ST’s family of modules leverages a robust and
mature manufacturing process already used for
the production of micromachined accelerometers.
The various sensing elements are manufactured
using specialized micromachining processes,
while the IC interfaces are based on CMOS
technology that allows designing a dedicated
circuit which is trimmed to better match the
sensing element characteristics.
The LSM330DL has a dynamic, user-selectable
full-scale acceleration range of ±2g/±4g/±8g/±16g
and an angular rate of ±250/±500/±2000 deg/sec.
The accelerometer and gyroscope sensors can
be either activated or put in low-power / powerdown mode separately for power-saving
optimized applications. The LSM330DL is
available in a plastic land grid array (LGA)
package.
Several years ago ST successfully pioneered the
use of this package for accelerometers. Today, ST
has the broadest manufacturing capability in the
world and unrivalled expertise for the production
of sensors in a plastic LGA package.
Description
The LSM330DL is a system-in-package featuring
a 3D digital accelerometer and a 3D digital
gyroscope.
Table 1.Device summary
Part numberTemperature range [°C]PackagePacking
LSM330DL-40 to +85LGA-28Tray
LSM330DLTR-40 to +85LGA-28Tape & reel
July 2011Doc ID 022018 Rev 11/54
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to
change without notice.
C serial data (SDA)
SPI serial data input (SDI)
3-wire interface serial data output (SDO)
Accelerometer:
SPI serial data output (SDO)
2
I
C least significant bit of the device address (SA0)
SDO_A
SCL_A
DRDY_G/INT2_G
Res
LSM330DL
(BOTTOM VIEW)
Res
Vdd
Res
Res
INT1_G
INT1_A
SDO_G
FILTVDD
FILTIN Y
Res
INT2_A
CS_A
CS_G
SDA/SDI_G
10
Res
11
Vdd_IO_G
SCL_G
Res
14
15
Vdd
Res
AM09256V1
Accelerometer:
4SCL_A
2
I
C serial clock (SCL)
SPI serial port clock (SPC)
5DRDY_G/INT2_GGyroscope data ready/interrupt signal 2
6INT1_AAccelerometer interrupt signal
Gyroscope:
7SDO_G
SPI serial data output (SDO)
I2C least significant bit of the device address (SA0)
8INT2_AAccelerometer interrupt signal
Gyroscope:
2
I
9SDA/SDI_G
C serial data (SDA)
SPI serial data input (SDI)
3-wire interface serial data output (SDO)
10/54Doc ID 022018 Rev 1
LSM330DLBlock diagram and pin description
Table 2.Pin description (continued)
Pin#NameFunction
Gyroscope:
10CS_G
11ResReserved, connect to GND
12Vdd_IO_GGyroscope power supply for I/O pins
13SCL_G
14ResReserved connect to GND
15VddPower supply
16ResReserved, connect to GND
17CS_A
18ResReserved, connect to GND
SPI enable
2
I
C/SPI mode selection (1: SPI idle mode / I2C communication
enabled; 0: SPI communication mode / I
2
C disabled)
Gyroscope:
2
C serial clock (SCL)
I
SPI serial port clock (SPC)
Accelerometer:
SPI enable
2
C/SPI mode selection (1: SPI idle mode / I2C communication
I
enabled; 0: SPI communication mode / I
2
C disabled)
19ResReserved, connect to GND
20ResReserved, connect to GND
21INT1_GGyroscope interrupt signal 1
22VddPower supply
23ResReserved, connect to GND
24ResReserved, connect to GND
25GND0 V power supply
26VCONTPLL filter connection
27ResReserved, connect to GND
28Vdd_IO_AAccelerometer power supply for I/O pins
Doc ID 022018 Rev 111/54
Module specificationsLSM330DL
zHz
2 Module specifications
2.1 Mechanical characteristics
The values given in the following table are for the conditions Vdd = 3 V, T = 25 °C unless
otherwise noted.
Table 3.Mechanical characteristics
SymbolParameterTest conditionsMin. Typ.
LA_FS
G_FSAngular rate measurement range
LA_SoLinear acceleration sensitivity
G_SoAngular rate sensitivity
LA_So
G_SoAngular rate sensitivity change vs. temp. from -40 to +85°C±2%
LA_TyOffTypical zero-
G_TyOffTypical zero-rate level
LA_TCOff Zero-
G_TCOffZero-rate level change vs. temperature
AnAcceleration noise density
RnRate noise densityFS bit set to 00, BW = 50 Hz0.03dps/
TopOperating temperature range-40+85°C
1. Typical specifications are not guaranteed.
2. Verified by wafer level test and measurement of initial offset and sensitivity.
3. Typical zero-g level offset value after MSL3 preconditioning.
4. Offset can be eliminated by enabling the built-in high-pass filter.
Linear acceleration
measurement range
Linear acceleration
Sensitivity change vs. temperature
g level change vs. temperatureMax delta from 25 °C±0.5mg/°C
(a)
(2)
g level offset accuracy
(4)
(2)
(1)
FS bit set to 00±2
FS bit set to 01±4
FS bit set to 10±8
FS bit set to 11±16
FS bit set to 00±250
FS bit set to 10±2000
FS bit set to 001
FS bit set to 012
FS bit set to 104
FS bit set to 1112
FS bit set to 008.75
FS bit set to 0117.5
FS bit set to 1070
FS bit set to 00±0.05%/°C
(3)
FS bit set to 00±60mg
FS bit set to 0010LSb
FS bit set to 00
from -40 to +85°C
FS bit set to 00, normal
mode, ODR bit set to 1001
±0.03dps/°C
220µ
Max.Unit
mg/digit
mdps/
g/
g
dpsFS bit set to 01±500
digit
H
a. The product is factory calibrated at 3 V. The operational power supply range is from 2.4 V to 3.6 V.
12/54Doc ID 022018 Rev 1
LSM330DLModule specifications
2.2 Electrical characteristics
The values given in the following table are for the conditions Vdd = 3 V, T = 25 °C unless
otherwise noted.
Table 4.Electrical characteristics
SymbolParameterTest conditionsMin.Typ.
VddSupply voltage2.43.6V
Vdd_IOPower supply for I/O1.71Vdd+0.1V
LA_Idd
LA_IddLowP
LA current consumption in
normal mode
LA current consumption in
low-power mode
ODR = 50 Hz11
ODR = 1 Hz2
ODR = 50 Hz6µA
(1)
Max.Unit
µA
LA_IddPdn
G_Idd
G_IddLowP
G_IddPdn
VIHDigital high-level input voltage0.8*Vdd_IOV
VILDigital low-level input voltage0.2*Vdd_IOV
VOHHigh-level output voltage0.9*Vdd_IOV
VOLLow-level output voltage0.1*Vdd_IOV
TopOperating temperature range-40+85°C
1. Typical specifications are not guaranteed.
2. Sleep mode introduces a faster turn-on time compared to power-down mode.
LA current consumption in
power-down mode
AR current consumption in
normal mode
AR supply current in sleep mode
AR current consumption in
power-down mode
T = 25 °C0.5µA
6.1mA
(2)
T = 25 °C5µA
1.5mA
2.3 Temperature sensor characteristics
The values given in the following table are for the conditions Vdd = 3.0 V, T=25 °C, unless
otherwise noted.
Table 5.Temperature sensor characteristics
SymbolParameterTest conditionMin.Typ.
TSDr
TODRTemperature refresh rate1Hz
Top Operating temperature range-40+85°C
1. The product is factory calibrated at 3.0 V.
2. Typical specifications are not guaranteed.
Temperature sensor output
change vs. temperature
Doc ID 022018 Rev 113/54
(1)
-
(2)
-1°C/digit
Max.Unit
Module specificationsLSM330DL
t
t
t
t
t
t
t
t
2.4 Communication interface characteristics
2.4.1 SPI - serial peripheral interface
The values given in the following table are subject to the general operating conditions for
Vdd and T
Table 6.SPI slave timing values
SymbolParameter
OP
.
(1)
Val ue
Unit
MinMax
t
c(SPC)
f
c(SPC)
t
su(CS)
t
h(CS)
t
su(SI)
t
h(SI)
t
v(SO)
t
h(SO)
t
dis(SO)
1. Values are guaranteed at 10 MHz clock frequency for SPI with both 4 and 3 wires, based on characterization results, not
tested in production.
Figure 3.SPI slave timing diagram
CS
(3)
SPC
(3)
SPI clock cycle100ns
SPI clock frequency10MHz
CS setup time6
CS hold time8
SDI input setup time5
SDI input hold time15
SDO valid output time50
SDO output hold time9
SDO output disable time50
(b)
su(CS)
c(SPC)
h(CS)
ns
(3)
(3)
MSB IN
MSB OUT
h(SI)
v(SO)
LSB IN
h(SO)
LSB OUT
su(SI)
(3)
SDI
(3)
SDO
3. Data on CS, SPC, SDI and SDO concern the following pins: CS_A/G, SCL_A/G, SDA/SDI_A/G, SDO_A/G
b. Measurement points are done at 0.2·Vdd_IO and 0.8·Vdd_IO, for both input and output ports.
14/54Doc ID 022018 Rev 1
(3)
dis(SO)
(3)
LSM330DLModule specifications
t
t
t
t
t
t
t
t
t
t
t
t
2.4.2 I2C - inter-IC control interface
The values given in the following table are subject to the general operating conditions for
Vdd and T
Table 7.I2C slave timing values
SymbolParameter
OP
.
(1)
I2C standard mode
I2C fast mode
MinMaxMinMax
(1)
Unit
f
(SCL)
t
w(SCLL)
t
w(SCLH)
t
su(SDA)
t
h(SDA)
t
r(SDA) tr(SCL)
t
f(SDA) tf(SCL)
t
h(ST)
t
su(SR)
t
su(SP)
t
w(SP:SR)
SCL clock frequency01000400kHz
SCL clock low time4.71.3
SCL clock high time4.00.6
SDA setup time250100ns
SDA data hold time0.013.4500.9µs
SDA and SCL rise time1000
SDA and SCL fall time300
START condition hold time40.6
Repeated START condition setup time4.70.6
STOP condition setup time40.6
Bus free time between STOP and
START condition
1. SCL (SCL_A/G pin), SDA (SDA_A/G pin)
Figure 4.I2C slave timing diagram
START
(3)
20 + 0.1C
20 + 0.1C
4.71.3
µs
(2)
b
(2)
b
300
ns
300
µs
REPEATED
START
SDA
f(SDA)
r(SDA)
su(SDA)
h(SDA)
SCL
w(SCLL)
h(ST)
1. Data based on standard I
w(SCLH)
2
C protocol requirement, not tested in production.
r(SCL)
f(SCL)
2 Cb = total capacitance of one bus line, in pF
3. Measurement points are done at 0.2·Vdd_IO and 0.8·Vdd_IO, for both ports.
Doc ID 022018 Rev 115/54
su(SR)
su(SP)
w(SP:SR)
START
STOP
AM09238V1
Module specificationsLSM330DL
2.5 Absolute maximum ratings
Stresses above those listed as “absolute maximum ratings” may cause permanent damage
to the device. This is a stress rating only and functional operation of the device under these
conditions is not implied. Exposure to maximum rating conditions for extended periods may
affect device reliability.
Table 8.Absolute maximum ratings
SymbolRatingsMaximum valueUnit
VddSupply voltage-0.3 to 4.8V
Vdd_IOI/O pins supply voltage-0.3 to 4.8V
Input voltage on any control pin
(SCL_A/G, SDA/SDI_A/G, SDO_A/G, CS_A/G)
Acceleration (any axis, powered, Vdd = 3 V)
-0.3 to Vdd_IO +0.3V
3000 g for 0.5 ms
10000 g for 0.1 ms
A
Vin
POW
A
T
T
UNP
STG
Acceleration (any axis, unpowered)
Operating temperature range-40 to +85°C
OP
Storage temperature range-40 to +125°C
ESDElectrostatic discharge protection2 (HBM)kV
Note:Supply voltage on any pin should never exceed 4.8 V
This is a device sensitive to mechanical shock, improper handling can cause
permanent damage to the part
This is an ESD-sensitive device, improper handling can cause permanent damage to
the part
3000 g for 0.5 ms
10000 g for 0.1 ms
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LSM330DLModule specifications
2.6 Terminology
2.6.1 Sensitivity
Linear acceleration sensitivity can be determined by applying 1 g acceleration to the device.
As the sensor can measure DC accelerations, this can be done easily by pointing the axis of
interest towards the center of the Earth, noting the output value, rotating the sensor by 180
degrees (point to the sky) and then noting the output value again. By doing so, ±1 g
acceleration is applied to the sensor. Subtracting the larger output value from the smaller
one, and dividing the result by 2, leads to the actual sensitivity of the sensor. This value
changes very little over temperature and also very little over time. The sensitivity tolerance
describes the range of sensitivities of a large population of sensors.
Angular rate sensitivity describes the angular rate gain of the sensor and can be determined
by applying a defined angular velocity to it. This value changes very little over temperature
and also very little over time.
2.6.2 Zero level
Linear acceleration zero-g level offset (TyOff) describes the deviation of an actual output
signal from the ideal output signal if no acceleration is present. A sensor in a steady state on
a horizontal surface will measure 0 g on the X-axis and 0 g on the Y-axis whereas the Z-axis
will measure 1 g. The output is ideally in the middle of the dynamic range of the sensor
(content of OUT registers 00h, data expressed as 2’s complement number). A deviation
from the ideal value in this case is called zero-g offset. Offset is to some extent a result of
stress to the MEMS sensor and therefore the offset can slightly change after mounting the
sensor onto a printed circuit board or exposing it to extensive mechanical stress. Offset
changes little over temperature, see “Zero-g level change vs. temperature” (refer toTable 3).
The zero-g level tolerance (TyOff) describes the standard deviation of the range of zero-g
levels of a population of sensors.
The angular rate zero-rate level describes the actual output value if there is no angular rate
present. Zero-rate level of precise MEMS sensors is, to some extent, a result of stress to the
sensor and therefore the zero-rate level can slightly change after mounting the sensor onto
a printed circuit board or after exposing it to extensive mechanical stress. This value
changes very little over temperature and also very little over time.
Doc ID 022018 Rev 117/54
FunctionalityLSM330DL
3 Functionality
The LSM330DL is a system-in-package featuring a 3D digital accelerometer and a 3D digital
gyroscope.
The complete device includes specific sensing elements and two IC interfaces able to
measure both the acceleration and angular rate applied to the module and to provide a
signal to the external world through an SPI/I
The various sensing elements are manufactured using specialized micromachining
processes, while the IC interfaces are based on CMOS technology that allows designing a
dedicated circuit which is trimmed to better match the sensing element characteristics.
The LSM330DL may also be configured to generate an inertial wake-up and free-fall
interrupt signal according to a programmed acceleration event along the enabled axes.
3.1 Factory calibration
The IC interface is factory calibrated for sensitivity and zero level. The trimming values are
stored inside the device in non-volatile memory. Any time the device is turned on, the
trimming parameters are downloaded into the registers to be used duringnormal operation.
This allows using the device without further calibration.
2
C serial interface.
18/54Doc ID 022018 Rev 1
LSM330DLApplication hints
4 Application hints
Figure 5.LSM330DL electrical connections
Vdd_IO
C5
GND
CS_G
10
Res
11
Vdd_IO_G
SCL_G
Res
14
15
Vdd
Vdd
Digital signal from/to signal controller.Signals levels are defined by proper selection of Vdd
Table 9.Part list
Component Typical value
Reserved pins have to be connected to GND
SDA/SDI_G
INT2_A
LSM330DL
(TOP VIEW)
FILTVDD
FILTIN Y
CS_A
Res
DRDY_G
SDO_G
INT1_A
SCL_A
Res
Res
Res
INT1_G
SDO_A
Vdd
SDA/SDI_A
Res
1
28
25
24
Res
Res
Vdd_IO_A
Res
VCONT
GND
C4
C3
Vdd_IO
GND
Z
DIRECTION OF
DETECTABLE
ACCELERATIONS
Z
DIRECTION OF
C1
R2C2
DETECTABLE
ANGULAR RATE
Y
1
X
+Ω
+Ω
Y
z
1
Y
+Ω
X
X
GND
AM09287v1
C1 10 nF
C2 470 nF
C3 10 µF
C4
C5
R210 kOhm
4.1 External capacitors
The device core is supplied through the Vdd line. Power supply decoupling capacitors
(C4=100 nF ceramic, C3=10 µF Al) should be placed as near as possible to the supply pin
of the device (common design practice).
All the voltage and ground supplies must be present at the same time to have proper
behavior of the IC (refer to Figure 5).
The functionality of the device and the measured acceleration/angular rate data is
selectable and accessible through the SPI/I
2
C interface.
100 nF
Doc ID 022018 Rev 119/54
Application hintsLSM330DL
The functions, the threshold and the timing of the two interrupt pins for each sensor can be
completely programmed by the user though the SPI/I
4.2 Soldering information
The LGA package is compliant with the ECOPACK®, RoHS and “Green” standards.
It is qualified for soldering heat resistance according to JEDEC J-STD-020D.
Leave “Pin 1 Indicator” unconnected during soldering.
The landing pattern and soldering recommendations are available at www.st.com/mems
2
C interface.
.
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LSM330DLDigital interfaces
5 Digital interfaces
The registers embedded inside the LSM330DL may be accessed through both the I2C and
SPI serial interfaces. The latter may be SW configured to operate either in 3-wire or 4-wire
interface mode.
To select/exploit the I
Table 10.Serial interface pin description
Pin namePin description
2
C interface, the CS line must be tied high (i.e. connected to Vdd_IO).
CS_A
CS_G
SCL_A
SCL_G
SDA/SDI_A
SDA/SDI_G
SDO_A
SDO_G
Linear acceleration SPI enable
Linear acceleration I
Angular rate SPI enable
Angular rate I
2
I
C serial clock (SCL)
SPI serial port clock (SPC)
2
C serial data (SDA)
I
SPI serial data input (SDI)
3-wire interface serial data output (SDO)
I2C least significant bit of the device address (SA0)
SPI serial data output (SDO)
5.1 I2C serial interface
The LSM330DL I2C is a bus slave. The I2C is employed to write data into the registers
whose content can also be read back.
ReceiverThe device which receives data from the bus
Master
SlaveThe device addressed by the master
There are two signals associated with the I
The device which initiates a transfer, generates clock signals and terminates a
transfer
2
C bus: the serial clock line (SCL) and the serial
data line (SDA). The latter is a bidirectional line used for sending and receiving the data
to/from the interface.
Doc ID 022018 Rev 121/54
Digital interfacesLSM330DL
5.1.1 I2C operation
The transaction on the bus is started through a START (ST) signal. A START condition is
defined as a HIGH to LOW transition on the data line while the SCL line is held HIGH. After
this has been transmitted by the Master, the bus is considered busy. The next byte of data
transmitted after the start condition contains the address of the slave in the first 7 bits and
the eighth bit tells whether the Master is receiving data from the slave or transmitting data to
the slave. When an address is sent, each device in the system compares the first seven bits
after a start condition with its own address. If they match, the device considers itself
addressed by the Master.
Data transfer with acknowledge is mandatory. The transmitter must release the SDA line
during the acknowledge pulse. The receiver must then pull the data line LOW so that it
remains stable low during the HIGH period of the acknowledge clock pulse. A receiver which
has been addressed is obliged to generate an acknowledge after each byte of data
received.
2
The I
C embedded inside the LSM330DL behaves like a slave device and the following
protocol must be adhered to. After the start condition (ST) a slave address is sent, once a
slave acknowledge (SAK) has been returned, an 8-bit sub-address (SUB) will be
transmitted: the 7 LSb represents the actual register address while the MSB enables the
address auto increment. If the MSb of the SUB field is ‘1’, the SUB (register address) will be
automatically increased to allow multiple data read/writes.
Table 12.Transfer when master is writing one byte to slave
MasterSTSAD + WSUBDATASP
SlaveSAKSAKSAK
Table 13.Transfer when master is writing multiple bytes to slave
MasterSTSAD + WSUBDATADATASP
SlaveSAKSAKSAKSAK
Table 14.Transfer when master is receiving (reading) one byte of data from slave
MasterSTSAD + WSUBSRSAD + RNMAKSP
SlaveSAKSAKSAKDATA
Table 15.Transfer when master is receiving (reading) multiple bytes of data from slave
Master ST SAD+WSUBSR SAD+RMAKMAKNMAK SP
SlaveSAKSAKSAKDATADATADATA
Data are transmitted in byte format (DATA). Each data transfer contains 8 bits. The number
of bytes transferred per transfer is unlimited. Data is transferred with the Most Significant bit
(MSb) first. If a receiver can’t receive another complete byte of data until it has performed
some other function, it can hold the clock line, SCL LOW to force the transmitter into a wait
22/54Doc ID 022018 Rev 1
LSM330DLDigital interfaces
state. Data transfer only continues when the receiver is ready for another byte and releases
the data line. If a slave receiver doesn’t acknowledge the slave address (i.e. it is not able to
receive because it is performing some real-time function), the data line must be left HIGH by
the slave. The Master can then abort the transfer. A LOW to HIGH transition on the SDA line
while the SCL line is HIGH is defined as a STOP condition. Each data transfer must be
terminated by the generation of a STOP (SP) condition.
In order to read multiple bytes, it is necessary to assert the most significant bit of the subaddress field. In other words, SUB(7) must be equal to 1 while SUB(6-0) represents the
address of first register to be read.
In the presented communication format MAK is Master acknowledge and NMAK is No
Master Acknowledge.
Default address
The SDO/SA0 pad can be used to modify the least significant bit of the device address. If
the SA0 pad is connected to a voltage supply, LSb is ‘1’ (ex. address 0011001b), else if the
SA0 pad is connected to ground, the LSb value is ‘0’ (ex address 0011000b).
The slave address is completed with a Read/Write bit. If the bit was ‘1’ (Read), a repeated
START (SR) condition will have to be issued after the two sub-address bytes. If the bit is ‘0’
(Write), the Master will transmit to the slave with the direction unchanged. Table 16 and
Table 17 explain how the SAD+Read/Write bit pattern is composed, listing all the possible
configurations.
Linear acceleration address: the default (factory) 7-bit slave address is
001100xb
Angular rate sensor: the default (factory) 7-bit slave address is 110100xb
Table 17.Angular rate SAD+Read/Write patterns
CommandSAD[6:1]SAD[0] = SA0R/WSAD+R/W
Read1101000111010001 (D1h)
Write1101000011010000 (D0h)
Read1101001111010011 (D3h)
Write1101001011010010 (D2h)
Doc ID 022018 Rev 123/54
Digital interfacesLSM330DL
5.2 SPI bus interface
The LSM330DL SPI is a bus slave. The SPI allows to write and read the registers of the
device.
The Serial Interface interacts with the outside world with 4 wires: CS, SPC, SDI and SDO
(SPC, SDI, SD0 are common).
Figure 6.Read and write protocol
CS
SPC
SDI
RW
MS
AD5 AD4 AD3 AD2 AD1 AD0
SDO
CS is the serial port enable and it is controlled by the SPI master. It goes low at the start of
the transmission and goes back high at the end. SPC is the serial port clock and it is
controlled by the SPI master. It is stopped high when CS is high (no transmission). SDI and SDO are, respectively, the serial port data input and output. These lines are driven at the
falling edge of SPC and should be captured at the rising edge of SPC.
DI7DI6DI5DI4DI3DI2DI1DI0
DO7DO6DO5DO4DO3DO2DO1DO0
Both the read register and write register commands are completed in 16 clock pulses or in
multiples of 8 in case of multiple read/write bytes. Bit duration is the time between two falling
edges of SPC. The first bit (bit 0) starts at the first falling edge of SPC after the falling edge
of CS, while the last bit (bit 15, bit 23, ...) starts at the last falling edge of SPC just before the
rising edge of CS.
bit 0: RW
bit. When 0, the data DI(7:0) is written into the device. When 1, the data DO(7:0)
from the device is read. In the latter case, the chip will drive SDO at the start of bit 8.
bit 1: MS
bit. When 0, the address will remain unchanged in multiple read/write commands.
When 1, the address will be auto-incremented in multiple read/write commands.
bit 2-7: address AD(5:0). This is the address field of the indexed register.
bit 8-15: data DI(7:0) (write mode). This is the data that will be written into the device (MSb
first).
bit 8-15: data DO(7:0) (read mode). This is the data that will be read from the device (MSb
first).
In multiple read/write commands, further blocks of 8 clock periods will be added. When the
MS
bit is ‘0’, the address used to read/write data remains the same for every block. When
the MS
bit is ‘1’, the address used to read/write data is increased at every block.
The function and the behavior of SDI and SDO remain unchanged.
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LSM330DLDigital interfaces
5.2.1 SPI read
Figure 7.SPI read protocol
CS
SPC
SDI
RW
MS
AD5 AD4 AD3 AD2 AD1 AD0
SDO
DO7 DO6 DO5DO4 DO3 DO2 DO1DO0
The SPI Read command is performed with 16 clock pulses. The multiple byte read
command is performed, adding blocks of 8 clock pulses to the previous one.
bit 0: READ bit. The value is 1.
bit 1: MS
bit. When 0, this bit does not increment the address. When 1, it increments the
address in multiple reads.
bit 2-7: address AD(5:0). This is the address field of the indexed register.
bit 8-15: data DO(7:0) (read mode). This is the data that will be read from the device (MSb
first).
bit 16-... : data DO(...-8). Further data in multiple byte reads.
The SPI Write command is performed with 16 clock pulses. The multiple byte write
command is performed adding blocks of 8 clock pulses to the previous one.
bit 0: WRITE bit. The value is 0.
bit 1: MS
bit. When 0, this bit does not increment the address, when 1, it increments the
address in multiple writes.
bit 2 -7: address AD(5:0). This is the address field of the indexed register.
bit 8-15: data DI(7:0) (write mode). This is the data that will be written inside the device
(MSb first).
bit 16-... : data DI(...-8). Further data in multiple byte writes.
Registers marked as Reserved must not be changed. Writing to those registers may cause
permanent damage to the device.
The content of the registers that are loaded at boot should not be changed. They contain the
factory-calibrated values. Their content is automatically restored when the device is
powered up.
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LSM330DLRegisters description
7 Registers description
The device contains a set of registers which are used to control its behavior and to retrieve
acceleration, angular rate and temperature data. The register addresses, composed of 7
bits, are used to identify them and to write the data through the serial interface.
7.1 CTRL_REG1_A (20h)
Table 19.CTRL_REG1_A register
ODR3ODR2ODR1ODR0LPenZenYenXen
Table 20.CTRL_REG1_A description
ODR3-0
LPen
Zen
Ye n
Xen
Data rate selection. Default value: 0
(0000: power-down; Others: Refer to Table 21: Data rate configuration
0: Trigger event linked to trigger signal on INT1_A
1: Trigger event linked to trigger signal on INT2_A
)
Table 40.FIFO mode configuration
FM1FM0FIFO mode
00Bypass mode
01FIFO mode
10Stream mode
11Trigger mode
7.13 FIFO_SRC_REG_A (2Fh)
Table 41.FIFO_SRC_REG_A register
WTMOVRN_FIFOEMPTYFSS4FSS3FSS2FSS1FSS0
7.14 INT1_CFG_A (30h)
Table 42.INT1_CFG_REG_A register
AOI6DZHIE/
ZUPE
Table 43.INT1_CFG_REG_A description
AOIAnd/Or combination of Interrupt events. Default value: 0. Refer to Table 44: Interrupt
mode
6D6-direction detection function enabled. Default value: 0. Refer to Table 44: Interrupt
mode
ZHIE/
ZUPE
ZLIE/
ZDOWNE
YHIE/
YUPE
YLIE/
YDOWNE
Enable interrupt generation on Z high event or on direction recognition. Default value: 0
(0: disable interrupt request; 1: enable interrupt request)
Enable interrupt generation on Z low event or on direction recognition. Default value: 0
(0: disable interrupt request; 1: enable interrupt request)
Enable interrupt generation on Y high event or on direction recognition. Default value: 0
(0: disable interrupt request; 1: enable interrupt request.)
Enable interrupt generation on Y low event or on direction recognition. Default value: 0
(0: disable interrupt request; 1: enable interrupt request.)
ZLIE/
ZDOWNE
YHIE/
YUPE
YLIE/
YDOWNE
XHIE/
XUPE
XLIE/
XDOWNE
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LSM330DLRegisters description
Table 43.INT1_CFG_REG_A description (continued)
XHIE/
XUPE
XLIE/XDO
WNE
Enable interrupt generation on X high event or on direction recognition. Default value: 0
(0: disable interrupt request; 1: enable interrupt request.)
Enable interrupt generation on X low event or on direction recognition. Default value: 0
(0: disable interrupt request; 1: enable interrupt request.)
The contents of the INT1_CFG_REG_A register are loaded at boot.
A write operation at this address is possible only after system boot.
Table 44.Interrupt mode
AOI6DInterrupt mode
00OR combination of interrupt events
016-direction movement recognition
10AND combination of interrupt events
116-direction position recognition
The difference between AOI-6D = ‘01’ and AOI-6D = ‘11’ is defined as follows:
AOI-6D = ‘01’ is movement recognition. An interrupt is generated when the orientation
moves from an unknown zone to a known zone. The interrupt signal stays for a duration
determined by ODR.
AOI-6D = ‘11’ is direction recognition. An interrupt is generated when the orientation is
inside a known zone. The interrupt signal stays until orientation is inside the zone.
7.15 INT1_SRC_A (31h)
Table 45.INT1_SRC_A register
(1)
0
1. This bit has to be set to ‘0’ for correct operation.
Table 46.INT1_SRC_A description
IA
ZH
ZL
IAZHZLYHYLXHXL
Interrupt active. Default value: 0
(0: no interrupt has been generated; 1: one or more interrupts have been generated)
Z high. Default value: 0
(0: no interrupt, 1: Z high event has occurred)
Z low. Default value: 0
(0: no interrupt; 1: Z low event has occurred)
YH
YL
Y high. Default value: 0
(0: no interrupt, 1: Y high event has occurred)
Y low. Default value: 0
(0: no interrupt, 1: Y low event has occurred)
Doc ID 022018 Rev 135/54
Registers descriptionLSM330DL
Table 46.INT1_SRC_A description
XH
X high. Default value: 0
(0: no interrupt, 1: X high event has occurred)
X low. Default value: 0
XL
(0: no interrupt, 1: X low event has occurred)
The Interrupt 1 source register is a read-only register.
Reading at this address clears the INT1_SRC_A IA bit (and the interrupt signal on the
INT1_A pin) and allows the refreshment of data in the INT1_SRC_A register if the latched
option was chosen.
7.16 INT1_THS_A (32h)
Table 47.INT1_THS_A register
(1)
0
1. This bit has to be set to ‘0’ for correct operation.
1. This bit has to be set to ‘0’ for correct operation.
D6D5D4D3D2D1D0
Table 50.INT1_DURATION_A description
D6 - D0Duration value. Default value: 000 0000
The D6 - D0 bits set the minimum duration of the Interrupt 1 event to be recognized. The
duration of the steps and maximum values depend on the ODR chosen.
7.18 CLICK_CFG _A (38h)
Table 51.CLICK_CFG_A register
----ZDZSYDYSXDXS
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LSM330DLRegisters description
Table 52.CLICK_CFG_A description
ZDEnable interrupt double CLICK on Z-axis. Default value: 0
(0: disable interrupt request; 1: enable interrupt request on measured accel. value
higher than preset threshold)
ZSEnable interrupt single CLICK on Z-axis. Default value: 0
(0: disable interrupt request; 1: enable interrupt request on measured accel. value
higher than preset threshold)
YDEnable interrupt double CLICK on Y-axis. Default value: 0
(0: disable interrupt request; 1: enable interrupt request on measured accel. value
higher than preset threshold)
YSEnable interrupt single CLICK on Y-axis. Default value: 0
(0: disable interrupt request; 1: enable interrupt request on measured accel. value
higher than preset threshold)
XDEnable interrupt double CLICK on X-axis. Default value: 0
(0: disable interrupt request; 1: enable interrupt request on measured accel. value
higher than preset threshold)
XSEnable interrupt single CLICK on X-axis. Default value: 0
(0: disable interrupt request; 1: enable interrupt request on measured accel. value
higher than preset threshold)
7.19 CLICK_SRC_A (39h)
Table 53.CLICK_SRC_A register
--IADCLICKSCLICKSignZYX
Table 54.CLICK_SRC_A description
IAInterrupt active. Default value: 0
(0: no interrupt has been generated; 1: one or more interrupts have been generated)
WTMWatermark status. (0: FIFO filling is lower than WTM level; 1: FIFO filling is equal
or higher than WTM level)
OVRNOverrun bit status.
(0: FIFO is not completely filled; 1:FIFO is completely filled)
EMPTYFIFO empty bit.
( 0: FIFO not empty; 1: FIFO empty)
FSS4-FSS1FIFO stored data level
Doc ID 022018 Rev 145/54
Registers descriptionLSM330DL
7.37 INT1_CFG_G (30h)
This is the configuration register for the interrupt source.
Table 90.INT1_CFG_G register
AND/ORLIRZHIEZLIEYHIEYLIEXHIEXLIE
Table 91.INT1_CFG_G description
AND/OR
AND/OR combination of interrupt events. Default value: 0
(0: OR combination of interrupt events 1: AND combination of interrupt events
LIR
ZHIE
ZLIE
YHIE
YLIE
XHIE
XLIE
Latch Interrupt Request. Default value: 0
(0: interrupt request not latched; 1: interrupt request latched)
Cleared by reading INT1_SRC_G reg.
Enable interrupt generation on Z high event. Default value: 0
(0: disable interrupt request; 1: enable interrupt request on measured accel. value
higher than preset threshold)
Enable interrupt generation on Z low event. Default value: 0
(0: disable interrupt request; 1: enable interrupt request on measured accel. value
lower than preset threshold)
Enable interrupt generation on Y high event. Default value: 0
(0: disable interrupt request; 1: enable interrupt request on measured accel. value
higher than preset threshold)
Enable interrupt generation on Y low event. Default value: 0
(0: disable interrupt request; 1: enable interrupt request on measured accel. value
lower than preset threshold)
Enable interrupt generation on X high event. Default value: 0
(0: disable interrupt request; 1: enable interrupt request on measured accel. value
higher than preset threshold)
Enable interrupt generation on X low event. Default value: 0
(0: disable interrupt request; 1: enable interrupt request on measured accel. value
lower than preset threshold)
46/54Doc ID 022018 Rev 1
LSM330DLRegisters description
7.38 INT1_SRC_G (31h)
The interrupt source register is a read-only register.
Reading at this address clears the INT1_SRC_G IA bit (and eventually the interrupt signal
on the INT1_G pin) and allows the refreshment of data in the INT1_SRC_G register if the
latched option was chosen.
Table 92.INT1_SRC_G register
(1)
0
1. This bit has to be set to ‘0’ for correct operation.
Table 93.INT1_SRC_G description
IA
ZHZ high. Default value: 0 (0: no interrupt, 1: Z high event has occurred)
ZLZ low. Default value: 0 (0: no interrupt; 1: Z low event has occurred)
YHY high. Default value: 0 (0: no interrupt, 1: Y high event has occurred)
YLY low. Default value: 0 (0: no interrupt, 1: Y low event has occurred)
XHX high. Default value: 0 (0: no interrupt, 1: X high event has occurred)
XLX low. Default value: 0 (0: no interrupt, 1: X low event has occurred)
IAZHZLYHYLXHXL
Interrupt active. Default value: 0
(0: no interrupt has been generated; 1: one or more interrupts have been generated)
The D6 - D0 bits set the minimum duration of the interrupt event to be recognized. The
duration of the steps and maximum values depend on the ODR chosen.
The WAIT bit has the following meaning:
Wait =’0’: the interrupt falls immediately if the signal crosses the selected threshold
Wait =’1’: if the signal crosses the selected threshold, the interrupt falls only after the
duration has counted the number of samples at the selected data rate, written into the
duration counter register.
Figure 13. Wait disabled
Doc ID 022018 Rev 149/54
Registers descriptionLSM330DL
Figure 14. Wait enabled
50/54Doc ID 022018 Rev 1
LSM330DLPackage information
8 Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
specifications, grade definitions and product status are available at: www.st.com. ECOPACK
is an ST trademark.
ECOPACK
®
specifications are available at: www.st.com.
®
Doc ID 022018 Rev 151/54
Package informationLSM330DL
Table 108. LLGA 7.5 x 4.4 x 1.1 28L mechanical data
mm
Dim.
Min. Typ. Max.
A1 1.100
A2 0.855
A3 0.200
D1 4.2504.4004.550
E1 7.3507.5007.650
N1 0.300
L1 5.400
L2 1.800
P2 1.200
T1 0.600
T2 0.400
M 0.100
d 0.3
k 0.050
h 0.100
Figure 15. LLGA 7.5 x 4.4 x 1.1 28L package drawing
Pin 1 Indicator
A
k
1
D
TOP VIEW
E1
E
B
k
C
A3
D
E
k
A2
D
k
Seating
Plane
A1
K
C
h
==
L1
d
2
P
2
L
M
N1
T1
T2
8190050_B
52/54Doc ID 022018 Rev 1
LSM330DLRevision history
9 Revision history
Table 109. Document revision history
DateRevisionChanges
19-Jul-20111First release.
Doc ID 022018 Rev 153/54
LSM330DL
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