3D digital accelerometer and 2D pitch and yaw analog gyroscope
Features
■ 2.7 V to 3.6 V power supply operation
■ Low voltage compatible digital IOs, 1.8 V
■ ±2 g/±4 g/±8 g dynamically selectable full-scale
■ ±300 dps absolute analog angular rate output
2
■ I
C/SPI digital linear acceleration interface (16
bit data output)
■ Two separated outputs for pitch and yaw axis
(1x and 4x amplified)
■ Integrated low-pass filters for angular rate
■ 2 independent programmable interrupt
generators for free-fall and motion detection
■ Sleep-to-wakeup function
■ 6D orientation detection
■ Extended operating temperature range (40 °C
to +85 °C)
■ High stability over temperature
■ High shock survivability
■ Embedded self-test
■ Embedded power-down
■ Embedded low-power mode
■ ECOPACK
®
RoHS and “Green” compliant
(see Section 9)
Applications
■ Motion control for smart user interface
■ Display orientation
■ Gaming and virtual reality input devices
■ Industrial and robotics
■ Vibration monitoring and compensation
■ Impact recognition and logging
■ Motion-activated functions
■ Intelligent power-saving for handheld devices
■ Free-fall detection
Description
The LSM320HAY30 is a low-power system-inpackage featuring a 3D digital linear acceleration
sensor and a 2D analog angular rate pitch and
yaw sensor. It provides excellent temperature
stability and high resolution over an extended
operating temperature range (-40°C to +85°C).
ST’s family of sensor modules leverages the
robust and mature manufacturing process already
used for the production of micromachined
accelerometers. The LSM320HAY30 has a
dynamically user-selectable full-scale
acceleration range of ±2 g/±4 g/±8 g, and an
angular rate of ±300 dps capable of detecting
rates with a -3 dB bandwidth up to 140 Hz along
pitch and yaw axes. The LSM320HAY30 is
capable of measuring linear accelerations with
output data rates from 0.5 Hz up to 1 kHz. The
embedded self-test capability allows the user to
check the functioning of each sensor in the final
application. The device can be configured to
generate an interrupt signal by inertial
wakeup/free-fall events as well as by the position
of the device itself. Several years ago ST
successfully pioneered the use of this package for
accelerometers. Today, ST has the widest
manufacturing capability and strongest expertise
in the world for production of sensors in plastic
LGA packages.
Angular rate high-pass filter reset (logic 0: normal operation mode;
logic1: external high-pass filter is reset)
9ARPDAngular rate power-down (see Table 5
10ARSTAngular rate self-test (see Table 5)
11GND0 V supply
12GND0 V supply
13RES0 V supply
14GND0 V supply
15GND0 V supply
16FILTVDDPLL filter connection pin 16
17VCONTPLL filter connection pin 15
18OUT XNot amplified Out X
8/42Doc ID 16917 Rev 1
)
LSM320HAY30Block diagram and pin description
Table 1.Pin description (continued)
Pin#NameFunction
194xIN XInput of 4x amplifier
204xOUT XX rate signal output voltage (amplified)
21VrefReference voltage
224x OUTZZ rate signal output voltage (amplified)
234xIN ZInput of 4x amplifier
24OUT ZNot amplified Out Z
25VDDPower supply
26RESConnected to Vdd
27RESConnected to Vdd
28RESConnected to Vdd
Doc ID 16917 Rev 19/42
Mechanical and electrical specificationsLSM320HAY30
2 Mechanical and electrical specifications
2.1 Mechanical characteristics
@ Vdd=3,0 V, T=25 °C unless otherwise noted.
Table 2.Mechanical characteristics
Symbol
LA_TCSo
AR_TCSo
LA_TyOff
LA_TCOff
AR_TCZrl
(1)
ParameterTest conditionsMin.Typ.
FS bit set to 00±2.0
LA_FS
Linear acceleration measurement
(3)
range
FS bit set to 11±8.0
4x OUT (amplified)±300
AR_FSAngular rate measurement range
OUT (not amplified)±1200
FS bit set to 00 (12 bit)0.911.1
LA_SoLinear acceleration sensitivity
FS bit set to 11 (12 bit)3.53.94.3
AR_SoAngular rate sensitivity
(4)
4x OUT (amplified)3.33mV/dps
OUT (not amplified)0.83mV/dps
Linear acceleration sensitivity
change vs. temperature
Angular rate sensitivity change vs
temperature
Linear acceleration typical zero-g
level offset accuracy
Linear acceleration zero-g level
change vs. temperature
AR_Zrl Zero-rate level
(5),(6)
(6)
FS bit set to 00±0.01%/°C
Delta from 25°C0.07%/°C
FS bit set to 00±20mg
Max delta from 25°C±0.1mg/°C
AR_VrefReference voltage1.5V
Angular rate zero-rate level
change vs. temperature
Max delta from 25°C±0.05dps/°C
LA_AnLinear acceleration noise densityFS bit set to 00218µg/√ Hz
AR_RnAngular rate noise density0.02dps/√ Hz
AR_NLAngular rate non linearityBest fit straight line±1% FS
LA_BWLinear acceleration bandwidth
AR_BWAngular rate bandwidth
(7)
(8)
FS bit set to 00 X axis+500LSb
LA_ST
Linear acceleration self-test
output change
(9),(10),(11)
FS bit set to 00 Y axis-500LSb
FS bit set to 00 Z axis+600LSb
(a)
(2)
Max.Unit
dps
mg/digitFS bit set to 01 (12 bit)1.822.2
1.5V
ODR/2Hz
140Hz
gFS bit set to 01±4.0
a. The product is factory calibrated at 3.0 V. The operational power supply range is from 2.7 V to 3.6 V.
10/42Doc ID 16917 Rev 1
LSM320HAY30Mechanical and electrical specifications
Table 2.Mechanical characteristics (continued)
Symbol
(1)
ParameterTest conditionsMin.Typ.
(2)
Max.Unit
AR_ST
Angular rate self-test output
change
250mV
TopOperating temperature range-40+85°C
1. Linear acceleration (LA), Angular Rate (AR) parameter labeling
2. Typical specifications are not guaranteed
3. Verified by wafer level test and measurement of initial offset and sensitivity
4. Sensitivity and zero-rate offset are not ratiometric to supply voltage
5. Typical zero-g level offset value after MSL3 preconditioning
6. Offset can be eliminated by enabling the built-in high-pass filter
7. Refer to Table 23 for filter cut-off frequency.
8. The product is capable of measuring angular rates extending from DC to the selected BW.
9. The sign of “Self-test output change” is defined by LA_CTRL_REG4 STsign bit (Table 27), for all axes.
Linear acceleration sensing Self-Test output changes with the power supply. “Self-test output change” is defined as
10.
OUTPUT[LSb]
Full-scale
11. Output data reach 99% of final value after 1/ODR+1ms when enabling
device filtering.
(LA_CTRL_REG4 ST bit=1)
- OUTPUT[LSb]
(LA_CTRL_REG4 ST bit=0)
linear acceleration sensing
. 1LSb=4g/4096 at 12bit representation, ±2 g
self-test mode, due to
2.2 Electrical characteristics
@ Vdd=3,0 V, T=25 °C unless otherwise noted.
(b)
Table 3.Electrical characteristics
SymbolParameterTest conditionMin.Typ.
VddSupply voltage2.73.03.6V
Vdd_IOI/O pins supply voltage
LA_Idd
AR_Idd
LA_IddLP
AR_IddSl
LA_IddPdn
AR_IddPdn
Linear acceleration current
consumption in normal mode
Angular rate current consumption
in normal mode
Linear acceleration current
consumption in low-power mode
Angular rate current consumption
in sleep mode
Linear acceleration current
consumption in power-down mode
Angular rate current consumption
in power-down mode
b. The product is factory calibrated at 3 V.
(2)
1.71Vdd+0.1V
ODR = 50 Hz0.25mA
ARPD pin
connected to GND
= 0.5 Hz10µA
ODR
LP
ARPD, ARST pin
connected to Vdd
ARPD pin
connected to Vdd
(1)
Max.Unit
6.8mA
2.15mA
1µA
15µA
Doc ID 16917 Rev 111/42
Mechanical and electrical specificationsLSM320HAY30
Table 3.Electrical characteristics (continued)
SymbolParameterTest conditionMin.Typ.
(1)
Max.Unit
AR_VSTAngular rate self-test input
AR_VPDAngular rate power-down input
LA_VIH
LA_VIL
LA_VOH
LA_VOL
LA_ODR
LA_ODR
Linear acceleration digital high
level input voltage
Linear acceleration digital low level
input voltage
Linear acceleration high level
output voltage
Linear acceleration low level
output voltage
Linear acceleration output data
rate in normal mode
Linear acceleration output data
LP
rate in low-power mode
Logic 0 level00.2*Vdd
Logic 1 level0.8*VddVdd
Logic 0 level00.2*Vdd
Logic 1 level0.8*VddVdd
0.8*Vdd_IOV
0.2*Vdd_IOV
0.9*Vdd_IOV
0.1*Vdd_IOV
DR bit set to 0050
DR bit set to 01100
DR bit set to 10400
DR bit set to 111000
PM bit set to 0100.5
PM bit set to 0111
PM bit set to 1002
PM bit set to 1015
PM bit set to 11010
V
V
Hz
Hz
LA_TonLinear acceleration turn-on time
AR_TonAngular rate turn-on time
(4)
(3)
ODR = 100 Hz
1/ODR+1
ms
200 ms
TopOperating temperature range-40+85
1. Typical specifications are not guaranteed
2. It is possible to remove Vdd, maintaining Vdd_IO without blocking the communication buses. In this condition the
measurement chain is powered off.
3. Time to obtain valid data after exiting power-down mode
4. Time to obtain valid data after exiting power-down mode
12/42Doc ID 16917 Rev 1
s
°C
LSM320HAY30Absolute maximum ratings
3 Absolute maximum ratings
Stresses above those listed as “Absolute maximum ratings” may cause permanent damage
to the device. This is a stress rating only and functional operation of the device under these
conditions is not implied. Exposure to maximum rating conditions for extended periods may
affect device reliability.
Table 4.Absolute maximum ratings
SymbolRatingsMaximum valueUnit
VddSupply voltage-0.3 to 4.8V
VinInput voltage on any control pin (PD, ST) -0.3 to Vdd +0.3V
AAcceleration
Vdd_IO I/O pin supply voltage-0.3 to 6V
3000 for 0.5 msg
10000 for 0.1 msg
Vin
A
A
T
T
ESDElectrostatic discharge protection2 (HBM)kV
Input voltage on any control pin
(CS, SCL/SPC, SDA/SDI/SDO, SDO/SA0)
Acceleration (any axis, powered, Vdd = 3 V)
POW
Acceleration (any axis, unpowered)
UNP
Operating temperature range-40 to +85°C
OP
Storage temperature range-40 to +125°C
STG
-0.3 to Vdd_IO +0.3V
3000 for 0.5 msg
10000 for 0.1 msg
3000 for 0.5 msg
10000 for 0.1 msg
This is a mechanical shock sensitive device, improper handling can cause permanent
damage to the part.
This is an ESD sensitive device, improper handling can cause permanent damage to
the part.
Doc ID 16917 Rev 113/42
Functionality and terminologyLSM320HAY30
4 Functionality and terminology
The LSM320HAY30 is an inertial module capable of detecting 3-axis linear acceleration and
2-axis angular rate. The system is housed in an LGA package.
The device includes an ASIC with a digital IC interface capable of providing linear
acceleration information through an I
angular rate.
The LSM320HAY30 may also be configured to generate an inertial wakeup and free-fall
interrupt signal according to a programmed acceleration event along the enabled axes. Both
free-fall and wakeup can be used simultaneously on two different pins (INT1/INT2).
4.1 Factory calibration
The system is factory calibrated for sensitivity and zero level. The trimming values are
stored inside the device in non-volatile memory. When the device is turned on, the trimming
parameters are downloaded into the registers to be used during active operation. This
allows the use of the device without further calibration.
4.2 Sensitivity
Linear acceleration sensing
Liner Acceleration Sensitivity (LA_So) describes the gain of the sensor and can be
determined e.g. by applying 1 g acceleration to it. Because the sensor can measure DC
accelerations, this can be done easily by pointing the selected axis towards the ground,
noting the output value, rotating the sensor 180 degrees (pointing towards the sky) and
noting the output value again. By doing so, a ±1 g acceleration is applied to the sensor.
Subtracting the larger output value from the smaller one, and dividing the result by 2, leads
to the actual sensitivity of the sensor. This value changes very little over temperature and
over time. The sensitivity tolerance describes the range of sensitivities of a large number of
sensors.
2
C/SPI serial interface and analog output related to
Angular rate sensing
Angular rate detection produces a positive-going output voltage for counter-clockwise
rotation around the sensitive axis considered. Angular Rate Sensitivity (AR_So) describes
the gain of the sensor and can be determined by applying a defined angular rate to it. This
value changes very little over temperature and over time.
4.3 Zero level
Zero-g level
Zero-g level Offset (LA_TyOff) describes the deviation of an actual output signal from the
ideal output signal if no linear acceleration is present. A sensor in a steady state on a
horizontal surface will measure 0 g on both the X and Y axes, whereas the Z axis will
measure 1 g. Ideally, the output is in the middle of the dynamic range of the sensor (content
14/42Doc ID 16917 Rev 1
LSM320HAY30Functionality and terminology
of OUT registers 00h, data expressed as 2’s complement number). A deviation from the
ideal value in this case is called Zero-g offset.
Offset is to some extent a result of stress to the MEMS sensor and therefore the offset can
slightly change after mounting the sensor onto a printed circuit board or exposing it to
extensive mechanical stress.
Zero-g level offset changes little over temperature, see “Zero-g level change vs.
temperature” (LA_TCOff) in Table 2. The Zero-g level tolerance (LA_TyOff) describes the
standard deviation of the range of Zero-g levels of a group of sensors.
Zero-rate level
Angular rate zero-rate level (AR_Zrl) describes the actual angular rate output signal if there
is no angular rate present. Zero-rate level of precise MEMS sensors is, to some extent, a
result of stress to the sensor and therefore zero-rate level can slightly change after mounting
the sensor onto a printed circuit board or after exposing it to extensive mechanical stress.
This value changes very little over temperature and time.
4.4 Self-test
Linear acceleration self-test
Self-test allows the checking of sensor functionality without moving it. The self-test function
is off when the self-test bit (ST) of LA_CTRL_REG4 (control register 4) is programmed to ‘0‘.
When the self-test bit of LA_CTRL_REG4 is programmed to ‘1‘ an actuation force is applied
to the sensor, simulating a definite input acceleration. In this case, the sensor outputs will
exhibit a change in their DC levels which are related to the selected full-scale through the
device sensitivity. When self-test is activated, the device output level is given by the
algebraic sum of the signals produced by the acceleration acting on the sensor and by the
electrostatic test-force. If the output signals change within the amplitude specified in
Table 2, then the sensor is working properly and the parameters of the interface chip are
within the defined specifications.
Angular rate self-test
Self-test allows testing of the mechanical and electric parts of the sensor, permitting the
seismic mass to be moved by means of an electrostatic test-force. The self-test function is
off when the ARST pin is connected to GND. When the ARST pin is tied to Vdd and ARPD
tied to GND
Coriolis force. In this case the sensor output exhibits a voltage change in its DC level which
is also dependent on the supply voltage. When ST is active, the device output level is given
by the algebraic sum of the signals produced by the velocity acting on the sensor and by the
electrostatic test-force. If the output signals change within the amplitude specified in
Table 2, then the mechanical element is working properly and the parameters of the
interface chip are within the defined specifications.
(see Table 5), an actuation force is applied to the sensor, emulating a definite
is
Doc ID 16917 Rev 115/42
Functionality and terminologyLSM320HAY30
4.5 Advanced features
4.5.1 Linear acceleration sensing
The LSM320HAY30 linear acceleration sensor includes a low-power mode characterized by
lower data rate refreshing. In this way the device, even when sleeping, continues sensing
acceleration and generating interrupt requests.
The “sleep-to-wakeup” function, in conjunction with low-power mode, allows further
reduction of system power consumption and the development of new smart applications.
When the sleep-to-wakeup function is activated,the LSM320HAY30 is able to automatically
wake up the linear acceleration sensor as soon as an interrupt event has been detected.
With this feature the system is efficiently switched from low-power mode to normal mode
based on user-selectable positioning and acceleration events, thus ensuring power-saving
and flexibility.
4.5.2 Angular rate sensing
Sleep mode, self-test and power-down
The LSM320HAY30 has advanced power-saving features for angular rate sensing thanks to
the availability of three different operating modes. When the device is set to sleep mode
configuration, the reading chain is completely turned off, resuting in low power consumption.
In this condition, the device turn-on time is significantly reduced, allowing simple external
power cycling.
Based on the table below, the user can select the desired operating mode using two
dedicated pins (ARST and ARPD).
Table 5.Angular rate sleep mode and power-down mode configuration
Operating modeARST pinARPD pin
Normal mode00
Power-down01
Self-test10
Sleep mode11
High-pass filter reset (ARHP)
The LSM320HAY30 provides the possibility to reset the optional external high-pass filter by
applying a high logic value to the ARHP pad. This procedure ensures faster response,
especially during overload conditions. Moreover, this operation is recommended each time
the device is powered.
16/42Doc ID 16917 Rev 1
LSM320HAY30Application hints
5 Application hints
Figure 3.LSM320HAY30 electrical connections
+Ω
Z
Y
1
X
DIRECTION OF
DETECTABLE
ACCELERATIONS
Z
Vdd_IO
z
1
Y
X
+Ω
x
DIRECTION OF
DETECTABLE
ANGULAR RATE
Vdd
ARHP
ARST
R2
Recommended
Low-pass filter
GND
GND
GND
RES
C1
R1C2
VrefGND
Optional
High-pass filter
ARPD
10
11
14
15
GND
OUT X
4xIN X
INT2
LSM320HAY30
(TOP VIEW)
FILTVDD
FILTIN Y
VCONT
FILTVDD
C4
Digital signal from/to signal controller.Signal’s levels are defined by proper selection of Vdd_IO
Table 6.External component values
Component typeComponentValue
SDO/SA0
INT1
F
4xOUTX
R3C3
SDA/SDI/SDO
VREF
CS
SCL/SPC
1
RES
28
RES
RES
VDD
25
24
4xOUTY
OUT Z
4xIN Z
C1
Recommended
Low-pass filter
C6
C5
R2
R1C2
VrefGND
Optional
High-pass filter
AM06041v1
Capacitor
Resistor
C14.7 µF
C22.2 nF to 2.2 µF
C3470 nF
C410 nF
C5100 nF
C610 µF
R11 MΩ
R233 kΩ
R310 kΩ
Doc ID 16917 Rev 117/42
Application hintsLSM320HAY30
The device core is supplied through the Vdd line. Power supply decoupling capacitors
(C1=100 nF ceramic, C2=10 µF aluminum) should be placed as near as possible to the
supply pin of the device (common design practice).
All voltage and ground supplies must be present at the same time to obtain proper behavior
of the IC (refer to Figure 3).
5.1 Linear acceleration sensing
The functionality of the device and the measured acceleration data is selectable and
accessible through the SPI/I
2
C interface.
The functions, the threshold and the timing of the two interrupt pins (INT 1 and INT 2) can be
completely programmed by the user though the SPI/I
5.2 Angular rate sensing
The LSM320HAY30 allows band limitation of the output rate response through the use of an
external low-pass filter (recommended) and/or high-pass filter (optional) in addition to the
embedded low-pass filter (f
4xOUTX and 4xOUTZ are, respectively, OUTX and OUTZ amplified outputs lines, internally
buffered to ensure low output impedance.
If external filtering is not applied, it is mandatory to short-circuit pad 18 to pad 19 and pad 23
to pad 24, respectively, when amplified outputs are used.
When only a non-amplified output is used (OUTX/OUTZ), it is recommended to set pin 19
and 23 to a fixed reference voltage (Vref).
The LSM320HAY30 IC includes a PLL (phase locked loop) circuit to synchronize driving and
sensing interfaces. Capacitors and resistors must be added at the FILTVDD and VCONT
pins (as shown in Figure 3) to implement a second-order low-pass filter.
Figure 4.Angular rate output response vs. rotation
The LGA package is compliant with the ECOPACK®, RoHS and “Green” standard.
It is qualified for soldering heat resistance according to JEDEC J-STD-020.
Leave “pin 1 Indicator” unconnected during soldering.
Land pattern and soldering recommendations are available at www.st.com.
Doc ID 16917 Rev 119/42
Digital interfacesLSM320HAY30
6 Digital interfaces
The registers embedded in the LSM320HAY30 may be accessed through both the I2C and
SPI serial interfaces. The latter may be software configured to operate either in 3-wire or 4wire interface mode.
The serial interfaces are mapped onto the same pads. To select/exploit the I
CS line must be tied high (i.e. connected to Vdd_IO).
I
SPI serial data input (SDI)
3-wire interface serial data output (SDO)
2
C less significant bit of the device address (SA0)
I
SPI serial data output (SDO)
6.1 I2C serial interface
The LSM320HAY30 I2C is a bus slave. The I2C is employed to write data into registers
whose content can also be read back.
The relevant I
Table 8.Serial interface pin description
TransmitterThe device which sends data to the bus
ReceiverThe device which receives data from the bus
2
C terminology is given in the table below.
TermDescription
Master
SlaveThe device addressed by the master
The device which initiates a transfer, generates clock signals and terminates a
transfer
There are two signals associated with the I2C bus: the serial clock line (SCL) and the serial
data line (SDA). The latter is a bidirectional line used for sending and receiving the data
to/from the interface. Both the lines are connected to Vdd_IO through a pull-up resistor
embedded inside the LSM320HAY30. When the bus is free, both the lines are high.
2
The I
C interface is compliant with fast mode (400 kHz) I2C standards as well as with normal
mode.
20/42Doc ID 16917 Rev 1
LSM320HAY30Digital interfaces
6.1.1 I2C operation
The transaction on the bus is started through a START (ST) signal. A START condition is
defined as a high to low transition on the data line while the SCL line is held high. After this
has been transmitted by the master, the bus is considered busy. The next byte of data
transmitted after the start condition contains the address of the slave in the first 7 bits and
the 8th bit tells whether the master is receiving data from the slave or transmitting data to
the slave. When an address is sent, each device in the system compares the first seven bits
after a start condition with its address. If they match, the device considers itself addressed
by the master.
The Slave ADdress (SAD) associated with the LSM320HAY30 is 001100xb. The SDO/SA0
pad can be used to modify the least significant bit of the device address. If the SA0 pad is
connected to voltage supply, LSb is ‘1’ (address 0011001b), otherwiseif the SA0 pad is
connected to ground, the LSb value is ‘0’ (address 0011000b). This solution permits
connecting and addressing two different accelerometers to the same I
Data transfer with acknowledge is mandatory. The transmitter must release the SDA line
during the acknowledge pulse. The receiver must then pull the data line LOW so that it
remains stable low during the HIGH period of the acknowledge clock pulse. A receiver which
has been addressed is obliged to generate an acknowledge after each byte of data
received.
2
The I
C embedded in the LSM320HAY30 behaves like a slave device and the following
protocol must be adhered to. After the start condition (ST) a slave address is sent. Once a
slave acknowledge (SAK) has been returned, an 8-bit sub-address (SUB) is transmitted: the
7 LSb represent the actual register address while the MSB enables address auto-increment.
If the MSb of the SUB field is ‘1’, the SUB (register address) is automatically incremented to
allow multiple data read/write.
2
C lines.
The slave address is completed with a read/write bit. If the bit was ‘1’ (read), a repeated
START (SR) condition will have to be issued after the two sub-address bytes; if the bit is ‘0’
(write) the master transmits to the slave with direction unchanged. Table 9 explains how the
SAD+Read/Write bit pattern is composed, listing all the possible configurations.
Table 9.SAD+Read/Write patterns
CommandSAD[6:1]SAD[0] = SA0R/WSAD+R/W
Read0011000100110001 (31h)
Write0011000000110000 (30h)
Read0011001100110011 (33h)
Write0011001000110010 (32h)
Table 10.Transfer when master is writing one byte to slave
MasterSTSAD + WSUBDATASP
SlaveSAKSAKSAK
Doc ID 16917 Rev 121/42
Digital interfacesLSM320HAY30
Table 11.Transfer when master is writing multiple bytes to slave
MasterSTSAD + WSUBDATADATASP
SlaveSAKSAKSAKSAK
Table 12.Transfer when master is receiving (reading) one byte of data from slave
MasterSTSAD + WSUBSRSAD + RNMAKSP
SlaveSAKSAKSAKDATA
Table 13.Transfer when master is receiving (reading) multiple bytes of data from slave
MasterST SAD+WSUBSR SAD+RMAKMAKNMAKSP
SlaveSAKSAKSAKDATADATADATA
Data are transmitted in byte format (DATA). Each data transfer contains 8 bits. The number
of bytes transferred per transfer is unlimited. Data is transferred with the most significant bit
(MSb) first. If a receiver cannot receive another complete byte of data until it has performed
some other function, it can hold the clock line SCL LOW to force the transmitter into a wait
state. Data transfer only continues when the receiver is ready for another byte and releases
the data line. If a slave receiver does not acknowledge the slave address (i.e. it is not able to
receive because it is performing a real-time function) the data line must be left HIGH by the
slave. The master can then abort the transfer. A LOW to HIGH transition on the SDA line
while the SCL line is HIGH is defined as a STOP condition. Each data transfer must be
terminated by the generation of a STOP (SP) condition.
In order to read multiple bytes, it is necessary to assert the most significant bit of the subaddress field. In other words, SUB(7) must be equal to 1 while SUB(6-0) represents the
address of the first register to be read.
In the presented communication format MAK is Master Acknowledge and NMAK is No
Master Acknowledge.
6.2 SPI bus interface
The LSM320HAY30 SPI is a bus slave. The SPI allows writing and reading of the registers
of the device.
The serial interface interacts with the outside world with 4 wires: CS, SPC, SDI and SDO.
22/42Doc ID 16917 Rev 1
LSM320HAY30Digital interfaces
Figure 5.Read and write protocol
CS
SPC
SDI
DI7DI6DI5DI4DI3DI2DI1DI0
DO7DO6DO5DO4DO3DO2DO1DO0
SDO
RW
MS
AD5 AD4 AD3 AD2 AD1 AD0
CS is the serial port enable and is controlled by the SPI master. It goes low at the start of the
transmission and goes back high at the end. SPC is the serial port clock and is controlled by
the SPI master. It is stopped high when CS is high (no transmission). SDI and SDO are
respectively the serial port data input and output. These lines are driven at the falling edge
of SPC and should be captured at the rising edge of SPC.
Both the read register and write register commands are completed in 16 clock pulses or in
multiples of 8 in case of multiple bytes read/write. Bit duration is the time between two falling
edges of SPC. The first bit (bit 0) starts at the first falling edge of SPC after the falling edge
of CS while the last bit (bit 15, bit 23, ...) starts at the last falling edge of SPC just before the
rising edge of CS.
bit 0: RW
from the device is read. In the latter case, the chip drives SDO at the start of bit 8.
bit 1: MS
When 1, the address is auto incremented in multiple read/write commands.
bit 2-7: address AD(5:0). This is the address field of the indexed register.
bit 8-15: data DI(7:0) (write mode). This is the data that is written into the device (MSb first).
bit 8-15: data DO(7:0) (read mode). This is the data that is read from the device (MSb first).
In multiple read/write commands, further blocks of 8 clock periods are added. When the MS
bit is ‘0’ the address used to read/write data remains the same for every block. When the MS
bit is ‘1’ the address used to read/write data is incremented at every block.
The function and the behavior of SDI and SDO remain unchanged.
6.2.1 SPI read
Figure 6.SPI read protocol
bit. When 0, the data DI(7:0) is written to the device. When 1, the data DO(7:0)
bit. When 0, the address remains unchanged in multiple read/write commands.
CS
SPC
SDI
RW
MS
AD5 AD4 AD3 AD2 AD1 AD0
SDO
DO7 DO6 DO5DO4 DO3 DO2 DO1DO0
Doc ID 16917 Rev 123/42
Digital interfacesLSM320HAY30
The SPI Read command is performed with 16 clock pulses. A multiple byte read command
is performed adding blocks of 8 clock pulses afterthe previous one.
bit 0: READ bit. The value is 1.
bit 1: MS
multiple reading.
bit 2-7: address AD(5:0). This is the address field of the indexed register.
bit 8-15: data DO(7:0) (read mode). This is the data that is read from the device (MSb first).
bit 16-... : data DO(...-8). Further data in multiple byte reading.
bit. When 0, do not increment the address. When 1, increment the address in
RW
AD5 AD4 AD3 AD2 AD1 AD0
MS
DO7DO6DO5DO4DO3DO2DO1DO0
DO15 DO14 DO13 DO12 DO11 DO10 DO9 DO8
CS
SPC
SDI
RW
AD5 AD4 AD3 AD2 AD1 AD0MS
DI7 DI6 DI5 DI4 DI3 DI2 DI1 DI0
The SPI Write command is performed with 16 clock pulses. A multiple byte write command
is performed adding blocks of 8 clock pulses after the previous one.
bit 0: WRITE bit. The value is 0.
bit 1: MS
bit. When 0, do not increment the address. When 1, increment the address in
multiple writing.
bit 2 -7: address AD(5:0). This is the address field of the indexed register.
bit 8-15: data DI(7:0) (write mode). This is the data that is written to the device (MSb first).
bit 16-... : data DI(...-8). Further data in multiple byte writing.
3-wires mode is entered by setting to ‘1’ bit SIM (SPI serial interface mode selection) in
LA_CTRL_REG4.
Figure 10. SPI read protocol in 3-wires mode
CS
SPC
SDI/O
RW
MS
AD5 AD4 AD3 AD2 AD1 AD0
DO7 DO6 DO5 DO4 DO3 DO2 DO1 DO0
The SPI Read command is performed with 16 clock pulses:
bit 0: READ bit. The value is 1.
bit 1: MS
bit. When 0, do not increment the address. When 1, increment the address in
multiple reading.
bit 2-7: address AD(5:0). This is the address field of the indexed register.
bit 8-15: data DO(7:0) (read mode). This is the data that is read from the device (MSb first).
Multiple read command is also available in 3-wires mode.
Doc ID 16917 Rev 125/42
Register mappingLSM320HAY30
7 Register mapping
The table given below provides a listing of the 8-bit registers embedded in the device and
the related addresses:
Table 14.Register address map
Register address
NameType
HexBinary
Reserved (do not modify)00 - 0EReserved
WHO_AM_Ir0F000 1111 00110010Dummy register
Reserved (do not modify)10 - 1FReserved
LA_CTRL_REG1rw20010 0000 00000111
LA_CTRL_REG2rw21010 0001 00000000
LA_CTRL_REG3rw22010 0010 00000000
LA_CTRL_REG4rw23010 0011 00000000
LA_CTRL_REG5rw24010 0100 00000000
DefaultComment
LA_HP_FILTER_RESETr25010 0101Dummy register
LA_REFERENCErw26010 0110 00000000
LA_STATUS_REGr27010 0111 00000000
LA_OUT_X_Lr28010 1000output
LA_OUT_X_Hr29010 1001output
LA_OUT_Y_Lr2A010 1010output
LA_OUT_Y_Hr2B010 1011output
LA_OUT_Z_Lr2C010 1100output
LA_OUT_Z_Hr2D010 1101output
Reserved (do not modify)2E - 2FReserved
LA_INT1_CFGrw30011 0000 00000000
LA_INT1_SOURCEr31011 0001 00000000
LA_INT1_THSrw32011 0010 00000000
LA_INT1_DURATIONrw33011 0011 00000000
LA_INT2_CFGrw34011 0100 00000000
LA_INT2_SOURCEr35011 0101 00000000
LA_INT2_THSrw36011 0110 00000000
LA_INT2_DURATIONrw37011 0111 00000000
Reserved (do not modify)38 - 3FReserved
26/42Doc ID 16917 Rev 1
LSM320HAY30Register mapping
Registers marked as Reserved must not be changed. Writing to these registers may cause
permanent damage to the device.
The content of the registers that are loaded at boot should not be changed. They contain the
factory calibrated values. Their content is automatically restored when the device is powered
up.
Doc ID 16917 Rev 127/42
Register descriptionLSM320HAY30
8 Register description
The device contains a set of registers which are used to control acceleration portion
behavior and to retrieve acceleration data. The register address, composed of 7 bits, is used
to identify them and to write the data through the serial interface.
8.1 WHO_AM_I (0Fh)
Table 15.WHO_AM_I register
00110010
This register is the device identification register, and contains the device identifier which, for
the LSM320HAY30, is set to 32h.
8.2 LA_CTRL_REG1 (20h)
Table 16.LA_CTRL_REG1 register
PM2PM1PM0DR1DR0ZenYenXen
Table 17.LA_CTRL_REG1 description
PM2 - PM0
DR1, DR0
Zen
Ye n
Xen
Power mode selection. Default value: 000
(000: Power-down; Others: refer to Table 18)
Data rate selection. Default value: 00
(00:50 Hz; others: refer to Table 19)
Z axis enable. Default value: 1
(0: Z axis disabled; 1: Z axis enabled)
Y axis enable. Default value: 1
(0: Y axis disabled; 1: Y axis enabled)
X axis enable. Default value: 1
(0: X axis disabled; 1: X axis enabled)
PM bits allow selection between power-down and two operating active modes. The device is
in power-down mode when the PD bits are set to “000” (default value after boot). Table 18
shows all the possible power mode configurations and respective output data rates. Output
data in the low-power modes are computed with a low-pass filter cut-off frequency defined
by DR1, DR0 bits.
DR bits, in normal mode operation, select the data rate at which acceleration samples are
produced. In low-power mode they define the output data resolution. Table 19 shows all the
possible configurations for the DR1 and DR0 bits.
28/42Doc ID 16917 Rev 1
LSM320HAY30Register description
Table 18.Power mode and low-power output data rate configurations
PM2PM1PM0Power mode selection
000Power-down--
001Normal modeODR
010Low power0.5
011Low power1
100Low power2
101Low power5
110Low power10
Output data rate [Hz]
ODR
LP
Table 19.Normal mode output data rate configurations and low-pass cut-off
The BOOT bit is used to refresh the content of the internal registers stored in the Flash
memory block. At device power-up, the content of the Flash memory block is transferred to
the internal registers related to trimming functions to permit good device behavior. If, for any
reason, the content of the trimming registers was changed, it is sufficient to use this bit to
restore the correct values. When the BOOT bit is set to ‘1’, the content of internal Flash is
copied to the corresponding internal registers and is used to calibrate the device. These
values are factory-trimmed and are different for every accelerometer. They permit good
device behavior and normally do not have to be modified. At the end of the boot process, the
BOOT bit is again set to ‘0’.
Table 22.High-pass filter mode configuration
HPM1HPM0High-pass filter mode
00Normal mode (reset reading HP_RESET_FILTER)
01Reference signal for filtering
10Normal mode (reset reading HP_RESET_FILTER)
HPCF[1:0]. These bits are used to configure the high-pass filter cut-off frequency f
given by:
f
⎛⎞
f
1
t
⎝⎠
1
----------- -–
HPc
s
------
⋅ln=
2π
The equation can be simplified to the following approximated equation:
f
----------------------=
6HPc⋅
s
f
t
Table 23.High-pass filter cut-off frequency configuration
[Hz]
f
HPcoeff2,1
0012820
010.51410
100.250.525
110.1250.2512.5
t
Data rate = 50 Hz
ft [Hz]
Data rate = 100 Hz
ft [Hz]
Data rate = 400 Hz
ft [Hz]
Data rate = 1000 Hz
which is
t
30/42Doc ID 16917 Rev 1
LSM320HAY30Register description
8.4 LA_CTRL_REG3 (22h)
Table 24.LA_CTRL_REG3 register
IHLPP_ODLIR2I2_CFG1I2_CFG0LIR1I1_CFG1I1_CFG0
Table 25.LA_CTRL_REG3 description
IHL
Interrupt active high, low. Default value: 0
(0: active high; 1: active low)
PP_OD
LIR2
I2_CFG1,
I2_CFG0
LIR1
I1_CFG1,
I1_CFG0
Push-pull/open drain selection on interrupt pad. Default value 0.
(0: push-pull; 1: open drain)
Latch interrupt request on INT2_SRC register, with INT2_SRC register cleared by
reading INT2_SRC itself. Default value: 0.
(0: interrupt request not latched; 1: interrupt request latched)
Data signal on INT 2 pad control bits. Default value: 00.
(see table below)
Latch interrupt request on INT1_SRC register, with INT1_SRC register cleared by
reading INT1_SRC register. Default value: 0.
(0: interrupt request not latched; 1: interrupt request latched)
Data signal on INT 1 pad control bits. Default value: 00.
(see table below)
Table 26.Data signal on INT 1 and INT 2 pad
I1(2)_CFG1I1(2)_CFG0INT 1(2) Pad
00Interrupt 1 (2) source
01Interrupt 1 source OR Interrupt 2 source
10Data ready
11Boot running
8.5 LA_CTRL_REG4 (23h)
Table 27.LA_CTRL_REG4 register
BDUBLEFS1FS0STsign0STSIM
Doc ID 16917 Rev 131/42
Register descriptionLSM320HAY30
Table 28.LA_CTRL_REG4 description
Block data update. Default value: 0
BDU
BLE
FS1, FS0
STsign
ST
SIM
(0: continuous update; 1: output registers not updated between MSB and LSB
reading)
Big/little endian data selection. Default value 0.
(0: data LSB @ lower address; 1: data MSB @ lower address)
The BDU bit is used to inhibit output register updates between the reading of the upper and
lower register parts. In default mode (BDU = ‘0’), the lower and upper register parts are
updated continuously. If it is not certain to read faster than the output data rate, it is
recommended to set BDU bit to ‘1’. In this way, after the reading of the lower (upper) register
part, the content of that output register is not updated until the upper (lower) part is read
also. This feature avoids reading LSB and MSB related to different samples.
8.6 LA_CTRL_REG5 (24h)
Table 29.LA_CTRL_REG5 register
000000TurnOn1TurnOn0
Table 30.LA_CTRL_REG5 description
Tu r n On 1 ,
Tu r n On 0
Turn On bits are used for turning on the sleep-to-wake function.
Table 31.Sleep-to-wake configuration
TurnOn1TurnOn0Sleep-to-wake status
00Sleep-to-wake function is disabled
11
Turn-on mode selection for sleep-to-wake function. Default value: 00.
Turned on: The device is in low-power mode (ODR is defined in
LA_CTRL_REG1)
32/42Doc ID 16917 Rev 1
LSM320HAY30Register description
By setting the TurnOn[1:0] bits to 11, the “sleep-to-wake” function is enabled. When an
interrupt event occurs, the device is goes into normal mode, increasing the ODR to the value
defined in LA_CTRL_REG1. Although the device is in normal mode, LA_CTRL_REG1
content is not automatically changed to “normal mode” configuration.
8.7 LA_HP_FILTER_RESET (25h)
Dummy register. Reading at this address instantaneously zeroes the content of the internal
high-pass filter. If the high-pass filter is enabled, all three axes are instantaneously set to 0
g. This makes it possible to surmount the settling time of the high-pass filter.
8.8 REFERENCE (26h)
Table 32.REFERENCE register
Ref7Ref6Ref5Ref4Ref3Ref2Ref1Ref0
Table 33.REFERENCE description
Ref7 - Ref0Reference value for high-pass filter. Default value: 00h.
This register sets the acceleration value taken as a reference for the high-pass filter output.
When the filter is turned on (at least one FDS, HPen2, or HPen1 bit is equal to ‘1’) and HPM
bits are set to “01”, filter out is generated taking this value as a reference.
8.9 LA_STATUS_REG (27h)
Table 34.LA_STATUS_REG register
ZYXORZORYORXORZYXDAZDAYDAXDA
Table 35.LA_STATUS_REG description
X, Y and Z axis data overrun. Default value: 0
ZYXOR
ZOR
YOR
(0: no overrun has occurred;
1: new data has overwritten the previous one before it was read)
Z axis data overrun. Default value: 0
(0: no overrun has occurred;
1: new data for the Z-axis has overwritten the previous one)
Y axis data overrun. Default value: 0
(0: no overrun has occurred;
1: new data for the Y-axis has overwritten the previous one)
Doc ID 16917 Rev 133/42
Register descriptionLSM320HAY30
Table 35.LA_STATUS_REG description (continued)
X axis data overrun. Default value: 0
XOR
ZYXDAX, Y and Z axis new data available. Default value: 0
ZDAZ axis new data available. Default value: 0
YDAY axis new data available. Default value: 0
XDAX axis new data available. Default value: 0
(0: no overrun has occurred;
1: new data for the X-axis has overwritten the previous one)
(0: a new set of data is not yet available; 1: a new set of data is available)
(0: new data for the Z-axis is not yet available;
1: new data for the Z-axis is available)
(0: new data for the Y-axis is not yet available;
1: new data for the Y-axis is available)
(0: new data for the X-axis is not yet available;
1: new data for the X-axis is available)
8.10 LA_OUT_X_L (28h), LA_OUT_X_H (29h)
X-axis acceleration data. The value is expressed as two’s complement.
8.11 LA_OUT_Y_L (2Ah), LA_OUT_Y_H (2Bh)
Y-axis acceleration data. The value is expressed as two’s complement.
8.12 LA_OUT_Z_L (2Ch), LA_OUT_Z_H (2Dh)
Z-axis acceleration data. The value is expressed as two’s complement.
8.13 LA_INT1_CFG (30h)
Table 36.LA_INT1_CFG register
AOI6DZHIEZLIEYHIEYLIEXHIEXLIE
Table 37.LA_INT1_CFG description
AOI
6D
ZHIE
AND/OR combination of interrupt events. Default value: 0.
(See Table 38)
6 direction detection function enable. Default value: 0.
(See Table 38)
Enable interrupt generation on Z high event. Default value: 0
(0: disable interrupt request;
1: enable interrupt request on measured accel. value higher than preset threshold)
34/42Doc ID 16917 Rev 1
LSM320HAY30Register description
Table 37.LA_INT1_CFG description (continued)
Enable interrupt generation on Z Low event. Default value: 0
ZLIE
YHIE
YLIE
XHIE
XLIE
(0: disable interrupt request;
1: enable interrupt request on measured accel. value lower than preset threshold)
Enable interrupt generation on Y high event. Default value: 0
(0: disable interrupt request;
1: enable interrupt request on measured accel. value higher than preset threshold)
Enable interrupt generation on Y low event. Default value: 0
(0: disable interrupt request;
1: enable interrupt request on measured accel. value lower than preset threshold)
Enable interrupt generation on X high event. Default value: 0
(0: disable interrupt request;
1: enable interrupt request on measured accel. value higher than preset threshold)
Enable interrupt generation on X Low event. Default value: 0
(0: disable interrupt request;
1: enable interrupt request on measured accel. value lower than preset threshold)
Configuration register for Interrupt 1 source.
Table 38.Interrupt 1 source configurations
AOI6DInterrupt mode
00OR combination of interrupt events
016 direction movement recognition
10AND combination of interrupt events
116 direction position recognition
8.14 LA_INT1_SRC (31h)
Table 39.LA_INT1_SRC register
0 IA ZHZLYHYLXHXL
Table 40.LA_INT1_SRC description
IA
ZH
ZL
YH
Interrupt active. Default value: 0
(0: no interrupt has been generated; 1: one or more interrupts have been generated)
Z High. Default value: 0
(0: no interrupt, 1: Z high event has occurred)
Z Low. Default value: 0
(0: no interrupt; 1: Z low event has occurred)
Y High. Default value: 0
(0: no interrupt, 1: Y high event has occurred)
Doc ID 16917 Rev 135/42
Register descriptionLSM320HAY30
Table 40.LA_INT1_SRC description (continued)
YL
XH
XL
Y Low. Default value: 0
(0: no interrupt, 1: Y low event has occurred)
X High. Default value: 0
(0: no interrupt, 1: X High event has occurred)
X Low. Default value: 0
(0: no interrupt, 1: X Low event has occurred)
Interrupt 1 source register. Read-only register.
Reading at this address clears LA_INT1_SRC IA bit (and the interrupt signal on INT 1 pin)
and allows the refreshing of data in the LA_INT1_SRC register if the latched option was
chosen.
The D6 - D0 bits set the minimum duration of the Interrupt 2 event to be recognized.
Duration steps and maximum values depend on the ODR chosen.
8.17 LA_INT2_CFG (34h)
Table 45.LA_INT2_CFG register
AOI6DZHIEZLIEYHIEYLIEXHIEXLIE
36/42Doc ID 16917 Rev 1
LSM320HAY30Register description
Table 46.LA_INT2_CFG description
AOI
6D
ZHIE
ZLIE
YHIE
YLIE
XHIE
XLIE
AND/OR combination of Interrupt events. Default value: 0.
(See table below)
6 direction detection function enable. Default value: 0.
(See table below)
Enable interrupt generation on Z High event. Default value: 0
(0: disable interrupt request;
1: enable interrupt request on measured accel. value higher than preset threshold)
Enable interrupt generation on Z Low event. Default value: 0
(0: disable interrupt request;
1: enable interrupt request on measured accel. value lower than preset threshold)
Enable interrupt generation on Y High event. Default value: 0
(0: disable interrupt request;
1: enable interrupt request on measured accel. value higher than preset threshold)
Enable interrupt generation on Y Low event. Default value: 0
(0: disable interrupt request;
1: enable interrupt request on measured accel. value lower than preset threshold)
Enable interrupt generation on X High event. Default value: 0
(0: disable interrupt request;
1: enable interrupt request on measured accel. value higher than preset threshold)
Enable interrupt generation on X Low event. Default value: 0
(0: disable interrupt request;
1: enable interrupt request on measured accel. value lower than preset threshold)
Configuration register for Interrupt 2 source.
Table 47.Interrupt mode configuration
AOI6DInterrupt mode
00OR combination of interrupt events
016 direction movement recognition
10AND combination of interrupt events
116 direction position recognition
8.18 LA_INT2_SRC (35h)
Table 48.LA_INT2_SRC register
0 IA ZHZLYHYLXHXL
Doc ID 16917 Rev 137/42
Register descriptionLSM320HAY30
Table 49.LA_INT2_SRC description
IA
ZH
ZL
YH
YL
XH
XL
Interrupt active. Default value: 0
(0: no interrupt has been generated; 1: one or more interrupts have been generated)
Z High. Default value: 0
(0: no interrupt, 1: Z High event has occurred)
Z Low. Default value: 0
(0: no interrupt; 1: Z Low event has occurred)
Y High. Default value: 0
(0: no interrupt, 1: Y High event has occurred)
Y Low. Default value: 0
(0: no interrupt, 1: Y Low event has occurred)
X High. Default value: 0
(0: no interrupt, 1: X High event has occurred)
X Low. Default value: 0
(0: no interrupt, 1: X Low event has occurred)
Interrupt 2 source register. Read-only register.
Reading at this address clears the LA_INT2_SRC IA bit (and the interrupt signal on INT 2
pin) and allows the refreshing of data in the LA_INT2_SRC register if the latched option was
chosen.
The D6 - D0 bits set the minimum duration of the Interrupt 2 event to be recognized.
Duration time steps and maximum values depend on the ODR chosen.
38/42Doc ID 16917 Rev 1
LSM320HAY30Package information
9 Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK is an ST trademark.
Figure 11. LGA-28: mechanical data and package dimensions
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