Supermicro A2SAP-E operation manual

A2SAP-H/-E/-L

USER’S MANUAL

Revision 1.0

The information in this user’s manual has been carefully reviewed and is believed to be accurate. The vendor assumes
no responsibility for any inaccuracies that may be contained in this document, and makes no commitment to update
or to keep current the information in this manual, or to notify any person or organization of the updates. Please Note:

For the most up-to-date version of this manual, please see our website at www.supermicro.com.

Super Micro Computer, Inc. ("Supermicro") reserves the right to make changes to the product described in this manual
at any time and without notice. This product, including software and documentation, is the property of Supermicro and/
or its licensors, and is supplied only under a license. Any use or reproduction of this product is not allowed, except
as expressly permitted by the terms of said license.

IN NO EVENT WILL Super Micro Computer, Inc. BE LIABLE FOR DIRECT, INDIRECT, SPECIAL, INCIDENTAL,
SPECULATIVE OR CONSEQUENTIAL DAMAGES ARISING FROM THE USE OR INABILITY TO USE THIS PRODUCT
OR DOCUMENTATION, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. IN PARTICULAR, SUPER
MICRO COMPUTER, INC. SHALL NOT HAVE LIABILITY FOR ANY HARDWARE, SOFTWARE, OR DATA STORED
OR USED WITH THE PRODUCT, INCLUDING THE COSTS OF REPAIRING, REPLACING, INTEGRATING,
INSTALLING OR RECOVERING SUCH HARDWARE, SOFTWARE, OR DATA.

Any disputes arising between manufacturer and customer shall be governed by the laws of Santa Clara County in the
State of California, USA. The State of California, County of Santa Clara shall be the exclusive venue for the resolution
of any such disputes. Supermicro's total liability for all claims will not exceed the price paid for the hardware product.

FCC Statement: This equipment has been tested and found to comply with the limits for a Class A digital device
pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful
interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can
radiate radio frequency energy and, if not installed and used in accordance with the manufacturer’s instruction manual,
may cause harmful interference with radio communications. Operation of this equipment in a residential area is likely
to cause harmful interference, in which case you will be required to correct the interference at your own expense.

California Best Management Practices Regulations for Perchlorate Materials: This Perchlorate warning applies only
to products containing CR (Manganese Dioxide) Lithium coin cells. “Perchlorate Material-special handling may apply.
See www.dtsc.ca.gov/hazardouswaste/perchlorate”.

WARNING: Handling of lead solder materials used in this product may expose you to lead, a
chemical known to the State of California to cause birth defects and other reproductive harm.

The products sold by Supermicro are not intended for and will not be used in life support systems, medical equipment,
nuclear facilities or systems, aircraft, aircraft devices, aircraft/emergency communication devices or other critical

systems whose failure to perform be reasonably expected to result in signicant injury or loss of life or catastrophic

property damage. Accordingly, Supermicro disclaims any and all liability, and should buyer use or sell such products
for use in such ultra-hazardous applications, it does so entirely at its own risk. Furthermore, buyer agrees to fully
indemnify, defend and hold Supermicro harmless for and against any and all claims, demands, actions, litigation, and
proceedings of any kind arising out of or related to such ultra-hazardous use or sale.

Manual Revision 1.0

Release Date: January 19, 2018

Unless you request and receive written permission from Super Micro Computer, Inc., you may not copy any part of this

document. Information in this document is subject to change without notice. Other products and companies referred

to herein are trademarks or registered trademarks of their respective companies or mark holders.

Copyright © 2018 by Super Micro Computer, Inc.
All rights reserved.

Printed in the United States of America

Preface

Preface

About This Manual

This manual is written for system integrators, IT technicians and knowledgeable end users.
It provides information for the installation and use of the A2SAP-H/-E/-L motherboard.

About This Motherboard

The A2SAP-H/-E/-L motherboard provides powerful graphics and increased media processing
performance with multi-frame technology. Paired with the Intel® Atom SoC (System-on-a­Chip) processor, the A2SAP-H/-E/-L delivers more computing power for faster memory speeds

and bandwidth while maintaining energy efciency. Utilizing Intel® TCC (Time Coordinated

Computing) Technology, the A2SAP-H/-E/-L resolves latency issues in applications and
improves determinism across connected devices. The motherboard features advanced
technologies such as Intel® Virtualization to improve security and reliabity of systems, and
Thermal Monitoring to reduce power consumption. It also comes with more I/O ports and
high-speed connectivity.

Please note that this motherboard is intended to be installed and serviced by professional
technicians only. For processor/memory updates, please refer to our website at http://www.

supermicro.com/products/.

Conventions Used in the Manual

Special attention should be given to the following symbols for proper installation and to prevent

damage done to the components or injury to yourself:

Warning! Indicates important information given to prevent equipment/property damage

or personal injury.

Warning! Indicates high voltage may be encountered when performing a procedure.

Important: Important information given to ensure proper system installation or to

relay safety precautions.

Note: Additional Information given to differentiate various models or provides infor­mation for correct system setup.

3

A2SAP-H/-E/-L User's Manual

Contacting Supermicro

Headquarters

Address: Super Micro Computer, Inc.

980 Rock Ave.

San Jose, CA 95131 U.S.A.

Tel: [phone]

Fax: [phone]

Email: [e-mail] (General Information)

[e-mail] (Technical Support)

Website: www.supermicro.com

Europe

Address: Super Micro Computer B.V.

Het Sterrenbeeld 28, 5215 ML

's-Hertogenbosch, The Netherlands

Tel: [phone]

Fax: [phone]

Email: [e-mail] (General Information)

[e-mail] (Technical Support)

[e-mail] (Customer Support)

Website: www.supermicro.nl

Asia-Pacic

Address: Super Micro Computer, Inc.

3F, No. 150, Jian 1st Rd.

Zhonghe Dist., New Taipei City 235

Taiwan (R.O.C)

Tel: [phone]

Fax: [phone]

Email: [e-mail]

Website: www.supermicro.com.tw

4

Preface

Table of Contents

Chapter 1 Introduction

1.1 Checklist ...............................................................................................................................7

Quick Reference ...............................................................................................................14

Quick Reference Table ......................................................................................................15

Motherboard Features .......................................................................................................16

1.2 Processor Overview ...........................................................................................................19

1.3 Special Features ................................................................................................................19

Recovery from AC Power Loss .........................................................................................20

1.4 ACPI Features ....................................................................................................................20

1.5 Power Supply .....................................................................................................................20

1.6 Super I/O ............................................................................................................................21

1.7 Advanced Power Management ..........................................................................................21

Management Engine (ME) ................................................................................................21

Chapter 2 Installation

2.1 Static-Sensitive Devices .....................................................................................................22

Precautions .......................................................................................................................22

Unpacking .........................................................................................................................22

2.2 Motherboard Installation .....................................................................................................23

Tools Needed ....................................................................................................................23

Location of Mounting Holes ..............................................................................................23

Installing the Motherboard.................................................................................................24

2.3 Memory Support and Installation .......................................................................................25

Memory Support ................................................................................................................25

SO-DIMM Installation ........................................................................................................26

SO-DIMM Removal ...........................................................................................................26

2.4 Rear I/O Ports ....................................................................................................................27

2.5 Front Control Panel ............................................................................................................30

2.6 Connectors .........................................................................................................................33

Power Connections ...........................................................................................................33

Headers and Connectors ..................................................................................................34

2.7 Jumper Settings .................................................................................................................44

5

A2SAP-H/-E/-L User's Manual

How Jumpers Work ...........................................................................................................44

2.8 LED Indicators ....................................................................................................................46

Chapter 3 Troubleshooting

3.1 Troubleshooting Procedures ..............................................................................................47

Before Power On ..............................................................................................................47

No Power ..........................................................................................................................47

Memory Errors ..................................................................................................................48

Losing the System's Setup Conguration .........................................................................48

When the System Becomes Unstable ..............................................................................48

3.2 Technical Support Procedures ...........................................................................................50

3.3 Frequently Asked Questions ..............................................................................................51

3.4 Battery Removal and Installation .......................................................................................52

Battery Removal ................................................................................................................52

Proper Battery Disposal ....................................................................................................52

Battery Installation .............................................................................................................52

3.5 Returning Merchandise for Service ....................................................................................53

Chapter 4 BIOS

4.1 Introduction .........................................................................................................................54

Starting the Setup Utility ...................................................................................................54

4.2 Main Setup .........................................................................................................................55

4.3 Advanced ............................................................................................................................57

4.4 Security ...............................................................................................................................78

4.5 Boot ....................................................................................................................................82

4.6 Save & Exit .........................................................................................................................84

Appendix A Software Installation

A.1 Installing Software Programs .............................................................................................86

A.2 SuperDoctor® 5 ...................................................................................................................87

Appendix B Standardized Warning Statements

Battery Handling ................................................................................................................88

Product Disposal ...............................................................................................................90

Appendix C UEFI BIOS Recovery

6

Chapter 1: Introduction

Chapter 1

Introduction

Congratulations on purchasing your computer motherboard from an industry leader. Supermicro
boards are designed to provide you with the highest standards in quality and performance.

In additon to the motherboard, several important parts that are included with the system are
listed below. If anything listed is damaged or missing, please contact your retailer.

1.1 Checklist

Main Parts List (Retail Single Package)

Description Part Number Quantity

Supermicro Motherboard A2SAP-H/-E/-L 1

Heatsink (A2SAP-H/-E) SNK-C0115L 1

Heatsink (A2SAP-L) SNK-C0116L 1

Audio cable (20cm) (A2SAP-E/-L) CBL-OTHR-0986 1

SATA power cable (20cm) (A2SAP-E/-L) CBL-PWEX-1030 1

USB 2.0 cable (20cm) (A2SAP-E/-L) CBL-CUSB-0983 1

COM cable (20cm) (A2SAP-E/-L) CBL-CUSB-0984 1

SATA data cables (29cm) (A2SAP-E/-L) CBL-SAST-0538 1

Power input cable (15cm) (A2SAP-E/-L) CBL-PWEX-1029 1

Screw bag with four M3L4.5 screws and
four M4 Standoff 11mm in height (A2SAP-H)

MCP-110-00096-0N 1

Main Parts List (Bulk Package)

Description Part Number Quantity

Supermicro Motherboard A2SAP-H/-E/-L 1

Heatsink (A2SAP-E) SNK-C0115L 1

Heatsink (A2SAP-L) SNK-C0116L 1

SATA power cable (20cm) (A2SAP-E/-L) CBL-PWEX-1030 1

SATA data cables (29cm) (A2SAP-E/-L) CBL-SAST-0538 1

Power input cable (15cm) (A2SAP-E/-L) CBL-PWEX-1029 1

Screw bag with four M3L4.5 screws and
four M4 Standoff 11mm in height (A2SAP-H)

MCP-110-00096-0N 1

Note: The A2SAP-H bulk package does not include thermal solution.

7

A2SAP-H/-E/-L User's Manual

Important Links

For your system to work properly, please follow the links below to download all necessary
drivers/utilities and the user’s manual for your server.

• Supermicro product manuals: http://www.supermicro.com/support/manuals/

• Product drivers and utilities: ftp://ftp.supermicro.com

• Product safety info: http://www.supermicro.com/about/policies/safety_information.cfm

• If you have any questions, please contact our support team at: [e-mail]

This manual may be periodically updated without notice. Please check the Supermicro website
for possible updates to the manual revision level.

8

Figure 1-1. A2SAP-H Motherboard Image

Motherboard Bottom side

Chapter 1: Introduction

Motherboard TopSide

Note: All graphics shown in this manual were based upon the latest PCB revision

available at the time of publication of the manual. The motherboard you received may
or may not look exactly the same as the graphics shown in this manual.

9

A2SAP-H/-E/-L User's Manual

Figure 1-2. A2SAP-E/-L Motherboard Image

Motherboard Bottom side

Motherboard Topside

10

Figure 1-3. Motherboard Mechanical Drawings

A2SAP-H/-E/-L Motherboard Topside

Chapter 1: Introduction

A2SAP-H Motherboard Bottom Side

A2SAP-E/-L Motherboard Bottom Side

11

A2SAP-H/-E/-L User's Manual

Figure 1-4. A2SAP-H/-E/-L Back Panel Mechanical Drawings

A2SAP-H Back Panel I/O with Heatsink

A2SAP-H Back Panel I/O without Heatsink

1.60

27.04

16.34

A2SAP-E Back Panel I/O with Heatsink

A2SAP-L Back Panel I/O with Heatsink

12

Chapter 1: Introduction

JDC

Figure 1-5. Motherboard Layout

(not drawn to scale)

A2SAP-H/-E/-L Bottom Layout

JPWR1

JHDMI1

JUSB1

USB2/3 (3.0)

SRW2

JMD1

JF1

JGP1

LED1

A2SAP-L

Rev:1.01
DESIGNED IN USA

J6: USB0/1

JLAN2

JMP1

JCOM1: COM1/COM2

SRW1

JLAN1

J3: AUDIO FP

LVDS1

JEIO1

BT1

JLCDPWR1

I-SATA1

1

32-Pin Connector A

(JF1 + JGP1 + J6)

(A2SAP-H only)

A2SAP-H/-E/-L Topside Layout

JSMBUS1

34-Pin Connector B

(JCOM1 + J3)

(A2SAP-H only)

PEC1

CPU1

J5

13

A2SAP-H/-E/-L User's Manual

Quick Reference

Bottom Layout

JDC

SRW2

JMD1

32-Pin Connector A

(JF1 + JGP1 + J6)

(A2SAP-H only)

JDC

JPWR1

JPWR1

SRW2

JMD1

JF1

JUSB1

JUSB1

USB2/3 (3.0)

JF1

JGP1

LED1

LED1

JGP1

JHDMI1

JHDMI1

A2SAP-L

Rev:1.01
DESIGNED IN USA

J6: USB0/1

J6

JLAN2

JLAN2

JMP1

JCOM1: COM1/COM2

JCOM1

JMP1

SRW1

JLAN1

SRW1

JLAN1

LVDS1

J3: AUDIO FP

J3

I-SATA1

I-SATA1

JEIO1

JEIO1

LVDS1

BT1

BT1

1

JLCDPWR1

JLCDPWR1

34-Pin Connector B

(JCOM1 + J3)

(A2SAP-H only)

Topside Layout

PEC1

CPU1

CPU

JSMBUS1

JSMBUS1

J5

SODIMM

Notes:

• See Chapter 2 for detailed information on jumpers, I/O ports, and JF1 front panel connec-

tions. Jumpers and LED indicators not indicated are used for testing only.

• " " indicates the location of Pin 1.

14

Chapter 1: Introduction

Quick Reference Table

Jumper Description Jumper Setting (Default *)

FORCE POWER ON

JLCDPWR1

LVDS Panel Power Source Selection

LED Description Status

LED1 Power LED

Connector Description

Battery Connector

BT1

I-SATA1 Intel® PCH SATA 3.0 Port

J3 Front Panel Audio Header (Mic-In/Headphone-out)

J6 Two USB 2.0 Headers

JCOM1 Two COM Headers (two RS232/422/485)

JDC 12V DC Jack Power Connector (for A2SAP-H)

JEIO1

JF1 Front Control Panel Header (Power/HDD LED, Reset, Power button)

JGP1 8-bit General Purpose I/O Header

JHDMI1 High Denition Multimedia Interface (HDMI) Port

JLAN1/JLAN2 LAN1/LAN2 (RJ45 LAN) Ports

JMD1 M.2 Slot (B-KEY 2242/3042) (SATA 3.0 / PCI-E x1 Gen2 / one USB 2.0)

JMP1 Half-Size Mini PCI-E Slot (supports PCI-E x1 Gen2 / one USB 2.0)

(To Clear CMOS, remove the battery, short pins 1-2 for more than 10 seconds and

install the battery.)

Supermicro Extension I/O

(DP/HDMI, two PCI-E x1, two USB 2.0, LPC, SATA, SMBus, SMBus,12Vsb 2A, 5Vsb

2.8A)

Notes: A2SAP-E/-L does NOT support SATA signal. The DP signal is supported

through a requested BIOS update.

Pins 2-4* (FORCE POWER ON)

Pins 4-6 (POWER BUTTON ON)

Pins 1-3* (3.3V)

Pins 3-5 (5V)

Solid Green: S0 mode

Solid Red: S3/S4/S5 modes

JPWR1 One 2x4-Pin 12V Power Connector (For A2SAP-E/L)

JSMBUS1 SMBus and 5V/1A SATA Power Box Header

JUSB1 Two Back Panel USB 3.0 Ports

LVDS1 Dual Channel 48-bit LVDS Connector

SRW1 - SRW2 M.2 and Mini PCI-E Mounting Holes

32-Pin Connector A Front panel, 8-bit GPIO and USB 2.0 x 2 (JF1 + JGP1 + J6) (A2SAP-H only)

34-Pin Connector B RS232/422/485 x 2 and Audio (JCOM1 + J3) (A2SAP-H only)

Note: Components not documented are for internal testing only.

15

A2SAP-H/-E/-L User's Manual

Motherboard Features

Motherboard Features

CPU

• A2SAP-H/-E: Intel® Atom™ x5-E3940 Processor, Quad Core, 2 MB L2 Cache, 1.6GHz-1.8GHz, 9.5W

• A2SAP-L: Intel® Atom™ x5-E3930 Processor, Dual Core, 2 MB L2 Cache, 1.3GHz-1.8GHz, 6.5W

Memory

• Integrated memory controller supports up to 8GB of DDR3L 1333/1600/1866MHz Non-ECC 204-pin SO-DIMM

DIMM Size

• Single channel Non-ECC SO-DIMM, DDR3L 1333/1600/1866MHz up to 8GB

Expansion Slots

• One (1) Half-Size Mini PCI-E Slot (supports PCI-E x1 Gen2 / one USB 2.0)

• One (1) M.2 Slot (B-KEY 2242/3042) (SATA 3.0 / PCI-E x1 Gen2 / USB 2.0)

Network

• Dual Intel I210 controller

Graphics

• Features: OpenGL 5.0, DirectX 12, OpenCL 2.1

• Hardware Decode: AVC/H.264, MPEG2, VC1/WMV9, JPEG/MJPEG,

• Intel® HD Graphics GT Series

HEVC/H.265, VP8, VP9, MVC

• Hardware Encode: AVC/H.264, JPEG/MJPEG, HEVC/H.265, VP8, VP9, MVC

• Display: HDMI 1.4 (resolution up to 3840x2160 at 30Hz), LVDS (dual channel

48-bit, resolution up to 1920x1200 at 60Hz)

I/O Devices

• COM Header • Two (2) front accessible ports (JCOM1 supports two RS232/RS422/RS485)

• SATA Port • One (1) SATA 3.0 port (I-SATA1)

• Audio Port

• One (1) HD Audio header with Mic-in/Headphone-out (Realtek ALC888S) (Audio

on A2SAP-H/-E/-L only supports 0-60ºC)

• SMBus Header • One (1) SMBus box header

• One (1) Supermicro EI/O Header (DP/HDMI, two PCI-E x1, two USB 2.0, LPC,

• SMCI EI/O

SATA, SMBus, SMBus,12Vsb 2A, 5Vsb 2.8A)

Notes: A2SAP-E/-L does NOT support SATA signal. The DP signal is supported

through a requested BIOS update.

Peripheral Devices

• One (1) USB 3.0 port on the rear I/O panel (JUSB1)

• One (1) USB 2.0 header (J6)

BIOS

• 128Mb SPI AMI BIOS

®

• ACPI 3.0, SMBIOS 2.7, PCI F/W 3.0, BIOS rescue hot-key, RTC (Real Time Clock) wakeup

Note: The table above is continued on the next page.

16

Chapter 1: Introduction

Motherboard Features

Power Management

• ACPI power management

• S3, S4, S5

• Power button override mechanism

• Power-on mode for AC power recovery

• Wake-On-LAN

• TXE Management Engine

• Force Power On by Jumper

• RTC Battery (typical voltage: 3.0V, normal discharge capacity: 220mAh)

System Health Monitoring

• Onboard voltage monitoring for +3.3V,+3.3V standby, VBAT, Vcore, system temperature, and memory voltage

• CPU switching phase voltage regulator

• CPU thermal trip support

System Management

• SuperDoctor® 5, Watch Dog, NMI, RoHs

LED Indicators

• Power/Suspend State Indicator LED

Dimensions

• 2.83" (L) x 3.93" (W) (72mm x 100mm) SBCs

• Height: A2SAP-H/-E 42.93mm, A2SAP-L 32.94mm

Environment

• Operating Temperature Range: A2SAP-H/-E support -30°C ~ 75°C (-22°F - 167°F), A2SAP-L supports -30°C ~ 60°C

(-22°F - 140°F). Note: The audio function operating temperature is 0~60°C.

• Non-Operating Temperature Range: -40°C - 85°C (-40°F - 185°F)

• Operating Relative Humidity Range: 8% - 90% (non-condensing)

• Non-Operating Relative Humidity Range: 10% - 95% (non-condensing)

Note 1: The CPU maximum thermal design power (TDP) is subject to chassis and

heatsink cooling restrictions. For proper thermal management, please check the chas-

sis and heatsink specications for proper CPU TDP sizing.

17

A2SAP-H/-E/-L User's Manual

Figure 1-6.

System Block Diagram

HDMI connector

LVDS Connector

Rear USB3.0 connector (USB 0)

Rear USB3.0 connector (USB 1)

Rear USB3.0 connector (USB 2)
Rear USB3.0 connector (USB 3)

SMBUS_HEADER

I/O Panel Layout

USB 3.0

LAN1 LAN2

USB 3.0

HDMI

21

DP to LVDSBridge

FLASH

SPI 128Mb

DC_IN

PTN3460

DDI0

5.0Gb/s

5.0Gb/s

480Mb/s
480Mb/s

SMBUS

SPI

eDP

8-Bit GPIO

Intel

DDR3L non ECC SKU

FST_SPI

USB 2.0 [0]
USB 3.0 [0]

USB 2.0 [1]
USB 3.0 [1]

USB 2.0 [2]
USB 3.0 [3]

PCIE[4/5]

USB2.0 [4,5]

USB2.0[7]

PCIE[2]

PCIE[1]

PCIE[0]

SATA[1]

SATA[0]

LPC

NCT5523

Audio

SIO

SINGLE CHANNEL

DDR3L
1866/1600/1333 MHz

High Definition

PCIe Gen2 x 2

DDI1

PCIe Gen2 x 1

5.0GT/s

480Mb/s

PCIe Gen2 x 1

5.0GT/s

PCIe Gen2 x 1

5.0GT/s

PCIe Gen2 x 1

5.0GT/s
SATA
6Gb/s

COM 1 / 2 (RS232 / 422 / 485)

EIO (2 ports PCIe X1 / 2 ports USB 2.0 /
HDMI / LPC / SATA / SMBus)

Mini-PCIe Slot

GLAN2 (LAN2)

INTEL I210

GLAN2 (LAN1)
INTEL I210

M.2 SLOT (B KEY)

SATA 6Gb/s

MAX. 8G SO-DIMM SUPPORTED

Non-ECC-SODIMM0

REALTEK

ALC888S-VD2-GR

RJ45 (JLAN2)

RJ45 (JLAN1)

I-SATA0 (For A2SAP-E/-L)
JEIO1 (For A2SAP-H)

FRONT AUDIO Header

Figure 1-7.

A2SAP Series Specication Chart

Base

Turbo

Model CPU GbE HDMI LVDS

A2SAP-E E3940 2 Yes 21.8GHz1.66GHz 9.5W Yes 2 Yes 8-bit Yes 2 1 N/A Box header 1 -30°C ~ 75°C

A2SAP-L E3930 2 Yes 21.8GHz1.3GHz 6.5W Yes 2 Yes 8-bit Yes 2 1 N/A Box header 1 -30°C ~ 60°C

A2SAP-H E3940 2 Yes 21.8GHz1.66GHz 9.5W Yes 32-pin connector A 34-pin connector B N/A Yes DC Jack

Freq.

Freq.

CPU
TDP

USB3.0 USB2.0

Front

GPIO Audio COM SATA

Panel

EI/O
SATA

Power

conn

EI/O Temp.

1 -30°C~ 75°C

Note 1: Audio function operating temperature is 0~60°C only

Note 2: This is a general block diagram and may not exactly represent the features

on your motherboard. See the previous pages for the actual specications of your

motherboard.

18

Passive
Heatsink

25mm height
(SNK-C0115L)

15mm height
(SNK-C0116L)

25mm height
(SNK-C0115L)

Chapter 1: Introduction

1.2 Processor Overview

Built upon the functionality and capability of the Intel® Atom SoC series processor, the

A2SAP-H/-E/-L motherboard offers maximum I/O expandability, energy efciency, and data

reliability in a 14-nm process architecture, and is optimized for embedded storage solutions,
networking applications, or cloud-computing platforms. The A2SAP-H/-E/-L drastically
increases system performance for a multitude of server applications.

The A2SAP-H/-E/-L supports the following features:

• Intel Virtualization Technology for Directed I/O (Intel VT-d)

• Enhanced Intel SpeedStep® Technology

• Video Connectors: HDMI and LVDS

• Adaptive Thermal Management/Monitoring

• Mini-PCI-E slot with PCI-E Gen2 X1 with transfer rates of up to 5Gb/s

• SATA port with SATA Gen3 with transfer rates of up to 6Gb/s

• System Management Bus (SMBus) Specication, Version 2.0

• M.2 slot with B-key 2242/3042 module

• Integrated Sensor Hub (ISH)

• Intel® Identity Protection Technology

1.3 Special Features

This section describes the health monitoring features of the A2SAP-H/-E/-L motherboard.
The motherboard has an onboard System Hardware Monitor chip that supports system health
monitoring.

19

A2SAP-H/-E/-L User's Manual

Recovery from AC Power Loss

The Basic I/O System (BIOS) provides a setting that determines how the system will respond
when AC power is lost and then restored to the system. You can choose for the system to
remain powered off (in which case you must press the power switch to turn it back on), or
for it to automatically return to the power-on state. See the Advanced BIOS Setup section
for this setting. The default setting is Last State.

Note: Before setting the Recovery from AC Power Loss function in the BIOS, please

adjust force power on jumper JLCDPWR1 to pins 4-6 to disable the force power-on

function.

1.4 ACPI Features

ACPI stands for Advanced Conguration and Power Interface. The ACPI specication denes
a exible and abstract hardware interface that provides a standard way to integrate power

management features throughout a computer system including its hardware, operating system
and application software. This enables the system to automatically turn on and off peripherals
such as network cards, hard disk drives and printers.

In addition to enabling operating system-directed power management, ACPI also provides a
generic system event mechanism for Plug and Play and an operating system-independent

interface for conguration control. ACPI leverages the Plug and Play BIOS data structures

while providing a processor architecture-independent implementation that is compatible with
Windows® 10.

1.5 Power Supply

As with all computer products, a stable power source is necessary for proper and reliable
operation. It is even more important for processors that have high CPU clock rates. In areas

where noisy power transmission is present, you may choose to install a line lter to shield

the computer from noise. It is recommended that you also install a power surge protector to
help avoid problems caused by power surges.

20

Chapter 1: Introduction

1.6 Super I/O

The Super I/O (NCT5523 chip) provides two high-speed, 16550 compatible serial
communication ports (UARTs), one of which supports serial infrared communication. Each
UART includes a 16-byte send/receive FIFO, a programmable baud rate generator, complete
modem control capability and a processor interrupt system. Both UARTs provide legacy speed
with baud rate of up to 115.2 Kbps as well as an advanced speed with baud rates of 250 K,
500 K, or 1 Mb/s, which support higher speed modems.

The Super I/O provides functions that comply with ACPI (Advanced Conguration and Power

Interface), which includes support of legacy and ACPI power management through a SMI
or SCI function pin. It also features auto power management to reduce power consumption.

The IRQs, DMAs and I/O space resources of the Super I/O can be exibly adjusted to meet

ISA PnP requirements, which support ACPI and APM (Advanced Power Management).

1.7 Advanced Power Management

The following new advanced power management features are supported by the motherboard.

Management Engine (ME)

Intel Atom SoC only supports the TXE function, also called CSE (Converged Security Engine),
which is the lite ME function.

21

A2SAP-H/-E/-L User's Manual

Chapter 2

Installation

2.1 Static-Sensitive Devices

Electrostatic Discharge (ESD) can damage electronic com ponents. To prevent damage to your
motherboard, it is important to handle it very carefully. The following measures are generally

sufcient to protect your equipment from ESD.

Precautions

• Use a grounded wrist strap designed to prevent static discharge.

• Touch a grounded metal object before removing the board from the antistatic bag.

• Handle the board by its edges only; do not touch its components, peripheral chips, memory

modules or gold contacts.

• When handling chips or modules, avoid touching their pins.

• Put the motherboard and peripherals back into their antistatic bags when not in use.

• For grounding purposes, make sure that your chassis provides excellent conductivity be-

tween the power supply, the case, the mounting fasteners and the motherboard.

• Use only the correct type of CMOS onboard battery as specied by the manufacturer.

Unpacking

The motherboard is shipped in antistatic packaging to avoid static damage. When unpacking
the motherboard, make sure that the person handling it is static protected.

22

Chapter 2: Installation

2.2 Motherboard Installation

All motherboards have standard mounting holes to t different types of chassis. Make sure

that the locations of all the mounting holes for both the motherboard and the chassis match.
Although a chassis may have both plastic and metal mounting fasteners, metal ones are
highly recommended because they ground the motherboard to the chassis. Make sure that
the metal standoffs click in or are screwed in tightly.

Phillips Screwdriver (1)

Tools Needed

JPWR1

JDC

SRW2

JMD1

JF1

JUSB1

USB2/3 (3.0)

Phillips Screws (4)

JHDMI1

Rev:1.01
DESIGNED IN USA

LED1

JGP1

J6: USB0/1

JLAN2

SRW1

JMP1

JCOM1: COM1/COM2

Standoffs (4)
Only if Needed

JLAN1

JEIO1

LVDS1

BT1

JLCDPWR1

J3: AUDIO FP

I-SATA1

1

Location of Mounting Holes

Note: 1) To avoid damaging the motherboard and its components, please do not use

a force greater than 8 lb/inch on each mounting screw during motherboard installation.

2) Some components are very close to the mounting holes. Please take precautionary
measures to avoid damaging these components when installing the motherboard to
the chassis.

23

A2SAP-H/-E/-L User's Manual

Installing the Motherboard

1. Locate the mounting holes on the motherboard. See the previous page for the location.

2. Install standoffs in the chassis.

3. Install the memory. Follow section 2.3 - Memory Support and Installation

4. After the memory installation is complete, install the heatsink.

5. The thermal solution kit that comes with the motherboard includes one heatsink with
thermal grease and four copper standoffs that are 19mm in height. The copper standoff
type is determined by the customer's chassis design. The copper standoffs that are
19mm in height are recommended only.

6. To install the heatsink, remove the plastic cover on the bottom of the heatsink to expose
the thermal grease. Then place the heatsink directly on the CPU and make sure the
thermal grease is in contact with the CPU.

7. Turn the motherboard over and tighten the standoffs on the chassis with the
corresponding screws by using the Phillips screwdriver. Install the motherboard into the
chassis carefully to avoid damaging other motherboard components.

8. Make sure that the motherboard is securely placed in the chassis.

Note: Images displayed are for illustration only. Your chassis or components might
look different from those shown in this manual.

24

Chapter 2: Installation

2.3 Memory Support and Installation

Note: Check the Supermicro website for recommended memory modules.

Important: Exercise extreme care when installing or removing DIMM modules to pre-

vent any possible damage.

Memory Support

The A2SAP-H/-E/-L supports up to 8GB of DDR3L Non-ECC SO-DIMM with speeds of
1333/1600/1866MHz in one memory slot on the bottom side of the motherboard.

Bottom Layout

JSMBUS1

PEC1

CPU1

J5

SO-DIMM Socket

25

A2SAP-H/-E/-L User's Manual

SO-DIMM Installation

1. Position the SO-DIMM module's bottom key so it aligns with the receptive point on the
slot.

Align

2. Insert the SO-DIMM module vertically at about a 45 degree angle. Press down until the
module locks into place.

Insert this end rst Press down until the module

locks into place.

3. The side clips will automatically secure the SO-DIMM module, locking it into place.

Locking clip

SO-DIMM Removal

1. Push the side clips at the end of the slot to release the SO-DIMM module. Pull the SO­DIMM module up to remove it from the slot.

26

Chapter 2: Installation

2.4 Rear I/O Ports

See Figure 2-1 below for the locations and descriptions of the various I/O ports on the rear
of the motherboard.

JPWR1

LED1

JHDMI1

Rev:1.01
DESIGNED IN USA

J6: USB0/1

JLAN2

SRW1

JMP1

JCOM1: COM1/COM2

JLAN1

JEIO1

LVDS1

BT1

JLCDPWR1

J3: AUDIO FP

JDC

SRW2

JMD1

JF1

JUSB1

USB2/3 (3.0)

JGP1

Figure 2-1. I/O Port Locations and Denitions

A2SAP-H A2SAP-E/-L

I-SATA1

1

4

1

6532

1 532

4

Rear I/O Ports

# Description # Description

1. LAN1 4. USB2

2. LAN2 5. USB1

3. HDMI 6. JDC

27

A2SAP-H/-E/-L User's Manual

LAN Ports

Two LAN ports (JLAN1 - JLAN2) are located on the I/O back panel. These ports accept RJ45
type cables. Please refer to the LED Indicator section for LAN LED information. Refer to the

table below for pin dentions.

LAN Port

Pin Denition

Pin# Denition Pin# Denition

1 GND 9 TRD1+

2 CT_VCC 10 TRD1-

3 TRD4+ 11 GRN+/ORG-

4 TRD4- 12 GRN-/ORG+

5 TRD3+ 13 YEL+

6 TRD3- 14 YEL-

7 TRD2+ 15 SH1

8 TRD2- 16 SH2

HDMI Port

The HDMI (High-Denition Multimedia Interface) port is used to display both high denition

video and digital sound through an HDMI-capable display, using the same cable.

3

2

1

1. JLAN1

JPWR1

2. JLAN2

3. HDMI

LED1

JHDMI1

Rev:1.01
DESIGNED IN USA

J6: USB0/1

JLAN2

SRW1

JMP1

JCOM1: COM1/COM2

JLAN1

J3: AUDIO FP

LVDS1

JEIO1

BT1

JLCDPWR1

I-SATA1

1

JDC

SRW2

JMD1

JF1

JUSB1

USB2/3 (3.0)

JGP1

28

Chapter 2: Installation

Universal Serial Bus (USB) Ports

There are two USB 3.0 ports (JUSB1) on the I/O back panel. The motherboard has two
additional USB 2.0 connections via the JEIO1 header. J6 also provides two front panel USB

2.0 connections. The onboard headers can be used to provide front side USB access with a
cable. Two USB 2.0 cables for front panel support are included with the motherboard single
retail package.

Back Panel USB 3.0

Pin Denition

Pin# Denition Pin# Denition

A1 VBUS B1 VBUS

A2 D1-N B2 D2-N

A3 D1-P B3 D2-P

A4 GND B4 GND

A5 Stda_SSRX1-N B5 Stda_SSRX2-N

A6 Stda_SSRX1-P B6 Stda_SSRX2-P

A7 GND_DRAIN B7 GND_DRAIN

A8 Stda_SSTX1-N B8 Stda_SSTX2-N

A9 Stda_SSTX1-P B9 Stda_SSTX2-P

Front Panel USB 2.0 Header

Pin Denition

Pin# Denition Pin# Denition

1 P5V_DUAL_F 2 P5V_DUAL_F

3 USBCON_N0 4 USBCON_N1

5 USBCON_P0 6 USBCON_P1

7 GND 8 GND

9 N/A 10 N/A

JDC

JPWR1

SRW2

JMD1

JF1

1

JUSB1

USB2/3 (3.0)

JGP1

LED1

JHDMI1

Rev:1.01
DESIGNED IN USA

2

J6: USB0/1

JLAN2

SRW1

JMP1

JCOM1: COM1/COM2

JLAN1

J3: AUDIO FP

29

LVDS1

JEIO1

BT1

JLCDPWR1

1. JUSB1

2. J6

I-SATA1

1