Sony Ericsson W595 DocumentDispatch

Working Instruction, Electrical

Applicable for W595

CONTENTS

1 Read this first .........................................................................................3

2 Lead-free soldering ................................................................................ 4

3 Soldering issues..................................................................................... 6

3.1 Hot air gun temperature requirements .................................................. 6

3.2 Soldering tip temperature requirements ................................................ 6

3.3 Bottom heat requirements ..................................................................... 6

3.4 BGA rework specifications .................................................................... 6

4 Shield fence instruction......................................................................... 7

5 Preparations of Thor’s shield can lid ...................................................8

6 Replacement of components ................................................................9

6.1 Shield Cover........................................................................................ 10

6.2 B2100 Crystal 32,768 kHz................................................................... 11

6.3 B3105 Microphone .............................................................................. 11

6.4 B4200 Vibrator .................................................................................... 11

6.5 C2217 Capacitor 220 μF 4.0 V............................................................12

6.6 L2200 Inductor Wire wound 4.7 μH.....................................................12

6.7 L2401 - L2404 and L2411 Filter 0.0 Hz 0402...................................... 12

6.8 L2421 - L2422 Inductor 120nH 5% 0402 0.11A .................................. 13

6.9 N1002 IC Amplifier .............................................................................. 13

6.10 N1200 Thor2 Radio Module EDGE..................................................... 13

6.11 N1210 RF-Module Squid prebumped.................................................. 14

6.12 N1400 Module Bluetooth + FM STLC2592 ......................................... 14

6.13 N2202 IC Vreg 600mA ........................................................................ 14

6.14 N2203 IC Vreg PLP1010-4.................................................................. 15

6.15 N2205 DC/DC Converter..................................................................... 15

6.16 N2400 1-Bit Level Translator............................................................... 15

6.17 N2402 IC ESD Prot UDFN 6 2x2 mm ................................................. 16

6.18 N2404 IC IF ISP1508 ES3 (3.5*3.5*0.8) ............................................. 16

6.19 N2410 IC ESD Prot CS-5.................................................................... 16

6.20 N2490 ASIC Accelerometer ................................................................ 17

6.21 N3100 IC CS-9.................................................................................... 17

6.22 N3102 IC CS-9.................................................................................... 17

6.23 N3101 ASIC Tjatte3 CSP20................................................................ 18

6.24 N4200 Trans N-ch FET ....................................................................... 18

6.25 N4310 IC Vreg..................................................................................... 18

6.26 N4311 IC Vreg..................................................................................... 19

6.27 R2432 and R2434 Resistor 0 Ohm +/-50m 63mW K0603 .................. 19

6.28 V2200 Zener diode.............................................................................. 19

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Working Instruction, Electrical

6.29 V2202 Trans P-ch FET........................................................................ 20

6.30 V2405 MOSFET Complementary N P 20 V (DS)................................20

6.31 V2408 Schottky Barrier Diode 2PIN.................................................... 20

6.32 V2420 Zenner Diode 15V.................................................................... 21

6.33 V2421 Zenner Diode 15V.................................................................... 21

6.34 X1200 Conn Receptacle 0p Hirose RF connector .............................. 21

6.35 X1201 Antenna connector................................................................... 22

6.36 X1400 and X1401 Antenna connector ................................................ 22

6.37 X2200 Battery Connector.................................................................... 22

6.38 X2400 System Connector ................................................................... 23

6.39 X2410 MS Connector.......................................................................... 23

6.40 X2420 SIM Connector......................................................................... 23

6.41 X2430 Connector FPC 25p ................................................................. 24

6.42 X4200 Connector FPC 51p ................................................................. 24

6.43 X4300 Connector FPC 26p ................................................................. 24

6.44 Z4200 - Z4203 LC Filter ...................................................................... 25

7 Revision History ................................................................................... 26

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Working Instruction, Electrical

1 Read this first

CAUTION

Keep all contact surfaces clean, no dirt or hand grease!

Before you start replacing any components, make sure you have read and fully understood the contents of section 2 – 5.

Also make sure you have access to the mechanical Working Instruction and the equipment listed on the first page of section 6.

Attention! All repair action with Hot air station or BGA repair station around and on the opposite side of these components shall be performed with care, if the soldering joints temperature on these components will reach 220 degrees than soldering of these components will be damaged.

Protect the phone from ESD damages whenever it has been opened by using:

• ESD-wristband

• ESD-gloves

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Working Instruction, Electrical

2 Lead-free soldering

KEEP ALL CONTACT SURFACES CLEAN OF DIRT AND HAND

GREASE

THIS PRODUCT IS MANUFACTURED WITH LEAD-FREE SOLDER

AND LEAD

-FREE COMPONENTS!

During electrical repair, it is critical to make sure that no lead is introduced.

This symbol indicates that the product is lead- free.

All lead-free PBA’s will be marked with this symbol.

A lead-free work area must be set up completely separated from work areas that are used to make lead repairs.

The lead-free work area must also be clearly labeled with the lead free symbol as shown in the adjacent picture.

The items on this desk must remain lead-free. They must be adequately labeled to make their lead-free

status clearly and easily recognized.

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Working Instruction, Electrical

Lead-free soldering continued

LFS (lead-free solder paste) characteristics:

• High melting point (typically 220°C)

• Low wettability

• High surface tension

• Difficult to spread

• Recommended tip temperature = 360°C

WHEN SERVICING PBA’S THAT HAVE BEEN MANUFACTURED

LFS (LEAD-FREE SOLDER PASTE), LFS MUST BE USED.

WITH

F NOT, THERE IS A HIGH RISK FOR UNRELIABLE SOLDERING

JOINTS.

Lead-free solder joints are more difficult to inspect because they do not have shiny surfaces like leaded solder joints.

Also, lead-free solder does not flow as well as leaded solder, so some of the solder pad areas may remain exposed.

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Working Instruction, Electrical

3 Soldering issues

3.1 Hot air gun temperature requirements

The air temperature shall not exceed 360°C. The temperature shall be measured 5 mm from the nozzle outlet.

If it’s not possible to remove and/ or solder with 360°C a BGA Rework Station or another repair process shall be considered to ensure high process control.

Too high temperature can cause damage and cracks due to thermal stress on sensitive components, e.g. ceramic components like capacitors.

3.2 Soldering tip temperature requirements

The soldering tip temperature shall be minimum 310°C and maximum 360°C.

Too high temperature can cause damage and cracks due to thermal stress on sensitive components, e.g. ceramic components like capacitors.

3.3 Bottom heat requirements

In the chapter “Replacement of components” there are components which require to us a bottom heater during repair to pre-heat the board and to level out the ∆T on the PBA. It will also minimize thermal stress.

The temperature on the PBA surface shall not exceed 150°C to minimize inter-metallic growth and thermal stress on PWB.

3.4 BGA rework specifications

Follow the Technical Requirement, 1207-2949, for components that require use of BGA Rework

Station.

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Working Instruction, Electrical

4 Shield fence instruction

This instruction shows how to cut and bend the shield can fence to be able to replace components under the fence.

Use a sharp-edged pliers to cut the fence. Use Shield fence pliers NTZ 112 537 to bend the fence.

MAKE SURE THAT CUTTING PLIERS IS SHARP-EDGED TO

PREVENT DAMAGING THE SHIELD CAN FENCE

Remove the shield can lid, use a dentist hook. Remove the pick up area according to the white lines with

cutting pliers. (1) This pick up area is only used when machine mounting

and there is no need to put it back again. Cut the shield can fence according to the white lines with

cutting pliers. (2)

Bend carefully the shield fence with a shield fence plier. Replace the components.

Replace the components. Bend carefully back the shield fence. Put back a new shield can lid. Press on all sides of the lid until you hear a “click” sound.

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Working Instruction, Electrical

5 Preparations of Thor’s shield can lid

The shield can lid for Thor will be delivered together with a fence. The fence has to be removed from the lid before the lid can be used.

Use a screw driver and a par of tweezers.

Place the screw driver between the lid and the fence.

Press the shield can fence to the middle.

Use the tweezers to move the fence from the lid.

The shield can lid is now ready to use.

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