using STMicroelectronics VIPower Technology,
intended for replacement of standard power
MOSFETS in DC to 50 KHz applications.
Built-in thermal shut-down, linear current limitation and overvoltage clamp protect the chip
n harsh enviroments.
BLOCK DIAG RAM
TO-220
3
2
1
March 2004
1/11
VNP10N06
ABSOLUTE MAXIMUM RATING
SymbolParameterValueUnit
V
V
V
P
T
THERMAL DATA
R
thj-case
R
thj-amb
Drain-source Voltage (Vin = 0)Internally ClampedV
DS
Input VoltageInternally ClampedV
in
I
Input Current± 20mA
in
I
Drain CurrentInternally LimitedA
D
I
Reverse DC Output Current-15A
R
Electrostatic Discharge (C= 100 pF, R=1.5 KΩ)
esd
Total Dissipation at Tc = 25 oC42W
tot
T
Operating Junction TemperatureInternally Limited
j
T
Case Operating TemperatureInternally Limited
c
Storage Temperature-55 to 150
stg
Thermal Resistance Junction-case Max
Thermal Resistance Junction-ambient Max
4000V
3
62.5
o
o
o
C
o
C
o
C
C/W
C/W
ELECTRICAL CHARACTERISTICS (T
= 25 oC unless otherwise specified)
case
OFF
SymbolParameterTest ConditionsMin.Typ.Max.Unit
V
CLAMP
Drain-source Clamp
ID = 200 mA V
= 0506070 V
in
Voltage
V
IL
Input Low Level
I
= 100 µA V
D
DS
= 16 V
1.5V
Voltage
V
V
I
DSS
I
IH
INCL
ISS
Input High Level
Voltage
Input-Source Reverse
Clamp Voltage
Zero Input Voltage
Drain Current (V
in
= 0)
Supply Current from
R
= 27 Ω V
L
V
= 0.5 V
DS
I
= -1 mA
in
I
= 1 mA
in
= 50 V V
V
DS
VDS < 35 V V
DD
in
in
= 16 V
= V
IL
= V
IL
VDS = 0 V Vin = 5 V150300µA
3.2V
-1
8
-0.3
11
250
100
Input Pin
ON (∗)
SymbolParameterTest ConditionsMin.Typ.Max.Unit
R
DS(on)
Static Drain-source On
V
= 7 V ID = 1 A TJ < 125 oC
in
0.150.3Ω
Resistance
DYNAMIC
V
V
µA
µA
SymbolParameterTest ConditionsMin.Typ.Max.Unit
C
Output CapacitanceV
oss
= 13 V f = 1 MHz V
DS
= 0350500pF
in
2/11
VNP10N06
ELECTRICAL CHARACTERISTICS (continued)
SWITCHING (∗∗)
SymbolParameterTest ConditionsMin.Typ.Max.Unit
t
d(on)
t
t
d(off)
t
t
d(on)
t
t
d(off)
t
(di/dt)
Q
Turn-on Delay Time
Rise Time
r
Turn-off Delay Time
Fall Time
f
Turn-on Delay Time
Rise Time
r
Turn-off Delay Time
Fall Time
f
Turn-on Current SlopeV
on
Total Input ChargeVDD = 12 V ID = 1 A V
i
V
= 16 V Id = 1 A
DD
V
= 7 V R
gen
(see figure 3)
V
= 16 V Id = 1 A
DD
V
= 7 V R
gen
(see figure 3)
= 16 V ID = 1 A
DD
= 7 V R
V
in
gen
gen
gen
= 10 Ω
= 1000 Ω
= 10 Ω
1100
550
200
100
1.2
1.6
1.2
1.5A/µs
= 7 V13nC
in
SOURCE DRAIN DIO DE
SymbolParameterTest ConditionsMin.Typ.Max.Unit
VSD (∗)Forward On VoltageISD = 1 A Vin = V
t
Q
(∗∗)
rr
rr
(∗∗)
Reverse Recovery
Time
Reverse Recovery
I
= 1 A di/dt = 100 A/µs
SD
V
= 30 V Tj = 25 oC
DD
(see test circuit, figure 5)
Charge
Reverse Recovery
(∗∗)
I
RRM
Current
IL
0.81.6V
125
0.22
3.5
1600
900
400
200
1.8
1
1.5
2.3
1.8
ns
ns
ns
ns
µs
µs
µs
µs
ns
µC
A
PROTECTION
SymbolParameterTest ConditionsMin.Typ.Max.Unit
I
lim
t
dlim
T
jsh
T
jrs
Eas (∗∗)Single Pulse
(∗) Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %
(∗∗) Parameters guaranteed by design/characterizat i on
Drain Current LimitVin = 7 V VDS = 13 V61015A
(∗∗) Step Response
Vin = 7 V VDS step from 0 to 13 V1220µs
Current Limit
(∗∗) Overtemperature
150
Shutdown
(∗∗)Overtemperature Reset135
Avalanche Energy
starting Tj = 25 oC VDD = 24 V
Vin = 7 V R
= 1 KΩ L = 10 mH
gen
250mJ
o
C
o
C
3/11
VNP10N06
PROTECTION FEATURES
During Normal Operation, the INPUT pin is
electrically connected to the gate of the internal
power MOSFET through a low impedance path
as soon as V
> VIH.
IN
The device then behaves like a standard power
MOSFET and can be used as a switch from DC
to 50KHz. The only difference from the user’s
standpoint is that a small DC current (typically
150 µA) flows into the INPUT pin in order to
supply the internal circuitry.
During turn-off of an unclamped inductive load
the output voltage is clamped to a safe level by
an integrated Zener clamp between DRAIN pin
and the gate of the internal Power MOSFET.
In this condition, the Power MOSFET gate is set
to a voltage high enough to sustain the inductive
load current even if the INPUT pin is driven to 0V.
The device integrates an active current limiter
circuit which limits the drain current I
to I
D
lim
whatever the INPUT pin Voltage.
When the current limiter is active, the device
operates in the linear region, so power dissipation
may exceed the heatsinking capability. Both case
and junction temperatures increase, and if this
phase lasts long enough, junction temperature
may reach the overtemperat ure thres hold T
If T
reaches T
j
, the device shuts down
jsh
jsh
.
whatever the INPUT pin voltage. The device will
restart automatically when T
T
jrs
has cooled down to
j
4/11
VNP10N06
Thermal Impedance
Output Characteris tics
Derating Curve
Static Drain-Sourc e On Resistance vs Input
Voltage
Static Drain-Source On Resist ance
Static Drain-Source On Resistance
5/11
VNP10N06
Input Charge vs Input Voltage
Normalized Input Threshold Voltage vs
Temperature
Capacitance Variations
Normalized On Resistance vs Temperat ure
Normalized On Resist ance vs Temperat ure
6/11
Turn-on Current Slope
VNP10N06
Turn-on Current Slope
Turn-off Drain-Source Voltage Slope
Turn-off Drain-Source Voltage Slope
Switching Time Resistive Load
Switching Time Resistive Load
Switching Time Resistive Load
7/11
VNP10N06
Current Limit vs Junction Temperature
Source Drain Diode Voltage vs Junction
Temperature
Step Response Current Limit
8/11
VNP10N06
Fig. 1: Unclamped Inductive Load Test Circuits
Fig. 3: Switching Times Test Circuits For
Resistive Load
Fig. 2: Unclamped Inductive Waveforms
Fig. 4: Input Charge Test Circuit
Fig. 5: Test Circuit For Inductive Load Switching
And Diode Recovery Times
Fig. 6: Waveforms
9/11
VNP10N06
TO-220 MECHANICAL DATA
DIM.
MIN.TYPMAX.
A4.404.60
b0.610.88
b11.151.70
c0.490.70
D15.2515.75
E1010.40
e2.402.70
e14.955.15
F1.231.32
H16.206.60
J12.402.72
L1314
L13.503.93
L2016.40
L3028.90
mm.
∅P3.753.85
Q2.652.95
Package Weight1.9Gr. (T yp .)
10/11
VNP10N06
Information furnished is believed to be accurate and reliable. Ho wev er, STMicroelectr onics assumes no r es ponsibility for the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may results from its use. No license is
granted by implication or otherwise under any patent or patent r ights of STMicr oelectronics . Specifications mentioned in this publication are
subject to c hange withou t notice. This publicatio n s upersedes an d r eplaces all information previously supplied. STM icroelectr on ics product s
are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
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The ST logo is a trademark of ST M ic r oelectronic s
2004 STMicroelectronics - Printed in ITALY- All Rights Reserved.
STMicroelectronics GROUP OF COMPANIES
http://www.st.com
11/11
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