ST’s family of MEMS sensor modules leverages
the robust and mature manufacturing processes
already used for the production of micromachined
accelerometers.
The various sensing elements are manufactured
using specialized micromachining processes,
while the IC interfaces are developed using a
CMOS technology that allows the design of a
dedicated circuit which is trimmed to better match
the sensing element characteristics.
The LSM330DLC has dynamically user-
Application
■ GPS navigation systems
■ Impact recognition and logging
■ Gaming and virtual reality input devices
■ Motion activated functions
■ Intelligent power saving for handheld devices
■ Vibration monitoring and compensation
■ Free-fall detection
■ 6D orientation detection
selectable full scale acceleration range of
±2 g/±4 g/±8 g/±16 g and angular rate of
±250/±500/±2000 deg/sec.
The accelerometer and gyroscope sensors can
be either activated or separately put in Low
power/Power-down mode for applications
optimized for power saving.
The LSM330DLC is available in a plastic land grid
array (LGA) package.
Description
The LSM330DLC is a system-in-package
featuring a 3D digital accelerometer and a 3D
digital gyroscope.
Table 1.Device summary
Part numberTemperature range [°C]PackagePacking
LSM330DLC-40 to +85
LSM330DLCTR-40 to +85Tape and reel
LGA-28L (4x5x1.1 mm)
Tr ay
September 2011Doc ID 022162 Rev 11/67
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to
change without notice.
2. Verified by wafer level test and measurement of initial offset and sensitivity.
3. Typical zero-g level offset value after MSL3 preconditioning.
4. Offset can be eliminated by enabling the built-in high-pass filter.
H
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LSM330DLCModule specifications
2.2 Electrical characteristics
@ Vdd = 3 V, T = 25 °C unless otherwise noted
Table 4.Electrical characteristics
SymbolParameterTest conditionsMin.Typ.
VddSupply voltage2.43.6V
Vdd_IOPower supply for I/O1.71Vdd+0.1V
LA_Idd
LA_IddLowP
LA_IddPdn
G_Idd
Accelerometer current
consumption in Normal mode
Accelerometer current
consumption in Low power
mode
Accelerometer current
consumption in Power-down
mode
Gyroscope current
consumption in Normal mode
ODR = 50 Hz11
ODR = 1 Hz2
ODR = 50 Hz6µA
(1)
0.5µA
6.1mA
Max.Unit
µA
G_IddLowP
G_IddPdn
VIHDigital high level input voltage0.8*Vdd_IOV
VILDigital low level input voltage0.2*Vdd_IOV
VOHHigh level output voltage0.9*Vdd_IOV
VOLLow level output voltage0.1*Vdd_IOV
TopOperating temperature range-40+85
1. Typical specifications are not guaranteed.
2. Sleep mode introduces a faster turn-on time compared to Power-down mode.
Gyroscope supply current
in Sleep mode
Gyroscope current
consumption in Power-down
mode
(2)
2mA
5µA
°C
Doc ID 022162 Rev 115/67
Module specificationsLSM330DLC
2.3 Temperature sensor characteristics
@ Vdd = 3V, T = 25 °C unless otherwise noted
Table 5.Electrical characteristics
SymbolParameterTest conditionMin.Typ.
(b)
(1)
Max.Unit
TSDr
TODRTemperature refresh rate1Hz
Top Operating temperature range-40+85°C
1. Typical specifications are not guaranteed.
Temperature sensor output
change vs. temperature
-1°C/digit
-
b. The product is factory calibrated at 3.0 V.
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LSM330DLCModule specifications
t
t
t
t
t
t
t
t
2.4 Communication interface characteristics
2.4.1 SPI - serial peripheral interface
Subject to general operating conditions for Vdd and TOP.
Table 6.SPI slave timing values
(1)
Val u e
SymbolParameter
MinMax
tc(SPC)SPI clock cycle100ns
fc(SPC)SPI clock frequency10MHz
tsu(CS)CS setup time6
th(CS)CS hold time8
tsu(SI)SDI input setup time5
th(SI)SDI input hold time15
tv(SO)SDO valid output time50
th(SO)SDO output hold time9
tdis(SO)SDO output disable time50
Unit
ns
1. Values are guaranteed at 10 MHz clock frequency for SPI with both 4 and 3 wires, based on characterization results. Not
tested in production.
(c)(d)
Figure 3.SPI slave timing diagram
CS
(3)
su(CS)
SPC
(3)
h(SI)
MSB IN
MSB OUT
SDI
SDO
su(SI)
(3)
(3)
v(SO)
c(SPC)
h(SO)
h(CS)
LSB IN
LSB OUT
dis(SO)
3. Data on CS, SPC, SDI and SDO refer to pins: CS_A, CS_G, SCL_A/G, SDA_A/G, SDO_A / SDO_G.
(3)
(3)
(3)
(3)
c. The SDO output line features an internal pull-up.
d. Measurement points are done at 0.2·Vdd_IO and 0.8·Vdd_IO, for both input and output ports.
Doc ID 022162 Rev 117/67
Module specificationsLSM330DLC
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W
W
W
W
W
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2.4.2 I2C - inter IC control interface
Subject to general operating conditions for Vdd and TOP.
Table 7.I2C slave timing values
SymbolParameter
(1)
I2C standard mode
(1)
I2C fast mode
MinMaxMinMax
(1)
Unit
f
(SCL)
t
w(SCLL)
t
w(SCLH)
t
su(SDA)
t
h(SDA)
t
r(SDA) tr(SCL)
t
f(SDA) tf(SCL)
t
h(ST)
t
su(SR)
t
su(SP)
t
w(SP:SR)
1. SCL (SCL_A/G pin), SDA (SDA_A/G pin)
2. Cb = total capacitance of one bus line, in pF
Figure 4.I
SCL clock frequency01000400KHz
SCL clock low time4.71.3
SCL clock high time4.00.6
SDA setup time250100ns
SDA data hold time0.013.4500.9µs
SDA and SCL rise time1000
SDA and SCL fall time300
START condition hold time40.6
Repeated START condition
setup time
STOP condition setup time40.6
Bus free time between STOP
and START condition
2
C slave timing diagram
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(e)
20 + 0.1C
20 + 0.1C
4.70.6
4.71.3
µs
(2)
b
(2)
b
300
ns
300
µs
5(3($7('
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e. Measurement points are done at 0.2·Vdd_IO and 0.8·Vdd_IO, for both ports
Z6&/+
U6&/
I6&/
18/67Doc ID 022162 Rev 1
VX65
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67$57
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LSM330DLCModule specifications
2.5 Absolute maximum ratings
Stresses above those listed as “absolute maximum ratings” may cause permanent damage
to the device. This is a stress rating only and functional operation of the device under these
conditions is not implied. Exposure to maximum rating conditions for extended periods may
affect device reliability.
Table 8.Absolute maximum ratings
SymbolRatingsMaximum valueUnit
VddSupply voltage-0.3 to 4.8V
Vdd_IOI/O pins supply voltage-0.3 to 4.8V
Input voltage on any control pin (SCL_A/G, SDA_A/G,
SDO_A, SDO_G, CS_A, CS_G, DEN_G)
Acceleration (any axis, powered, Vdd = 3 V)
Acceleration (any axis, unpowered)
Operating temperature range-40 to +85°C
OP
Storage temperature range-40 to +125°C
A
A
T
T
Vin
POW
UNP
STG
ESDElectrostatic discharge protection2 (HBM)kV
1. Supply voltage on any pin should never exceed 4.8 V.
(1)
-0.3 to Vdd_IO +0.3V
3000 g for 0.5 ms
10000 g for 0.1 ms
3000 g for 0.5 ms
10000 g for 0.1 ms
This is a mechanical shock sensitive device, improper handling can cause permanent
damage to the part.
This is an ESD sensitive device, improper handling can cause permanent damage to
the part.
Doc ID 022162 Rev 119/67
TerminologyLSM330DLC
3 Terminology
3.1 Sensitivity
Linear acceleration sensitivity can be determined e.g. by applying 1 g acceleration to the
device. Because the sensor can measure DC accelerations, this can be done easily by
pointing the selected axis towards the ground, noting the output value, rotating the sensor
180 degrees (pointing towards the sky) and noting the output value again. By doing so, ±1 g
acceleration is applied to the sensor. Subtracting the larger output value from the smaller
one, and dividing the result by 2, leads to the actual sensitivity of the sensor. This value
changes very little over temperature and over time. The sensitivity tolerance describes the
range of sensitivities of a large number of sensors.
Angular Rate Sensitivity describes the angular rate gain of the sensor and can be
determined by applying a defined angular velocity to it. This value changes very little over
temperature and also very little over time.
3.2 Zero-g level
Linear acceleration zero-g level offset (TyOff) describes the deviation of an actual output
signal from the ideal output signal if no acceleration is present. A sensor in a steady state on
a horizontal surface will measure 0 g on both the X axis and Y axes, whereas the Z axis will
measure 1 g. Ideally, the output is in the middle of the dynamic range of the sensor (content
of OUT registers 00h, data expressed as 2’s complement number). A deviation from the
ideal value in this case is called zero-g offset.
Offset is to some extent a result of stress to MEMS sensor and therefore the offset can
slightly change after mounting the sensor onto a printed circuit board or exposing it to
extensive mechanical stress. Offset changes little over temperature, see “Linear
acceleration zero-g level change vs. temperature” in Ta bl e 3 . The zero-g level tolerance
(TyOff) describes the standard deviation of the range of zero-g levels of a group of sensors.
Angular rate zero-rate level describes the actual output value if there is no angular rate
present. zero-rate level of precise MEMS sensors is, to some extent, a result of stress to the
sensor and therefore zero-rate level can slightly change after mounting the sensor onto a
printed circuit board or after exposing it to extensive mechanical stress. This value changes
very little over temperature and over time.
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LSM330DLCFunctionality
4 Functionality
The LSM330DLC is a system-in-package featuring a 3D digital accelerometer and a 3D
digital gyroscope.
The device includes specific sensing elements and two IC interfaces capable to measuring
both the acceleration and angular rate applied to the module and to provide a signal to
external applications through an SPI/I
The various sensing elements are manufactured using specialized micromachining
processes, while the IC interfaces are developed using a CMOS technology that allows the
design of a dedicated circuit which is trimmed to better match the sensing element
characteristics.
The LSM330DLC may also be configured to generate an inertial wakeup and free-fall
interrupt signal according to a programmed acceleration event along the enabled axes.
4.1 Normal mode, Low power mode
The LSM330DLC provides two different operating modes: Normal mode and Low power
mode. Normal mode guarantees high resolution, while Low power mode further reduces
current consumption.
2
C serial interface.
The table below summarizes how to select the operating mode and the corresponding
characteristics.
Table 9.Operating mode selection
Operating mode
Low power mode (8-bit)10ODR/21
Normal mode (12-bit)01ODR/97/ODR(kHz)
CTRL_REG1[3]
(LPen bit)
4.1.1 Self-test
Self-test allows the checking of sensor functionality without moving it. The self-test function
is off when the self-test bit (ST) is programmed to ‘0’. When the self-test bit is programmed
to ‘1’ an actuation force is applied to the sensor, simulating a definite input acceleration. In
this case, the sensor outputs exhibit a change in their DC levels which are related to the
selected full scale through the device sensitivity. When self-test is activated, the device
output level is given by the algebraic sum of the signals produced by the acceleration acting
on the sensor and by the electrostatic test-force. If the output signals change within the
amplitude specified in Ta bl e 3 , then the sensor is working properly and the parameters of
the interface chip are within the defined specifications.
4.1.2 6D/4D orientation detection
CTRL_REG4[3]
(HR bit)
BW [Hz]Turn-on time [ms]
The LSM330DLC includes 6D/4D orientation detection. In this configuration the interrupt is
generated when the device is stable in a known direction. In 4D configuration, Z axis
position detection is disabled.
Doc ID 022162 Rev 121/67
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