To evaluate the conduction losses use the following equation:
P = 0.28 x I
2/7
F(AV)
+ 0.022 I
F2(RMS)
= V
V
R
RRM
V
0.7mA
STPS20L40CCharacteristics
Figure 1.Average forward power
dissipation versus average forward
current (per diode)
P(W)
F(AV)
8
7
6
5
4
3
2
1
0
δ = 0.05
02468101214
δ = 0.1
δ = 0.2
I(A)
F(AV)
δ = 0.5
δ
=tp/T
δ = 1
T
tp
Figure 3.Normalized avalanche power
derating versus pulse duration
P(t)
ARM p
P(1µs)
ARM
1
0.1
0.01
t (µs)
0.001
0.10.011
p
101001000
Figure 5.Non repetitive surge peak forward
current versus overload duration
(maximum values, per diode)
Figure 2.Average forward current versus
ambient temperature
(
δ = 0.5, per diode)
I(A)
F(AV)
12
11
10
9
8
7
6
5
4
3
2
1
=tp/T
δ
0
0255075100125150
R =15°C/W
th(j-a)
T
tp
T(°C)
amb
R=R
th(j-a) th(j-c)
Figure 4.Normalized avalanche power
derating versus junction
temperature
P(t)
ARM p
P(25°C)
ARM
1.2
1
0.8
0.6
0.4
0.2
0
255075100125150
T (°C)
j
Figure 6.Relative variation of thermal
impedance junction to case versus
pulse duration
I (A)
M
100
90
80
70
60
50
40
30
IM
20
10
0
1E-31E-21E-11E+0
δ=0.5
t
t(s)
T =25°C
T =50°C
T =100°C
C
Z/R
th(j-c) th(j-c)
1.0
0.8
0.6
C
C
δ = 0.5
0.4
δ = 0.2
δ = 0.1
0.2
t (s)
Single pulse
0.0
1E-31E-21E-11E+01E+1
p
3/7
δ
=tp/T
T
tp
CharacteristicsSTPS20L40C
Figure 7.Reverse leakage current versus
reverse voltage applied
(typical values, per diode)
I (mA)
R
2E+2
1E+2
1E+1
1E+0
1E-1
1E-2
1E-3
0510152025303540
T =150°C
j
T =125°C
j
T =75°C
j
T =25°C
j
V (V)
R
Figure 9.Forward voltage drop versus
forward current (maximum values)
(per diode)
I (A)
FM
100.0
10.0
T =125°C
j
T =150°C
j
(typical values)
T =25°C
j
Figure 8.Junction capacitance versus
reverse voltage applied
(typical values, per diode)
C(pF)
2000
1000
V (V)
100
1251020 50
R
F=1MHz
V =30mV
OSCRMS
T =25°C
j
1.0
0.1
0.00.20.40.60.81.01.21.41.6
T =75°C
j
V (V)
FM
4/7
STPS20L40CPackage Information
2 Package Information
●Epoxy meets UL94, V0
●Cooling method: by conduction (C)
●Recommended torque value: 0.55 Nm
●Maximum torque value: 0.70 Nm
Table 4.TO-220FPAB dimensions
Dimensions
Ref
MillimetersInches
Min.Max.Min.Max.
A 4.4 4.6 0.173 0.181
A
H
B
B 2.5 2.7 0.098 0.106
D 2.5 2.75 0.098 0.108
E 0.45 0.70 0.018 0.027
Dia
L6
L2
L3
L5
F1
L4
F2
D
L7
F 0.75 1 0.030 0.039
F1 1.15 1.70 0.045 0.067
F2 1.15 1.70 0.045 0.067
G 4.95 5.20 0.195 0.205
G1 2.4 2.7 0.094 0.106
H 10 10.4 0.393 0.409
L2 16 Typ. 0.63 Typ.
G1
F
E
L3 28.6 30.6 1.126 1.205
L4 9.8 10.6 0.386 0.417
G
L5 2.9 3.6 0.114 0.142
L6 15.9 16.4 0.626 0.646
L7 9.00 9.30 0.354 0.366
Dia. 3.00 3.20 0.118 0.126
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
5/7
Ordering informationSTPS20L40C
3 Ordering information
Ordering typeMarkingPackageWeightBase qty
STPS20L40CFP STPS20L40CFP TO-220FPAB 2 g 50 Tube
Delivery
mode
4 Revision history
DateRevisionDescription of Changes
Jul_20034BLast release.
26-Mar-20075Removed ISOWATT, TO-220AB and TO-247 packages.
6/7
STPS20L40C
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