The LD49300xx is a high-bandwidth, low dropout, 3.0 A voltage regulator, ideal for powering
core voltages of low-power microprocessors. The
LD49300xx implements a dual supply
configuration allowing for very low output
impedance and very fast transient response. The
LD49300xx requires a bias input supply and a
main input supply, allowing for ultra-low input
voltages on the main supply rail. The input supply
operates from 1.4 V to 5.5 V and the bias supply
requires between 3 V and 6 V for proper
operation. The LD49300xx offers fixed output
voltages from 0.8 V to 1.8 V and adjustable output
voltages down to 0.8 V. The LD49300xx requires a
minimum output capacitance for stability, and
works optimally with small ceramic capacitors.
Table 1.Device summary
Order codesPackagePackaging
LD49300PT08R
LD49300PT10RPPAK (Tape and reel)2500 parts per reel
LD49300PT12RPPAK (Tape and reel)2500 parts per reel
The LD49300xx is an ultra-high performance, low dropout linear regulator, designed for high
current application that requires fast transient response. The LD49300xx operates from two
input voltages, to reduce dropout voltage. The LD49300xx is designed so that a minimum of
external component are necessary.
8.1 Input supply voltage (VIN)
VIN provides the power input current to the LD49300xx. The minimum input voltage can be
as low as 1.4 V, allowing conversion from very low voltage supplies to achieve low output
voltage levels with very low power dissipation.
8.2 Bias supply voltage (V
The LD49300xx control circuitry is supplied the V
current (3 mA typ.) even at the maximum output current level (3 A). A bypass capacitor on
the bias pin is recommended to improve the performance of the LD49300xx during line and
load transient. The small ceramic capacitor from V
noise that could be injected into the control circuitry from the bias rail. In typical applications
a 1 µF ceramic chip capacitor may be used. The V
the output voltage, with a minimum V
8.3 External capacitors
To assure regulator stability, input and output capacitors are required as shown in the typical
application circuit.
8.4 Output capacitor
The LD49300xx requires a minimum output capacitance to maintain stability. A ceramic chip
capacitor of at least 1 µF is required. However, specific capacitor selection could be needed
to ensure the transient response. A 1 µF ceramic chip capacitor satisfies most applications
but 10 µF is recommended to ensure better transient performances. In applications where
the V
recommended to use an output capacitors of, at least, 10 µF in order to avoid over-voltage
stress on the Input/output power pins during short circuit conditions due to parasitic
inductive effect. The output capacitor must be located as close as possible to the output pin
of the LD49300xx. The ESR (equivalent series resistance) of the output capacitor must be
within the "STABLE" region as shown in the typical characteristics figures. Both ceramic and
tantalum capacitors are suitable.
level is close to the maximum operating voltage (V
IN
BIAS
BIAS
)
pin which requires a very low bias
BIAS
to ground reduces high frequency
BIAS
input voltage must be 2.1 V above
input voltage of 3 V.
BIAS
> 4 V), it is strongly
IN
8.5 Minimum load current
The LD49300xx does not require a minimum load to maintain output voltage regulation.
In order to ensure the correct biasing and settling of the regulator internal circuitry during the
startup phase, as well as to avoid overvoltage spikes at the output, it is recommended to
provide for the correct power sequencing.
As a general rule the V
and V
IN
signals timings at startup should be chosen properly, so
INH
that they are applied to the device after the V
operative value (see paragraph 8.2: Bias supply voltage (VBIAS)). This can be achieved, for
instance, by avoiding too slow V
rising edges (Tr > 10 ms).
BIAS
Provided that the above condition is satisfied, when fast V
present, a smooth startup, with limited overvoltage on the output, can be obtained by
applying V
voltage at the same time as the V
IN
and Figure 22 on page 11).
In the fixed voltage versions it is possible to reduce overvoltage spikes during very fast
startup (T
<< 100 µs) by pulling the V
r
pin up to VIN voltage (see Figure 23 on page 12).
INH
8.7 Power dissipation/heatsinking
A heatsink may be required depending on the maximum power dissipation and maximum
ambient temperature of the application. Under all possible conditions, the junction
temperature must be within the range specified under operating conditions. The total power
dissipation of the device is given by:
P
= VIN x IIN + V
D
Where:
●V
●V
●V
●I
, Input supply voltage
IN
, Bias supply voltage
BIAS
, Output voltage
OUT
, Load current
OUT
From this data, we can calculate the thermal resistance (
using the following formula:
BIAS
x I
BIAS
- V
OUT
x I
OUT
voltage is already settled at its minimum
BIAS
transient input (Tr < 100 µs) is
IN
voltage (refer to Figure 20, Figure 21
BIAS
θ
) required for the heat sink
SA
θ
= (TJ - TA/PD) - (θJC + θCS)
SA
The maximum allowed temperature rise (T
temperature (T
(T
):
Jmax
T
= T
Rmax
Jmax
) of the application, and the maximum allowable junction temperature
Amax
- T
Amax
Rmax
The maximum allowable value for junction to ambient thermal resistance, θJA, can be
calculated using the formula:
θ
JAmax
= T
Rmax
/ P
D
This part is available for the PPAK package.
The thermal resistance depends on the amount of copper area or heat sink, and on air flow.
If the maximum allowable value of
θ
calculated above is ≥100 °C/W for the PPAK
JA
package, no heatsink is needed since the package can dissipate enough heat to satisfy
these requirements. If the value for allowable
The PPAK package uses the copper plane on the PCB as a heatsink. The tab of these
packages is soldered to the copper plane for heat sinking. It is also possible to use the PCB
ground plane a heatsink. This area can be the inner GND layer of a multi-layer PCB, or, in a
dual layer PCB, it can be an unbroken GND area on the opposite side where the IC is
situated with a dissipating area thermally connected through vias holes, filled by solder.
Figure 25 shows a curve for
θ
of the PPAK package for different copper area sizes, using
JA
a typical PCB with 1/16 in thick G10/FR4.
θ
Figure 25.
vs. Copper Area for PPAK package
JA
8.9 Adjustable regulator design
The LD49300xx adjustable version allows fixing output voltage anywhere between 0.8 V and
4.5 V using two resistors as shown in the typical application circuit. For example, to fix the
R1 resistor value between V
(R2) is calculated by:
R2 = R1 [0.8 / (V
Where V
It is suggested to use R1 values lower than 10 kΩ to obtain better load transient
performances. Even, higher values up to 100 kΩ are suitable.
8.10 Enable
The fixed output voltage versions of LD49300xx feature an active high enable input (EN)
that allows on-off control of the regulator. The EN input threshold is guaranteed between 0.4
V and 1.4 V, for simple logic interfacing. The regulator is set in shut down mode when V
0.4 V and it is in operating mode (V
must be tied directly to the V
not be left at high impedance.
and the ADJ pin, the resistor value between ADJ and GND
OUT
- 0.8)]
OUT
is the desired output voltage.
OUT
to keep the regulator continuously activated. The En pin must
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK®
®
is an ST trademark.
16/20Doc ID 12861 Rev 3
LD49300XX08, LD49300XX10, LD49300XX12Package mechanical data
LD49300XX08, LD49300XX10, LD49300XX12Revision history
10 Revision history
Table 6.Document revision history
DateRevisionChanges
20-Nov-20061Initial release.
01-Dec-20062Add note in cover page.
30-Jun-20103Modified Section 8.6: Power sequencing recommendations on page 14.
Doc ID 12861 Rev 319/20
LD49300XX08, LD49300XX10, LD49300XX12
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