Datasheet STA260 Datasheet (ST)

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Sirius SDARS channel, service & source decoder

Features

■ 2 Satellite and 1 terrestrial signal demodulators

and decoders

■ Advanced DSP processor to implement PAC

audio decoder

■ Requires a single 17MHz clock reference; all

high-speed clock signals are derived using on-chip PLL

■ Programmable I

audio sample rate (32K/48K Sample rates use internal clocks, 44.1K Sample rate uses external clock)

■ I

C master interface to control tuner and audio

DAC

■ External control through UART interface using

Sirius Standard Protocol (SSP) over RS-232

Analog to digital converters

■ Three internal 10 BIT A/D converters for

76.5MHZ if signals conversion

Low power technology

■ 1.2V, 90 µm technology

■ 2.5V capable I/OS

Table 1. Device summary

Part Number

S to support 32K/48K/44.1K

(1)

Package Packing

STA260

Data Brief

LFBGA289 VFBGA244

(15x15x1.4mm) (8x8x1.0mm)

Description

STA260 is a fully integrated 3rd generation Baseband signal processor for Sirius Satellite Digital Audio Radio Service (SDARS). It is implemented using ST Micro's advanced 90 µm CMOS090 technology.

It allows a highly efficient implementation of a Sirius “SDARS Satellite Digital Audio Radio Service” receiver when used with its companion STA210 tuner ASIC.

STA260 is packaged in a Low profile Fine pitch Ball Grid Array (LFBGA 15x15) and in Very thin Fine pitch Ball Grid Array (VFBGA 8x8).

STA260 LFBGA289 Tray

STA260TR LFBGA289 Tape & reel

STA260-8x8 VFBGA244 Tray

1. This device is Pb-Free ECOPACK® see Chapter 3: Package information.

June 2007 Rev 1 1/7

For further information contact your local STMicroelectronics sales office.

www.st.com

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Application block diagram STA260

1 Application block diagram

Figure 1. Application block diagram

FLASH

1M x 16

STA210N

Tuner FE

I2C

IFAGC

STA260

Baseband

Processor

SDRAM

8Mbx8 or 16Mx8

Audio/I2S

Data

AC00244

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STA260 Electrical specifications

2 Electrical specifications

2.1 Absolute maximum ratings

Table 2. Absolute maximum ratings

Symbol Parameter Value Unit

DDIO

D_VDD

D_VDD2

PLL_VDD

stg

1.2V Power supply Voltage 1.32 V

2.5V Power Supply Voltage 2.75 V

1.2V Power supply Voltage 1.32 V

2.5V Power Supply Voltage 2.75 V

Voltage on input pin -0.5 to (V

Voltage on output pin -0.5 to (V

Storage Temperature -55 to +150 °C

Operative Ambient Temperature -40 to +85 °C

Operative Junction Temperature -40 to +125 °C

2.2 Thermal data

Table 3. Thermal data

Symbol Parameter LFBGA VFBGA Unit

th j-amb

1. According to JEDEC specification on a 4 layers board

Thermal resistance Junction to ambient

(1)

+ 0.5) V

DDIO

+ 0.5) V

DDIO

35 50 °C/W

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Package information STA260

3 Package information

In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect. The category of second Level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label.

ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.

Figure 2. LFBGA (15x15x1.4mm 289 ball) mechanical data & package dimensions

DIM.

A 1.400 0.0551

A1 0.210 0.0083

A2 0.985 0.0387

A3 0.200 0.0078

A4 0.800 0.0315

b 0.350 0.400 0.450 0.0138 0.0157 0.0177

D 14.850 15.000 15.150 0.5846 0.5906 0.5965

D1 12.800 0.5039

E 14.850 15.000 15.150 0.5846 0.5906 0.5965

E1 12.800 0.5039

e 0.800 0.0315

F 1.100 0.0433

ddd 0.120 0.0047

eee 0.150 0.0059

fff 0.080 0.0031

mm inch

MIN. TYP. MAX. MIN. TYP. MAX.

OUTLINE AND

MECHANICAL DATA

Body: 15 x 15 x 1.4mm

LFBGA289

Low profile Fine Pitch Ball Grid Array

4/7

7963045 C

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STA260 Package information

Figure 3. VFBGA (8x8x1.0mm 180+64 ball) mechanical data & package dimensions

DIM.

A 1.000 0.0394

A1 0.130 0.170 0.210 0.0051 0.0067 0.0083

A2 0.620 0.0244

A3 0.180 0.0071

A4 0.450 0.0177

b 0.220 0.260 0.300 0.0087 0.0102 0.0118

D 7.950 8.000 8.050 0.3130 0.3150 0.3169

D1 6.800 0.2677

E 7.950 8.000 8.050 0.3130 0.3150 0.3169

E1 6.800 0.2677

e 0.400 0.0157

F 0.600 0.0236

ddd 0.080 0.0031

eee 0.130 0.0051

fff 0.040 0.0016

mm inch

MIN. TYP. MAX. MIN. TYP. MAX.

OUTLINE AND

MECHANICAL DATA

Body: 8 x 8 x 1.0mm

VFBGA244

Very thin profile Fine Pitch Ball Grid Array

7520777 C

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Revision history STA260

4 Revision history

Table 4. Document revision history

Date Revision Changes

18-Jun-2007 1 Initial release.

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STA260

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