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STGP7NB60M - STGD7NB60M
N-CHANNEL 7A - 600V TO-220 / DPAK
PowerMESH™ IGBT
TYPE
STGP7NB60M
STGD7NB60M
■ HIGH INPUT IMPEDANCE
■ LOW ON-VOLTAGE DROP (V
■ OFF LOSSES INCLUDE TAIL CURRENT
■ LOW GATE CHARGE
■ HIGH CURRENT CAPABILITY
■ HIGH FREQUENCY OPERATION
■ CO-PACKAGED WITH TURBOSWITCH™
V
CES
600 V
600 V
V
CE(sat) (Max)
@25°C
< 1.9 V
< 1.9 V
cesat
)
I
C
@100°C
7A
7A
ANTIPARALLEL DIODE
DESCRIPTION
Using the latest high voltage technology based on a
patented strip layout, STMicroelectronics has designed an advanc ed family of IGBTs, the PowerMESH™ IGBTs, with outstanding perfomances.
The suffix "M" identifies a family optimized to
achieve very low switc hing switching times for high
frequency applications (<20KHZ)
3
1
TO-220
3
2
1
DPAK
INTERNAL SCHEMATIC DIAGRAM
APPLICATIONS
■ MOTOR CONTROLS
■ SMPS AND PFC AND BOTH HARD SWITCH
AND RESONANT TOPOLOGIES
ORDERING INFORMATION
SALES TYPE MARKING PACKAGE PACKAGING
STGP7NB60M GP7NB60M TO-220 TUBE
STGD7NB60MT4 GD7NB60M DPAK TAPE & REEL
1/11 June 2003
STGP7NB60M - STG D7NB60M
ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Value Unit
TO-220 DPAK
V
CES
V
I
I
I
CM
P
TOT
T
T
( ) Pulse width limited by safe operating area
THERMAL DATA
Rthj-case Thermal Resistance Junction-case Max 1.56 1.78 °C/W
Rthj-amb Thermal Resistance Junction-ambient Max 62.5 100 °C/W
Collector-Emitter Voltage (VGS=0)
Gate-Emitter Voltage ±20 V
GE
Collector Current (continuous) at TC=25°C
C
Collector Current (continuous) at TC=100°C
C
( )
Collector Current (pulsed) 56 A
Total Dissipation at TC= 25°C
80 70 W
600 V
14 A
7A
Derating Factor 0.64 0.56 W/°C
Storage Temperature – 55 to 150 °C
stg
Max. Operating Junction Temperature 150 °C
j
TO-220 DPAK
ELECTRICAL CHARACTERISTICS (T
= 25 °C UNLESS OTHERWISE SPECIFIED)
CASE
OFF
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
BR(CES)
Collector-Emitter Breakdown
IC= 250 µA, VGE=0 600 V
Voltage
I
CES
I
GES
Collector cut-off
=0)
(V
GE
Gate-Emitter Leakage
Current (V
CE
=0)
V
= Max Rating, TC=25°C
CE
VCE= Max Rating, TC= 125 °C
V
=±20V,VCE= 0 ±100 nA
GE
50 µA
100 µA
ON (1)
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
GE(th)
V
CE(sat)
Gate Threshold Voltage
Collector-Emitter Saturation
Voltage
V
CE=VGE,IC
VGE= 15V, IC=7A
VGE= 15V, IC= 7 A, Tj =125°C
=250µA
35 V
1.5 1.9 V
1.2 V
2/11
STGP7NB60M - STG D7NB60M
ELECTRICAL CHARACTERISTICS (CONTINUED)
DYNAMIC
Symbol Parameter Test Conditions Min. Typ. Max. Unit
(1)
g
fs
C
ies
C
oes
C
res
Forward Transconductance
Input Capacitance
Output Capacitance 85 pF
Reverse Transfer
Capacitance
Q
Q
ge
Q
gc
I
CL
Total Gate Charge
g
Gate-Emitter Charge
Gate-Collector Charge
Latching Current V
SWITCHING ON
Symbol Parameter Test Conditions Min. Typ. Max. Unit
t
d(on)
t
(di/dt)
Eon
r
Turn-on Delay Time
Rise Time
Turn-on Current Slope
on
Turn-on Switching Losses
VCE=25V,Ic=7A
V
=25V,f=1MHz,VGE=0
CE
= 480V, IC=7A,
V
CE
=15V
V
GE
= 480 V, VGE=15V
clamp
Tj = 125°C , RG=10Ω
= 480 V, IC=7ARG=10Ω
V
CC
,VGE=15V
=480V,IC=7ARG=10Ω
V
CC
V
= 15 V,Tj =125°C
GE
5S
550 pF
13 pF
37
50
4.2
13
28 A
13
6
1000
50
nC
nC
nC
ns
ns
A/µs
µJ
SWITCHING OFF
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
t
c
t
r(Voff
t
d(off
t
f
(**)
E
off
E
ts
t
c
t
r(Voff
td(
off
t
f
E
(**)
off
E
ts
Note: 1. Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %.
2. Pulse width limited by max. junction temperature.
(**)Losses include Also the Tail (Jedec Standardization)
Cross-over Time
)
Off Voltage Rise Time 95 ns
)
Delay Time 155 ns
Fall Time 240 ns
Turn-off Switching Loss 455
Total Switching Loss 500
Cross-over Time
)
Off Voltage Rise Time 215 ns
)
Delay Time 280 ns
Fall Time 390 ns
Turn-off Switching Loss 870
Total Switching Loss 920
=480V,IC=7A,
cc
R
=10Ω ,VGE=15V
G
V
=480V,IC=7A,
cc
R
=10Ω ,VGE=15V
G
Tj = 125 °C
340 ns
610 ns
µJ
µJ
µJ
µJ
3/11
STGP7NB60M - STG D7NB60M
Output Characteristics
Transfer Characteri stics
Normalized Co llecto r-Emitter On Voltage vs Temp . Transconductance
Collector-Emitter On Voltage vs Collector Current
4/11
Gate Thresho ld vs Tempe rature
STGP7NB60M - STG D7NB60M
Normalized Breakdown Voltage vs Temperature
Gate Charge vs G ate-Emitter Voltage
Capacitance Variations
Total Switching Losses vs Gate Resistance
Total Switching Lo sses vs Temperature
Total Switching L osses vs Collector Current
5/11
STGP7NB60M - STG D7NB60M
Turn-Off SOA
Thermal Imped ance for DPAK Thermal Impedance for TO-220
6/11
STGP7NB60M - STG D7NB60M
Fig. 2: Test Circuit For Induc t ive Load Switching Fig. 1: Gate Charge test Circuit
7/11
STGP7NB60M - STG D7NB60M
TO-220 MECHANICAL DATA
DIM.
A 4.40 4.60 0.173 0.181
b 0.61 0.88 0.024 0.034
b1 1.15 1.70 0.045 0.066
c 0.49 0.70 0.019 0.027
D 15.25 15.75 0.60 0.620
E 10 10.40 0.393 0.409
e 2.40 2.70 0.094 0.106
e1 4.95 5.15 0.194 0.202
F 1.23 1.32 0.048 0.052
H1 6.20 6.60 0.244 0.256
J1 2.40 2.72 0.094 0.107
L 13 14 0.511 0.551
L1 3.50 3.93 0.137 0.154
L20 16.40 0.645
L30 28.90 1.137
øP 3.75 3.85 0.147 0.151
Q 2.65 2.95 0.104 0.116
MIN. TYP MAX. MIN. TYP. MAX.
mm. inch
8/11
STGP7NB60M - STG D7NB60M
TO-252 (DPAK) MECHANICAL DATA
DIM.
A 2.20 2.40 0.087 0.094
A1 0.90 1.10 0.035 0.043
A2 0.03 0.23 0.001 0.009
B 0.64 0.90 0.025 0.035
B2 5.20 5.40 0.204 0.213
C 0.45 0.60 0.018 0.024
C2 0.48 0.60 0.019 0.024
D 6.00 6.20 0.236 0.244
E 6.40 6.60 0.252 0.260
G 4.40 4.60 0.173 0.181
H 9.35 10.10 0.368 0.398
L2 0.8 0.031
L4 0.60 1.00 0.024 0.039
V2 0
MIN. TYP. MAX. MIN. TYP. MAX.
o
mm inch
o
8
o
0
o
0
9/11
STGP7NB60M - STG D7NB60M
DPAK FOOTPRINT
All dimensions are in m illimeters
TAPE AND REEL SHIPMENT (suffix ”T4”)*
TUBE SHIPMENT (no suffix)*
All dimensions
are in millimeters
REEL MECHANICAL DATA
DIM.
A 330 12.992
B 1.5 0.059
C 12.8 13.2 0.504 0.520
D 20.2 0.795
G 16.4 18.4 0.645 0.724
N 50 1.968
T 22.4 0.881
mm inch
MIN. MAX. MIN. MAX.
TAPE MECHANICAL DATA
DIM.
A0 6. 8 7 0.267 0.275
B0 10.4 10.6 0.409 0.417
B1 12.1 0.476
D 1.5 1.6 0.059 0.063
D1 1.5 0.059
E 1.65 1.85 0.065 0.073
F 7. 4 7.6 0.291 0.299
K0 2.55 2.75 0.100 0.108
P0 3. 9 4.1 0.153 0.161
P1 7.9 8.1 0.311 0.319
P2 1. 9 2.1 0.075 0.082
R 40 1.574
W 15.7 16.3 0.618 0.641
* on sales ty pe
10/11
mm inch
MIN. MAX. MIN. MAX.
BASE QTY BULK QTY
2500 2500
STGP7NB60M - STG D7NB60M
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the
consequences of u se of such inf ormat ion nor for any in fring ement of p aten ts or othe r ri ghts of th ird p arties whic h may resul t f rom
its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications
mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information
previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or
systems without express written approval of STMicroelectronics.
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11/11