ST M24C32-125 User Manual

M24C32-125

Automotive 32-Kbit serial I²C bus EEPROM

Features

Compatible with all I2C bus modes:

400 kHz Fast mode

100 kHz Standard mode

Memory array:

32 Kbit (4 Kbytes) of EEPROM

Page size: 32 bytes

Write

Byte Write within 5 ms

Page Write within 5 ms

Single supply voltage: 2.5 V to 5.5 V

Operating temperature range: from -40 °C up to +125 °C

Random and sequential Read modes

Write protect of the whole memory array

Enhanced ESD/Latch-Up protection

More than 1 million Write cycles

More than 40-year data retention

Packages

RoHS compliant and halogen-free (ECOPACK®)

TSSOP8 (DW) 169 mil width

SO8 (MN) 150 mil width

February 2012

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Contents

M24C32-125

 

 

Contents

1

Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

6

2

Signal description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

7

2.1 Serial Clock (SCL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2.2 Serial Data (SDA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2.3 Chip Enable (E2, E1, E0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2.4 Write Control (WC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2.5 VSS (ground) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.6 Supply voltage (VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

2.6.1 Operating supply voltage VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

2.6.2 Power-up conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.6.3 Device reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.6.4 Power-down conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

3

Memory organization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

. 9

4

Device operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

10

 

4.1

Start condition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

11

 

4.2

Stop condition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

11

 

4.3

Acknowledge bit (ACK) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

11

 

4.4

Data input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

11

 

4.5

Memory addressing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

11

5

Instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

13

 

5.1

Write operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

13

5.1.1 Byte Write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 5.1.2 Page Write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 5.1.3 Minimizing Write delays by polling on ACK . . . . . . . . . . . . . . . . . . . . . . 16

5.2 Read operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

5.2.1 Random Address Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 5.2.2 Current Address Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 5.2.3 Sequential Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 5.2.4 Acknowledge in Read mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

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Contents

6

Initial delivery state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

. . . . 18

7

Maximum rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

. . . . 19

8

DC and AC parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

. . . . 20

9

Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

. . . . 25

10

Part numbering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

. . . . 27

11

Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

. . . . 28

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List of tables

M24C32-125

 

 

List of tables

Table 1. Signal names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Table 2. Device select code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Table 3. Operating modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Table 4. Most significant address byte . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Table 5. Least significant address byte . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Table 6. Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Table 7. Operating conditions (voltage range W) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Table 8. AC measurement conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Table 9. Input parameters. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Table 10. Memory cell characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Table 11. DC characteristics (M24C32-W, device grade 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Table 12. 400 kHz AC characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Table 13. TSSOP8 – 8-lead thin shrink small outline, package mechanical data. . . . . . . . . . . . . . . . 25 Table 14. SO8N – 8 lead plastic small outline, 150 mils body width, package data . . . . . . . . . . . . . . 26 Table 15. Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 Table 16. Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

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List of figures

 

 

List of figures

Figure 1. Logic diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Figure 2. 8-pin package connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Figure 3. Device select code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Figure 4. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Figure 5. I2C bus protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Figure 6. Write mode sequences with WC = 0 (data write enabled) . . . . . . . . . . . . . . . . . . . . . . . . . 14 Figure 7. Write mode sequences with WC = 1 (data write inhibited) . . . . . . . . . . . . . . . . . . . . . . . . . 15 Figure 8. Write cycle polling flowchart using ACK . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Figure 9. Read mode sequences . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Figure 10. AC measurement I/O waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

Figure 11. Maximum Rbus value versus bus parasitic capacitance (Cbus) for

an I2C bus at maximum frequency fC = 400 kHz . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Figure 12. AC waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

Figure 13. TSSOP8 – 8-lead thin shrink small outline, package outline . . . . . . . . . . . . . . . . . . . . . . . 25 Figure 14. SO8N – 8 lead plastic small outline, 150 mils body width, package outline . . . . . . . . . . . . 26

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Description

M24C32-125

 

 

1 Description

The M24C32 is a 32-Kbit I2C-compatible EEPROM (Electrically Erasable PROgrammable Memory) organized as 4 K × 8 bits.

This I2C EEPROM can operate with a supply voltage from 2.5 V up to 5.5 V over an ambient temperature range of -40 °C / 125 °C.

The device is compliant with the Automotive standard AEC-Q100 grade 1.

Figure 1. Logic diagram

 

6##

 

 

% %

3$!

 

- XXX

3#,

 

7#

 

 

 

 

633

 

 

 

 

 

 

!) F

Table 1.

Signal names

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Signal name

 

 

 

 

Function

Direction

 

 

 

 

 

 

 

 

 

 

 

 

 

 

E2, E1, E0

 

Chip Enable

 

 

 

 

 

 

Input

 

 

 

 

 

 

 

 

 

 

 

 

 

 

SDA

 

Serial Data

 

 

 

 

 

 

I/O

 

 

 

 

 

 

 

 

 

 

 

 

 

 

SCL

 

Serial Clock

 

 

 

 

 

 

Input

 

 

 

 

 

 

 

 

 

 

 

 

 

 

WC

 

Write Control

 

 

 

 

 

 

Input

 

 

 

 

 

 

 

 

 

 

 

 

 

 

VCC

 

Supply voltage

 

 

 

 

 

 

 

VSS

 

Ground

 

 

 

 

 

 

 

Figure 2.

8-pin package connections

 

 

 

 

 

 

 

 

%

 

 

 

 

 

 

 

6##

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

%

 

 

 

 

 

7#

 

 

 

 

 

 

 

%

 

 

 

 

 

 

3#,

 

 

 

 

 

 

 

633

 

 

 

3$!

!) F

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

1. See Section 9: Package mechanical data for package dimensions, and how to identify pin 1.

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Signal description

 

 

2 Signal description

2.1Serial Clock (SCL)

This input signal is used to strobe all data in and out of the device. In applications where this signal is used by slave devices to synchronize the bus to a slower clock, the bus master must have an open drain output, and a pull-up resistor must be connected from Serial Clock (SCL) to VCC. (Figure 11 indicates how to calculate the value of the pull-up resistor). In most applications, though, this method of synchronization is not employed, and so the pull-up resistor is not necessary, provided that the bus master has a push-pull (rather than open drain) output.

2.2Serial Data (SDA)

This bidirectional signal is used to transfer data in or out of the device. It is an open drain output that may be wire-OR’ed with other open drain or open collector signals on the bus. A pull up resistor must be connected from Serial Data (SDA) to VCC. (Figure 11 indicates how to calculate the value of the pull-up resistor).

2.3Chip Enable (E2, E1, E0)

(E2,E1,E0) input signals are used to set the value that is to be looked for on the three least significant bits (b3, b2, b1) of the 7-bit device select code (see Table 2). These inputs must be tied to VCC or VSS, as shown in Figure 3. When not connected (left floating), these inputs are read as low (0).

Figure 3. Device select code

VCC

VCC

M24xxx M24xxx

Ei

 

 

Ei

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

VSS

 

VSS

Ai12806

2.4Write Control (WC)

This input signal is useful for protecting the entire contents of the memory from inadvertent write operations. Write operations are disabled to the entire memory array when Write Control (WC) is driven high. Write operations are enabled when Write Control (WC) is either driven low or left floating.

When Write Control (WC) is driven high, device select and address bytes are acknowledged, Data bytes are not acknowledged.

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Signal description

M24C32-125

 

 

2.5VSS (ground)

VSS is the reference for the VCC supply voltage.

2.6Supply voltage (VCC)

2.6.1Operating supply voltage VCC

Prior to selecting the memory and issuing instructions to it, a valid and stable VCC voltage within the specified [VCC(min), VCC(max)] range must be applied (see Operating conditions in Section 8: DC and AC parameters). In order to secure a stable DC supply voltage, it is recommended to decouple the VCC line with a suitable capacitor (usually of the order of 10 nF to 100 nF) close to the VCC/VSS package pins.

This voltage must remain stable and valid until the end of the transmission of the instruction and, for a write instruction, until the completion of the internal write cycle (tW).

2.6.2Power-up conditions

The VCC voltage has to rise continuously from 0 V up to the minimum VCC operating voltage (see Operating conditions in Section 8: DC and AC parameters) and the rise time must not vary faster than 1 V/µs.

2.6.3Device reset

In order to prevent inadvertent write operations during power-up, a power-on-reset (POR) circuit is included.

At power-up, the device does not respond to any instruction until VCC has reached the internal reset threshold voltage. This threshold is lower than the minimum VCC operating voltage (see Operating conditions in Section 8: DC and AC parameters). When VCC passes over the POR threshold, the device is reset and enters the Standby Power mode; however, the device must not be accessed until VCC reaches a valid and stable DC voltage within the specified [VCC(min), VCC(max)] range (see Operating conditions in Section 8: DC and AC parameters).

In a similar way, during power-down (continuous decrease in VCC), the device must not be accessed when VCC drops below VCC(min). When VCC drops below the power-on-reset threshold voltage, the device stops responding to any instruction sent to it.

2.6.4Power-down conditions

During power-down (continuous decrease in VCC), the device must be in the Standby Power mode (mode reached after decoding a Stop condition, assuming that is there is no internal write cycle in progress).

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M24C32-125

Memory organization

 

 

3 Memory organization

The memory is organized as shown in Figure 4.

Figure 4. Block diagram

WC

 

E0

High Voltage

Control Logic

Generator

E1

 

E2

 

SCL

 

SDA

I/O Shift Register

Address Register

Data

and Counter

Register

 

Y Decoder

 

1 Page

 

X Decoder

 

AI06899

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