Features
Max supply voltage V
Operating voltage range V
Max on-state resistance R
Current limitation (typ) I
Off-state supply current I
CC
CC
ON
LIM
S
41V
5.5 to 36V
500mΩ
0.4A
25 µA
VNQ500
Quad channel high-side driver
PowerSSO-12
■ CMOS compatible I/O’s
■ Chip Enable
■ Junction over temperature protection and
diagnostic
■ Current limitation
■ Shorted load protection
■ Undervoltage shutdown
■ Protection against loss of ground
■ Very low standby current
■ In compliance with the 2002/95/EC european
directive
Table 1. Device summary
Package
Description
The VNQ500 is a monolithic device designed in
STMicroelectronics VIPower M0-3 technology,
intended for driving any kind of load with one side
connected to ground.
Active current limitation, combined with latched
thermal shutdown, protect the device against
overload.
In the case of over temperature of one channel
the relative I/O pin is pulled down.
The device automatically turns off in the case of
ground pin disconnection.
Order codes
Tub e Tap e a n d reel
PowerSSO-12 VNQ500PEP-E VNQ500PEPTR-E
July 2009 Doc ID 9934 Rev 3 1/24
www.st.com
1
Contents VNQ500
Contents
1 Block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2 Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.2 Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.4 Electrical characteristics curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
3 Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
3.1 GND protection network against reverse battery . . . . . . . . . . . . . . . . . . . 14
3.1.1 Solution 1: a resistor in the ground line (RGND only) . . . . . . . . . . . . . . 14
3.1.2 Solution 2: a diode (D
3.2 Load dump protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
) in the ground line . . . . . . . . . . . . . . . . . . . . 15
GND
3.3 MCU I/O protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
3.4 Maximum demagnetization energy (V
= 13.5V) . . . . . . . . . . . . . . . . . . 16
CC
4 Package and thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
4.1 PowerSSO-12 thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
5 Package and packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
5.1 ECOPACK® packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
5.2 PowerSSO-12 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
5.3 PowerSS0-12 packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
6 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
2/24 Doc ID 9934 Rev 3
VNQ500 List of tables
List of tables
Table 1. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Table 2. Pin definitions and functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Table 3. Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Table 4. Thermal data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Table 5. Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Table 6. Switching (V
Table 7. Input and CE pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Table 8. Protections and diagnostics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Table 9. Truth table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Table 10. Electrical transient requirements on VCC pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Table 11. Thermal parameter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Table 12. PowerSSO-12 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Table 13. Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
=13V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
CC
Doc ID 9934 Rev 3 3/24
List of figures VNQ500
List of figures
Figure 1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Figure 2. Configuration diagram (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Figure 3. Current and voltage conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Figure 4. Switching time waveforms: turn-on and turn-off . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Figure 5. Driving circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Figure 6. Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Figure 7. Off-state output current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Figure 8. High level input current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Figure 9. Input clamp voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Figure 10. Turn-off voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Figure 11. Overvoltage shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Figure 12. Turn-off voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Figure 13. ILIM vs Tcase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 14. On-state resistance vs VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 15. Input high level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 16. Input hysteresis voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 17. On-state resistance vs Tcase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 18. Input low level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 19. Application schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 20. Maximum turn-off current versus load inductance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Figure 21. PowerSSO-12 PC board. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Figure 22. Rthj-amb Vs PCB copper area in open box free air condition . . . . . . . . . . . . . . . . . . . . . . 17
Figure 23. Thermal impedance junction ambient single pulse . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Figure 24. Thermal fitting model of a quad channel HSD in PowerSSO-12 . . . . . . . . . . . . . . . . . . . . 18
Figure 25. PowerSSO-12 package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Figure 26. PowerSSO-12 tube shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Figure 27. PowerSSO-12 tape and reel shipment (suffix “TR”) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
4/24 Doc ID 9934 Rev 3
VNQ500 Block diagram and pin description
1 Block diagram and pin description
Figure 1. Block diagram
V
CC
UNDERVOLTAGE
DETECTION
V
CC
CE
I/O 1
I/O 2
I/O 3
I/O 4
OT1
OT2
OT3
OT4
LOGIC
CLAMP POWER
CURRENT LIMITER
JUNCTION TEMP.
DETECTION
Same structure for all
channels
CLAMP
GND
OUTPUT 1
OUTPUT 2
OUTPUT 3
OUTPUT 4
Table 2. Pin definitions and functions
Pin No Symbol Function
TA B V
7,12 V
CC
CC
Positive power supply voltage
Positive power supply voltage
1 GND Logic ground
2 CE Chip Enable
3 I/O 1 Input/output of channel 1
4 I/O 2 Input/output of channel 2
5 I/O 3 Input/output of channel 3
6 I/O 4 Input/output of channel 4
8 OUTPUT 4 High-side output of channel 4
9 OUTPUT 3 High-side output of channel 3
10 OUTPUT 2 High-side output of channel 2
11 OUTPUT 1 High-side output of channel 1
Doc ID 9934 Rev 3 5/24
Block diagram and pin description VNQ500
Figure 2. Configuration diagram (top view)
TAB = VCC
GND
CE
I/O1
I/O2
I/O3
I/O4
1
2
3
4
5
6
12
11
10
9
8
7
PowerSSO-12
VCC
OUTPUT1
OUTPUT2
OUTPUT3
OUTPUT4
V
CC
6/24 Doc ID 9934 Rev 3
VNQ500 Electrical specifications
2 Electrical specifications
2.1 Absolute maximum ratings
Stressing the device above the rating listed in the “Absolute maximum ratings” table may
cause permanent damage to the device. These are stress ratings only and operation of the
device at these or any other conditions above those indicated in the Operating sections of
this specification is not implied. Exposure to Absolute Maximum Rating conditions for
extended periods may affect device reliability. Refer also to the STMicroelectronics SURE
Program and other relevant quality document.
Table 3. Absolute maximum ratings
Symbol Parameter Value Unit
DC supply voltage 41 V
Reverse supply voltage -0.3 V
CC
DC ground pin reverse current - 250 mA
DC output current Internally limited A
Reverse DC output current -1 A
DC Input current +/- 10 mA
- I
- I
V
-V
I
OUT
CC
GND
OUT
I
IN
Electrostatic discharge (R = 1.5KΩ; C = 100pF)
V
ESD
- I/On
- OUTn and V
P
T
T
stg
Power dissipation at Tc = 25°C 7.3 W
tot
Junction operating temperature Internally limited °C
j
Storage temperature - 55 to 150 °C
2.2 Thermal data
Table 4. Thermal data
Symbol Parameter Max. value Unit
R
thj-case
R
thj-amb
1. When mounted on a standard single-sided FR-4 board with 0.5 cm2 of Cu (at least 35mm thick) connected
to all V
2. When mounted on a standard single-sided FR-4 board with 8 cm2 of Cu (at least 35mm thick) connected to
all VCC pins.
PowerSSO-12 thermal resistance junction-case 17 °C/W
PowerSSO-12 thermal resistance junction-ambient 61
pins.
CC
CC
4000
5000
(1)
50
(2)
V
V
°C/W
Doc ID 9934 Rev 3 7/24
Electrical specifications VNQ500
2.3 Electrical characteristics
Values specified in this section are for 8V<VCC<36V; -40°C< Tj <150°C, unless otherwise
stated.
Figure 3. Current and voltage conventions
I
S
V
CC
V
INn
Table 5. Power
V
I
GND
CC
OUTPUTn
I
INn
I
CE
V
CE
I/On
CE
GND
I
OUTn
V
OUTn
Symbol Parameter Test conditions Min. Typ. Max. Unit
Operating supply
V
V
USD
V
R
(1)
CC
voltage
Undervoltage
(1)
shutdown
(1)
Overvoltage shutdown 36 V
OV
I
= 0.25A; Tj = 25°C
On-state resistance
ON
Supply current
I
S
OUTn
= 0.25A
I
OUTn
Off-state; V
= V
V
CE
I/On
= V
V
CE
I/On
= 13V; T
V
CC
= 13V;
CC
= 0V;
= 0V;
case
= 25°C
5.5 13 36 V
345.5V
500
1000mΩmΩ
25
20
On-state (all channels ON);
mA
8
1mA
5µA
3µA
LGND
I
L(off1)
I
L(off3)
I
L(off4)
1. Per channel.
turn-off
(1)
Off-state output current V
(1)
Off-state output current
(1)
Off-state output current
Output current at
(1)
I
= 13V
V
CC
V
= V
CC
V
OUTn
I/On
V
I/On
V
CC
V
I/On
V
CC
= V
CE
= 0V
= V
OUTn
= V
OUTn
= 13V; TJ = 125°C
= V
OUTn
= 13V; TJ = 25°C
I/On
= V
GND
= 13V;
= 0V 0 50 µA
=0 V,
= 0V,
µA
µA
8/24 Doc ID 9934 Rev 3
VNQ500 Electrical specifications
Table 6. Switching (VCC =13V)
Symbol Parameter Test conditions Min. Typ. Max. Unit
t
on
t
off
dV
OUT
dV
OUT
1. See Figure 4: Switching time waveforms: turn-on and turn-off.
Table 7. Input and CE pin
Turn-on time RL= 52Ω from 80% V
Turn-off time RL= 52Ω to 10% V
= 52Ω from V
R
/dt
Turn-on voltage slope
(on)
/dt
Turn-off voltage slope
(off)
L
V
OUT
= 52Ω from V
R
L
V
OUT
= 10.4V
= 1.3V
(1)
(1)
OUT
OUT
Symbol Parameter Test conditions Min. Typ. Max. Unit
(1)
OUT
(1)
OUT
= 1.3V to
= 11.7V to
50 µs
75 µs
0.3 V/µs
0.3 V/µs
V
I
INL
V
INH
I
INH
V
I(hyst)
V
Table 8. Protections and diagnostics
I/O low level 1.25 V
INL
Low level I/O current V
= 1.25V 1 µA
IN
I/O high level 3.25 V
High level I/O current V
= 3.25V 10 µA
IN
I/O hysteresis voltage 0.5 V
Input clamp voltage
ICL
I
IN
= - 1mA
I
IN
(1)
= 1mA
6.8
6
- 0.7
8V
Symbol Parameter Test conditions Min. Typ. Max. Unit
V
T
I
V
demag
t
reset
1. To ensure long term reliability under heavy overload or short circuit conditions, protection and related
diagnostic signals must be used together with a proper software strategy. If the device is subjected to
abnormal conditions, this software must limit the duration and number of activation cycles.
I/O low level default
OL
detection
Junction shutdown
TSD
temperature
DC short circuit
lim
current
Turn-off output clamp
voltage
Thermal latch reset
time
= 1mA, latched thermal
I
IN
shutdown
= 13V; R
V
CC
I
= 0.25 A; L = 50mH
OUT
Tj < T
(see third figure in
TSD
= 10mΩ 0.4 0.6 0.9 A
LOAD
Figure 6: Waveforms)
0.5 V
150 175 200 °C
V
CC
-48V
-
V
CC
41
CC
55
-
10 µs
V
V
Doc ID 9934 Rev 3 9/24
Electrical specifications VNQ500
Figure 4. Switching time waveforms: turn-on and turn-off
V
IN
V
OUT
dV
OUT
Figure 5. Driving circuit
MCU
t
on
80%
/dt
(on)
MCOUTn
Diagnostic feedback
t
r
Rprot
Rprot
Rprot
10%
(1)
(1)
t
off
t
90%
/dt
dV
OUT
(off)
t
f
t
(1)
CE
I/On
OUTPUTn
VNQ500PEP
1. See Figure 19: Application schematic.
Table 9. Truth table
Conditions MCOUTn CE I/On Output_n
Normal operation
Current limitation
Over temperature
Undervoltage
L
H
L
H
L
H
L
H
Standby X L X L
10/24 Doc ID 9934 Rev 3
H
H
H
H
H
H
H
H
L
H
L
H
L
L (latched)
L
H
L
H
L
H
L
L
L
L
VNQ500 Electrical specifications
Table 10. Electrical transient requirements on V
ISO T/R
Test level
CC
pin
7637/1
Test pulse
1- 25V
2 + 25V
3a - 25V
3b + 25V
4- 4V
5+ 26.5V
1. All functions of the device are performed as designed after exposure to disturbance.
2. One or more functions of the device is not performed as designed after exposure and cannot be returned to
proper operation without replacing the device.
I II III IV Delays and impedance
(1)
(1)
(1)
(1)
(1)
(1)
- 50V
+ 50V
- 50V
+ 50V
- 5V
+ 46.5V
(1)
(1)
(1)
(1)
(1)
(2)
- 75V
+ 75V
- 100V
+ 75V
- 6V
+ 66.5V
(1)
(1)
(1)
(1)
(1)
(2)
- 100V
+ 100V
- 150V
+ 100V
- 7V
+ 86.5V
(1)
(1)
(1)
(1)
(1)
(2)
2ms, 10Ω
0.2ms, 10Ω
0.1µs, 50Ω
0.1µs, 50Ω
100ms, 0.01Ω
400ms, 2Ω
Figure 6. Waveforms
1) NORMAL OPERATION
CE
MC
I/O
n
VOUT
CE
V
CC
MC
I/
On
V
OUTn
CE
T
jn
MC
I/O
n
I
OUTn
OUTn
OUTn
OUTn
n
2) UNDERVOLTAGE
VUSD
hyst
V
USD
3) SHORTED LOAD OPERATION
T
TSD
VOL
t
reset
Doc ID 9934 Rev 3 11/24
Electrical specifications VNQ500
2.4 Electrical characteristics curves
Figure 7. Off-state output current Figure 8. High level input current
Figure 9. Input clamp voltage Figure 10. Turn-off voltage slope
IL(off) (uA)
0.3
0.27
0.24
0.21
0.18
0.15
0.12
0.09
0.06
0.03
Vcc=36V
0
-50 -25 0 25 50 75 100 125 150 175
Tc ( °C )
Vicl (V)
10
9.5
8.5
7.5
6.5
5.5
Iin=1mA
9
8
7
6
5
-50 -25 0 25 50 75 100 125 150 175
Tc ( °C )
Iih (uA)
6
5.5
4.5
3.5
2.5
1.5
Vin=3.25V
5
4
3
2
1
-50 -25 0 25 50 75 100 125 150 175
Tc ( °C )
dVout/dt(on) (V/ms)
1000
900
800
700
600
500
400
300
200
100
Vcc=13V
Rl=6.5Ohm
0
-50 -25 0 25 50 75 100 125 150 175
Tc ( °C )
Figure 11. Overvoltage shutdown Figure 12. Turn-off voltage slope
Vov (V)
60
55
50
45
40
35
30
25
20
-50 -25 0 25 50 75 100 125 150 175
Tc ( °C )
dVout/dt(off) (V/ms)
800
750
700
650
600
550
500
450
400
Vcc=13V
Rl=6.5Ohm
-50 -25 0 25 50 75 100 125 150 175
Tc ( °C )
12/24 Doc ID 9934 Rev 3
VNQ500 Electrical specifications
Figure 13. I
Figure 15. Input high level Figure 16. Input hysteresis voltage
vs T
LIM
case
Ilim (A)
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
Vcc=13V
0
-50 -25 0 25 50 75 100 125 150 175
Tc ( °C )
Vih (V)
3.6
3.4
3.2
3
2.8
2.6
2.4
2.2
2
1.8
-50 -25 0 25 50 75 100 125 150 175
Tc ( °C )
Figure 14. On-state resistance vs V
Ron (mOhm)
1000
900
800
700
600
500
400
300
200
100
0
Vhyst (V)
1.4
1.3
1.2
1.1
1
0.9
0.8
0.7
0.6
0.5
-50 -25 0 25 50 75 100 125 150 175
Iout=0.25A
Tc= 150°C
Tc= 25 °C
Tc= -40°C
5 10152025303540
Vcc (V)
Tc ( °C )
CC
Figure 17. On-state resistance vs Tcase Figure 18. Input low level
Ron (mOhm)
900
800
700
600
500
400
300
200
100
0
-50 -25 0 25 50 75 100 125 150 175
Iout=0.25A
Vcc=8V, 13V & 36V
Tc ( °C )
Vil (V)
3
2.75
2.5
2.25
2
1.75
1.5
1.25
1
-50 -25 0 25 50 75 100 125 150 175
Tc ( °C )
Doc ID 9934 Rev 3 13/24
Application information VNQ500
3 Application information
Figure 19. Application schematic
+5V
V
CC
mC
R
prot
R
prot
R
prot
Diagnostic
feedback
CE
I/0n
V
GND
GND
R
GND
D
GND
OUTPUT
D
ld
3.1 GND protection network against reverse battery
This section provides two solutions for implementing a ground protection network against
reverse battery.
3.1.1 Solution 1: a resistor in the ground line (R
This can be used with any type of load.
The following show how to dimension the R
1. R
2. R
where -I
≤ 600mV / (I
GND
≥ (−VCC) / (-I
GND
is the DC reverse ground pin current and can be found in the absolute
GND
S(on)max
GND
)
)
maximum rating section of the device datasheet.
Power dissipation in R
P
= (-VCC)2/R
D
GND
(when VCC<0 during reverse battery situations) is:
GND
This resistor can be shared amongst several different HSDs. Please note that the value of
this resistor should be calculated with formula (1) where I
maximum on-state currents of the different devices.
Please note that, if the microprocessor ground is not shared by the device ground, then the
R
will produce a shift (I
GND
S(on)max
* R
GND
values. This shift will vary depending on how many devices are ON in the case of several
high-side drivers sharing the same R
GND
.
resistor:
GND
) in the input thresholds and the status output
GND
S(on)max
only)
becomes the sum of the
14/24 Doc ID 9934 Rev 3
VNQ500 Application information
If the calculated power dissipation requires the use of a large resistor, or several devices
have to share the same resistor, then ST suggests using solution 2 below.
3.1.2 Solution 2: a diode (D
Note that a resistor (R
GND
) in the ground line
GND
=1kΩ) should be inserted in parallel to D
an inductive load.
This small signal diode can be safely shared amongst several different HSDs. Also in this
case, the presence of the ground network will produce a shift ( 600mV) in the input
threshold and in the status output values if the microprocessor ground is not common to the
device ground. This shift will not vary if more than one HSD shares the same diode/resistor
network.
3.2 Load dump protection
Dld is necessary (Voltage Transient Suppressor) if the load dump peak voltage exceeds the
V
maximum DC rating. The same applies if the device is subject to transients on the VCC
CC
line that are greater than those shown in the ISO T/R 7637/1 table.
3.3 MCU I/O protection
If a ground protection network is used and negative transients are present on the VCC line,
the control pins will be pulled negative. ST suggests to insert a resistor (R
prevent the μC I/O pins from latching up.
The value of these resistors is a compromise between the leakage current of
current required by the HSD I/Os (Input levels compatibility) with the latch-up limit of
I/Os:
-V
CCpeak/Ilatchup
≤ R
prot
≤ (V
OHμC-VIH-VGND
) / I
IHmax
if the device drives
GND
≈
) in line to
prot
µC and the
µC
Example
For the following conditions:
V
I
latchup
V
5kΩ ≤ R
Recommended values are:
R
CCpeak
OHμC
=10kΩ
prot
= - 100V
≥ 20mA
≥ 4.5V
≤ 180kΩ.
prot
Doc ID 9934 Rev 3 15/24
Application information VNQ500
3.4 Maximum demagnetization energy (VCC = 13.5V)
Figure 20. Maximum turn-off current versus load inductance
I
LM AX ( A )
10
VIN, I
A = Single Pulse at T
B= Repetitive pulse at T
C= Repetitive Pulse at T
Jstart
=150ºC
Jstart
Jstart
=100ºC
=125ºC
1
A
B
C
0,1
10 100 1000
L( mH)
L
Demagnetization
Demagnetization
Demagnetization
Note: Values are generated with RL=0 Ω.
In case of repetitive pulses, T
(at beginning of each demagnetization) of every pulse
jstart
must not exceed the temperature specified above for curves B and C.
16/24 Doc ID 9934 Rev 3
t
VNQ500 Package and thermal data
4 Package and thermal data
4.1 PowerSSO-12 thermal data
Figure 21. PowerSSO-12 PC board
Note: Layout condition of R
thickness=2mm,Cu thickness=35
Figure 22. R
RTHj_amb(°C/ W)
thj-amb
75
70
65
60
55
50
45
0246810
and Zth measurements (PCB FR4 area= 78mm x 78mm, PCB
th
Vs PCB copper area in open box free air condition
μ
m, Copper areas: from minimum pad lay-out to 16 cm2).
PCB Cu heatsink area (cm^ 2)
Doc ID 9934 Rev 3 17/24
Package and thermal data VNQ500
Figure 23. Thermal impedance junction ambient single pulse
ZTH ( °C/ W)
1000
Equation 1:
Z
where
THδ
RTHδ Z
δ tpT⁄=
100
10
1
0,1
0 0 0,01 0,1 1 10 100 1000
Time (s)
pulse calculation formula
1 δ–()+⋅=
THtp
Footprint
8 cm
2
Figure 24. Thermal fitting model of a quad channel HSD in PowerSSO-12
18/24 Doc ID 9934 Rev 3
VNQ500 Package and thermal data
Table 11. Thermal parameter
Area/island (cm2)Footprint8
R1=R7=R9=R11 (°C/W) 0.8
R2=R8=R10=R12 (°C/W) 2.6
R3 (°C/W) 1.5
R4 (°C/W) 8
R5 (°C/W) 28 18
R6 (°C/W) 30 22
C1=C7=C9=C11 (W.s/°C) 0.00006
C2=C8=C10=C12 (W.s/°C) 0.0005
C3 (W.s/°C) 0.015
C4 (W.s/°C) 0.1
C5 (W.s/°C) 0.15 0.17
C6 (W.s/°C) 3 5
Doc ID 9934 Rev 3 19/24
Package and packing information VNQ500
5 Package and packing information
5.1 ECOPACK® packages
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com
ECOPACK
®
is an ST trademark.
5.2 PowerSSO-12 mechanical data
Table 12. PowerSSO-12 mechanical data
Symbol
Min. Typ. Max.
A 1.250 1.620
A1 0.000 0.100
A2 1.100 1.650
B 0.230 0.410
C 0.190 0.250
D 4.800 5.000
E 3.800 4.000
e0.800
H 5.800 6.200
h 0.250 0.500
.
Millimeters
L 0.400 1.270
k0º 8º
X 1.900 2.500
Y 3.600 4.200
ddd 0.100
20/24 Doc ID 9934 Rev 3
VNQ500 Package and packing information
Figure 25. PowerSSO-12 package dimensions
Doc ID 9934 Rev 3 21/24
Package and packing information VNQ500
5.3 PowerSS0-12 packing information
Figure 26. PowerSSO-12 tube shipment (no suffix)
B
C
Base Q.ty 100
Bulk Q.ty 2000
A
Tube length (± 0.5) 532
A1.85
B6.75
C (± 0.1) 0.6
Figure 27. PowerSSO-12 tape and reel shipment (suffix “TR”)
Reel dimensions
Base Q.ty 2500
Bulk Q.ty 2500
A (max) 330
B (min) 1.5
C (± 0.2) 13
F 20.2
G (+ 2 / -0) 12.4
N (min) 60
T (max) 18.4
Tape dimensions
According to Electronic Industries Association
(EIA) Standard 481 rev. A, Feb. 1986
Tape width W 12
Tape Hole Spacing P0 (± 0.1) 4
Component Spacing P 8
Hole Diameter D (± 0.05) 1.5
Hole Diameter D1 (min) 1.5
Hole Position F (± 0.1) 5.5
Compartment Depth K (max) 4.5
Hole Spacing P1 (± 0.1) 2
All dimensions are in mm.
To p
cover
tape
End
22/24 Doc ID 9934 Rev 3
500mm min
No componentsNo components Components
Empty components pockets
saled with cover tape.
User direction of feed
500mm min
Start
VNQ500 Revision history
6 Revision history
Table 13. Document revision history
Date Revision Changes
24-Jan-2006 1 Initial release.
Document restructured and reformatted.
09-Dec-2008 2
14-Jul-2009 3
Updated Table 3: Absolute maximum ratings - corrected P
Updated Table 4: Thermal data.
Updated Figure 6: Waveforms - corrected
MC
OUTn
signal.
Updated Table 10: Electrical transient requirements on VCC pin.
Corrected Figure 22: Rthj-amb Vs PCB copper area in open box free
air condition.
®
Added ECOPACK
packages information.
Replaced the obsolete root part number VNQ500PEP-E with the
new root part number VNQ500.
tot
value.
Doc ID 9934 Rev 3 23/24
VNQ500
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24/24 Doc ID 9934 Rev 3
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