1.5 A very low drop for low output voltage regulator
Features
■ Input voltage range:
–V
= 1.4 V to 5.5 V
I
–V
■ Stable with ceramic capacitor
■ ±1.5 % initial tolerance
■ Maximum dropout voltage (V
over temperature
■ Adjustable output voltage down to 0.8 V
■ Ultra fast transient response (up to 10 MHz
bandwidth)
■ Excellent line and load regulation
specifications
■ Logic controlled shutdown option
■ Thermal shutdown and current limit protection
■ Junction temperature range: - 25 °C to 125 °C
Applications
■ Graphics processors
■ PC add-in cards
■ Microprocessor core voltage supply
■ Low voltage digital ICs
■ High efficiency linear power supplies
■ SMPS post regulators
= 3 V to 6 V
BIAS
- VO) of 200 mV
I
LD49150XX08
PPAK
Description
The LD49150xx is a high-bandwidth, low-dropout,
1.5 A voltage regulator, ideal for powering core
voltages of low-power microprocessors. The
LD49150xx implements a dual supply
configuration allowing for very low output
impedance and very fast transient response. The
LD49150xx requires a bias input supply and a
main input supply, allowing for ultra-low input
voltages on the main supply rail. The input supply
operates from 1.4 V to 5.5 V and the bias supply
requires between 3 V and 6 V for proper
operation. The LD49150xx offers fixed output
voltages from 0.8 V to 1.8 V and adjustable output
voltages down to 0.8 V. The LD49150xx requires a
minimum output capacitance for stability, and
work optimally with small ceramic capacitors.
The LD49150xx is an ultra-high performance, low dropout linear regulator, designed for high
current application that requires fast transient response. The LD49150xx operates from two
input voltages, to reduce dropout voltage. The LD49150xx is designed so that a minimum of
external component are necessary.
8.1 Input supply voltage (VIN)
VIN provides the power input current to the LD49150xx. The minimum input voltage can be
as low as 1.4 V, allowing conversion from very low voltage supplies to achieve low output
voltage levels with very low power dissipation.
8.2 Bias supply voltage (V
The LD49150xx control circuitry is supplied the V
current (3 mA typ.) even at the maximum output current level (1.5 A). A bypass capacitor on
the bias pin is recommended to improve the performance of the LD49150xx during line and
load transient. The small ceramic capacitor from V
noise that could be injected into the control circuitry from the bias rail. In typical applications
a 1 µF ceramic chip capacitor may be used. The V
the output voltage, with a minimum V
8.3 External capacitors
To assure regulator stability, input and output capacitors are required as shown in the 1:
Typical application circuits.
8.4 Output capacitor
The LD49150xx requires a minimum output capacitance to maintain stability. A ceramic chip
capacitor of at least 1 µF is required. However, specific capacitor selection could be needed
to ensure the transient response. A 1 µF ceramic chip capacitor satisfies most applications
but 10 µF is recommended to ensure better transient performances. In applications where
the V
recommended to use an output capacitors of, at least, 10 µF in order to avoid over-voltage
stress on the Input/output power pins during short circuit conditions due to parasitic
inductive effect. The output capacitor must be located as close as possible to the output pin
of the LD49150xx. The ESR (equivalent series resistance) of the output capacitor must be
within the "stable" region as shown in the typical characteristics figures. Both ceramic and
tantalum capacitors are suitable.
level is close to the maximum operating voltage (V
IN
BIAS
BIAS
)
pin which requires a very low bias
BIAS
to ground reduces high frequency
BIAS
input voltage must be 2.1 V above
input voltage of 3 V.
BIAS
> 4 V), it is strongly
IN
8.5 Minimum load current
The LD49150xx does not require a minimum load to maintain output voltage regulation.
In order to ensure the correct biasing and settling of the regulator internal circuitry during the
startup phase, as well as to avoid overvoltage spikes at the output, it is recommended to
provide for the correct power sequencing.
As a general rule the V
and V
IN
signals timings at startup should be chosen properly, so
INH
that they are applied to the device after the V
operative value (see paragraph 8.2: Bias supply voltage (VBIAS)). This can be achieved, for
instance, by avoiding too slow V
rising edges (Tr >10 ms).
BIAS
Provided that the above condition is satisfied, when fast V
present, a smooth startup, with limited overvoltage on the output, can be obtained by
applying V
voltage at the same time as the V
IN
and Figure 22 on page 11).
In the fixed voltage versions it is possible to reduce overvoltage spikes during very fast
startup (T
<< 100 µs) by pulling the V
r
pin up to VIN voltage (see Figure 23 on page 12).
INH
8.7 Power dissipation/heatsinking
A heatsink may be required depending on the maximum power dissipation and maximum
ambient temperature of the application. Under all possible conditions, the junction
temperature must be within the range specified under operating conditions. The total power
dissipation of the device is given by:
P
= VIN x IIN + V
D
Where:
●V
●V
●V
●I
, input supply voltage
IN
, bias supply voltage
BIAS
, output voltage
OUT
, load current
OUT
From this data, we can calculate the thermal resistance (
using the following formula:
BIAS
x I
BIAS
- V
OUT
x I
OUT
voltage is already settled at its minimum
BIAS
transient input (Tr < 100 µs) is
IN
voltage (refer to Figure 20, Figure 21
BIAS
θ
) required for the heat sink
SA
θ
= (TJ - TA/PD) - (θJC + θCS)
SA
The maximum allowed temperature rise (T
temperature (T
(T
):
Jmax
T
= T
Rmax
Jmax
) of the application, and the maximum allowable junction temperature
Amax
- T
Amax
Rmax
The maximum allowable value for junction to ambient thermal resistance, θJA, can be
calculated using the formula:
θ
JAmax
= T
Rmax
/ P
D
This part is available for the PPAK package.
The thermal resistance depends on the amount of copper area or heat sink, and on air flow.
If the maximum allowable value of
θ
calculated above is ≥ 100 °C/W for the PPAK
JA
package, no heatsink is needed since the package can dissipate enough heat to satisfy
these requirements. If the value for allowable
The PPAK package uses the copper plane on the PCB as a heatsink. The tab of these
packages is soldered to the copper plane for heat sinking. It is also possible to use the PCB
ground plane a heatsink. This area can be the inner GND layer of a multi-layer PCB, or, in a
dual layer PCB, it can be an unbroken GND area on the opposite side where the IC is
situated with a dissipating area thermally connected through vias holes, filled by solder.
Figure 26 shows a curve for
θ
of the PPAK package for different copper area sizes, using
JA
a typical PCB with 1/16 in thick G10/FR4.
θ
Figure 24.
vs. copper area for PPAK package
JA
8.9 Adjustable regulator design
The LD49150xx adjustable version allows fixing output voltage anywhere between 0.8 V and
4.5 V using two resistors as shown in the typical application circuit. For example, to fix the
R
resistor value between V
1
(R
) is calculated by:
2
R
= R1 [0.8/(V
2
Where V
It is suggested to use R1 values lower than 10 kΩ to obtain better load transient
performances. Even, higher values up to 100 kΩ are suitable.
8.10 Enable
The fixed output voltage versions of LD49150xx feature an active high Enable input (EN)
that allows on-off control of the regulator. The EN input threshold is guaranteed between 0.4
V and 1.4 V, for simple logic interfacing. The regulator is set in shut down mode when V
0.4 V and it is in operating mode (V
must be tied directly to the V
not be left at high impedance.
and the ADJ pin, the resistor value between ADJ and GND
OUT
- 0.8)]
OUT
is the desired output voltage.
OUT
to keep the regulator continuously activated. The En pin must
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK®
®
is an ST trademark.
16/22Doc ID 13446 Rev 3
LD49150XX08, LD49150XX10, LD49150XX12Package mechanical data
LD49150XX08, LD49150XX10, LD49150XX12Revision history
10 Revision history
Table 6.Document revision history
DateRevisionChanges
18-Apr-20071Initial release.
12-Jan-20092Added new package DFN6 (3x3 mm) and mechanical data.
29-Jun-20103Modified Section 8.6: Power sequencing recommendations on page 14.
Doc ID 13446 Rev 321/22
LD49150XX08, LD49150XX10, LD49150XX12
Please Read Carefully:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any
time, without notice.
All ST products are sold pursuant to ST’s terms and conditions of sale.
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no
liability whatsoever relating to the choice, selection or use of the ST products and services described herein.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this
document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products
or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such
third party products or services or any intellectual property contained therein.
UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED
WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS
OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT
RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING
APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY,
DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE
GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.
Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void
any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any
liability of ST.
ST and the ST logo are trademarks or registered trademarks of ST in various countries.
Information in this document supersedes and replaces all information previously supplied.
The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.