ST’s family of modules leverages a robust and
mature manufacturing process already used for
the production of micromachined accelerometers.
The various sensing elements are manufactured
using specialized micromachining processes,
while the IC interfaces are based on CMOS
technology that allows designing a dedicated
circuit which is trimmed to better match the
sensing element characteristics.
The LSM330DL has a dynamic, user-selectable
full-scale acceleration range of ±2g/±4g/±8g/±16g
and an angular rate of ±250/±500/±2000 deg/sec.
The accelerometer and gyroscope sensors can
be either activated or put in low-power / powerdown mode separately for power-saving
optimized applications. The LSM330DL is
available in a plastic land grid array (LGA)
package.
Several years ago ST successfully pioneered the
use of this package for accelerometers. Today, ST
has the broadest manufacturing capability in the
world and unrivalled expertise for the production
of sensors in a plastic LGA package.
Description
The LSM330DL is a system-in-package featuring
a 3D digital accelerometer and a 3D digital
gyroscope.
Table 1.Device summary
Part numberTemperature range [°C]PackagePacking
LSM330DL-40 to +85LGA-28Tray
LSM330DLTR-40 to +85LGA-28Tape & reel
July 2011Doc ID 022018 Rev 11/54
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to
change without notice.
C serial data (SDA)
SPI serial data input (SDI)
3-wire interface serial data output (SDO)
Accelerometer:
SPI serial data output (SDO)
2
I
C least significant bit of the device address (SA0)
SDO_A
SCL_A
DRDY_G/INT2_G
Res
LSM330DL
(BOTTOM VIEW)
Res
Vdd
Res
Res
INT1_G
INT1_A
SDO_G
FILTVDD
FILTIN Y
Res
INT2_A
CS_A
CS_G
SDA/SDI_G
10
Res
11
Vdd_IO_G
SCL_G
Res
14
15
Vdd
Res
AM09256V1
Accelerometer:
4SCL_A
2
I
C serial clock (SCL)
SPI serial port clock (SPC)
5DRDY_G/INT2_GGyroscope data ready/interrupt signal 2
6INT1_AAccelerometer interrupt signal
Gyroscope:
7SDO_G
SPI serial data output (SDO)
I2C least significant bit of the device address (SA0)
8INT2_AAccelerometer interrupt signal
Gyroscope:
2
I
9SDA/SDI_G
C serial data (SDA)
SPI serial data input (SDI)
3-wire interface serial data output (SDO)
10/54Doc ID 022018 Rev 1
LSM330DLBlock diagram and pin description
Table 2.Pin description (continued)
Pin#NameFunction
Gyroscope:
10CS_G
11ResReserved, connect to GND
12Vdd_IO_GGyroscope power supply for I/O pins
13SCL_G
14ResReserved connect to GND
15VddPower supply
16ResReserved, connect to GND
17CS_A
18ResReserved, connect to GND
SPI enable
2
I
C/SPI mode selection (1: SPI idle mode / I2C communication
enabled; 0: SPI communication mode / I
2
C disabled)
Gyroscope:
2
C serial clock (SCL)
I
SPI serial port clock (SPC)
Accelerometer:
SPI enable
2
C/SPI mode selection (1: SPI idle mode / I2C communication
I
enabled; 0: SPI communication mode / I
2
C disabled)
19ResReserved, connect to GND
20ResReserved, connect to GND
21INT1_GGyroscope interrupt signal 1
22VddPower supply
23ResReserved, connect to GND
24ResReserved, connect to GND
25GND0 V power supply
26VCONTPLL filter connection
27ResReserved, connect to GND
28Vdd_IO_AAccelerometer power supply for I/O pins
Doc ID 022018 Rev 111/54
Module specificationsLSM330DL
zHz
2 Module specifications
2.1 Mechanical characteristics
The values given in the following table are for the conditions Vdd = 3 V, T = 25 °C unless
otherwise noted.
Table 3.Mechanical characteristics
SymbolParameterTest conditionsMin. Typ.
LA_FS
G_FSAngular rate measurement range
LA_SoLinear acceleration sensitivity
G_SoAngular rate sensitivity
LA_So
G_SoAngular rate sensitivity change vs. temp. from -40 to +85°C±2%
LA_TyOffTypical zero-
G_TyOffTypical zero-rate level
LA_TCOff Zero-
G_TCOffZero-rate level change vs. temperature
AnAcceleration noise density
RnRate noise densityFS bit set to 00, BW = 50 Hz0.03dps/
TopOperating temperature range-40+85°C
1. Typical specifications are not guaranteed.
2. Verified by wafer level test and measurement of initial offset and sensitivity.
3. Typical zero-g level offset value after MSL3 preconditioning.
4. Offset can be eliminated by enabling the built-in high-pass filter.
Linear acceleration
measurement range
Linear acceleration
Sensitivity change vs. temperature
g level change vs. temperatureMax delta from 25 °C±0.5mg/°C
(a)
(2)
g level offset accuracy
(4)
(2)
(1)
FS bit set to 00±2
FS bit set to 01±4
FS bit set to 10±8
FS bit set to 11±16
FS bit set to 00±250
FS bit set to 10±2000
FS bit set to 001
FS bit set to 012
FS bit set to 104
FS bit set to 1112
FS bit set to 008.75
FS bit set to 0117.5
FS bit set to 1070
FS bit set to 00±0.05%/°C
(3)
FS bit set to 00±60mg
FS bit set to 0010LSb
FS bit set to 00
from -40 to +85°C
FS bit set to 00, normal
mode, ODR bit set to 1001
±0.03dps/°C
220µ
Max.Unit
mg/digit
mdps/
g/
g
dpsFS bit set to 01±500
digit
H
a. The product is factory calibrated at 3 V. The operational power supply range is from 2.4 V to 3.6 V.
12/54Doc ID 022018 Rev 1
LSM330DLModule specifications
2.2 Electrical characteristics
The values given in the following table are for the conditions Vdd = 3 V, T = 25 °C unless
otherwise noted.
Table 4.Electrical characteristics
SymbolParameterTest conditionsMin.Typ.
VddSupply voltage2.43.6V
Vdd_IOPower supply for I/O1.71Vdd+0.1V
LA_Idd
LA_IddLowP
LA current consumption in
normal mode
LA current consumption in
low-power mode
ODR = 50 Hz11
ODR = 1 Hz2
ODR = 50 Hz6µA
(1)
Max.Unit
µA
LA_IddPdn
G_Idd
G_IddLowP
G_IddPdn
VIHDigital high-level input voltage0.8*Vdd_IOV
VILDigital low-level input voltage0.2*Vdd_IOV
VOHHigh-level output voltage0.9*Vdd_IOV
VOLLow-level output voltage0.1*Vdd_IOV
TopOperating temperature range-40+85°C
1. Typical specifications are not guaranteed.
2. Sleep mode introduces a faster turn-on time compared to power-down mode.
LA current consumption in
power-down mode
AR current consumption in
normal mode
AR supply current in sleep mode
AR current consumption in
power-down mode
T = 25 °C0.5µA
6.1mA
(2)
T = 25 °C5µA
1.5mA
2.3 Temperature sensor characteristics
The values given in the following table are for the conditions Vdd = 3.0 V, T=25 °C, unless
otherwise noted.
Table 5.Temperature sensor characteristics
SymbolParameterTest conditionMin.Typ.
TSDr
TODRTemperature refresh rate1Hz
Top Operating temperature range-40+85°C
1. The product is factory calibrated at 3.0 V.
2. Typical specifications are not guaranteed.
Temperature sensor output
change vs. temperature
Doc ID 022018 Rev 113/54
(1)
-
(2)
-1°C/digit
Max.Unit
Module specificationsLSM330DL
t
t
t
t
t
t
t
t
2.4 Communication interface characteristics
2.4.1 SPI - serial peripheral interface
The values given in the following table are subject to the general operating conditions for
Vdd and T
Table 6.SPI slave timing values
SymbolParameter
OP
.
(1)
Val ue
Unit
MinMax
t
c(SPC)
f
c(SPC)
t
su(CS)
t
h(CS)
t
su(SI)
t
h(SI)
t
v(SO)
t
h(SO)
t
dis(SO)
1. Values are guaranteed at 10 MHz clock frequency for SPI with both 4 and 3 wires, based on characterization results, not
tested in production.
Figure 3.SPI slave timing diagram
CS
(3)
SPC
(3)
SPI clock cycle100ns
SPI clock frequency10MHz
CS setup time6
CS hold time8
SDI input setup time5
SDI input hold time15
SDO valid output time50
SDO output hold time9
SDO output disable time50
(b)
su(CS)
c(SPC)
h(CS)
ns
(3)
(3)
MSB IN
MSB OUT
h(SI)
v(SO)
LSB IN
h(SO)
LSB OUT
su(SI)
(3)
SDI
(3)
SDO
3. Data on CS, SPC, SDI and SDO concern the following pins: CS_A/G, SCL_A/G, SDA/SDI_A/G, SDO_A/G
b. Measurement points are done at 0.2·Vdd_IO and 0.8·Vdd_IO, for both input and output ports.
14/54Doc ID 022018 Rev 1
(3)
dis(SO)
(3)
LSM330DLModule specifications
t
t
t
t
t
t
t
t
t
t
t
t
2.4.2 I2C - inter-IC control interface
The values given in the following table are subject to the general operating conditions for
Vdd and T
Table 7.I2C slave timing values
SymbolParameter
OP
.
(1)
I2C standard mode
I2C fast mode
MinMaxMinMax
(1)
Unit
f
(SCL)
t
w(SCLL)
t
w(SCLH)
t
su(SDA)
t
h(SDA)
t
r(SDA) tr(SCL)
t
f(SDA) tf(SCL)
t
h(ST)
t
su(SR)
t
su(SP)
t
w(SP:SR)
SCL clock frequency01000400kHz
SCL clock low time4.71.3
SCL clock high time4.00.6
SDA setup time250100ns
SDA data hold time0.013.4500.9µs
SDA and SCL rise time1000
SDA and SCL fall time300
START condition hold time40.6
Repeated START condition setup time4.70.6
STOP condition setup time40.6
Bus free time between STOP and
START condition
1. SCL (SCL_A/G pin), SDA (SDA_A/G pin)
Figure 4.I2C slave timing diagram
START
(3)
20 + 0.1C
20 + 0.1C
4.71.3
µs
(2)
b
(2)
b
300
ns
300
µs
REPEATED
START
SDA
f(SDA)
r(SDA)
su(SDA)
h(SDA)
SCL
w(SCLL)
h(ST)
1. Data based on standard I
w(SCLH)
2
C protocol requirement, not tested in production.
r(SCL)
f(SCL)
2 Cb = total capacitance of one bus line, in pF
3. Measurement points are done at 0.2·Vdd_IO and 0.8·Vdd_IO, for both ports.
Doc ID 022018 Rev 115/54
su(SR)
su(SP)
w(SP:SR)
START
STOP
AM09238V1
Module specificationsLSM330DL
2.5 Absolute maximum ratings
Stresses above those listed as “absolute maximum ratings” may cause permanent damage
to the device. This is a stress rating only and functional operation of the device under these
conditions is not implied. Exposure to maximum rating conditions for extended periods may
affect device reliability.
Table 8.Absolute maximum ratings
SymbolRatingsMaximum valueUnit
VddSupply voltage-0.3 to 4.8V
Vdd_IOI/O pins supply voltage-0.3 to 4.8V
Input voltage on any control pin
(SCL_A/G, SDA/SDI_A/G, SDO_A/G, CS_A/G)
Acceleration (any axis, powered, Vdd = 3 V)
-0.3 to Vdd_IO +0.3V
3000 g for 0.5 ms
10000 g for 0.1 ms
A
Vin
POW
A
T
T
UNP
STG
Acceleration (any axis, unpowered)
Operating temperature range-40 to +85°C
OP
Storage temperature range-40 to +125°C
ESDElectrostatic discharge protection2 (HBM)kV
Note:Supply voltage on any pin should never exceed 4.8 V
This is a device sensitive to mechanical shock, improper handling can cause
permanent damage to the part
This is an ESD-sensitive device, improper handling can cause permanent damage to
the part
3000 g for 0.5 ms
10000 g for 0.1 ms
16/54Doc ID 022018 Rev 1
LSM330DLModule specifications
2.6 Terminology
2.6.1 Sensitivity
Linear acceleration sensitivity can be determined by applying 1 g acceleration to the device.
As the sensor can measure DC accelerations, this can be done easily by pointing the axis of
interest towards the center of the Earth, noting the output value, rotating the sensor by 180
degrees (point to the sky) and then noting the output value again. By doing so, ±1 g
acceleration is applied to the sensor. Subtracting the larger output value from the smaller
one, and dividing the result by 2, leads to the actual sensitivity of the sensor. This value
changes very little over temperature and also very little over time. The sensitivity tolerance
describes the range of sensitivities of a large population of sensors.
Angular rate sensitivity describes the angular rate gain of the sensor and can be determined
by applying a defined angular velocity to it. This value changes very little over temperature
and also very little over time.
2.6.2 Zero level
Linear acceleration zero-g level offset (TyOff) describes the deviation of an actual output
signal from the ideal output signal if no acceleration is present. A sensor in a steady state on
a horizontal surface will measure 0 g on the X-axis and 0 g on the Y-axis whereas the Z-axis
will measure 1 g. The output is ideally in the middle of the dynamic range of the sensor
(content of OUT registers 00h, data expressed as 2’s complement number). A deviation
from the ideal value in this case is called zero-g offset. Offset is to some extent a result of
stress to the MEMS sensor and therefore the offset can slightly change after mounting the
sensor onto a printed circuit board or exposing it to extensive mechanical stress. Offset
changes little over temperature, see “Zero-g level change vs. temperature” (refer toTable 3).
The zero-g level tolerance (TyOff) describes the standard deviation of the range of zero-g
levels of a population of sensors.
The angular rate zero-rate level describes the actual output value if there is no angular rate
present. Zero-rate level of precise MEMS sensors is, to some extent, a result of stress to the
sensor and therefore the zero-rate level can slightly change after mounting the sensor onto
a printed circuit board or after exposing it to extensive mechanical stress. This value
changes very little over temperature and also very little over time.
Doc ID 022018 Rev 117/54
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