Datasheet STPS2H100-Y Datasheet (ST)

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Features

■ Negligible switching losses

■ High junction temperature capability

■ Low leakage current

■ Good trade-off between leakage current and

forward voltage drop

■ Avalanche capability specified

■ ECOPACK

■ AEC-Q101 qualified

2 compliant component

STPS2H100-Y

Automotive power Schottky rectifier

SMA

STPS2H100AY

STPS2H100UY

SMB

Description

Schottky rectifiers designed for high frequency miniature switched mode power supplies such as adaptators and on board DC/DC converters. Available in SMA and SMB.

Table 1. Device summary

Symbol Value

F(AV)

RRM

(max) 175 °C

(max) 0.65 V

2 A

100 V

December 2010 Doc ID 17944 Rev 1 1/9

www.st.com

Characteristics STPS2H100-Y

1 Characteristics

Table 2. Absolute ratings (limiting values)

Symbol Parameter Value Unit

F(AV)

1. condition to avoid thermal runaway for a diode on its own heatsink

Table 3. Thermal resistance

Symbol Parameter Value Unit

Repetitive peak reverse voltage 100 V

RRM

Average forward current SMA / SMB TL = 130 °C δ = 0.5 2 A

Surge non repetitive forward current tp =10 ms sinusoidal 75 A

FSM

Repetitive peak avalanche power tp = 1 µs Tj = 25 °C 2400 W

ARM

Storage temperature range -65 to +175 °C

stg

Operating junction temperature range

dPtot

dTj

Rth(j-a)

(1)

-40 to +175 °C

th(j-l)

Junction to lead

SMB 25

°C/W

Table 4. Static electrical characteristics

SMA 30

Symbol Parameter Test conditions Min. Typ. Max. Unit

(1)

1. Pulse test: tp = 5 ms, δ < 2%

2. Pulse test: tp = 380 µs, δ < 2%

Reverse leakage current

(2)

Forward voltage drop

Tj = 25 °C

VR = V

= 2 A

= 4 A

RRM

= 125 °C - 0.4 1 mA

= 25 °C

= 125 °C - 0.6 0.65

= 25 °C

Tj = 125 °C - 0.69 0.74

--1µA

- - 0.79

- - 0.88

To evaluate the conduction losses use the following equation: P = 0.56 x I

F(AV)

+ 0.045 I

F2(RMS)

2/9 Doc ID 17944 Rev 1

STPS2H100-Y Characteristics

Figure 1. Average forward power dissipation

versus average forward current

P (W)

F(AV)

1.7

1.6

1.5

1.4

1.3

1.2

1.1

1.0

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

0.1

0.0

0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2

δ = 0.05

I (A)

F(AV)

δ = 0.1

δ = 0.2

δ = 0.5

=tp/T

δ = 1

Figure 3. Normalized avalanche power

derating versus pulse duration

P(tp)

ARM

P (1 µs)

ARM

0.1

0.01

t (µs)

0.001

0.10.01 1

10 100 1000

Figure 5. Non repetitive surge peak forward

current versus overload duration (maximum values) (SMA)

I (A)

1.E-03 1.E-02 1.E-01 1.E+00

δ=0.5

t(s)

SMA

T =25°C

T =75°C

T =125°C

Figure 2. Average forward current versus

ambient temperature (δ = 0.5) (SMA / SMB)

I (A)

F(AV)

2.2

2.0

1.8

1.6

1.4

1.2

1.0

0.8

0.6

0.4

0.2

0.0

SMA R =100°C/W

th(j-a)

S =1.5cm

(CU)

=tp/T

0 25 50 75 100 125 150 175

R=R

th(j-a) th(j-I)

SMB R =80°C/W

th(j-a)

S =1.5cm

(CU)

T (°C)

amb

SMB

SMA

Figure 4. Normalized avalanche power

derating versus junction temperature

P(Tj)

ARM

P (25 °C)

ARM

1.2

0.8

0.6

0.4

0.2

25 50 75 100 125 150

T (°C)

Figure 6. Non repetitive surge peak forward

current versus overload duration (maximum values) (SMB)

I (A)

1.E-03 1.E-02 1.E-01 1.E+00

δ=0.5

t(s)

SMB

T =25°C

T =75°C

T =125°C

Doc ID 17944 Rev 1 3/9

Characteristics STPS2H100-Y

Figure 7. Relative variation of thermal

impedance junction to ambient versus pulse duration (SMA / SMB)

Z/R

th(j-a) th(j-a)

1.0

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

Single pulse

0.1

0.0

1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03

t (s)

SMB

SMA

=tp/T

Figure 9. Junction capacitance versus

reverse voltage applied (typical values)

C(pF)

100

V (V)

1 10 100

F=1MHz

V =30mV

OSC RMS

T=25°C

Figure 8. Reverse leakage current versus

reverse voltage applied (typical values)

I (µA)

1.E+04

1.E+03

1.E+02

1.E+01

1.E+00

1.E-01

1.E-02

0 20406080100

Tj=150°C

Tj=125°C

Tj=100°C

Tj=75°C

Tj=50°C

Tj=25°C

V (V)

Figure 10. Forward voltage drop versus

forward current (low level)

I (A)

2.0

1.8

1.6

1.4

1.2

1.0

0.8

0.6

0.4

0.2

0.0

0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2

Tj=125°C

(Maximum values)

Tj=125°C

(Typical values)

(Maximum values)

V (V)

Tj=25°C

4/9 Doc ID 17944 Rev 1

STPS2H100-Y Characteristics

Figure 11. Forward voltage drop versus

forward current (high level)

Figure 12. Thermal resistance junction to

ambient versus copper surface under each lead (SMA)

R (°C/W)

I (A)

100

Tj=125°C

(Maximum values)

Tj=125°C

(Typical values)

Tj=25°C

(Maximum values)

V (V)

0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8

th(j-a)

130

120

110

100

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0

Epoxy printed circuit board FR4,

Copper thickness = 35 µm

S (cm²)

SMA

Figure 13. Thermal resistance junction to ambient versus copper surface under each lead (SMB)

R (°C/W)

th(j-a)

110

100

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0

Epoxy printed circuit board FR4,

Copper thickness = 35 µm

S (cm²)

SMB

Doc ID 17944 Rev 1 5/9

Package information STPS2H100-Y

2 Package information

● Epoxy meets UL94, V0

● Lead-free packages

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK specifications, grade definitions and product status are available at: www.st.com ECOPACK

Table 5. SMA dimensions

packages, depending on their level of environmental compliance. ECOPACK®

is an ST trademark.

Dimensions

Ref.

Millimeters Inches

Min. Max. Min. Max.

A1 1.90 2.45 0.075 0.094

A2 0.05 0.20 0.002 0.008

b 1.25 1.65 0.049 0.065

c 0.15 0.40 0.006 0.016

D 2.25 2.90 0.089 0.114

E 4.80 5.35 0.189 0.211

E1 3.95 4.60 0.156 0.181

L 0.75 1.50 0.030 0.059

Figure 14. SMA footprint (dimensions in mm)

1.4

2.63

1.4

5.43

6/9 Doc ID 17944 Rev 1

1.64

STPS2H100-Y Package information

Table 6. SMB dimensions

Dimensions

Ref.

Figure 15. SMB footprint (dimensions in mm)

1.62

2.60

5.84

1.62

Millimeters Inches

Min. Max. Min. Max.

A1 1.90 2.45 0.075 0.096

A2 0.05 0.20 0.002 0.008

b 1.95 2.20 0.077 0.087

c 0.15 0.40 0.006 0.016

E 5.10 5.60 0.201 0.220

E1 4.05 4.60 0.159 0.181

D 3.30 3.95 0.130 0.156

L 0.75 1.50 0.030 0.059

2.18

Doc ID 17944 Rev 1 7/9

Ordering information STPS2H100-Y

3 Ordering information

Table 7. Ordering information

Order code Marking Package Weight Base qty Delivery mode

STPS2H100AY S21Y SMA 0.068 g 5000 Tape and reel

STPS2H100UY G21Y SMB 0.107 g 2500 Tape and reel

4 Revision history

Table 8. Document revision history

Date Revision Changes

03-Dec-2010 1 Initial release.

8/9 Doc ID 17944 Rev 1

STPS2H100-Y

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Doc ID 17944 Rev 1 9/9

Datasheet STPS2H100-Y Datasheet (ST)

Specifications and Main Features

Frequently Asked Questions

User Manual

Table 1. Device summary

1 Characteristics

Table 2. Absolute ratings (limiting values)

Table 3. Thermal resistance

Table 4. Static electrical characteristics

Figure 13. Thermal resistance junction to ambient versus copper surface under each lead (SMB)

2 Package information

Table 5. SMA dimensions

Figure 14. SMA footprint (dimensions in mm)

Table 6. SMB dimensions

Figure 15. SMB footprint (dimensions in mm)

3 Ordering information

Table 7. Ordering information

4 Revision history

Table 8. Document revision history