The STA369BWS is an integrated solution of digital audio processing, digital amplifier
controls and power output stage to create a high-power single-chip FFX digital amplifier with
high-quality and high-efficiency. Three channels of FFX processing are provided. The FFX
processor implements the ternary, binary and binary differential processing capabilities of
the full FFX processor.
The STA369BWS is part of the Sound Terminal™ family that provides full digital audio
streaming to the speakers and offers cost effectiveness, low power dissipation and sound
enrichment.
The power section consists of four independent half-bridges. These can be configured via
digital control to operate in different modes.
For example, 2.1 channels can be provided by two half-bridges and a single full-bridge,
supplying up to 2 x 9 W + 1 x 20 W of output power or two channels can be provided by two
full-bridges, supplying up to 2 x 20 W of output power.
The IC can also be configured as 2.1 channels with 2 x 20 W supplied by the device plus a
drive for an external FFX power amplifier, such as STA533WF or STA515W.
Also provided in the STA369BWS are a full assortment of digital processing features. This
includes up to 8 programmable biquads (EQ) per channel. Special digital signal processing
techniques are available to manage low-frequency quantization noise in filters with very low
cut-off frequencies. The coefficient range -4 to +4 allows easy high-shelf filter usage and
better sound shaping. Available presets enable a time-to-market advantage by substantially
reducing the amount of software development needed for functions such as audio preset
volume loudness, preset volume curves and preset EQ settings. There are also new
advanced AM radio interference reduction modes. Dual-band DRC dynamically equalizes
the system to provide linear frequency speaker response regardless of output power level.
This feature separates the audio frequency band into two sub-bands independently
processed to provide better sound clarity and to avoid speaker saturation.
The serial audio data input interface accepts all possible formats, including the popular I
format. The high-quality conversion from PCM audio to FFX PWM switching provides over
100 dB of SNR and of dynamic range.
2
S
The new F3X™ modulation is capable of digitally filtering the PWM carrier to simplify
external filtering requirements, AM interference and EMI. F3X™ is implemented in the
auxiliary output of STA369BWS and it is specifically designed for application where a simple
op-amp can be used to drive an auxiliary headphone line.
Doc ID 16861 Rev 49/89
DescriptionSTA369BWS
Figure 1.Block diagram
I2S
interface
Volume
control
PLL
FFX
I2C
Power
control
Protection
current/thermal
Logic
Regulators
Bias
Channel
1A
Channel
1B
Channel
2A
Channel
2B
PowerDigital DSP
10/89Doc ID 16861 Rev 4
STA369BWSPin connections
2 Pin connections
2.1 Connection diagram
Figure 2.Pin connection PowerSSO-36 (top view)
GND_SUB
SA
TEST_MODE
VSS
VCC_REG
OUT2B
GND2
VCC2
OUT2A
OUT1B
VCC1
GND1
OUT1A
GND_REG
VDD
CONFIG
OUT3B / FFX3B
OUT3A / FFX3A
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
EP, exposed pad
(device ground)
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
20
19
D05AU1638
VDD_DIG
GND_DIG
SCL
SDA
INT_LINE
RESET
SDI
LRCKI
BICKI
XTI
GND_PLL
FILTER_PLL
VDD_PLL
PWRDN
GND_DIG
VDD_DIG
TWARN / OUT4A
EAPD / OUT4B
2.2 Pin description
Table 2.Pin description
PinTypeNameDescription
1GNDGND_SUBSubstrate ground
2I SAI
3ITEST_MODEThis pin must be connected to ground (pull-down)
4I/OVSSInternal reference at V
5I/OVCC_REGInternal V
6OOUT2BOutput half-bridge channel 2B
7GNDGND2Power negative supply
8PowerVCC2Power positive supply
9OOUT2AOutput half-bridge channel 2A
10OOUT1BOutput half-bridge channel 1B
2
C select address (pull-down)
- 3.3 V
CC
reference
CC
Doc ID 16861 Rev 411/89
Pin connectionsSTA369BWS
Table 2.Pin description (continued)
PinTypeNameDescription
11PowerVCC1Power positive supply
12GNDGND1Power negative supply
13OOUT1AOutput half-bridge channel 1A
14GNDGND_REGInternal ground reference
15PowerVDDInternal 3.3 V reference voltage
16ICONFIGParallel mode command
17OOUT3B / FFX3BPWM out channel 3B / external bridge driver
18OOUT3A / FFX3APWM out channel 3A / external bridge driver
19OEAPD / OUT4BPower down for external bridge / PWM out channel 4B
20I/OTWARN / OUT4A
21PowerVDD_DIGDigital supply voltage
22GNDGND_DIGDigital ground
23IPWRDNPower down (pull-up)
24PowerVDD_PLLPositive supply for PLL
Thermal warning from external bridge (pull-up when input)
/ PWM out channel 4A
25IFILTER_PLLConnection to PLL filter
26GNDGND_PLLNegative supply for PLL
27IXTIPLL input clock
2
28IBICKII
29ILRCKII
30ISDII
S serial clock
2
S left/right clock
2
S serial data channels 1 and 2
31IRESETReset (pull-up)
32OINT_LINEFault interrupt
2
33I/OSDAI
34ISCLI
C serial data
2
C serial clock
35GNDGND_DIGDigital ground
36PowerVDD_DIGDigital supply voltage
--EP Exposed pad for PCB heatsink, to be connected to GND
12/89Doc ID 16861 Rev 4
STA369BWSElectrical specifications
3 Electrical specifications
3.1 Absolute maximum ratings
Table 3.Absolute maximum ratings
Symbol Parameter MinTypMaxUnit
V
CC
V
DD
V
DD
T
Operating junction temperature -20-150 °C
op
Storage temperature -40 -150 °C
T
stg
Power supply voltage (pins VCCx) -0.3-24 V
Digital supply voltage (pins VDD_DIG)-0.3 -4.0V
PLL supply voltage (pin VDD_PLL)-0.3-4.0V
Warning:Stresses beyond those listed in Table 3 above may cause
permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any
other conditions beyond those indicated under
“Recommended operating conditions” are not implied.
Exposure to absolute-maximum-rated conditions for
extended periods may affect device reliability. In the real
application, power supplies with nominal values rated within
the recommended operating conditions, may experience
some rising beyond the maximum operating conditions for a
short time when no or very low current is sinked (amplifier in
mute state). In this case the reliability of the device is
guaranteed, provided that the absolute maximum ratings are
not exceeded.
3.2 Thermal data
Table 4.Thermal data
R
th j-case
T
th-sdj
T
th-w
T
th-sdh
R
th j-amb
1. See Chapter 8: Package thermal characteristics on page 85 for details.
3.4 Electrical specifications for the digital section
Table 6.Electrical specifications - digital section (T
Symbol Parameter ConditionsMinTypMaxUnit
I
il
I
ih
V
il
V
ih
V
ol
V
oh
R
pu
Low level input current without
pull-up/down device
High level input current without
pull-up/down device
Low level input voltage---
High level input voltage-
Low level output voltageIol = 2 mA-
High level output voltageIoh = 2 mA
Equivalent pull-up/down
resistance
Vi = 0 V --1 µA
Vi = VDD_DIG
= 3.6 V
--50-kΩ
= 25 °C)
amb
--1µA
0.8 *
VDD_DIG
0.8 *
VDD_DIG
--V
--V
0.2 *
VDD_DIG
0.4 *
VDD_DIG
V
V
14/89Doc ID 16861 Rev 4
STA369BWSElectrical specifications
3.5 Electrical specifications for the power section
The specifications given in this section are valid for the operating conditions: VCC=18V,
f=1kHz, f
Table 7.Electrical specifications - power section
SymbolParameter ConditionsMin Typ Max Unit
= 384 kHz, T
sw
= 25 °C and RL = 8 Ω, unless otherwise specified.
amb
Output power BTL
W
THD = 10%-20-
Po
THD = 1%-16-
Output power SE
R
dsON
Power P-channel or N-channel MOSFETld = 0.75 A --250 mΩ
gPPower P-channel RdsON matchingl
gNPower N-channel RdsON matchingl
IdssPower P-channel/N-channel leakageV
t
r
t
f
Rise time
Fall time --10 ns
THD = 1%,R
THD = 10%,R
= 0.75 A-100-%
d
= 0.75 A-100-%
d
= 20 V--1µA
CC
Resistive load,
see Figure 3 below
= 4 Ω-7-
L
= 4 Ω -9-
L
--10 ns
W
Supply current from VCC in power down PWRDN = 0 -0.3-µA
I
VCC
I
VDD
I
LIM
I
SCP
V
t
min
UVP
Supply current from V
Supply current FFX processing
Overcurrent limit
in operation PWRDN = 1-15-mA
CC
Internal clock =
49.152 MHz
(1)
-55-mA
2.23.0-A
Short -circuit protectionRL = 0 Ω2.7 3.6 -A
Undervoltage protection ---4.3 V
Output minimum pulse width No load 20 40 60 ns
DRDynamic range--100-dB
Signal to noise ratio, ternary modeA-Weighted-100-dB
SNR
Signal to noise ratio binary mode--90-dB
FFX stereo mode,
THD+NTotal harmonic distortion + noise
Po = 1 W
-0.2-%
f=1kHz
FFX stereo mode,
<5 kHz
X
TA LK
Crosstalk
One channel driven
-80-dB
at 1 W, other channel
measured
Peak efficiency, FFX mode
η
Peak efficiency, binary modes
Po = 2 x 2 0 W
into 8 Ω
Po = 2 x 9 W into 4 Ω
+ 1 x 20 W into 8 Ω
-90-
%
-87-
1. Limit the current if overcurrent warning detect adjustment bypass is enabled (register bit CONFC.OCRB on
page 32). When disabled refer to I
SCP
.
Doc ID 16861 Rev 415/89
Electrical specificationsSTA369BWS
Figure 3.Test circuit
Low current dead time = MAX(DTr, DTf)
Duty cycle = 50%
INxY
gnd
+Vcc
OUTxY
OUTxY
DTrDTf
Rload = 8
Ω
vdc = Vcc/2
+
-
Vcc
(3/4)Vcc
(1/2)Vcc
(1/4)Vcc
t
16/89Doc ID 16861 Rev 4
STA369BWSElectrical specifications
3.6 Power on/off sequence
Figure 4.Power-on sequence
VCC
VCC
VCC
VCC
VCC
VDD_Dig
VDD_Dig
VDD_Dig
VDD_Dig
VDD_Dig
XTI
XTI
XTI
XTI
XTI
Reset
Reset
Reset
Reset
Reset
2
2
2
2
2
C
C
C
C
C
I
I
I
I
I
PWDN
PWDN
PWDN
PWDN
PWDN
Note: no specific VCC and
VDD_DIG turn
is required
Don’t care
Don’t care
Don’t care
Don’t care
Don’t care
Don’t care
Don’t care
−
on sequence
TR
TR
TR
TR
TR
Don’t care
Don’t care
Don’t care
Don’t care
Don’t care
TC
TC
TC
TC
TC
CMD0CMD1CMD2
CMD0CMD1CMD2
CMD0CMD1CMD2
CMD0CMD1CMD2
CMD0CMD1CMD2
TR = minimum time between XTI master clock stable and Reset removal: 1 ms
TC = minimum time between Reset removal and I
Note:The definition of a stable clock is when f
Section : Serial data interface on page 28 gives information on setting up the I
Figure 5.Power-off sequence for pop-free turn-off
VCC
VCC
VDD_Dig
VDD_Dig
XTI
XTI
Soft Mute
Soft Mute
Reg. 0x07
Reg. 0x07
Data 0xFE
Data 0xFE
Soft EAPD
Soft EAPD
Reg. 0x05
Reg. 0x05
Bit 7 = 0
Bit 7 = 0
Don’t care
Don’t care
2
C program, sequence start: 1ms
- f
max
< 1 MHz.
min
FE
FE
2
S interface.
Note: no specific VCC and
VDD_DIG turn
is required
Don’t care
Don’t care
Don’t care
Don’t care
−
off sequence
Don’t care
Don’t care
Don’t care
Don’t care
Doc ID 16861 Rev 417/89
Processing data pathsSTA369BWS
4 Processing data paths
Figure 6 and Figure 7 below show the data processing paths inside STA369BWS. The
whole processing chain is composed of two consecutive sections. In the first one,
dual-channel processing is implemented and in the second section each channel is fed into
the post-mixing block either to generate a third channel (typically used in 2.1 output
configuration and with crossover filters enabled) or to have the channels processed by the
dual-band DRC block (2.0 output configuration with crossover filters used to define the
cut-off frequency of the two bands).
The first section, Figure 6, begins with a 2x oversampling FIR filter providing 2 * f
audio
S
processing. Then a selectable high-pass filter removes the DC level (enabled if HPB = 0).
The left and right channel processing paths can include up to 8 filters, depending on the
selected configuration (bits BQL, BQ5, BQ6, BQ7 and XO[3:0]). By default, four user
programmable, independent filters per channel are enabled, plus the preconfigured
de-emphasis, bass and treble controls (BQL = 0, BQ5 = 0, BQ6 = 0, BQ7 = 0).
If the coefficient sets for the two channels are linked (BQL = 1) it is possible to use the
de-emphasis, bass and treble filters in a user defined configuration (provided the relevant
BQx bits are set). In this case both channels use the same processing coefficients and can
have up to seven filters each. If BQL = 0 the BQx bits are ignored and the fifth, sixth and
seventh filters are configured as de-emphasis, bass and treble controls, respectively.
Figure 6.Left and right processing, section 1
Sampling
Sampling
Sampling
Sampling
frequency=Fs
frequency=Fs
frequency=Fs
frequency=Fs
From
From
From
From
I2S input
I2S input
I2S input
I2S input
interface
interface
interface
interface
sampling
sampling
sampling
sampling
x2
x2
FIR
FIR
x2
x2
over
over
FIR
FIRover
over
x2
x2
FIR
FIR
x2
x2
over
over
FIR
FIRover
over
Sampling
Sampling
Sampling
Sampling
frequency=2xFs
frequency=2xFs
frequency=2xFs
frequency=2xFs
Hi-Pass
Hi-Pass
Hi-Pass
Hi-Pass
Hi-Pass
Hi-Pass
PreScale
PreScale
PreScale
PreScale
If HPB=0
If HPB=0
Hi-Pass
Hi-Pass
Hi-Pass
Hi-Pass
PreScale
PreScale
PreScale
PreScale
Filter
Filter
Filter
Filter
Filter
Filter
Filter
Filter
Filter
Filter
Biquad#1Biquad#2Biquad#3Biquad
Biquad#1Biquad#2Biquad#3Biquad
Biquad#1Biquad#2Biquad#3Biquad
Biquad#1Biquad#2Biquad#3Biquad
User Defined Filters
User Defined Filters
If DSPB=0 and C1EQBP=0
If DSPB=0 and C1EQBP=0
Biquad#1Biquad#2Biquad#3Biquad
Biquad#1Biquad#2Biquad#3Biquad
Biquad#1Biquad#2Biquad#3Biquad
Biquad#1Biquad#2Biquad#3Biquad
#4
#4
#4
#4
#4
#4
#4
#4
If BQ5=1
If BQ5=1
and BQL=1
and BQL=1
Biquad
Biquad
#5
#5
De-Emph.
De-Emph.
If DEMP=0
If DEMP=0
If BQ5=1
If BQ5=1
and BQL=1
and BQL=1
Biquad
Biquad
#5
#5
De-Emph.
De-Emph.
IF BQ7=1
IF BQ7=1
If BQ6=1
If BQ6=1
and BQL=1
and BQL=1
and BQL=1
and BQL=1
If C1TCB=0
If C1TCB=0
BTC: Bass Boost/Cut
BTC: Bass Boost/Cut
TTC: Treble Boost/Cut
TTC: Treble Boost/Cut
If BQ6=1
If BQ6=1
and BQL=1
and BQL=1
Biquad
Biquad
Biquad
Biquad
#6
#6
BassTreble
BassTreble
IF BQ7=1
IF BQ7=1
and BQL=1
and BQL=1
Biquad
Biquad
Biquad
Biquad
#6
#6
BassTreble
BassTreble
#7
#7
#7
#7
L
L
L
L
L
R
L
R
If HPB=0
If HPB=0
User Defined Filters
User Defined Filters
If DSPB=0 and C2EQBP=0
If DSPB=0 and C2EQBP=0
Moreover, the common 8th filter can be available on both channels provided the predefined
crossover frequencies are not used, XO[3:0] = 0, and the dual-band DRC is not used.
In the second section, Figure 7, mixing and crossover filters are available. If B
enabled they are fully user-programmable and allow the generation of a third channel
(2.1 outputs). Alternatively, in mode B
2
DRC, these blocks are used to split the sub-band and
define the cut-off frequencies of the two bands. A prescaler and a final postscaler allow full
control over the signal dynamics before and after the filtering stages. A mixer function is also
available.
18/89Doc ID 16861 Rev 4
If DEMP=0
If DEMP=0
If C2TCB=0
If C2TCB=0
BTC: Bass Boost/Cut
BTC: Bass Boost/Cut
TTC: Treble Boost/Cut
TTC: Treble Boost/Cut
2
DRC is not
STA369BWSProcessing data paths
In all the available configurations high-pass filtering with a 2-Hz cut-off frequency is applied
before the postscale block. This filter cannot be disabled.
Figure 7.Left and right processing, section 2
Dual-band DRC enabled
CH3
CH3
Volume
Volume
C1Mx1
C1Mx1=
C1Mx1
C1Mx1=
0x7fffff
L
L
L
L
R
R
R
R
0x7fffff
C1Mx2
C1Mx2=
C1Mx2
C1Mx2=
0x00000
0x00000
C2Mx1
C2Mx1=
C2Mx1
C2Mx1=
0x000000
0x000000
C2Mx2
C2Mx2=
C2Mx2
C2Mx2=
0x7fffff
0x7fffff
C3Mx1
C3Mx1=
C3Mx1
C3Mx1=
0x40000
0x40000
C3Mx2
C3Mx2=
C3Mx2
C3Mx2=
0x400000
0x400000
Hi-Pass XO
Hi-Pass XO
B2DRC
B2DRC
Filter
+
+
+
+
+
+
+
+
+
+
+
+
Filter
Hi-pass
Hi-pass
filter
filter
Hi-Pass XO
Hi-Pass XO
B2DRC
B2DRC
Filter
Filter
Hi-pass
Hi-pass
filter
filter
-
-++
+
-
-++
+
CH1
CH1
Volume
Volume
CH2
CH2
Volume
Volume
CH3
CH3
Volume
Volume
DRC2
DRC2
DRC1
DRC1
Limiter
Limiter
DRC1
DRC1
DRC2
DRC2
Vol
VolAnd
And
+
+
+
+
Post scale
Post scale
DC cut
DC cut
filter
filter
Post scale
Post scale
DC cut
DC cut
filter
filter
Post scale
Post scalePost scale
Post scale
Post scale
Post scale
Post scale
Post scale
User-Defined Mix Coefficients
User-Defined Mix Coefficients
User-Defined Mix Coefficients
User-Defined Mix Coefficients
Dual-band DRC disabled
L
L
L
L
R
R
R
R
User-Defined Mix Coefficie nts
User-Defined Mix Coefficie nts
User-Defined Mix Coefficie nts
User-Defined Mix Coefficie nts
Crossover Frequency determined by XO Setting
Crossover Frequency determined by XO Setting
User Defined If XO =0000
User Defined If XO =0000
User Defined If XO =0000
User Defined If XO =0000
C1Mx1
C1Mx1
C1Mx1
C1Mx1
+
+
+
+
C1Mx2
C1Mx2
C1Mx2
C1Mx2
C2Mx1
C2Mx1
C2Mx1
C2Mx1
+
+
+
+
C2Mx2
C2Mx2
C2Mx2
C2Mx2
C3Mx1
C3Mx1
C3Mx1
C3Mx1
+
+
+
+
C3Mx2
C3Mx2
C3Mx2
C3Mx2
Channel ½
Channel ½
Hi-Pass XO
Hi-Pass XO
#8
Biquad #5
Biquad #5
Filter
Filter
--------------
--------------
Hi-pass XO
Hi-pass XO
filter
filter
Channel ½
Channel ½
Hi-Pass XO
Hi-Pass XO
#8
Biquad #5
Biquad #5
Filter
Filter
--------------
--------------
Hi-pass XO
Hi-pass XO
filter
filter
Channel 3
Channel 3
Lo-Pass XO
Lo-Pass XO
Biquad
Biquad
Filter
Filter
--------------
--------------
Low-pass XO
Low-pass XO
filter
filter
Crossover Frequency determined by XO Setting
Crossover Frequency determined by XO Setting
User Defined If XO=0000
User Defined If XO=0000
User Defined If XO=0000
User Defined If XO=0000
Vol
Vol
Vol
Vol
And
And
And
And
Limiter
Limiter
Limiter
Limiter
Vol
Vol
Vol
Vol
Vol
Vol
Vol
Vol
And
And
And
And
And
And
And
And
Limiter
Limiter
Limiter
Limiter
Limiter
Limiter
Limiter
Limiter
Vol
Vol
Vol
Vol
And
And
And
And
Limiter
Limiter
Limiter
Limiter
B2DRC Enabled
B2DRC Enabled
DC cutt
DC cutt
Post scale
Post scale
filter
filter
DC cutt
DC cutt
Post scale
Post scale
filter
filter
DC cutt
DC cutt
Post scale
Post scale
filter
filter
Post scale
Post scale
Post scale
Post scale
Post scale
Post scale
Post scale
Post scale
Post scale
Post scale
Post scale
Post scale
B2DRC Disabled
B2DRC Disabled
Doc ID 16861 Rev 419/89
I2C bus specificationSTA369BWS
5 I2C bus specification
The STA369BWS supports the I2C protocol via the input ports SCL and SDA_IN (master to
slave) and the output port SDA_OUT (slave to master). This protocol defines any device that
sends data on to the bus as a transmitter and any device that reads the data as a receiver.
The device that controls the data transfer is known as the master and the other as the slave.
The master always starts the transfer and provides the serial clock for synchronization. The
STA369BWS is always a slave device in all of its communications. It supports up to 400 kb/s
(fast-mode bit rate).
For correct operation of the I
has a frequency at least 10 times higher than the frequency of the applied SCL clock.
5.1 Communication protocol
5.1.1 Data transition or change
Data changes on the SDA line must only occur when the clock SCL is low. A SDA transition
while the clock is high is used to identify a START or STOP condition.
2
C interface ensure that the master clock generated by the PLL
5.1.2 Start condition
START is identified by a high to low transition of the data bus, SDA, while the clock, SCL, is
stable in the high state. A START condition must precede any command for data transfer.
5.1.3 Stop condition
STOP is identified by low to high transition of SDA while SCL is stable in the high state. A
STOP condition terminates communication between STA369BWS and the bus master.
5.1.4 Data input
During the data input the STA369BWS samples the SDA signal on the rising edge of SCL.
For correct device operation the SDA signal must be stable during the rising edge of the
clock and the data can change only when the SCL line is low.
5.2 Device addressing
To start communication between the master and the STA369BWS, the master must initiate
with a start condition. Following this, the master sends onto the SDA line 8-bits (MSB first)
corresponding to the device select address and read or write mode bit.
The seven most significant bits are the device address identifiers, corresponding to the I
bus definition. In the STA369BWS the I
the SA pin configuration, 0x38 when SA = 0, and 0x3A when SA = 1.
2
2
C interface has two device addresses depending on
C
The eighth bit (LSB) identifies a read or write operation (R/W); this is set to 1 for read and to
0 for write. After a START condition the STA369BWS identifies the device address on the
SDA bus and if a match is found, acknowledges the identification during the 9th bit time
frame. The byte following the device identification is the address of a device register.
20/89Doc ID 16861 Rev 4
STA369BWSI2C bus specification
5.3 Write operation
Following the START condition the master sends a device select code with the RW bit set
to 0. The STA369BWS acknowledges this and then waits for the byte of internal address.
After receiving the internal byte address the STA369BWS again responds with an
acknowledgement.
5.3.1 Byte write
In the byte write mode the master sends one data byte, this is acknowledged by the
STA369BWS. The master then terminates the transfer by generating a STOP condition.
5.3.2 Multi-byte write
The multi-byte write modes can start from any internal address. The master generating a
STOP condition terminates the transfer.
Figure 8.Write mode sequence
BYTE
BYTE
WRITE
WRITE
MULTIBYTE
MULTIBYTE
WRITE
WRITE
START
START
START
START
DEV-ADDR
DEV-ADDR
DEV-ADDR
DEV-ADDR
ACK
ACK
SUB-ADDR
SUB-ADDR
RW
RW
ACK
ACK
SUB-ADDR
SUB-ADDR
RW
RW
ACK
ACK
ACK
ACK
DATA IN
DATA IN
DATA IN
DATA IN
ACK
ACK
ACK
ACK
STOP
STOP
DATA IN
DATA IN
ACK
ACK
STOP
STOP
5.4 Read operation
5.4.1 Current address byte read
Following the START condition the master sends a device select code with the RW bit set
to 1. The STA369BWS acknowledges this and then responds by sending one byte of data.
The master then terminates the transfer by generating a STOP condition.
5.4.2 Current address multi-byte read
The multi-byte read modes can start from any internal address. Sequential data bytes are
read from sequential addresses within the STA369BWS. The master acknowledges each
data byte read and then generates a STOP condition terminating the transfer.
5.4.3 Random address byte read
Following the START condition the master sends a device select code with the RW bit set
to 0. The STA369BWS acknowledges this and then the master writes the internal address
byte. After receiving, the internal byte address the STA369BWS again responds with an
acknowledgement. The master then initiates another START condition and sends the device
select code with the RW bit set to 1. The STA369BWS acknowledges this and then
responds by sending one byte of data. The master then terminates the transfer by
generating a STOP condition.
Doc ID 16861 Rev 421/89
I2C bus specificationSTA369BWS
5.4.4 Random address multi-byte read
The multi-byte read modes could start from any internal address. Sequential data bytes are
read from sequential addresses within the STA369BWS. The master acknowledges each
data byte read and then generates a STOP condition terminating the transfer.
Figure 9.Read mode sequence
CURRENT
CURRENT
ADDRESS
ADDRESS
READ
READ
RANDOM
RANDOM
ADDRESS
ADDRESS
READ
READ
SEQUENTIAL
SEQUENTIAL
CURRENT
CURRENT
READ
READ
SEQUENTIAL
SEQUENTIAL
RANDOM
RANDOM
READ
READ
START
START
START
START
START
START
START
START
DEV-ADDR
DEV-ADDR
DEV-ADDR
DEV-ADDR
DEV-ADDR
DEV-ADDR
DEV-ADDR
DEV-ADDR
RW=
RW=
HIGH
HIGH
ACK
ACK
RW
RW
ACK
ACK
RW
RW
ACK
ACK
ACK
ACK
RW
RW
DATA
DATA
SUB-ADDR
SUB-ADDR
DATA
DATA
SUB-ADDR
SUB-ADDR
NO ACK
NO ACK
STOP
STOP
ACK
ACK
ACK
ACK
ACK
ACK
DEV-ADDR
DEV-ADDR
STARTRW
STARTRW
DATA
DATA
DEV-ADDR
DEV-ADDR
STARTRW
STARTRW
ACK
ACK
ACK
ACK
ACK
ACK
DATA
DATA
DATA
DATA
DATA
DATA
NO ACK
NO ACK
NO ACK
NO ACK
ACK
ACK
STOP
STOP
STOP
STOP
DATA
DATA
ACKNO ACK
ACKNO ACK
DATA
DATA
STOP
STOP
22/89Doc ID 16861 Rev 4
STA369BWSRegister description
6 Register description
Note:Addresses exceeding the maximum address number must not be written.
Selects the ratio between the input I
frequency and the input clock.
2
S sample
2R/W0 MCS2
The STA369BWS supports sample rates of 32 kHz, 44.1 kHz, 48 kHz, 88.2 kHz, 96 kHz,
176.4 kHz, and 192 kHz. Therefore the internal clock is:
z32.768 MHz for 32 kHz
z45.1584 MHz for 44.1 kHz, 88.2 kHz, and 176.4 kHz
z49.152 MHz for 48 kHz, 96 kHz, and 192 kHz
The external clock frequency provided to the XTI pin must be a multiple of the input sample
frequency (f
).
s
The relationship between the input clock and the input sample rate is determined by both
the MCSx and the IR (input rate) register bits. The MCSx bits determine the PLL factor
generating the internal clock and the IR bit determines the oversampling ratio used
internally.
Selects internal interpolation ratio based on input I
sample frequency
2
S
STA369BWSRegister description
The STA369BWS has variable interpolation (oversampling) settings such that internal
processing and FFX output rates remain consistent. The first processing block interpolates
by either 2-times or 1-time (pass-through) or provides a 2-times downsample. The
oversampling ratio of this interpolation is determined by the IR bits.
Table 12.IR bit settings as a function of input sample rate
Input sample rate fs (kHz)IR1st stage interpolation ratio
This bit sets the behavior of the IC after a thermal warning disappears. If TWRB is enabled
the device automatically restores the normal gain and output limiting is no longer active. If it
is disabled the device keeps the output limit active until a reset is asserted or until TWRB set
to 0. This bit works in conjunction with TWAB
Thermal warning adjustment bypass
Table 14.Thermal warning adjustment bypass
BitR/WRSTNameDescription
6R/W1 TWAB
Bit TWAB enables automatic output limiting when a power stage thermal warning condition
persists for longer than 400ms. When the feature is active (TWAB = 0) the desired output
limiting, set through bit TWOCL (-3 dB by default) at address 0x37 in the RAM coefficients
bank, is applied. The way the limiting acts after the warning condition disappears is
controlled by bit TWRB.