Datasheet STGP7NB60M, STGD7NB60M Datasheet (ST)

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STGP7NB60M - STGD7NB60M
N-CHANNEL 7A - 600V TO-220 / DPAK
PowerMESH™ IGBT
TYPE
STGP7NB60M STGD7NB60M
HIGH INPUT IMPEDANCE
LOW ON-VOLTAGE DROP (V
LOW GATE CHARGE
HIGH CURRENT CAPABILITY
HIGH FREQUENCY OPERATION
CO-PACKAGED WITH TURBOSWITCH™
V
CES
600 V 600 V
V
CE(sat) (Max)
@25°C < 1.9 V
< 1.9 V
cesat
)
I
C
@100°C
7A 7A
ANTIPARALLEL DIODE
DESCRIPTION
Using the latest high voltage technology based on a patented strip layout, STMicroelectronics has de­signed an advanc ed family of IGBTs, the Power­MESH™ IGBTs, with outstanding perfomances. The suffix "M" identifies a family optimized to achieve very low switc hing switching times for high frequency applications (<20KHZ)
3
1
TO-220
3
2
1
DPAK
INTERNAL SCHEMATIC DIAGRAM
APPLICATIONS
MOTOR CONTROLS
SMPS AND PFC AND BOTH HARD SWITCH
AND RESONANT TOPOLOGIES
ORDERING INFORMATION
SALES TYPE MARKING PACKAGE PACKAGING
STGP7NB60M GP7NB60M TO-220 TUBE
STGD7NB60MT4 GD7NB60M DPAK TAPE & REEL
1/11June 2003
STGP7NB60M - STG D7NB60M
ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Value Unit
TO-220 DPAK
V
CES
V
I I
I
CM
P
TOT
T
T
() Pulse width limited by safe operating area
THERMAL DATA
Rthj-case Thermal Resistance Junction-case Max 1.56 1.78 °C/W
Rthj-amb Thermal Resistance Junction-ambient Max 62.5 100 °C/W
Collector-Emitter Voltage (VGS=0) Gate-Emitter Voltage ±20 V
GE
Collector Current (continuous) at TC=25°C
C
Collector Current (continuous) at TC=100°C
C
()
Collector Current (pulsed) 56 A Total Dissipation at TC= 25°C
80 70 W
600 V
14 A
7A
Derating Factor 0.64 0.56 W/°C Storage Temperature – 55 to 150 °C
stg
Max. Operating Junction Temperature 150 °C
j
TO-220 DPAK
ELECTRICAL CHARACTERISTICS (T
= 25 °C UNLESS OTHERWISE SPECIFIED)
CASE
OFF
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
BR(CES)
Collector-Emitter Breakdown
IC= 250 µA, VGE=0 600 V
Voltage
I
CES
I
GES
Collector cut-off
=0)
(V
GE
Gate-Emitter Leakage Current (V
CE
=0)
V
= Max Rating, TC=25°C
CE
VCE= Max Rating, TC= 125 °C V
=±20V,VCE= 0 ±100 nA
GE
50 µA
100 µA
ON (1)
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
GE(th)
V
CE(sat)
Gate Threshold Voltage Collector-Emitter Saturation
Voltage
V
CE=VGE,IC
VGE= 15V, IC=7A VGE= 15V, IC= 7 A, Tj =125°C
=250µA
35V
1.5 1.9 V
1.2 V
2/11
STGP7NB60M - STG D7NB60M
ELECTRICAL CHARACTERISTICS (CONTINUED)
DYNAMIC
Symbol Parameter Test Conditions Min. Typ. Max. Unit
(1)
g
fs
C
ies
C
oes
C
res
Forward Transconductance Input Capacitance Output Capacitance 85 pF Reverse Transfer
Capacitance
Q
Q
ge
Q
gc
I
CL
Total Gate Charge
g
Gate-Emitter Charge Gate-Collector Charge
Latching Current V
SWITCHING ON
Symbol Parameter Test Conditions Min. Typ. Max. Unit
t
d(on)
t
(di/dt)
Eon
r
Turn-on Delay Time Rise Time
Turn-on Current Slope
on
Turn-on Switching Losses
VCE=25V,Ic=7A V
=25V,f=1MHz,VGE=0
CE
= 480V, IC=7A,
V
CE
=15V
V
GE
= 480 V, VGE=15V
clamp
Tj = 125°C , RG=10
= 480 V, IC=7ARG=10
V
CC
,VGE=15V
=480V,IC=7ARG=10
V
CC
V
= 15 V,Tj =125°C
GE
5S
550 pF
13 pF
37
50
4.2 13
28 A
13
6
1000
50
nC nC nC
ns ns
A/µs
µJ
SWITCHING OFF
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
t
c
t
r(Voff
t
d(off
t
f
(**)
E
off
E
ts
t
c
t
r(Voff
td(
off
t
f
E
(**)
off
E
ts
Note: 1. Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %.
2. Pulse width limited by max. junction temperature.
(**)Losses include Also the Tail (Jedec Standardization)
Cross-over Time
)
Off Voltage Rise Time 95 ns
)
Delay Time 155 ns Fall Time 240 ns Turn-off Switching Loss 455 Total Switching Loss 500 Cross-over Time
)
Off Voltage Rise Time 215 ns
)
Delay Time 280 ns Fall Time 390 ns Turn-off Switching Loss 870 Total Switching Loss 920
=480V,IC=7A,
cc
R
=10,VGE=15V
G
V
=480V,IC=7A,
cc
R
=10,VGE=15V
G
Tj = 125 °C
340 ns
610 ns
µJ µJ
µJ µJ
3/11
STGP7NB60M - STG D7NB60M
Output Characteristics
Transfer Characteri stics
Normalized Co llecto r-Emitter On Voltage vs Temp .Transconductance
Collector-Emitter On Voltage vs Collector Current
4/11
Gate Thresho ld vs Tempe rature
STGP7NB60M - STG D7NB60M
Normalized Breakdown Voltage vs Temperature
Gate Charge vs G ate-Emitter Voltage
Capacitance Variations
Total Switching Losses vs Gate Resistance
Total Switching Lo sses vs Temperature
Total Switching L osses vs Collector Current
5/11
STGP7NB60M - STG D7NB60M
Turn-Off SOA
Thermal Imped ance for DPAKThermal Impedance for TO-220
6/11
STGP7NB60M - STG D7NB60M
Fig. 2: Test Circuit For Induc t ive Load SwitchingFig. 1: Gate Charge test Circuit
7/11
STGP7NB60M - STG D7NB60M
TO-220 MECHANICAL DATA
DIM.
A 4.40 4.60 0.173 0.181
b 0.61 0.88 0.024 0.034
b1 1.15 1.70 0.045 0.066
c 0.49 0.70 0.019 0.027 D 15.25 15.75 0.60 0.620 E 10 10.40 0.393 0.409
e 2.40 2.70 0.094 0.106
e1 4.95 5.15 0.194 0.202
F 1.23 1.32 0.048 0.052
H1 6.20 6.60 0.244 0.256
J1 2.40 2.72 0.094 0.107
L 13 14 0.511 0.551
L1 3.50 3.93 0.137 0.154 L20 16.40 0.645 L30 28.90 1.137
øP 3.75 3.85 0.147 0.151
Q 2.65 2.95 0.104 0.116
MIN. TYP MAX. MIN. TYP. MAX.
mm. inch
8/11
STGP7NB60M - STG D7NB60M
P032P_B
TO-252 (DPAK) MECHANICAL DATA
DIM.
A 2.20 2.40 0.087 0.094 A1 0.90 1.10 0.035 0.043 A2 0.03 0.23 0.001 0.009
B 0.64 0.90 0.025 0.035 B2 5.20 5.40 0.204 0.213
C 0.45 0.60 0.018 0.024
C2 0.48 0.60 0.019 0.024
D 6.00 6.20 0.236 0.244
E 6.40 6.60 0.252 0.260
G 4.40 4.60 0.173 0.181
H 9.35 10.10 0.368 0.398 L2 0.8 0.031 L4 0.60 1.00 0.024 0.039 V2 0
MIN. TYP. MAX. MIN. TYP. MAX.
o
mm inch
o
8
o
0
o
0
9/11
STGP7NB60M - STG D7NB60M
DPAK FOOTPRINT
All dimensions are in m illimeters
TAPE AND REEL SHIPMENT (suffix ”T4”)*
TUBE SHIPMENT (no suffix)*
All dimensions
are in millimeters
REEL MECHANICAL DATA
DIM.
A 330 12.992
B 1.5 0.059 C 12.8 13.2 0.504 0.520 D 20.2 0.795 G 16.4 18.4 0.645 0.724 N 50 1.968
T 22.4 0.881
mm inch
MIN. MAX. MIN. MAX.
TAPE MECHANICAL DATA
DIM.
A0 6. 8 7 0.267 0.275 B0 10.4 10.6 0.409 0.417 B1 12.1 0.476
D 1.5 1.6 0.059 0.063
D1 1.5 0.059
E 1.65 1.85 0.065 0.073
F 7. 4 7.6 0.291 0.299 K0 2.55 2.75 0.100 0.108 P0 3. 9 4.1 0.153 0.161 P1 7.9 8.1 0.311 0.319 P2 1. 9 2.1 0.075 0.082
R 40 1.574
W 15.7 16.3 0.618 0.641
* on sales ty pe
10/11
mm inch
MIN. MAX. MIN. MAX.
BASE QTY BULK QTY
2500 2500
STGP7NB60M - STG D7NB60M
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of u se of such inf ormat ion nor for any in fring ement of p aten ts or othe r ri ghts of th ird p arties whic h may resul t f rom its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
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11/11
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