Studer OnAir2000 User Manual

Studer On-Air 2000
Digital Mixing Console
SW Version 3.0
Operating Instructions
Prepared and edited by Copyright by Studer Professional Audio AG
Studer Professional Audio AG Printed in Switzerland
Technical Documentation Order no. 10.27.4263 (Ed. 1199)
Althardstrasse 30
CH-8105 Regensdorf – Switzerland
http://www.studer.ch Subject to change
SAFETY / SECURITE / SICHERHEIT
I
To reduce the risk of electric shock, do not remove covers (or
back). No user-serviceable parts inside. Refer servicing to quali-
fied service personnel.
Afin de prévenir un choc électrique, ne pas enlever les couvercles
(où l’arrière) de l’appareil. Il ne se trouve à l’intérieur aucune
pièce pouvant être réparée par l’usager.
Um die Gefahr eines elektrischen Schlages zu vermeiden, entfer-
nen Sie keine Geräteabdeckungen (oder dessen Rückwand). Über-
lassen Sie Wartung und Reparatur qualifiziertem Fachpersonal.
This symbol is intended to alert the user to presence of uninsula-
ted “dangerous voltage” within the apparatus that may be of suf-
ficient magnitude to constitute a risk of electric shock to a person.
Ce symbole indique à l'utilisateur qu'il existent à l'intérieur de
l'appareil des tensions dangereuses”. Ces tensions élevées en-
trainent un risque de choc électrique en cas de contact.
Dieses Symbol deutet dem Anwender an, dass im Geräteinnern die
Gefahr der Berührung von “gefährlicher Spannung” besteht. Die
Grösse der Spannung kann zu einem elektrischen Schlag führen.
This symbol is intended to alert the user to the presence of
important instructions for operating and maintenance in the en-
closed documentation.
Ce symbole indique à l’utilisateur que la documentation jointe
contient d'importantes instructions concernant le fonctionnement
et la maintenance.
Dieses Symbol deutet dem Anwender an, dass die beigelegte Do-
kumentation wichtige Hinweise für Betrieb und Wartung enthält.
CAUTION: Lithium battery. Danger of explosion by incorrect handling. Re-
place by battery of the same make and type only.
ATTENTION: Pile au lithium. Danger d'explosion en cas de manipulation incor-
recte. Ne remplacer que par un modèle de même type.
ACHTUNG: Explosionsgefahr bei unsachgemässem Auswechseln der Lithium-
batterie. Nur durch den selben Typ ersetzen.
ADVARSEL: Lithiumbatterei. Eksplosinsfare. Udskinftning ma kun foretages af
en sagkyndig of som beskrevet i servicemanualen (DK).
SAFETY / SECURITE / SICHERHEIT
II
FIRST AID
(in case of electric shock)
1. Separate the person as quickly
as possible from the electric
power source:
by switching off the equipment
or by unplugging or disconnec-
ting the mains cable
pushing the person away from
the power source by using dry
insulating material (such as
wood or plastic).
After having sustained an elec-
tric shock, always consult a
doctor.
WARNING!
DO NOT TOUCH THE PERSON
OR HIS CLOTHING BEFORE
THE POWER IS TURNED OFF,
OTHERWISE YOU STAND
THE RISK OF SUSTAINING
AN ELECTRIC SHOCK AS
WELL!
2. If the person is unconscious:
check the pulse,
reanimate the person if respira-
tion is poor,
lay the body down, turn it to one
side, call for a doctor immed-
iately.
PREMIERS SECOURS
(en cas d'électrocution)
1. Si la personne est dans l'impos-
sibilité de se libérer:
Couper l'interrupteur principal
Couper le courant
Repousser la personne de l'ap-
pareil à l'aide d'un objet en ma-
tière non conductrice (matière
plastique ou bois)
Après une électrocution, tou-
jours consulter un médecin.
ATTENTION!
NE JAMAIS TOUCHER UNE
PERSONNE QUI EST SOUS
TENSION, SOUS PEINE DE
SUBIR EGALEMENT UNE
ELECTROCUTION.
2. En cas de perte de connaissance
de la personne électrocutée:
Controller le pouls
Si nécessaire, pratiquer la respi-
ration artificielle
Placer l'accidenté sur le flanc et
consulter un médecin.
ERSTE HILFE
(bei Stromunfällen)
1. Bei einem Stromunfall die be-
troffene Person so rasch wie
möglich vom Strom trennen:
Ausschalten des Gerätes
Ziehen oder Unterbrechen der
Netzzuleitung
Betroffene Person mit isoliertem
Material (Holz, Kunststoff) von
der Gefahrenquelle wegstossen
Nach einem Stromunfall sollte
immer ein Arzt aufgesucht wer-
den.
ACHTUNG!
EINE UNTER SPANNUNG
STEHENDE PERSON DARF
NICHT BERÜHRT WERDEN.
SIE KÖNNEN DABEI SELBST
ELEKTRISIERT WERDEN!
2. Bei Bewusstlosigkeit des Verun-
fallten:
Puls kontrollieren,
bei ausgesetzter Atmung künst-
lich beatmen,
Seitenlagerung des Verunfallten
vornehmen und Arzt verstän-
digen.
SICHERHEIT / SAFETY
III
Installation
Vor der Installation des Gerätes müssen die hier aufge-
führten und auch die weiter in dieser Anleitung mit
bezeichneten Hinweise gelesen und während der
Installation und des Betriebes beachtet werden.
Untersuchen Sie das Gerät und sein Zubehör auf allfäl-
lige Transportschäden.
Ein Gerät, das mechanische Beschädigung aufweist
oder in welches Flüssigkeit oder Gegenstände einge-
drungen sind, darf nicht ans Netz angeschlossen oder
muss sofort durch Ziehen des Netzsteckers vom Netz
getrennt werden. Das Öffnen und Instandsetzen des
Gerätes darf nur von Fachpersonal unter Einhaltung der
geltenden Vorschriften durchgeführt werden.
Falls dem Gerät kein konfektioniertes Netzkabel
beiliegt, muss dieses durch eine Fachperson unter
Verwendung der mitgelieferten Kabel-Gerätedose
IEC320/C13 oder IEC320/C19 und unter Berücksichti-
gung der einschlägigen, im geweiligen Lande geltenden
Bestimmungen angefertigt werden; siehe unten.
Vor Anschluss des Netzkabels an die Netzsteckdose
muss überprüft werden, ob die Stromversorgungs- und
Anschlusswerte des Gerätes (Netzspannung, Netz-
frequenz) innerhalb der erlaubten Toleranzen liegen.
Die im Gerät eingesetzten Sicherungen müssen den am
Gerät angebrachten Angaben entsprechen.
Ein Gerät mit einem dreipoligen Gerätestecker (Gerät
der Schutzklasse I) muss an eine dreipolige Netzsteck-
dose angeschlossen und somit das Gerätegehäuse mit
dem Schutzleiter der Netzinstallation verbunden werden
(Für Dänemark gelten Starkstrombestimmungen, Ab-
schnitt 107).
Installation
Before you install the equipment, please read and adhe-
re to the following recommendations and all sections of
these instructions marked with .
Check the equipment for any transport damage.
A unit that is mechanically damaged or which has been
penetrated by liquids or foreign objects must not be
connected to the AC power outlet or must be immedia-
tely disconnected by unplugging the power cable. Re-
pairs must only be performed by trained personnel in
accordance with the applicable regulations.
Should the equipment be delivered without a matching
mains cable, the latter has to be prepared by a trained
person using the attached female plug (IEC320/C13 or
IEC320/C19) with respect to the applicable regulations
in your country - see diagram below.
Before connecting the equipment to the AC power out-
let, check that the local line voltage matches the equip-
ment rating (voltage, frequency) within the admissible
tolerance. The equipment fuses must be rated in accor-
dance with the specifications on the equipment.
Equipment supplied with a 3-pole appliance inlet
(equipment conforming to protection class I) must be
connected to a 3-pole AC power outlet so that the
equipment cabinet is connected to the protective earth
conductor of the AC supply (for Denmark the Heavy
Current Regulations, Section 107, are applicable).
Female plug (IEC320), view from contact side:
L live; brown National American Standard: Black
N neutral; blue White
PE protective earth; green and yellow green
Connecteur femelle (IEC320), vue de la face aux contacts:
L phase; brun Standard national américain: Noir
N neutre; bleu Blanc
PE terre protective; vert et jaune Vert
Ansicht auf Steckkontakte der Kabel-Gerätesteckdose (IEC320):
L Phase; braun USA-Standard: Schwarz
N Nulleiter; blau Weiss
PE Schutzleiter; gelb/grün grün
SICHERHEIT / SAFETY
IV
Zugentlastung für den Netzanschluss
Zum Verankern von Steckverbindungen ohne mechani-
sche Verriegelung (z.B. IEC-Kaltgerätedosen) empfeh-
len wir die folgende Anordnung:
Vorgehen: Der mitgelieferte Kabelhalter ist selbstkle-
bend. Bitte beachten Sie bei der Montage die folgenden
Regeln:
1. Der Untergrund muss sauber, trocken und frei von
Fett, Öl und anderen Verunreinigungen sein. Tempe-
raturbereich für optimale Verklebung: 20...40° C.
2. Entfernen Sie die Schutzfolie auf der Rückseite des
Kabelhalters und bringen sie ihn mit kräftigem
Druck an der gewünschten Stelle an. Lassen sie ihn
unbelastet so lange wie möglich ruhen – die maxi-
male Klebekraft ist erst nach rund 24 Stunden er-
reicht.
3. Die Stabilität des Kabelhalters wird erhöht, wenn
Sie ihn zusätzlich verschrauben. Zu diesem Zweck
liegen ihm eine selbstschneidende Schraube sowie
eine M4-Schraube mit Mutter bei.
4. Legen Sie das Kabel gemäss Figur in den Halter ein
und pressen Sie die Klemme kräftig auf, bis das Ka-
bel fixiert ist.
Mains connector strain relief
For anchoring connectors without a mechanical lock
(e.g. IEC mains connectors), we recommend the fol-
lowing arrangement:
Procedure: The cable clamp shipped with your unit is
auto-adhesive. If mounting, please follow the rules be-
low:
1. The surface to be adhered to must be clean, dry, and
free from grease, oil or other contaminants. Best ap-
plication temperature range is 20...40° C.
2. Remove the plastic protective backing from the rear
side of the clamp and apply it firmly to the surface
at the desired position. Allow as much time as pos-
sible for curing. The bond continues to develop for
as long as 24 hours.
3. For improved stability, the clamp can be fixed with
a screw. For this purpose, a self-tapping screw and
an M4 bolt and nut are included.
4. Place the cable into the clamp as shown in the illus-
tration above and firmly press down the internal top
cover until the cable is fixed.
UMGEBUNGSBEDINGUNGEN / AMBIENT CONDITIONS
V
Lufttemperatur und Feuchtigkeit
Allgemein
Die Betriebstauglichkeit des Gerätes oder Systems ist unter
folgenden Umgebungsbedingungen gewährleistet:
EN 60721-3-3, Set IE32, Wert 3K3.
Diese Norm umfasst einen umfassenden Katalog von Parame-
tern; die wichtigsten davon sind: Umgebungstemperatur
+5...+40 °C; rel. Luftfeuchtigkeit 5...85% – d.h. weder Konden-
sation noch Eisbildung; abs. Luftfeuchtigkeit 1...25 g/m³; Tem-
peratur-Änderungsrate < 0,5 °C/min. In den folgenden Ab-
schnitten wird darauf näher eingegangen.
Unter den genannten Bedingungen startet und arbeitet das
Gerät oder System problemlos. Ausserhalb dieser Spezifikatio-
nen möglicherweise auftretende Probleme sind in den folgenden
Abschnitten beschrieben.
Umgebungstemperatur
Geräte und Systeme von Studer sind allgemein für einen Um-
gebungstemperaturbereich (d.h. Temperatur der eintretenden
Kühlluft) von +5...+40 °C ausgelegt. Bei Installation in einem
Schrank muss der vorgesehene Luftdurchsatz und dadurch die
Konvektionskühlung gewährleistet sein. Folgende Tatsachen
sind dabei zu berücksichtigen:
1. Die zulässige Umgebungstemperatur für den Betrieb der
Halbleiter-Bauelemente beträgt 0 °C bis +70 °C (commercial
temperature range for operation).
2. Der Luftdurchsatz der Anlage muss gewährleisten, dass die
austretende Kühlluft ständig kühler ist als 70 °C.
3. Die mittlere Erwärmung der Kühlluft soll 20 K betragen,
die maximale Erwärmung an den heissen Komponenten darf
somit um weitere 10 K höher liegen.
4. Zum Abführen einer Verlustleistung von 1 kW bei dieser
zulässigen mittleren Erwärmung ist eine Luftmenge von
2,65 m³/min notwendig.
Beispiel: Für ein Rack mit einer Leistungsaufnahme P = 800 W
ist eine Kühlluftmenge von 0,8 * 2,65 m³/min nötig, entspre-
chend 2,12 m³/min.
5. Soll die Kühlfunktion der Anlage (z.B. auch bei Lüfter-
Ausfall oder Bestrahlung durch Spotlampen) überwacht wer-
den, so ist die Temperatur der Abluft unmittelbar oberhalb der
Einschübe an mehreren Stellen im Rack zu messen; die An-
sprechtemperatur der Sensoren soll 65 bis 70 °C betragen.
Reif und Tau
Das unversiegelte System (Steckerpartien, Halbleiteranschlüs-
se) verträgt zwar leichte Eisbildung (Reif). Mit blossem Auge
sichtbare Betauung führt jedoch bereits zu Funktionsstörungen.
In der Praxis kann mit einem zuverlässigen Betrieb der Geräte
bereits im Temperaturbereich ab –15 °C gerechnet werden,
wenn für die Inbetriebnahme des kalten Systems die folgende
allgemeine Regel beachtet wird:
Wird die Luft im System abgekühlt, so steigt ihre relative
Feuchtigkeit an. Erreicht diese 100%, kommt es zu Nieder-
schlag, meist in der Grenzschicht zwischen der Luft und einer
kühleren Oberfläche, und somit zur Bildung von Eis oder Tau
an empfindlichen Systemstellen (Kontakte, IC-Anschlüsse etc.).
Ein störungsfreier Betrieb mit interner Betauung, unabhängig
von der Temperatur, ist nicht gewährleistet.
Air temperature and humidity
General
Normal operation of the unit or system is warranted under the
following ambient conditions defined by:
EN 60721-3-3, set IE32, value 3K3.
This standard consists of an extensive catalogue of parameters,
the most important of which are: ambient temperature +5...
+40° C, relative humidity 5...85% – i.e. no formation of con-
densation or ice; absolute humidity 1...25 g/m³; rate of tem-
perature change < 0,5 °C/min. These parameters are dealt with
in the following paragraphs.
Under these conditions the unit or system starts and works
without any problem. Beyond these specifications, possible
problems are described in the following sections.
Ambient temperature
Units and systems by Studer are generally designed for an am-
bient temperature range (i.e. temperature of the incoming air) of
+5...+40 °C. When rack mounting the units, the intended air
flow and herewith adequate cooling must be provided. The
following facts must be considered:
1. The admissible ambient temperature range for operation of
the semiconductor components is 0 °C to +70 °C (commercial
temperature range for operation).
2. The air flow through the installation must provide that the
outgoing air is always cooler than 70 °C.
3. Average heat increase of the cooling air shall be 20 K, al-
lowing for an additional maximum 10 K increase at the hot
components.
4. In order to dissipate 1 kW with this admissible average heat
increase, an air flow of 2,65 m³/min is required.
Example: A rack dissipating P = 800 W requires an air flow of
0,8 * 2,65 m³/min which corresponds to 2,12 m³/min.
5. If the cooling function of the installation must be monitored
(e.g. for fan failure or illumination with spot lamps), the outgo-
ing air temperature must be measured directly above the mod-
ules at several places within the rack. The trigger temperature of
the sensors should be 65 to 70 °C.
Frost and dew
The unsealed system parts (connector areas and semiconductor
pins) allow for a minute formation of ice or frost. However,
formation of dew visible with the naked eye will already lead to
malfunctions. In practice, reliable operation can be expected in
a temperature range above –15 °C, if the following general rule
is considered for putting the cold system into operation:
If the air within the system is cooled down, the relative humid-
ity rises. If it reaches 100%, condensation will arise, usually in
the boundary layer between the air and a cooler surface, to-
gether with formation of ice or dew at sensitive areas of the
system (contacts, IC pins, etc.). Once internal condensation
occurs, troublefree operation cannot be guaranteed, independent
of temperature.
UMGEBUNGSBEDINGUNGEN / AMBIENT CONDITIONS
VI
Vor der Inbetriebnahme muss das System auf allfällige interne
Betauung oder Eisbildung überprüft werden. Nur bei sehr
leichter Eisbildung kann mit direkter Verdunstung (Sublimati-
on) gerechnet werden; andernfalls muss das System im abge-
schalteten Zustand gewärmt und getrocknet werden.
Das System ohne feststellbare interne Eisbildung oder Betau-
ung soll möglichst homogen (und somit langsam) mit eigener
Wärmeleistung aufgewärmt werden; die Lufttemperatur der
Umgebung soll ständig etwas tiefer als diejenige der Syste-
mabluft sein.
Ist es unumgänglich, das abgekühlte System sofort in warmer
Umgebungsluft zu betreiben, so muss diese entfeuchtet sein.
Die absolute Luftfeuchtigkeit muss dabei so tief sein, dass die
relative Feuchtigkeit, bezogen auf die kälteste Oberfläche im
System, immer unterhalb 100% bleibt.
Es ist dafür zu sorgen, dass beim Abschalten des Systems die
eingeschlossene Luft möglichst trocken ist (d.h. vor dem Ab-
schalten im Winter den Raum mit kalter, trockener Luft belüf-
ten und feuchte Gegenstände, z.B. Kleider, entfernen).
Die Zusammenhänge sind im folgenden Klimatogramm er-
sichtlich. Zum kontrollierten Verfahren gehören Thermometer
und Hygrometer sowie ein Thermometer innerhalb des Systems.
Beispiel 1: Ein Ü-Wagen mit einer Innentemperatur von 20 °C
und 40% relativer Luftfeuchtigkeit wird am Abend abgeschal-
tet. Sinkt die Temperatur unter +5 °C, bildet sich Tau oder Eis.
Beispiel 2: Ein Ü-Wagen wird morgens mit 20 °C warmer Luft
von 40% relativer Luftfeuchtigkeit aufgewärmt. Auf Teilen, die
kälter als +5 °C sind, bildet sich Tau oder Eis.
Before putting into operation, the system must be checked for
internal formation of condensation or ice. Only with a minute
formation of ice, direct evaporation (sublimation) may be ex-
pected; otherwise the system must be heated and dried while
switched off.
A system without visible internal formation of ice or condensa-
tion should be heated up with its own heat dissipation, as ho-
mogeneously (and subsequently as slow) as possible; the ambi-
ent temperature should then always be lower than the outgoing
air.
If it is absolutely necessary to operate the system immediately
within warm ambient air, this air must be dehydrated. In such a
case, the absolute humidity must be so low that the relative
humidity, related to the coldest system surface, always remains
below 100%.
Ensu re that t he enclosed air is as dr y as p ossibl e when powe-
ring off (i.e. before switching off in winter, aerate the room with
cold, dry air, and remove humid objects as clothes from the
room).
These relationships are visible from the following climatogram.
For a controlled procedure, thermometer and hygrometer as well
as a thermometer within the system will be required.
Example 1: An OB-van having an internal temperature of
20 °C and rel. humidity of 40% is switched off in the evening.
If temperature falls below +5 °C, dew or ice will be forming.
Example 2: An OB-van is heated up in the morning with air of
20 °C and a rel. humidity of 40%. On all parts being cooler than
+5 °C, dew or ice will be forming.
WARTUNG / MAINTENANCE
VII
Wartung und Reparatur
Durch Entfernen von Gehäuseteilen, Abschirmungen
etc. werden stromführende Teile freigelegt. Deshalb
müssen u.a. die folgenden Grundsätze beachtet werden:
Eingriffe in das Gerät dürfen nur von Fachpersonal
unter Einhaltung der geltenden Vorschriften vorge-
nommen werden.
Vor Entfernen von Gehäuseteilen muss das Gerät aus-
geschaltet und vom Netz getrennt werden.
Bei geöffnetem, vom Netz getrenntem Gerät dürfen
Teile mit gefährlichen Ladungen (z. B. Kondensatoren,
Bildröhren) erst nach kontrollierter Entladung, heiße
Bauteile (Leistungshalbleiter, Kühlkörper etc.) erst
nach deren Abkühlen berührt werden.
Bei Wartungsarbeiten am geöffneten, unter Netz-
spannung stehenden Gerät dürfen blanke Schaltungs-
teile und metallene Halbleitergehäuse weder direkt noch
mit nichtisoliertem Werkzeug berührt werden.
Zusätzliche Gefahren bestehen bei unsachgemässer
Handhabung besonderer Komponenten:
Explosionsgefahr bei Lithiumzellen, Elektrolyt-Kon-
densatoren und Leistungshalbleitern
Implosionsgefahr bei evakuierten Anzeigeeinheiten
Strahlungsgefahr bei Lasereinheiten (nichtioni-
sierend), Bildröhren (ionisierend)
Verätzungsgefahr bei Anzeigeeinheiten (LCD) und
Komponenten mit flüssigem Elektrolyt.
Solche Komponenten dürfen nur von ausgebildetem
Fachpersonal mit den vorgeschriebenen Schutzmitteln
(u.a. Schutzbrille, Handschuhe) gehandhabt werden.
Maintenance and Repair
The removal of housing parts, shields, etc. exposes
energized parts. For this reason the following precauti-
ons should be observed:
Maintenance should only be performed by trained per-
sonnel in accordance with the applicable regulations.
The equipment should be switched off and disconnected
from the AC power outlet before any housing parts are
removed.
Even if the equipment is disconnected from the power,
parts with hazardous charges (e.g. capacitors, picture
tubes) must not be touched until they have been pro-
perly discharged. Touch hot components (power semi-
conductors, heat sinks, etc.) only when cooled off.
If maintenance is performed on a unit that is opened
and switched on, no uninsulated circuit components and
metallic semiconductor housings must be touched nei-
ther with your bare hands nor with uninsulated tools.
Certain components pose additional hazards:
Explosion hazard from lithium batteries, electrolytic
capacitors and power semiconductors
Implosion hazard from evacuated display units
Radiation hazard from laser units (non-ionizing),
picture tubes (ionizing)
Caustic effect of display units (LCD) and such com-
ponents containig liquid electrolyte.
Such components should only be handled by trained
personnel who are properly protected (e.g. safety
goggles, gloves).
WARTUNG / MAINTENANCE
VIII
Elektrostatische Entladung (ESD)
bei Wartung und Reparatur
ATTENTION:
ATTENTION:
ACHTUNG:
Viele ICs und andere Halbleiter sind empfindlich gegen
elektrostatische Entladung (ESD). Unfachgerechte Be-
handlung von Baugruppen mit solchen Komponenten
bei Wartung und Reparatur kann deren Lebensdauer
drastisch vermindern.
Bei der Handhabung der ESD-empfindlichen Kompo-
nenten sind u.a. folgende Regeln zu beachten:
ESD-empfindliche Komponenten dürfen ausschliess-
lich in dafür bestimmten und bezeichneten Ver-
packungen gelagert und transportiert werden.
Unverpackte, ESD-empfindliche Komponenten dür-
fen nur in dafür eingerichteten Schutzzonen (EPA,
z.B. Gebiet für Feldservice, Reparatur- oder Service-
platz) gehandhabt und nur von Personen berührt
werden, die durch ein Handgelenkband mit Serie-
widerstand mit dem Massepotential des Reparatur-
oder Serviceplatzes verbunden sind. Das gewartete
Gerät wie auch Werkzeug, Hilfsmittel, EPA-
taugliche (elektrisch halbleitende) Arbeits-, Ablage-
und Bodenmatten müssen ebenfalls mit diesem Po-
tential verbunden sein.
Die Anschlüsse der ESD-empfindlichen Komponen-
ten dürfen unkontrolliert weder mit elektrostatisch
aufladbaren (Gefahr von Spannungsdurchschlag),
noch mit metallischen Oberflächen (Schockent-
ladungsgefahr) in Berührung kommen.
Um undefinierte transiente Beanspruchung der Kom-
ponenten und deren eventuelle Beschädigung durch
unerlaubte Spannung oder Ausgleichsströme zu ver-
meiden, dürfen elektrische Verbindungen nur am ab-
geschalteten Gerät und nach dem Abbau allfälliger
Kondensatorladungen hergestellt oder getrennt wer-
den.
Electrostatic Discharge (ESD)
during Maintenance and Repair
Observe precautions for handling devices sensitive to
electrostatic discharge!
Respecter les précautions d’usage concernant la mani-
pulation de composants sensibles à l’électricité statique!
Vorsichtsmassnahmen bei Handhabung elektrostatisch
entladungsgefährdeter Bauelemente beachten!
Many ICs and semiconductors are sensitive to elec-
trostatic discharge (ESD). The life of components con-
taining such elements can be drastically reduced by
improper handling during maintenance and repair work.
Please observe the following rules when handling ESD
sensitive components:
ESD sensitive components should only be stored and
transported in the packing material specifically pro-
vided for this purpose.
Unpacked ESD sensitive components should only be
handled in ESD protected areas (EPA, e.g. area for
field service, repair or service bench) and only be
touched by persons who wear a wristlet that is con-
nected to the ground potential of the repair or service
bench by a series resistor. The equipment to be repai-
red or serviced and all tools, aids, as well as electri-
cally semiconducting work, storage and floor mats
should also be connected to this ground potential.
The terminals of ESD sensitive components must not
come in uncontrolled contact with electrostatically
chargeable (voltage puncture) or metallic surfaces
(discharge shock hazard).
To prevent undefined transient stress of the compo-
nents and possible damage due to inadmissible volta-
ges or compensation currents, electrical connections
should only be established or separated when the
equipment is switched off and after any capacitor
charges have decayed.
WARTUNG / MAINTENANCE
IX
SMD-Bauelemente
Der Austausch von SMD-Bauelementen ist ausschliess-
lich geübten Fachleuten vorbehalten. Für verwüstete
Platinen können keine Ersatzansprüche geltend gemacht
werden. Beispiele für korrekte und falsche SMD-
Lötverbindungen in der Abbildung weiter unten.
Bei Studer werden keine handelsüblichen SMD-Teile
bewirtschaftet. Für Reparaturen sind die notwendigen
Bauteile lokal zu beschaffen. Die Spezifikationen von
Spezialbauteilen finden Sie in der Serviceanleitung.
SMD Components
SMDs should only be replaced by skilled specialists.
No warranty claims will be accepted for circuit boards
that have been ruined. Proper and improper SMD sol-
dering joints are depicted below.
Studer does not keep any commercially available SMDs
in stock. For repair the corresponding devices should be
purchased locally. The specifications of special compo-
nents can be found in the service manual.
EMV / EMC
X
Störstrahlung und Störfestigkeit
Das Gerät entspricht den Schutzanforderungen auf dem
Gebiet elektromagnetischer Phänomene, wie u.a. in den
Richtlinien 89/336/EWG und FCC, Part 15, aufgeführt:
1. Vom Gerät erzeugte elektromagnetische Strahlung ist
soweit begrenzt, dass bestimmungsgemässer Betrieb
anderer Geräte und Systeme möglich ist.
2. Das Gerät weist eine angemessene Festigkeit gegen
elektromagnetische Störungen auf, so dass sein be-
stimmungsgemässer Betrieb möglich ist.
Das Gerät wurde getestet und erfüllt die Bedingungen
der im Kapitel „Technische Daten“ aufgeführten EMV-
Standards. Die Limiten dieser Standards gewährleisten
mit angemessener Wahrscheinlichkeit sowohl den
Schutz der Umgebung wie auch entsprechende Stör-
festigkeit des Gerätes. Absolute Garantie, dass keine
unerlaubte elektromagnetische Beeinträchtigung wäh-
rend des Betriebes entsteht, ist jedoch nicht gegeben.
Um die Wahrscheinlichkeit solcher Beeinträchtigung
weitgehend auszuschliessen, sind u.a. folgende Mass-
nahmen zu beachten:
Installieren Sie das Gerät gemäss den Angaben in der
Betriebsanleitung, und verwenden Sie das mitgelie-
ferte Zubehör.
Verwenden Sie im System und in der Umgebung, in
denen das Gerät eingesetzt ist, nur Komponenten
(Anlagen, Geräte), die ihrerseits die Anforderungen
der obenerwähnten Standards erfüllen.
Sehen Sie ein Erdungskonzept des Systems vor, das
sowohl die Sicherheitsanforderungen (die Erdung der
Geräte gemäss Schutzklasse I mit einem Schutzleiter
muss gewährleistet sein), wie auch die EMV-Belange
berücksichtigt. Bei der Entscheidung zwischen stern-
oder flächenförmiger bzw. kombinierter Erdung sind
Vor- und Nachteile gegeneinander abzuwägen.
Benutzen Sie abgeschirmte Kabel, wo vorgesehen.
Achten Sie auf einwandfreie, grossflächige, korrosi-
onsbeständige Verbindung der Abschirmung zum
entsprechenden Steckeranschluss und dessen Gehäu-
se. Beachten Sie, dass eine nur an einem Ende ange-
schlossene Kabelabschirmung als Sende- bzw. Emp-
fangsantenne wirken kann (z.B. bei wirksamer Ka-
bellänge von 5 m oberhalb von 10 MHz), und dass
die Flanken digitaler Kommunikationssignale hoch-
frequente Aussendungen verursachen (z.B. LS- oder
HC-Logik bis 30 MHz).
Vermeiden Sie Bildung von Masseschleifen oder ver-
mindern Sie deren unerwünschte Auswirkung, indem
Sie deren Fläche möglichst klein halten und den darin
fliessenden Strom durch Einfügen einer Impedanz
(z.B. Gleichtaktdrossel) reduzieren.
Electromagnetic Compatibility
The equipment conforms to the protection requirements
relevant to electromagnetic phenomena that are listed in
the guidelines 89/336/EC and FCC, part 15.
1. The electromagnetic interference generated by the
equipment is limited in such a way that other equip-
ment and systems can be operated normally.
2. The equipment is adequately protected against elec-
tromagnetic interference so that it can operate cor-
rectly.
The unit has been tested and conforms to the EMC
standards applicable to residential, commercial and
light industry, as listed in the section „Technical Data“.
The limits of these standards reasonably ensure protec-
tion of the environment and corresponding noise immu-
nity of the equipment. However, it is not absolutely
warranted that the equipment will not be adversely af-
fected by electromagnetic interference during operation.
To minimize the probability of electromagnetic interfer-
ence as far as possible, the following recommendations
should be followed:
Install the equipment in accordance with the opera-
ting instructions. Use the supplied accessories.
In the system and in the vicinity where the equipment
is installed, use only components (systems, equip-
ment) that also fulfill the above EMC standards.
Use a system grounding concept that satisfies the
safety requirements (protection class I equipment
must be connected with a protective ground conduc-
tor) that also takes into consideration the EMC requi-
rements. When deciding between radial, surface or
combined grounding, the advantages and disad-
vantages should be carefully evaluated in each case.
Use shielded cables where shielding is specified. The
connection of the shield to the corresponding con-
nector terminal or housing should have a large sur-
face and be corrosion-proof. Please note that a cable
shield connected only single-ended can act as a
transmitting or receiving antenna (e.g. with an effec-
tive cable length of 5 m, the frequency is above
10 MHz) and that the edges of the digital communi-
cation signals cause high-frequency radiation (e.g.
LS or HC logic up to 30 MHz).
Avoid ground loops or reduce their adverse effects
by keeping the loop surface as small as possible, and
reduce the noise current flowing through the loop by
inserting an additional impedance (e.g. common-
mode rejection choke).
Konformitätserklärungen / Declarations of conformity
XI
Class A Equipment - FCC Notice
This equipment has been tested and found to comply with
the limits for a Class A digital device, pursuant to Part 15
of the FCC Rules. These limits are designed to provide a
reasonable protection against harmful interference when the
equipment is operated in a commercial environment. This
equipment generates, uses, and can r adiate radio frequency
energy and, if not installed and used in accordance with the
instruction manual, may cause harmful interference to radio
communications. Operation of this equipment in a residen-
tial area is likely to cause harmful interference in which
case the user will be required to correct the interference at
his own expense.
Caution:
Any changes or modifications not expressly approved by
the manufacturer could void the user's authority to operate
the equipment. Also refer to relevant information in this
manual.
CE-Konformitätserklärung
Der Hersteller,
Studer Professional Audio AG,
CH-8105 Regensdorf,
erklärt in eigener Verant wortung, dass das Produkt
Studer On-Air 2000, Digital-Mischpult,
(ab Serie-Nr. 1001),
auf das sich diese Erklärung bezieht, entsprechend den
Bestimmungen der EU-Richtlinien und Ergänzungen
Elektromagnetische Verträglichkeit (EMV):
89/336/EWG + 92/31/EWG + 93/68/EWG
Niederspannung:
73/23/EWG + 93/68/EWG
mit den folgenden Normen und normativen Dokumenten
übereinstimmt:
Sicherheit:
Schutzklasse 1, EN 60950:1992 + A1/A2:1993
•EMV:
EN 55103-1/-2:1996, elektromagnetische Umgebungen
E2 und E4.
Regensdorf, 7. Mai 1997
B. Hochstrasser, Geschäftsleiter
P. Fial a , Leiter QS
CE Declaration of C onform ity
The man ufacturer ,
Studer Professional Audio AG,
CH-8105 Regensdorf,
declares under his sole responsibility that the product
Studer On-Air 2000, Digital Mixing Console,
(on from serial No. 1001),
to which this declaration relates, according to following
regulations of EU directives and amendm ent s
Electromagnetic Compatibility (EMC):
89/336/EEC + 92/31/EE C + 93/68/ E EC
Low Voltage (LVD):
73/23/EEC + 93/68/EE C
is in conformity with the following standards or other nor-
mative documents:
•Safety:
Class 1, EN 60950:1992 + A1/A2:1993
•EMC:
EN 55103-1/-2:1996, electromagnetic environments E2
and E4.
Regensdorf, May 7, 1997
B. Hochstrasser, Man agin g d i rector
P. Fial a , Mana g er QA
On-Air 2000 Digital Mixing Console
Date printed: 05.10.99 SW V3.0 Contents E0/1
CONTENTS
1 Introduction...........................................................................................................................................................E1/1
1.1 Block diagram V3.0.......................................................................................................................................... E1/2
2 General.................................................................................................................................................................. E2/1
2.1 Utilization for the purpose intended................................................................................................................ E2/1
2.2 First steps....................................................................................................................................................... E2/1
2.2.1 Unpacking and inspection ......................................................................................................................E2/1
2.2.2 Installation .............................................................................................................................................E2/1
2.2.3 Adjustments, repair ................................................................................................................................ E2/2
2.2.4 PC-card.................................................................................................................................................. E2/2
2.3 Technical specifications (preliminary) ............................................................................................................ E2/3
3 Operating concept................................................................................................................................................. E3/1
3.1 Operating elements.........................................................................................................................................E3/2
3.1.1 Power switch .......................................................................................................................................... E3/2
3.1.2 Central section, display unit ...................................................................................................................E3/3
3.1.3 Central section, meter unit......................................................................................................................E3/3
3.1.4 Central section, monitoring and talkback................................................................................................ E3/4
3.1.5 Fader units .............................................................................................................................................E3/6
4 Channel functions.................................................................................................................................................. E4/1
4.1 Keys ...............................................................................................................................................................E4/1
4.2 Faders ............................................................................................................................................................E4/1
4.3 Overload indicator.......................................................................................................................................... E4/1
4.4 Channel screen...............................................................................................................................................E4/2
4.4.1 Channel screen fields .............................................................................................................................E4/2
4.4.2 Multi-Source Selector page..................................................................................................................... E4/4
4.4.3 Channel Control page, microphone input ...............................................................................................E4/5
4.4.4 Channel Control page, line input............................................................................................................E4/6
4.4.5 Equalizer control page, microphone input ..............................................................................................E4/8
4.4.6 Equalizer control page, line input...........................................................................................................E4/9
5 Master functions.................................................................................................................................................... E5/1
5.1 Login/logout...................................................................................................................................................E5/1
5.2 AUX and Insert control ..................................................................................................................................E5/2
5.3 N–1/audition master and telephone hybrid control ..........................................................................................E5/3
5.3.1 Additional N–1 outputs .......................................................................................................................... E5/4
5.4 Studio monitoring...........................................................................................................................................E5/5
5.5 Mixer set-up................................................................................................................................................... E5/6
5.6 Snapshots.......................................................................................................................................................E5/7
5.6.1 Recall a snapshot from memory..............................................................................................................E5/7
5.6.2 Save a snapshot to memory.....................................................................................................................E5/8
5.6.3 Delete a snapshot from memory..............................................................................................................E5/8
On-Air 2000 Digital Mixing Console
E0/2 Contents SW V3.0 Date printed: 05.10.99
5.7 Microphone settings ....................................................................................................................................... E5/9
5.7.1 Recall a microphone setting from memory..............................................................................................E5/9
5.7.2 Save a microphone setting to memory .................................................................................................. E5/10
5.7.3 Delete a microphone setting from memory ........................................................................................... E5/10
5.8 Using PC-cards ............................................................................................................................................ E5/11
5.8.1 Load a snapshot/mic setting from PC-card............................................................................................ E5/11
5.8.2 Save a snapshot/mic setting to PC-card ................................................................................................E5/11
5.8.3 Delete a snapshot/mic setting from PC-card .........................................................................................E5/12
5.9 Administrator............................................................................................................................................... E5/13
5.9.1 Features................................................................................................................................................ E5/13
5.9.2 Administrator selection of snapshots/mic settings................................................................................. E5/14
5.9.3 Users with and without a password....................................................................................................... E5/14
5.10 User administration...................................................................................................................................... E5/15
5.11 System configuration.................................................................................................................................... E5/15
5.12 Watch and stopwatch.................................................................................................................................... E5/16
5.12.1 Watch .................................................................................................................................................. E5/16
5.12.2 Fader stopwatch ................................................................................................................................... E5/17
5.12.3 User stopwatch..................................................................................................................................... E5/17
5.13 Master fader for PGM and REC outputs....................................................................................................... E5/18
6 Level meters ..........................................................................................................................................................E6/1
6.1 Standard level meters ..................................................................................................................................... E6/1
7 Monitoring............................................................................................................................................................. E7/1
7.1 Control room monitoring................................................................................................................................ E7/1
7.2 Studio monitoring ..........................................................................................................................................E7/4
7.3 Talkback ........................................................................................................................................................E7/5
7.3.1 Additional talkback functions................................................................................................................. E7/5
7.3.2 Talkback settings.................................................................................................................................... E7/6
7.4 External PFL.................................................................................................................................................. E7/7
8 Signaling................................................................................................................................................................ E8/1
9 Machine Control ...................................................................................................................................................E9/1
9.1 Keys and LEDs............................................................................................................................................... E9/2
9.2 Control outputs............................................................................................................................................... E9/4
9.2.1 CTRL OUT1 .......................................................................................................................................... E9/4
9.2.2 CTRL OUT2 .......................................................................................................................................... E9/4
9.3 Control inputs ................................................................................................................................................ E9/5
9.3.1 CTRL IN................................................................................................................................................ E9/5
9.3.2 EXTERN PFL input...............................................................................................................................E9/5
9.4 CTRL OUT1/2 & CTRL IN application examples .......................................................................................... E9/6
On-Air 2000 Digital Mixing Console
Date printed: 05.10.99 SW V3.0 Contents E0/3
10 Automation ...................................................................................................................................................... E10/1
10.1 Introduction.................................................................................................................................................. E10/1
10.2 Features of the On-Air 2000 CAB support.................................................................................................... E10/2
10.3 Application handling.................................................................................................................................... E10/4
10.3.1 Configuration for automation control.................................................................................................... E10/4
10.3.2 Routing................................................................................................................................................E10/4
10.3.3 Communication time-out...................................................................................................................... E10/6
10.3.4 Output selection ................................................................................................................................... E10/6
10.3.5 Start a new title from schedule..............................................................................................................E10/6
10.3.6 Next Indication..................................................................................................................................... E10/8
10.3.7 Indication of the currently playing input line........................................................................................ E10/8
10.3.8 Ready indication................................................................................................................................... E10/9
10.3.9 AUX mode........................................................................................................................................... E10/9
10.3.10 Text display..........................................................................................................................................E10/9
10.3.11 Input gain control................................................................................................................................. E10/9
10.3.12 Pre-listening......................................................................................................................................... E10/9
10.3.13 Billing................................................................................................................................................ E10/10
10.3.14 Time synchronisation .........................................................................................................................E10/10
11 User modes....................................................................................................................................................... E11/1
11.1 Purpose of user modes..................................................................................................................................E11/1
11.2 Access configurable functions of the console................................................................................................. E11/2
11.3 User administration ......................................................................................................................................E11/4
11.4 Administration functions.............................................................................................................................. E11/5
11.5 Log-in procedure and defaults ...................................................................................................................... E11/6
12 Configuration................................................................................................................................................... E12/1
12.1 Configuration handling ................................................................................................................................ E12/1
12.2 Configuration procedure............................................................................................................................... E12/2
12.2.1 Input ....................................................................................................................................................E12/4
12.2.2 Common settings.................................................................................................................................. E12/7
12.2.3 Output.................................................................................................................................................. E12/8
12.2.4 Level meter ..........................................................................................................................................E12/8
12.2.5 Time & date......................................................................................................................................... E12/9
12.2.6 System test ......................................................................................................................................... E12/10
12.2.7 Software update.................................................................................................................................. E12/11
12.2.8 Console dump ....................................................................................................................................E12/11
12.2.9 System synchronization...................................................................................................................... E12/12
12.2.10 Automation ........................................................................................................................................ E12/13
12.2.11 Monitor expander (optional)............................................................................................................... E12/13
12.2.12 Customer code.................................................................................................................................... E12/15
13 Sw update ........................................................................................................................................................ E13/1
13.1 Software structure......................................................................................................................................... E13/1
13.1.1 The CPU software package................................................................................................................... E13/1
13.1.2 DSP software package..........................................................................................................................E13/1
13.2 SW update procedure.................................................................................................................................... E13/2
13.2.1 Error handling PC-Card update............................................................................................................ E13/4
On-Air 2000 Digital Mixing Console
E0/4 Contents SW V3.0 Date printed: 05.10.99
14 System diagnostics and error handling........................................................................................................... E14/1
14.1 Error, warning, and information messages ................................................................................................... E14/1
14.1.1 System diagnostics ............................................................................................................................... E14/2
14.2 Indication on failure of restricted functions...................................................................................................E14/6
14.3 System test ................................................................................................................................................... E14/7
14.3.1 Buttons/faders...................................................................................................................................... E14/7
14.3.2 Fader calibration ..................................................................................................................................E14/8
14.3.3 Display................................................................................................................................................. E14/9
14.3.4 PC-Card............................................................................................................................................... E14/9
14.3.5 SW versions....................................................................................................................................... E14/10
15 Hardware modules .......................................................................................................................................... E15/1
15.1 Mic input module 1.942.220......................................................................................................................... E15/1
15.2 Analog line input module 1.942.230 (w. transformer); 1.942.232 (transformerless)...................................... E15/3
15.3 Digital input module 1.942.240.................................................................................................................... E15/3
15.4 Analog hex input module (optional) 1.942.245............................................................................................. E15/4
15.5 Digital hex input module (optional) 1.942.250 ............................................................................................. E15/5
15.6 Telephone hybrid module (optional) 1.942.140............................................................................................. E15/6
15.7 Analog output module (with balancing transformers) 1.942.120.................................................................. E15/7
15.8 Dual analog output module (with balancing transformers) 1.942.121...........................................................E15/7
15.9 Digital output module 1.942.124 ..................................................................................................................E15/8
15.10 Analog insert module (optional) 1.942.160................................................................................................... E15/9
15.11 Digital insert module (optional) 1.942.165 ................................................................................................. E15/10
15.12 Monitoring module 1.942.134/1.942.180.................................................................................................... E15/11
15.13 Monitoring module w. extension (optional) 1.942.138/1.942.181 ............................................................... E15/17
15.14 Serial interface module (optional) 1.942.145 .............................................................................................. E15/20
15.15 Clock sync module (optional) 1.942.135..................................................................................................... E15/21
15.16 Time sync module (optional) 1.942.150...................................................................................................... E15/22
15.17 TB mic input module (optional) 1.942.219 ................................................................................................. E15/23
15.18 DIP switches & jumpers ............................................................................................................................. E15/26
On-Air 2000 Digital Mixing Console
Date printed: 05.10.99 SW V3.0 Intro E1/1
1 INTRODUCTION
On-Air 2000 is a low-cost yet powerful digital mixing console for “on-air”
and small recording and editing studio applications. It has a modularity of 6
channels; the maximum console size is limited to 24 channel strips (stereo or
mono).
On-Air 2000 is based on a touch-screen user surface. Only the most impor-
tant functions have hardware control elements. Unlike other digital mixing
consoles, On-Air 2000 does not need external racks and power supply. Eve-
rything is integrated in a single, lightweight console.
Since it is fully digital, it can be adapted to the current user using snapshot
automation. Extensive configuration possibilities allow On-Air 2000 to be
integrated into almost any broadcast studio environment.
For an overview, please refer to the On-Air 2000 block diagram located on
the following two pages.
On-Air 2000 Digital Mixing Console
E1/2 Intro SW V3.0 Date printed: 05.10.99
1.1 Block diagram V3.0
A
PREAMP.1 A
D
D
PREAMP.2
PREAMP.3
D
A
A
D
A
DJ MIC 1
GUEST MIC.1
DC REJ
PHASE
DIG PAD EQU.
FILTER/
(INSERT) FADER BALANCE
INPUT CHANNELS
STUDIO MIC.1
GUEST MIC.2
STUDIO MIC.2
LINE INP. 1
TEL.HYBR. 1
HL INP.1
HL INP.2
TEL.HYBR. 2
a
a
a
a
a
a
a
a
a
INPUTS
DC REJ FILTER/
INSERT
INSERT
INSERT
PF
AF
PF
AF
CTRL I/O
CTRL I/O
CTRL I/O
CTRL I/O
CTRL I/O
(INSERT)DIG PAD
PHASE
EQU. BALANCEFADER
(INSERT)
PHASE
DC REJ
DIG PAD
FILTER/
EQU. BALANCEFADER
PF
AF
PF
AF
PF
AF
PF
AF
D
D
D
LINE INP. 2
a
AES INP.1d
d
SFC
AES INP.2
D
CD 2
d
d
SFC
D
AES INP.3
D
JINGLE
d
d
SFC
D
-
a
A
D
CD 1
a
a
a
a
a
TAPE 1
TAPE 2
TT 1
TT 2
EXT.1
EXT.2
ANALOG INP.WITH 6CH SELECTOR (OPTION)
a
EXT.2
EXT.1
TT 2
-
a
a
D
A
TT 1
TAPE 1
TAPE 2
a
a
a
HL INP.3
HL INP.4
CTRL I/O
CTRL I/O
CTRL I/O
CTRL I/O
CTRL I/O
CTRL I/O
a
a
a
a
AES INP.5
AES INP.4
AUTO 1
DAT1
AUTO 2
DAT2
d
d
d
d
SFC
SFC
D
D
D
D
(INSERT)DIG PAD
DC REJ
PHASE
FILTER/
EQU. BALANCEFADER
MONO LINE
STEREO LINE
ANALOG SIGNAL
DIGITAL SIGNAL (AES EBU)
CONFIG SELECTION
MONITOR SELECTOR
d
a
PF
AF
PF
AF
XLR CONNECTOR
D-TYPE CONNECTOR
DIN MULTIPIN (39p)
BANTAM JACK
HEADPHONE JACK SOCKET
CTRL I/O
* N-1 A/B STANDARD / N-1 C...F OPTIONAL
** MASTER FADER (IF CONFIGURED)
*** IF "PFL CUT ON CHANNEL ACTIVE" IS YES
AUX2
AUX1
N-1 A
N-1 F*
AUX 1
AUX 2
PFL
ON
CHANNEL
MUTE
***
AUX2
AUX1
AUX 2
PFL
N-1 A
N-1 F*
AUX 1
AUX1
AUX2
N-1 F*
AUX 1
PFL
AUX 2
N-1 A
CHANNEL ON
CHANNEL ON
ON
CHANNEL
MUTE
***
***
CHANNEL ON
TB TO STUDIO
TB TO CR
TB TO STUDIO
TB TO CR
BUS
AUX2
AUX1
PFL
AUX 2
AUX 1
N-1 F*
N-1 A
CHANNEL ON
ON
CHANNEL
ON
CHANNEL
MUTE
MUTE
***
Σ
PROGRAM
Σ
RECORD
Σ AUDITION
Σ
PROGRAM
Σ
RECORD
Σ
AUDITION
Σ
PROGRAM
Σ RECORD
Σ
AUDITION
Σ
PROGRAM
Σ
RECORD
Σ
AUDITION
+
+
+
+
+
+
+
+
+
+
+
+
+
+
+
+
+
+
+
+
+
+
+
+
+
+
+
+
+
+
+
+
+
+
+
+
On-Air 2000 Digital Mixing Console
Date printed: 05.10.99 SW V3.0 Intro E1/3
PFL
REGENSDORF
SWITZERLAND
0
22.3.99 STI
OA2000_V3
ON AIR 2000 V3.0
BLOCK DIAGRAM AUDIO
1 19.4.99 STI
PPM
BAR-
GRAPH
VCA
BAR-
GRAPH
PPM
DIM
DIM
DIM
DIM
DIM
DIM
VCA
ANALOGDIGITAL
VCA
VOL CONTR
VOL CONTR
VOL CONTR
AUX1 MASTER
C+S TALK
MASTER AND MONITORING
METER 1
(INSERT)
(INSERT)
C+S TALK
N-1 / F*
N-1 / A
METER INTERFACE
LIMITER
LIMITER (INSERT)
SEND RETURN
PFL**
PFL**
RET 3
RET 2
d
d
D
D
SFC
D
SFC
D
RET 1
a
A
D
D
D
d
A
D
A
D
a
a
SEND 2
SEND 4
SEND 1
SEND 3
D
D d
a A
D
RET 4
4 x INSERTS
(OPTIONAL)
D
A
LIM
LIM
LIM
LIM
AUX2 MASTER
C TALK
C TALK
OFF AIR
a
EXT.1
a
EXT.3
a
EXT.2
a
EXTERN MONITORING
EXT. TO PFL
D
A
D
A
D
EXT.PFL
a
EXT PFL CONTROL
LIMITER
LIMITER
(INSERT)
a
EXT. TB INPUT
EXT TB TO STUDIO
EXT TB TO CR
EXTERN TB INPUT
(OPTIONAL)
* WITH OPTION N-1 C...F, ONLY TWO STEREO INSERTS AVAILABLE
GUESTS
CR.LOUDSPEAKER
C.R. CUT + DIM
PFL/TB
DJ
STUDIO LSP
STUDIO
STUDIO CUT
MONO
STUDIO MONITOR
C.R./ DJ MONITOR
MONO
C.R.MON.
CR/PFL
TB TO STUDIO
A
D
TB TO C.R.MON
TB TO C.R.MON
STUDIO MIC SIGN.
MIC SIGN.
TB TO TEL
MONITOR SELECT
A
D
N-1 A
N-1 F *
d
a
a
a
a
a
AUX 2
AUX 1
MAIN OUTPUTS
METER 2
d
d
d
A
D
d
d
D
D
D
D
D
A
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On-Air 2000 Digital Mixing Console
Date printed: 05.10.99 General E2/1
2 GENERAL
2.1 Utilization for the purpose intended
The On-Air 2000 mixing console is intended for professional use.
It is presumed that the unit is operated only by trained personnel. Servicing
is reserved to skilled technicians.
The electrical connections may be connected only to the voltages and signals
designated in this manual.
2.2 First steps
2.2.1 Unpacking and inspection
Your new mixing console is shipped in a special packing which protects the
units against mechanical shock during transit. Care should be exercised
when unpacking so that the surfaces do not get marred.
Verify that the content of the packing agrees with the items listed on the
enclosed shipping list.
Check the condition of the equipment for signs of shipping damage. If there
should be any complaints you should immediately notify the forwarding
agent and your nearest Studer distributor.
Please retain the original packing material because it offers the best protec-
tion in case your equipment ever needs to be transported.
2.2.2 Installation
Primary voltage: The power supply unit is auto-ranging; it can be used for mains voltages in
a range of 100...240 VAC
General precautions: Do not use the unit in conditions of excessive heat or cold, near any source
of moisture, in excessively humid environments, or in positions where it is
likely to be subjected to vibration or dust.
Do not use any liquids to clean the exterior of the unit. A soft, dry cloth or
brush will usually do.
For cleaning the touch-screen display windows, most of the commercially
available window or computer/TV screen cleaners are suited. Use only a
slightly damp (never wet) cloth. Never use any solvent!
Power connection: The attached female IEC 320/C13 mains cable socket has to be connected to
an appropriate mains cable by a trained technician, respecting your local
regulations. Refer to the “Installation, Operation, and Waste Disposal” sec-
tion at the beginning of this manual.
Maintenance work inside the units must be performed by a trained techni-
cian.
On-Air 2000 Digital Mixing System
E2/2 General Date printed: 05.10.99
Earthing: This equipment must be earthed, due to the mains input filter network be-
ing connected to the mains earth.
Some consideration should be given to the earthing arrangement of the sys-
tem at the center of which is the console. The console chassis is earthed to
the mains earth via the power supply. Ground loops may occur where signal
processing equipment, patched to the console, has its signal earth commoned
to the equipment chassis.
2.2.3 Adjustments, repair
Danger: All internal adjustments as well as repair work on this product must be per-
formed by trained technicians!
Replacing the supply unit: The primary fuse is located inside the power supply module and cannot be
changed. In case of failure, the complete supply unit must be replaced.
Please ask your nearest Studer representative.
2.2.4 PC-card
A standard On-Air 2000 mixing console is equipped with a PC-card socket.
Using the industry-standard SRAM PC-cards, the user can save important
console information on a card. This information can then be used to restore
the console to the same state at a later moment. Since the information stored
on the card is DOS compatible, it is easily transferred to an IBM-compatible
PC for data storage and backup.
Note: Although it is possible to format an SRAM card in a PC, the card must be
re-formatted in the On-Air 2000; therefore, the write protect tab must be set
to OFF when the card is used in the mixing console for the first time.
It is also possible for new software releases to be downloaded from an
SRAM PC-card. This feature is only available for users in possession of the
correct files. For more information on this subject, refer to section 13.
The mixing console PC-card support is restricted to 5 V, Type 1, SRAM
memory cards with a capacity of 64 kbytes to 32 Mbytes. Hot-swapping is
supported, too.
On-Air 2000 Digital Mixing Console
Date printed: 05.10.99 General E2/3
2.3 Technical specifications (preliminary)
General
Level specs, digital, in dB
FS
: dB, referenced to full modulation (dB
FS
, dB Full Scale)
Level specs, analog, in dBu: 0 dBu 0.775 Vrms
Level specs, analog, in dBu
FS
: Level in dBu for full modulation ( 0 dB
FS
)
Sampling rate: 48 kHz ±100 ppm (internally synchronized)
Headroom adjustable: 0...20 dB
Default setting: 9 dB
All input faders set to their 0 dB position. External analog sources: Source im-
pedance < 200 . Frequency range: 20 Hz...20 kHz, if not stated otherwise.
Microphone inputs Microphone input modules have A/B-switchover and are equipped with a bal-
ancing transformer. The signal is routed to an electronically balanced, analog in-
sert point before the A/D-converter.
Input sensitivity –60...+20 dBu
FS
(with 9 dB headroom: –69...+11 dBu)
Gain setting in steps of 1 dB
Phantom power, switchable 48 V
Frequency response ±0.5 dB
High-pass filter (12 dB/Octave) –3 dB @ 75 Hz ±5 Hz, switchable
Input impedance > 1 k
Insert level +15 dBu
FS
(with 9 dB headroom: +6 dBu)
A/D converter 20 bit (Delta-Sigma, 64 × oversampling)
Dynamics typ. 102 dB @ +15 dBu
FS
(unweighted)
THD+N < –85 dB
FS
, 20 Hz...20 kHz, @ –1 dB
FS
(+15 dBu
FS
)
THD+N < –100 dB
FS
, 20 Hz...20 kHz, @ –30 dB
FS
Noise figure typ. < 4 dB @ max. gain, bandwidth 20 kHz, R
s
= 200
Common mode rejection > 50 dB @ 15 kHz, > 75 dB @ 50 Hz
Line level inputs Analog line level input modules are available in three versions:
Stereo input with A/B switching, with balancing transformer
Stereo input with A/B switching, with electronically balanced input
Stereo input with 6-input selector, with balancing transformer. On this module
the sources are connected via a 39-pin DIN connector.
Input sensitivity –10...+24 dBu
FS
(with 9 dB headroom: –19...+15 dBu)
Gain setting in steps of 1 dB
Frequency response ±0.1 dB
Input impedance > 10 k
A/D converter 20 bit (Delta-Sigma, 64 x oversampling)
Dynamics typ. 102 dB @ +15 dBu
FS
(unweighted)
THD+N < –94 dB
FS
, 20 Hz...20 kHz @ –1 dB
FS
(+15 dBu
FS
)
THD+N < –100 dB
FS
, 20 Hz...20 kHz @ –30 dB
FS
Common mode rejection > 50 dB @ 50 Hz...15 kHz, with transformer;
> 47 dB @ 50 Hz...15 kHz, electronically balanced
Digital inputs Digital input modules are available either with A/B switching or with a 6-input
selector. The module with A/B switching supports the AES/EBU (AES3-1992)
and S/PDIF (IEC 958) formats. It is equipped with XLR, Cinch, and Toslink
connectors.
The 6-input selector supports the AES/EBU (AES3-1992) format and is equipped
with a 39-pin DIN connector for source connection.
All digital inputs are equipped with a sampling frequency converter (SFC).
SFC resolution 20 Bit
Input sampling rate 30...54 kHz
THD+N < –105 dB
FS
@ 1 kHz, 0 dB
FS
Frequency response ±0.1 dB
Input impedance 110 (XLR and DIN inputs); 75 (Cinch input)
On-Air 2000 Digital Mixing System
E2/4 General Date printed: 05.10.99
Analog outputs Analog output modules are available with balancing transformer or with elec-
tronically balanced output.
Output level (transformer-balanced)
+4...+24 dBu
FS
@ R
L
= 100 k;
+4...+23 dBu
FS
@ R
L
= 300
Output level (electronically balanced)
+4...+23 dBu
FS
@ R
L
= 100 k;
+4...+22 dBu
FS
@ R
L
= 300
D/A converter 20 bit (Delta-Sigma, 128 x oversampling)
Dynamics typ. 101 dB (unweighted)
THD+N < –90 dB
FS
@ 1 kHz, –1 dB
FS
(+15 dBu
FS
)
Frequency response ±0.2 dB
Output impedance < 40
Digital outputs Digital output modules are equipped with two independent outputs according to
the AES/EBU standard (AES3-1992). On each of these outputs, the same signal
is fed to two XLR sockets with individual buffers.
Output level 2...5 V
Output impedance 110
Equalizer Treble control (High) 5 kHz/10 kHz: ±15 dB (depending on Customer Code setting; refer to 12.2.12)
Equalizer (Mid) 200 Hz...10 kHz: ±15 dB
Bass control (Low) 200 Hz/400 Hz: ±15 dB
Crosstalk attenuation
Between channels > 90 dB
Input fader attenuation > 100 dB
Power supply Mains voltage 100...240 V, 50/60 Hz (auto-ranging)
Power consumption 150 VA typ. (On-Air 2000/24/4)
Note: Depending on the application, the on-air mixing consoles can have different
configurations. For this reason the abovementioned values are applicable
only to a typical configuration; in an individual case, the values may differ.
We reserve the right to make changes as technological progress may war-
rant.
On-Air 2000 Digital Mixing Console
Date printed: 05.10.99 Operating Concept E3/1
3 OPERATING CONCEPT
The normal operation of the console is as simple as possible. This has been
achieved by reducing the number of operating elements to the minimum.
Nevertheless, high flexibility has been achieved thanks to the use of touch-
screen technology which just shows those operating elements which are
needed at a certain time.
A channel fader and three buttons (ON, OFF, PFL) are the only hardware
operating elements in a channel strip. All other functions are available
through the touch-screens. To maintain a good console overview these
touch-screens (channel screens) are located right above the channel strips.
Symbols on the screens show the current settings on every channel. Touch-
ing one of the symbols assigns the center touch-screen (control screen) to
this function. Parameters can now be entered via the four rotary encoders
(e.g. equalizer parameters), or directly through the assigned touch-screen
(e.g. equalizer on/off). On the screen above the channel strips, the new set-
tings are immediately updated. The On-Air 2000 concept has all current
settings for every channel visible at any time. This innovative user surface is
called the “Touch’n’action” concept and is patented.
In broadcast applications many DJs and operators without a special techni-
cal education work on the same mixing console. Every DJ has his preferred
console settings, mainly EQ parameters for his microphone. In the On-Air
2000, individual settings can be stored; by simply pressing a key, every op-
erator can recall her or his particular, tailor-made setting and concentrate
afterwards upon her/his essential task – presenting a radio program meeting
the needs of the listeners.
Radio stations often use the same mixing console type for on-air and pro-
duction. The “Snapshot” feature easily turns the production console into an
on-air console within seconds, if required.
On-Air 2000 Digital Mixing System
E3/2 Operating Concept Date printed: 05.10.99
3.1 Operating elements
3.1.1 Power switch
The power switch is located on the rear side of the console next to the power
inlet.
On-Air 2000 Digital Mixing Console
Date printed: 05.10.99 Operating Concept E3/3
3.1.2 Central section, display unit
[1] Central touch-screen The central touch-screen display is used for parameter entries (refer to
sections 4, 5, 10, 12, and 13 for details) and always displays the current
time and date in digital and analog formats. Besides, the fader stopwatch
and the user stopwatch are always displayed.
[2] Rotary encoders Depending on the current status, the rotary encoders are used for parameter
settings.
[3] Contrast knob For setting the LC display contrast, depending on the desired viewing angle
and the ambient light conditions.
[4] User stopwatch control Keys to control the user stopwatch (lower). Refer to section 5.12.
[5] Loudspeaker for PFL and talkback signals.
3.1.3 Central section, meter unit
The central meter section allows installing four 190 × 40 mm meter mod-
ules. The level meters and/or groups of keys can be installed according to
the customer's specification. Therefore, no universally valid statement can
be given here.
START
STOP
RESET
DIGITAL MIXING CONSOLEON-AIR 2000
[1][5] [2] [4] [3]
On-Air 2000 Digital Mixing System
E3/4 Operating Concept Date printed: 05.10.99
3.1.4 Central section, monitoring and talkback
[1] Control room monitoring selector
Ten mutually releasing keys for selecting the control room monitoring signal
from the following sources:
AUX 2/AUX 1: Auxiliary, general purpose output sums;
AUDIT: Auxiliary, general purpose output sum with configurable inputs;
Σ REC: Recorder output signal;
Σ PGM: Program (on-air) output signal;
PFL: PFL (pre-fader listening) sum;
EXT 3: External analog input signal;
EXT 2: External analog input signal;
EXT 1: External analog input signal;
OFF AIR: External analog input signal (tuner for off-air listening).
[2] CR monitor speaker control
MON : Monitoring volume control.
DIM: If pressed, the monitor speaker level is reduced by 20 dB.
The DIM function is activated automatically if one of the TALK BACK
keys is pressed. If “CR DIM WHEN AUDITION SEL” is active (details:
refer to section 12.2.2), the monitoring source is AUDIT, and the DJ micro-
phone is on, the AUDIT level is not muted but reduced by 20 dB.
If DIM is active, the key is illuminated.
PFL/TB
EXT
PFL
PFL
MON
MON
CUT
DIM
PHONES
PFL
MON
PFL
MON
TALK BACK
N–1 B
N–1 A
AUX 2
AUX 1
STUDIO
ON-AIR CR-MIC STUDIO-MIC
AUX 2
AUX 1
AUDIT
S REC
S PGM
PFL
EXT 3
EXT 2
OFF AIR
EXT 1
F5
F4
F3
F2
F1
[3] [4] [5] [6] [8]
[7]
[1]
[2]
On-Air 2000 Digital Mixing Console
Date printed: 05.10.99 Operating Concept E3/5
CUT: If pressed, the monitor speakers are muted, and the CUT key is illuminated.
As long as one of the CR or DJ microphones is on, the monitor speakers are
automatically muted, and the CUT key is illuminated.
[3] PFL/TB PFL/TB: Volume control for the built-in PFL/TB speakers.
EXT PFL: The EXT PFL input can be used as an external PFL input to the monitoring
unit. If pressed, the key is illuminated, the external signal is routed to the
PFL bus, and the external PFL control output is active.
PFL>MON: If PFL is active on any channel, the PFL signal is routed to the main moni-
tor speakers. If no PFL is selected, the monitoring signal is the stereo CR
signal as selected. The PFL>MON key is illuminated if active.
[4] Headphones PHONES : Headphones volume control. The headphones socket (6.3 mm jack) is lo-
cated below the hand rest of the central console part.
Three keys allow different monitoring modes:
PFL: PFL and TB signals are routed to the headphones.
MON/PFL: The left-channel headphones signal is the mono PFL signal, while the right-
channel headphones signal is the mono CR signal as selected by the moni-
toring source selector [1]. If no PFL is selected, the headphones signal is the
stereo CR signal as selected.
MON: The headphones signal is the same stereo signal as selected by the monitor-
ing source selector [1]. It is, however, not affected by the DIM and CUT
functions.
[5] Talkback Selector for five talkback destinations:
N-1 B/N-1 A: Connection between the DJ microphone* in the control room and the corre-
sponding cleanfeed (N-1) bus; this allows talking e.g. to the connected tele-
phone hybrid(s) or communication lines.
AUX 2/AUX 1: Connection between the DJ microphone* in the control room and the AUX 2
or AUX 1 outputs.
STUDIO: Connection between the DJ microphone* in the control room and the studio
speakers and headphones.
The built-in PFL/TB loudspeakers and/or the headphones are used for talk-
back listening in the control room.
* If a console is equipped with an additional talkback microphone, this micro-
phone is used instead of the DJ microphone.
[6] F1...F5 Programmable function keys, e.g. for additional CR monitor selector keys
(with optional Monitor Expander unit, refer to section 12.2.11).
[7] Signaling lamps ON-AIR Is turned on by a control signal on the “SIGN.” control connector on the
monitoring module.
CR-MIC Is on if at least one microphone in the control room is routed to the program
or to the record bus (i.e. the corresponding sum is selected, the channel is
ON, and the fader is opened).
STUDIO-MIC Is on if at least one microphone in the studio is routed to the program or to
the record bus (i.e. the corresponding sum is selected, the channel is ON,
and the fader is opened).
[8] Loudspeaker for PFL and talkback signals.
On-Air 2000 Digital Mixing System
E3/6 Operating Concept Date printed: 05.10.99
3.1.5 Fader units
[1] OFF (“key no. 3”) Keys for deactivating or activating a channel. Can be reconfigured.
[2] ON (“key no. 2”) For details please refer to sections 9 and 15.
[3] Linear fader The audio path is fully digital, therefore the signal does not pass through the
fader; their stroke length is 104 mm. For details concerning fader start con-
trol please refer to sections 9 and 15.
[4] PFL (“key no. 1”) Key for activating/deactivating the PFL (pre-fader listening) function.
[5] OVL Channel overload indicator.
[6] Contrast knob For setting the contrast of the LC display located above the fader panel,
depending on the desired viewing angle and the ambient light conditions.
10
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PFL
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OVL
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ON
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OVL
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ON
OFF
OVL
PFL
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OFF
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ON
OFF
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