STPS2L40
Low drop power Schottky rectifier
Features
■ Very small conduction losses
■ Negligible switching losses
■ Low forward voltage drop
■ Surface mount miniature package
■ Avalanche capability specified
■ ECOPACK2
(SMAflat and SMBflat)
Description
Single chip Schottky rectifiers suited to Switched
Mode Power Supplies and high frequency DC to
DC converters.
Packaged in SMB, low profile SMB and low profile
SMA, this device is especially intended for surface
mounting and used in low voltage, high frequency
inverters, free wheeling and polarity protection
applications.
®
halogen-free component
A
K
SMB
STPS2L40U
A
K
SMAflat
STPS2L40AF
Table 1. Device summary
I
F(AV)
V
RRM
(max) 150 °C
T
j
(max) 0.34 V
V
F
A
K
SMBflat
STPS2L40UF
2 A
40 V
September 2008 Rev 4 1/10
www.st.com
10
Characteristics STPS2L40
d
-
1 Characteristics
Table 2. Absolute ratings (limiting values)
Symbol Parameter Value Unit
V
RRM
I
F(AV)
I
FSM
P
ARM
T
stg
T
Ptot
--------------
1. condition to avoid thermal runaway for a diode on its own heatsink
dTj
Table 3. Thermal resistances
Repetitive peak reverse voltage 40 V
SMB T
Average forward current
SMAflat T
= 130 °C δ = 0.5
L
= 140 °C δ = 0.5
L
= 130 °C δ = 0.5
L
Surge non repetitive forward current tp = 10 ms sinusoidal 75 A
Repetitive peak avalanche power tp = 1 µs Tj = 25 °C 2200 W
Storage temperature range -65 to + 150 °C
Operating junction temperature
j
1
------------------- -------
<
Rth j a–()
(1)
150 °C
2ASMBflat T
Symbol Parameter Value Unit
SMB 20
R
Junction to lead
th (j-l)
°C/W SMBflat 10
SMAflat 20
Table 4. Static electrical characteristics
Symbol Tests conditions Min. Typ. Max. Unit
(1)
I
Reverse leakage current
R
(1)
V
Forward voltage drop
F
1. Pulse test: tp = 380 µs, δ < 2
= 25 °C
T
j
T
= 100 °C 20 mA
j
T
= 125 °C 38 80 mA
j
V
R
= 40 V
Tj = 25 °C
I
= 1 A
T
= 125 °C 0.25 0.28
j
T
= 25 °C
j
= 125 °C 0.31 0.34
T
j
T
= 25 °C
j
= 125 °C 0.39 0.45
T
j
F
I
= 2 A
F
I
= 4 A
F
220 µA
0.39
V
0.43
0.5
V
To evaluate the conduction losses use the following equation:
P = 0.22 x I
2/10
F(AV)
+ 0.06 I
F2(RMS)
STPS2L40 Characteristics
Figure 1. Average forward power dissipation
versus average forward current
P (W)
F(AV)
1.2
1.0
0.8
0.6
0.4
0.2
0.0
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8
δ = 0.05
δ = 0.1
δ = 0.2
I (A)
F(AV)
δ = 0.5
δ
=tp/T
δ = 1
T
tp
Figure 3. Average forward current versus
ambient temperature (
δ = 0.5)
SMBflat
I(A)
F(AV)
2.2
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
0 25 50 75 100 125 150
δ
=tp/T
T
tp
R =100°C/W
th(j-a)
T (°C)
R=R
th(j-a) th(j-l)
amb
SMBflat
Figure 5. Non repetitive surge peak forward
current versus overload duration
(maximum values) SMB
I (A)
M
12
11
10
9
8
7
6
5
4
3
I
M
2
1
0
1.E-03 1.E-02 1.E-01 1.E+00
t
δ
=0.5
t(s)
SMB
T =25°C
a
T =75°C
a
T =125°C
a
Figure 2. Average forward current versus
ambient temperature (
I (A)
F(AV)
2.2
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
0 25 50 75 100 125 150
δ
=tp/T
T
tp
R =100°C/W
th(j-a)
T (°C)
R=R
th(j-a) th(j-l)
amb
δ = 0.5) SMB
SMB
Figure 4. Average forward current versus
ambient temperature (δ = 0.5)
SMAflat
I (A)
F(AV)
2.2
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
=tp/T
δ
0.0
0 25 50 75 100 125 150
R
=200 °C/W
th(j-a)
T
tp
T (°C)
amb
R
th(j-a)=Rth(j-l)
SMAflat
Figure 6. Non repetitive surge peak forward
current versus overload duration
(maximum values) SMBflat
I (A)
M
30
25
20
15
10
I
M
5
0
1.E-03 1.E-02 1.E-01 1.E+00
t
δ
=0.5
t(s)
SMBflat
T =25°C
L
T =75°C
L
T =125°C
L
3/10
Characteristics STPS2L40
0
Figure 7. Non repetitive surge peak forward
current versus overload duration
(maximum values) SMAflat
I(A)
M
8
7
6
5
4
3
2
I
M
1
0
1.E-03 1.E-02 1.E-01 1.E+0
t
=0.5
δ
t(s)
SMAflat
Ta=25 °C
Ta=75 °C
Ta=125 °C
Figure 9. Normalized avalanche power
derating versus junction
temperature
P(T)
ARM j
P (25°C)
ARM
1.2
1
0.8
0.6
0.4
0.2
0
25 50 75 100 125 150
T (°C)
j
Figure 11. Relative variation of thermal
impedance junction to lead
versus pulse duration - SMBflat
Z/R
th(j-l) th(j-l)
1.0
SMBflat
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
Single pulse
0.1
0.0
1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01
t (s)
p
δ
=tp/T
T
tp
Figure 8. Normalized avalanche power
derating versus pulse duration
P(t)
ARM p
P (1µs)
ARM
1
0.1
0.01
t (µs)
0.001
0.10.01 1
p
10 100 1000
Figure 10. Relative variation of thermal
impedance junction to ambient
versus pulse duration - SMB
Z/R
th(j-a) th(j-a)
1.0
SMB
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
Single pulse
0.1
0.0
1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
t (s)
p
δ
T
=tp/T
Figure 12. Relative variation of thermal
impedance junction to ambient
versus pulse duration - SMAflat
Z/R
th(j-a) th(j-a)
1.0
SMAflat
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
Single pulse
0.1
0.0
1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
t (s)
p
tp
4/10
STPS2L40 Characteristics
Figure 13. Reverse leakage current versus
reverse voltage applied (typical
values)
I (mA)
R
1.E+02
Tj=125°C
1.E+01
1.E+00
1.E-01
1.E-02
1.E-03
0 5 10 15 20 25 30 35 40
Tj=25°C
V (V)
R
Figure 15. Forward voltage drop versus
forward current (high level)
I (A)
FM
10.0
T=125°C
j
(typical values)
T=25°C
j
T=125°C
j
1.0
(maxmimum values)
(maximum values)
Figure 14. Junction capacitance versus
reverse voltage applied (typical
values)
C(pF)
1000
100
V (V)
10
1 10 100
R
F=1MHz
V =30mV
OSC RMS
T=25°C
j
Figure 16. Forward voltage drop versus
forward current (low level)
I (A)
FM
3.0
2.5
2.0
1.5
1.0
T=125°C
j
(typical values)
T=125°C
j
(maxmimum values)
T=25°C
j
(maximum values)
V (V)
0.1
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7
FM
Figure 17. Thermal resistance junction to
ambient versus copper surface
under each lead, SMB, SMBflat
(epoxy printed board FR4, copper
thickness = 35 µm)
R (°C/W)
th(j-a)
110
100
90
80
70
60
50
40
30
20
10
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
SMB
SMBflat
S (cm²)
CU
0.5
V (V)
0.0
0.0 0.1 0.2 0.3 0.4 0.5 0.6
FM
Figure 18. Thermal resistance junction to
ambient versus copper surface
under each lead, SMAflat (epoxy
printed board FR4, copper
thickness = 35 µm)
R (°C/W)
th(j-a)
200
180
160
140
120
100
80
60
40
20
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
S (cm²)
CU
SMAflat
5/10
Package Information STPS2L40
2 Package Information
● Epoxy meets UL94,V0
®
In order to meet environmental requirements, ST offers these devices in ECOPACK
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at www.st.com.
Table 5. SMB dimensions
Dimensions
E1
D
E
A1
C
L
A2
b
Figure 19. SMB footprint dimensions in
millimeters (inches)
1.62
2.60
(0.064) (0.102)
5.84
(0.300)
1.62
(0.064)
2.18
(0.086)
Ref.
Millimeters Inches
Min. Max. Min. Max.
A1 1.90 2.45 0.075 0.096
A2 0.05 0.20 0.002 0.008
b 1.95 2.20 0.077 0.087
c 0.15 0.40 0.006 0.016
E 5.10 5.60 0.201 0.220
E1 4.05 4.60 0.159 0.181
D 3.30 3.95 0.130 0.156
L 0.75 1.50 0.030 0.059
Figure 20. Marking information
Cathode bar (
x x x
y w w
z
unidirectional
e3
devices only )
e3: ECOPACK (Leadfree)
XXX: Marking
Z: Manufacturing location
Y: Year
WW: week
6/10
STPS2L40 Package Information
Table 6. SMBflat dimensions
Dimensions
A
c
D
L
L2
E
E1
L
L1
b
1. Applies to plated leads
Figure 21. SMBflat footprint dimensions
optimized for SMBflat
5.84
(0.230)
(1)
Ref.
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
A 0.90 1.10 0.035 0.043
(1)
b
1.95 2.20 0.077 0.087
(1)
c
0.15 0.40 0.006 0.016
D 3.30 3.95 0.130 0.156
E 5.10 5.60 0.200 0.220
E1 4.05 4.60 0.189 0.181
L 0.75 1.50 0.029 0.059
L1 0.40 0.016
L2 0.60 0.024
Figure 22. Marking information
Cathode bar (
unidirectional
devices only )
1.20
(0.047)
3.44
(0.136)
(0.047)
millimeters
(inches)
1.20
1. SMB footprint may also be used.
2.07
(0.082)
x x x
y w w
z
e3
e3: ECOPACK (Leadfree)
XXX: Marking
Z: Manufacturing location
Y: Year
WW: week
7/10
Package Information STPS2L40
Table 7. SMAflat dimensions
Dimensions
A
c
D
L 2x
L1 2x
E
E1
L
L2 2x
b
Figure 23. SMAflat footprint dimensions
optimized for SMAflat
5.52
(0.217)
1.20
(0.047)
3.12
(0.123)
millimeters
(inches)
1.20
(0.047)
1.52
(0.060)
(1)
Ref.
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
A 0.90 1.10 0.035 0.043
b 1.25 1.65 0.049 0.065
c 0.15 0.40 0.006 0.016
D 2.25 2.95 0.088 0.116
E 4.80 5.60 0.189 0.220
E1 3.95 4.60 0.156 0.181
L 0.75 1.50 0.030 0.059
L1 0.50 0.019
L2 0.50 0.019
Figure 24. Marking information
Cathode bar (
x x x
y w w
z
unidirectional
e3
devices only )
e3: ECOPACK (Leadfree)
XXX: Marking
Z: Manufacturing location
Y: Year
WW: week
1. SMA footprint may also be used.
8/10
STPS2L40 Ordering Information
3 Ordering Information
Table 8. Ordering information
Order code Marking Package Weight Base qty Delivery mode
STPS2L40U GD4 SMB 0.107 g 2500 Tape and reel
STPS2L40UF FGD4 SMBflat 0.50 g 5000 Tape and reel
STPS2L40AF F2L4 SMAflat 0.35 g 10000 Tape and reel
4 Revision history
Table 9. Document revision history
Date Revision Description of changes
Jul-2003 2A Last update.
31-Jan-2007 3
Reformatted to current standard. Added ECOPACK
statement. Added SMBflat package.
18-Sep-2008 4
Reformatted to current standard. Updated ECOPACK
statement. Added SMAflat package.
9/10
STPS2L40
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