The TDA7590 is a high performances, fully
programmable 24-bit, 120 MIPS. Digital signal
processor (DSP), designed to support several
speech and audio applications, as automatic
speech recognition, speech synthesis, MP3
decoding, echo and noise cancellation.
Nevertheless, the embedded CODECs bandwidth
and the generic processing engine allow to
proceed also full-band audio signals. The large
amount of on-chip memory (128 Kwords),
together with the 16 Mwords external memory
addressable and the 32 general purpose I/O pins
permit to build a DSP-system avoiding the usage
of an additional microcontroller.
1. In ECOPACK® package (see Section 9: Package information on page 40).
January 2009 Rev 21/42
TQFP144 (20x20x1.0 exposed pad down)
The presence of serial and parallel interfaces
allows easy connection with external devices
including CODECs, DSPs, microprocessors and
personal computers.
In particular, the debug/JTAG interface permits the
on-chip emulation of the firmware developed.
Further, the presence of the timers and watchdog
block makes TDA7590 suitable for PWM
processing and allows the integration of a system
watchdog.
Host address 9. Address line 9 in multiplexed mode otherwise address line 2
in non-multiplexed mode.
Host address 8. Address line 8 in multiplexed mode otherwise address line 1
in non-multiplexed mode.
Host address strobe. Address strobe for multiplexed bus or Address 0 for non
multiplexed.
51HAD[7]I/O
Host 8-bit data line 7. Host data bus and/or address lines when in multiplexed
mode.
9/42
Pin descriptionTDA7590
Table 2.Pin function (continued)
N°NameTypeDescription
52HAD[6]I/O
53HAD[5]I/O
54HAD[4]I/O
55COREVDDICore power supply.
56COREVSSICore ground.
57HAD[3]I/O
58HAD[2]I/O
59HAD[1]I/O
60HAD[0]I/O
61AA[3]O
62AA[2]O
63BR_NO
64BB_NI/O
Host 8-bit data line 6. Host data bus and/or address lines when in multiplexed
mode.
Host 8-bit data line 5. Host data bus and/or address lines when in multiplexed
mode.
Host 8-bit data line 4. Host data bus and/or address lines when in multiplexed
mode.
Host 8-bit data line 3. Host data bus and/or address lines when in multiplexed
mode.
Host 8-bit data line 2. Host data bus and/or address lines when in multiplexed
mode.
Host 8-bit data line 1. Host data bus and/or address lines when in multiplexed
mode.
Host 8-bit data line 0. Host data bus and/or address lines when in multiplexed
mode.
Address attributes line 3.Port A address attributes/chip select pins with
programmable polarity.
Address attributes line 2.Port A address attributes/chip select pins with
programmable polarity.
Bus request. Asserted when port A requires bus mastership to perform offchip accesses.
Bus busy. Asserted by port A when bus_busy_in_n is negated and BG_N is
asserted.
65IOVDDIIO power supply.
66IOVSSIIO ground.
67WEN_NOWrite enable.
68OEN_NOOutput enable.
69AA[1]O
70AA[0]O
71BG_NI
72AB[0]OAddress bus line 0. Port A external address bus.
73AB[1]OAddress bus line 1. Port A external address bus.
74IOVDDIIO power supply.
75IOVSSIIO ground.
76AB[2]OAddress bus line 2. Port A external address bus.
10/42
Address attributes line 1.Port A address attributes/chip select pins with
programmable polarity.
Address attributes line 0.Port A address attributes/chip select pins with
programmable polarity.
Bus grant. When asserted, Port A becomes the bus master elect. Bus
mastership
is attained when bus busy is negated by the current bus master.
TDA7590Pin description
Table 2.Pin function (continued)
N°NameTypeDescription
77AB[3]OAddress bus line 3. Port A external address bus.
78AB[4]OAddress bus line 4. Port A external address bus.
79AB[5]OAddress bus line 5. Port A external address bus.
80IOVDDIIO power supply.
81IOVSSIIO ground.
82AB[6]OAddress bus line 6. Port A external address bus.
83AB[7]OAddress bus line 7. Port A external address bus.
84AB[8]OAddress bus line 8. Port A external address bus.
85AB[9]OAddress bus line 9. Port A external address bus.
86COREVDDICore power supply.
87COREVSSICore ground.
88AB[10]OAddress bus line 10. Port A external address bus.
89AB[11]OAddress bus line 11. Port A external address bus.
90IOVDDIIO power supply.
91IOVSSIIO ground.
92AB[12]OAddress bus line 12. Port A external address bus.
93AB[13]OAddress bus line 13. Port A external address bus.
94AB[14]OAddress bus line 14. Port A external address bus.
95AB[15]OAddress bus line 15. Port A external address bus.
96AB[16]OAddress bus line 16. Port A external address bus.
97AB[17]OAddress bus line 17. Port A external address bus.
98AB[18]OAddress bus line 18. Port A external address bus.
99AB[19]OAddress bus line 19. Port A external address bus.
100DB[0]I/OAddress bus 0. Port A external data bus.
101DB[1]I/OAddress bus 1. Port A external data bus.
102DB[2]I/OAddress bus 2. Port A external data bus.
103COREVDDICore power supply.
104COREVSSICore ground.
105DB[3]I/OData bus line 3. Port A external data bus.
106DB[4]I/OData bus line 4. Port A external data bus.
107DB[5]I/OData bus line 5. Port A external data bus.
108DB[6]I/OData bus line 6. Port A external data bus.
109DB[7]I/OData bus line 7. Port A external data bus.
110DB[8]I/OData bus line 8. Port A external data bus.
111IOVDDIIO Power Supply.
11/42
Pin descriptionTDA7590
Table 2.Pin function (continued)
N°NameTypeDescription
112IOVSSIIO Ground.
113DB[9]I/OData Bus line 9. Port A external data bus.
114DB[10]I/OData bus line 10. Port A external data bus.
115DB[11]I/OData bus line 11. Port A external data bus.
116DB[12]I/OData bus line 12. Port A external data bus.
117DB[13]I/OData bus line 13. Port A external data bus.
118DB[14]I/OData bus line 14. Port A external data bus.
119IOVDDIIO power supply.
120IOVSSIIO Ground.
121DB[15]I/OData bus line 15. port a external data bus.
122DB[16]I/OData bus line 16. Port A external data bus.
123DB[17]I/OData bus line 17. Port A external data bus.
124DB[18]I/OData bus line 18. Port A external data bus.
125DB[19]I/OData bus line 19. Port A external data bus.
126COREVDDICore power supply.
127COREVSSICore ground.
128DB[20]I/OData bus line 20. Port A external data bus.
129IOVDDIIO power supply.
130IOVSSIIO ground.
131DB[21]I/OData bus line 21. Port A external data bus.
132DB[22]I/OData bus line 22. Port A external data bus.
133DB[23]I/OData bus line 23. Port A external data bus.
134IRQAI
135IRQBI
136IRQCI
137IRQDI
138TRSTNITest reset. JTAG output pin for serial data out from debug interface.
139TDIITest data input. JTAG input pin for serial data input for debug interface.
140TCKITest clock. JTAG input pin for clocking debug interface.
141TMSI
142TDOOTest data output. JTAG output pin for serial data out from debug interface.
Interrupt request line/ Mode control. Used as mode control during RESET
and as interrupt request line at all other times.
Interrupt request line/ Mode control. Used as mode control during RESET
and as interrupt request line at all other times.
Interrupt request line/ Mode control. Used as mode control during RESET
and as interrupt request line at all other times.
Interrupt request line/ Mode control. Used as mode control during RESET
and as interrupt request line at all other times.
Test mode select. JTAG input pin for control of TAP Controller of debug
interface.
12/42
TDA7590Pin description
Table 2.Pin function (continued)
N°NameTypeDescription
143SC12I/O
Serial control 2.Transmitter frame sync only in asynchronous mode,
transmitter and receiver frame sync in synchronous mode.
Serial control 1. Receive frame sync in asynchronous mode,
144SC11/SDAI/O
output from transmitter 2 or serial flag 1 in synchronous mode.
I2C SDA. Serial data line.
2.3 Thermal data
Table 3.Thermal data
SymbolParameterValueUnit
R
th-j-pins
Thermal resistance junction to pins32°C/W
13/42
Key parametersTDA7590
3 Key parameters
3.1 Power consumption
Power consumption depends on application running and DSP clock frequency.
Supply current values are measured and guaranteed at testing level by adopting the
benchmarking program reported in Appendix 1.
Table 4.Key parameters
SymbolParameterMin.Typ.Max.Unit
General
foscCrystal frequency16MHz
CORE_VDD Operating voltage1.621.81.98V
CODEC_VDD Operating voltage3.03.33.6V
IOVDDOperating voltage3.03.33.6V
PLL_VDDOperating voltage3.03.33.6V
IDD_1.8VSupply current 150mA
IDD_3.3VSupply current 50mA
TambOperating temperature-4085°C
DSP core
fdspDSP clock frequency120MHz
ADC single ended
VppMaximum input range at ADC11.4V
THD/STotal harmonics distortion to signal-71dB
(THD+N)/S(THD + Noise) to signal-70dB
DR Dynamic range75dB
ICLInterchannel Isolation-100dB
ADC differential
VppMaximum input range at ADC0M-ADC0P2.8V
THD/STotal harmonics distortion to signal-65dB
(THD+N)/S(THD + Noise) to signal-65dB
DR Dynamic range84dB
ICLInterchannel isolation-100dB
DAC single ended
VppMaximum input range at ADC11.4V
THD/STotal harmonics distortion to signal-64dB
(THD+N)(THD + Noise) to signal-60dB
14/42
TDA7590Key parameters
Table 4.Key parameters (continued)
SymbolParameterMin.Typ.Max.Unit
DR Dynamic range89dB
ICLInterchannel isolation-100dB
DAC differential
VppMaximum input range at ADC12.8V
THD/STotal harmonics distortion to signal -58dB
(THD+N)/S(THD + Noise) to signal-57dB
DR Dynamic range90dB
ICLInterchannel Isolation-85dB
3.1.1 CODEC (ADC/DAC) test description
Reported typical values (table 3. - ADC and DAC sections) have been measured at Lab level
during product evaluation phase. General definitions and procedures are separately defined
in following dedicated paragraphs.
Total harmonic distortion with noise to signal (THD+N)/S
THD+N is defined as the ratio of the total power of the second power and higher harmonic
with noise components to the power of the fundamental for that signal. For THD+N
measurement, choose the DSP analyzer in digital analyzer with THD ratio as measurement
option. Measure the THD+N value at -3 dB amplitude of the input signal. First measure the
THD+N value at 1Vrms which is 0 dB reference and then measure the value at -3 dB
reference.
Dynamic range (DR)
DR is defined as the level of THD+N measured when the input sine wave amplitude is so
small that no harmonics apart from the fundamental tone are present in the output signal.
This way THD+N becomes practically the ratio between the whole signal and noise floor,
being a different way to express SNR. As a convention, at which no harmonics should be
present in the output signal, it is fixed at -40dB of the full scale amplitude.
Crosstalk or interchannel isolation
A disturbance, caused by electromagnetic interference, along a circuit or a cable pair. An
electric signal disrupts another signal in an adjacent circuit and can cause it to become
confused and cross over each other. Crosstalk is measured by applying a signal -3dB
amplitude of input signal at one channel (A) and no signal at an other channel (B),
measuring the effect on this channel (B) because of the channel (A).
Total harmonic distortion to signal (THD)/S
THD is defined as the ratio of the sum of only those components of the output signal which
are harmonic of system input, after having removed the fundamental tone corresponding to
the pure sine wave as input and the input signal.This measurement is done by using the
Harmonic analyzer which can isolate up to 15th harmonic components on the acquired
signal and report the sum of all of them, centering the fundamental tone on the frequency
provided by the input signal generator. These measurements are performed at -3dB
reference amplitude of input signal.
15/42
Electrical specificationTDA7590
4 Electrical specification
4.1 Absolute maximum ratings
Table 5.Absolute maximum ratings
SymbolParameterValueUnit
PLL_VDD3.3V PLL power supply voltage-0.5 to 4V
CODEC_VDD3.3V CODEC analog power supply-0.5 to 4V
IOVDD3.3V IO power supply-0.5 to 4V
CORE_VDD1.8V CORE power supply-0.5 to 2.2V
IO_MAXInput or output voltage-0.5 to (IOVDD +0.5)V
4.2 Electrical characteristics for I/O pins
Table 6.Recommended DC operating conditions
SymbolParameterValueUnit
IOVDDIO power supply voltage3 to 3.6
1. All the specification are valid only within these recommended operating conditions.
1. TTL specifications only apply to the supply voltage range Vdd = 3.15V to 3.6V.
2. Takes into account 200mV voltage drop in both supply lines.
3. X is the source/sink current under worst case conditions and is reflected in the name of the I/O cell according to the drive
capability.
Operating junction temperature-40 to 105°C
Low level input current without
pull-up device
High level input current without
pull-down device
Tri-state output leakage without
pull up/down device
Iih
Ioz
T
j
Iil
Five Volt tolerant tri-state output
leakage without pull up/down
device
VilLow level input voltage
VihHigh level input voltage
VolLow level output voltage
VohHigh level output voltage
(1)
1μA
1μA
1μA
1μA
(1)
)0.8V
(1)
(1)
(1) (2) (3)
(1) (2) (3)
Iol = XmA0.15V
Ioh = -XmA
2V
0.4V
IOVDD
- 0.15
V
V
16/42
TDA759024 bit DSP core
5 24 bit DSP core
The DSP core is a general purpose 24-bit DSP. The main feature of the DSP core are listed
below:
●120 MHz operating frequency (120 MIPS)
●Fully pipelined 24 x 24 bit parallel multiplier-accumulator
●Saturation/limiting logic
●56-bit parallel barrel shifter
●Linear, reverse carry and modulo addressing modes
●24-bit address buses for program, X and Y data spaces and DMA
●Memory-expandible hardware stack
●Nested zero-overhead DO loops
●Fast interrupts
●Powerful JTAG emulation port
●Software wait and stop low power standby modes
●Program address tracing support
●Two 24-bit data moves in parallel with arithmetic operations
●External interrupts including non-maskable interrupt
●Interrupts may be independently masked and prioritized
●Bit-manipulation instructions can access any register or memory location
●On board support for DMA controller
17/42
MemoriesTDA7590
6 Memories
128 K x 24-bit RAM divided into 4 areas, program RAM(PRAM), X data RAM(XRAM), Y
data RAM(YRAM) and flexible allocation RAM(FLEX) as follows:
●16 kB PRAM
●40 kB FLEX RAM. FLEX RAM is accessed through the expansion port by the DSP
core.
●External access to the FLEX RAM is also supported.
●72 kB RAM is allocated as XRAM and YRAM. Four configurations are supported:
–4 kB XRAM and 68 kB YRAM
–8 kB XRAM and 64 kB YRAM
–16 kB XRAM and 56 kB YRAM
–24 kB XRAM and 48 kB YRAM
18/42
TDA7590DSP peripherals
7 DSP peripherals
7.1 Serial audio interface (SAI)
The SAI is used to communicate between the CODEC and the DSPs.
In addition, digital audio can be directly input for processing. There is only one SAI found on
the chip that can be accessed by either the DSP or the DMA controller. The main features of
this block are listed below:
–Slave operating modes, all clock lines can be inputs or outputs
–Transmit and receive interrupt logic triggers on left/right data pairs
–Receive and transmit data registers have two locations to hold left and right data
7.2 Serial communication interface (SCI)
The serial communication interface provides a full duplex port for serial communication to
other DSPs, microprocessors, and peripherals like modems.
The interface supports the following features:
–No additional logic for connection to other TTL level peripherals
–Asynchronous bit rates and protocols "High speed“ synchronous data
transmission.
–Asynchronous protocol includes Multidrop mode for master/slave operation with
wake-up on Idle line and wake-up on address bit capability, permitting the SCI to
share a single line with multiple peripherals
–Transmit and receive logic can operate asynchronously from each other.
–A programmable baud-rate generator which provide the transmit and receive
clocks or functions as a general purpose timer.
7.3 I2C interface
The inter integrated-circuit bus is a simple bi-directional two-wire bus used for efficient inter
IC control. All I
them to communicate directly with each other via the I
Every component connected to the I
memory or some other complex function chip. Each of these chips can act as a receiver
and/or transmitter depending on it s functionality.
2
C bus compatible devices incorporate an on-chip interface which allows
7.4 Host interface (HI)
The host interface is a system-on-chip module that permits connection to the data bus of a
host processor. The HI is capable of driving 16 programmable external pins which can be
configured as an 8 bit parallel port for direct connection to a host processor.
2
C bus.
2
C bus has it s own unique address whether it is a CPU,
19/42
DSP peripheralsTDA7590
The key features of the host interface are:
●8 bit parallel port "Full-duplex" dedicated host register bank
●Dedicated Mozart™ core DSP register core bank.
●Register banks map directly into Mozart X memory space
●3 transfer modes:
–host command
–Host to Mozart core DSP
–Mozart core DSP to host
●Access protocols:
–Software polled
–Interrupt
–DMA access by the Mozart core DSP core
●2+ wait states clock cycles per transfer
●Supported instructions:
–Data transfer between Mozart core and external host using Mozart MOVE
instruction
–Simple I/O service routine with bit addressing instructions
–IO service using fast interrupts with MOVEP instructions.
7.5 ESSI
The ESSI peripheral enables serial-port communication between the DSP core and external
devices including Codecs, DSP, microprocessors. The ESSI is capable of driving 12
programmable external pins which can be configured as GPIO ports C and D or ESSI pins.
The key features of the ESSI are:
●Independent receiver and transmitter
●Synchronous or asynchronous channel modes synchronous. Receiver and transmitter
use same clock/sync asynchronous. Receiver and transmitter may use separate
clock/sync up to one transmitter enabled in asynchronous channel mode.
●Up to three transmitters enabled in synchronous channel mode.
●Normal mode. One word per period.
●Network mode. Up to 32 words per period.
7.6 EOC
The Salieri extended on-chip memory interface provides access to 40 kB of on-chip
memory. The Mozart core will treat this memory as if it were external. Access by off-chip
expansion bus masters is permitted. All accesses to the extended on-chip RAM are
controlled by the extended on-chip memory control register. This register determines which
combinations of the Address attribute pins should be interpreted as accesses to the 40 kB of
RAM.
20/42
TDA7590DSP peripherals
7.7 Timers and watchdog block
The timers and watchdog block consists of a common 21-bit prescaler and three
independent and identical general-purpose 24-bit timer/event counters, each with its own
register set.
Each timer has the following capabilities:
●Uses internal or external clocking.
●Interrupts the Mozart after a specified number of events (clocks).
●Signals an external device after counting internal events.
●Triggers DMA transfers after a specified number of events (clocks) occurs.
●Connects to the external world through designated pins TIO[0-2] for timers 0-2.
When TIO is configured as an
●Input: timer functions as an external event counter. Timer measures external pulse
width/signal period.
●Output: timer functions as a:
–Timer
–Watchdog timer
–Pulse-width modulator.
7.8 PLL
The PLL generates the following clocks:
●DCLK: DSP core clock
●DACLK: ADC and DAC clock
●LRCLK: left/right clock for the SAI and the CODEC
●SCLK: shift serial clock for the SAI and the CODEC
7.9 CODEC cell
The main features of the CODEC cell are listed below:
●20 bits stereo DAC, and 18 bits ADC
2
●I
S format
●Oversampling ratio: 512
●Sampling rates of 8 kHz to 48 kHz
The analog interface is in the form of differential signals for each channel. The interface on
the digital side has the form of an SAI interface and can interface directly to an SAI channel
and then to the DSP core.
DCLK can be supplied either by the internal PLL or by external, to allow synchronization
with external anal digital sources.
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK
®
is an ST trademark.
Figure 3.TQFP144 mechanical data and package dimensions
DIM.
A1.200.047
A10.050.15 0.0020.006
A20.951.00 1.05 0.037 0.039 0.041
B0.170.22 0.27 0.007 0.009 0.011
C0.090.20 0.0030.008
D21.80 22.00 22.20 0.858 0.866 0.874
D119.80 20.00 20.20 0.779 0.787 0.795
D22.000.079
D317.500.689
E21.80 22.00 22.20 0.858 0.866 0.874
E119.80 20.00 20.20 0.779 0.787 0.795
E22.000.079
E317.500.689
e0.500.020
L0.45 0.60 0.75 0.018 0.024 0.030
L11.000.0393
K0˚ (min.), 3.5˚ (typ.), 7˚(max.)
ccc0.080.03
Note 1: Exact shape of each corner is optional.
mminch
MIN. TYP. MAX. MIN. TYP. MAX.
OUTLINE AND
MECHANICAL DATA
TQFP144
(20x20x1.0mm exposed pad down)
40/42
7386636 B
TDA7590Revision history
10 Revision history
Table 8.Document revision history
DateRevisionChanges
11-Apr-20061Initial release.
26-Jan-20092
Document status promoted from preliminary data to datasheet.
Updated Section 9: Package information on page 40.
41/42
TDA7590
Please Read Carefully:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any
time, without notice.
All ST products are sold pursuant to ST’s terms and conditions of sale.
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no
liability whatsoever relating to the choice, selection or use of the ST products and services described herein.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this
document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products
or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such
third party products or services or any intellectual property contained therein.
UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED
WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS
OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT
RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING
APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY,
DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE
GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.
Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void
any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any
liability of ST.
ST and the ST logo are trademarks or registered trademarks of ST in various countries.
Information in this document supersedes and replaces all information previously supplied.
The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.