Datasheet STPS30H60C-Y Datasheet (ST)

Page 1
STPS30H60C-Y
Automotive power Schottky rectifier
Features
■ Very small conduction losses
■ Negligible switching losses
■ Extremely fast switching
Description
30 A dual center tab Schottky rectifier suitable for automotive applications.
Package in PowerSO-20 (slug up), this device is especially intented for use in a low voltage applications.
A1
A2
Pin 10
K
K
Pin 1
Pin 20
PowerSO-20 (slug up)
STPS30H60CKY-TR

Table 1. Device summary

Symbol Value
I
F(AV)
V
RRM
T
j(max)
V
F(max)
K
Pin 11
K
A1
A2
K
2 x 15 A
60 V
150 °C
0.645 V
December 2010 Doc ID 18295 Rev 1 1/7
www.st.com
7
Page 2
Characteristics STPS30H60C-Y

1 Characteristics

Table 2. Absolute rating (limiting value, per diode)

Symbol Parameter Value Unit
V
RRM
IF
(RMS)
IF
(AV)
I
FSM
T
T
1. All anode pins (A1, A2) must be connected
Repetitive peak reverse voltage 60 V
(1)
Forward rms current 45 A
= 140 °C, δ = 0.5
T
c
(1)
Average forward current
square pulse
= 135 °C, δ = 0.5
T
c
square pulse
(1)
Surge non repetitive forward current tp = 10 ms Sinusoidal 250 A
Storage temperature range -65 to +175 °C
stg
T
Operating junction temperature range -40 to +150 °C
j
Recommended reflow soldering temperature range 245 +0/-5 °C
R
Per diode 15
Per device 30

Table 3. Thermal parameters

Symbol Parameter Value Unit
R
R
th(j-c)
th(c)
Junction to case
Per diode Per device
Coupling 0.27 °C/W
0.95
0.61
°C/W
When diodes 1 and 2 are used simultaneously: ΔT
j(diode 1)

Table 4. Static electrical characteristics (per diode)

= P
(diode1)
x R
th(j-c)(Per diode)
+ P
(diode 2)
x R
th(c)
A
Symbol Parameter Test conditions Min. Typ. Max. Unit
= 25 °C
T
R
(1)
V
F
1. Pulse test : tp = 380 µs, d < 2%
2. All anode pins (A1, A2) must be connected
current
(2)
Forward voltage drop
Reverse leakage
(1)
I
j
= 125 °C 45 mA
T
j
= 25 °C IF = 15 A 0.580
T
j
T
= 125 °C IF = 15 A 0.515
j
= 25 °C IF = 30 A 0.700
T
j
= 125 °C IF = 30 A 0.645
T
j
V
R
To evaluate the maximum conduction losses use the following equation: P = 0.385 x I
2/7 Doc ID 18295 Rev 1
+ 0.00867 x I
F(AV)
F2(RMS)
= V
150 µA
RRM
V
Page 3
STPS30H60C-Y Characteristics
Figure 1. Average forward power dissipation
versus average forward current (per diode, all anode pins connected)
P (W)
F(AV)
12
δ = 0.05
10
8
6
4
2
0
0 2 4 6 8 101214161820
δ = 0.1
δ = 0.2
δ = t / T
p
δ = 0.5
T
t
p
δ = 1
I (A)
F(AV)
Figure 3. Non repetitive surge peak forward
current versus overload duration (maximum values)
I (A)
M
300
250
200
150
100
I
50
M
t
δ = 0.5
0
1.E-03 1.E-02 1.E-01 1.E+00
(per diode, all anode pins connected)
T = 25 °C
c
T = 75 °C
c
T = 125 °C
c
t(s)
Figure 5. Reverse leakage current versus
reverse voltage applied (per diode) (typical values)
I (mA)
R
1.E+02
1.E+01
1.E+00
1.E-01
1.E-02
T = 150 °C
j
T = 125 °C
j
T = 100 °C
j
T = 75 °C
j
T = 50 °C
j
T = 25 °C
j
Figure 2. Average forward current versus
ambient temperature (per diode, all anode pins connected) (δ = 0.5)
I (A)
F(AV)
18
R
16
14
12
10
8
6
4
2
0
T
δ = t / T
0 25 50 75 100 125 150
t
p
p
R
th(j-a)
= 10 °C/W
th(j-a)
= R
th(j-c)
T (°C)
amb
Figure 4. Relative variation of thermal
impedance junction to case versus pulse duration
Z/R
th(j-c) th(j-c)
1.0 (per diode, all anode pins connected)
0.9
0.8
0.7
0.6
0.5
0.4
Single pulse
0.3
0.2
0.1
0.0
1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01
t (s)
p
Figure 6. Junction capacitance versus
reverse voltage applied (per diode) (typical values)
C(nF)
10.0
1.0
F=1MHz
V=30mV
osc RMS
T=25°C
j
1.E-03 0 5 10 15 20 25 30 35 40 45 50 55 60
V (V)
R
0.1 1 10 100
V (V)
R
Doc ID 18295 Rev 1 3/7
Page 4
Characteristics STPS30H60C-Y
Figure 7. Forward voltage drop versus
forward current (per diode, all anode pins connected, low level)
I (A)
FM
30
T = 125 °C
25
20
15
10
5
0
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8
j
(Maximum values)
T = 125 °C
j
(Typical values)
T = 25 °C
j
(Maximum values)
V (V)
FM
Figure 8. Forward voltage drop versus
forward current (per diode, all anode pins connected, high level)
I (A)
FM
100.0
T = 125 °C
j
(Maximum values)
T = 125 °C
10.0
1.0
0.1
j
(Typical values)
T = 25 °C
j
(Maximum values)
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1
V (V)
FM
4/7 Doc ID 18295 Rev 1
Page 5
STPS30H60C-Y Package information

2 Package information

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK specifications, grade definitions and product status are available at: www.st.com ECOPACK

Table 5. PowerSO-20 (slug up) dimensions

R
E3
H
®
packages, depending on their level of environmental compliance. ECOPACK®
®
is an ST trademark.
Dimensions
Ref
Millimeter Inch
Min Typ Max Min Typ Max
A 3.25 3.5 0.128 0.138
A2 3 3.15 3.3 0.118 0.124 0.13
A4 0.8 1 0.031 0.039
-C-
GC
c
A4
V
E
E2
A5
DETAIL A
A
A2
D2 (x2)
M
10
e
SEATING PLANE
(COP LANAR ITY)
a1
L
0.35
S
DETAIL A
Gage Plane
E1
11
A5 0.15 0.2 0.25 0.006 0.008 0.01
a1 0.03 -0.04 0.0012 -0.0016
b 0.4 0.53 0.016 0.021
c 0.23 0.32 0.009 0.012
(1)
D
15.8 16 0.622 0.63
D1 9.4 9.8 0.37 0.385
D2 1 0.039
PSO20DME
E 13.9 14.5 0.547 0.57
(1)
E1
10.9 11.1 0.429 0.437
E2 2.9 0.114
E3 5.8 6.2 0.228 0.244
D1
D
e3
e 1.12 1.27 1.42 0.044 0.05 0.056
e3 11.43 0.45
.
N
b
N
1
hx45°
20
E2
G 0 0.1 0 0.004
H 15.5 15.9 0.61 0.625
h 1.1 0.043
L 0.8 1.1 0.031 0.043
N10°10°
R 0.6 0.024
S0° 8°0° 8°
V5° 7°5° 7°
1. These measurements do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm (0.006”). Critical dimensions: E, a1, e, and G.
Doc ID 18295 Rev 1 5/7
Page 6
Ordering information STPS30H60C-Y

3 Ordering information

Table 6. Ordering information

Order code Marking Package Weight Base qty Delivery mode
STPS30H60CKY-TR PS30H60CY PowerSO-20 1.93 g 600 Tape and reel

4 Revision history

Table 7. Document revision history

Date Revision Changes
02-Dic-2010 1 First issue.
6/7 Doc ID 18295 Rev 1
Page 7
STPS30H60C-Y
Please Read Carefully:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice.
All ST products are sold pursuant to ST’s terms and conditions of sale.
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein.
UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.
Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST.
ST and the ST logo are trademarks or registered trademarks of ST in various countries.
Information in this document supersedes and replaces all information previously supplied.
The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.
© 2010 STMicroelectronics - All rights reserved
STMicroelectronics group of companies
Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan -
Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America
www.st.com
Doc ID 18295 Rev 1 7/7
Loading...