ST M28W320EBT, M28W320EBB User Manual

SUPPLY VOLTAGE
= 2.7V to 3.6V Core Power Supply
–V
DD
–V –V
ACCESS TIME: 70, 85, 90,100ns
PROGRAMMING TIME
= 1.65V to 3.6V for Input/Output
DDQ
= 12V for fast Program (optional)
PP
– 10µs typical – Double Word Programming Option – Quadruple Word Programming Option
COMMON FLASH INTERFACE
MEMORY BLOCKS
– Parameter Blocks (Top or Bottom location) – Main Blocks
BLOCK PROTECTIO N o n TWO PARAMETER
BLOCKS –WP
for Block Protection
AUTOMATIC STAND-BY MODE
PROGRAM and ERASE SUSPEND
100,000 PROGRAM/ERASE CYCLES per
BLOCK
ELECTRONIC SIGNATURE
– Manufacturer Code: 20h – Top Device Code, M28W320EBT: 88BCh – Bottom Device Code, M28W320EBB: 88BDh
M28W320EBT
M28W320EBB
32 Mbit (2Mb x16, Boot Block)
3V Supply Flash Me m ory
PRELIMINARY DATA
Figure 1. Packages
FBGA
TFBGA47 (ZB)
6.39 x 6.37mm
TSOP48 (N)
12 x 20mm
October 2002
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice.
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M28W320EBT, M28W320EBB
TABLE OF CONTENTS
SUMMARY DESCRIPTION. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Figure 2. Logic Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Table 1. Signal Names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Figure 3. TSOP Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Figure 4. TFBGA Connections (Top view through package). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Figure 5. Block Addresses. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
SIGNAL DESCRIPTIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Address Inputs (A0-A20). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Data Input/Output (DQ0-DQ15). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Chip Enable (E). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Output Enable (G). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Write Enable (W). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Write Protect (WP). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Reset (RP). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
V
Supply Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
DD
Supply Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
V
DDQ
V
Program Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
PP
V
Ground. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
SS
BUS OPERATIONS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Read.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 0
Write.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Output Disable. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Standby. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Automatic Standby. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Reset. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10
Table 2. Bus Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
COMMAND INTERFACE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Read Memory Array command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
Read Status Register Command. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
Read Electronic Signature Comma nd . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Table 3. Command Codes. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Read CFI Query Command. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1
Block Erase Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Program Command. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Double Word Program Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Clear Status Regist e r Command. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Program/Erase Suspend Comm and . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Program/Eras e Resume Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Block Protection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Table 4. Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Table 5. Read Electronic Signature. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
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M28W320EBT, M28W320EBB
Table 6. Memory Blocks Protection Truth Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15
Table 7. Program, Erase Times and Program/Erase Endurance Cycles . . . . . . . . . . . . . . . . . . . . 15
STATUS REGISTER. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Program/Erase Controller Status (Bit 7) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16
Erase Suspend Status (Bit 6) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Erase Status (Bit 5). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Program Status (Bit 4). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
V
Status (Bit 3). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
PP
Program Suspend Status (Bit 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Block Protection Status (Bit 1). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Reserved (Bit 0). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Table 8. Status Re gister Bits. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
MAXIMUM RATING. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Table 9. Absolute Maximum Ratings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18
DC and AC PARAMETERS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 9
Table 10. Operating and AC Measurement Conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Figure 6. AC Measurement I/O Waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19
Figure 7. AC Measurement Load Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Table 11. Device Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Table 12. DC Characte r i stics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Figure 8. Read AC Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Table 13. Read AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Figure 9. Write AC Waveforms, Write Enable Controlled . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Table 14. Write AC Characteristics, Write Enable Controlled . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Figure 10. Write AC Wavefo rms, Chip Enable Control led. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Table 15. Write AC Chara cte ristics, Chip Enabl e Contro lled . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Figure 11. Power-Up and Reset AC Waveforms. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Table 16. Power-Up and Res et AC Charac te r istics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
PACKAGE MECHANICAL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Figure 12. TSOP48 - 48 lead Plastic Thin Small Outline, 12 x 20mm, Package Outline . . . . . . . . 27
Table 17. TSOP48 - 48 lead Plastic Thin Small Outline, 12 x 20mm, Package Mechanical Data . 27 Figure 13. TFBGA47 6.39x6.37mm - 8x6 ball array, 0.75mm pitch, Bottom View Package Outlin e28 Table 18. TFBGA47 6.39x6.37mm - 8x6 ball array, 0.75mm pitch, Package Mecha nical Data . . . 28
Figure 14. TFBGA47 Daisy Chain - Package Connections (Top view through package) . . . . . . . . 29
Figure 15. TFBGA47 Daisy Chain - PCB Connections proposal (Top view through package). . . . 29
PART NUMBERING . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Table 19. Ordering Information Scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Table 20. Daisy Chain Orde r ing Scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
APPENDIX A. BLOCK ADDRESS TABLES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
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M28W320EBT, M28W320EBB
Table 21. Top Boot Block Addresses, M28W320EBT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Table 22. Botto m Boo t Block Addresses, M28W320E BB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
APPENDIX B. COMMON FLASH INTERFACE (CFI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Table 23. Query Stru cture Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33
Table 24. CFI Query Identification String . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33
Table 25. CFI Query System Interface Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Table 26. Device Geome try Definition. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35
Table 27. Primary Algorithm-Specific Extended Query Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Table 28. Security Code Area . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6
APPENDIX C. FLOWCHARTS AND PSEUDO CODES. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Figure 16. Program Flowchart and Pseudo Code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Figure 17. Double Word Program Flowchart and Pseudo Code . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Figure 19. Program Suspend & Resume Flowchart and Pseudo Code . . . . . . . . . . . . . . . . . . . . . 40
Figure 20. Erase Flowchart and Pseudo Code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
Figure 21. Erase Suspend & Resume Flowchart and Pseudo Code. . . . . . . . . . . . . . . . . . . . . . . . 42
APPENDIX D. COMMAND INTERFACE AND PROGRAM/ERASE CONTROLLER STATE . . . . . . . 43
Table 29. Write State Machine Current/Next. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
REVISION HISTORY. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
Table 30. Document Revision History. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .44
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SUMMARY DESCRIPTION
The M28W320EB is a 32 M bit (2 Mbit x 16) non­volatile Flash memory that can b e erased electri­cally at the block level and programmed in-system on a Word-by-Word basis. These operations can be performed using a single low voltage (2.7 to
3.6V) supply. V down to 1.65V. An optional 12V V
allows to drive the I/O pin
DDQ
power supply
PP
is provided to speed up customer programming. The device features an asymmetrical blocked ar-
chitecture. The M28W320EB has an array of 71 blocks: 8 Parameter Blocks of 4 KWord and 63 Main Blocks of 32 KWord. M28W320EBT has the Parameter Blocks at the top of the memory ad­dress space while the M28W320EBB locates the Parameter Blocks starting from the bottom. The memory maps are shown in Figure 5, Block Ad­dresses.
Parameter blocks 0 and 1 can be protected from accidental programming or erasure. Each block can be erased separately. Erase can be suspend­ed in order to perform either read or program in any other block and then resumed . Program can be suspended to read data in any other block and then resumed. Each block can be programmed and erased over 100,000 cycles.
Program and Erase command s are written to the Command Interface of the memory. An on-chip Program/Erase Controller takes care of the tim­ings necessary for program and erase operations. The end of a program or erase operation can be detected and any error conditions identified. The command set required to control the memory is consistent with JEDEC standards.
The memory is offered in TSOP48 (10 X 20mm), and TFBGA47 (6.39 x 6.37mm, 0.75mm pitch) packages and is supplied with all the bits erased (set to ’1’).
M28W320EBT, M28W320EBB
Figure 2. Logic Diagram
V
V
DDQVPP
DD
21
A0-A20
W
E G
RP
WP
Table 1. Signal Names
A0-A20 Address Inputs DQ0-DQ15 Data Input/Output E G W RP
M28W320EBT M28W320EBB
V
SS
Chip Enable Output Enable Write Enable Reset
16
DQ0-DQ15
AI05514
WP V
DD
V
DDQ
V
PP
V
SS
Write Protect Core Power Supply Power Supply for
Input/Output Optional Supply Voltage for
Fast Program & Erase Ground
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M28W320EBT, M28W320EBB
Figure 3. TSOP Con necti on s
A15 A14 A13 A12 A11
1
48
A16 V
DDQ
V
SS
DQ15 DQ7
A10 DQ14
37 36
DQ6 DQ13 DQ5 DQ12 DQ4 V
DD
DQ11 DQ3 DQ10 DQ2 DQ9 DQ1 DQ8 DQ0 G V
SS
E A0
A9 A8
NC
A20
RP
V
PP
WP A19 A18 A17
A7 A6 A5 A4 A3 A2 A1
W
12
M28W320EBT M28W320EBB
13
24 25
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AI05515
Figure 4. TFBGA Connections (Top view through package)
M28W320EBT, M28W320EBB
87654321
A
B
C
D
E
F
DDQ
SS
DQ7V
A8A11A13
DQ13
PP
RP A18
DQ11
DQ12
DQ4
WP A19
A20
DQ2
DD
A7V
A5A17WA10A14
DQ0DQ9DQ3DQ6DQ15V
DQ1DQ10V
A4
A2
A1A3A6A9A12A15
A0EDQ8DQ5DQ14A16
V
SS
G
AI03823
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M28W320EBT, M28W320EBB
Figure 5. Block Addresses
M28W320EBT
Top Boot Block Addresses
1FFFFF
1FF000
1F8FFF
1F8000
1F7FFF
1F0000
00FFFF
008000
007FFF
000000
4 KWords
4 KWords
32 KWords
32 KWords
32 KWords
Total of 8
4 KWord Blocks
Total of 63
32 KWord Blocks
M28W320EBB
Bottom Boot Block Addresses
1FFFFF
1F8000
1F7FFF
1F0000
00FFFF
008000
007FFF
007000
000FFF
000000
32 KWords
32 KWords
32 KWords
4 KWords
4 KWords
Total of 63
32 KWord Blocks
Total of 8
4 KWord Blocks
AI05516
Note: Also see Appendix A, Tables 21 and 22 f or a full listing of the Block A ddresses.
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SIGNAL DESCRIPTIONS
See Figure 2 Logic Diagram and T able 1,Signal Names, for a brief overview of the signals connect­ed to this de vice.
Address Inputs (A0-A20). The Address Inputs select the cell s in th e memory array to a ccess dur­ing Bus Read operations. During Bus Write opera­tions they control the commands sent to the Command Interface of the internal state machine.
Data Input/Output (DQ0-DQ15). The Data I/O outputs the data stored at the selected address during a Bus Read operation or inputs a command or data to be programmed during a Write Bus op­eration.
Chip Enable (E
). The Chip Enable input acti-
vates the memory control logic, input bu ffers, de­coders and sense amplifiers. When Chip Enable is
and Reset is at VIH the device is in active
at V
IL
mode. When Chi p E nable is at V
the memory is
IH
deselected, the outputs are high impedan ce and the power consumption is reduced to the stand-by level.
Output Enable (G
). The Output Enable controls
data outputs during the Bus Read operation of the memory.
Write Enable (W
). The Write Enable controls the
Bus Write operation of the memory’s Command Interface. The data and address inputs are latched on the rising edge of Chip Enable, E, or Write En­able, W
Write Protect (WP
, whichever occurs first.
). Write Protect is an input to protect or unprotect the two lockable parameter blocks. When Write Protect is at V
, the lockable
IL
blocks are protected and Program or Erase oper­ations are not possible. When Wr ite Protect is at
, the lockable blocks are unprotected and can
V
IH
be programmed or erased (refer to Table 5, Mem­ory Blocks Protect ion Truth).
Reset (RP
ware reset of the memory. W hen Reset is at V
). The Reset input provides a hard-
IL
the memory is in reset mode: the outputs are high impedance and the current consumption is mini­mized. When Reset is at V
, the device is in nor-
IH
M28W320EBT, M28W320EBB
mal operation. Exiting reset mode the device enters read array mode, but a negative trans ition of Chip Enable or a change of the address is re­quired to ensure valid data outputs.
V
Supply Voltage. VDD provides the power
DD
supply to the internal core of the memory device. It is the main power supply for all operations (Read, Program and Erase).
Su pp ly V olt ag e . V
V
DDQ
power supply to the I/O pins a nd ena bles all Out­puts to be powered independently from V can be tied to VDD or can use a separate supply.
V
Program Supply Voltage. VPP is both a
PP
control input and a power supply pin. The two functions are selected by the voltage range ap­plied to the pin. The Supply Voltage V Program Supply Voltage V any order.
If V
is kept in a low voltage range (0V to 3.6V)
PP
V
is seen as a control input. In this case a volt-
PP
age lower than V
gives an absolute protection
PPLK
against program or erase, whi le V ables these functions (see Table 12, DC Charac­teristics for the relevant values). V sampled at the beginning of a Program or Erase; a change in its value after the operation has start­ed does not have any effect on Program or Erase, however for Double or Q uadruple Word Program the results are uncertain.
is in the range 11.4V to 12.6V it acts as a
If V
PP
power supply pin. In t his condition V stable until the Program/Erase algorithm i s com­pleted (see Table 14 and 15).
Ground. VSS is the reference for all voltage
V
SS
measurements.
Note: Each device in a system should have V
DD,VDDQ
and VPP decoupled with a 0.1µF ca-
pacitor close to the pin. See Figure 7, AC Mea-
,
surement Load Circu it. The PCB trace widths should be sufficient to carry the required V Program and Erase currents.
provides the
DDQ
can be applied in
PP
PP
DD
and the
DD
> V
is only
PP
must be
PP
. V
PP1
DDQ
en-
PP
9/45
M28W320EBT, M28W320EBB
BUS OPERATIONS
There are six standard bus operations that control the device. These are Bus Read, Bus Wri te, Out­put Disable, Standby, Automatic Standby and Re­set. See Table 2, Bus Operations, for a summary.
Typically glitches of less than 5ns on Chip Enable or Write Enable are ignored by the memory and do not affect bus operations.
Read. Read Bus operations are used to output the contents of the Memory Array, the Electronic Signature, the Status Register and the Common Flash Interface. Both Chip Enable and Output En­able must be at V eration. The Chip Enable input should be used t o enable the device. Out put E nable shoul d be used to gate data onto th e output. The data read de­pends on the previous command written to the memory (see Command Interface section). See Figure 8, Read Mode AC Wa veforms, and Table 13, Read AC Characteristics, for details of when the output becomes valid.
Read mode is the default state of the device when exiting Reset or after power-up.
Write. Bus Write operations write Comm ands to the memory or latch Input Data to be programmed. A write operation is initiated when Chip Enable and Write Enable are at V V
. Commands, Input Data and Addresses are
IH
latched on the rising edge of Write Enable or Chip Enable, whichever occurs first.
in order to perform a read op-
IL
with Output Enable at
IL
See Figures 9 and 10, Write AC Waveforms, and Tables 14 and 15, Write AC Characteristics, for details of the timing requirements.
Output Disa bl e . The data outputs are high im­pedance when the Output Enable is at V
.
IH
Standby. Stan dby disables most of the inte rnal circuitry allowing a substantial reduction of the cur­rent consumption. The memory is in stand-by when Chip Enable is at V
and the device is in
IH
read mode. The power consumption is reduced to the stand-by level and the o utputs are set to high impedance, independently from the Output Enable or Write Enable inputs. If Chip Enable switches to V
during a program or erase operation, t he de-
IH
vice enters Standby mode when finished. Automatic Standby. Automatic Standby pro-
vides a low power consumption state during Read mode. Following a read operation, the device en­ters Automatic Standby after 150ns of bus inactiv­ity, even if Chip Enable is low, V current is reduced to I
. The data I nputs/Out-
DD1
, and the supply
IL
puts will st ill ou t p ut d ata. Reset. During Reset mode, when Output Enable
is low, V
, the memory is deselected and the out-
IL
puts are high impedance. The memory is in Reset mode when Reset is at V
. The power consump-
IL
tion is reduced to the Standby level, independently from the Chip Enable, Output Enable or Write En­able inputs. If Reset is pulled to V
during a Pro-
SS
gram or Erase, this operation is aborted and the memory content is no longer valid.
Table 2. Bus Operations
Operation E G W RP WP
Read Write Output Disable Standby Reset X X X
Note: X = VIL or VIH, V
10/45
V V V V
= 12V ± 5%.
PPH
IL
IL
IL
IH
V
IL
V
IH
V
IH
XX
V
IH
V
IL
V
IH
V
IH
V
IH
V
IH
V
IH
V
IL
V
PP
X Don’t Care Data Output
V
X X Don’t Care Hi-Z X Don’t Care Hi-Z X Don’t Care Hi-Z
DD
or V
PPH
DQ0-DQ15
Data Input
COMMAND INTERFACE
All Bus Write operations t o the me mory are in ter­preted by the Command Interface. Commands consist of one or more sequential Bus Write oper­ations. An internal Program/Erase Controller han­dles all timings and verifies the correct execution of the Program and Erase commands. The Pro­gram/Erase Controller provides a Status Regi ster whose output may be read at any time, to monitor the progress of an operation, or the Program/ Erase states. See T able 3, Command Codes , for a summary of the commands and see Appendix D, Table 29, Write State Machine Current/Next, for a summary of the Command Interface.
The Command Interface is reset to Read mode when power is first applied, when exiting from Re­set or whenever V
is lower than V
DD
LKO
. Com­mand sequences must be followed exactly. Any invalid combination of commands will reset the de­vice to Read mode. Refer to Table 4, Commands, in conjunction with the text descriptions below.
Read Memory Array command
The Read command returns the memory to its Read mode. One Bus Write cycle is required to is­sue the Read Memory Array command and return the memory to Read mode. Subsequ ent read op­erations will read the addressed location and out­put the data. When a device Reset occurs, the memory defaults to Read mode.
Read Status Register Command
The Status Register indicates when a program or erase operation is complete and the success or failure of the operation itself. Issue a Read Status Register command to rea d the Status Register’s contents. Subsequent Bus Read op erations read the Status Register, at any addres s, until anot her command is issued. See Tab le 8, Status Register Bits, for details on the definitions of the bits.
The Read Status Register command m ay be is­sued at any time, even during a Program/Erase operation. Any Read attempt during a Program/ Erase operation will automatically output the con­tent of the Status Register.
Read Electronic Signature Command
The Read Electronic Signature command reads the Manufacturer and Device Codes.
The Read Electronic Signature command consists of one write cycle, a subsequent read will ou tput the Manufacturer or the Device Code depending on the levels of A0. The Manufacturer Code is out­put when the address line A0 is at V Code is output when A 0 is at V A7 must be kept to V
, other addresses are ig-
IL
, the Device
IL
. Addresses A1-
IH
nored. The codes are output on DQ0-DQ7 with DQ8-DQ15 at 00h. (see Table 5)
M28W320EBT, M28W320EBB
Table 3. Command Codes
Hex Code Command
10h Program 20h Erase 30h 40h Program 50h Clear Status Register 55h Reserved 56h 70h Read Status Register 90h Read Electronic Signature 98h Read CFI Query B0h Program/Erase Suspend
D0h Program/Erase Resume
FFh Read Memory Array
Read CFI Query Command
The Read Query Command is used to read dat a from the Common Flash Interface (CFI) Me mory Area, allowing programming equi pment or appli­cations to automatically match their interface to the characteristics of the device.
One Bus Write cycle is required to issue the Read Query Command. Once the command is issued subsequent Bus Read operations read from the Common Flash Interfac e Memory Area. See Ap­pendix B, Common Flash Interface, Tables 23, 24, 25, 26, 27 and 28 for details on the information contained in the Common Flash Interface memory area.
Block Erase Command
The Block Erase com mand can be used to erase a block. It sets all the bits within the selected block to ’1’. A ll previous data in t he block is lost. If the block is protected then the Erase operation will abort, the data in the block will not be changed and the Status Register will output the error.
Two Bus Write cycles are required to issue the command.
The first bus cycle sets up the Erase command.
The second latches the block address in the
internal state machine and starts the Program/ Erase Controller.
If the second bus cycle is not Write Erase Confirm (D0h), Status Register bits b4 and b5 are set and the command aborts.
Double Word Program
Quadruple Word Program
11/45
M28W320EBT, M28W320EBB
Erase aborts if Reset turns to VIL. As data integrity cannot be guaranteed when the Erase operation is aborted, the block must be erased again.
During Erase operations the memory will onl y ac­cept the Read Status Register command and the Program/Erase Suspend command, all other com­mands will be ignored. Typical Erase times are given in Table 7, Program, Erase Times and Pr o­gram/Erase Endurance Cycles.
See Appendix C , Figure 20, Erase Fl owchart and Pseudo Code, for the flowchart for using the Erase command.
Program Command
The memory array can be programmed word-by­word. Two bus write cycles are required to issue the Program command.
The first bus cycle sets up the Program
command.
The second latches the Address and the Data to
be written and starts the Program/Erase Controller.
During Program operations the memory will only accept the Read Status Register command and the Program/Erase Su spend command. All ot her commands will be ignored. Typical Program times are given in Table 7, Prog ram, Erase Times and Program/Erase Endurance Cycles.
Programming aborts if Reset goe s to V
. As data
IL
integrity cannot be guaranteed when the program operation is aborted, the block containing the memory location must be erased and repro­grammed.
See Appendix C, Figure 16, Program Flowchart and Pseudo Code, for the f lowchart for using the Program command.
Double Word Program Command
This feature is offered to improve the programming throughput, writing a page of two adjacent words in parallel.The two words m ust differ only for the address A0. Programm ing s hould not b e at t emp t­ed when V
is not at V
PP
PPH
.
Three bus write cycles are necessary to issue the Double Word Program command.
The first bus cycle sets up the Double Word
Program command.
The second bus cycle latches the Address and
the Data of the first word to be written.
The third bus cycle latches the Address and the
Data of the second word to be written and starts the Program/Erase Controller.
Read operations output the Status Register con­tent after the programming has s tarted. Program­ming aborts if Res et goes to V
. As data integrity
IL
cannot be guaranteed when the program opera-
tion is aborted, the block containing the memory location must be erased and reprogrammed.
See Appendix C, Figure 17, Double Word Pro­gram Flowchart and Pseudo Code, for the flow­chart for using the Double Word Program command.
Quadruple Word Program Command
This feature is offered to improve the programming throughput, writing a page of four adjacent words in parallel.The four words must differ only for the addresses A0 and A1. Programming should not be attempted when V
is not at V
PP
PPH
.
Five bus write cycles are necessary to issue the Quadruple Word Program command.
The first bus cycle sets up the Quadruple Word
Program Command.
The second bus cycle latches the Address and
the Data of the first word to be written.
The third bus cycle latches the Address and the
Data of the second word to be written.
The fourth bus cycle latches the Address and
the Data of the third word to be written.
The fifth bus cycle latches the Ad dr es s and th e
Data of the fourth word to be written and starts the Program/Erase Controller.
Read operations output the Status Register con­tent after the programming has s tarted. Program­ming aborts if Reset goes to V
. As data integrity
IL
cannot be guaranteed when the program opera­tion is aborted, the block containing the memory location must be erased and reprogrammed.
See Appendix C, Figure 18, Quadruple Word Pro­gram Flowchart and Pseudo Code, for the flow­chart for using the Quadruple Word Program command.
Clear Status Register Command
The Clear Status Register comm and can be used to reset bits 1, 3, 4 and 5 in the Status Register to ‘0’. One bus write cycle is required to issue the Clear Status Register command.
The bits in the Status Register do not automatical­ly return to ‘0’ when a new Program or Erase com­mand is issued. The error bits in the Status Register should be cleared before attempting a new Program or Erase command.
Program/Erase Suspend Command
The Program/Erase Suspend command is used to pause a Program or Erase operation. One bus write cycle is required to issue the Program/Erase command and pau se the Prog ram/Erase control­ler.
During Program/Erase Suspend the Command In­terface will accept the Program/Erase Resume, Read Array, Read Status Register, Read Electron­ic Signature and Read CFI Query commands. Ad-
12/45
M28W320EBT, M28W320EBB
ditionally, if the suspend operation was Erase then the Program, Double Wo rd P rogram and Q uadru­ple Word Program commands will also be accept­ed. Only the blocks no t be i ng era se d may be read or programmed correctly.
During a Program/Erase Suspend, the device can be placed in a pseudo-standby mode by taking Chip Ena ble to V Reset turns to V
. Program/Erase is aborted if
IH
.
IL
See Appendix C, Figure 19 , Program Suspend & Resume Flowchart and Pseudo Code, and Figure 21, Erase Suspend & Resume Flowchart and Pseudo Code for flowcharts for using the Program/ Erase Suspend command.
Program/Erase Resume Command
The Program/Erase Resume command can be used to restart the Program/Erase Controller after a Program/Erase Suspend o peration has paused it. One Bus Write cycle is required to issue the command. Once the command is issued subse-
quent Bus Read operations read the Status Reg­ister.
See Appendix C, Figure 19, Program or Double Word Program Suspend & Resume Flowchart and Pseudo Code, an d Figure 21, Erase Sus pend & Resume Flowchart and Pseudo Code for flow­charts for using the Program/Erase Resume com­mand.
Block Protection
Two parameter/lockable blocks (blocks #0 and #1) can be protected against Program or Erase oper­ations. Unprotect ed blocks ca n be progra mmed or erased.
To protect the two lockab le blocks set W rite Pro­tect to V
. When VPP is below V
IL
all blocks are
PPLK
protected. Any attempt to Program or Erase pro­tected blocks will abort, the data in the block will not be changed and t he Status Register outputs the error.
Table 6, Memory Blocks P rotection Truth Table, defines the protection methods.
13/45
M28W320EBT, M28W320EBB
Table 4. Commands
Commands
No. of
Cycles
1st Cycle 2nd Cycle 3nd Cycle
Bus
Op.
Addr Data
Bus Write Operations
Bus
Addr Data
Op.
Bus
Op.
Addr Data
Read Memory Array Write X FFh Read Status
Register Read Electronic
Signature Read CFI Query Write X 98h Read QA QD Erase Write X 20h Write BA D0h
Program Write X
Double Word Program
Quadruple Word Program
Clear Status Register
Program/Erase Suspend
Program/Erase Resume
Note: 1. X = Don’t C are, RA=Rea d Addre ss, RD =Read D ata, SRD =Stat us Regis ter Da ta, ID =Identif ier (Ma nufact ure and Devic e Code),
(3)
(4)
QA=Query Address, QD=Query Data, BA=Block Address, PA=Program Address, PD=Program Data, PRA=Protection Register Ad­dress, PRD=Protection Regis ter Data.
2. A0 =V
3. Program Addres ses 1 and 2 must be consecuti ve Addresses differing only for A0.
4. Program Addres ses 1,2,3 and 4 m ust be consecutive Addresses differing only for A0 and A1.
5. 55h is reserved.
6. To be c haracteriz ed.
outputs Manufacturer code, A0=VIHoutputs Device code. A ddress A7-A1 must be VIL.
IL
Write X 70h Read X SRD
Write X 90h Read
40h or
Write X 30h Write PA1 PD1 Write PA2 PD2
Write X
Write X 50h
Write X B0h
Write X D0h
56h
Read
Write PA PD
10h
(6)
Write PA1 PD1 Write PA2 PD2 Write PA3 PD3 Write
RA RD
(2)
SA
IDh
Table 5. Read Electronic Signature
Code Device E G W A0 A1-A7 A8-A20 DQ0-DQ7 DQ8-DQ15
Manufacture. Code
M28W320EBT
Device Code
M28W320EBB
Note: RP = VIH.
14/45
V
V
V
IL
IL
V
V
IL
IL
V
V
IL
IL
V
IH
V
V
IH
V
V
IH
V
IL
V
IH
V
IH
Don’t Care 20h 00h
IL
Don’t Care BCh 88h
IL
Don’t Care BDh 88h
IL
M28W320EBT, M28W320EBB
Table 6. Memory Blocks Protection Truth Table
(1)
V
PP
X
V
IL
V
or V
DD
V
or V
DD
Note: 1 . X = Don’t Care
2. V
(2)
PPH
(2)
PPH
must also be greater than the Program Voltage Lock Out V
PP
RP WP
V
IL
V
IH
V
IH
V
IH
(1)
X Protected Protected X Protected Protected
V
IL
V
IH
Table 7. Program, Erase Tim es and Pro gra m /Erase Endurance Cycle s
Parameter Test Conditions
V
Word Program Double Word Program Quadruple Word Program
Main Block Program
Parameter Block Program
Main Block Erase
Parameter Block Erase
Program/Erase Cycles (per Block) 100,000 cycles
Note: 1. Typical time to program a Main or Parameter Block using the Double Word Program and the Quadruple Word Program commands
respectively.
= V
PP
V
= 12V ±5%
PP
V
= 12V ±5%
PP
V
= 12V ±5%
PP
= V
V
PP
V
= 12V ±5%
PP
= V
V
PP
V
= 12V ±5%
PP
V
= V
PP
V
= 12V ±5%
PP
= V
V
PP
DD
DD
DD
DD
DD
Lockable Blocks
(blocks #0 and #1)
Other Blocks
Protected Unprotected
Unprotected Unprotected
.
PPLK
M28W320EB
Min Typ Max
10 200 µs 10 200 µs 10 200 µs
0.16/0.08
(1)
5s
0.32 5 s
0.02/0.01
(1)
4s
0.04 4 s 110s 110s
0.4 10 s
0.4 10 s
Unit
15/45
M28W320EBT, M28W320EBB
STATUS REGISTER
The Status Register provides information on t he current or previous Program or Erase operation. The various bits convey information and errors on the operation. To read the Status register the Read Status Register command can be issued, re­fer to the Read Status Register Command section. To output the contents, the Status Register is latched o n the falling edge of the Ch ip Enable or Output Enable signals, and can be read until Chip Enable or Output Enable returns to V
. Either
IH
Chip Enable or Output Enable must be toggled to update the latched data.
Bus Read operations from any address always read the Status Register during Program and Erase operations.
The bits in the Status Register are summarized in Table 8, Status Register Bits. Refer to Table 8 in conjunction with the following text descriptions.
Program/Erase Controller Status (Bit 7). The Pro­gra m/Erase Controller Status bit indicates whether the Program/Erase Controller is active or inactive. When the Program/Erase Controller Status bit is Low (set to ‘0’), the Program/Erase Controller is active; when the bit is High (set to ‘1’), the Pro­gram/Erase Controller is inactive, and the device is ready to process a new command.
The Program/Erase Controller Status is Low im­mediately after a Program/Erase Suspend com­mand is issued until the Program/Erase Controller pauses. After the Program/Erase Controller paus­es the bit is High .
During Program, Erase, operations the Program/ Erase Controller Status bit can be polled to find the end of the operation. Other bits in the Status Reg­ister should not be tested until the Program/Erase Controller completes the operation and the bit is High.
After the Program/Erase Cont roller completes its operation the Erase Status, Prog ram Status, V
PP
Status and Block Pr otec tion Sta tus b its should be tested for errors.
Erase Suspend Status (Bit 6). The Erase Sus­pend Status bit (set to ‘1’) indicates that an Erase operation has been suspend ed or is going to be suspended.
The Erase Suspend Status should only be consid­ered valid when the Program/Erase Controller Sta­tus bit is High (Program/Erase Controller inactive). Bit 7 is set within 30µs of the Program/Erase Sus­pend command being issued therefore the memo­ry may still complete the operation rather than entering the Suspend mode.
When a Program/Erase Re sume command is is­sued the Erase Suspend Status bit returns Low.
memory may still complete the operation rather than entering the Suspend mode.
Erase Status (Bit 5). The Erase Status bit can be used to identify if the memory has failed to verify that the block has erased correctly. When the Erase Status bit is High (set t o ‘1’), the Program/ Erase Controller has applied the max imum num­ber of pulses to the block and still failed to verify that the block has erased correctly. The Erase Sta­tus bit should be read once the Program/Erase Controller Status bit is High (Program/Erase Con­troller inactive).
Once set High, the Erase Status bit can only be re­set Low by a Clear Status Register command or a hardware reset. If set High it should be reset be­fore a new Program or Erase command is issued, otherwise the new command will appear to fail.
Program Status (Bit 4). The Program Status bit is used to identify a Program failure. When the Program Status bit is High (set to ‘1’), the Pro­gram/Erase Controller has applied the maximum number of pulses to the byte and still failed to ver­ify that it has programmed correctly. The Program Status bit should be read once the Program/Erase Controller Status bit is High (Program/Erase Con­troller inactive).
Once set High, the Program Status bit can only be reset Low by a Clear Status Register command or a hardware reset. If set High it should be reset be­fore a new command is issued, otherwise the new command will appear to fail.
V
Status (Bit 3). The VPP Status bit can be
PP
used to identify an invalid volt age on the V during Program and Erase operations. The V
PP
pin
PP
pin is only sampled at the beginning of a Program or Erase operation. Indeterminate results can oc­cur if V
When the V age on the V when the V
becomes invalid during an operation.
PP
Status bit is Low (set to ‘0’), the volt-
PP
pin was sampled at a valid voltage;
PP
Status bit is High (set to ‘1’), the V
PP
PP
pin has a voltage that is below the VPP Lockout Voltage, V
, the memory is protected and Pro-
PPLK
gram and Erase operations cannot be performed. Once set High, the V
Status bit can only be reset
PP
Low by a Clear Status Register command or a hardware reset. If set High it should be reset be­fore a new Program or Erase command is issued, otherwise the new command will appear to fail.
Program Suspend Status (Bit 2). The Program Suspend Status bit (set to ‘1’) indicates that a Pro­gram operation has been suspended or is going to be suspended.
The Program Suspend Status should only be con­sidered valid when the Program/Erase Controller Status bit is High (Program/Erase Con troller inac­tive). Bit 2 is set within 5µs of the Program/Erase Suspend command being issued therefore the
16/45
M28W320EBT, M28W320EBB
When a Program/Erase Re sume command is is­sued the Program Suspend Status bit returns Low.
Block Protection Status (Bit 1). The Block Pro­tection Status bit can be used to identify if a Pro­gram or Erase operation has tried to modify the contents of a protected block.
When the Block Protection S tatus bit is High (set to ‘1’), a Program or Erase operation has been at­tempted on a protected block.
Once set High, the Block Protection Status bit can only be reset Low by a Clear Status Register com­mand or a hardware reset. If set High it should be reset before a new command is issued, otherwise the new command will appear to fail.
Reserved (Bit 0). Bit 0 of the Status Register is reserved. Its value must be masked.
Note: Refer to Appendix C, Flowcharts and Pseudo Codes, for using the Status Register.
Table 8. Status Register Bits
Bit Name Logic Level Definition
7 P/E.C. Status
6 Erase Suspend Status
5 Erase Status
4 Program Status
Status
3
2 Program Suspend Status
V
PP
’1’ Ready ’0’ Busy ’1’ Suspended ’0’ In progress or Completed ’1’ Erase Error ’0’ Erase Success ’1’ Program Error ’0’ Program Success
V
’1’ ’0’ ’1’ Suspended ’0’ In Progress or Completed
Invalid, Abort
PP
OK
V
PP
1 Block Protection Status
0 Reserved
Note: Logic level ’1’ is High, ’0’ is Low.
’1’ Program/Erase on protected Block, Abort ’0’ No operation to protected blocks
17/45
M28W320EBT, M28W320EBB
MAXIMUM RATIN G
Stressing the device above the rating l isted in the Absolute Maximum Ratings table m ay cause per­manent damage to the device. Exposure to Abso­lute Maximum Rating conditions for extended periods may affect device reliability. These are stress ratings only and operation of the dev ice at
Table 9. Absolute Maximum Ratings
Symbol Parameter
T
A
T
BIAS
T
STG
V
IO
V
, V
DD
DDQ
V
PP
Note: 1. Depends on range.
Ambient Operating Temperature Temperature Under Bias –40 125 °C Storage Te mperat ure –55 155 °C Input or Output Voltage –0.6 Supply Voltage –0.6 4.1 V Program Voltage –0.6 13 V
(1)
these or any other conditions above those indicat­ed in the Operating sections of this specification is not implied. Refer also to the STMicroelectronics SURE Program and other relevan t quality docu­ments.
Value
Min Max
–40 85 °C
V
+0.6
DDQ
Unit
V
18/45
DC AND AC PARAMETERS
This section summarizes the operat ing and mea­surement conditions, and the DC and AC charac­teristics of the device. The parameters in the DC and AC characteristics Tables that follow, are de­rived from tests performed under the Measure-
ment Conditions summarized in Table 10, Operating and AC Measurem ent Conditions. De­signers should check that the operating conditions in their circuit match the measurement conditions when relying on the quoted parameters.
Table 10. Operating and AC Measurement Conditions
M28W320EBT, M28W320EBB
M28W320EBT, M28W320EBB
Parameter
70 85 90 1 00
Min Max Min Max Min Max M in Max
V
Supply Voltage
DD
V
Supply Voltage (V
DDQ
DDQ
V
DD
2.7 3.6 2.7 3.6 2.7 3.6 2.7 3.6 V
2.7 3.6 2.7 3.6 2.7 3.6 1.65 3.6 V
)
Ambient Operating T emperature – 40 85 – 40 85 – 40 85 – 40 85 °C Load Capacitance (C
)
L
50 50 50 50 pF Input Rise and Fall Times 5 5 5 5 ns Input Pulse Voltages Input and Output Timing Ref.
Voltages
0 to V
V
DDQ
DDQ
/2 V
0 to V
DDQ
DDQ
/2 V
0 to V
DDQ
DDQ
/2 V
0 to V
DDQ
DDQ
/2
Figure 6. AC Measurement I/O Waveform Figu re 7. AC Measurement Loa d Circuit
V
DDQ
V
DDQ
V
/2
DDQ
0V
AI00610
V
DDQ
V
DD
25k
Units
V
V
DEVICE UNDER
TEST
0.1µF
0.1µF
CL includes JIG capacitance
C
Table 11. Device Capacitance
Symbol Parameter Test Condition Min Max Unit
V
V
IN
OUT
= 0V
= 0V
6pF
12 pF
C
IN
C
OUT
Note: Sampled o nl y, not 100% test ed.
Input Capacitance Output Capacitance
L
25k
AI00609C
19/45
M28W320EBT, M28W320EBB
Table 12. DC Characteristics
Symbol Parameter Test Condition Min Typ Max Unit
I
LI
I
LO
I
DD
I
DD1
I
DD2
I
DD3
I
DD4
I
DD5
I
PP
I
PP1
I
PP2
I
PP3
I
PP4
V
IL
V
IH
V
OL
V
OH
V
PP1
V
PPH
V
PPLK
V
LKO
Input Leakage Current Output Leakage Current Supply Current (Read) Supply Current (Stand-by or
Automatic Stand-by) Supply Current
(Reset)
Supply Current (Program)
Supply Current (Erase)
Supply Current (Program/Erase Suspend)
Program Current (Read or Stand-by)
Program Current (Read or Stand-by)
Program Current (Reset)
Program Current (Program)
Program Current (Erase)
Input Low Voltage
Input High Voltage
Output Low Voltage
Output High Voltage Program Voltage (Program or
Erase operations) Program Voltage
(Program or Erase operations)
Program Voltage (Program and Erase lock-out)
VDD Supply Voltage (Program and Erase lock-out)
0V≤ V
0V
E
= VSS, G = VIH, f = 5MHz
= V
E
RP
= V
RP
Program in progress
V
PP
Program in progress
Erase in progress
V
PP
Erase in progress
E
= V
Erase suspended
RP
Program in progress
V
PP
Program in progress
Erase in progress
V
PP
Erase in progress
V
V
I
= 100µA, VDD = VDDmin,
OL
V
DDQ
I
= –100µA, VDD = VDDmin,
OH
V
DDQ
V
IN
DDQ
V
OUT
DDQ
DDQ
V
DDQ
± 0.2V,
± 0.2V
= VSS ± 0.2V
= 12V ± 5%
V
= V
PP
DD
= 12V ± 5%
V
= V
PP
DD
± 0.2V,
DDQ
> V
V
PP
DD
V
V
PP
DD
= VSS ± 0.2V
= 12V ± 5%
= V
V
PP
DD
= 12V ± 5%
= V
V
PP
DD
2.7V
DDQ
2.7V 0.7 V
DDQ
= V
= V
DDQ
DDQ
min
min
±1 µA
±10 µA
918mA
15 50 µA
15 50 µA
510mA
10 20 mA
520mA
10 20 mA
15 50 µA
400 µA
15µA 15µA 110mA
15µA
310mA
15µA
–0.5 0.4 V
–0.5 0.8 V
V
–0.4 V
DDQ
DDQ
V
DDQ DDQ
+0.4 +0.4
0.1 V
–0.1
V
DDQ
1.65 3.6 V
11.4 12.6 V
1V
2V
V V
V
20/45
Figure 8. Read AC Waveforms
M28W320EBT, M28W320EBB
tAVAV
A0-A20
tAVQV
E
tELQX
G
tGLQX
DQ0-DQ15
ADDR. VALID
CHIP ENABLE
Table 13. Read AC Characteristics
Symbol Alt Parameter
t
AVAV
t
AVQV
t
AXQX
t
EHQX
t
EHQZ
t
ELQV
t
ELQX
t
GHQX
t
GHQZ
t
GLQV
t
GLQX
Note: 1. Sampled only, not 100% tested.
2. G
t
Address Valid to Next Address Valid Min 70 85 90 100 ns
RC
t
Address Valid to Output Valid Max 70 85 90 100 ns
ACC
(1)
t
Address Transition to Output Transition Min 0 0 0 0 ns
OH
(1)
t
Chip Enable High to Output Transition Min 0 0 0 0 ns
OH
(1)
t
Chip Enable High to Output Hi-Z Max 20 20 25 30 ns
HZ
(2)
t
Chip Enable Low to Output Valid Max 70 85 90 100 ns
CE
(1)
t
Chip Enable Low to Output Transition Min 0 0 0 0 ns
LZ
(1)
t
Output Enable High to Output Transition Min 0 0 0 0 ns
OH
(1)
t
Output Enable High to Output Hi-Z Max 20 20 25 30 ns
DF
(2)
t
Output Enable Low to Output Valid Max 20 20 30 35 ns
OE
(1)
t
Output Enable Low to Output Transition Min 0 0 0 0 ns
OLZ
may be delayed by up to t
ELQV
- t
after the fal ling edge of E without increasing t
GLQV
tELQV
tGLQV
OUTPUTS ENABLED
VALID
tEHQX
tEHQZ
tGHQX
tGHQZ
VALID
DATA VALID STANDBY
M28W320EB
70 85 90 10
.
ELQV
tAXQX
AI03825b
Unit
21/45
M28W320EBT, M28W320EBB
Figure 9. Write AC Waveforms, Write Enable Controlled
AI03826b
tWHAX
PROGRAM OR ERASE
tAVAV
VALIDA0-A20
tAVWH
tWHGL
tELQV
tWHEL
tQVWPL
STATUS REGISTER
tQVVPL
READ
1st POLLING
STATUS REGISTER
OR DATA INPUT
22/45
E
tELWL tWHEH
WP
tVPHWH
PP
V
SET-UP COMMAND CONFIRM COMMAND
tWPHWH
tWHWL
G
W
tWHDX
tWLWH
tDVWH
DQ0-DQ15 COMMAND CMD or DATA
Table 14. Write AC Characteristics, Write Enable Controlled
Symbol Alt Parameter
M28W320EBT, M28W320EBB
M28W320EB
Unit
70 85 90 10
t
AVAV
t
AVWH
t
DVWH
t
ELWL
t
ELQV
(1,2)
t
QVVPL
t
QVWPL
t
VPHWH
t
WHAX
t
WHDX
t
WHEH
t
WHEL
t
WHGL
t
WHWL
t
WLWH
t
WPHWH
Note: 1. Sampled only, not 100% tested.
2. Appl i cable if V
(1)
t
Write Cycle Time Min 70 85 90 100 ns
WC
t
Address Valid to Write Enable High Min 45 45 50 50 ns
AS
t
Data Valid to Write Enable High Min 45 45 50 50 ns
DS
t
Chip Enable Low to Write Enable Low Min 0 0 0 0 ns
CS
Chip Enable Low to Output Valid Min 70 85 90 100 ns Output Valid to VPP Low Output Valid to Write Protect Low Min 0 0 0 0 ns
t
VPSVPP
t
AH
t
DH
t
CH
High to Write Enable High
Write Enable High to Address Transition Min 0 0 0 0 ns Write Enable High to Data Transition Min 0 0 0 0 ns Write Enable High to Chip Enable High Min 0 0 0 0 ns Write Enable High to Chip Enable Low Min 25 25 30 30 ns Write Enable High to Output Enable Low Min 20 20 30 30 ns
t
Write Enable High to Write Enable Low Min 25 25 30 30 ns
WPH
t
Write Enable Low to Write Enable High Min 45 45 50 50 ns
WP
Write Protect High to Write Enable High Min 45 45 50 50 ns
is seen as a logic i nput (VPP < 3.6V ).
PP
Min 0 0 0 0 ns
Min 200 200 200 200 ns
23/45
M28W320EBT, M28W320EBB
Figure 10. Write AC Waveforms, Chip Enable Controlled
AI033827b
tEHAX
PROGRAM OR ERASE
tAVAV
VALIDA0-A20
tAVEH
tEHGL
tELQV
tQVWPL
CMD or DATA STATUS REGISTER
tQVVPL
READ
1st POLLING
STATUS REGISTER
OR DATA INPUT
CONFIRM COMMAND
24/45
W
tWLEL tEHWH
WP
tVPHEH
PP
V
POWER-UP AND
SET-UP COMMAND
tWPHEH
tEHEL
G
E
tEHDX
tELEH
tDVEH
DQ0-DQ15 COMMAND
Table 15. Write AC Characteristics, Chip Enable Controlled
Symbol Alt Parameter
M28W320EBT, M28W320EBB
M28W320EB
Unit
70 85 90 10
t
AVAV
t
AVEH
t
DVEH
t
EHAX
t
EHDX
t
EHEL
t
EHGL
t
EHWH
t
ELEH
t
ELQV
(1,2)
t
QVVPL
t
QVWPL
t
VPHEH
t
WLEL
t
WPHEH
Note: 1. Sampled only, not 100% tested.
2. Appl i cable if V
(1)
t
Write Cycle Time Min 70 85 90 100 ns
WC
t
Address Valid to Chip Enable High Min 45 45 50 50 ns
AS
t
Data Valid to Chip Enable High Min 45 45 50 50 ns
DS
t
Chip Enable High to Address Transition Min 0 0 0 0 ns
AH
t
Chip Enable High to Data Transition Min 0 0 0 0 ns
DH
t
Chip Enable High to Chip Enable Low Min 25 25 30 30 ns
CPH
Chip Enable High to Output Enable Low Min 25 25 30 30 ns
t
Chip Enable High to Write Enable High Min 0 0 0 0 ns
WH
t
Chip Enable Low to Chip Enable High Min 45 45 50 50 ns
CP
Chip Enable Low to Output Valid Min 70 85 90 100 ns Output Valid to VPP Low Data Valid to Write Protect Low Min 0 0 0 0 ns
t
VPSVPP
t
CS
High to Chip Enable High
Write Enable Low to Chip Enable Low Min 0 0 0 0 ns Write Protect High to Chip Enable High Min 45 45 50 50 ns
is seen as a logic i nput (VPP < 3.6V ).
PP
Min 0 0 0 0 ns
Min 200 200 200 200 ns
25/45
M28W320EBT, M28W320EBB
Figure 11. Power-Up and Reset AC Waveforms
E, G
W,
RP
tPHWL
tPHEL
tPHGL
tPHWL
tPHEL
tPHGL
tVDHPH
VDD, VDDQ
Power-Up Reset
Table 16. Power-Up and Reset AC Characteristics
Symbol Parameter Test Condition
t
PHWL
t
PHEL
t
PHGL
t
PLPH
t
VDHPH
Note: 1. The devi ce Reset is possible but not guarant eed if t
2. Sampled only, not 100% tested.
3. It is im portant to ass ert RP
Reset High to Write Enable Low, Chip Enable Low, Output Enable Low
(1,2)
Reset Low to Reset High Min 100 100 100 100 ns
(3)
Supply Voltages High to Reset High Min 50 50 50 50 µs
in order to all ow proper CPU i ni tializati on during pow er up or reset .
PLPH
During
Program
and Erase
others Min 30 30 30 30 ns
< 100ns.
tPLPH
AI03453b
M28W320EB
Unit
70 85 90 10
Min 50 50 50 50 µs
26/45
M28W320EBT, M28W320EBB
PACKAGE MECHANICAL
Figure 12. TSOP48 - 48 lead Plastic Thin Small Outline, 12 x 20mm, Package Outline
A2
1 N
e
E
B
N/2
D1
D
DIE
A
CP
C
TSOP-a
Note: Drawing is not to scale.
LA1 α
Table 17. TSOP48 - 48 lead Plastic Thin Small Outline, 12 x 20mm, Package Mechanical Data
Symbol
A 1.20 0.0472 A1 0.05 0.15 0.0020 0.0059 A2 0.95 1.05 0.0374 0.0413
B 0.17 0.27 0.0067 0.0106
C 0.10 0.2 1 0.0039 0.0083
D 19.80 20.2 0 0.7795 0.7953
D1 18.30 18.50 0.7205 0.7283
E 11.90 12.10 0.4685 0.4764
e 0.50 0.01 97 – L 0.50 0.70 0.0 197 0.0279
α
N48 48
CP 0.10 0.0039
Typ Min Max Typ Min Max
mm inches
27/45
M28W320EBT, M28W320EBB
Figure 13. TFBGA47 6.39x6.37mm - 8x6 ball array, 0.75mm pitch, Bottom View Package Ou tline
D
FD
FE
D1
SD
SE
E1E
e
ddd
BALL "A1"
e
A
b
A2
A1
BGA-Z35
Note: Drawing is not to scale.
Table 18. TFBGA47 6.39x6.37mm - 8x6 ball array, 0.75mm pitch, Package Mechanical Data
Symbol
Typ Min Max Typ Min Max
A 1.200 0.0472 A1 0.200 0.0079
millimeters inches
A2 1.000 0.0394
b 0.400 0.350 0.450 0.0157 0.0138 0.0177
D 6.390 6.290 6.490 0.2516 0.2476 0.2555
D1 5.250 0.2067
ddd 0.100 0.0039
E 6.370 6.270 6.470 0.2508 0.2469 0.2547 E1 3.750 0.1476
e 0.750 0.0295 – FD 0.570 0.0224 – FE 1.310 0.0516 – SD 0.375 0.0148 – SE 0.375 0.0148
28/45
M28W320EBT, M28W320EBB
Figure 14. TFBGA47 Daisy Chain - Package Connections (Top view through package)
87654321
A
B
C
D
E
F
Figure 15. TFBGA47 Daisy Chain - PCB Connections proposal (Top view through package)
87654321
A
B
C
D
E
F
START
POINT
POINT
AI03295
END
AI03296
29/45
M28W320EBT, M28W320EBB
PART NUMBERING Table 19. Ordering Information Scheme
Example: M28W320EBT 90 N 6 T
Device Type
M28
Operating Voltage
W = V
Device Function
320EB = 32 Mbit (x16), Boot Block
Array Matrix
T = Top Boot B = Bottom Boot
Speed
70 = 70 ns 85 = 85 ns 90 = 90 ns 10 = 100 ns
= 2.7V to 3.6V; V
DD
= 1.65V to 3.6V
DDQ
Package
N = TSOP48: 12 x 20 mm ZB = TFBGA47: 6.39 x 6.37mm, 0.75 mm pitch
Temperature Range
1 = 0 to 70 °C 6 = –40 to 85 °C
Option
T = Tape & Reel Packing
Table 20. Daisy Chain Ordering Scheme
Example: M28W320EB -ZB T
Device Type
M28W320EB
Daisy Chain
-ZB = TFBGA47: 6.39 x 6.37mm, 0.75 mm pitch
Option
T = Tape & Reel Packing
Note:Devices are shipped from the factory with the memory content bits erased to ’1’. For a list of available
options (Speed, Package, etc...) or for further information on any aspect of this device, please contact the ST Sales Office nearest to you.
30/45
APPENDIX A. BLOCK ADDRESS TABLES
M28W320EBT, M28W320EBB
Table 21. Top Boot Block Addresses, M28W320EBT
#
0 4 1FF000-1FFFFF 1 4 1FE000-1FEFFF 2 4 1FD000-1FDFFF 3 4 1FC000-1FCFFF 4 4 1FB000-1FBFFF 5 4 1FA000-1FAFFF 6 4 1F9000-1F9FFF 7 4 1F8000-1F8FFF 8 32 1F0000-1F7FFF
9 32 1E8000-1EFFFF 10 32 1E0000-1E7FFF 11 32 1D8000-1DFFFF 12 32 1D0000-1D7FFF 13 32 1C8000-1CFFFF 14 32 1C0000-1C7FFF 15 32 1B8000-1BFFFF 16 32 1B0000-1B7FFF 17 32 1A8000-1AFFFF 18 32 1A0000-1A7FFF 19 32 198000-19FFFF 20 32 190000-197FFF 21 32 188000-18FFFF 22 32 180000-187FFF 23 32 178000-17FFFF 24 32 170000-177FFF 25 32 168000-16FFFF 26 32 160000-167FFF 27 32 158000-15FFFF 28 32 150000-157FFF 29 32 148000-14FFFF 30 32 140000-147FFF 31 32 138000-13FFFF 32 32 130000-137FFF 33 32 128000-12FFFF
Size
(KWord)
Address Range
34 32 120000-127FFF 35 32 118000-11FFFF 36 32 110000-117FFF 37 32 108000-10FFFF 38 32 100000-107FFF 39 32 0F8000-0FFFFF 40 32 0F00000-F7FFF 41 32 0E8000-0EFFFF 42 32 0E0000-0E7FFF 43 32 0D8000-0DFFFF 44 32 0D0000-0D7FFF 45 32 0C8000-0CFFFF 46 32 0C0000-0C7FFF 47 32 0B8000-0BFFFF 48 32 0B0000-0B7FFF 49 32 0A8000-0AFFFF 50 32 0A0000-0A7FFF 51 32 098000-09FFFF 52 32 090000-097FFF 53 32 088000-08FFFF 54 32 080000-087FFF 55 32 078000-07FFFF 56 32 070000-077FFF 57 32 068000-06FFFF 58 32 060000-067FFF 59 32 058000-05FFFF 60 32 050000-057FFF 61 32 048000-04FFFF 62 32 040000-047FFF 63 32 038000-03FFFF 64 32 030000-037FFF 65 32 028000-02FFFF 66 32 020000-027FFF 67 32 018000-01FFFF 68 32 010000-017FFF 69 32 008000-00FFFF 70 32 000000-007FFF
31/45
M28W320EBT, M28W320EBB
Table 22. Bottom Boot Block Addresses, M28W320EBB
#
70 32 1F8000-1FFFFF 69 32 1F0000-1F7FFF 68 32 1E8000-1EFFFF 67 32 1E0000-1E7FFF 66 32 1D8000-1DFFFF 65 32 1D0000-1D7FFF 64 32 1C8000-1CFFFF 63 32 1C0000-1C7FFF 62 32 1B8000-1BFFFF 61 32 1B0000-1B7FFF 60 32 1A8000-1AFFFF 59 32 1A0000-1A7FFF 58 32 198000-19FFFF 57 32 190000-197FFF 56 32 188000-18FFFF 55 32 180000-187FFF 54 32 178000-17FFFF 53 32 170000-177FFF 52 32 168000-16FFFF 51 32 160000-167FFF 50 32 158000-15FFFF 49 32 150000-157FFF 48 32 148000-14FFFF 47 32 140000-147FFF 46 32 138000-13FFFF 45 32 130000-137FFF 44 32 128000-12FFFF 43 32 120000-127FFF 42 32 118000-11FFFF 41 32 110000-117FFF 40 32 108000-10FFFF 39 32 100000-107FFF 38 32 0F8000-0FFFFF 37 32 0F0000-0F7FFF
Size
(KWord)
Address Range
36 32 0E8000-0EFFFF 35 32 0E0000-0E7FFF 34 32 0D8000-0DFFFF 33 32 0D0000-0D7FFF 32 32 0C8000-0CFFFF 31 32 0C0000-0C7FFF 30 32 0B8000-0BFFFF 29 32 0B0000-0B7FFF 28 32 0A8000-0AFFFF 27 32 0A0000-0A7FFF 26 32 098000-09FFFF 25 32 090000-097FFF 24 32 088000-08FFFF 23 32 080000-087FFF 22 32 078000-07FFFF 21 32 070000-077FFF 20 32 068000-06FFFF 19 32 060000-067FFF 18 32 058000-05FFFF 17 32 050000-057FFF 16 32 048000-04FFFF 15 32 040000-047FFF 14 32 038000-03FFFF 13 32 030000-037FFF 12 32 028000-02FFFF 11 32 020000-027FFF 10 32 018000-01FFFF
9 32 010000-017FFF 8 32 008000-00FFFF 7 4 007000-007FFF 6 4 006000-006FFF 5 4 005000-005FFF 4 4 004000-004FFF 3 4 003000-003FFF 2 4 002000-002FFF 1 4 001000-001FFF 0 4 000000-000FFF
32/45
M28W320EBT, M28W320EBB
APPENDIX B. COMMON FLASH INTERFACE (CFI)
The Common Flash Interface is a JEDEC ap­proved, standardized data structure that can be read from the Flash memory device. It allows a system software to query the device to det ermine various electrical and t iming parameters, density information and functions supported by the mem­ory. The system can interface easily with the de­vice, enabling the software to upgrade itself when necessary.
When the CFI Query Co mmand (RCFI) is issued the device enters CFI Query mode and the data
Table 23. Query Structure Overview
Offset Sub-section Name Description
00h Reserved Reserved for algorithm-specific information 10h CFI Query Identification String Command set ID and algorithm data offset 1Bh System Interface Information Device timing & voltage information 27h Device Geometry Definition Flash device layout
P Primary Algorithm-specific Extended Query table
A Alternate Algorithm-specific Extended Query table
Note: Query data are always presented on the lowest order data outputs.
structure is read from the memory. Tables 23, 24, 25, 26, 27 and 28 show the addresses used to re­trieve the data.
The CFI data structure also contains a security area where a 64 bit unique security number is writ­ten (see Table 28, Security Code area). This area can be accessed only in Read mode by the final user. It is impossible to change the security num ­ber after it has been written by ST. Issue a Read command to return to Read mode.
Additional information specific to the Primary Algorithm (optional)
Additional information specific to the Alternate Algorithm (optional)
Table 24. CFI Query Identification String
Offset Data Description Value
00h 0020h Manufacturer Code ST
01h
02h-0Fh reserved Reserved
10h 0051h Query Unique ASCII String "QRY" “Q” 11h 0052h Query Unique ASCII String "QRY" “R” 12h 0059h Query Unique ASCII String "QRY" “Y” 13h 0003h 14h 0000h
15h
16h 0000h 17h 0000h 18h 0000h
19h
1Ah 0000h
Note: Query data are always presented on the lowest order data outputs (DQ7-DQ0) only. DQ8-DQ15 are ‘0’.
88BCh 88BDh
offset = P =
0035h
value = A =
0000h
Device Code
Primary Algorithm Command Set and Control Interface ID code 16 bit ID code defining a specific algorithm
Address for Primary Algorithm extended Query table
Alternate Vendor Command Set and Control Interface ID Code second vendor - specified algorithm supported (note: 0000h means none exists)
Address for Alternate Algorithm extended Query table note: 0000h means none exists
Compatible
Top
Bottom
Intel
P=35h
NA
NA
33/45
M28W320EBT, M28W320EBB
Table 25. CFI Query System Interface Information
Offset Data Description Value
V
Logic Supply Minimum Program/Erase or Write voltage
1Bh 0027h
1Ch 0036h
1Dh 00B4h
1Eh 00C6h
1Fh 0004h 20h 0004h 21h 000Ah 22h 0000h 23h 0005h 24h 0005h 25h 0003h 26h 0000h
DD
bit 7 to 4 BCD value in volts bit 3 to 0 BCD value in 100 mV
Logic Supply Maximum Program/Erase or Write voltage
V
DD
bit 7 to 4 BCD value in volts bit 3 to 0 BCD value in 100 mV
V
[Programming] Supply Minimum Program/Erase voltage
PP
bit 7 to 4 HEX value in volts bit 3 to 0 BCD value in 100 mV
[Programming] Supply Maximum Program/Erase voltage
V
PP
bit 7 to 4 HEX value in volts
bit 3 to 0 BCD value in 100 mV Typical timeout per single word program = 2 Typical timeout for Double/ Quadruple Word Program = 2 Typical timeout per individual block erase = 2 Typical timeout for full chip erase = 2 Maximum timeout for word program = 2
n
n
ms
n
times typical
µs
n
n
ms
Maximum timeout for Double/ Quadruple Word Program = 2 Maximum timeout per individual block erase = 2 Maximum timeout for chip erase = 2
n
times typical
n
times typical
µs
n
times typical
2.7V
3.6V
11.4V
12.6V
16µs 16µs
1 s
NA 512µs 512µs
8 s
NA
34/45
Table 26. Device Geometry Definition
Offset Word
Mode
27h 0016h 28h
29h
2Ah 2Bh
2Ch 0002h Number of Erase Block Regions within the device.
Data Description Value
n
in number of bytes
0001h 0000h
0003h 0000h
Device Size = 2
Flash Device Interface Code description
Maximum number of bytes in multi-byte program or page = 2
It specifies the number of regions within the device containing contiguous Erase Blocks of the same size.
M28W320EBT, M28W320EBB
4MByte
x16
Async
n
8
2
2Dh 2Eh
2Fh
30h 31h
32h
M28W320EBT
33h 34h
2Dh 2Eh
2Fh
30h 31h
32h
M28W320EBB
33h 34h
003Eh
0000h 0000h
0001h 0007h
0000h 0020h
0000h 0007h
0000h 0020h
0000h
003Eh
0000h 0000h
0001h
Region 1 Information Number of identical-size erase block = 003Eh+1
Region 1 Information Block size in Region 1 = 0100h * 256 byte
Region 2 Information Number of identical-size erase block = 0007h+1
Region 2 Information Block size in Region 2 = 0020h * 256 byte
Region 1 Information Number of identical-size erase block = 0007h+1
Region 1 Information Block size in Region 1 = 0020h * 256 byte
Region 2 Information Number of identical-size erase block = 003Eh+1
Region 2 Information Block size in Region 2 = 0100h * 256 byte
63
64KByte
8
8KByte
8
8KByte
63
64KByte
35/45
M28W320EBT, M28W320EBB
Table 27. Primary Algorithm-Specific Extended Qu ery Ta bl e
Offset
P = 35h
(1)
Data Description Value
(P+0)h = 35h 0050h (P+1)h = 36h 0052h "R"
Primary Algorithm extended Query table unique ASCII string “PRI”
"P"
(P+2)h = 37h 0049h "I" (P+3)h = 38h 0031h Major version number, ASCII "1"
(P+4)h = 39h 0030h Minor version number, ASCII "0" (P+5)h = 3Ah 0006h Extended Query table contents for Primary Algorithm. Address (P+5)h (P+6)h = 3Bh 0000h (P+7)h = 3Ch 0000h (P+8)h = 3Dh 0000h
contains less significant byte.
bit 0 Chip Erase supported (1 = Yes, 0 = No) bit 1 Erase Suspend supported (1 = Yes, 0 = No) bit 2 Program Suspend (1 = Yes, 0 = No) bit 3 Lock/Unlock supported (1 = Yes, 0 = No) bit 4 Queued Erase supported (1 = Yes, 0 = No)
No Yes Yes
No
No
bit 31 to 5 Reserved; undefined bits are ‘0’
(P+9)h = 3Eh 0001h Supported Functions after Suspend
Read Array, Read Status Register and CFI Query are always supported during Erase or Program operation
bit 0 Program supported after Erase Suspend (1 = Yes, 0 = No)
Yes
bit 7 to 1 Reserved; undefined bits are ‘0’ (P+A)h = 3Fh 0000h Block Lock Status (P+B)h = 40h 0000h
Defines which bits in the Block Status Register section of the Query are implemented.
NA
bit 0 Block Lock Status Register Lock/Unlock bit active(1 = Yes, 0 = No)
bit 1 Block Lock Status Register Lock-Down bit active (1 = Yes, 0 = No)
bit 15 to 2 Reserved for future use; undefined bits are ‘0’ (P+C)h = 41h 0030h V
Logic Supply Optimum Program/Erase voltage (highest performance)
DD
3V
bit 7 to 4 HEX value in volts
bit 3 to 0 BCD value in 100 mV (P+D)h = 42h 00C0h V
Supply Optimum Program/Erase voltage
PP
bit 7 to 4 HEX value in volts
bit 3 to 0 BCD value in 100 mV
(P+E)h 0000h Reserved
Note: 1. See Table 24, offset 15h for P point er definiti on.
Table 28. Security Code Area
Offset Data Description
81h XXXX 82h XXXX 83h XXXX 84h XXXX
36/45
64 bits unique device number.
12V
APPENDIX C. FLOWCHARTS AND PSEUDO CODES
Figure 16. Program Flow c hart and Pseudo Code
Start
M28W320EBT, M28W320EBB
Write 40h or 10h
Write Address
& Data
Read Status
Register
b7 = 1
YES
b3 = 0
YES
b4 = 0
YES
b1 = 0
YES
End
NO
NO
NO
NO
VPP Invalid
Error (1, 2)
Error (1, 2)
Program to Protected
Block Error (1, 2)
Program
program_command (addressToProgram, dataToProgram) {: writeToFlash (any_address, 0x40) ; /*or writeToFlash (any_address, 0x10) ; */
writeToFlash (addressToProgram, dataToProgram) ; /*Memory enters read status state after the Program Command*/
do { status_register=readFlash (any_address) ; /* E or G must be toggled*/
} while (status_register.b7== 0) ;
if (status_register.b3==1) /*VPP invalid error */ error_handler ( ) ;
if (status_register.b4==1) /*program error */ error_handler ( ) ;
if (status_register.b1==1) /*program to protect block error */ error_handler ( ) ;
}
AI03538b
Note: 1. Status check of b1 (Protected Blo ck ), b3 (VPP Invalid) and b4 (Program Error) can be made aft er each program ope rat i on or after
a sequence.
2. If an er ror is found, the Status Re gi ster must be cl eared befor e further Program/Era se Controlle r operations.
37/45
M28W320EBT, M28W320EBB
Figure 17. Doubl e W or d Pr og ram Fl owchart and Pseudo Code
Start
Write 30h
Write Address 1
& Data 1 (3)
Write Address 2
& Data 2 (3)
Read Status
Register
b7 = 1
YES
b3 = 0
YES
b4 = 0
NO
NO
NO
VPP Invalid
Error (1, 2)
Program
Error (1, 2)
double_word_program_command (addressToProgram1, dataToProgram1, addressToProgram2, dataToProgram2) { writeToFlash (any_address, 0x30) ;
writeToFlash (addressToProgram1, dataToProgram1) ; /*see note (3) */ writeToFlash (addressToProgram2, dataToProgram2) ; /*see note (3) */ /*Memory enters read status state after the Program command*/
do { status_register=readFlash (any_address) ; /* E or G must be toggled*/
} while (status_register.b7== 0) ;
if (status_register.b3==1) /*VPP invalid error */ error_handler ( ) ;
if (status_register.b4==1) /*program error */ error_handler ( ) ;
YES
NO
b1 = 0
YES
End
Note: 1. Status check of b1 (Protected Blo ck ), b3 (VPP Invalid) and b4 (Program Error) can be made aft er each program ope rat i on or after
a sequence.
2. If an er ror is found, the Status Re gi ster must be cl eared befor e further Program/Era se operations.
3. Address 1 and Address 2 must be consecutive addresse s differing only for bit A0.
Program to Protected
Block Error (1, 2)
if (status_register.b1==1) /*program to protect block error */ error_handler ( ) ;
}
AI03539b
38/45
Figure 18. Qu adruple Word P rog ram Fl owchart and Pseudo Code
Start
M28W320EBT, M28W320EBB
Write 56h
Write Address 1
& Data 1 (3)
Write Address 2
& Data 2 (3)
Write Address 3
& Data 3 (3)
Write Address 4
& Data 4 (3)
Read Status
Register
b7 = 1
YES
quadruple_word_program_command (addressToProgram1, dataToProgram1, addressToProgram2, dataToProgram2, addressToProgram3, dataToProgram3, addressToProgram4, dataToProgram4) { writeToFlash (any_address, 0x56) ;
writeToFlash (addressToProgram1, dataToProgram1) ; /*see note (3) */
writeToFlash (addressToProgram2, dataToProgram2) ; /*see note (3) */
writeToFlash (addressToProgram3, dataToProgram3) ; /*see note (3) */
writeToFlash (addressToProgram4, dataToProgram4) ; /*see note (3) */
/*Memory enters read status state after the Program command*/
do { status_register=readFlash (any_address) ; /* E or G must be toggled*/
NO
} while (status_register.b7== 0) ;
b3 = 0
b4 = 0
b1 = 0
End
Note: 1. Status check of b1 (Protected Blo ck ), b3 (VPP Invalid) and b4 (Program Error) can be made aft er each program ope rat i on or after
a sequence.
2. If an er ror is found, the Status Re gi ster must be cl eared befor e further Program/Era se operations.
3. Address 1 to Address 4 must be consecutive addresse s differing only for bits A0 an d A1.
NO
YES
NO
YES
NO
YES
VPP Invalid
Error (1, 2)
Program
Error (1, 2)
Program to Protected
Block Error (1, 2)
if (status_register.b3==1) /*VPP invalid error */ error_handler ( ) ;
if (status_register.b4==1) /*program error */ error_handler ( ) ;
if (status_register.b1==1) /*program to protect block error */ error_handler ( ) ;
}
AI06233
39/45
M28W320EBT, M28W320EBB
Figure 19. Program Suspend & Resume Flowchart and Pseudo Code
Start
program_suspend_command ( ) {
Write B0h
Write 70h
Read Status
Register
writeToFlash (any_address, 0xB0) ; writeToFlash (any_address, 0x70) ;
/* read status register to check if program has already completed */
do { status_register=readFlash (any_address) ; /* E or G must be toggled*/
b7 = 1
YES
b2 = 1
YES
Write FFh
Read data from another address
Write D0h
Program Continues
NO
NO
Program Complete
Write FFh
Read Data
} while (status_register.b7== 0) ;
if (status_register.b2==0) /*program completed */ { writeToFlash (any_address, 0xFF) ; read_data ( ) ; /*read data from another block*/ /*The device returns to Read Array (as if program/erase suspend was not issued).*/
} else { writeToFlash (any_address, 0xFF) ; read_data ( ); /*read data from another address*/ writeToFlash (any_address, 0xD0) ; /*write 0xD0 to resume program*/ } }
AI03540b
40/45
Figure 20. Erase Flowchart and Pseudo Code
Start
Write 20h
Write Block
Address & D0h
M28W320EBT, M28W320EBB
erase_command ( blockToErase ) { writeToFlash (any_address, 0x20) ;
writeToFlash (blockToErase, 0xD0) ; /* only A12-A20 are significannt */
/* Memory enters read status state after
the Erase Command */
Read Status
Register
YES
YES
NO
YES
YES
NO
NO
YES
NO
NO
VPP Invalid
Error (1)
Command
Sequence Error (1)
Erase to Protected
Block Error (1)
b7 = 1
b3 = 0
b4, b5 = 1
b5 = 0 Erase Error (1)
b1 = 0
End
do { status_register=readFlash (any_address) ; /* E or G must be toggled*/
} while (status_register.b7== 0) ;
if (status_register.b3==1) /*VPP invalid error */ error_handler ( ) ;
if ( (status_register.b4==1) && (status_register.b5==1) ) /* command sequence error */ error_handler ( ) ;
if ( (status_register.b5==1) ) /* erase error */ error_handler ( ) ;
if (status_register.b1==1) /*program to protect block error */ error_handler ( ) ;
}
AI03541b
Note: If an error is fo und, the Stat us Register must be cleared before fu rther Program /Erase operations.
41/45
M28W320EBT, M28W320EBB
Figure 21. Erase Suspend & Resume Flowchart and Pseudo Code
Start
Write B0h
Write 70h
Read Status
Register
b7 = 1
YES
b6 = 1
YES
Write FFh
Read data from
another block
or
Program
Write D0h
Erase Continues
NO
NO
Erase Complete
Write FFh
Read Data
erase_suspend_command ( ) { writeToFlash (any_address, 0xB0) ;
writeToFlash (any_address, 0x70) ; /* read status register to check if erase has already completed */
do { status_register=readFlash (any_address) ; /* E or G must be toggled*/
} while (status_register.b7== 0) ;
if (status_register.b6==0) /*erase completed */ { writeToFlash (any_address, 0xFF) ;
read_data ( ) ; /*read data from another block*/ /*The device returns to Read Array (as if program/erase suspend was not issued).*/
} else { writeToFlash (any_address, 0xFF) ; read_program_data ( ); /*read or program data from another address*/ writeToFlash (any_address, 0xD0) ; /*write 0xD0 to resume erase*/ } }
42/45
AI03549b
M28W320EBT, M28W320EBB
APPENDIX D. COMMAND INTERFACE AND PROGRAM/ERASE CONTROLLER STATE
Table 29. Write State Machine Current/Next
Command Input (and Next State)
Current
State
Read Array
Read
Status
Read
Elect.Sg.
Program
Setup
Program
(continue)
Program
Suspend
to Read
Status
Program
Suspend
to Read
Array
Program
Suspend
to Read
Elect.Sg.
Program
(complete)
Erase Setup
Erase
Cmd. Error
Erase
(continue)
Erase
Suspend
to Read
Status
Erase
Suspend
to Read
Array
Erase
Suspend
to Read
Elect.Sg.
Erase
(complete)
Note: Elect.Sg. = Electronic Signature.
bit 7
Data
SR
When
Read
“1” A rray
“1” Status
Electronic
“1”
Signature
“1” St atus Program (C om m and input = Dat a to be Programmed)
“0” Status Program (continue)
“1” Status
“1” A rray
Electronic
“1”
Signature
“1” Status
“1” Status Erase Command Error
“0” Status
“1” St atus Erase (continu e)
“1” Status
“1” A rray
Electronic
“1”
Signature
“1” Status
Read Array (FFh)
Read Array
Read Array
Read Array
Program
Suspend
to Read
Array
Program
Suspend
to Read
Array
Program
Suspend
to Read
Array Read
Array
Read Array
Erase
Suspend
to Read
Array
Erase
Suspend
to Read
Array
Erase
Suspend
to Read
Array Read
Array
Program
Setup
(10/40h)
Program
Setup
Program
Setup
Program
Setup
Program Suspend to
Program Suspend to
Program Suspend to
Program
Setup
Program
Setup
Program
Setup
Program
Setup
Program
Setup
Program
Setup
Erase Setup
(20h)
Erase Setup
Erase Setup
Erase Setup
Read Array
Read Array
Read Array
Erase Setup
Erase Setup
Erase
Suspend
to Read
Array
Erase
Suspend
to Read
Array
Erase
Suspend
to Read
Array
Erase Setup
Erase
Confirm
(D0h)
Program
(continue)
Program
(continue)
Program
(continue)
Erase
(continue)
Erase
(continue)
Erase
(continue)
Erase
(continue)
Program/
Erase
Suspend
(B0h)
Read Array
Read Array
Read Array
Program
Suspend
to Read
Status
Program
Suspend
to Read
Array
Program
Suspend
to Read
Array
Program
Suspend
to Read
Array
Read Array
Erase
Command
Error
Read Array
Erase
Suspend
to Read
Status
Erase
Suspend
to Read
Array
Erase
Suspend
to Read
Array
Erase
Suspend
to Read
Array
Read Array
Program/
Erase
Resume
(D0h)
Program
(continue)
Program
(continue)
Program
(continue)
Erase
(continue)
Erase
(continue)
Erase
(continue)
Erase
(continue)
Read
Status
(70h)
Read
Status
Read
Status
Read
Status
Program (continue)
Program Suspend
to Read
Status
Program Suspend
to Read
Status
Program Suspend
to Read
Status
Read
Status
Read
Status
Erase (conti nue)
Erase
Suspend
to Read
Status
Erase
Suspend
to Read
Status
Erase
Suspend
to Read
Status
Read
Status
Clear
Status
(50h)
Read Array
Read Array
Read Array
Program Suspend
to Read
Array
Program Suspend
to Read
Array
Program Suspend
to Read
Array Read
Array
Erase Com m and Error
Read Array
Erase
Suspend
to Read
Array Erase
Suspend
to Read
Array Erase
Suspend
to Read
Array Read
Array
Read
Elect.Sg.
(90h)
Read
Elect.Sg.
Read
Elect.Sg.
Read
Elect.Sg.
Program
Suspend
to Read
Elect.Sg.
Program
Suspend
to Read
Elect.Sg.
Program
Suspend
to Read
Elect.Sg.
Read
Elect.Sg.
Read
Elect.Sg.
Erase
Suspend
to Read
Elect.Sg.
Erase
Suspend
to Read
Elect.Sg.
Erase
Suspend
to Read
Elect.Sg.
Read
Elect.Sg.
43/45
M28W320EBT, M28W320EBB
REVISION HIST ORY
Table 30. Document Revision History
Date Version Revision Details
10-Sep-2001 -01 First Issue
Maximum changed to 3.3V
V
06-Nov-2001 -02
17-Jun-2002 -03
3-Oct-2002 3.1
DDQ
Commands Table, Read CFI Query Address on 1st cycle changed to ‘X’ (Table 4) Quadruple Word Program command added, V
package dimensions added to description. Corrections to Program and Erase times Tab le 7, DC Characteristics Table 12 and CFI Tables 25 and 26. Command Codes Table added.
Revision numbering modified: a minor revision will be indicated by incrementing the digit after the dot, and a major revision, by incrementing the digit before the dot (revision version 03 equals 3.0). Revision History moved to end of document. “Double Word Program Command” and “Quadruple Word Program Command” clarified.
Maximum changed to 3.6V, TFBGA
DDQ
44/45
M28W320EBT, M28W320EBB
Information furnished is believed to be accurate an d rel i able. However, STMicroelectro ni cs assumes no responsibilit y for the cons equences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implic ation or otherwise under any patent or patent rights of STMi croelectr onics. Specifications mentioned in th i s publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authoriz ed for use as critical comp onents in lif e support devi ces or systems wi thout exp ress written approval of STM i croelect ronics.
The ST logo i s registered trademark of STMicroel ectronics All other nam es are the pro perty of their respective owners
© 2002 STMicroelectronics - All Rights Reserved
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