Studer OnAir2000 User Manual

Studer On-Air 2000
Digital Mixing Console SW Version 3.0
Operating Instructions
Prepared and edited by Copyright by Studer Professional Audio AG Studer Professional Audio AG Printed in Switzerland Technical Documentation Order no. 10.27.4263 (Ed. 1199) Althardstrasse 30 CH-8105 Regensdorf – Switzerland http://www.studer.ch Subject to change
SAFETY / SECURITE / SICHERHEIT
To reduce the risk of electric shock, do not remove covers (or back). No user-serviceable parts inside. Refer servicing to quali­fied service personnel.
Afin de prévenir un choc électrique, ne pas enlever les couvercles (où l’arrière) de l’appareil. Il ne se trouve à l’intérieur aucune pièce pouvant être réparée par l’usager.
Um die Gefahr eines elektrischen Schlages zu vermeiden, entfer­nen Sie keine Geräteabdeckungen (oder dessen Rückwand). Über­lassen Sie Wartung und Reparatur qualifiziertem Fachpersonal.
This symbol is intended to alert the user to presence of uninsula­ted “dangerous voltage” within the apparatus that may be of suf­ficient magnitude to constitute a risk of electric shock to a person.
Ce symbole indique à l'utilisateur qu'il existent à l'intérieur de l'appareil des “tensions dangereuses”. Ces tensions élevées en- trainent un risque de choc électrique en cas de contact.
Dieses Symbol deutet dem Anwender an, dass im Geräteinnern die Gefahr der Berührung von “gefährlicher Spannung” besteht. Die Grösse der Spannung kann zu einem elektrischen Schlag führen.
This symbol is intended to alert the user to the presence of important instructions for operating and maintenance in the en­closed documentation.
Ce symbole indique à l’utilisateur que la documentation jointe contient d'importantes instructions concernant le fonctionnement et la maintenance.
Dieses Symbol deutet dem Anwender an, dass die beigelegte Do­kumentation wichtige Hinweise für Betrieb und Wartung enthält.
CAUTION: Lithium battery. Danger of explosion by incorrect handling. Re-
place by battery of the same make and type only.
ATTENTION: Pile au lithium. Danger d'explosion en cas de manipulation incor-
recte. Ne remplacer que par un modèle de même type.
ACHTUNG: Explosionsgefahr bei unsachgemässem Auswechseln der Lithium-
batterie. Nur durch den selben Typ ersetzen.
ADVARSEL: Lithiumbatterei. Eksplosinsfare. Udskinftning ma kun foretages af
en sagkyndig of som beskrevet i servicemanualen (DK).
I
SAFETY / SECURITE / SICHERHEIT
FIRST AID
(in case of electric shock)
1. Separate the person as quickly
as possible from the electric power source:
• by switching off the equipment
• or by unplugging or disconnec­ting the mains cable
• pushing the person away from the power source by using dry insulating material (such as wood or plastic).
After having sustained an elec-
tric shock, always consult a doctor.
WARNING!
DO NOT TOUCH THE PERSON OR HIS CLOTHING BEFORE THE POWER IS TURNED OFF, OTHERWISE YOU STAND THE RISK OF SUSTAINING AN ELECTRIC SHOCK AS WELL!
PREMIERS SECOURS
(en cas d'électrocution)
1. Si la personne est dans l'impos-
sibilité de se libérer:
• Couper l'interrupteur principal
• Couper le courant
• Repousser la personne de l'ap­pareil à l'aide d'un objet en ma­tière non conductrice (matière plastique ou bois)
Après une électrocution, tou-
jours consulter un médecin.
ATTENTION!
NE JAMAIS TOUCHER UNE PERSONNE QUI EST SOUS TENSION, SOUS PEINE DE SUBIR EGALEMENT UNE ELECTROCUTION.
ERSTE HILFE
(bei Stromunfällen)
1. Bei einem Stromunfall die be-
troffene Person so rasch wie möglich vom Strom trennen:
• Ausschalten des Gerätes
• Ziehen oder Unterbrechen der Netzzuleitung
• Betroffene Person mit isoliertem Material (Holz, Kunststoff) von der Gefahrenquelle wegstossen
Nach einem Stromunfall sollte
immer ein Arzt aufgesucht wer­den.
ACHTUNG!
EINE UNTER SPANNUNG STEHENDE PERSON DARF NICHT BERÜHRT WERDEN. SIE KÖNNEN DABEI SELBST ELEKTRISIERT WERDEN!
2. If the person is unconscious:
• check the pulse,
• reanimate the person if respira­tion is poor,
• lay the body down, turn it to one side, call for a doctor immed­iately.
2. En cas de perte de connaissance
de la personne électrocutée:
• Controller le pouls
• Si nécessaire, pratiquer la respi­ration artificielle
• Placer l'accidenté sur le flanc et consulter un médecin.
2. Bei Bewusstlosigkeit des Verun-
fallten:
• Puls kontrollieren,
• bei ausgesetzter Atmung künst­lich beatmen,
• Seitenlagerung des Verunfallten vornehmen und Arzt verstän­digen.
II
SICHERHEIT / SAFETY
Installation
Vor der Installation des Gerätes müssen die hier aufge­führten und auch die weiter in dieser Anleitung mit bezeichneten Hinweise gelesen und während der Installation und des Betriebes beachtet werden. Untersuchen Sie das Gerät und sein Zubehör auf allfäl­lige Transportschäden. Ein Gerät, das mechanische Beschädigung aufweist oder in welches Flüssigkeit oder Gegenstände einge­drungen sind, darf nicht ans Netz angeschlossen oder muss sofort durch Ziehen des Netzsteckers vom Netz getrennt werden. Das Öffnen und Instandsetzen des Gerätes darf nur von Fachpersonal unter Einhaltung der geltenden Vorschriften durchgeführt werden.
Falls dem Gerät kein konfektioniertes Netzkabel beiliegt, muss dieses durch eine Fachperson unter Verwendung der mitgelieferten Kabel-Gerätedose IEC320/C13 oder IEC320/C19 und unter Berücksichti­gung der einschlägigen, im geweiligen Lande geltenden Bestimmungen angefertigt werden; siehe unten. Vor Anschluss des Netzkabels an die Netzsteckdose muss überprüft werden, ob die Stromversorgungs- und Anschlusswerte des Gerätes (Netzspannung, Netz­frequenz) innerhalb der erlaubten Toleranzen liegen. Die im Gerät eingesetzten Sicherungen müssen den am Gerät angebrachten Angaben entsprechen. Ein Gerät mit einem dreipoligen Gerätestecker (Gerät der Schutzklasse I) muss an eine dreipolige Netzsteck­dose angeschlossen und somit das Gerätegehäuse mit dem Schutzleiter der Netzinstallation verbunden werden (Für Dänemark gelten Starkstrombestimmungen, Ab­schnitt 107).
Installation
Before you install the equipment, please read and adhe­re to the following recommendations and all sections of these instructions marked with .
Check the equipment for any transport damage.
A unit that is mechanically damaged or which has been penetrated by liquids or foreign objects must not be connected to the AC power outlet or must be immedia­tely disconnected by unplugging the power cable. Re­pairs must only be performed by trained personnel in accordance with the applicable regulations.
Should the equipment be delivered without a matching mains cable, the latter has to be prepared by a trained person using the attached female plug (IEC320/C13 or IEC320/C19) with respect to the applicable regulations in your country - see diagram below.
Before connecting the equipment to the AC power out­let, check that the local line voltage matches the equip­ment rating (voltage, frequency) within the admissible tolerance. The equipment fuses must be rated in accor­dance with the specifications on the equipment.
Equipment supplied with a 3-pole appliance inlet (equipment conforming to protection class I) must be connected to a 3-pole AC power outlet so that the equipment cabinet is connected to the protective earth conductor of the AC supply (for Denmark the Heavy Current Regulations, Section 107, are applicable).
Female plug (IEC320), view from contact side:
L live; brown National American Standard: Black N neutral; blue White PE protective earth; green and yellow green
Connecteur femelle (IEC320), vue de la face aux contacts:
L phase; brun Standard national américain: Noir N neutre; bleu Blanc PE terre protective; vert et jaune Vert
Ansicht auf Steckkontakte der Kabel-Gerätesteckdose (IEC320):
L Phase; braun USA-Standard: Schwarz N Nulleiter; blau Weiss PE Schutzleiter; gelb/grün grün
III
SICHERHEIT / SAFETY
Zugentlastung für den Netzanschluss
Zum Verankern von Steckverbindungen ohne mechani­sche Verriegelung (z.B. IEC-Kaltgerätedosen) empfeh­len wir die folgende Anordnung:
Mains connector strain relief
For anchoring connectors without a mechanical lock (e.g. IEC mains connectors), we recommend the fol­lowing arrangement:
Vorgehen: Der mitgelieferte Kabelhalter ist selbstkle­bend. Bitte beachten Sie bei der Montage die folgenden Regeln:
1. Der Untergrund muss sauber, trocken und frei von
Fett, Öl und anderen Verunreinigungen sein. Tempe­raturbereich für optimale Verklebung: 20...40° C.
2. Entfernen Sie die Schutzfolie auf der Rückseite des
Kabelhalters und bringen sie ihn mit kräftigem Druck an der gewünschten Stelle an. Lassen sie ihn unbelastet so lange wie möglich ruhen – die maxi­male Klebekraft ist erst nach rund 24 Stunden er­reicht.
3. Die Stabilität des Kabelhalters wird erhöht, wenn
Sie ihn zusätzlich verschrauben. Zu diesem Zweck liegen ihm eine selbstschneidende Schraube sowie eine M4-Schraube mit Mutter bei.
4. Legen Sie das Kabel gemäss Figur in den Halter ein
und pressen Sie die Klemme kräftig auf, bis das Ka­bel fixiert ist.
Procedure: The cable clamp shipped with your unit is auto-adhesive. If mounting, please follow the rules be­low:
1. The surface to be adhered to must be clean, dry, and
free from grease, oil or other contaminants. Best ap­plication temperature range is 20...40° C.
2. Remove the plastic protective backing from the rear
side of the clamp and apply it firmly to the surface at the desired position. Allow as much time as pos­sible for curing. The bond continues to develop for as long as 24 hours.
3. For improved stability, the clamp can be fixed with
a screw. For this purpose, a self-tapping screw and an M4 bolt and nut are included.
4. Place the cable into the clamp as shown in the illus-
tration above and firmly press down the internal top cover until the cable is fixed.
IV
UMGEBUNGSBEDINGUNGEN / AMBIENT CONDITIONS
Lufttemperatur und Feuchtigkeit
Allgemein
Die Betriebstauglichkeit des Gerätes oder Systems ist unter folgenden Umgebungsbedingungen gewährleistet:
EN 60721-3-3, Set IE32, Wert 3K3.
Diese Norm umfasst einen umfassenden Katalog von Parame­tern; die wichtigsten davon sind: Umgebungstemperatur +5...+40 °C; rel. Luftfeuchtigkeit 5...85% – d.h. weder Konden­sation noch Eisbildung; abs. Luftfeuchtigkeit 1...25 g/m³; Tem­peratur-Änderungsrate < 0,5 °C/min. In den folgenden Ab­schnitten wird darauf näher eingegangen. Unter den genannten Bedingungen startet und arbeitet das Gerät oder System problemlos. Ausserhalb dieser Spezifikatio­nen möglicherweise auftretende Probleme sind in den folgenden Abschnitten beschrieben.
Umgebungstemperatur
Geräte und Systeme von Studer sind allgemein für einen Um­gebungstemperaturbereich (d.h. Temperatur der eintretenden Kühlluft) von +5...+40 °C ausgelegt. Bei Installation in einem Schrank muss der vorgesehene Luftdurchsatz und dadurch die Konvektionskühlung gewährleistet sein. Folgende Tatsachen sind dabei zu berücksichtigen:
1. Die zulässige Umgebungstemperatur für den Betrieb der Halbleiter-Bauelemente beträgt 0 °C bis +70 °C (commercial temperature range for operation).
2. Der Luftdurchsatz der Anlage muss gewährleisten, dass die austretende Kühlluft ständig kühler ist als 70 °C.
3. Die mittlere Erwärmung der Kühlluft soll 20 K betragen, die maximale Erwärmung an den heissen Komponenten darf somit um weitere 10 K höher liegen.
4. Zum Abführen einer Verlustleistung von 1 kW bei dieser zulässigen mittleren Erwärmung ist eine Luftmenge von 2,65 m³/min notwendig. Beispiel: Für ein Rack mit einer Leistungsaufnahme P = 800 W ist eine Kühlluftmenge von 0,8 * 2,65 m³/min nötig, entspre­chend 2,12 m³/min.
5. Soll die Kühlfunktion der Anlage (z.B. auch bei Lüfter­Ausfall oder Bestrahlung durch Spotlampen) überwacht wer­den, so ist die Temperatur der Abluft unmittelbar oberhalb der Einschübe an mehreren Stellen im Rack zu messen; die An­sprechtemperatur der Sensoren soll 65 bis 70 °C betragen.
Air temperature and humidity
General
Normal operation of the unit or system is warranted under the following ambient conditions defined by:
EN 60721-3-3, set IE32, value 3K3.
This standard consists of an extensive catalogue of parameters, the most important of which are: ambient temperature +5... +40° C, relative humidity 5...85% – i.e. no formation of con­densation or ice; absolute humidity 1...25 g/m³; rate of tem­perature change < 0,5 °C/min. These parameters are dealt with in the following paragraphs. Under these conditions the unit or system starts and works without any problem. Beyond these specifications, possible problems are described in the following sections.
Ambient temperature
Units and systems by Studer are generally designed for an am­bient temperature range (i.e. temperature of the incoming air) of +5...+40 °C. When rack mounting the units, the intended air flow and herewith adequate cooling must be provided. The following facts must be considered:
1. The admissible ambient temperature range for operation of the semiconductor components is 0 °C to +70 °C (commercial temperature range for operation).
2. The air flow through the installation must provide that the outgoing air is always cooler than 70 °C.
3. Average heat increase of the cooling air shall be 20 K, al­lowing for an additional maximum 10 K increase at the hot components.
4. In order to dissipate 1 kW with this admissible average heat increase, an air flow of 2,65 m³/min is required.
Example: A rack dissipating P = 800 W requires an air flow of 0,8 * 2,65 m³/min which corresponds to 2,12 m³/min.
5. If the cooling function of the installation must be monitored (e.g. for fan failure or illumination with spot lamps), the outgo­ing air temperature must be measured directly above the mod­ules at several places within the rack. The trigger temperature of the sensors should be 65 to 70 °C.
Reif und Tau
Das unversiegelte System (Steckerpartien, Halbleiteranschlüs­se) verträgt zwar leichte Eisbildung (Reif). Mit blossem Auge sichtbare Betauung führt jedoch bereits zu Funktionsstörungen. In der Praxis kann mit einem zuverlässigen Betrieb der Geräte bereits im Temperaturbereich ab –15 °C gerechnet werden, wenn für die Inbetriebnahme des kalten Systems die folgende allgemeine Regel beachtet wird: Wird die Luft im System abgekühlt, so steigt ihre relative Feuchtigkeit an. Erreicht diese 100%, kommt es zu Nieder­schlag, meist in der Grenzschicht zwischen der Luft und einer kühleren Oberfläche, und somit zur Bildung von Eis oder Tau an empfindlichen Systemstellen (Kontakte, IC-Anschlüsse etc.). Ein störungsfreier Betrieb mit interner Betauung, unabhängig von der Temperatur, ist nicht gewährleistet.
Frost and dew
The unsealed system parts (connector areas and semiconductor pins) allow for a minute formation of ice or frost. However, formation of dew visible with the naked eye will already lead to malfunctions. In practice, reliable operation can be expected in a temperature range above –15 °C, if the following general rule is considered for putting the cold system into operation:
If the air within the system is cooled down, the relative humid­ity rises. If it reaches 100%, condensation will arise, usually in the boundary layer between the air and a cooler surface, to­gether with formation of ice or dew at sensitive areas of the system (contacts, IC pins, etc.). Once internal condensation occurs, troublefree operation cannot be guaranteed, independent of temperature.
V
UMGEBUNGSBEDINGUNGEN / AMBIENT CONDITIONS
Vor der Inbetriebnahme muss das System auf allfällige interne Betauung oder Eisbildung überprüft werden. Nur bei sehr leichter Eisbildung kann mit direkter Verdunstung (Sublimati­on) gerechnet werden; andernfalls muss das System im abge­schalteten Zustand gewärmt und getrocknet werden. Das System ohne feststellbare interne Eisbildung oder Betau­ung soll möglichst homogen (und somit langsam) mit eigener Wärmeleistung aufgewärmt werden; die Lufttemperatur der Umgebung soll ständig etwas tiefer als diejenige der Syste­mabluft sein. Ist es unumgänglich, das abgekühlte System sofort in warmer Umgebungsluft zu betreiben, so muss diese entfeuchtet sein. Die absolute Luftfeuchtigkeit muss dabei so tief sein, dass die relative Feuchtigkeit, bezogen auf die kälteste Oberfläche im System, immer unterhalb 100% bleibt. Es ist dafür zu sorgen, dass beim Abschalten des Systems die eingeschlossene Luft möglichst trocken ist (d.h. vor dem Ab­schalten im Winter den Raum mit kalter, trockener Luft belüf­ten und feuchte Gegenstände, z.B. Kleider, entfernen). Die Zusammenhänge sind im folgenden Klimatogramm er­sichtlich. Zum kontrollierten Verfahren gehören Thermometer und Hygrometer sowie ein Thermometer innerhalb des Systems. Beispiel 1: Ein Ü-Wagen mit einer Innentemperatur von 20 °C und 40% relativer Luftfeuchtigkeit wird am Abend abgeschal­tet. Sinkt die Temperatur unter +5 °C, bildet sich Tau oder Eis. Beispiel 2: Ein Ü-Wagen wird morgens mit 20 °C warmer Luft von 40% relativer Luftfeuchtigkeit aufgewärmt. Auf Teilen, die kälter als +5 °C sind, bildet sich Tau oder Eis.
Before putting into operation, the system must be checked for internal formation of condensation or ice. Only with a minute formation of ice, direct evaporation (sublimation) may be ex­pected; otherwise the system must be heated and dried while switched off. A system without visible internal formation of ice or condensa­tion should be heated up with its own heat dissipation, as ho­mogeneously (and subsequently as slow) as possible; the ambi­ent temperature should then always be lower than the outgoing air. If it is absolutely necessary to operate the system immediately within warm ambient air, this air must be dehydrated. In such a case, the absolute humidity must be so low that the relative humidity, related to the coldest system surface, always remains below 100%. Ensu re that t he enclosed air is as dr y as p ossibl e when powe­ring off (i.e. before switching off in winter, aerate the room with cold, dry air, and remove humid objects as clothes from the room). These relationships are visible from the following climatogram. For a controlled procedure, thermometer and hygrometer as well as a thermometer within the system will be required. Example 1: An OB-van having an internal temperature of 20 °C and rel. humidity of 40% is switched off in the evening. If temperature falls below +5 °C, dew or ice will be forming. Example 2: An OB-van is heated up in the morning with air of 20 °C and a rel. humidity of 40%. On all parts being cooler than +5 °C, dew or ice will be forming.
VI
WARTUNG / MAINTENANCE
Wartung und Reparatur
Durch Entfernen von Gehäuseteilen, Abschirmungen etc. werden stromführende Teile freigelegt. Deshalb müssen u.a. die folgenden Grundsätze beachtet werden: Eingriffe in das Gerät dürfen nur von Fachpersonal unter Einhaltung der geltenden Vorschriften vorge­nommen werden. Vor Entfernen von Gehäuseteilen muss das Gerät aus­geschaltet und vom Netz getrennt werden. Bei geöffnetem, vom Netz getrenntem Gerät dürfen Teile mit gefährlichen Ladungen (z. B. Kondensatoren, Bildröhren) erst nach kontrollierter Entladung, heiße Bauteile (Leistungshalbleiter, Kühlkörper etc.) erst nach deren Abkühlen berührt werden.
Bei Wartungsarbeiten am geöffneten, unter Netz­spannung stehenden Gerät dürfen blanke Schaltungs­teile und metallene Halbleitergehäuse weder direkt noch mit nichtisoliertem Werkzeug berührt werden. Zusätzliche Gefahren bestehen bei unsachgemässer Handhabung besonderer Komponenten:
Explosionsgefahr bei Lithiumzellen, Elektrolyt-Kon-
densatoren und Leistungshalbleitern
Implosionsgefahr bei evakuierten Anzeigeeinheiten
Strahlungsgefahr bei Lasereinheiten (nichtioni-
sierend), Bildröhren (ionisierend)
Verätzungsgefahr bei Anzeigeeinheiten (LCD) und
Komponenten mit flüssigem Elektrolyt.
Solche Komponenten dürfen nur von ausgebildetem Fachpersonal mit den vorgeschriebenen Schutzmitteln (u.a. Schutzbrille, Handschuhe) gehandhabt werden.
Maintenance and Repair
The removal of housing parts, shields, etc. exposes energized parts. For this reason the following precauti­ons should be observed: Maintenance should only be performed by trained per­sonnel in accordance with the applicable regulations. The equipment should be switched off and disconnected from the AC power outlet before any housing parts are removed. Even if the equipment is disconnected from the power, parts with hazardous charges (e.g. capacitors, picture tubes) must not be touched until they have been pro­perly discharged. Touch hot components (power semi­conductors, heat sinks, etc.) only when cooled off.
If maintenance is performed on a unit that is opened and switched on, no uninsulated circuit components and metallic semiconductor housings must be touched nei­ther with your bare hands nor with uninsulated tools. Certain components pose additional hazards:
Explosion hazard from lithium batteries, electrolytic
capacitors and power semiconductors
Implosion hazard from evacuated display units
Radiation hazard from laser units (non-ionizing),
picture tubes (ionizing)
Caustic effect of display units (LCD) and such com-
ponents containig liquid electrolyte.
Such components should only be handled by trained personnel who are properly protected (e.g. safety goggles, gloves).
VII
WARTUNG / MAINTENANCE
Elektrostatische Entladung (ESD) bei Wartung und Reparatur
ATTENTION:
ATTENTION:
ACHTUNG:
Viele ICs und andere Halbleiter sind empfindlich gegen elektrostatische Entladung (ESD). Unfachgerechte Be­handlung von Baugruppen mit solchen Komponenten bei Wartung und Reparatur kann deren Lebensdauer drastisch vermindern. Bei der Handhabung der ESD-empfindlichen Kompo­nenten sind u.a. folgende Regeln zu beachten:
Electrostatic Discharge (ESD) during Maintenance and Repair
Observe precautions for handling devices sensitive to electrostatic discharge!
Respecter les précautions d’usage concernant la mani­pulation de composants sensibles à l’électricité statique!
Vorsichtsmassnahmen bei Handhabung elektrostatisch entladungsgefährdeter Bauelemente beachten!
Many ICs and semiconductors are sensitive to elec­trostatic discharge (ESD). The life of components con­taining such elements can be drastically reduced by improper handling during maintenance and repair work.
Please observe the following rules when handling ESD sensitive components:
• ESD-empfindliche Komponenten dürfen ausschliess­lich in dafür bestimmten und bezeichneten Ver­packungen gelagert und transportiert werden.
• Unverpackte, ESD-empfindliche Komponenten dür­fen nur in dafür eingerichteten Schutzzonen (EPA, z.B. Gebiet für Feldservice, Reparatur- oder Service­platz) gehandhabt und nur von Personen berührt werden, die durch ein Handgelenkband mit Serie­widerstand mit dem Massepotential des Reparatur­oder Serviceplatzes verbunden sind. Das gewartete Gerät wie auch Werkzeug, Hilfsmittel, EPA­taugliche (elektrisch halbleitende) Arbeits-, Ablage­und Bodenmatten müssen ebenfalls mit diesem Po­tential verbunden sein.
• Die Anschlüsse der ESD-empfindlichen Komponen­ten dürfen unkontrolliert weder mit elektrostatisch aufladbaren (Gefahr von Spannungsdurchschlag), noch mit metallischen Oberflächen (Schockent­ladungsgefahr) in Berührung kommen.
• Um undefinierte transiente Beanspruchung der Kom­ponenten und deren eventuelle Beschädigung durch unerlaubte Spannung oder Ausgleichsströme zu ver­meiden, dürfen elektrische Verbindungen nur am ab­geschalteten Gerät und nach dem Abbau allfälliger Kondensatorladungen hergestellt oder getrennt wer­den.
• ESD sensitive components should only be stored and transported in the packing material specifically pro­vided for this purpose.
• Unpacked ESD sensitive components should only be handled in ESD protected areas (EPA, e.g. area for field service, repair or service bench) and only be touched by persons who wear a wristlet that is con­nected to the ground potential of the repair or service bench by a series resistor. The equipment to be repai­red or serviced and all tools, aids, as well as electri­cally semiconducting work, storage and floor mats should also be connected to this ground potential.
• The terminals of ESD sensitive components must not come in uncontrolled contact with electrostatically chargeable (voltage puncture) or metallic surfaces (discharge shock hazard).
• To prevent undefined transient stress of the compo­nents and possible damage due to inadmissible volta­ges or compensation currents, electrical connections should only be established or separated when the equipment is switched off and after any capacitor charges have decayed.
VIII
WARTUNG / MAINTENANCE
SMD-Bauelemente
Der Austausch von SMD-Bauelementen ist ausschliess­lich geübten Fachleuten vorbehalten. Für verwüstete Platinen können keine Ersatzansprüche geltend gemacht werden. Beispiele für korrekte und falsche SMD­Lötverbindungen in der Abbildung weiter unten.
Bei Studer werden keine handelsüblichen SMD-Teile bewirtschaftet. Für Reparaturen sind die notwendigen Bauteile lokal zu beschaffen. Die Spezifikationen von Spezialbauteilen finden Sie in der Serviceanleitung.
SMD Components
SMDs should only be replaced by skilled specialists. No warranty claims will be accepted for circuit boards that have been ruined. Proper and improper SMD sol­dering joints are depicted below.
Studer does not keep any commercially available SMDs in stock. For repair the corresponding devices should be purchased locally. The specifications of special compo­nents can be found in the service manual.
IX
EMV / EMC
Störstrahlung und Störfestigkeit
Das Gerät entspricht den Schutzanforderungen auf dem Gebiet elektromagnetischer Phänomene, wie u.a. in den Richtlinien 89/336/EWG und FCC, Part 15, aufgeführt:
1. Vom Gerät erzeugte elektromagnetische Strahlung ist soweit begrenzt, dass bestimmungsgemässer Betrieb anderer Geräte und Systeme möglich ist.
2. Das Gerät weist eine angemessene Festigkeit gegen elektromagnetische Störungen auf, so dass sein be­stimmungsgemässer Betrieb möglich ist.
Das Gerät wurde getestet und erfüllt die Bedingungen der im Kapitel „Technische Daten“ aufgeführten EMV­Standards. Die Limiten dieser Standards gewährleisten mit angemessener Wahrscheinlichkeit sowohl den Schutz der Umgebung wie auch entsprechende Stör­festigkeit des Gerätes. Absolute Garantie, dass keine unerlaubte elektromagnetische Beeinträchtigung wäh­rend des Betriebes entsteht, ist jedoch nicht gegeben.
Um die Wahrscheinlichkeit solcher Beeinträchtigung weitgehend auszuschliessen, sind u.a. folgende Mass­nahmen zu beachten:
• Installieren Sie das Gerät gemäss den Angaben in der Betriebsanleitung, und verwenden Sie das mitgelie­ferte Zubehör.
• Verwenden Sie im System und in der Umgebung, in denen das Gerät eingesetzt ist, nur Komponenten (Anlagen, Geräte), die ihrerseits die Anforderungen der obenerwähnten Standards erfüllen.
• Sehen Sie ein Erdungskonzept des Systems vor, das sowohl die Sicherheitsanforderungen (die Erdung der Geräte gemäss Schutzklasse I mit einem Schutzleiter muss gewährleistet sein), wie auch die EMV-Belange berücksichtigt. Bei der Entscheidung zwischen stern­oder flächenförmiger bzw. kombinierter Erdung sind Vor- und Nachteile gegeneinander abzuwägen.
• Benutzen Sie abgeschirmte Kabel, wo vorgesehen. Achten Sie auf einwandfreie, grossflächige, korrosi­onsbeständige Verbindung der Abschirmung zum entsprechenden Steckeranschluss und dessen Gehäu­se. Beachten Sie, dass eine nur an einem Ende ange­schlossene Kabelabschirmung als Sende- bzw. Emp­fangsantenne wirken kann (z.B. bei wirksamer Ka­bellänge von 5 m oberhalb von 10 MHz), und dass die Flanken digitaler Kommunikationssignale hoch­frequente Aussendungen verursachen (z.B. LS- oder HC-Logik bis 30 MHz).
• Vermeiden Sie Bildung von Masseschleifen oder ver­mindern Sie deren unerwünschte Auswirkung, indem Sie deren Fläche möglichst klein halten und den darin fliessenden Strom durch Einfügen einer Impedanz (z.B. Gleichtaktdrossel) reduzieren.
Electromagnetic Compatibility
The equipment conforms to the protection requirements relevant to electromagnetic phenomena that are listed in the guidelines 89/336/EC and FCC, part 15.
1. The electromagnetic interference generated by the equipment is limited in such a way that other equip­ment and systems can be operated normally.
2. The equipment is adequately protected against elec­tromagnetic interference so that it can operate cor­rectly.
The unit has been tested and conforms to the EMC standards applicable to residential, commercial and light industry, as listed in the section „Technical Data“. The limits of these standards reasonably ensure protec­tion of the environment and corresponding noise immu­nity of the equipment. However, it is not absolutely warranted that the equipment will not be adversely af­fected by electromagnetic interference during operation.
To minimize the probability of electromagnetic interfer­ence as far as possible, the following recommendations should be followed:
• Install the equipment in accordance with the opera­ting instructions. Use the supplied accessories.
• In the system and in the vicinity where the equipment is installed, use only components (systems, equip­ment) that also fulfill the above EMC standards.
• Use a system grounding concept that satisfies the safety requirements (protection class I equipment must be connected with a protective ground conduc­tor) that also takes into consideration the EMC requi­rements. When deciding between radial, surface or combined grounding, the advantages and disad­vantages should be carefully evaluated in each case.
• Use shielded cables where shielding is specified. The connection of the shield to the corresponding con­nector terminal or housing should have a large sur­face and be corrosion-proof. Please note that a cable shield connected only single-ended can act as a transmitting or receiving antenna (e.g. with an effec­tive cable length of 5 m, the frequency is above 10 MHz) and that the edges of the digital communi­cation signals cause high-frequency radiation (e.g. LS or HC logic up to 30 MHz).
• Avoid ground loops or reduce their adverse effects by keeping the loop surface as small as possible, and reduce the noise current flowing through the loop by inserting an additional impedance (e.g. common­mode rejection choke).
X
Class A Equipment - FCC Notice
Konformitätserklärungen / Declarations of conformity
This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide a reasonable protection against harmful interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can r adiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may cause harmful interference to radio communications. Operation of this equipment in a residen-
CE-Konformitätserklärung
Der Hersteller, Studer Professional Audio AG,
CH-8105 Regensdorf, erklärt in eigener Verant wortung, dass das Produkt
tial area is likely to cause harmful interference in which case the user will be required to correct the interference at his own expense.
Caution: Any changes or modifications not expressly approved by the manufacturer could void the user's authority to operate the equipment. Also refer to relevant information in this manual.
CE Declaration of C onform ity
The man ufacturer , Studer Professional Audio AG,
CH-8105 Regensdorf, declares under his sole responsibility that the product
Studer On-Air 2000, Digital-Mischpult,
(ab Serie-Nr. 1001),
auf das sich diese Erklärung bezieht, entsprechend den Bestimmungen der EU-Richtlinien und Ergänzungen
• Elektromagnetische Verträglichkeit (EMV): 89/336/EWG + 92/31/EWG + 93/68/EWG
• Niederspannung: 73/23/EWG + 93/68/EWG
mit den folgenden Normen und normativen Dokumenten übereinstimmt:
• Sicherheit: Schutzklasse 1, EN 60950:1992 + A1/A2:1993
•EMV: EN 55103-1/-2:1996, elektromagnetische Umgebungen E2 und E4.
Regensdorf, 7. Mai 1997
B. Hochstrasser, Geschäftsleiter
Studer On-Air 2000, Digital Mixing Console,
(on from serial No. 1001),
to which this declaration relates, according to following regulations of EU directives and amendm ent s
• Electromagnetic Compatibility (EMC): 89/336/EEC + 92/31/EE C + 93/68/ E EC
• Low Voltage (LVD): 73/23/EEC + 93/68/EE C
is in conformity with the following standards or other nor­mative documents:
•Safety: Class 1, EN 60950:1992 + A1/A2:1993
•EMC: EN 55103-1/-2:1996, electromagnetic environments E2 and E4.
Regensdorf, May 7, 1997
B. Hochstrasser, Man agin g d i rector
P. Fial a , Leiter QS
P. Fial a , Mana g er QA
XI
On-Air 2000 Digital Mixing Console
CONTENTS
1 Introduction...........................................................................................................................................................E1/1
1.1 Block diagram V3.0.......................................................................................................................................... E1/2
2 General.................................................................................................................................................................. E2/1
2.1 Utilization for the purpose intended................................................................................................................ E2/1
2.2 First steps....................................................................................................................................................... E2/1
2.2.1 Unpacking and inspection ......................................................................................................................E2/1
2.2.2 Installation .............................................................................................................................................E2/1
2.2.3 Adjustments, repair ................................................................................................................................ E2/2
2.2.4 PC-card.................................................................................................................................................. E2/2
2.3 Technical specifications (preliminary) ............................................................................................................ E2/3
3 Operating concept................................................................................................................................................. E3/1
3.1 Operating elements.........................................................................................................................................E3/2
3.1.1 Power switch .......................................................................................................................................... E3/2
3.1.2 Central section, display unit ...................................................................................................................E3/3
3.1.3 Central section, meter unit......................................................................................................................E3/3
3.1.4 Central section, monitoring and talkback................................................................................................ E3/4
3.1.5 Fader units .............................................................................................................................................E3/6
4 Channel functions.................................................................................................................................................. E4/1
4.1 Keys ...............................................................................................................................................................E4/1
4.2 Faders ............................................................................................................................................................E4/1
4.3 Overload indicator.......................................................................................................................................... E4/1
4.4 Channel screen...............................................................................................................................................E4/2
4.4.1 Channel screen fields .............................................................................................................................E4/2
4.4.2 Multi-Source Selector page..................................................................................................................... E4/4
4.4.3 Channel Control page, microphone input ...............................................................................................E4/5
4.4.4 Channel Control page, line input............................................................................................................E4/6
4.4.5 Equalizer control page, microphone input ..............................................................................................E4/8
4.4.6 Equalizer control page, line input...........................................................................................................E4/9
5 Master functions.................................................................................................................................................... E5/1
5.1 Login/logout...................................................................................................................................................E5/1
5.2 AUX and Insert control ..................................................................................................................................E5/2
5.3 N–1/audition master and telephone hybrid control ..........................................................................................E5/3
5.3.1 Additional N–1 outputs .......................................................................................................................... E5/4
5.4 Studio monitoring...........................................................................................................................................E5/5
5.5 Mixer set-up................................................................................................................................................... E5/6
5.6 Snapshots.......................................................................................................................................................E5/7
5.6.1 Recall a snapshot from memory..............................................................................................................E5/7
5.6.2 Save a snapshot to memory.....................................................................................................................E5/8
5.6.3 Delete a snapshot from memory..............................................................................................................E5/8
Date printed: 05.10.99 SW V3.0 Contents E0/1
On-Air 2000 Digital Mixing Console
5.7 Microphone settings ....................................................................................................................................... E5/9
5.7.1 Recall a microphone setting from memory..............................................................................................E5/9
5.7.2 Save a microphone setting to memory .................................................................................................. E5/10
5.7.3 Delete a microphone setting from memory ........................................................................................... E5/10
5.8 Using PC-cards ............................................................................................................................................ E5/11
5.8.1 Load a snapshot/mic setting from PC-card............................................................................................ E5/11
5.8.2 Save a snapshot/mic setting to PC-card ................................................................................................E5/11
5.8.3 Delete a snapshot/mic setting from PC-card .........................................................................................E5/12
5.9 Administrator............................................................................................................................................... E5/13
5.9.1 Features................................................................................................................................................ E5/13
5.9.2 Administrator selection of snapshots/mic settings................................................................................. E5/14
5.9.3 Users with and without a password....................................................................................................... E5/14
5.10 User administration...................................................................................................................................... E5/15
5.11 System configuration.................................................................................................................................... E5/15
5.12 Watch and stopwatch.................................................................................................................................... E5/16
5.12.1 Watch .................................................................................................................................................. E5/16
5.12.2 Fader stopwatch ................................................................................................................................... E5/17
5.12.3 User stopwatch..................................................................................................................................... E5/17
5.13 Master fader for PGM and REC outputs....................................................................................................... E5/18
6 Level meters ..........................................................................................................................................................E6/1
6.1 Standard level meters ..................................................................................................................................... E6/1
7 Monitoring............................................................................................................................................................. E7/1
7.1 Control room monitoring................................................................................................................................ E7/1
7.2 Studio monitoring ..........................................................................................................................................E7/4
7.3 Talkback ........................................................................................................................................................E7/5
7.3.1 Additional talkback functions................................................................................................................. E7/5
7.3.2 Talkback settings.................................................................................................................................... E7/6
7.4 External PFL.................................................................................................................................................. E7/7
8 Signaling................................................................................................................................................................ E8/1
9 Machine Control ...................................................................................................................................................E9/1
9.1 Keys and LEDs............................................................................................................................................... E9/2
9.2 Control outputs............................................................................................................................................... E9/4
9.2.1 CTRL OUT1 .......................................................................................................................................... E9/4
9.2.2 CTRL OUT2 .......................................................................................................................................... E9/4
9.3 Control inputs ................................................................................................................................................ E9/5
9.3.1 CTRL IN................................................................................................................................................ E9/5
9.3.2 EXTERN PFL input...............................................................................................................................E9/5
9.4 CTRL OUT1/2 & CTRL IN application examples .......................................................................................... E9/6
E0/2 Contents SW V3.0 Date printed: 05.10.99
On-Air 2000 Digital Mixing Console
10 Automation ...................................................................................................................................................... E10/1
10.1 Introduction.................................................................................................................................................. E10/1
10.2 Features of the On-Air 2000 CAB support.................................................................................................... E10/2
10.3 Application handling.................................................................................................................................... E10/4
10.3.1 Configuration for automation control.................................................................................................... E10/4
10.3.2 Routing................................................................................................................................................E10/4
10.3.3 Communication time-out...................................................................................................................... E10/6
10.3.4 Output selection ................................................................................................................................... E10/6
10.3.5 Start a new title from schedule..............................................................................................................E10/6
10.3.6 Next Indication..................................................................................................................................... E10/8
10.3.7 Indication of the currently playing input line........................................................................................ E10/8
10.3.8 Ready indication................................................................................................................................... E10/9
10.3.9 AUX mode........................................................................................................................................... E10/9
10.3.10 Text display..........................................................................................................................................E10/9
10.3.11 Input gain control................................................................................................................................. E10/9
10.3.12 Pre-listening......................................................................................................................................... E10/9
10.3.13 Billing................................................................................................................................................ E10/10
10.3.14 Time synchronisation .........................................................................................................................E10/10
11 User modes....................................................................................................................................................... E11/1
11.1 Purpose of user modes..................................................................................................................................E11/1
11.2 Access configurable functions of the console................................................................................................. E11/2
11.3 User administration ......................................................................................................................................E11/4
11.4 Administration functions.............................................................................................................................. E11/5
11.5 Log-in procedure and defaults ...................................................................................................................... E11/6
12 Configuration................................................................................................................................................... E12/1
12.1 Configuration handling ................................................................................................................................ E12/1
12.2 Configuration procedure............................................................................................................................... E12/2
12.2.1 Input ....................................................................................................................................................E12/4
12.2.2 Common settings.................................................................................................................................. E12/7
12.2.3 Output.................................................................................................................................................. E12/8
12.2.4 Level meter ..........................................................................................................................................E12/8
12.2.5 Time & date......................................................................................................................................... E12/9
12.2.6 System test ......................................................................................................................................... E12/10
12.2.7 Software update.................................................................................................................................. E12/11
12.2.8 Console dump ....................................................................................................................................E12/11
12.2.9 System synchronization...................................................................................................................... E12/12
12.2.10 Automation ........................................................................................................................................ E12/13
12.2.11 Monitor expander (optional)............................................................................................................... E12/13
12.2.12 Customer code.................................................................................................................................... E12/15
13 Sw update ........................................................................................................................................................ E13/1
13.1 Software structure......................................................................................................................................... E13/1
13.1.1 The CPU software package................................................................................................................... E13/1
13.1.2 DSP software package..........................................................................................................................E13/1
13.2 SW update procedure.................................................................................................................................... E13/2
13.2.1 Error handling PC-Card update............................................................................................................ E13/4
Date printed: 05.10.99 SW V3.0 Contents E0/3
On-Air 2000 Digital Mixing Console
14 System diagnostics and error handling........................................................................................................... E14/1
14.1 Error, warning, and information messages ................................................................................................... E14/1
14.1.1 System diagnostics ............................................................................................................................... E14/2
14.2 Indication on failure of restricted functions...................................................................................................E14/6
14.3 System test ................................................................................................................................................... E14/7
14.3.1 Buttons/faders...................................................................................................................................... E14/7
14.3.2 Fader calibration ..................................................................................................................................E14/8
14.3.3 Display................................................................................................................................................. E14/9
14.3.4 PC-Card............................................................................................................................................... E14/9
14.3.5 SW versions....................................................................................................................................... E14/10
15 Hardware modules .......................................................................................................................................... E15/1
15.1 Mic input module 1.942.220......................................................................................................................... E15/1
15.2 Analog line input module 1.942.230 (w. transformer); 1.942.232 (transformerless)...................................... E15/3
15.3 Digital input module 1.942.240.................................................................................................................... E15/3
15.4 Analog hex input module (optional) 1.942.245............................................................................................. E15/4
15.5 Digital hex input module (optional) 1.942.250 ............................................................................................. E15/5
15.6 Telephone hybrid module (optional) 1.942.140............................................................................................. E15/6
15.7 Analog output module (with balancing transformers) 1.942.120.................................................................. E15/7
15.8 Dual analog output module (with balancing transformers) 1.942.121...........................................................E15/7
15.9 Digital output module 1.942.124 ..................................................................................................................E15/8
15.10 Analog insert module (optional) 1.942.160................................................................................................... E15/9
15.11 Digital insert module (optional) 1.942.165 ................................................................................................. E15/10
15.12 Monitoring module 1.942.134/1.942.180.................................................................................................... E15/11
15.13 Monitoring module w. extension (optional) 1.942.138/1.942.181 ............................................................... E15/17
15.14 Serial interface module (optional) 1.942.145 .............................................................................................. E15/20
15.15 Clock sync module (optional) 1.942.135..................................................................................................... E15/21
15.16 Time sync module (optional) 1.942.150...................................................................................................... E15/22
15.17 TB mic input module (optional) 1.942.219 ................................................................................................. E15/23
15.18 DIP switches & jumpers ............................................................................................................................. E15/26
E0/4 Contents SW V3.0 Date printed: 05.10.99
1 INTRODUCTION
On-Air 2000 Digital Mixing Console
On-Air 2000 is a low-cost yet powerful digital mixing console for “on-air” and small recording and editing studio applications. It has a modularity of 6 channels; the maximum console size is limited to 24 channel strips (stereo or mono).
On-Air 2000 is based on a touch-screen user surface. Only the most impor­tant functions have hardware control elements. Unlike other digital mixing consoles, On-Air 2000 does not need external racks and power supply. Eve­rything is integrated in a single, lightweight console.
Since it is fully digital, it can be adapted to the current user using snapshot automation. Extensive configuration possibilities allow On-Air 2000 to be integrated into almost any broadcast studio environment.
For an overview, please refer to the On-Air 2000 block diagram located on the following two pages.
Date printed: 05.10.99 SW V3.0 Intro E1/1
On-Air 2000 Digital Mixing Console
INPUT CHANNELS
INPUTS
*** IF "PFL CUT ON CHANNEL ACTIVE" IS YES
1.1 Block diagram V3.0
CTRL I/O
PREAMP.1 A
DJ MIC 1
CTRL I/O
GUEST MIC.1 STUDIO MIC.1
CTRL I/O
GUEST MIC.2 STUDIO MIC.2
CTRL I/O
TEL.HYBR. 1
LINE INP. 1
CTRL I/O
TEL.HYBR. 2
LINE INP. 2 CTRL I/O
TAPE 1 TAPE 2
TT 1
TT 2 EXT.1 EXT.2
ANALOG INP.WITH 6CH SELECTOR (OPTION)
CTRL I/O
TAPE 1 TAPE 2
TT 1
TT 2 EXT.1 EXT.2
CTRL I/O
CD 1
CTRL I/O
CD 2
CTRL I/O
JINGLE
CTRL I/O
AUTO 1
DAT1
CTRL I/O
AUTO 2
DAT2
a a
INSERT
PREAMP.2
a a
INSERT
a
PREAMP.3
a
INSERT
HL INP.1
a a
HL INP.2
a a
a a
a
a
a
a
a
a
a
a
-
a a a a a a
-
D
AES INP.1d
AES INP.2
AES INP.3
AES INP.4
AES INP.5
SFC
D SFC
D SFC
D SFC
D SFC
d
d d
d d
d d
d
d
MONO LINE STEREO LINE
a
ANALOG SIGNAL
d
DIGITAL SIGNAL (AES EBU) CONFIG SELECTION MONITOR SELECTOR
XLR CONNECTOR DIN MULTIPIN (39p) D-TYPE CONNECTOR BANTAM JACK HEADPHONE JACK SOCKET
* N-1 A/B STANDARD / N-1 C...F OPTIONAL
** MASTER FADER (IF CONFIGURED)
A
A
A
A
HL INP.3
A
HL INP.4
A
D
D
D
D
D
D
D
D
D
D
D
D
DC REJ DIG PAD EQU.
PHASE
DC REJ FILTER/
PHASE
DC REJ DIG PAD PHASE
DC REJ
PHASE
FILTER/
EQU. BALANCEFADER
FILTER/
EQU. BALANCEFADER
FILTER/
EQU. BALANCEFADER
(INSERT) FADER BALANCE
(INSERT)DIG PAD
(INSERT)
(INSERT)DIG PAD
AF PF
AF PF
AF PF
AF PF
AF PF
AF PF
AF PF
AF PF
CHANNEL
ON
CHANNEL ON
CHANNEL
ON
CHANNEL ON
CHANNEL
ON
***
CHANNEL ON
CHANNEL
ON
CHANNEL ON
Σ
MUTE
***
AUX1
AUX2
MUTE
***
AUX1
AUX2
PROGRAM
Σ
RECORD
Σ AUDITION
N-1 A
N-1 F*
AUX 1
AUX 2
PFL
TB TO STUDIO
TB TO CR
Σ
PROGRAM
Σ
RECORD
Σ
AUDITION
N-1 A
N-1 F*
AUX 1
AUX 2
PFL
TB TO STUDIO
TB TO CR
+
+
+ +
+ +
+ + + +
+ + + +
+ +
+ + +
+
BUS
Σ
MUTE
AUX1
AUX2
MUTE
***
AUX1
AUX2
PROGRAM
Σ RECORD
Σ
AUDITION
N-1 A
N-1 F*
AUX 1
AUX 2
PFL
Σ
PROGRAM
Σ
RECORD
Σ
AUDITION
N-1 A
N-1 F*
AUX 1
AUX 2
PFL
+ + + +
+ +
+ +
+ + + +
+ +
+ +
E1/2 Intro SW V3.0 Date printed: 05.10.99
On-Air 2000 Digital Mixing Console
MASTER AND MONITORING
MAIN OUTPUTS
METER 1
METER INTERFACE
Σ
+
+
PFL**
PFL**
FADER**
Σ
FADER**
SEND RETURN
(INSERT)
(INSERT)
LIMITER
LIMITER (INSERT)
+ +
+ +
DIM
DIM
+
+
C+S TALK
C+S TALK
(INSERT)
Σ
PROGRAM
Σ
RECORD
Σ AUDITION
N-1 / A
N-1 / F*
PPM BAR-
GRAPH
DDD
+
+
+ + +
+ + + +
+ +
+ + +
+
+ + + +
+ +
+ +
+
RET 1
+ + +
+ +
RET 2
RET 3
RET 4
AUX1 MASTER
DIM
AUX2 MASTER
DIM
C TALK
+
C TALK
+
LIMITER
LIMITER
+
EXT PFL CONTROL
EXT.PFL
OFF AIR
EXT.1 EXT.2 EXT.3
a
a
a
a
a
EXTERN MONITORING
EXT TB TO STUDIO
EXT. TB INPUT
EXT TB TO CR
EXTERN TB INPUT
(OPTIONAL)
D
A
4 x INSERTS
* WITH OPTION N-1 C...F, ONLY TWO STEREO INSERTS AVAILABLE
a A
a
d
d
A
D
SFC
D
SFC
D
D
D
D
LIM
LIM
LIM
LIM
a
(OPTIONAL)
D
A
D
A
D d
D
D
D
a
a
d
EXT. TO PFL
SEND 1
SEND 2
SEND 3
SEND 4
A
DADAD
A
D
TB TO STUDIO
D
A
+
DIM
STUDIO CUT
TB TO C.R.MON
C.R.MON.
CR/PFL MONO MONO
C.R. CUT + DIM
DIM
PFL
ANALOGDIGITAL
PPM
METER 2
BAR-
GRAPH
A
D
A
D
D
d
D
D
D
A
D
D
D
A
D
A
D
A
D
A
D
A
D
D
d
a
d d
a
a
a
a
a
d d
Σ
PROGRAM/D
(Σ ON-AIR/D)
Σ PROGRAM/A (Σ ON-AIR/A)
Σ RECORD/D
Σ
RECORD/A
Σ AUDITION (OPTIONAL)
N-1 A
N-1 F *
AUX 1
AUX 2
STUDIO MONITOR
+
STUDIO MIC SIGN.
VCA
STUDIO
VCA
STUDIO LSP
TB TO TEL
MONITOR SELECT
MIC SIGN.
TB TO C.R.MON
C.R./ DJ MONITOR
+
+
VOL CONTR
VOL CONTR
VCA
VOL CONTR
PFL/TB
DJ
GUESTS
CR.LOUDSPEAKER
+ +
Date printed: 05.10.99 SW V3.0 Intro E1/3
22.3.99 STI
0
OA2000_V3
REGENSDORF SWITZERLAND
1 19.4.99 STI
ON AIR 2000 V3.0 BLOCK DIAGRAM AUDIO
2 GENERAL
2.1 Utilization for the purpose intended
The On-Air 2000 mixing console is intended for professional use. It is presumed that the unit is operated only by trained personnel. Servicing is reserved to skilled technicians. The electrical connections may be connected only to the voltages and signals designated in this manual.
2.2 First steps
2.2.1 Unpacking and inspection
Your new mixing console is shipped in a special packing which protects the units against mechanical shock during transit. Care should be exercised when unpacking so that the surfaces do not get marred. Verify that the content of the packing agrees with the items listed on the enclosed shipping list. Check the condition of the equipment for signs of shipping damage. If there should be any complaints you should immediately notify the forwarding agent and your nearest Studer distributor. Please retain the original packing material because it offers the best protec­tion in case your equipment ever needs to be transported.
On-Air 2000 Digital Mixing Console
2.2.2 Installation
Primary voltage: The power supply unit is auto-ranging; it can be used for mains voltages in
General precautions: Do not use the unit in conditions of excessive heat or cold, near any source
Power connection: The attached female IEC 320/C13 mains cable socket has to be connected to
a range of 100...240 VAC
of moisture, in excessively humid environments, or in positions where it is likely to be subjected to vibration or dust. Do not use any liquids to clean the exterior of the unit. A soft, dry cloth or brush will usually do. For cleaning the touch-screen display windows, most of the commercially available window or computer/TV screen cleaners are suited. Use only a
slightly damp (never wet) cloth. Never use any solvent!
an appropriate mains cable by a trained technician, respecting your local regulations. Refer to the “Installation, Operation, and Waste Disposal” sec­tion at the beginning of this manual. Maintenance work inside the units must be performed by a trained techni­cian.
Date printed: 05.10.99 General E2/1
On-Air 2000 Digital Mixing System
Earthing: This equipment must be earthed, due to the mains input filter network be-
ing connected to the mains earth.
Some consideration should be given to the earthing arrangement of the sys­tem at the center of which is the console. The console chassis is earthed to the mains earth via the power supply. Ground loops may occur where signal processing equipment, patched to the console, has its signal earth commoned to the equipment chassis.
2.2.3 Adjustments, repair
Danger: All internal adjustments as well as repair work on this product must be per-
formed by trained technicians!
Replacing the supply unit: The primary fuse is located inside the power supply module and cannot be
changed. In case of failure, the complete supply unit must be replaced. Please ask your nearest Studer representative.
2.2.4 PC-card
A standard On-Air 2000 mixing console is equipped with a PC-card socket. Using the industry-standard SRAM PC-cards, the user can save important console information on a card. This information can then be used to restore the console to the same state at a later moment. Since the information stored on the card is DOS compatible, it is easily transferred to an IBM-compatible PC for data storage and backup.
Note: Although it is possible to format an SRAM card in a PC, the card must be
re-formatted in the On-Air 2000; therefore, the write protect tab must be set to OFF when the card is used in the mixing console for the first time.
It is also possible for new software releases to be downloaded from an SRAM PC-card. This feature is only available for users in possession of the correct files. For more information on this subject, refer to section 13.
The mixing console PC-card support is restricted to 5 V, Type 1, SRAM memory cards with a capacity of 64 kbytes to 32 Mbytes. Hot-swapping is supported, too.
E2/2 General Date printed: 05.10.99
On-Air 2000 Digital Mixing Console
2.3 Technical specifications (preliminary)
General
Level specs, digital, in dBFS: dB, referenced to full modulation (dBFS, dB Full Scale) Level specs, analog, in dBu: 0 dBu 0.775 Vrms
Level specs, analog, in dBuFS: Level in dBu for full modulation ( 0 dBFS)
Sampling rate: 48 kHz ±100 ppm (internally synchronized)
Headroom adjustable: 0...20 dB
Default setting: 9 dB
All input faders set to their 0 dB position. External analog sources: Source im­pedance < 200 . Frequency range: 20 Hz...20 kHz, if not stated otherwise.
Microphone inputs Microphone input modules have A/B-switchover and are equipped with a bal-
ancing transformer. The signal is routed to an electronically balanced, analog in­sert point before the A/D-converter.
Input sensitivity –60...+20 dBu
Gain setting in steps of 1 dB
(with 9 dB headroom: –69...+11 dBu)
FS
Phantom power, switchable 48 V
Frequency response ±0.5 dB
High-pass filter (12 dB/Octave) –3 dB @ 75 Hz ±5 Hz, switchable
Input impedance > 1 k
Insert level +15 dBuFS (with 9 dB headroom: +6 dBu)
A/D converter 20 bit (Delta-Sigma, 64 × oversampling)
Dynamics typ. 102 dB @ +15 dBuFS (unweighted)
THD+N < –85 dBFS, 20 Hz...20 kHz, @ –1 dBFS (+15 dBuFS) THD+N < –100 dBFS, 20 Hz...20 kHz, @ –30 dB
Noise figure typ. < 4 dB @ max. gain, bandwidth 20 kHz, Rs = 200
FS
Common mode rejection > 50 dB @ 15 kHz, > 75 dB @ 50 Hz
Line level inputs Analog line level input modules are available in three versions:
Stereo input with A/B switching, with balancing transformer
Stereo input with A/B switching, with electronically balanced input
Stereo input with 6-input selector, with balancing transformer. On this module the sources are connected via a 39-pin DIN connector.
Input sensitivity –10...+24 dBu
Gain setting in steps of 1 dB
(with 9 dB headroom: –19...+15 dBu)
FS
Frequency response ±0.1 dB
Input impedance > 10 k
A/D converter 20 bit (Delta-Sigma, 64 x oversampling)
Dynamics typ. 102 dB @ +15 dBuFS (unweighted)
THD+N < –94 dBFS, 20 Hz...20 kHz @ –1 dBFS (+15 dBuFS) THD+N < –100 dBFS, 20 Hz...20 kHz @ –30 dB
Common mode rejection > 50 dB @ 50 Hz...15 kHz, with transformer;
FS
> 47 dB @ 50 Hz...15 kHz, electronically balanced
Digital inputs Digital input modules are available either with A/B switching or with a 6-input
selector. The module with A/B switching supports the AES/EBU (AES3-1992) and S/PDIF (IEC 958) formats. It is equipped with XLR, Cinch, and Toslink connectors. The 6-input selector supports the AES/EBU (AES3-1992) format and is equipped with a 39-pin DIN connector for source connection. All digital inputs are equipped with a sampling frequency converter (SFC).
SFC resolution 20 Bit
Input sampling rate 30...54 kHz
THD+N < –105 dBFS @ 1 kHz, 0 dB
Frequency response ±0.1 dB
FS
Input impedance 110 (XLR and DIN inputs); 75 (Cinch input)
Date printed: 05.10.99 General E2/3
On-Air 2000 Digital Mixing System
Analog outputs Analog output modules are available with balancing transformer or with elec-
tronically balanced output.
Output level (transformer-balanced)
+4...+24 dBuFS @ RL = 100 kΩ; +4...+23 dBuFS @ RL = 300
Output level (electronically balanced)
+4...+23 dBuFS @ RL = 100 kΩ; +4...+22 dBuFS @ RL = 300
D/A converter 20 bit (Delta-Sigma, 128 x oversampling)
Dynamics typ. 101 dB (unweighted)
THD+N < –90 dBFS @ 1 kHz, –1 dBFS (+15 dBuFS)
Frequency response ±0.2 dB
Output impedance < 40
Digital outputs Digital output modules are equipped with two independent outputs according to
the AES/EBU standard (AES3-1992). On each of these outputs, the same signal is fed to two XLR sockets with individual buffers.
Output level 2...5 V
Output impedance 110
Equalizer Treble control (High) 5 kHz/10 kHz: ±15 dB (depending on Customer Code setting; refer to 12.2.12)
Equalizer (Mid) 200 Hz...10 kHz: ±15 dB
Bass control (Low) 200 Hz/400 Hz: ±15 dB
Crosstalk attenuation
Between channels > 90 dB
Input fader attenuation > 100 dB
Power supply Mains voltage 100...240 V, 50/60 Hz (auto-ranging)
Power consumption 150 VA typ. (On-Air 2000/24/4)
Note: Depending on the application, the on-air mixing consoles can have different
configurations. For this reason the abovementioned values are applicable only to a typical configuration; in an individual case, the values may differ. We reserve the right to make changes as technological progress may war­rant.
E2/4 General Date printed: 05.10.99
3 OPERATING CONCEPT
The normal operation of the console is as simple as possible. This has been achieved by reducing the number of operating elements to the minimum. Nevertheless, high flexibility has been achieved thanks to the use of touch­screen technology which just shows those operating elements which are needed at a certain time.
A channel fader and three buttons (ON, OFF, PFL) are the only hardware operating elements in a channel strip. All other functions are available through the touch-screens. To maintain a good console overview these touch-screens (channel screens) are located right above the channel strips. Symbols on the screens show the current settings on every channel. Touch­ing one of the symbols assigns the center touch-screen (control screen) to this function. Parameters can now be entered via the four rotary encoders (e.g. equalizer parameters), or directly through the assigned touch-screen (e.g. equalizer on/off). On the screen above the channel strips, the new set­tings are immediately updated. The On-Air 2000 concept has all current settings for every channel visible at any time. This innovative user surface is called the “Touch’n’action” concept and is patented.
On-Air 2000 Digital Mixing Console
In broadcast applications many DJs and operators without a special techni­cal education work on the same mixing console. Every DJ has his preferred console settings, mainly EQ parameters for his microphone. In the On-Air 2000, individual settings can be stored; by simply pressing a key, every op­erator can recall her or his particular, tailor-made setting and concentrate afterwards upon her/his essential task – presenting a radio program meeting the needs of the listeners. Radio stations often use the same mixing console type for on-air and pro­duction. The “Snapshot” feature easily turns the production console into an on-air console within seconds, if required.
Date printed: 05.10.99 Operating Concept E3/1
On-Air 2000 Digital Mixing System
3.1 Operating elements
3.1.1 Power switch
The power switch is located on the rear side of the console next to the power inlet.
E3/2 Operating Concept Date printed: 05.10.99
3.1.2 Central section, display unit
On-Air 2000 Digital Mixing Console
DIGITAL MIXING CONSOLEON-AIR 2000
START
RESET
STOP
[1][5] [2] [4] [3]
[1] Central touch-screen The central touch-screen display is used for parameter entries (refer to
sections 4, 5, 10, 12, and 13 for details) and always displays the current
time and date in digital and analog formats. Besides, the fader stopwatch and the user stopwatch are always displayed.
[2] Rotary encoders Depending on the current status, the rotary encoders are used for parameter
settings.
[3] Contrast knob For setting the LC display contrast, depending on the desired viewing angle
and the ambient light conditions.
[4] User stopwatch control Keys to control the user stopwatch (lower). Refer to section 5.12.
[5] Loudspeaker for PFL and talkback signals.
3.1.3 Central section, meter unit
The central meter section allows installing four 190 × 40 mm meter mod­ules. The level meters and/or groups of keys can be installed according to the customer's specification. Therefore, no universally valid statement can be given here.
Date printed: 05.10.99 Operating Concept E3/3
On-Air 2000 Digital Mixing System
3.1.4 Central section, monitoring and talkback
[7]
[1]
[2]
ON-AIR CR-MIC STUDIO-MIC
AUX 2
AUX 1
AUDIT
S REC
S PGM
DIM
CUT
MON
PFL
EXT 3
EXT 2
EXT 1
OFF AIR
EXT PFL
PFL
MON
PFL/TB
PFL
MON
PFL
MON
PHONES
F5
F4
F3
F2
F1
N–1 B
N–1 A
AUX 2
AUX 1
STUDIO
TALK BACK
[1] Control room monitoring selector
AUX 2/AUX 1: Auxiliary, general purpose output sums;
AUDIT: Auxiliary, general purpose output sum with configurable inputs;
Σ REC: Recorder output signal;
Σ PGM: Program (on-air) output signal;
PFL: PFL (pre-fader listening) sum; EXT 3: External analog input signal; EXT 2: External analog input signal; EXT 1: External analog input signal;
OFF AIR: External analog input signal (tuner for off-air listening).
[2] CR monitor speaker control
MON : Monitoring volume control.
DIM: If pressed, the monitor speaker level is reduced by 20 dB.
[3] [4] [5] [6] [8]
Ten mutually releasing keys for selecting the control room monitoring signal from the following sources:
The DIM function is activated automatically if one of the TALK BACK keys is pressed. If “CR DIM WHEN AUDITION SEL” is active (details: refer to section 12.2.2), the monitoring source is AUDIT, and the DJ micro­phone is on, the AUDIT level is not muted but reduced by 20 dB. If DIM is active, the key is illuminated.
E3/4 Operating Concept Date printed: 05.10.99
On-Air 2000 Digital Mixing Console
CUT: If pressed, the monitor speakers are muted, and the CUT key is illuminated.
As long as one of the CR or DJ microphones is on, the monitor speakers are automatically muted, and the CUT key is illuminated.
[3] PFL/TB PFL/TB: Volume control for the built-in PFL/TB speakers.
EXT PFL: The EXT PFL input can be used as an external PFL input to the monitoring
unit. If pressed, the key is illuminated, the external signal is routed to the PFL bus, and the external PFL control output is active.
PFL>MON: If PFL is active on any channel, the PFL signal is routed to the main moni-
tor speakers. If no PFL is selected, the monitoring signal is the stereo CR signal as selected. The PFL>MON key is illuminated if active.
[4] Headphones PHONES : Headphones volume control. The headphones socket (6.3 mm jack) is lo-
cated below the hand rest of the central console part. Three keys allow different monitoring modes:
PFL: PFL and TB signals are routed to the headphones.
MON/PFL: The left-channel headphones signal is the mono PFL signal, while the right-
channel headphones signal is the mono CR signal as selected by the moni­toring source selector [1]. If no PFL is selected, the headphones signal is the stereo CR signal as selected.
MON: The headphones signal is the same stereo signal as selected by the monitor-
ing source selector [1]. It is, however, not affected by the DIM and CUT functions.
[5] Talkback Selector for five talkback destinations:
N-1 B/N-1 A: Connection between the DJ microphone* in the control room and the corre-
sponding cleanfeed (N-1) bus; this allows talking e.g. to the connected tele­phone hybrid(s) or communication lines.
AUX 2/AUX 1: Connection between the DJ microphone* in the control room and the AUX 2
or AUX 1 outputs.
STUDIO: Connection between the DJ microphone* in the control room and the studio
speakers and headphones. The built-in PFL/TB loudspeakers and/or the headphones are used for talk­back listening in the control room.
* If a console is equipped with an additional talkback microphone, this micro-
phone is used instead of the DJ microphone.
[6] F1...F5 Programmable function keys, e.g. for additional CR monitor selector keys
(with optional Monitor Expander unit, refer to section 12.2.11).
[7] Signaling lamps ON-AIR Is turned on by a control signal on the “SIGN.” control connector on the
monitoring module.
CR-MIC Is on if at least one microphone in the control room is routed to the program
or to the record bus (i.e. the corresponding sum is selected, the channel is ON, and the fader is opened).
STUDIO-MIC Is on if at least one microphone in the studio is routed to the program or to
the record bus (i.e. the corresponding sum is selected, the channel is ON, and the fader is opened).
[8] Loudspeaker for PFL and talkback signals.
Date printed: 05.10.99 Operating Concept E3/5
On-Air 2000 Digital Mixing System
3.1.5 Fader units
[6]
[5]
[4]
[3]
OVL
PFL
10
0
10
20
30
40
50
60
OVL
PFL
10
0
10
20
30
40
50
60
OVL
PFL
10
0
10
20
30
40
50
60
OVL
PFL
10
0
10
20
30
40
50
60
OVL
PFL
10
0
10
20
30
40
50
60
OVL
PFL
10
0
10
20
30
40
50
60
[2]
[1]
ON
OFF
ON
OFF
ON
OFF
ON
OFF
ON
OFF
ON
OFF
[1] OFF (“key no. 3”) Keys for deactivating or activating a channel. Can be reconfigured. [2] ON (“key no. 2”) For details please refer to sections 9 and 15.
[3] Linear fader The audio path is fully digital, therefore the signal does not pass through the
fader; their stroke length is 104 mm. For details concerning fader start con­trol please refer to sections 9 and 15.
[4] PFL (“key no. 1”) Key for activating/deactivating the PFL (pre-fader listening) function. [5] OVL Channel overload indicator. [6] Contrast knob For setting the contrast of the LC display located above the fader panel,
depending on the desired viewing angle and the ambient light conditions.
E3/6 Operating Concept Date printed: 05.10.99
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