A
1 LED
DIMMB2
HDDNIC
DIMMB1
JBR1
IPMI LAN
USB0/1
JGP1
JSMB1
JPI2C1: PWR I2C
JPI2C1
JPH1
JBT1
BT1
JPW1
JTGLED1
PWR
LED
JPV1
FAN2
FAN1
Figure 2-2. I/O Port Locations and Denitions
1
2
3
4
5
6
7
Rear I/O Ports
#Description#Description
1.IPMI LAN5.LAN1
2.USB16.LAN4 (SFP+) (TP4F only)
3.USB07.LAN3 (SFP+) (TP4F only)
4.LAN28.VGA port
8
28
Chapter 2: Installation
JGP1
VGA Port
The onboard VGA port is located next to LAN ports 3/4 on the I/O back panel. Use this
connection for VGA display.
LAN Ports
The A2SDi-H-TP4F has four 10Gb LAN ports, and the A2SDi-H-TF has two. These ports are
located on the I/O back panel and accept RJ45 cables. There is also a dedicated IPMI LAN
port on the I/O back panel.
There are two USB ports (USB0/1) on the I/O back panel. The motherboard also has one
front access USB 2.0 header (USB2/3) and one USB 3.0 Type A header (USB4). The onboard
headers can be used to provide front side USB access with a cable (not included).